WO2015010433A1 - 封框胶组合物及其制备方法、含有其的液晶面板 - Google Patents

封框胶组合物及其制备方法、含有其的液晶面板 Download PDF

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WO2015010433A1
WO2015010433A1 PCT/CN2013/090100 CN2013090100W WO2015010433A1 WO 2015010433 A1 WO2015010433 A1 WO 2015010433A1 CN 2013090100 W CN2013090100 W CN 2013090100W WO 2015010433 A1 WO2015010433 A1 WO 2015010433A1
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Prior art keywords
sealant composition
frame
hydrophobic silica
resin
adhesive composition
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English (en)
French (fr)
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赵秀强
肖昂
吴昊
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BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
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Priority to US14/386,503 priority Critical patent/US9676972B2/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Definitions

  • Embodiments of the present invention relate to a frame sealant composition, a method of preparing the same, and a liquid crystal panel comprising the sealant composition. Background technique
  • TFT-LCD Thin Film Transistor Liquid Crystal Display
  • a conventional TFT-LCD is formed by injecting a liquid crystal between a TFT array substrate and a counter substrate.
  • the opposite substrate can be formed into a conventional color film (CF) substrate, and the color film can also be fabricated on the array substrate by a COA (CF On Array) process.
  • CF color film
  • COA COA On Array
  • the frame sealant composition is used to encapsulate it.
  • the sealing frame is used to encapsulate the liquid crystal cell, and it is necessary to ensure that the sealing frame adhesive composition maintains a certain hydrophobicity after curing, otherwise it will not function as a water blocking.
  • the sealant composition is mainly composed of a resin, a catalyst, a solvent, and a spherical silica filler.
  • the surface energy of the spherical silica filler is small, which affects the water blocking performance of the sealant.
  • the spherical silica filler is easily moved by pressure, so that some regions are distributed in a slug shape, and the gap is too large, resulting in uneven distribution (as shown in FIG. 1).
  • the water blocking performance of the liquid crystal panel sealed by the sealant composition is not satisfactory.
  • the main object of the embodiments of the present invention is to provide a frame sealant composition, a preparation method thereof, and a liquid crystal panel sealed by the sealant composition, wherein the sealant composition has hydrophobicity
  • the effect is enhanced to enhance the water repellency of the liquid crystal panel.
  • the embodiment of the invention provides a frame sealant composition, comprising:
  • the hydrophobic silica filler has an irregular polyhedral shape
  • the resin is a mixture of an acrylate resin and an epoxy resin.
  • the sealant composition may further comprise from 1.5% to 3% by weight of a dispersant.
  • the hydrophobic silica filler is added in an amount of 5 wt% to 7.5 wt%.
  • the hydrophobic silica filler has an average particle diameter of from 150 nm to 250 nm.
  • the dispersing agent is selected from at least one of a hyperdispersant YRC, hydrazine, fluorenyl-dimercaptoaminopropylamine and polyacrylate.
  • the number average molecular weight of the epoxy resin and the acrylate resin are each independently
  • the weight ratio of the acrylate resin to the epoxy resin is 55 to 95: 5-45.
  • the embodiment of the invention further provides a method for preparing the above-mentioned frame sealant composition, comprising the following steps: a: ultrasonically oscillating the hydrophobic silica particles under the first ultrasonic condition to obtain hydrophobicity with irregular polyhedral shape Silica particles;
  • the first ultrasonic condition is 5-20 minutes at 50 kHz.
  • the second ultrasonic condition is 5-20 minutes at 90 kHz.
  • the method also includes the step of ultrasonic grading at 50 kHz after the ultrasonic oscillating step under the second ultrasonic condition.
  • the embodiment of the invention further provides a liquid crystal panel comprising an array substrate and an opposite substrate disposed opposite to each other; wherein the array substrate and the opposite substrate are sealed by the sealant composition.
  • DRAWINGS 1 is a schematic view showing the distribution of a silica filler in a prior art sealant composition
  • FIG. 2 is a schematic view showing the distribution of a hydrophobic silica filler in a frame sealant composition according to an embodiment of the present invention
  • Figure 3 is a flow chart of the permeable experiment of the sealant film sample after curing. detailed description
  • the embodiment of the invention provides a frame sealant composition, comprising: 70 wt% to 80 wt% of resin, 2 wt% to 10 wt. / ⁇ 1 ⁇ 4 ⁇ , 2wt% ⁇ 10wt% solvent, 2.5wt% ⁇ 10wt% hydrophobic silica filler, lwt% ⁇ 1.5wt% silicon sphere, wherein the hydrophobic silica filler has irregular polyhedron
  • the shape, and the above resin is a mixture of an acrylate resin and an epoxy resin.
  • the above sealant composition may further comprise from 1.5% by weight to 3% by weight of a dispersant.
  • the resin may be a mixture of an acrylate resin and an epoxy resin which are commonly used in the art, for example, a mixture of polydecyl acrylate and bisphenol A epoxy resin.
  • the weight ratio of the acrylate resin to the epoxy resin is 55 to 95: 5 to 45, preferably 65 to 80: 20 to 35.
  • the number average molecular weight of the above acrylate resin and epoxy resin is independently from 5,000 to 10,000.
  • the dispersant may be any of the commonly used hydrophobic dispersants in the art, for example, may be selected from the group consisting of the superdispersants YRC, hydrazine, decyl-dimercaptoaminopropylamine, and polyacrylate.
  • the silicon spheres are silica particles having an average particle diameter of 1 to 5 ⁇ m for maintaining the cell pitch. It is preferred to use silica particles having an average particle diameter of 3 to 4 ⁇ m, which is the closest to the design value of the cell pitch.
  • the catalyst may be a catalyst conventionally used in the art to cause the above resin to be cured under ultraviolet light, and may be, for example, ⁇ , ⁇ -diethyl acetophenone.
  • the solvent may be a solvent commonly used in the art, and is not particularly limited, and may, for example, be propylene glycol monodecyl ether acetate or an acrylate solvent.
  • the frame sealant composition of the embodiment of the invention optimizes the shape of the hydrophobic silica filler based on the resin, catalyst, solvent, and hydrophobic silica filler.
  • Prior art frame sealant combination The silica filler added in the material is mostly spherical (as shown in FIG. 1), and the embodiment of the present invention optimizes it into an irregular polyhedron shape (as shown in FIG. 2), and the average of the irregular polyhedral silica.
  • the particle size is from 150 nm to 250 nm, preferably 200 nm, and is added in an amount of 2.5% to 10%, preferably 5% to 7.5%, based on the total weight of the sealant composition.
  • the choice of particle size and percentage herein allows the hydrophobicity of the sealer composition to be optimized under otherwise identical conditions. Based on the principle that the spherical surface area of the same volume of material is minimal, the spherical silica particles added by the prior art frame sealant composition are theoretically the smallest water blocking surface area. According to the principle that the surface area of the hydrophobic material is larger, the surface energy is larger, and the hydrophobicity is stronger.
  • the irregular polyhedral hydrophobic silica particles are prepared, and the surface area of the same volume of silica particles can be increased by 5%-20. %, as the overall area of the silica particle filler increases, the overall hydrophobicity of the sealant composition is enhanced.
  • the agent is added to the frame sealant composition of the embodiment of the present invention.
  • the sealant composition of the agent is not added, and the hydrophobic silica filler flows due to stress before curing after sealing, resulting in uneven distribution and affecting water blocking performance.
  • the mechanism of adding the dispersing agent is that the dispersing agent can uniformly distribute the silica filler in the sealant composition, so that the sealant composition is subjected to pressure flow before curing after sealing, The silica filler remains evenly distributed, ensuring that the cured sealant has good hydrophobicity.
  • the embodiment of the invention further provides a method for preparing the above sealant composition, comprising the following steps:
  • the first ultrasonic condition described above was carried out at 50 kHz for 5-20 minutes.
  • the second ultrasonic condition described above was carried out at 90 kHz for 5-20 minutes.
  • the above method also includes the step of performing ultrasonic grading at 50 kHz after the ultrasonic oscillating step.
  • the irregular polyhedral silica filler is composed of ultrasonic machinery
  • the preparation method is as follows: Adding polyethylene glycol octyl phenyl ether and n-pentanol to ethylene oxide (polyethylene glycol octyl phenyl ether: n-pentanol: volume of ethylene oxide The ratio is 1:1:3 ⁇ 1:1:5), the mixture I is obtained, and after ultrasonic vibration at 50 kHz, the mixture I 3 to 5 times the volume of water is added to obtain the mixture II, and a conventional silica filler (silica filled) is added.
  • the volume of the mixture is 30% of the volume of the mixture II, and the ultrasonic vibration is continued for 5 to 20 minutes to obtain a microemulsion; the concentrated sulfuric acid is added to the microemulsion in a volume ratio of 20 to 40% to form a silica precipitate; the precipitate formed
  • nano-sized silica particles are obtained. Further, after the cauterized nano-sized silica particles are subjected to ultrasonic grading by 50 kHz for 5-20 minutes, 50 to 100 nm of silica particles having an irregular polyhedral shape are left.
  • the frame sealant composition prepared by the above method can be stored at a temperature of from -25 ° C to -15 ° C, preferably -20 ° C.
  • the above sealant composition can be sealed by a conventional method by coating and ultraviolet curing.
  • Polyethylene glycol octyl phenyl ether and n-pentanol are added in volume to ethylene oxide (polyethylene glycol octyl phenyl ether: n-pentanol: ethylene oxide in a volume ratio of 1:1: 3)
  • ethylene oxide polyethylene glycol octyl phenyl ether: n-pentanol: ethylene oxide in a volume ratio of 1:1: 3
  • Mixture I was obtained, and after ultrasonic vibration at 50 kHz, 3 parts by volume of water of mixture I was added to obtain mixture II, and a conventional hydrophobic silica filler containing 30% by volume of mixture II was added, and ultrasonic vibration was continued for 20 minutes to obtain a microemulsion.
  • a concentrated sulfuric acid having a volume ratio of 20% was added to the microemulsion to form a silica precipitate; the resulting precipitate was subjected to a 100-degree cauterization treatment to obtain nano-sized silica particles. Thereafter, the cauterized nano-sized silica particles were subjected to ultrasonic grading by 50 kHz for 5 minutes, and then hydrophobic silica particles having an irregular polyhedral shape having an average particle diameter of 150 nm to 250 nm were obtained.
  • Example 1 the ratio of each component was selected to be: 80 wt% resin, 8 wt% catalyst, 7 wt.
  • the hydrophobic silica particle dispersion prepared above and the resin mixture were mixed to obtain 50 g of the sealant composition 1.
  • FIG. 2 is a schematic view showing the distribution of hydrophobic silica filler in the sealant of Example 1.
  • the hydrophobic silica filler is densely distributed in the sealant, and is oxidized due to oxidation.
  • the silicon filler is an irregular polyhedron, and the volume is small under the same surface area, and the distribution layer number and the individual singular number can be increased in the same volume area, so that the specific surface area of the hydrophobic material in the same volume of the sealant composition is increased. Thereby increasing the hydrophobic interface of the solid silica and optimizing the hydrophobicity of the sealant composition.
  • Example 2 the ratio of each component was selected to be: 77 wt% resin, 7 wt% catalyst, 7.5 wt% solvent, 5 wt% hydrophobic silica filler, 1.5 wt% silicon spheres, 2 wt% dispersant.
  • the following specific implementation scheme can be used as an example:
  • 50 g of the sealant composition 2 was prepared in the same manner as in Example 1, except that: 38.5 g of a mixture of decyl acrylate and bisphenol A epoxy resin in a weight ratio of 65:35, 3.5 was included. g ⁇ , ⁇ -diethyl acetophenone, 3.75 g propylene glycol decyl ether acetate (in which 2.25 g is used for the resin mixture, 1.5 g is used for the silica particle dispersion), and 2.5 g has an irregular polyhedral shape. Hydrophobic silica filler (average particle size 200 nm), 0.75 g silicon spheres (average particle size 3 microns), lg polyacrylate.
  • Example 3 the ratio of each component was selected to be: 75 wt% resin, 6 wt% catalyst, 8 wt% solvent, 7.5 wt% hydrophobic silica filler, lwt% silica gel, 2.5 wt% dispersant.
  • the following specific implementation scheme can be used as an example:
  • 50 g of the sealant composition 3 was prepared in the same manner as in Example 1, except that: 37.5 g of a mixture of decyl acrylate and bisphenol A epoxy resin in a weight ratio of 80:20, 3 g, 3 g ⁇ , ⁇ -diethyl acetophenone, 4 g propylene glycol decyl ether acetate (in which 2 g is used for the resin mixture, 2 g is used for the dispersion of silica particles), 3.75 g of hydrophobicity having an irregular polyhedral shape Silica filler (average particle size 250nm), 0.5g silicon sphere (average particle size 3 microns), 1.25g polypropylene Example 4
  • Example 4 the ratio of each component was selected to be: 70% by weight of resin, 6% by weight of catalyst, 10% by weight of solvent, 10% by weight of hydrophobic silica filler, 1% by weight of silicon spheres, and 3 % by weight of dispersant.
  • 70% by weight of resin 6% by weight of catalyst, 10% by weight of solvent, 10% by weight of hydrophobic silica filler, 1% by weight of silicon spheres, and 3 % by weight of dispersant.
  • 50 g of the sealant composition 4 was prepared in the same manner as in Example 1, except that 35 g of a mixture of decyl acrylate and bisphenol A epoxy resin in a weight ratio of 95:5 was used, 3 g of ⁇ , ⁇ -diethoxyacetophenone, 5 g of acrylate (1.5 g for resin mixture, 3.5 g for silica particle dispersion), 5 g of hydrophobic silica filled with irregular polyhedral shape (average particle size: 200 nm), 0.5 g of silicon spheres (average particle size of 3 ⁇ m), 1.5 g of hydrazine, fluorenyl-dimercaptoaminopropylamine.
  • the frame sealant compositions 5 to 8 were each prepared in the same manner as in Examples 1 to 4, and the contents of the respective components were 50 g each, except that the added silica filler was a conventional spherical dioxide.
  • the silicon filler (correspondingly, the average particle diameter is 150 nm to 250 nm).
  • the ratio of each component was selected to be: 80 wt% of resin, 8 wt% of catalyst, 8.5 wt% of solvent, 2.5 wt% of hydrophobic silica filler, and 1 wt% of silicon spheres.
  • 80 wt% of resin 80 wt% of resin, 8 wt% of catalyst, 8.5 wt% of solvent, 2.5 wt% of hydrophobic silica filler, and 1 wt% of silicon spheres.
  • the sealant composition 9 was prepared in the same manner as in Example 1 except that the hyperdispersant YRC was not used, and the solvent propylene glycol monodecyl ether acetate was 4.25 g (of which 2.5 g was used for the resin mixture). , 1.75 g for silica particle dispersion).
  • the frame sealant composition 1 ⁇ 9 is respectively made into a 3 ⁇ thick frame seal film 1 ⁇ 9;
  • the same weight of silica gel is sealed in the container shown in Figure 3 by using the frame sealing film 1 ⁇ 9 respectively.
  • the total weight A was measured separately; and after standing for 24 hours in different temperature and humidity environments as shown in Table 1, the total weight B was measured; wherein the surface area of each film sample on the container was 0.3 m 2 .
  • the above silica gel may be replaced by other hygroscopic substances or desiccants.
  • Water permeability (BA) / framed film area (g / m 2 ), where A and B are the total weight of the front and rear sealing film, hygroscopic substance and container, respectively.
  • the water permeability of 1 to 4 of the framed rubber film sample with irregular polyhedral shape of silica filler is much smaller, and thus it can be seen that the sealant formed according to the embodiment of the present invention is formed.
  • the water resistance of the film is significantly improved.
  • the added hydrophobic silica filler is 5 wt% and 7.5 wt%, respectively, the effect of lowering the water permeability of the sealant film and improving the water blocking performance is most obvious.
  • the sealant film sample 1 (Example 1) with 9 (Comparative Example 5) it can be seen that in the case where the irregular polyhedral shape silica filler is added, the dispersant is added.
  • the sealant formed by the above-mentioned frame sealant composition can effectively block water molecules from reaching the inside of the liquid crystal panel to corrode the metal wires, thereby prolonging the service life of the display device.

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Abstract

一种封框胶组合物及其制备方法、含所述封框胶组合物的液晶面板，所述封框胶组合物包括树脂、催化剂、溶剂、疏水性二氧化硅填充物和硅球，其中，疏水性二氧化硅填充物形状为不规则多面体形。疏水性二氧化硅颗粒形状的优化，增大了二氧化硅颗粒的整体表面积，相应地提高了封框胶组合物的疏水特性。所述封框胶组合物还可包括分散剂，分散剂的添加使封框胶组合物中二氧化硅填充物的分布更加均匀，避免了其分布不均匀引起的间隙。二氧化硅填充物的均匀分布和比表面积的增大，两个方面相互配合，共同起到了增强封框胶组合物的阻水性能的作用，使采用所述封框胶组合物进行封合的液晶面板能够更好的阻拦外界水分，防止内部金属线的腐蚀。

Description

封框胶组合物及其制备方法、 含有其的液晶面板 技术领域
本发明实施例涉及封框胶组合物及其制备方法、 含该封框胶组合物的液 晶面板。 背景技术
薄膜晶体管液晶显示器（TFT-LCD, Thin Film Transistor Liquid Crystal Display )是有源矩阵类液晶显示器的一种， 是新世纪的主流产品。 传统的 TFT-LCD采用 TFT阵列基板与对向基板对盒后灌注液晶形成。 其中， 对向 基板可以做成传统的彩膜（ CF )基板，也可以将彩膜通过 COA( CF On Array, 彩膜制作在阵列基板上）工艺制作在阵列基板上。 对盒封装是 TFT-LCD制 备过程中的一个重要环节。 为了保证 TFT-LCD在各种环境下的正常使用， 尤其是在高温高湿环境下， 要避免水分子透过封装材料进入液晶盒内部， 腐 蚀金属线造成显示不良的缺陷。 为此， 采用封框胶组合物对其进行封装。 采 用封框胶对液晶盒进行封装,要保证封框胶组合物固化后保持一定的疏水性， 否则无法起到阻水的作用。
现有技术中， 封框胶组合物主要由树脂、 催化剂、 溶剂、 球形二氧化硅 填充物组成。 在实际应用中， 球形二氧化硅填充物表面能较小， 影响封框胶 的阻水性能。 在封框胶组合物固化前的对盒过程中， 球形二氧化硅填充物受 压易移动， 从而致使部分区域团状分布， 间隙过大， 导致分布不均 （如图 1 所示） ， 使得该封框胶组合物封合的液晶面板阻水性能达不到要求。 特别是 在高温高湿可靠性要求严格的环境下， 水分子易透过间隙到达液晶盒内部， 对金属线造成腐蚀。 鉴于此， 本发明实施例的主要目的在于提供一种封框胶 组合物及其制备方法、 采用所述封框胶组合物封合的液晶面板， 其中所述封 框胶组合物的疏水性得以提高， 从而达到增强液晶面板的阻水性的效果。 发明内容
本发明实施例提供一种封框胶组合物， 包括：
70wt%~80wt %树脂， 2wt %~10wt %催化剂，
2wt%~10wt %溶剂，
2.5wt%~10wt %疏水性二氧化硅填充物，
lwt%~1.5wt %石圭球；
其中， 所述疏水性二氧化硅填充物具有不规则的多面体形状， 且 所述树脂为丙烯酸酯树脂与环氧树脂的混合物。
所述封框胶组合物还可包括 1.5wt%~3wt %分散剂。
所述疏水性二氧化硅填充物的添加量为 5 wt %~7.5 wt %。
所述疏水性二氧化硅填充物具有 150nm~250nm的平均粒径。
所述分散剂选自超分散剂 YRC、 Ν,Ν-二曱基氨基丙胺和聚丙烯酸酯中的 至少一种。
所述环氧树脂和所述丙烯酸酯树脂的数均分子量各自独立地为
Figure imgf000004_0001
所述丙烯酸酯树脂与所述环氧树脂的重量比为 55~95： 5-45。
本发明实施例还提供一种制备上述封框胶组合物的方法，包括如下步骤： a、在第一超声条件下对疏水性二氧化硅颗粒进行超声振荡，得到具有不 规则多面体形状的疏水性二氧化硅颗粒；
b、将所述具有不规则多面体形状的疏水性二氧化硅颗粒、分散剂和溶剂 混合，并在第二超声条件下进行超声分散，得到疏水性二氧化硅颗粒分散液； c、 将环氧树脂、 丙烯酸酯树脂、 催化剂、 溶剂混合， 得到树脂混合物； d、将所述疏水性二氧化硅颗粒分散液和所述树脂混合物混合均匀，得到 所述封框胶组合物。
所述第一超声条件为在 50kHz下进行 5-20分钟。
所述第二超声条件为在 90kHz下进行 5-20分钟。
所述方法还包括在所述第二超声条件下的超声振荡步骤后， 在 50kHz下 进行超声分级的步骤。
本发明实施例还提供一种液晶面板， 包括相对设置的阵列基板和对向基 板； 其中， 所述阵列基板和对向基板由所述封框胶组合物进行封合。 附图说明 图 1为现有技术封框胶组合物中二氧化硅填充物的分布示意图； 图 2为本发明实施例封框胶组合物中疏水性二氧化硅填充物的分布示意 图；
图 3为固化后的封框胶薄膜样品透水实验流程图。 具体实施方式
以下结合附图和具体实施例对本发明作进一步说明。 显然， 所描述的 实施例仅仅是本发明一部分实施例， 而不是全部的实施例。 基于本发 明中的实施例， 本领域普通技术人员在没有做出创造性劳动前提下所 获得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供了一种封框胶组合物， 包括： 70wt%~80wt%的树脂， 2wt%~10wt。/^¼化剂， 2wt%~10wt %溶剂， 2.5wt%~10wt %疏水性二氧化硅填 充物， lwt%~1.5wt%硅球， 其中， 疏水性二氧化硅填充物具有不规则的多面 体形状， 且上述树脂为丙烯酸酯树脂与环氧树脂的混合物。
上述封框胶组合物还可以包括 1.5wt%~3wt%的分散剂。
所述树脂可为本领域中常用的丙烯酸酯树脂和环氧树脂的混合物， 例如 为聚曱基丙烯酸曱酯和双酚 A环氧树脂的混合物。 其中， 丙烯酸酯树脂与环 氧树脂的重量比为 55~95:5~45 , 优选 65~80:20~35。 上述丙烯酸酯树脂与环 氧树脂的数均分子量各自独立地为 5000~10000。
所述分散剂可为本领域中任何常用的疏水性分散剂， 例如可选自超分散 剂 YRC、 Ν,Ν-二曱基氨基丙胺和聚丙烯酸酯。
所述硅球是平均粒径为 1~5微米的二氧化硅颗粒， 用于保持盒间距。 优 选可以采用平均粒径为 3~4 i米的二氧化硅颗粒， 此平均粒径最接近盒间距 的设计值。
所述催化剂可为本领域常用的促使上述树脂在紫外光辐射下进行固化的 催化剂， 例如可为 α,α-二乙^ 苯乙酮。
所述溶剂可为本领域常用溶剂， 没有特别限制， 例如可为丙二醇单曱基 醚醋酸酯、 丙烯酸酯类溶剂。
本发明实施例的封框胶组合物在树脂、 催化剂、 溶剂、 疏水性二氧化硅 填充物的基础上优化了疏水性二氧化硅填充物的外形。 现有技术封框胶组合 物中添加的二氧化硅填充物多为球形（如图 1所示；)，本发明实施例将其优化 为不规则多面体形 （如图 2 所示）， 不规则多面体形二氧化硅的平均粒径为 150nm~250nm,优选 200nm, 其添加量为封框胶组合物总重量的 2.5%~10%, 优选 5%~7.5%。此处粒径和百分数的选择可使封框胶组合物的疏水性在其他 条件相同的情况下达到最佳。 基于相同体积的物质球状表面积最小的原则， 现有技术封框胶组合物添加的球状二氧化硅颗粒， 理论上是最小的阻水表面 积。 依据疏水物质表面积越大表面能越大， 表面能越大疏水性越强的原则， 制备不规则多面体形的疏水二氧化硅颗粒， 可使同体积的二氧化硅颗粒表面 积增大 5%~20%, 随着二氧化硅颗粒填充物整体面积增大， 封框胶组合物的 整体疏水性得以增强。
同时， 本发明实施例的封框胶组合物中添加了^：剂。 未添加^：剂的 封框胶组合物， 其中的疏水性二氧化硅填充物在封合后固化前由于受力， 会 发生流动， 从而导致分布不均匀， 影响阻水性能。 本发明实施例中， 添加分 散剂的机理在于分散剂可使二氧化硅填充物均匀分布于封框胶组合物中， 从 而使封框胶组合物在封合后固化前受压流动时， 二氧化硅填充物仍然保持均 匀分布， 确保固化后的封框胶具有良好的疏水性。
本发明实施例还提供了一种制备上述封框胶组合物的方法， 包括如下步 骤：
a、在第一超声条件下对疏水性二氧化硅颗粒进行超声振荡，得到具有不 规则多面体形状的疏水性二氧化硅颗粒；
b、将所述具有不规则多面体形状的疏水性二氧化硅颗粒、分散剂和溶剂 混合，并在第二超声条件下进行超声分散，得到疏水性二氧化硅颗粒分散液； c、 将环氧树脂、 丙烯酸酯树脂、 催化剂、 溶剂混合， 得到树脂混合物； d、将所述疏水性二氧化硅颗粒分散液和所述树脂混合物混合均匀，得到 所述封框胶组合物。
上述第一超声条件为在 50kHz下进行 5-20分钟。
上述第二超声条件为在 90kHz下进行 5-20分钟。
上述方法还包括在所述超声振荡步骤后， 在 50kHz下进行超声分级的步 骤。
例如， 在上述步骤 a中， 不规则多面体形二氧化硅填充物由超声波机械 法进行制备， 具体步骤如下： 将聚乙二醇辛基苯基醚及正戊醇加入到环氧乙 烷中 （聚乙二醇辛基苯基醚： 正戊醇： 环氧乙烷的体积比为 1: 1 :3~1 :1 :5 )得 混合物 I , 以 50kHz超声震荡后加混合物 I 3~5倍体积的水得混合物 II , 加 入常规的二氧化硅填充物（二氧化硅填充物体积为混合物 II体积的 30% ), 持续超声震荡 5~20分钟， 得到微乳液； 在微乳液中添加体积比为 20~40%的 浓硫酸生成二氧化硅沉淀物； 将生成的沉淀物经过 100~200度烧灼处理， 得 到纳米级二氧化硅颗粒。 进一步地， 将烧灼得到的纳米级二氧化硅颗粒通过 50kHz的超声分级 5-20分钟后，留取具有不规则多面体形的 50~100nm的二 氧化硅颗粒。
由上述方法制备的封框胶组合物可在 -25°C~-15°C , 优选 -20 °C的条件下 降温储存。
上述封框胶组合物可通过常规方法涂布及紫外光固化来进行液晶面板的 封合。
以下结合附图详细说明一下本发明的具体实施例及对比例。
制备例
将聚乙二醇辛基苯基醚及正戊醇按体积加入到环氧乙烷中 （聚乙二醇辛 基苯基醚： 正戊醇： 环氧乙烷的体积比为 1: 1 :3 )得混合物 I , 并以 50kHz 超声震荡后加入混合物 I 3 倍体积的水得混合物 II , 加入占混合物 II体积 30%的常规疏水性二氧化硅填充物， 持续超声震荡 20分钟， 得到微乳液； 在 微乳液中添加体积比为 20%的浓硫酸生成二氧化硅沉淀物； 将生成的沉淀物 经过 100度烧灼处理， 得到纳米级二氧化硅颗粒。 此后， 将烧灼得到的纳米 级二氧化硅颗粒通过 50kHz 的超声波分级 5 分钟后， 留取平均粒径为 150nm~250nm的具有不规则多面体形的疏水性二氧化硅颗粒。
实施例 1
在实施例 1中，选取各组分的比例为： 80wt%的树脂， 8wt%催化剂， 7wt
%溶剂， 2.5wt%疏水性二氧化硅填充物， lwt%硅球， 1.5wt%分散剂。具体地， 可以用下述的具体实现方案为例：
将以上制得的 1.25g疏水性二氧化硅颗粒（平均粒径 150nm )、 0.5g硅球 (平均粒径 3微米）、 0.75g超分散剂 YRC与 lg溶剂丙二醇单曱基醚醋酸酯 混合， 在 90kHz下超声振荡 20分钟， 得到疏水性二氧化硅颗粒分散液。 将 40g聚曱基丙烯酸曱酯（ Mn=5000 )和双酚 A环氧树脂（ Mn=10000 ) (重量比为 55:45 ) 的混合物， 与 4g催化剂 α,α-二乙氧基苯乙酮、 2.5g溶剂 丙二醇单曱基醚醋酸酯混合， 得到树脂混合物。
将以上制得的疏水性二氧化硅颗粒分散液和树脂混合物混合， 得到 50g 封框胶组合物 1。
图 2所示为实施例 1的封框胶中疏水性二氧化硅填充物分布示意图， 如 图 2所示， 疏水性二氧化硅填充物在封框胶内分布均勾致密， 且由于二氧化 硅填充物为不规则多面体， 在相同表面积情况下体积较小， 可以在同等体积 的区域增大分布层数和个体单数， 从而使相同体积的封框胶组合物内疏水物 质比表面积增大， 从而增加固态二氧化硅疏水界面， 优化封框胶组合物的疏 水性。
实施例 2
在实施例 2中，选取各组分的比例为： 77wt%的树脂， 7wt%催化剂， 7.5wt %溶剂， 5wt%疏水性二氧化硅填充物， 1.5wt%硅球， 2wt%分散剂。 具体地， 可以用下述的具体实现方案为例：
以与实施例 1相同的方法制备 50g封框胶组合物 2, 所不同之处在于： 包括 38.5g重量比为 65:35的聚曱基丙烯酸曱酯与双酚 A环氧树脂的混合物， 3.5g α,α-二乙^ 苯乙酮， 3.75g丙二醇曱基醚醋酸酯（其中， 2.25g用于树 脂混合物， 1.5g用于二氧化硅颗粒分散液）， 2.5g具有不规则的多面体形状的 疏水性二氧化硅填充物（平均粒径 200nm ), 0.75g硅球（平均粒径 3微米 ), lg聚丙烯酸酯。
实施例 3
在实施例 3中，选取各组分的比例为： 75wt%的树脂， 6wt%催化剂， 8wt %溶剂， 7.5wt%疏水性二氧化硅填充物， lwt%硅球， 2.5wt%分散剂。具体地， 可以用下述的具体实现方案为例：
以与实施例 1相同的方法制备 50g封框胶组合物 3 , 所不同之处在于： 包括 37.5g重量比为 80:20的聚曱基丙烯酸曱酯与双酚 A环氧树脂的混合物， 3g α,α-二乙^ 苯乙酮， 4g丙二醇曱基醚醋酸酯（其中， 2g用于树脂混合物， 2g用于二氧化硅颗粒分散液 ) , 3.75g具有不规则的多面体形状的疏水性二氧 化硅填充物 (平均粒径为 250nm), 0.5g硅球（平均粒径 3微米）， 1.25g聚丙 实施例 4
在实施例 4中，选取各组分的比例为： 70wt%的树脂， 6wt%催化剂， 10wt %溶剂， 10wt%疏水性二氧化硅填充物， lwt%硅球， 3wt%分散剂。 具体地， 可以用下述的具体实现方案为例：
以与实施例 1相同的方法制备 50g封框胶组合物 4, 所不同之处在于： 包括 35g重量比为 95:5的聚曱基丙烯酸曱酯与双酚 A环氧树脂的混合物， 3g α, α-二乙氧基苯乙酮， 5g丙烯酸酯（其中， 1.5g用于树脂混合物， 3.5g用 于二氧化硅颗粒分散液）， 5g具有不规则的多面体形状的疏水性二氧化硅填 充物 (平均粒径为 200nm), 0.5g硅球 (平均粒径 3微米）， 1.5g Ν,Ν-二曱基氨 基丙胺。
对比例 1~4
分别以与实施例 1至 4相同的方法、 组分及各组分含量制备封框胶组合 物 5至 8各 50g, 所不同之处在于： 所添加的二氧化硅填充物为常规球形二 氧化硅填充物（相应地， 平均粒径为 150nm~250nm )。
对比例 5
在对比例 5中，选取各组分的比例为： 80wt%的树脂， 8wt%催化剂， 8.5wt %溶剂， 2.5wt%疏水性二氧化硅填充物， lwt%硅球。 具体地， 可以用下述的 具体实现方案为例：
以与实施例 1相同的方法制备封框胶组合物 9, 所不同之处在于： 不使 用超分散剂 YRC, 且溶剂丙二醇单曱基醚醋酸酯为 4.25g (其中， 2.5g用于 树脂混合物， 1.75g用于二氧化硅颗粒分散液）。
将以上实施例 1至 4制得的各封框胶组合物采用本领域常规方法涂覆至 阵列基板和对向基板， 并常规封合， 可制得液晶面板。 透水实验
根据图 3所示流程用上述实施例 1~4和对比例 1~5制得的各封框胶组合 物进行透水实验， 具体步骤如下：
分别将封框胶组合物 1~9制成 3μηι厚的封框胶薄膜 1~9；
分别采用封框胶薄膜 1~9将相同重量的硅胶封闭于如图 3 所示的容器 中， 分别测量其总重量 A; 同时在如表 1所示的不同温度湿度环境中放置 24 小时后，分别测量其总重量 B;其中各薄膜样品在该容器上的表面积为 0.3m2。
上述硅胶可采用其他吸湿性物质或干燥剂代替。
根据以下公式计算各封框胶薄膜的单位面积透水率：
透水率 =(B-A)/封框胶薄膜面积（ g/m2 ), 其中 A和 B分别为放置前后封 框胶薄膜、 吸湿性物质以及容器的总重量。
上述计算结果汇总于以下表 1中。
表 1
Figure imgf000010_0001
从表 1中可以看出， 与添加常规球形二氧化硅填充物的封框胶薄膜样品
5~8相比，添加不规则多面体形状的二氧化硅填充物的封框胶薄膜样品的 1~4 的透水率小得多， 由此可以看出根据本发明实施例制备的封框胶形成的薄膜 的阻水性明显提高。 其中， 在添加的疏水性二氧化硅填充物分别为 5wt%、 7.5wt%时， 其降低封框胶薄膜的透水率、 提高其阻水性能的效果最明显。 此 夕卜， 将封框胶薄膜样品 1 (实施例 1 )与 9 (对比例 5 ) 比较， 可以看出， 在 均添加不规则多面体形状的二氧化硅填充物的情况下， 添加分散剂后可明显 降低封框胶薄膜的透水率， 提高其阻水性能。 这证明， 通过将不规则形状的 二氧化硅填充物与^：剂同时添加到封框胶组合物中， 可大幅提高封框胶组 合物的阻水性能， 这是因为一方面二氧化硅填充物所具有的不规则多面体形 能够增大二氧化硅填充物的整体表面积， 由此增强其疏水性； 另一方面所添 加的^:剂能够使封框胶组合物中的二氧化硅填充物均匀分布， 避免了因团 状分布导致的较大间隙， 从而提高了阻水效果。 因此， 即使在高温高湿可靠 性要求严格的环境下， 由上述封框胶组合物形成的封框胶能有效阻拦水分子 到达液晶面板内部腐蚀金属线， 从而延长显示装置的使用寿命。
以上所述， 仅为本发明的较佳实施例而已， 并非用于限定本发明的保护 范围。

Claims

权利要求书
1、 一种封框胶组合物， 包括：
70wt%~80wt %树脂，
2wt %~10wt %催化剂，
2wt%~10wt %溶剂，
2.5wt%~10wt %疏水性二氧化硅填充物，
lwt%~1.5wt %石圭球；
其中， 所述疏水性二氧化硅填充物具有不规则的多面体形状， 且 所述树脂为丙烯酸酯树脂与环氧树脂的混合物。
2、 如权利要求 1所述的封框胶组合物， 还包括 1.5wt%~3wt %分散剂。
3、如权利要求 1或 2所述的封框胶组合物， 其中， 所述疏水性二氧化硅 填充物的添加量为 5 wt%~7.5 wt%。
4、如权利要求 1或 2所述的封框胶组合物， 其中， 所述疏水性二氧化硅 填充物具有 150nm~250nm的平均粒径。 5、如权利要求 2所述的封框胶组合物， 其中， 所述分散剂选自超分散剂
YRC、 Ν,Ν-二曱基氨基丙胺和聚丙烯酸酯中的至少一种。
6、如权利要求 1或 2所述的封框胶组合物， 其中， 所述环氧树脂和所述 丙烯酸酯树脂的数均分子量各自独立地为 5000~10000。
7、如权利要求 1所述的封框胶组合物， 其中， 所述丙烯酸酯树脂与所述 环氧树脂的重量比为 55~95:5~45。
8、一种制备权利要求 1-7任一项所述的封框胶组合物的方法， 所述方法 包括如下步骤： a、在第一超声条件下对疏水性二氧化硅颗粒进行超声振荡，得到具有不 规则多面体形状的疏水性二氧化硅颗粒；
b、将所述具有不规则多面体形状的疏水性二氧化硅颗粒、分散剂和溶剂 混合，并在第二超声条件下进行超声分散，得到疏水性二氧化硅颗粒分散液； c、 将环氧树脂、 丙烯酸酯树脂、 催化剂、 溶剂混合， 得到树脂混合物； d、将所述疏水性二氧化硅颗粒分散液和所述树脂混合物混合均匀，得到 所述封框胶组合物。
9、如权利要求 8所述的制备封框胶组合物的方法， 其中， 所述第一超声 条件为在 50kHz下进行 5~20分钟。
10、 如权利要求 8所述的制备封框胶组合物的方法， 其中， 所述第二超 声条件为在 90kHz下进行 5-20分钟。 11、 如权利要求 8所述的制备封框胶组合物的方法， 其中， 所述方法还 包括在所述第二超声条件下的超声振荡步骤后， 在 50kHz下进行超声分级的 步骤。
12、 一种液晶面板， 包括相对设置的阵列基板和对向基板； 其中， 所述 阵列基板和对向基板由权利要求 1-7 中任一项所述的封框胶组合物进行封 合。
PCT/CN2013/090100 2013-07-22 2013-12-20 封框胶组合物及其制备方法、含有其的液晶面板 Ceased WO2015010433A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170101546A1 (en) * 2015-10-12 2017-04-13 Boe Technology Group Co., Ltd. Filler of sealant, method for manufacturing the same and composite material

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104749828B (zh) 2015-04-22 2017-12-29 京东方科技集团股份有限公司 封框胶组合物、显示面板及显示装置
CN104793404B (zh) * 2015-04-24 2018-09-11 合肥京东方光电科技有限公司 一种显示面板及其液晶显示装置
CN108770358A (zh) 2015-12-31 2018-11-06 聚合物胶粘剂密封胶系统公司 用于具有密度改性剂的柔性密封剂的系统和方法
CN105505264B (zh) * 2016-01-04 2018-01-02 京东方科技集团股份有限公司 一种封框胶组合物及其应用
CN106896588A (zh) 2017-03-28 2017-06-27 京东方科技集团股份有限公司 一种显示面板、封框胶涂覆装置及其涂覆方法
CN108795307B (zh) * 2018-07-04 2020-02-18 东莞市古川胶带有限公司 一种极薄双面胶带及其制备方法
CN112341969B (zh) * 2019-08-09 2022-12-27 深圳市优宝新材料科技有限公司 一种用于oled边框封装的粘接剂及其制备、应用方法
CN110903793A (zh) * 2019-11-22 2020-03-24 Tcl华星光电技术有限公司 封框胶材料和液晶显示面板
CN112980372B (zh) * 2019-12-16 2022-11-22 深圳市优宝新材料科技有限公司 一种粘结剂及其制备方法
CN111413832A (zh) * 2020-04-27 2020-07-14 Tcl华星光电技术有限公司 一种边框结构及其制备方法和应用
CN114525097A (zh) * 2022-02-11 2022-05-24 广州华星光电半导体显示技术有限公司 一种疏水型框胶及其制备方法、液晶显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1867861A (zh) * 2003-10-17 2006-11-22 日本化药株式会社 液晶密封剂、采用该液晶密封剂的液晶显示装置和制造该显示装置的方法
CN1886479A (zh) * 2003-12-01 2006-12-27 德古萨股份公司 粘合剂和密封剂体系
CN101210169A (zh) * 2006-12-30 2008-07-02 比亚迪股份有限公司 一种液晶密封剂组合物及其制备方法
CN103087641A (zh) * 2013-01-23 2013-05-08 深圳市华星光电技术有限公司 一种边框胶材、液晶显示面板以及相应的液晶显示器
CN103173159A (zh) * 2013-03-13 2013-06-26 北京京东方光电科技有限公司 封框胶组合物及其制备方法和显示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4210774A (en) * 1977-06-16 1980-07-01 Electric Power Research Institute, Inc. Filled polymer electrical insulator
US5868887A (en) * 1996-11-08 1999-02-09 W. L. Gore & Associates, Inc. Method for minimizing warp and die stress in the production of an electronic assembly
US5896038A (en) * 1996-11-08 1999-04-20 W. L. Gore & Associates, Inc. Method of wafer level burn-in
US5900312A (en) * 1996-11-08 1999-05-04 W. L. Gore & Associates, Inc. Integrated circuit chip package assembly
US20120111621A1 (en) * 2009-07-24 2012-05-10 Sumitomo Bakelite Company, Ltd. Resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board and semiconductor device
CN102585745A (zh) * 2012-02-21 2012-07-18 绵阳艾萨斯电子材料有限公司 封框胶及其制备方法与应用
CN102888199B (zh) * 2012-09-17 2014-06-18 北京京东方光电科技有限公司 封框胶及其制备方法和应用

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1867861A (zh) * 2003-10-17 2006-11-22 日本化药株式会社 液晶密封剂、采用该液晶密封剂的液晶显示装置和制造该显示装置的方法
CN1886479A (zh) * 2003-12-01 2006-12-27 德古萨股份公司 粘合剂和密封剂体系
CN101210169A (zh) * 2006-12-30 2008-07-02 比亚迪股份有限公司 一种液晶密封剂组合物及其制备方法
CN103087641A (zh) * 2013-01-23 2013-05-08 深圳市华星光电技术有限公司 一种边框胶材、液晶显示面板以及相应的液晶显示器
CN103173159A (zh) * 2013-03-13 2013-06-26 北京京东方光电科技有限公司 封框胶组合物及其制备方法和显示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170101546A1 (en) * 2015-10-12 2017-04-13 Boe Technology Group Co., Ltd. Filler of sealant, method for manufacturing the same and composite material
US10011726B2 (en) * 2015-10-12 2018-07-03 Boe Technology Group Co., Ltd. Filler of sealant, method for manufacturing the same and composite material

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