WO2015043297A1 - 触控面板的制作方法 - Google Patents

触控面板的制作方法 Download PDF

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Publication number
WO2015043297A1
WO2015043297A1 PCT/CN2014/082576 CN2014082576W WO2015043297A1 WO 2015043297 A1 WO2015043297 A1 WO 2015043297A1 CN 2014082576 W CN2014082576 W CN 2014082576W WO 2015043297 A1 WO2015043297 A1 WO 2015043297A1
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WO
WIPO (PCT)
Prior art keywords
layer
substrate
touch panel
manufacturing
panel according
Prior art date
Application number
PCT/CN2014/082576
Other languages
English (en)
French (fr)
Inventor
林清山
吴春彦
纪连杰
方芳
Original Assignee
宸鸿科技(厦门)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201410243785.5A external-priority patent/CN104516576B/zh
Application filed by 宸鸿科技(厦门)有限公司 filed Critical 宸鸿科技(厦门)有限公司
Priority to JP2016518085A priority Critical patent/JP6165329B2/ja
Priority to KR1020167006165A priority patent/KR101801238B1/ko
Priority to EP14849651.6A priority patent/EP3051392B1/en
Publication of WO2015043297A1 publication Critical patent/WO2015043297A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to the field of touch technologies, and in particular, to a method for fabricating a touch panel ;
  • touch panels have been used in a variety of electronic products: smartphones, mobile phones, tablets and notebooks. Since the user can directly operate and release commands through the objects displayed on the screen, the touch panel provides a user-friendly interface between the user and the electronic product.
  • the embodiment of the invention provides a method for manufacturing a touch panel to meet the touch surface: J is lighter, thinner and less expensive in the manufacturing process.
  • a method for manufacturing a touch panel comprising the steps of: S1: forming a thin film layer on a first substrate; S2: forming a buffer layer on the thin film layer, wherein the thin film layer is located on the first substrate and the Between the layers; S3: forming a sensing layer on the buffer layer, and the buffer layer is located between the thin film layer and the sensing layer; S4: forming a second substrate on the sensing layer Upper, and the sensing layer is located between the buffer layer and the second substrate; S5: removing the first substrate; S6: attaching a cover plate to the film layer by using a bonding layer And the bonding layer is located between the cap plate and the film layer; and S7: removing the second substrate.
  • the method for manufacturing the touch panel introduces two substrates, that is, a first substrate and a second substrate, in the process of manufacturing the touch panel.
  • the two substrates do not form part of the touch panel of the final product, It plays a big role in the production process of the touch panel.
  • the touch panel formed is lighter and thinner, and the manufacturing cost is lower.
  • the sensing layer is located on the other side of the film layer bonding cover plate, which can prevent the adhesion between the film layer and the cover layer when the subsequent sensing layer and the flexible circuit board are joined.
  • a buffer layer is formed between the film layer and the sensing layer, and the difference in characteristics between the film layer and the sensing layer can be slowed down by the characteristics of the buffer layer, for example, the refractive index difference between the film layer and the sensing layer , the difference in thermal expansion coefficient.
  • the erosion of the thin film layer during the formation of the sensing layer can be reduced, and the damage of the thin film layer and the sensing layer by the stress when the first substrate is removed can be further reduced.
  • 1A is a flow chart of a method for fabricating a touch panel according to an embodiment of the invention.
  • 2A-2B are flowcharts showing a method of fabricating a touch panel according to another embodiment of the present invention.
  • 3A-3D are flow charts of a method for fabricating a touch panel according to still another embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a sensing layer of a touch panel according to an embodiment of the invention.
  • first electrode block 100, 300 ⁇ first substrate; 200 - protective layer; 110 - first bonding layer; 120 ⁇ carrier layer; 121 ⁇ film layer; 122 - buffer layer; 130 ⁇ sensing layer; 13 i ⁇ first electrode block;
  • an element may be formed "on” or “inferior” of another element, or may include an embodiment in which two elements are in direct contact, or may include embodiments in which other additional elements are interposed between the two elements. Different scales are displayed to make the illustration clear and concise.
  • FIG. 1A-1H are flow charts of a method for fabricating a touch panel according to an embodiment of the invention.
  • FIG. 1H is a schematic structural view of a touch panel formed by a method for fabricating an embodiment of the present invention.
  • a first substrate 100 is provided, and a thin film layer 121 is formed on the first substrate 100.
  • the first substrate 100 can serve as a mechanical support for the structure formed in the subsequent step, which can be a transparent or opaque substrate, such as a glass substrate. Since the first substrate 100 does not form part of the resulting touch panel product, the first substrate 100 can be used at a relatively low cost, as long as it provides the necessary mechanical support.
  • the first substrate 100 may be made of plain glass instead of chemically strengthened glass to reduce the manufacturing cost of the touch panel.
  • the recovery can be repeated, so that the manufacturing cost can be further reduced.
  • the first substrate 100 is not limited to glass, and it may be any other suitable material that can provide mechanical support.
  • the film layer 12] may be a single layer or a multilayer structure, or a stacked structure composed of a material having a release property of the lower layer and a material having no release property of the upper layer. Release as described herein and hereinafter refers to removal of the first substrate (or second substrate) from other layers (eg, film layer 21) to which it is originally attached.
  • the material of the film layer 121 may be an organic material such as polyugly imine (PI) compared to conventional glass.
  • the material of the film layer 121 may also be polypropylene (PP), polystyrene (PS), acrylonitrile-butadiene styrene (ABS), polyethylene terephthalate (PET polychlorinated) Ethylene (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE), cyclic olefin copolymer (COP, Arton) or a combination of the foregoing.
  • PP polypropylene
  • PS polystyrene
  • ABS acrylonitrile-butadiene styrene
  • PC polycarbonate
  • PE polyethylene
  • PMMA polymethyl methacrylate
  • PTFE polytetrafluoroethylene
  • COP cyclic olefin copolymer
  • the film layer 121 can be formed on the first substrate 100 using a solution coating reheat baking method.
  • a solution coating reheat baking method For example, taking the material of the film layer 121 as a polyimide as an example, the first substrate 100 is placed on a movable platform, and a certain ratio of the solution is applied to the first through a coating blade or a coating machine.
  • heat baking is performed to volatilize part of the solvent and/or to polymerize a part of the components (for example, a polymerizable monomer or a precursor) in the solution to form a polyimide film.
  • the thickness of the polyimide film can be adjusted by adjusting the flow rate of the solution by adjusting the viscosity of the solution and adjusting the moving speed of the solution.
  • Heating bake can include multiple different temperatures of baking, such as pre-baking and re-baking, or it can be continued with a gradient temperature.
  • the solution comprises a Soluble polyimide (SPI) and an organic solvent, or comprises a polyamic acid (PAA) and an organic solvent, wherein the polyamic acid is a precursor of the polyimide, and the organic solvent comprises two
  • SPI Soluble polyimide
  • PAA polyamic acid
  • the method for forming the film layer 121 such as mercaptoacetamide (DMAC), N-mercaptopyrrolidone (NMP), ethylene glycol monobutyl ether (BC), and R-butyrolactone (GBL) is not limited thereto, and for example, It is formed by vapor deposition or other suitable methods.
  • the polyimide film can also be directly pressed onto the first substrate.
  • the thin film layer 121 formed of the polyimide material can be modified by composition, structural modification, copolymerization, blending, etc., to obtain a polyimide film with superior performance.
  • the thin film layer 121 formed of polyimide has low water absorption due to strong Water absorption may affect the performance of the film layer 121 or affect the visual appearance of the resulting touch panel.
  • the polyimide can also have a fluorine-containing functional group by changing the functional group to have low water absorbability, for example, changing its halogen functional group.
  • the fluorine-containing poly ugly imine can also Filter out the shorter wavelength light, for example, absorb the ultraviolet light (wavelength 10nm ⁇ 400nm), avoid the ultraviolet light from penetrating the thin film layer 121 and damage the subsequently formed sensing layer, and also improve the touch panel color, avoiding-free
  • the touch panel is bluish and purple.
  • the thin film layer 121 formed of polyimide has high transparency, high temperature resistance and low water absorption, and its high temperature resistance can adapt to the temperature influence of the subsequent formation of the sensing layer, and its low water absorption can avoid the process of forming the sensing layer subsequently.
  • the film layer 121 expands due to water absorption, which causes the sensor layer electrode pattern to be three-dimensional, and the electrode pattern is visible, which affects the visual effect. Further, the life of the touch panel can be extended due to its low water absorption.
  • the thin film layer 121 provided by the embodiment of the present invention has a thickness thinner than that of a conventional material, such as polyethylene terephthalate (PET), and the thickness of the thin film layer 121 can be about 0.1 micron. About 15 microns, preferably about 2 microns to 5 microns, but the invention is not limited thereto.
  • the film layer 121 is thinner than a common glass substrate, and the film layer 121 of this thickness range has good mechanical properties including ductility, toughness and thermal stability, and the film layer 121 also has good optical properties, for example. High penetration rate.
  • the invention can greatly reduce the thickness and weight of the touch panel by using a thinner and thinner film layer, while maintaining good optical characteristics and product appearance.
  • the film layer 121 may be adhered to the first substrate 100 through the first bonding layer 110.
  • the adhesion between the first substrate 100 (such as glass) and the film layer 121 (such as an organic polymer) is relatively weak, and it cannot be tightly bonded together, in order to improve the relationship between the first substrate 100 and the film layer 121. Adhesion is provided between the first substrate 100 and the film layer 121.
  • the first adhesive layer 110 is an adhesion promoter comprising a functional group of an organophilic material and a functional group of an inorganic material, and can be formed on the first substrate 100 by solution coating and re-solidification.
  • the first substrate 100 is made of an inorganic material such as glass
  • the film layer 121 is made of an organic material such as polyimide
  • the first adhesive layer 10 contains different functional groups to accommodate the adhesion characteristics of the two different materials.
  • the film layer 121 can be relatively tightly fixed to the first substrate 100.
  • the adhesive layer 110 when it is first When the adhesive layer 110 is cured by heating, it will crosslink with the first substrate 100, so that the first substrate 100 is better adhered; in the process of forming the thin film layer 121, heating baking is usually required, so the first The bonding layer 110 is also cross-linked with the film layer 121, so that the film layer 121 is preferably adhered to the first substrate 100.
  • the first bonding layer 110 is disposed around the first substrate 100, for example, in the peripheral region N of the first substrate 100, so that the portion of the thin film layer 121 in the peripheral region N is better in adhesion to the first substrate 100, and the film
  • the layer 121 is in a region other than the peripheral region N (for example, the intermediate region M), and since the first bonding layer 110 is absent, the adhesion of the thin film layer 121 to the first substrate 100 is relatively low.
  • the film layer 121 can be attached to the first substrate 100 in a secure manner, and after the first bonding layer 110 is removed, the film can be easily removed.
  • a substrate 100 and a film layer 121, the specific removal method thereof will be described in detail later.
  • the first bonding layer 110 may also be overlaid on the first substrate 100, that is, the first bonding layer 110 is located between the first substrate 100 and the film layer 121.
  • the first adhesive layer 110 can be made of a material whose adhesive property can be changed, that is, it has strong adhesion to the first substrate 100 during the manufacturing process, and when the first substrate needs to be removed, The adhesion of the first substrate 100 from the film layer 21 can be facilitated by a specific solution immersion or temperature treatment.
  • a buffer layer 122 is formed on the thin film layer 121 , and the thin film layer 121 is located between the first substrate 100 and the buffer layer 122 .
  • the buffer layer 122 may be formed of a transparent insulating material.
  • the buffer layer 122 may be made of silicon oxide, and may be formed using chemical vapor deposition (CVD), printing, photolithography, or other suitable methods.
  • the material of the buffer layer 122 includes titanium dioxide ( ⁇ 02), silicon dioxide (SiO 2 ), zirconium dioxide (Zr0 2 ), antimony oxide, tungsten oxide, antimony oxide, antimony oxide, antimony oxide, antimony oxide.
  • the buffer layer 122 comprises an organic material and an inorganic material.
  • the composite material formed, wherein the inorganic material comprises titanium dioxide (Ti() 2 ) 3 ⁇ 4 silicon dioxide (SiO 2 ), zirconium dioxide (Zr0 2 ), antimony oxide, tungsten oxide, antimony oxide, antimony oxide, antimony oxide, antimony oxide , boron oxide, aluminum oxide, zinc oxide, indium oxide, cesium fluoride, magnesium fluoride, calcium fluoride or a combination thereof.
  • the foregoing organic material comprises a high molecular polymer or a resin such as an acrylic resin, a polyimide (PI), a polypropylene (PP), a polystyrene (PS), an acrylonitrile-butadiene-styrene copolymer (ABS). , polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA).
  • the foregoing organic material may be mixed with an inorganic material, for example, an organic material and an inorganic material may be mixed at a nanometer order to form a novel molecular structure composite material.
  • the mixing or combination of the inorganic material and the organic material can be formed by intermolecular forces such as van der Waals forces, hydrogen bonds, ionic bonds, and covalent bonds.
  • the inorganic material particles or the inorganic material particles are embedded in the organic layer by an organic material to form an organic-inorganic mixture.
  • Composite materials formed by organic materials and inorganic materials have organic material properties and inorganic material properties, and by this property, many high performance requirements can be met.
  • the buffer layer 122 comprising an organic material and an inorganic material has better adhesion to both the organic material and the inorganic material, so that the buffer layer 122 can be subsequently formed.
  • the sensing layer 130 is formed. On the buffer layer 122, the sensing layer 130 is located in the intermediate region M of the first substrate 100.
  • the buffer layer 122 formed of a composite material can be selected by different refractive index materials to meet the requirements of different touch panels, specifically, by adjusting the buffer layer 22
  • the refractive index and the thickness thereof are matched with the refractive index of the upper and lower stacked structures on the buffer layer 122, which can improve the light transmittance of the touch panel and improve the appearance of the touch panel.
  • the buffer layer 122 has a refractive index n ⁇
  • the film layer 121 has a yoke rate of n f
  • the sensing layer 130 has a 4 yt rate of ⁇ ⁇ , then ⁇ ⁇ ⁇ , - preferably, 3 ⁇ 4 3 ⁇ 4 Of x ⁇ ⁇ .
  • the refractive indices of the sequentially arranged thin film layer 121, the buffer layer 122 and the sensing layer 130 are sequentially increased or decreased sequentially, so that the light can penetrate the three layers relatively smoothly, and the sensing layer 130 can be lowered.
  • the difference between the refractive index of the area of the electrode block and the area without the electrode block reduces the visibility of the electrode pattern and improves the visual effect of the touch panel.
  • the buffer layer 122 can also reduce the stress generated between the thin film layer 121 and the sensing layer 130 and the buffer layer 122, respectively.
  • the role of the buffer layer 122 is particularly important in some specific situations, such as a sharp rise or fall in temperature, or during the release process of the first substrate 100.
  • the thin film layer 121 may be formed of an organic material such as polyimide (PI). While the sensing layer 130 is usually formed of an inorganic material, the polyimide film layer 121 has a relatively large coefficient of thermal expansion (CTE;), and the sensing layer 130 has a relatively small coefficient of thermal expansion. In addition, the mechanical properties of the film layer 121 and the sensing layer 130 formed of polyimide are also greatly different.
  • a large stress is generated between the thin film layer 121 and the sensing layer 130, and the stress not only adversely affects the visual appearance effect of the touch panel (such as the foregoing electrode pattern is visible), but may also cause the first removal.
  • the film layer 121 is damaged when the substrate 100.
  • a buffer layer 22 is added between the thin film layer 12 and the sensing layer 130.
  • the buffering effect of the buffer layer 122 the stress that may be generated between the thin film layer 121 and the sensing layer 130 is effectively reduced. .
  • adding a buffer layer 122 between the film layer 12] and the sensing layer 130 can greatly improve the mouth of the touch panel.
  • the coefficient of thermal expansion of the material of the buffer layer 122 should be between the coefficient of thermal expansion of the material of the film layer 121 and the coefficient of thermal expansion of the material of the sensing layer 130.
  • the thermal expansion coefficient of the buffer layer 121 is preferably three digits, which should not be too close.
  • the thermal expansion coefficient of the sensing layer 130 for example, should be greater than 100, and the thermal expansion coefficient of the buffer layer 22 should not be too close to the thermal expansion coefficient of the film layer 12, for example, the range should be less than 900.
  • the thermal expansion coefficient of the buffer layer 122 is preferably The intermediate value of the coefficient of thermal expansion of the film layer 121 and the coefficient of thermal expansion of the sensing layer 130 is approached. This is another reason why the buffer layer 122 is formed of an organic material and an inorganic material, and the thermal expansion coefficient of the buffer layer 122 can be easily adjusted.
  • buffer layer 122 may have a thickness of between about 10 angstroms (A) and about 3000 angstroms (A).
  • the buffer layer 122 can be formed by printing, coating or photolithography. If a convex plate such as an APR (Asahikasei photosensitive resin) plate is formed by transfer, the buffer layer 122 formed by the transfer can reduce the stress between the subsequently formed sensing layer and the thin film layer 121, and reduce the stress. The sensing layer is deformed by stress or the like.
  • the buffer layer 122 may be formed on the film layer 121 by solution coating, UV curing, and then further curing by heating.
  • the buffer layer 122 and the film layer 121 together form a carrier layer 120 on the first substrate 100.
  • the buffer layer 122 has a higher hardness with respect to the film layer 121, and the buffer layer 122 of the higher hardness is matched with the carrier layer formed by the film layer 12 having better ductility. 20 can simultaneously have good release ability and The good carrying capacity can improve the reliability of other components formed on the carrier layer 120. It should be further explained that, compared with the buffer layer 122 of a single material (such as silicon dioxide), the buffer layer 122 of the above-mentioned composite material is used, which will also facilitate the adjustment of the stress of the buffer layer 122, which is advantageous. Improve the stability of the overall touch structure when the release is improved.
  • FIG. 4 is a schematic structural diagram of a sensing layer of a touch panel according to an embodiment of the present invention.
  • the sensing layer 130 includes a plurality of first electrode blocks 131 arranged along a first direction, and a plurality of first wires 132 connected to the first electrode blocks 131 in the first direction.
  • the second electrode block 133 is arranged in the second direction, and each of the second electrode blocks 133 is distributed on two sides of the first wire 132.
  • An insulating block 135 is formed on each of the first wires 132, and a second direction is formed on each of the insulating blocks 135.
  • the second wire 134 of the adjacent second electrode block 133 that is, the insulating block 135 is located between the first wire 132 and the second wire 134, so that the first wire 132 and the second wire 134 are electrically insulated from each other. among them
  • the first direction is different from the second direction, preferably perpendicular to each other.
  • the structure of the sensing layer 130 is not limited to the structure shown in FIG. 4 , for example, the sensing layer 130 may be a single-layer electrode structure including a comb shape, a crisscross shape or a wave shape. Or in other embodiments, the sensing layer 130 may also be a multi-layer structure, for example, the first direction electrode, the second direction electrode, and the insulating layer between the first electrode and the second electrode are respectively located in three independent layers.
  • the step of forming the sensing layer 130 may specifically include: first, forming a first wire 132 on the buffer layer 122, secondly, forming an insulating block 135 on each of the first wires 132, and finally forming a first electrode block 131, a second electrode Block 133 and second wire 134.
  • the first pole block 131, the second electrode block 133, and the first wire 132 may be formed first, then the insulating block 135 is formed on the first wire 132, and finally the second block is formed on the insulating block 132. Wire 134.
  • the step of forming the sensing layer 130 further includes forming a plurality of signal lines 136, and the first electrode blocks 131 in the same axial direction are electrically connected to each other through the first wires 132 to form a series of sensing electrodes, and then corresponding signals.
  • the second electrode block 133 is electrically connected to each other through the second wire 34 to form a sensing electrode string, and then the signal line 136 corresponding thereto is electrically connected.
  • the sensing signals generated by the first electrode block 131 and the second electrode block 133 are transmitted to the controller (not shown) through the signal line 136, and the controller can calculate the touch position according to the sensing signal.
  • the arrangement and the number of the signal lines 136 can be adjusted according to the structure of the different sensing layers 130, and is not limited to the form in FIG. 4. Specifically, the area where the signal lines 136 are concentrated may be multiple.
  • the signal line 136 connected to the same sensing electrode string can also adopt a bilateral lead.
  • the material of the first electrode block 31 and the second electrode block 33 is a transparent conductive material, and may include indium tin oxide (yttrium), aluminum oxide, zinc oxide, tin oxide, tin dioxide, indium oxide or a combination thereof. .
  • the material of the first electrode block 131 and the second electrode block 133 may also be a conductive material such as nano silver, carbon nanotube or metal mesh.
  • the first wire 132, the second wire 134 and the signal line 136 may be used.
  • An opaque conductive material such as a metal or an alloy, including gold, silver, copper molybdenum, aluminum or a combination thereof, may be used as the transparent conductive material of the same electrode block.
  • the first electrode block 131, the second electrode block 133, the first conductive line 132, and the second conductive line 134 may be formed by a step of sputtering and photolithography, or may be formed by screen printing, spraying, or the like.
  • the first electrode block 131, the second electrode block 133, the first wire 132, and the second wire 134 are all sputtered under low temperature conditions.
  • the formed indium tin oxide has a low temperature of about 20 degrees Celsius to 80 degrees Celsius.
  • the indium tin oxide formed by the low temperature sputtering has a small overall stress, so that the stability of the overall touch structure formed on the carrier layer 120 when the first substrate 100 is subsequently removed is facilitated.
  • the first wire 132 is first sputtered and photolithographically formed under low temperature conditions, in which case the first wire 132 is amorphous indium tin oxide; then the first wire 132 is baked to make the amorphous indium oxide
  • the tin is converted into a crystalline indium tin oxide; then, each insulating block 135 is formed on the first wire 132; and then the first electrode block 131, the second electrode block 133, and the second are formed by sputtering and photolithography under low temperature conditions.
  • the first electrode block 131, the second electrode block 133, and the second wire 134 are all amorphous indium tin oxide, and finally the first electrode block 131, the second electrode block 133, and the second wire 134.
  • Baking is performed to convert the amorphous indium tin oxide into crystalline indium tin oxide.
  • the aforementioned baking temperature is 180 degrees Celsius or more and 350 degrees Celsius or less, preferably about 220 degrees Celsius or more and 240
  • Baking the first wire 132 can prevent the etching liquid from forming the first electrode block 131, the second electrode block 33 and the second wire 134 from eroding the first wire 132 which has been formed, and can improve the first wire
  • the light transmittance of 132 reduces the impedance of the first wire 132 and improves its conductivity. Similarly, for the first electrode block
  • the second electrode block 133 and the second wire 134 are baked, and the light transmittance of the first electrode block 131, the second electrode block 133, and the second wire 134 can be improved, and the impedance of the first wire 32 can be reduced. Improve its conductivity.
  • the first electrode block 131, the second electrode block 133, and the second wire 134 may be formed by sputtering and photolithography under low temperature conditions. At this time, the first electrode block 131 and the second electrode block 133.
  • the first wire 132 is an amorphous indium tin oxide; then the first electrode block 131 3 ⁇ 4 the second electrode block 133 and the first wire 132 are baked, so that the amorphous indium tin oxide is converted into a crystalline type. Indium tin oxide; then forming each insulating block 135 on the first wire 132; then forming a second wire 134, at which time the second wire 134 is amorphous indium tin oxide; finally, baking the second wire 134, so that The amorphous indium tin oxide is converted into a crystalline indium tin oxide.
  • This embodiment is exemplified only by the material of indium tin oxide, but the invention is not limited thereto.
  • a second substrate 150 is formed on the sensing layer 130.
  • the second substrate 150 may partially or completely cover the buffer layer 122.
  • the second substrate 150 may be adhered to the second substrate 150 through the second bonding layer 140.
  • the sensing layer 130 and the buffer layer 122 are on the sensing layer 130.
  • the material of the second substrate 150 comprises a polymer such as polyethylene terephthalate (PET) or any suitable material capable of supporting a film assembly for transfer to a cover plate according to embodiments of the present invention, such as glass, Cycloolefin copolymer (COP, Arton), polypropylene (PP), and the like.
  • PET polyethylene terephthalate
  • COP Cycloolefin copolymer
  • PP polypropylene
  • the second bonding layer 40 is a removable adhesive, and the second bonding layer 140 may include a water-insoluble glue or can temporarily adhere the two layers together and can be subsequently dissolved or otherwise moved Any other suitable material other than that.
  • the second substrate 150 and the second adhesive layer 140 are stacked, and the whole may be, for example, a single-sided adhesive.
  • the second substrate 150 is, for example, a flexible film layer, and the second bonding layer 140 is a glue layer. As shown in FIG. ID, the second bonding layer 140 has a relatively disposed A surface and a B surface.
  • the surface of the second substrate 150 is the surface A, and the viscosity of the surface B of the second bonding layer 140 can be reduced or even disappeared by illumination treatment such as ultraviolet light irradiation, heat treatment or cold treatment or a combination thereof, while the second adhesive layer There is still a good adhesion between the A surface of 140 and the second substrate 150, so that the second bonding layer 140 can be removed together in the subsequent step of removing the second substrate 150.
  • illumination treatment such as ultraviolet light irradiation, heat treatment or cold treatment or a combination thereof
  • FIG. 1E-1, FIG. 1E-2 and FIG. IF wherein FIG. 1E-2 is an exploded view of FIG. 1E-1.
  • the first substrate 100 is removed.
  • the edge of the intermediate region M can be cut along the edge of the peripheral region N, that is, cut along the cutting line CC shown in FIG. 1E, and will be located in the peripheral region N.
  • the first bonding layer 110, the film layer 121, the buffer layer 122, the second bonding layer 140, and the second substrate 150 are cut away, and then the first substrate 100 is removed.
  • the first adhesive layer 110 that serves as the main adhesive is first cut off, the adhesive layer between the first substrate 100 and the thin film layer 121 is not changed, and the adhesion between the first substrate 100 and the thin film layer 121 is greatly reduced, and the first substrate 100 is removed.
  • the effect of stress on the thin film layer 121 and other structures formed on the thin film layer 121 during the removal of the first reverse 100 is reduced.
  • the cutting parameters can be controlled so as not to be cut to the first substrate 100, and thus, the first substrate 100 can be reused to reduce the cost.
  • the cutting may be performed along the edge of the peripheral region N near the intermediate region M, that is, along the cutting line CC shown in FIG. IE-1, which is different from the foregoing in that it will not only be located in the periphery.
  • the first bonding layer 110, the thin film layer 121, the buffer layer 122, the second bonding layer 140, and the second substrate 150 are removed from the region, and a portion of the first substrate 100 located in the peripheral region N can be simultaneously removed, and then removed.
  • the first substrate 100 after being cut.
  • the step of forming the sensing layer 30 and the step of forming the second substrate 150 cutting along the edge of the peripheral region N near the intermediate region M, the first portion located in the peripheral region N
  • the bonding layer 110, the film layer 121, and the buffer layer 122 are cut away, and at the same time, the first substrate 100 remains, and after the second substrate 150 is formed, the first substrate 100 is removed.
  • the first substrate 100 can be removed from the film layer 121 by solution soaking, heat treatment, cold treatment, external force peeling, or a combination of the foregoing.
  • the solution used may be water, alcohol, propylene glycol methyl ether acetate (PGMEA) solution, polyvinylidene fluoride (PVDF) N-decyl pyrrolidone (NMP) solution, etc.; heat treatment and cold treatment are used to heat the first substrate 100. Or cooling, using the carrier layer 120 and the first substrate The coefficient of thermal expansion of 100 produces stress and is convenient for release.
  • the cover plate 170 is attached to the film layer 121, and the cover plate 170 and the film layer 121 may be laminated or otherwise laminated through the bonding layer 160, and the bonding layer 160 is located on the film layer. between 121 and cap plate 170, from the perspective drawing of FIG. 1G, stacking order from top to bottom of the cap plate 170, the bonding layer 160, the thin film layer 121, buffer layer 122 3 ⁇ 4 sensing layer 130, a second adhesive layer 140 and a second substrate 150.
  • the cover plate 170 can be used to protect the structure underneath, which can be made of glass polyimide (PI), polypropylene (PP), polystyrene (PS), acrylonitrile butadiene styrene (ABS), poly pair. Ethylene phthalate (PET), polyvinyl chloride (PVC) polycarbonate (PC), polyethylene (PE), polymethyl methacrylate (PMMA), polytetrafluoroethylene (PTFE) and other transparent materials .
  • the cover plate 170 may be made of a hard material or a flexible material, or may be a six-sided chemically reinforced substrate or a reinforced substrate that is chemically strengthened only on the upper and lower surfaces and physically reinforced on the side.
  • the cover plate 170 can be obtained by cutting the glass mother board into a size corresponding to the touch module and performing chemical strengthening.
  • the cover plate 170 may include two planar surfaces (the upper surface is flat as above), two curved surfaces (such as the lower surface are curved surfaces), or a plane-curved surface (one of the upper or lower surfaces is a flat surface and the other surface is a curved surface)
  • the design for example, can be a 2.5D shape, or a 3D shape.
  • the upper surface of the cover plate 170, i.e., the other side of the film layer 121, serves as a contact surface for touching the object.
  • the bonding layer 60 can be a solid or liquid transparent optical glue or other suitable transparent bonding material.
  • the carrier layer 120 and the sensing layer 130 may be referred to as a film component, and the common touch module comprises a glass substrate and a film layer, or two film layers, or two glass substrates as carrier plates and combinations.
  • the film component of the invention is thinner and more flexible, and the film component can be attached as a touch component to a rigid substrate having different curvature radii or attached to the flexible substrate. More flexible to adapt to the design needs of different touch panels.
  • the film layer 121 is attached to the cover plate 170 along with the buffer layer 122 and the sensing layer 130 by the reloading action of the second substrate 150.
  • the second substrate 150 is preferably used.
  • the flexible material is used, and the cover 170 is usually made of a relatively hard material such as tempered glass, so that the soft material is attached to the hard material, the bonding is easy, and the bonding layer 160 is prevented from generating bubbles and the thickness of the bonding layer 160 is reduced.
  • a relatively hard material such as tempered glass
  • the shielding layer 180 may be formed on the cover plate 170, and the shielding layer 180 is located on at least one side of the cover plate 170 for shielding the signal line (such as the signal line 136 in FIG. 4).
  • the side of the signal wire from the upper surface of the cover 170 is not easily seen by the user.
  • the masking layer 180 is located on the lower surface of the cover plate 170, i.e., on the side of the cover sheet 170 adjacent the film layer 121.
  • the masking layer 180 can be located on the upper surface of the cover plate 170, i.e., on the other side of the cover plate 170 relative to the film layer 121.
  • the shielding layer 180 may also be a decorative film layer (Deco-film).
  • the decorative film layer specifically includes a transparent film, and a shielding layer is disposed in a peripheral region of the transparent film.
  • the film layer is directly disposed on the upper surface of the cover plate, and the cover film 170 and the shielding layer 180 may be replaced by the decorative film layer.
  • the material of the masking layer 180 may be a colored ink, a colored photoresist, or a combination of the two.
  • the shielding layer 180 may be a single layer structure or a composite laminated structure, a single layer structure such as a black ink layer; a composite laminated structure such as a stack structure of an ink layer and a photoresist layer, a stack structure of a white ink layer and a black ink layer, and a white ink Stack, black ink layer and photoresist layer stack structure.
  • the second bonding layer 140 may be pre-processed, including illumination. Processing, heat treatment or cold treatment or a combination of the foregoing, for example, depending on the material of the second adhesive layer 40, the second adhesive layer 140 and the sensing layer may be respectively irradiated by ultraviolet light, heating or cooling. The adhesion between the 130 is reduced, and the second bonding layer 140 and the second substrate 150 are removed from the sensing layer 30.
  • the laminated structure of the second adhesive layer 140 and the second substrate 150 is a single-sided adhesive, which is irradiated with ultraviolet light, so that the viscosity between the tantalum surface of the second adhesive layer 40 and the sensing layer 130 is reduced or even disappeared.
  • the adhesion between the surface of the second adhesive layer 140 and the second substrate 150 still exists, so it is convenient
  • the second substrate 150 and the second bonding layer 140 are simultaneously removed.
  • different removal methods may be selected according to the material of the second adhesive layer 140, and the invention is not limited thereto.
  • the touch panel 10 as shown in FIG. 1H is finally formed through the above steps, so as to illustrate the user touch and observation surface above, the touch panel 10 includes a cover plate 170, a bonding layer 160, and a film layer stacked from top to bottom. 121, the buffer layer 122 and the sensing layer 130, that is, the bonding layer 160 is located between the cover plate 170 and the film layer 121, the film layer 121 is located between the bonding layer 160 and the buffer layer 122, and the buffer layer 122 is located at the film layer 121 Between the sensing layers 130.
  • the touch panel 10 further includes a shielding layer 180, and the shielding layer 180 is located on at least one side of the cover 170.
  • the detailed structure, material, and manufacturing method of each of the above components have been described above, and thus will not be described again.
  • the touch panel 10 can be applied to a touch display device such as a computer system, a mobile phone, a digital media player, a tablet computer, an ultra-thin notebook, a wearable touch device, and a car touch system.
  • the flexible circuit board with the controller can be further attached to the signal line 136 of the bonding position by the anisotropic conductive paste. It is not difficult to understand that, compared with the direct attaching of the flexible circuit board after the step of FIG. 1C, the invention attaches the flexible circuit board after completing the step of FIG. 1H, thereby avoiding the removal of the first substrate 100 or the second substrate. During the manufacturing process of 150, there may be a problem that the flexible circuit board is easy to fall off, which is beneficial to improve the stability of the overall touch panel.
  • FIG. 2A to 2B are flowcharts showing a method of fabricating a touch panel according to another embodiment of the present invention.
  • 2B is a schematic structural view of a touch panel according to an embodiment of the present invention.
  • FIG. 2A is a step of receiving FIG. 1C. The steps before the step shown in FIG. 2A are the same as those of FIG. 1A to FIG. 1C. For the sake of brevity, Therefore, it will not be repeated.
  • a protective layer 200 is formed on the sensing layer 30 , and the sensing layer 30 is located between the protective layer 200 and the buffer layer 122 .
  • the protective layer 200 has a protective effect on the sensing layer 130, and the second bonding layer 140 and the second substrate 150 are removed.
  • the effect on the sensing layer 130 during the process In addition, it is also possible to reduce the erosion of the sensing layer 130 by air, moisture or other substances in the environment after the second bonding layer 140 and the second substrate 150 are removed. Further, the protective layer 200 needs to expose the bonding position of the signal line to the flexible circuit board to facilitate the bonding of the signal connection line to the flexible circuit board.
  • the steps after the step shown in FIG. 2A are substantially similar to FIG. 1 to FIG. 1H, except that the second substrate 150 and the second bonding layer 140 are formed on the protective layer 200. That is, the second bonding layer 140 is located between the protective layer 200 and the second substrate 150.
  • the touch panel 20 formed after the first substrate 100 and the first bonding layer 110 are removed and bonded to the cover 170 and the second substrate 150 and the second bonding layer 140 are removed further includes a protective layer 200, such as As shown in FIG. 2B, the touch panel 20 includes a cover plate 170 stacked from top to bottom, a bonding layer 160, a film layer 121, a buffer layer 122, a sensing layer 130, and a protective layer 200.
  • the protective layer 200 In addition to the protective layer 200, other component structures are provided. The materials and production methods have been described above, and therefore will not be described again.
  • the protective layer 200 may be a single layer structure or a multilayer structure.
  • the first protective layer 201 and the second protective layer 202 may be included.
  • the first protective layer 201 is located between the sensing layer 130 and the second protective layer 202, and the second protective layer 202 is away from the first One side of the protective layer 201 can be combined with the display device to form a touch display device.
  • the first protective layer 20] and the second protective layer 202 may be selected from different materials to achieve different effects.
  • the first protective layer 201 may be at least one of an organic material, an inorganic material, a composite material, and a polymer material.
  • the first protective layer 201 may adopt the same composite material as the buffer layer 122 described above, and includes, for example, titanium dioxide (Ti02), silicon dioxide (SiO 2 ), zirconium dioxide (Zr0 2 ), or a combination thereof. Or a compound formed of titanium oxide (Ti0 2 ), silicon dioxide (SiO 2 ) and an organic material, or a compound formed of zirconium dioxide (Zr0 2 ) silicon dioxide (SiO 2 ) and an organic material.
  • the buffer layer 122 is used to improve the sensing layer 130 with and without the electrode block.
  • the difference in light reflection between the areas causes the appearance of the touch panel to be poor.
  • the refractive index of the first protective layer 201 is such that the refractive index of the second protective layer 202 is 11 3 and the refractive index of the sensing layer is ⁇ ⁇ , then ⁇ 3 ⁇ ⁇ 2 ⁇ ⁇ ⁇ is better «
  • the first protective layer 201 may have a thickness of about 0.01 microns to 0.3 microns.
  • the first protective layer 201 mainly functions as an index matching
  • the second protective layer 202 mainly provides further protection to the sensing layer 130 and the like, and reduces the erosion of the sensing layer 130 by air, moisture or other substances in the environment.
  • the material of the second protective layer 202 may specifically include a thermosetting resin, silicon dioxide, a first protective layer 201, and a second protective layer 202, which may be formed by transfer using a convex plate such as an APR (Asahikasei photosensitive resin) plate.
  • the first protective layer 201 and the second protective layer 202 formed by the transfer method can reduce the stress between the sensing layer 130 and other layers, improve the stability of the sensing layer 130, and subsequently It is convenient to remove the second substrate and the second bonding layer to reduce the influence of stress.
  • the first protective layer 201 and the second protective layer 202 may be respectively coated with a solution, cured by ultraviolet light, and then formed by thermosetting or the like.
  • other processes such as sputtering, chemical vapor deposition (CVD), irskjet printing, and slit coating may be used as needed.
  • the protective layer 200 is formed by spin coating, spray coating or roller coating.
  • a plurality of thin film components may be formed on the first substrate of the large piece at a time, in the film assembly and In the previous step of the cover bonding, the plurality of thin film components are separately separated, so that a plurality of touch panels can be formed at one time, thereby improving production efficiency and reducing cost.
  • the specific production process can refer to FIG. 3A to FIG. 3D. Example.
  • FIG. 3A-3D are flow charts of a method for fabricating a touch panel according to still another embodiment of the present invention. Please knot first 3A and 3B, wherein FIG. 3B is a cross-sectional view of FIG. 3A.
  • a plurality of mutually spaced regions V may be preset or distinguished on the large first substrate 300, and the size of the region V may be set according to the size of the touch panel.
  • the first adhesive layer 110 3 ⁇ 4 film layer 121 and the buffer layer 122 are sequentially formed on the first substrate 300, and then a plurality of mutually spaced sensing layers 130 are simultaneously formed on the buffer layer 122 and corresponding to the respective regions V, and then A protective layer 200 is formed on each of the sensing layers 130, and a second substrate 150 is adhered to the protective layer 200 by the second bonding layer 140.
  • the plurality of sensing layers 130 are spaced apart from each other, and the other structures include the first substrate 300, the thin film layer 12L buffer layer 122, the protective layer 200, the second bonding layer 140, and the first The two substrates 150 are each a one-piece structure.
  • the method of forming the first bonding layer 110, the thin film layer 121, the buffer layer 122, the second bonding layer 140, and the second substrate 150 refer to the embodiment corresponding to FIG. 1A to FIG. 1H, and the method for forming the protective layer 200. Reference may be made to the embodiments corresponding to the aforementioned FIGS. 2A and 2B.
  • the first substrate 300 is removed, and the film assembly 30 is attached to the third substrate 310 with the film layer 121 side, and the film layer 121 is located at the buffer layer 122 and the third layer. Between the substrates 310.
  • the manner in which the first substrate 300 is removed is the same as that of the foregoing embodiment.
  • the structure of the third substrate 310 may be combined with the structure of the second substrate in combination with the second bonding layer, which is a flexible film layer and a glue layer adhered to each other, such as a single-sided glue, which is a sticky surface.
  • the film layer 121 of the film assembly 30 is attached.
  • the third substrate 310 provides support and protection to the film assembly 30 to prevent damage to the film assembly 30 during subsequent separation.
  • the film assembly 30 corresponding to each of the regions V is separated, and the originally integrated film assembly is separated into a plurality of individual small film assemblies 30.
  • Each of the film assemblies 30 can be separated by knife cutting or laser cutting.
  • a small piece of film assembly separated into three groups is taken as an example, and it can be understood that it can also be separated into smaller or larger pieces of the film assembly.
  • the cover plate 170 finally removes the second substrate 150 and the second adhesive layer 140 to form a plurality of touch panels, respectively.
  • the resulting touch panel structure is as shown in FIG. 2B.
  • the cover plate 170 of this embodiment can be prepared by cutting a large piece of glass mother board into a size corresponding to the touch module and then chemically strengthening it. Compared with the conventional first, the large glass cover is chemically strengthened, and then a plurality of sensing layers are formed, and then the large glass cover is cut along with the sensing layer to obtain a small touch panel.
  • the cover 170 of the present embodiment is first. Cutting and re-strengthening, finally attached to the film assembly, without further cutting, has better edge strength, and the process of forming the sensing layer does not affect the strength of the cover plate, and can improve the overall strength of the finally formed touch panel. .
  • the first bonding layer may be disposed on a peripheral region of the first substrate 300 of the large piece, for example, around the first substrate 300.
  • the first bonding layer may also be disposed around the respective regions V to further enhance the adhesion of the film layer to the first substrate 300, and thus, when the first substrate 300 is removed, The first bonding layer located around the first substrate 300 and the bonding layer located around each of the regions V are removed.
  • the first bonding layer is disposed only in the 'a?' of each region V, and the first bonding layer is not disposed around the first substrate 300.
  • the present invention is not limited thereto.
  • the sensing layer is formed on the film layer by the supporting action of the first substrate, and the film layer and the sensing formed thereon are formed by the reloading action of the second substrate.
  • the layer is attached to the cover plate, so that the formed touch panel is lighter and thinner, and the manufacturing cost is lower.
  • the sensing layer is located on the other side of the film layer bonding cover plate, which can avoid the flatness of the bonding between the film layer and the cover plate when the sensing layer is bonded to the flexible circuit board.
  • a buffer layer is formed between the film layer and the sensing layer, which can reduce the erosion of the film layer during the process of forming the sensing layer, and further reduce the stress on the film layer and the sensing layer when the first substrate is removed. Damage.

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Abstract

一种触控面板的制作方法，该触控面板的制作方法包括步骤：S1:形成薄膜层于第一基板上；S2:形成缓冲层于薄膜层上，且薄膜层位于第一基板与缓冲层之间；S3:形成感测层于缓冲层上，且缓冲层位于薄膜层与感测层之间；S4:形成第二基板于感测层上，且感测层位于缓冲层与第二基板之间；S5:移除第一基板；S6:采用一接合层贴附一盖板于薄膜层上，且接合层位于盖板与薄膜层之间；及S7:移除第二基板。藉此形成的触控面板可满足轻、薄及成本低的需求。

Description

f劑作方法
本发明涉及触控技术领域， 尤其涉及一种触控面板的制作方法 ;
在现今消费性电子产品市场，触控面板 (touch panel)已应用于多种电子产品： 如智能手机， 移动电话、 平板电脑及笔记型电脑。 由于使用者可直接通过屏 幕上显示的物件进行操作与下达指令， 因此触控面板提供了使用者与电子产品 之间的人性化操作界面。
然而， 随着对触控面板结构上的轻、 薄及制作工艺上的低成本的日益增加 的需求， 目前现有的触控面板结构和制作工
本发明实施例提供一种触控面板的制作方法， 以满足触控面: J更 加轻、 薄及在制作工艺中成本更低的需求。
一种触控面板的制作方法， 包括步骤： S1 : 形成薄膜层于第一基板上； S2: 形成缓冲层于所述薄膜层上， 且所述薄膜层位于所述第一基板与所述缓沖层之 间； S3 : 形成感测层于所述缓冲层上， 且所述缓沖层位于所述薄膜层与所述感 测层之间； S4: 形成第二基板于所述感测层上， 且所述感测层位于所述緩冲层 与所述第二基板之间； S5: 移除所述第一基板； S6: 采用一接合层贴附一盖板 于所述薄膜层上， 且所述接合层位于所述盖板与所述薄膜层之间 ； 及 S7: 移除 所述第二基板。 本发明提供的触控面板的制作方法， 在触控面板的制作过程中引入两块基 板， 也即第一基板和第二基板， 虽然这两块基板不构成最终产品触控面板的一 部分， 但其在触控面板的制作过程中起到了很大的作用。 借由第一基板的支撑 作用将感测层形成于薄膜层上， 并后续移除第一基板， 再借由第二基板的转载 作用， 将薄膜层及其上形成的感测层贴附于盖板上， 如此， 形成的触控面板更 加轻、 薄， 制作成本较低。
另外， 本发明实施例提供的触控面板结构中， 感测层位于薄膜层贴合盖板 的另一面， 可避免后续感测层与软性电路板接合时影响薄膜层与盖板之间贴合 此外， 在薄膜层与感测层之间形成有缓沖层， 藉由缓冲层的特性， 可减缓 薄膜层与感测层之间的特性差异， 例如薄膜层与感测层的折射率差异， 热膨胀 系数差异。 进一步的， 由于缓冲层的存在， 可减少形成感测层的过程中对薄膜 层的侵蚀， 进一步的可减小移除第一基板时应力对薄膜层及感测层的损伤。
»围说明
图 1A '图 1H为本发明一实施例触控面板的制作方法的流程图。
图 2A ~图 2B为本发明另一实施例触控面板的制作方法的流程图。
图 3A〜图 3D为本发明又一实施例触控面板的制作方法的流程图。
图 4为本发明一实施例触控面板感测层结构示意图。
附图标记说明：
10、 20〜触控面板；
30〜 薄膜组件；
100、 300〜 第一基板； 200 -保护层； 110 - 第一粘结层； 120 ~ 承载层； 121 〜 薄膜层； 122 - 缓沖层； 130 ~ 感测层； 13 i~ 第一电极块；
132 ~ 第一导线；
133 ~ 第二电极块;
134、 第二导线；
135 - 绝缘块； 136〜信号线； 140〜 第二粘结层; 150〜 第二基板； 160、- 接合层； 170〜盖板；
180 - 遮蔽层； 310 - 第三基板； M〜中间区域；
N〜 周边区域； V〜 区域；
CC'〜切割线； 下面结合附图与具体实施方式对本发明作进一步详细描述。
本发明所揭示内容可能在不同实施例中使用重复的元件符号， 并不代表不 同实施例或图式间具有关联。 此外， 一元件形成于另一元件 「上』或 〖下■!可 包含两元件直接接触的实施 ， 或也可包含两元件之间夹设有其它额外元件的 实施例。 各种元件可能以任意不同比例显示以使图示清晰简洁。
图 1A〜图 1H为本发明一实施例触控面板的制作方法的流程图。其中图 1H 还为本发明一实施例制作方法形成的触控面板结构示意图。
请先参照图 1A, 首先， 提供第一基板 100， 并形成薄膜层 121于第一基板 100上。 第一基板 100可作为后续步骤中所形成的结构的机械性支撑， 其可为一 透明或不透明基板， 例如一玻璃基板。 由于第一基板 100 不构成最终形成的触 控面板产品的一部分， 所以第一基板 100可采用成本.相对较低的材料， 只要其 可提供必要的机械性支撑即可。 例如， 第一基板 100 可采用素玻璃而非化学强 化玻璃， 以降低触控面板的制作成本。 另外， 第一基板 100 在后续自触控面板 上移除后， 还可以再重复回收刹用， 如此， 可进一步降低制作成本。 值得注意 的是， 第一基板 100 并不限于玻璃， 其可以是其他任何可提供机械支撑的合适 材料。
薄膜层 12】 可为单层或多层结构， 或由下层具有离型能力的材料与上层不 具有离型能力的材料所构成的堆叠结构。 此处及下文中所述的离型是指将第一 基板（或第二基板） 自与其原本贴合在一起的其它层别 （例如薄膜层〗21 )上移 除。相较于习知的玻璃，薄膜层 121的材料可为有机材料，例如聚醜亚胺（PI )。 此外， 薄膜层 121的材料还可以是聚丙烯（PP )、 聚苯乙烯（PS )、 丙.烯腈-丁二 烯苯乙烯（ABS )、 聚对苯二曱酸乙二酯（PET 聚氯乙烯（PVC )、 聚碳酸酯 ( PC ), 聚乙烯（PE )、 聚甲基丙烯酸曱酯（PMMA )、 聚四氟乙烯（PTFE )、 环 烯烃共聚物 （COP、 Arton )或前述之组合。
薄膜层 121可使用溶液涂布再加热烘烤方法形成于第一基.板 100上。 如， 以薄膜层 121材料为聚酰亚胺为例说明， 将第一基板 100放置于可移动的平台 上， 通过一涂布刀头或一涂布机将一定配比的溶液涂布于第一基板 100上， 再 加热烘烤，使部分溶剂挥发和 /或使溶液中的部分成分(例如聚合单体或前驱体 ) 产生聚合， 从而形成聚酰亚胺薄膜。 其中， 可采用压力及调配合适之溶液黏度 调整溶液的流速， 及控制平台的移动速度来调整形成聚酰亚胺薄膜的厚度。 加 热烘烤可包括预烘烤和再烘烤等多次不同温度的烘烤， 也可采用具有一梯度温 度持续烘烤。 前述溶液包含可溶性聚酰亚胺 ( Soluble polyimide, SPI )及有机溶 剂， 或包含聚酰胺酸（Poiyamide acid, PAA )及有机溶剂， 其中聚酰胺酸为聚酰 亚胺的前驱体， 有机溶剂包括二曱基乙酰胺 (DMAC)、 N-曱基吡咯烷酮 (NMP)、 乙二醇单丁醚（BC )、 R-丁内酯（GBL )等 薄膜层 121的形成方法并不限于此， 例如还可采用气相沉积法或其它合适之方法形成。 在其他实施例中， 还可直接 釆用聚酰亚胺千膜压合于第 -基板. 100上。
聚酰亚胺材料形成的薄膜层 121， 可通过组成、 结构改造， 共聚、 共混等方 法改性， 得到性能更加优越的聚酰亚胺薄膜。 例如， 通过化学方法改变其分子 链长度和 /或官能基、 和 /或通过物理方法改变其表面微观结构， 使.得由聚酰亚胺 形成的薄膜层 121具有低吸水性， 因较强的吸水性可能会影响薄膜层 121 的性 能或影响最终形成的触控面板的视觉外观。 通常， 分子链长度越长， 吸水性也 越强， 不同分子链长度的聚酰亚胺会呈现出不同的粘度， 可根据具体需要调整 聚酰亚胺的粘度。 聚酰亚胺也可通过改变官能基使其具有低吸水性， 例如改变 其卤素官能基， 使聚酰亚胺具有含氟的官能基。 此外， 含氟的聚醜亚胺还可过 滤掉较短波长的光， 例如可吸收紫外光（波长 10nm〜400nm )， 避免紫外光穿透 薄膜层 121 而损伤后续形成之感测层， 另外也可以改善触控面板色度， 避—免触 控面板偏蓝偏紫现象。 聚酰亚胺形成的薄膜层 121 具有高透明度、 耐高温及低 吸水性， 其耐高温特性可适应后续感测层形成时的温度影响， 其低吸水性可避 免在后续形成感测层的过程中， 薄膜层 121 因吸水而膨胀， 导致感测层电极图 形立体化， 电极图形可见， 影响视觉效果。 进一步的， 因其低吸水性还可延长 触控面板的使用寿命。
本发明实施例提供的薄膜层 121，其厚度较习知材料形成的薄膜层如聚对苯 二甲酸乙二醇酯 （ polyethylene terephthakite, PET )厚度薄， 薄膜层 121的厚度 可为约 0.1微米至约 15微米， 较佳约为 2微米至 5微米， 但本发明并不以此为 限。 薄膜层 121 相较于普通的玻璃基板厚度较薄， 且此厚度范围的薄膜层 121 具有良好的机械性能， 包括延展性、 韧性及热稳定性， 同时薄膜层 121 还具有 良好的光学特性， 例如高穿透率。 本发明通过釆用更加轻薄的薄膜层， 可大幅 降低触控面板的厚度和重量， 同时， 仍能维持良好的光学特性及产品外观。
在本实施中，可通过第一粘结层 110将薄膜层 121粘附于第一基板 100上。 通常， 第一基板 100 (如玻璃）与薄膜层 121 (如有机聚合物）之间的附着力比 较弱， 其不能紧密的粘结在一起， 为提高第一基板 100和薄膜层 121之间的附 着力， 故设置第一粘结层】10于第一基板 100与薄膜层 121之间。
第一粘结层 110 为包含有亲有机材的官能基和亲无机材的官能基的粘着促 进剂（ Adhesion Promoter )，可采用溶液涂布 ,再固化的方式形成于第一基板 100 上。 当第一基板 100采用玻璃等无机材质， 而薄膜层 121釆用聚酰亚胺等有机 材质时， 第一粘结层 】10 所包含的不同官能基， 可适应两种不同材盾的粘着特 性， 如此可较为紧固地将薄膜层 121 固定于第一基板. 100上。 例如， 当对第一 粘结层 110加热固化时， 其会与第一基板 100发生交联， 从而较好的粘附第一 基板 100; 在形成薄膜层 121的过程中， 通常也会需要加热烘烤， 故第一粘结层 110也会与薄膜层 121发生交联， 从而较好的将薄膜层 121粘酎于第一基板 100 同时， 考虑后续薄膜层 121需较容易的自第一基板 100上移除， 可设置第 一粘结层 110位于第一基.板 100的四周，例如位于第一基板 100的周边区域 N， 使得薄膜层 121在周边区域 N的部分与第一基板 100粘结性较好， 薄膜层 121 在周边区域 N以外的区域（例如中间区域 M )， 由于无第一粘结层 110， 薄膜层 121与第一基板 100的粘结性相对较低。 如此， 在第一粘结层 110还未移除时， 薄膜层 121可紧固地^■附于第一基板 100上， 在移除第一粘结层 110之后， 又 可较为便捷离型第一基板 100与薄膜层 121 , 其具体的移除方法后文将再详述。
在另一实施例中， 第一粘结层 110也可以是一整面的覆盖于第一基板 100 上， 即第一粘结层 110位于第一基板 100与薄膜层 121之间。 在此种设计下， 第一粘结层 110 可采用粘着特性可改变之材质， 即在制作过程中， 其与第一基 板 100有较强之附着力， 在需要移除第一基板时， 又可通过特定溶液浸泡或温 度处理等方式以降低其粘着性， 利于第一基板 100自薄膜层】 21上移除。
接着， 请参照图 1B， 形成緩冲层 122于薄膜层 121上， 且薄膜层 121位于 第一基板 100与緩冲层 122之间。 缓沖层 122可由透明绝缘材料形成。 在一实 施例中， 緩冲层 122 可釆用氧化硅， 且可使用化学气相沉积（Chemical Vapor Deposition, CVD )、 印刷、 光刻或其他适当方法形成。 在另一实施例中， 缓冲 层 122 的材料包括二氧化钛 (ΊΊ02), 二氧化硅 (Si02)、 二氧化锆（Zr02 )、 氧化 钽、 氧化钨、 氧化钇、 氧化铈、 氧化锑、 氧化铌、 氧化硼、 氟化铈、 氟化镁、 氟化钙或前述之组合。 在又一实施例中， 缓冲层 122 包含有机材料和无机材料 形成的复合材料， 其中无机材料包含二氧化钛 (Ti()2) ¾ 二氧化硅 (Si02)、 二氧化 锆（Zr02 )、 氧化钽、 氧化钨、 氧化钇、 氧化铈、 氧化锑、 氧化铌， 氧化硼、 氧 化铝、 氧化锌、 氧化铟、 氟化铈、 氟化镁、 氟化钙或前述之组合等。 前述有机 材料包含高分子聚合物或树脂，例如丙烯酸树脂、聚酰亚胺（PI )、聚丙烯（PP )、 聚苯乙烯（PS ) , 丙烯腈 -丁二烯-苯乙烯共聚物 (ABS), 聚对苯二曱酸乙二醇酯 (PET), 聚氯乙烯 (PVC), 聚碳酸酯 (PC), 聚乙烯 (PE), 聚甲基丙烯酸曱酯 (PMMA) 进一步的， 在本发明实施例中， 前述有机材料可与无机材料混成， 例如有 机材料和无机材料在纳米数量级时可混合形成一种新的分子结构的复合材料。 无机材料和有机材料的混合或结合可通过分子间作用力， 如范德华力、 氢键、 离子键和共价键形成。 在另一实施例中， 通过有机材料包覆无机材料颗粒或无 机材料颗粒嵌入至有机层中， 以形成一种有机无机混合物。
通过有机材料和无机材料形成的复合材料具有有机材料特性和无机材料特 性， 藉由该特性， 可满足很多高性能的需求。 例如， 包含有机材料和无机材料 的緩冲层 122对有机材料和无机材料均具有较佳的酎着力， 使得緩冲层 122可 接着， 请结合参考图 IB和图 1C, 形成感测层 130于缓冲层 122上， 感测 层 130位于第一基板 100的中间区域 M。 相较于单一材质的緩冲层， 由复合材 料形成的缓冲层 122 , 其可通过不同折射率材质的选择， 适应不同外观需求的触 控面板要求， 具体而言， 通过调整缓冲层 】22 的折射率及厚度， 使其折射率与 位于缓冲层 122上、 下层叠结构的折射率相匹配， 可提高触控面板的透光率， 改善触控面板外观不良的问题。 例如， 緩冲层 122 的折射率为 n}， 薄膜层 121 的斤射率为 nf，感测层 130的 4斤射率为 ιιτ,則 <ητ, -较佳的， ¾ ¾ Of x ητ。 如此， 依序排列的薄膜层 121 ,缓冲层 122和感测层 130的折射率为依序递增或 依序递减， 因此， 光线可较为平滑的穿透这三层， 可降低感测层 130 中有电极 块的区域与无电极块区域对光线折射率差异， 降低电极图形的可见度， 改善触 控面板的视觉效果。
此外， 缓冲层 122还可降低薄膜层 121及感测层 130分别与缓沖层 122之 间产生的应力作用。 特别在一些特定的情形下， 例如温度的急剧升高或降低， 或者第一基板 100的离型过程中， 缓沖层 122的作用尤为重要。 如前所述， 薄 膜层 121可采用有机材料形成， 例如聚酰亚胺（PI )。 而感测层 130通常采用无 机材料形成， 所以聚酰亚胺形成的薄膜层 121 具有一相对较大的热膨胀系数 ( CTE；), 而感测层 130具有相对较小的热膨胀系数。 另外， 聚酰亚胺形成的薄 膜层 121和感测层 130的机械性能也相差很大。 因此， 薄膜层 121和感测层 130 之间会产生较大的应力， 该应力不仅对触控面板的视觉外观效杲产生不利的影 响 （如前述电极图形可见）， 也可能导致移除第一基板 100时损坏薄膜层 121。 本发明实施例在薄膜层 12】与感测层 130之间增加缓沖层】22， 通过缓冲层 122 的缓冲作用， 薄膜层 121与感测层 130之间可能产生的应力将被有效的減少。 如此， 在薄膜层 12】 与感测层 130之间增加緩冲层 122可大幅提升触控面板的 口
基于前述， 緩冲层 122材料的热膨胀系数应介于薄膜层 121 材料的热膨胀 系数与感测层 130材料的热膨胀系数之间。 例如， 如果聚酰亚胺材料的薄膜层 121 的热膨胀系数为 1000, 而感测层 130的热膨胀系数为个位数值， 则緩沖层 121的热膨胀系数较佳为三位数， 其不应太接近感测层 130的热膨胀系数， 例如 其范围应大于 100， 同时，缓冲层】22的热膨胀系数也不应太接近薄膜层 12】 的 热膨胀系数， 例如， 其范围应小于 900。 因此， 缓沖层 122的热膨胀系数较佳为 接近薄膜层 121 的热膨胀系数与感测层 130的热膨胀系数的中间值。 这也是緩 冲层 122由有机材料和无机材料形成的另一原因， 可便于调整緩冲层 122的热 膨胀系数。
此外， 缓冲层 122的厚度可介于约 10埃 (A)至约 3000埃 (A)。 缓冲层 122可 采用印刷、 涂布或光刻的方式形成。 如采用凸板例如 APR(Asahikasei photosensitive resin )板以转印的方式形成，采用该转印的方式形成的缓冲层 122， 可以减小后续形成的感测层与薄膜层 121 之间的应力， 降低感测层因应力影响 产生变形等不良。在一实施例中，缓冲层 122可采用溶液涂布， 再紫外光固化， 然后加热进一步固化的方式形成于薄膜层 121上。
缓冲层 122与薄膜层 121共同构成位于第一基板 100上的承载层 120。緩冲 层 122相对于薄膜层 121具有较高的硬度， 较高硬度的緩冲层 122搭配延展性 较佳的薄膜层 12〗 所构成的承载层】20可同时具有良好的离型能力及较佳的承 载能力，可提高后续形成于承载层 120上其它组件的可靠度。需更进一步说明， 相较于单一材质 (如二氧化硅)的緩冲层 122， 采用前述提及之复合材料的缓冲层 122, 其亦将有利于调整緩冲层 122之应力， 故有利于提高离型时， 整体触控结 构的稳定性。
接着， 请结合参阔图 1C及图 4， 图 4为本发明一实施例触控面板感测层结 构示意图。 在该实施例中， 感测层 130 包括复数个沿一第一方向排列的第一电 极块 131， 复数条连接第一方向上相邻第一电极块 131的第一导线 132， 复数个 沿一第二方向排列的第二电极块 133，各第二电极块 133分布于第一导线 132两 側， 各第一导线 132上形成有一绝缘块 135， 且各绝缘块 135上形成有连接第二 方向上相邻第二电极块 133的第二导线 134， 也即绝缘块 135位于第一导线 132 与第二导线 134之间， 以使第一导线 132与第二导线 134相互电性绝缘。 其中 第一方向不同于第二方向， 较佳为相互垂直。 需要说明的是， 感测层 130 的结 构并不限于图 4所示的结构， 例如， 感测层 130可为包含梳子状、 十字交叉状 或波浪状的单层的电极结构。 或者在其他实施例中， 感测层 130还可为多层的 结构， 例如第一方向电极、 第二方向电极以及位于第一电极和第二电极之间绝 缘层分别位于独立的三层。
形成感测层 130的步骤具体可包括， 首先， 在缓沖层 122上形成第一导线 132, 其次， 在各第一导线 132上形成绝缘块 135， 最后形成第一极块 131 , 第 二电极块 133及第二导线 134。或者，在另一实施例中，可先形成第一极块 131、 第二电极块 133及第一导线 132, 再在第一导线 132上形成绝缘块 135， 最后在 绝缘块 132上形成第二导线 134。
此外， 形成感测层 130的步骤还包括形成复数信号线 136，位于同一轴向的 第一电极块 131通过第一导线 132相互电性连接形成感测电极串列， 进而再与 之对应的信号线 136电性连接； 位于同一轴向的第二电极块 133通过第二导线 】34相互电性连接形成感测电极串列， 进而再与之对应的信号线 136电性连接。 第一电极块 131、第二电极块 133产生的感测信号通过信号线 136传递给控制器 (图未示），控制器根据感测信号可计算得到触摸位置。需说明的是，信号线 136 的排布方式和数量可根据不同感测层 130的结构作调整， 并不限定于图 4中的 形式， 具体而言， 信号线 136 汇聚之区域可为多个， 而连接于同一感测电极串 列的信号线 136亦可采用双边引线的方式。
第一电极块〗31和第二电极块】33的材料为透明导电材料， 可包括氧化铟 锡（ΠΌ )、 氧化铝辞、 氧化锌、 氧化锡锑、 二氧化锡、 氧化铟或前述之组合。 第一电极块 131和第二电极块 133的材料也可采用纳米银、 纳米碳管或金属网 格 ( Metal mesh )等导电材料„ 第一导线 132、 第二导线 134及信号线 136可采 用与前述电极块相同的透明导电材料， 亦可采用不透明的导电材料， 例如金属 或合金， 包括 ·金、 银、 铜 钼、 铝或前述之组合。 第一电极块 131、 第二电极块 133、第一导线 132及第二导线 134可采用溅镀及光刻的步骤形成，亦可用网印、 喷涂等方式形成。
值得说明的是，于本发明之触控面板，在一较佳实施例中，第一电极块 131、 第二电极块 133、第一导线 132及第二导线 134均为在低温条件下溅镀形成的氧 化铟锡， 该低温约为 20摄氏度到 80摄氏度。 相较于高温溅镀， 低温溅镀形成 之氧化铟锡， 其整体应力较小， 故将有利于后续移除第一基板 100 时， 形成于 承载层 120上整体触控结构的稳定性。 具体而言， 先在低温条件下溅镀及光刻 形成第一导线 132， 此时第一导线 132 为非结晶型氧化铟锡； 接着对第一导线 132进行烘烤， 使得非结晶型氧化铟锡转变成结晶型的氧化铟锡； 然后， 在第一 导线 132上形成各绝缘块 135;再然后在低温条件下溅镀及光刻形成第一电极块 131、 第二电极块 133及第二导线 134， 此时， 第一电极块 131 , 第二电极块 133 及第二导线 134均为非结晶型的氧化铟锡， 最后对第一电极块 131、 第二电极块 133及第二导线 134进行烘烤，使得非结晶型的氧化铟锡转变成结晶型的氧化铟 锡。 前述烘烤的温度大于等于 180摄氏度且小于等于 350摄氏度， 较佳约大于 等于 220摄氏度且小于等于 240摄氏度。
对第一导线 132进行烘烤可以避免在形成第一电极块 131、 第二电极块】33 及第二导线 134时的蚀刻液侵蚀既已形成的第一导线 132，且可以提高第一导线
132的透光性， 降低第一导线 132的阻抗， 提高其导电性。 同理， 对第一电极块
131、 第二电极块 133及第二导线 134进行烘烤， 也可以提高第一电极块 131、 第二电极块 133及第二导线 134的透光性， 且降低第一导线】32的阻抗， 提高 其导电性。 在另一实施例中， 可以先在低温条件下溅镀及光刻形成第一电极块 131、 第 二电极块 133及第二导线 134， 此时， 第一电极块 131、 第二电极块 133及第一 导线 132均为非结晶型的氧化铟锡； 接着对第一电极块 131 ¾ 第二电极块 133及 第一导线 132 进行烘烤， 使得非结晶型的氧化铟锡转变成结晶型的氧化铟锡； 接着在第一导线 132上形成各绝缘块 135; 然后形成第二导线 134， 此时第二导 线 134为非结晶型氧化铟锡； 最后， 对第二导线 134进行烘烤， 使得非结晶型 氧化铟锡转变成结晶型的氧化铟锡。 本实施例仅以氧化铟锡的材料举例说明， 但本发明并不以此为限。
接着， 请参照图 1D， 形成第二基板 150于感测层 130上， 第二基板 150更 可部分或全部覆盖緩冲层 122，可通过第二粘结层 140将第二基板 150粘附于感 测层 130及緩冲层 122上。 第二基板 150的材料包括诸如聚对苯二曱酸乙二醇 酯 (PET)的聚合物或根据本发明实施例能够支撑一薄膜组件使之转移至一盖板 的任何合适材料， 例如玻璃、 环烯烃共聚物 （COP、 Arton )、 聚丙烯（PP )等。 第二粘结层】40为一可移除式粘合剂， 该第二粘结层 140可包括非水溶性胶或 能够将两层临时粘附在一起且后续可被溶解或以其它方式移除的任何其它合适 的材料。 需要说明的是， 第二基板 150和第二粘结层 140层叠设置， 其整体可 例如为单面胶。 第二基板 150例如为一可挠性膜层， 而第二粘结层 140为一胶 层， 如图 ID所示， 第二粘结层 140具有一相对设置的 A表面和 B表面， 靠近 第二基板. 150的表面为 A表面， 第二粘结层 140的 B表面的粘性可通过光照处 理例如紫外光照射、 热处理或冷处理或前述之组合可降低甚或消失， 与此同时 第二粘结层 140的 A表面与第二基板 150之间仍具有较好的粘性， 如此在后续 移除第二基板 150的步驟中可一并移除第二粘结层 140。
然后， 请参照图 1E-1、 图 1E-2和图 IF , 其中图 1E-2为图 1E-1的爆炸图， 移除第一基板 100。如图 1E-1及图 1E-2所示，可先沿着周边区域 N靠近中间区 域 M的边缘切割， 亦即沿着图 IE 1所示的切割线 CC进行切割， 将位于周边区 域 N的第一粘结层 110 , 薄膜层 121、 缓冲层 122、 第二粘结层 140及第二基板 150切除， 然后移除第一基.板 100。 由于先将起主要粘着作用的第一粘结层 110 切除， 使得第一基板 100与薄膜层 121之间无粘结层， 其之间的附着力大幅降 低， 再移除第一基板 100， 可减小在移除第一 反 100 的过程中应力对薄膜层 121及薄膜层 121上形成的其它结构的影响。 另外， 在切除第一粘结层 110时， 可控制切割参数， 使其不会切割到第一基板 100， 如此， 第一基板 100可重复利 用， 以利于降低成本。
在另一实施例中， 可先沿着周边区域 N靠近中间区域 M的边缘切割， 亦即 沿着图 IE- 1所示的切割线 CC进行切割， 与前述不同之处在于， 不仅将位于周 边区域 的第一粘结层 110、 薄膜层 121、 缓冲层 122、 第二粘结层 140及第二 基板. 150切除， 进一步可同时切除位于周边区域 N的部分第一基板 100, 然后 再移除被切割之后的第一基板 100。 或者在又一实施例中， 可在形成感测层】30 的步骤与形成第二基板 150的步骤之间， 沿着周边区域 N靠近中间区域 M的边 缘切割，将位于周边区域 N的第一粘结层 110、薄膜层 121及緩冲层 122切除， 同时， 第一基板 100仍保留， 待第二基板 150形成之后， 再将第一基板 100移 除。
需说明的是，在移除第一基板. 100时，可辅助或采用其它措施以方便离型。 如可通过溶液浸泡、 热处理、 冷处理、 外力剥离或前述之组合的方式将第一基 板 100自薄膜层 121上移除。所用溶液可为水、酒精、丙二醇甲醚醋酸酯 (PGMEA) 溶液、 聚偏二氟乙烯（PVDF ) 的 N曱基吡咯烷酮 （NMP )溶液等； 采用热处 理及冷处理， 是对第一基板 100进行加热或冷却， 利用承载层 120与第一基板 100的热膨胀系数不同产生应力进而方便离型。
接着， 请参照图 1G， 贴附盖板 170于薄膜层 121上， 可通过.接合层 160以 层压或其它方式将盖板 170与薄膜层 121贴附在一起， 且接合层 160位于薄膜 层 121与盖板 170之间， 从图 1G的图面来看， 堆叠次序由上而下为盖板 170、 接合层 160、 薄膜层 121、 缓冲层 122 ¾ 感测层 130、 第二粘结层 140及第二基 板 150。
盖板 170可用以保护位于其下的结构， 其可采用玻璃 聚酰亚胺（PI )、 聚 丙烯（PP ), 聚苯乙烯（PS )、 丙烯腈丁二烯苯乙烯（ABS )、 聚对苯二曱酸乙 二酯 （PET ), 聚氯乙烯（PVC ) 聚碳酸酯 （PC ), 聚乙烯（PE ), 聚甲基丙烯 酸曱酯（PMMA )、 聚四氟乙烯（PTFE )等透明材料。 盖板 170可为硬质材质或 可挠性材质， 还可为六面化学强化， 或仅上 下表面化学强化而側面物理强化 的强化基板。 盖板 170可由玻璃母板经裁切成符合触控模块的尺寸， 再进行化 学强化而制得。 盖板 170可包含两平面表面 （如上下表面均为平面）、 两曲面表 面 （如上下表面均为曲面）、 或一平面一曲面 （如上或下表面其中一面为平面， 另一面为曲面） 的设计， 例如可为 2.5D形状， 或 3D形状。 盖板 170的上表面 也即相对于薄膜层 121 的另一面可作为触碰物体的接触面。 接合层〗60可采用 固态或液态透明光学胶或其它合适之透明接合材料。
本^ ^明之承载层 120和感测层 130可称作一薄膜组件， 与普通之触控模组 包含一玻璃基板和一薄膜层、 或两薄膜层、 或两玻璃基板作承载板及组合对应 的感测层相比， 本发明之薄膜组件更薄且可挠性更好， 薄膜组件可作为触控组 件贴酎于具有不同曲率半径的硬质基板上， 或贴附于柔性基板上， 可更加灵活 的适应不同触控面板的设计需求。 另外， 通过第二基板 150 的转载作用将薄膜 层 121连同緩冲层 122、 感测层 130贴酎于盖板 170上，较佳的第二基板 150采 用柔性材质， 而盖板 170 常用相对较硬的材质如强化玻璃， 如此采用软性材质 贴附到硬性材质上， 贴合容易， 且可避免接合层 160产生气泡及减少接合层 160 的厚度。
另外， 在贴附盖板 170之前， 可形成遮蔽层 180于盖板 170上， 遮蔽层 180 位于盖板 170的至少一侧， 用以遮蔽.信号线（如图 4中的信号线 136 )， 使得信 号导线从盖板 170上表面的一侧不容易被使用者看到。 在一实施例中， 遮蔽层 180位于盖板 170的下表面， 也即位于盖板 170邻近薄膜层 121的一面。 在另一 实施例中， 遮蔽层 180可位于盖板 170的上表面， 也即位于盖板 170相对于薄 膜层 121 的另一面。 或者在其它实施例中， 遮蔽层 180 还可以为一装饰膜层 ( Deco-film ), 该装饰膜层具体是包括一透明薄膜， 在该透明薄膜的周边区域设 置有遮蔽层， 可以将该装饰膜层直接设置于盖板的上表面， 亦可采用该装饰膜 层取代盖板 170及遮蔽层 180。 遮蔽层 180的材料可为有色油墨、有色光阻或前 述两者的组合。 遮蔽层 180 可为单层结构或复合叠层结构， 单层结构例如黑色 油墨层； 复合叠层结构例如油墨层与光阻层的堆叠结构、 白色油墨层与黑色油 墨层的堆叠结构、 白色油墨层、 黑色油墨层及光阻层的堆叠结构等。
最后， 请结合参照图 1G和图 1Ή， 将第二基板〗 50及第二粘结层 140 自感 测层 130上移除 具体的， 可先对第二粘结层 140进行预处理， 包括光照处理、 热处理或冷处理或前述之组合， 举例而言， 根据第二粘结层 】40 的材料不同， 可分别釆用紫外光照射、 加热或冷却等手段使第二粘结层 140与感测层 130之 间的粘着性降低， 再将第二粘结层 140和第二基板 150 自感测层】30上移除。 例如前述， 第二粘结层 140和第二基板 150的层叠结构为单面胶， 采用紫外光 照射， 使得第二粘结层】40的 Β表面与感测层 130之间的粘性降低甚或消失， 同时第二粘结层 140的 Α表面与第二基板 150之间的粘性仍存在， 故可较方便 且同时移除第二基板 150和第二粘结层 140。 当然， 可根据第二粘着层 140的材 料选用不同的移除方式， 本发明并不以此为限。
经由上述步骤最终形成如图 1H所示的触控面板 10， 以图示上方为使用者 触碰及观测面， 触控面板 10 包括由上而下堆叠的盖板 170、 接合层 160、 薄膜 层 121、 缓冲层 122及感测层 130, 即接合层 160位于盖板 170与薄膜层 121之 间， 薄膜层 121位于接合层 160与緩冲层 122之间， 緩冲层 122位于薄膜层 121 与感测层 130之间。
请继续参照图 1H， 触控面板 10还包括遮蔽层 180， 遮蔽层 180位于盖板 170的至少一侧。 前述各部件的详细结构、 材料、 制作方法在前文已叙述， 故在 此不再赘述。 触控面板 10可应用于计算机系统、 移动电话、 数字媒体播放器、 平板电脑、 超轻薄笔电、 穿戴式触控装置， 车载触控系统等触控显示装置中。
需说明的是， 在完成图 1A至图 1H步驟之后， 可进一步地通过各向异性导 电胶将带有控制器的软性电路板贴酎至接合位置的信号线 136上。 不难理解， 相较于在图 1C步驟之后直接贴附软性电路板， 本.发明在完成图 1H步骤之后， 再贴附软性电路板， 可避免移除第一基板 100或第二基板 150等制作工艺过程 中， 可能存在软性电路板易脱落的问题， 故将有利于提高整体触控面板的稳定 性。
图 2A ~ '图 2B为本发明另一实施例触控面板的制作方法的流程图。图 2B还 表示本发明一实施例触控面板的结构示意图 需要说明的是， 图 2A 为承接图 1C的步骤， 在图 2A所示步骤之前的步骤与图 1A〜图 1C相同， 为简洁起见， 故不再赘述。 如图 2A所示， 在形成感测层 130之后， 还包括形成一保护层 200 于感测层】 30之上， 感测层】30位于保护层 200与缓冲层 122之间。保护层 200 对感测层 130具有保护作用， 可减少在移除第二粘结层 140及第二基板 150的 过程中对感测层 130的影响。 另外， 还可以在移除第二粘结层 140及第二基板 150之后， 减少环境中空气、 水汽或其它物质对感测层 130的侵蚀。 进一步的， 保护层 200 需棵露出信号线连接软性电路板的接合位置， 以利于信号连接线与 软性电路板进行接合。
请结合参考图 ID〜图 1H， 承接图 2A所示步骤之后的步骤基本与图 ID至 图 1H类似， 不同在于， 第二基板 150及第二粘结层 140是形成于保护层 200之 上， 也即第二粘结层 140是位于保护层 200与第二基板 150之间。 移除第一基 板 100及第一粘结层 110， 并与盖板 170贴合， 再移除第二基板 150及第二粘结 层 140之后形成的触控面板 20更包括保护层 200， 如图 2B所示， 触控面板 20 包括由上而下堆叠的盖板 170、 接合层 160、 薄膜层 121 , 緩沖层 122、 感测层 130及保护层 200„ 除了保护层 200， 其它各元件结构及其材料、 制作方法前文 已叙述， 故不再赘述。
此外， 请参照图 2B， 保护层 200可为单层的结构或多层的结构。 例如保护 层为多层结构时， 可包含第一保护层 201和第二保护层 202， 第一保护层 201位 于感测层 130和第二保护层 202之间， 第二保护层 202远离第一保护层 201的 一侧可贴合显示装置而组合形成一触控显示装置。 第一保护层 20】 和第二保护 层 202可选用不同的材料达到不同的功效。
第一保护层 201 可选用有机材料、 无机材料、 复合材料及高分子材料之至 少其中之一。 在一实施例中， 第一保护层 201可采用与前述.缓冲层 122相同的 复合材料， 例如包括二氧化钛 (Ti02)、 二氧化硅 (Si02)、 二氧化锆（Zr02 )或前 述之组合， 或二氧化钛 (Ti02)、 二氧化硅 (Si02)与有机材料形成的化合物， 或二 氧化锆（Zr02 )二氧化硅 (Si02)与有机材料形成的化合物。 通过调整第一保护层 201的折射率及.厚度，搭配缓冲层 122来改善感测层 130有电极块和没有电极块 区域对光线反射差异造成触控面板外观不良的问题。 例如， 第一保护层 201 的 折射率为 ，第二保护层 202的折射率为 113, 感测层的折射率为 ητ, 则 η3 <η2 <ητ 较佳的 «
Figure imgf000021_0001
在此较佳实施例中， 第一保护层 201的厚度可为约 0.01 微米至 0.3微米。
上述第一保护层 201主要起折射率匹配的作用， 而第二保护层 202主要对 感测层 130等达到进一步保护作用， 减少环境中空气、 水汽或其它物质对感测 层 130的侵蚀。 第二保护层 202的材料具体可包括热硬化型树脂、 二氧化硅、 第一保护层 201、 第二保护层 202 可采用凸板例如 APR(Asahikasei photosensitive resin)板以转印的方式形成， 釆用该转印的方式形成的第一保护层 201和第二保护层 202， 可以减小感测层 130与其他层别之间的应力作用， 提高 感测层 130 的稳定性， 同时后续也可较方便的移除第二基板及第二粘结层， 减 少应力影响。 在另一实施例中， 第一保护层 201和第二保护层 202可分别釆用 溶液涂布， 再紫外光固化， 然后热固等方式形成。 在本发明的其他较佳实施例 中亦可视需要以其他制程例如溅镀（sputter) » 化学气相沉积 (chemical vapor deposition, CVD)、 喷墨印刷 (irskjet printing) , 狭缝涂布 (slit coating) , '旋涂 (spin coating)、 喷涂 (spray coating)或滚轮涂布 (roller coating)等方式形成保护层 200„ 前述实施例是以单独形成单片触控面板为例说明， 为提高生产效率， 降低 成本， 可先在大片的第一基板上一次形成多个薄膜组件（包括薄膜层、緩冲层、 感测层、保护层、第二粘结层、第二基板），在薄膜组件与盖板贴合的前一步骤， 再将该多个薄膜组件分别进行分离， 如此一次性可形成多片触控面板， 提高生 产效率， 降低成本。 具体制作流程可参考图 3A〜图 3D对应之实施例。
图 3A〜图 3D为本发明又一实施例触控面板的制作方法的流程图。 请先结 合参照图 3A及图 3B所示， 其中图 3B为图 3A的剖面示意图。可在大片的第一 基板 300上预先设定或区分复数个相互间隔的区域 V， 区域 V的大小可根据触 控面板的尺寸设定。 接着， 在第一基板 300上依序形成第一粘结层 110 ¾ 薄膜层 121、 缓冲层 122， 然后在缓冲层 122上并对应各个区域 V同时形成复数个相互 间隔的感测层 130， 接着在各感测层 130上形成保护层 200， 再在保护层 200上 利用第二粘结层 140粘附形成第二基.板 150。 需要说明的是， 此时， 多个感测层 130之间是相互间隔的，而其它结构包括第一基板 300 ,薄膜层 12L緩冲层 122、 保护层 200、 第二粘结层 140、 第二基板 150各自均为一整片的结构。 此外， 第 一粘结层 110、 薄膜层 121、 緩沖层 122、 第二粘结层 140、 第二基板 150的形 成方法可参考前述图 1A至图 1H对应之实施例， 保护层 200的形成方法可参考 前述图 2A及图 2B对应之实施例。
接着， 请结合参照图 3C和图 3D， 移除第一基板 300， 并将薄膜组件 30以 薄膜层 121—侧贴附在一第三基板 310上， 薄膜层 121位于緩冲层 122与第三 基板 310之间。 其中移除第一基板 300的方式和前述实施例方式相同。 第三基 板 310 的结构可与前述第二基板结合第二粘结层的结构相^, 为相互粘附的一 可挠性膜层和一胶层， 例如单面胶， 是以具有粘性的表面贴酎薄膜组件 30的薄 膜层 121。 第三基板 310可对薄膜组件 30起支撑和保护作用， 避免薄膜组件 30 在后续分离过程中损坏。
然后， 分离各个区域 V对应的薄膜组件 30， 将原本连成一体的薄膜组件分 离成多个单独的小片薄膜组件 30。 可釆用刀切或激光切割的方式分离各薄膜组 件 30。 如图 3D所示， 图 3D中是以分离成三个一组的小片薄膜组件为例， 可以 理解的是， 也可以分离成更小或更大片的薄膜组件。
然后， 移除第三基板. 310。 结合参考图 2B, 再将小片的薄膜组件分别贴合 盖板 170，最后移除第二基板 150及第二粘结层 140，以分别形成多个触控面板， 最终形成的触控面板结构如图 2B所示。该实施例之盖板 170可由大片的玻璃母 板经栽切成符合触控模块的尺寸， 再进行化学强化而制得。 相对于传统的先对 大片玻璃盖板进行化学强化， 再沉积形成多个感测层， 然后再将大片玻璃盖板 连同感测层裁切得到小片触控面板， 本实施 之盖板 170是先裁切再强化， 最 后贴合在薄膜组件上， 无需进一步切割， 具有较好的边缘强度， 且形成感测层 的制程也不会影响盖板的强度， 可提高最终形成之触控面板整体强度。
需要说明的是， 在图 3A〜图 3D中所示的采用大片的第一基板 300—次形 成多个触控面板的过程中， 其中， 用于将薄膜层粘附于第一基板 300上的第一 粘结层， 可以设置于该大片的第一基板 300的周边区域， 例如第一.基板 300的 四周。 在另一实施例中， 第一粘结层还可以设置在各个区域 V的四周, 以进一 步加强薄膜层与第一基板 300的附着性， 如此， 在移除第一基板 300时， 会一 并移除位于第一基板 300四周的第一粘结层以及位于各个区域 V四周的粘结层。 或者仅在各个区域 V的' a?周设置第一粘结层， 而在第一基板 300的四周不设置 第一粘结层， 本发明不以此为限。
本发明提供的触控面板及其制作方法， 借由第一基板的支撑作用将感测层 形成于薄膜层上， 再借由第二基板的转载作用， 将薄膜层及其上形成的感测层 贴酎于盖板上， 如此， 形成的触控面板更加轻、 薄， 制作成本较低。 另外， 感 测层位于薄膜层贴合盖板的另一面， 可避免感测层与软性电路板接合时影响薄 膜层与盖板之间贴合的平整度。 此外， 在薄膜层与感测层之间形成有缓冲层， 可減少形成感测层的过程中对薄膜层的侵蚀， 进一步的可減小移除第一基板时 应力对薄膜层及感测层的损伤。
以上所述仅为本发明的较佳实施例而已， 并不用以限制本发明， 凡在本发 明的精神和原则之内， 所傲的任何修改、 等同替换、 改进等， 均应包含在本发 明保护的范围之内。

Claims

WO 2015/043297 权 利 要 求 书 PCT/CN2014/082576
1 . 一种触控面板的制作方法， 其特征在于， 包括步骤：
S1 : 形成薄膜层于第一基.板上；
S2: 形成緩冲层于所述薄膜层上， 且所述薄膜层位于所述第一基板与所述缓 冲层之间；
S3 : 形成感测层于所述缓冲层上， 且所述緩冲层位于所述薄膜层与所述感测 层之间；
S4: 形成第二基板于所述感测层上， 且所述感测层位于所述缓沖层与所述第 二基板之间；
S6: 采用一接合层贴酎一盖板于所述薄膜层上， 且所述接合层位于所述盖板 与所述薄膜层之间； 及
S7: 移除所述第二基板。
2. 根据权利要求 1所述的触控面板的制作方法， 其特征在于， 所述步骤 S1 中 通过第一粘结层将所述薄膜层粘附于所述第一基板上。
3. 根据权刹要求 1所述的触控面板的制作方法， 其特征在于， 所述步骤 S2中 所述緩冲层以转印的方式或溶液涂布再固化的方式形成于所述薄膜层上。
4. 根据权利要求 1所述的触控面板的制作方法， 其特征在于， 在步骤 S3与 S4 之间还包括形成保护层于所述感测层上， 且所述感测层位于所述緩沖层与所 述保护层之间。
5. 根据权利要求 4所述的触控面板的制作方法， 其特征在于， 形成所述保护层 的步骤包括：
形成第一保护层于所述感测层上， 且所述感测层位于所述緩冲层与所述第一 保护层之间； 以及 形成第二保护层于所述第一保护层上， 且所述第一保护层位于所述感测层与 所述第二保护层之间。
6. 根据权利要求 4所述的触控面板的制作方法， 其特征在于， 所述保护层以转 印的方式或溶液涂布再固化的方式形成。
7. 根据权利要求 1所述的触控面板的制作方法， 其特征在于， 所述步骤 S4中 通过第二粘结层将所述第二基板粘附于所述感测层上。
8. 根据权利要求 1或 7所述的触控面板的制作方法， 其特征在于， 所述第二基 板为 可挠性基板。
9. 根据权利要求 1所述的触控面板的制作方法， 其特征在于， 步骤 S5中， 通 过溶液浸泡、 热处理、 冷处理、 外力剥离或前述之组合的方式移除所述第一 基板。
10.根据权利要求 2所述的触控面板的制作方法， 其特征在于， 所述第一基板定 义有一中间区域和围绕所述中间区域的周边区域， 所述第一粘结层位于所述 第一基板的周边区域， 所述感测层位于所述第一基板的中间区域。
1 1.根据权刹要求 10所述的触控面板的制作方法， 其特征在于， 步骤 S5 包括： 沿着所述周边区域靠近所述中间区域的边缘切割， 切除位于所述周边区域的 所述第一粘结层， 再移除所述第一基板。
】2.根据权利要求 10所述的触控面板的制作方法， 其特征在于， 步骤 S5 包括： 沿着所述周边区域靠近所述中间区域的边缘切割， 切除位于所述周边区域的 所述第一粘结层和位于所述周边区域的部分所述第一基板， 再移除所述第一 基板。
】3.根据权利要求 7所述的触控面板的制作方法， 其特征在于， 步骤 S7包括， 先对所述第二粘结层进行光照处理、 热处理， 冷处理或前述之组合， 再移除 所述第二粘结层和所述第二基板。
14.根据权利要求 1所述的触控面板的制作方法， 其特征在于， 形成所述感测层 的步骤包括：
形成复数条沿第一方向间隔排列的第一导线；
形成复数个沿所述第一方向排列的第一电极块、 复数个沿第二方向排列的第 二电极块、 复数条第二导线， 相邻第一电极块通过所述第一导线电性连接， 所述各第二电极块分布于所述第一导线两侧， 所述第二导线电性连接相邻所 述第二电极块； 及
形成复数个绝缘块于所述第一导线与所述第二导线之间， 以使所述第一导线 与所述第二导线相互电性绝缘。
15.根据权刹要求 14 所述的触控面板的制作方法， 其特征在于， 所述第一电极 块、 所述第二电极块及所述第二导线与所述第一导线分别在温度为 20摄氏 度至 80摄氏度的条^ "下形成。
】6.根据权利要求 〗4 所述的触控面板的制作方法， 其特征在于， 在形成所述第 一导线的步骤之后还包括一烘烤的步骤。
17.根据权利要求 14 所述的触控面板的制作方法， 其特征在于， 在形成所述第
—电极块、 第二电极块及第二导线的步骤之后还包括一烘烤的步骤。
】8.根据权利要求 16或 17所述的触控面板的制作方法， 其特征在于， 所述烘烤 的温度大于等于 180摄氏度且小于等于 350摄氏度。
19.根据权利要求】6或 17所述的触控面板的制作方法， 其特征在于， 所述烘烤 的温度为大于等于 220摄氏度且小于等于 240摄氏度。
20.根据权利要求 1所述的触控面板的制作方法， 其特征在于， 还包括形成遮蔽 层于所述盖板上， 且所述遮蔽层位于所述盖板至少一侧。 根据权利要求 1所述的触控面板的制作方法， 其特征在于， 所述第一基板上 区分有复数个相互间隔的区域， 步骤 S3 包括同时形成复数个感测层于所述 緩冲层上， 每一感测层分别对应所述第一基板上的所述一个区域。
根据权利要求 21所述的触控面板的制作方法， 其特征在于， 在步骤 S5之后 还包括提供一第三基板， 且所述薄膜层位于所述缓沖层与所述第三基板之间。 根据权利要求 22 所述的触控面板的制作方法， 其特征在于， 还包括步骤： 分离所述感测层分别对应的区域为多个； 移除所述第三基板。
根据权利要求 1所述的触控面板的制作方法， 其特征在于， 所述步骤 S1 包 括： 涂布溶液于所述第一基板上； 固化所述溶液以形成所述薄膜层于所述第 基板上。
根据权利要求 24 所述的触控面板的制作方法， 其特征在于， 所述溶液包含 可溶性聚酰亚胺及有机溶剂， 或所述溶液包含聚酰胺酸及有机溶剂。
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