WO2015018300A1 - 触控装置 - Google Patents

触控装置 Download PDF

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Publication number
WO2015018300A1
WO2015018300A1 PCT/CN2014/083614 CN2014083614W WO2015018300A1 WO 2015018300 A1 WO2015018300 A1 WO 2015018300A1 CN 2014083614 W CN2014083614 W CN 2014083614W WO 2015018300 A1 WO2015018300 A1 WO 2015018300A1
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WIPO (PCT)
Prior art keywords
substrate
conductive layer
touch device
layer
micrometers
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PCT/CN2014/083614
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English (en)
French (fr)
Inventor
何宽鑫
王文光
杨俊评
李利群
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宸鸿科技(厦门)有限公司
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Application filed by 宸鸿科技(厦门)有限公司 filed Critical 宸鸿科技(厦门)有限公司
Publication of WO2015018300A1 publication Critical patent/WO2015018300A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Definitions

  • the present invention relates to the field of touch technologies, and in particular, to a touch device.
  • FIG. 1 is a schematic structural view of a touch device of the prior art.
  • the touch panel 100 includes a first substrate 10 , a first conductive layer 11 , a second substrate 12 , a second conductive layer 13 , and an adhesive layer 14 .
  • the first conductive layer 11 is located on the lower surface of the first substrate 10
  • the second conductive layer 13 is located on the upper surface of the second substrate 12, wherein the lower surface of the first substrate 10 is disposed opposite to the upper surface of the second substrate 12.
  • the bonding layer 14 is located between the first conductive layer 11 and the second conductive layer 13.
  • the first conductive layer 11 serves as one direction electrode (for example, the X direction) of the touch sensing
  • the second conductive layer 12 serves as the other direction electrode (for example, the Y direction) of the touch sensing, when the touch object touches or approaches the touch.
  • the capacitance or voltage value between the first conductive layer 11 and the second conductive layer 12 is changed, and by detecting the change of the capacitance or voltage, the touch point position can be obtained.
  • the response time of the touch device 100 is inversely proportional to the distance between the first conductive layer 11 and the second conductive layer 12, that is, the distance between the first conductive layer 11 and the second conductive layer 12 is greater.
  • the smaller the response time the more sensitive it is.
  • the greater the distance between the first conductive layer 11 and the second conductive layer 12 the thicker the touch device 100 is, which is disadvantageous for the slim design.
  • the distance between the first conductive layer 11 and the second conductive layer 12 of the touch device 100 of the prior art can only be controlled by the thickness of the bonding layer 14 . In order to ensure the sensitivity of the touch device 100, the thickness of the bonding layer 14 must be greater than a minimum value, so that the thickness of the touch device 100 of the prior art is difficult to further reduce.
  • the embodiment of the invention provides a touch device, which can further reduce the thickness of the touch device while satisfying the sensitivity of the touch device.
  • the embodiment of the invention provides a touch device, comprising: a first substrate having a lower surface; a first conductive layer disposed on a lower surface of the first substrate; and a second substrate
  • the second conductive layer is disposed on the lower surface of the second substrate; the first adhesive layer is disposed between the first conductive layer and the second substrate.
  • a plurality of wires are disposed on the lower surface of the second substrate and located on at least one side of the second conductive layer, and electrically connected to the second conductive layer respectively.
  • an insulating layer is further included, and the insulating layer covers the wires.
  • an insulating layer further covers the second conductive layer.
  • the insulating layer is an insulating coating layer.
  • the second bonding layer and the display module are disposed, and the second bonding layer is disposed between the second conductive layer and the display module.
  • the material of the first adhesive layer and the second adhesive layer comprises a transparent optical adhesive.
  • the thickness of the second substrate is from 50 micrometers to 200 micrometers.
  • the sum of the thicknesses of the second substrate and the first bonding layer is 175 micrometers to 375 micrometers. Further, the thickness of the second substrate is from 35 micrometers to 175 micrometers.
  • the thickness of the first bonding layer is from 75 micrometers to 175 micrometers.
  • the sum of the thicknesses of the second substrate and the first bonding layer is from 110 micrometers to 350 micrometers.
  • the thickness of the insulating layer is from 2 micrometers to 5 micrometers.
  • the thickness of the first substrate is from 0.4 mm to 1.3 mm.
  • the materials of the first substrate, the second substrate, the first conductive layer and the second conductive layer comprise a transparent material.
  • the materials of the first substrate and the second substrate include glass, polycarbonate, polyethylene terephthalate, polymethyl methacrylate, polysulfone or polystyrene.
  • the first substrate is a transparent tempered glass cover.
  • the first conductive layer includes a plurality of first electrodes
  • the second conductive layer includes a plurality of second electrodes
  • the first electrodes and the second electrodes are staggered and electrically insulated from each other.
  • the first conductive layer and the second conductive layer comprise a metal nanowire, a transparent conductive film, a metal mesh or a combination thereof.
  • the distance between the first conductive layer and the second conductive layer can be adjusted by the first bonding layer and the second substrate, and the second substrate can serve as the carrier plate of the second conductive layer. Therefore, the thickness of the touch device can be further reduced while satisfying the sensitivity of the touch device.
  • FIG. 1 is a schematic structural view of a touch device of the prior art.
  • FIG. 2 is a schematic structural diagram of a touch device according to a first embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a touch device according to a second embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a touch device according to a third embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a touch device according to a first embodiment of the present invention.
  • the touch device 200 provided in this embodiment includes a first substrate 20 , a first conductive layer 21 , a second substrate 22 , a second conductive layer 23 , and a first bonding layer 24 .
  • the first substrate 20 has a lower surface, and the first conductive layer 21 is disposed on a lower surface of the first substrate 20.
  • the first substrate 20 further has an upper surface, and the upper surface of the first substrate 20 is disposed opposite to the lower surface.
  • the first substrate 20 can be a protective cover of the touch device 200 .
  • the upper surface serves as a contact surface for a touch object.
  • the second substrate 22 has a lower surface, and the second conductive layer 23 is disposed on the lower surface of the second substrate 22.
  • the first bonding layer 24 is disposed between the first conductive layer 21 and the second substrate 22 for combining the combination of the first substrate 20 and the first conductive layer 21 with the second substrate 22 and the second conductive layer 23 Bonding.
  • the first conductive layer 21 may include a plurality of first electrodes (not shown) that are parallel and spaced apart from each other in a first direction (for example, an X-axis direction), and the second conductive layer 23 may include a plurality of second directions (for example, a Y-axis)
  • the second electrodes (not shown) are arranged in parallel and spaced apart from each other.
  • the first electrodes and the second electrodes are staggered and electrically insulated from each other, preferably perpendicular to each other, but are not limited thereto.
  • the distance between the first conductive layer 21 and the second conductive layer 23 can be adjusted together with the second substrate 22 by the first adhesive layer 24, for example, while satisfying the sensitivity of the touch device 200, as long as the brightness is ensured.
  • the sum of the thicknesses of the first bonding layer 24 and the second substrate 22 is greater than a certain minimum value,
  • the second substrate 22 can be used as the carrier of the second conductive layer 23 at the same time. Therefore, at least the thickness of the second substrate 22 can be saved compared with the prior art, which is advantageous for the thin design of the touch device 200.
  • the thickness of each layer can be designed according to the actual needs of the product.
  • the thickness of the second substrate 22 is from 50 micrometers to 200 micrometers, preferably from 35 micrometers to 175 micrometers.
  • the sum of the thicknesses of the second substrate 22 and the first bonding layer 24 is from 175 micrometers to 375 micrometers, preferably from 110 micrometers to 350 micrometers.
  • the thickness of the first bonding layer is preferably from 75 micrometers to 175 micrometers.
  • the thickness of the first substrate 20 may be 0.4 mm to 1.3 mm, but the present invention is not limited thereto. In other embodiments, the dielectric properties or other component characteristics of the material may also be considered comprehensively, and the thickness of each of the above layers may be varied accordingly.
  • FIG. 3 is a schematic structural diagram of a touch device according to a second embodiment of the present invention.
  • the touch device 300 of the present embodiment is different from the touch device of the first embodiment shown in FIG. 2 in that the touch device 300 further includes a plurality of wires 35 .
  • the wire 35 is disposed on the lower surface of the second substrate 22 and located on at least one side of the second conductive layer 23, for example, the wire 35 may be located on one side or both sides of the second conductive layer 23.
  • the wires 35 are electrically connected to the second conductive layer 23, respectively, and the signal of the second conductive layer 23 can be transmitted to a controller (not shown), and the touch point position is calculated by the controller.
  • the first conductive layer 21 also has a corresponding wire (not shown) for transmitting the signal of the first conductive layer 21 to the controller, and the manner of setting is not limited herein.
  • the touch device 300 further includes an insulating layer 36 covering the wire 35 such that the wire 35 is located between the second substrate 22 and the insulating layer 36 to prevent the wire 35 from being polluted or eroded by the environment.
  • the insulating layer 36 may be directly coated on the wire 35 in a plating manner, and the insulating layer 36 may have a thickness of 2 micrometers to 5 micrometers.
  • Other components are substantially the same as the embodiment shown in FIG. 2, and details are not described herein again.
  • the touch device 300 further includes a second adhesive layer 37 and a display module 38 .
  • the second adhesive layer 37 is disposed between the second conductive layer 23 and the display module 38 for bonding the layers on the second conductive layer 23 and the second conductive layer 23 to the display module 38.
  • the second bonding layer 37 covers the second conductive layer 23 as a protective layer of the second conductive layer 23 to prevent the second conductive layer 23 from being corroded by the environment or the air.
  • the second bonding layer 37 may also partially cover the insulating layer 36 to further increase the connection between the display module 38 and the second conductive layer 23.
  • the display module 38 includes a liquid crystal display, a light emitting diode display, a plasma display, and the like.
  • FIG. 4 is a schematic structural diagram of a touch device according to a third embodiment of the present invention.
  • the difference between the touch device 400 provided in this embodiment and the touch device in the embodiment shown in FIG. 3 is that the insulating layer 46 covers not only the wires 35 but also the wires 35.
  • the second conductive layer 23 is disposed between the second substrate 22 and the insulating layer 46 to protect the wire 35 and the second conductive layer 23 at the same time.
  • the insulating layer 46 may directly cover the wire 35 and the second conductive layer 23 in a plating manner, and the insulating layer 46 has a thickness of 2 micrometers to 5 micrometers.
  • the second adhesive layer 47 is disposed between the insulating layer 46 and the display module 38 for bonding the layers above the insulating layer 23 and the insulating layer 23 to the display module 38.
  • Other components are substantially the same as the embodiment shown in FIG. 3, and details are not described herein again.
  • the materials of the first substrate and the second substrate comprise a transparent insulating material, such as glass, polycarbonate (polycarbonate, PC), polyethylene terephthalate (PET), polymethylmesacrylate, PMMA), polysulfone (PES), polystyrene or other cyclic olefin copolymer Copolymer) but not limited to this.
  • the first substrate can be a transparent tempered glass cover to provide direct touch contact of the touch device
  • the second substrate can be a flexible film substrate.
  • the first conductive layer and the second conductive layer comprise a conductive material such as a metal nanowire, a transparent conductive film, a metal mesh, or a combination thereof.
  • the first conductive layer and the second conductive layer may respectively adopt a combination of different conductive materials, for example, the first conductive layer adopts a metal nanowire and the second conductive layer uses a transparent conductive film or a metal mesh, or the first conductive layer adopts a transparent conductive film.
  • the second conductive layer uses a metal nanowire or a metal mesh, or the first conductive layer uses a metal mesh and the second conductive layer uses a transparent conductive film or a metal nanowire.
  • the metal nanowire can be, for example, a nano silver wire (silver Nanowire, SNW) or carbon nanotubes (CNT), transparent conductive film can be, for example, indium tin oxide (indium tin oxide, ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum oxide zinc (aluminum) Zinc oxide, AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium Oxide), hafnium oxide (HfO), indium gallium zinc oxide (indium gallium zinc oxide, InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium oxide (indium) Gallium magnesium oxide, InGaMgO) or indium gallium aluminum oxide (indium gallium aluminum oxide, InGaAlO), but is not limited to this.
  • the first conductive layer and the second conductive layer may be formed by printing, sputtering, and photolithography or laser etching.
  • the nano silver wires are located on a carrier film, and the nano silver wires and the carrier film can be pressed by one side of the carrier film by a hot pressing process.
  • the adhesion of the nano silver wire to the first substrate or the second substrate is increased, and the nano silver wire is prevented from being peeled off from the first substrate or the second substrate, thereby improving the reliability of the touch device. Sex.
  • the materials of the first adhesive layer and the second adhesive layer include transparent solid or liquid optical glue, double-sided adhesive, pressure sensitive adhesive and the like.
  • the material of the insulating layer includes an organic or inorganic insulating material, which can be formed by coating.
  • the material of the wire includes a conductive material such as gold, silver, copper, molybdenum, aluminum, molybdenum or a combination thereof.
  • the wires can be formed by printing, sputtering, and photolithography or laser etching.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

一种触控装置，包括第一基板（20）、第一导电层（21）、第二基板（22）、第二导电层（23）及第一粘结层（24）。第一基板（20）具有一下表面，第一导电层（21）设置于第一基板（20）的下表面。第二基板（22）具有一下表面，第二导电层（23）设置于第二基板（22）的下表面。第一粘结层（24）设置于第一导电层（21）与第二基板（22）之间。第一导电层（21）与第二导电层（23）之间的距离可通过第一粘结层（24）与第二基板（22）来调节，同时第二基板（22）又可作为第二导电层（23）的承载板，故可在满足触控装置灵敏度的同时，进一步降低触控装置的厚度。

Description

触控装置 技术领域
本发明涉及触控技术领域，尤其涉及一种触控装置。
背景技术
图1为现有技术的触控装置结构示意图。请参阅图1，触控面板100包括第一基板10、第一导电层11、第二基板12、第二导电层13及粘结层14。第一导电层11位于第一基板10的下表面，第二导电层13位于第二基板12的上表面，其中第一基板10的下表面与第二基板12的上表面相对设置。粘结层14位于第一导电层11与第二导电层13之间。通常第一导电层11作为触控感测的一个方向电极（例如X方向），第二导电层12作为触控感测的另一方向电极（例如Y方向），当触碰物体接触或靠近触控装置100时，会改变第一导电层11与第二导电层12之间的电容或电压值，通过侦测该电容或电压的改变，从而可得到触摸点位置。
通常，触控装置100的响应时间反比于第一导电层11与第二导电层12之间的距离，也即第一导电层11与第二导电层12之间距离越大则触控装置100响应时间越小，也即越灵敏。但第一导电层11与第二导电层12之间的距离越大，会导致触控装置100越厚，不利于轻薄化的设计。现有技术的触控装置100的第一导电层11与第二导电层12之间的距离仅能通过粘结层14的厚度来控制, 为保证触控装置100的灵敏度，粘结层14的厚度必须大于一个最小值，故现有技术的触控装置100厚度难以进一步降低。
发明内容
本发明实施例提供一种触控装置，可在满足触控装置灵敏度的同时，进一步降低触控装置的厚度。
本发明实施例提供一种触控装置，包括：第一基板，具有一下表面；第一导电层，设置于第一基板的下表面；第二基板, 具有一下表面; 第二导电层，设置于第二基板的下表面；第一粘结层，设置于第一导电层与第二基板之间。
进一步的，还包括复数条导线，设置于第二基板的下表面，并位于第二导电层的至少一侧，且分别电性连接于第二导电层。
进一步的，还包括绝缘层，绝缘层覆盖所述导线。
进一步的，绝缘层进一步覆盖于所述第二导电层。
进一步的，绝缘层为一绝缘镀膜层。
进一步的，还包括第二粘结层及显示模组，第二粘结层设置于第二导电层与显示模组之间。
进一步的，第一粘结层及第二粘结层的材料包括透明光学胶。
进一步的，第二基板的厚度为50微米至200微米。
进一步的，第二基板与第一粘结层的厚度之和为175微米至375微米。进一步的，第二基板的厚度为35微米至175微米。
进一步的，第一粘结层的厚度为75微米至175微米。
进一步的，第二基板与第一粘结层的厚度之和为110微米至350微米。
进一步的，绝缘层的厚度为2微米至5微米。
进一步的，第一基板的厚度为0.4毫米至1.3毫米。
进一步的，第一基板、第二基板、第一导电层及第二导电层的材料包括透明材料。
进一步的，第一基板及第二基板的材料包括玻璃、聚碳酸酯、聚对苯二甲酸乙二脂、聚甲基丙烯酸甲脂、聚砜或聚苯乙烯。
进一步的，所述第一基板为透明强化玻璃盖板。
进一步的，第一导电层包括复数第一电极，第二导电层包括复数第二电极，第一电极与第二电极相互交错且电性绝缘。
进一步的，第一导电层及第二导电层包含金属纳米导线、透明导电膜、金属网格或前述之组合。本发明提供的触控装置，第一导电层与第二导电层之间的距离可通过第一粘结层与第二基板共同来调节，同时第二基板又可作为第二导电层的承载板，故可在满足触控装置灵敏度的同时，进一步降低触控装置的厚度。
附图说明
图1为现有技术的触控装置结构示意图。
图2为本发明第一实施例提供的触控装置结构示意图。
图3为本发明第二实施例提供的触控装置结构示意图。
图4为本发明第三实施例提供的触控装置结构示意图。
具体实施方式
以下使用了某些词汇来指称特定的元件，本领域普通技术人员应可理解，制作商可能会用不同的名词来称呼同样的元件。以下说明并不以名称的差异来作为区别元件的方式，而是以元件在功能上的差异来作为区别的基准。在通篇说明书当中所提及的「包括」为一开放式的用语，故应解释成「包括但不限定于」。再者，为使本领域普通技术人员能更进一步了解本发明，下文特列举本发明之数个较佳实施例，并配合所附图式，详细说明本发明的构成内容。需注意的是图式仅以说明为目的，并未依照原尺寸作图。此外，在文中使用例如“第一”与“第二”等叙述，仅用以区别不同的元件，并不对其产生顺序之限制。
图2为本发明第一实施例提供的触控装置结构示意图。请参阅图2，本实施例提供的触控装置200包括第一基板20、第一导电层21、第二基板22、第二导电层23及第一粘结层24。第一基板20具有一下表面，第一导电层21设置于第一基板20的下表面。此外，第一基板20还具有一上表面，第一基板20的上表面与下表面相对设置, 第一基板20可为触控装置200的保护盖板, 其上表面可作为一触摸物体的接触面。第二基板22具有一下表面，第二导电层23设置于第二基板22的下表面。第一粘结层24设置于第一导电层21与第二基板22之间，用于将第一基板20及第一导电层21的组合与第二基板22及第二导电层23的组合相互粘结。
第一导电层21可包括复数沿第一方向（例如X轴向）平行且相互间隔排列的第一电极（图未示），第二导电层23可包括复数沿第二方向（例如Y轴向）平行且相互间隔排列的第二电极（图未示），第一电极与第二电极相互交错排列且电性绝缘，较佳为相互垂直，但不限于此。
由上述可知，第一导电层21与第二导电层23之间的距离可通过第一粘结层24与第二基板22共同调节，例如，在满足触控装置200的灵敏度的同时，只要保证第一粘结层24与第二基板22的厚度之和大于某一最小值即可, 而第二基板22又可同时作为第二导电层23的承载板，由此，与现有技术相比，至少可节省第二基板22的厚度，有利于触控装置200轻薄化设计。在实际触控装置产品设计时，可根据产品的实际需求来设计各层别的厚度。例如第二基板22的厚度为50微米至200微米，较佳为35微米至175微米。第二基板22与第一粘结层24的厚度之和为175微米至375微米，较佳为110微米至350微米。第一粘结层的厚度为较佳为75微米至175微米。第一基板20的厚度可以为0.4毫米至1.3毫米，但本发明并不限于此。在其他实施例中，还可综合考量材料的介电特性或其它元件特性，上述各层的厚度可相应改变。
图3为本发明第二实施例提供的触控装置结构示意图。请参阅图3，本实施例提供的触控装置300与图2所示第一实施例的触控装置的区别在于，触控装置300还包括复数条导线35。导线35设置于第二基板22的下表面，并位于第二导电层23的至少一侧，例如导线35可位于第二导电层23的一侧或两侧。导线35分别电性连接于第二导电层23，可将第二导电层23的信号传递至控制器（图未示），通过控制器计算触摸点位置。类似的，第一导电层21也具有相应的导线（图未示）将第一导电层21的信号传递至控制器，其设置方式在此不作限制。进一步的，触控装置300还包含绝缘层36，覆盖于导线35上，使得导线35位于第二基板22与绝缘层36之间，以避免导线35受到环境污染或侵蚀。绝缘层36可以以镀膜的方式直接覆盖于导线35上，绝缘层36的厚度可为2微米至5微米。其它元件与图2所示实施例基本相同，在此不再赘述。
请继续参阅图3，触控装置300还包括第二粘结层37及显示模组38。第二粘结层37设置于第二导电层23与显示模组38之间，用于将第二导电层23及第二导电层23之上的各层粘结于显示模组38之上。在此实施例中，第二粘结层37覆盖第二导电层23，可作为第二导电层23的保护层，以避免第二导电层23受到环境或空气的侵蚀。此外，第二粘结层37还可以部分覆盖绝缘层36，以进一步增加显示模组38与第二导电层23之间的连接。显示模组38包括液晶显示器、发光二极管显示器、等离子显示器等。
图4为本发明第三实施例提供的触控装置结构示意图。本实施例提供的触控装置400与图3所示实施例的触控装置的区别在于，绝缘层46不仅覆盖导线35, 更延伸覆盖于第二导电层23上，使得第二导电层23位于第二基板22与绝缘层46之间，以同时保护导线35及第二导电层23。绝缘层46可以以镀膜的方式直接覆盖于导线35与第二导电层23上，绝缘层46的厚度为2微米至5微米。第二粘结层47设置于绝缘层46与显示模组38之间，用于将绝缘层23及绝缘层23之上的各层粘结于显示模组38之上。其它元件与图3所示实施例基本相同，在此不再赘述。
上述各实施例中，第一基板与第二基板的材料包括透明绝缘材料，例如玻璃、聚碳酸脂（polycarbonate, PC）、聚对苯二甲酸乙二脂(polyethylene terephthalate, PET)、聚甲基丙烯酸甲脂(polymethylmesacrylate, PMMA)、聚砜(Polysulfone, PES)、聚苯乙烯或其他环烯共聚物（cyclic olefin copolymer）但不限于此。较佳的，第一基板可为透明强化玻璃盖板，以提供触控装置直接触控接触，第二基板可为可挠性薄膜基板。
第一导电层与第二导电层包含金属纳米导线、透明导电膜、金属网格或前述之组合等导电材料。第一导电层和第二导电层可分别采用不同导电材料的组合，例如第一导电层采用金属纳米导线而第二导电层采用透明导电膜或金属网格，或第一导电层采用透明导电膜而第二导电层采用金属纳米导线或金属网格，或第一导电层采用金属网格而第二导电层采用透明导电膜或金属纳米导线。金属奈米导线可例如为纳米银线（silver nanowire，SNW）或纳米碳管（carbon nanotubes，CNT），透明导电膜可例如氧化铟锡（indium tin oxide, ITO）、氧化铟锌(indium zinc oxide, IZO)、氧化镉锡(cadmium tin oxide, CTO)、氧化铝锌(aluminum zinc oxide, AZO)、氧化铟锌锡(indium tin zinc oxide, ITZO)、氧化锌(zinc oxide)、氧化镉(cadmium oxide)、氧化铪(hafnium oxide, HfO)、氧化铟镓锌(indium gallium zinc oxide, InGaZnO)、氧化铟镓锌镁(indium gallium zinc magnesium oxide, InGaZnMgO)、氧化铟镓镁(indium gallium magnesium oxide, InGaMgO)或氧化铟镓铝(indium gallium aluminum oxide, InGaAlO)，但不限于此。第一导电层和第二导电层可通过印刷、溅镀及微影蚀刻或激光蚀刻的方式形成。
需要说明的是，当第一导电层或第二导电层采用纳米银线形成时，纳米银线位于一载体薄膜上，纳米银线及载体薄膜可通过一热压工艺以载体薄膜一侧压合于第一基板或第二基板上，如此可增加纳米银线与第一基板或第二基板的附着力，避免纳米银线自第一基板或第二基板上剥离，从而提高触控装置的可靠性。
第一粘结层与第二粘结层的材料包括透明固态或液态光学胶、双面胶、感压胶等。绝缘层的材料包括有机或无机绝缘材料，可通过镀膜的方式形成。导线的材料包括导电材料，例如金、银、铜、钼、铝、钼或前述之组合。导线可通过印刷、溅镀及微影蚀刻或激光蚀刻的方式形成。
以上所述仅为本发明的较佳实施例而已, 并不用以限制本发明, 凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等, 均应包含在本发明保护的范围之内。

Claims (21)

  1. 一种触控装置，其特征在于，包括：
    第一基板，具有一下表面；
    第一导电层，设置于所述第一基板的所述下表面；
    第二基板，具有一下表面；
    第二导电层，设置于所述第二基板的所述下表面；
    第一粘结层，设置于所述第一导电层与所述第二基板之间。
  2. 根据权利要求1所述的触控装置，其特征在于，还包括复数条导线，所述导线设置于所述第二基板的所述下表面，并位于所述第二导电层的至少一侧，且分别电性连接于所述第二导电层。
  3. 根据权利要求2所述的触控装置，其特征在于，还包括绝缘层，所述绝缘层覆盖所述导线，所述导线位于所述第二基板与所述绝缘层之间。
  4. 根据权利要求3所述的触控装置，其特征在于，所述绝缘层进一步覆盖所述第二导电层，所述第二导电层位于所述第二基板与所述绝缘层之间。
  5. 根据权利要求3或4所述的触控装置，其特征在于，所述绝缘层为一绝缘镀膜层。
  6. 根据权利要求1所述的触控装置，其特征在于, 还包括第二粘结层及显示模组, 所述第二粘结层设置于所述第二导电层与所述显示模组之间。
  7. 根据权利要求4所述的触控装置，其特征在于，还包括第二粘结层及显示模组，所述第二粘结层设置于所述绝缘层与所述显示模组之间。
  8. 根据权利要求1所述的触控装置，其特征在于，所述第一粘结层的材料包括透明光学胶。
  9. 根据权利要求6或7所述的触控装置，其特征在于，所述第二粘结层的材料包括透明光学胶。
  10. 根据权利要求1所述的触控装置，其特征在于，所述第二基板的厚度为50微米至200微米。
  11. 根据权利要求1所述的触控装置，其特征在于，所述第二基板与所述第一粘结层的厚度之和为175微米至375微米。
  12. 根据权利要求1所述的触控装置，其特征在于，所述第二基板的厚度为35微米至175微米。
  13. 根据权利要求1所述的触控装置，其特征在于，所述第一粘结层的厚度为75微米至175微米。
  14. 根据权利要求1所述的触控装置，其特征在于，所述第二基板与所述第一粘结层的厚度之和为110微米至350微米。
  15. 根据权利要求5所述的触控装置，其特征在于，所述绝缘层的厚度为2微米至5微米。
  16. 根据权利要求1所述的触控装置，其特征在于，所述第一基板的厚度为0.4毫米至1.3毫米。
  17. 根据权利要求1所述的触控装置，其特征在于，所述第一基板、所述第二基板、所述第一导电层及所述第二导电层的材料包括透明材料。
  18. 根据权利要求1所述的触控装置，其特征在于，所述第一基板及第二基板的材料包括玻璃、聚碳酸酯、聚对苯二甲酸乙二脂、聚甲基丙烯酸甲脂、聚砜或聚苯乙烯。
  19. 根据权利要求1所述的触控装置，其特征在于，所述第一基板为透明强化玻璃盖板。
  20. 根据权利要求1所述的触控装置，其特征在于，所述第一导电层包括复数第一电极，所述第二导电层包括复数第二电极，所述第一电极与所述第二电极相互交错且电性绝缘。
  21. 根据权利要求1所述的触控装置，其特征在于，所述第一导电层及所述第二导电层包含金属纳米导线、透明导电膜、金属网格或前述之组合。
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