WO2014207790A1 - レーザ加工部品の製造方法及びレーザ加工方法 - Google Patents

レーザ加工部品の製造方法及びレーザ加工方法 Download PDF

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Publication number
WO2014207790A1
WO2014207790A1 PCT/JP2013/067170 JP2013067170W WO2014207790A1 WO 2014207790 A1 WO2014207790 A1 WO 2014207790A1 JP 2013067170 W JP2013067170 W JP 2013067170W WO 2014207790 A1 WO2014207790 A1 WO 2014207790A1
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WIPO (PCT)
Prior art keywords
laser
oxide glass
oxide
processing
component
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Application number
PCT/JP2013/067170
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English (en)
French (fr)
Japanese (ja)
Inventor
雅徳 宮城
拓也 青柳
内藤　孝
利則 川村
Original Assignee
株式会社 日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社 日立製作所 filed Critical 株式会社 日立製作所
Priority to PCT/JP2013/067170 priority Critical patent/WO2014207790A1/ja
Priority to CN201380076295.4A priority patent/CN105189019B/zh
Priority to JP2015523671A priority patent/JP6038313B2/ja
Priority to TW103116713A priority patent/TWI556896B/zh
Publication of WO2014207790A1 publication Critical patent/WO2014207790A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a method for manufacturing a laser processed component and a laser processing method.
  • Patent Document 1 discloses a method of removing a masking agent after applying a masking agent composed of a paste of metal powder and silica on a metal surface and performing hole processing with a laser. In this method, the surface is protected with a masking agent to obtain a clean surface of the processed part.
  • Patent Document 2 discloses a method of performing processing while removing a decomposition product generated during laser processing in the vicinity of an irradiated portion. In this method, a clean surface of a processed part is obtained by sucking before decomposition products such as spatter and dross adhere to the surface.
  • the masking agent is a ceramic coating, so that a treatment such as blasting is required for removal.
  • an object of the present invention is to obtain a clean processed surface by simple laser processing.
  • the present invention provides a laser-machined component comprising a protection step of forming a protective layer on the surface of the component, and a processing step of processing the component by irradiating the protective layer with a laser.
  • the method is characterized in that the protective layer is an oxide glass containing P, and includes a removing step of dissolving the protective layer with a liquid after the processing step.
  • the protective layer contains oxide glass containing P And a removal step of dissolving the protective layer with a liquid after the processing step.
  • a clean processed part surface can be obtained by simple laser processing.
  • a protective layer of oxide glass containing P is provided on the surface of the component, and laser processing is performed thereon. After the laser processing, the protective layer is removed by liquid cleaning.
  • the liquid is water or an aqueous solution containing water as a main solvent.
  • oxides that are soluble in water include P (phosphorus) and include P 2 O 5 and P 2 O 4 . These oxides are substantially free of Pb (lead) and Bi (bismuth). According to the RoHS directive (effective July 1, 2006), these substances are designated as prohibited substances. The fact that they do not contain substantially means that prohibited substances in the RoHS directive are not contained within the specified range.
  • V, Fe, Li, Na, K, Ba, Ca, B By adding V, Fe, Li, Na, K, Ba, Ca, B to the oxide containing P, water solubility and glass transition temperature can be adjusted.
  • alkali metals Li, K, Na, etc.
  • alkaline earth metals Ba, Ca, etc.
  • alkali metals Li, K, Na, etc.
  • alkaline earth metals Ba, Ca, etc.
  • oxides containing V are excellent in laser absorptivity, when processing Cu (copper) or Al (aluminum) with low laser absorptance, the laser absorptance is increased by applying to the surface, and processing Efficiency can be improved.
  • these oxides are easily dissolved in water, they can be washed away together with the spatter and dross generated during processing after laser processing. Even an oxide that does not contain V can absorb a laser having a wavelength of about 10 ⁇ m. Therefore, by appropriately selecting the wavelength of the laser, good processing quality can be obtained.
  • the effective composition range (as oxide) of the oxide is preferably 40 to 70 mol% for P 2 O 5 and 25 to 50 mol% for Na 2 O when P is the main component.
  • B 2 O 3 is contained in an amount of 5 to 10 mol%, the glass transition point is lowered, and a protective layer can be easily formed.
  • V contains V as the main component
  • P 2 O 5 is 5 to 50 mol%
  • V 2 O 5 is 50 to 95 mol%
  • P 2 O 5 + V 2 O 5 ⁇ 68 mol% Preferably there is.
  • P 2 O 5 + V 2 O 5 ⁇ 90 mol% the water solubility is further improved.
  • the heat resistance of the oxide can be improved by mixing metal or ceramic particles with the oxide described above. Since the powder particles are removed together with the oxide after processing, either metal or ceramic may be used, but considering the possibility of adhering and remaining, it is preferable to have the same composition as the processing object.
  • heat resistance can be imparted to the oxide by mixing metal particles having the same composition with the above oxide.
  • heat resistance can be imparted to the oxide by mixing Cu particles with the oxide.
  • the oxide described above can be used as a paste using a solvent and a binder.
  • An oxide glass layer adhered to the sample surface can be formed by applying the paste to the sample surface and drying. It is also possible to form an oxide glass layer on the surface by thermal spraying, cold spraying or the like. Regardless of the method used to form the oxide glass layer, water solubility and laser absorption are not affected.
  • oxide glasses having the compositions shown in Table 1 were prepared, and water solubility (cleanability) and glass transition temperature were evaluated.
  • Preparation of the above oxides uses reagents of V 2 O 5 , P 2 O 5 , Na 2 O, Fe 2 O 3 , Li 2 O, K 2 O, BaO, CaO, B 2 O 3 for a total of 200 g
  • the mixture was mixed in a predetermined amount so as to be, put into a platinum crucible, heated to 900 to 950 ° C. at a heating rate of 5 to 10 ° C./min in an electric furnace, and melted. In order to make it uniform at this temperature, it was kept for 1 to 2 hours with stirring.
  • the crucible was taken out and poured onto a stainless steel plate heated to about 150 ° C. in advance.
  • the oxide poured on the stainless steel plate was pulverized until the average particle size (D 50 ) was less than 20 ⁇ m.
  • This oxide is subjected to differential thermal analysis (DTA) up to 550 ° C at a heating rate of 5 ° C / min, so that the transition point (T g ), yield point (M g ), softening point (T s ), and crystallization temperature ( Tcry ) was measured.
  • DTA differential thermal analysis
  • T g transition point
  • M g yield point
  • T s softening point
  • Tcry crystallization temperature
  • FIG. 1 shows a typical DTA curve of an oxide glass.
  • T g is the first endothermic peak start temperature
  • Mg is the peak temperature
  • T s is the second endothermic peak temperature
  • T cry is the start temperature of the marked exothermic peak due to crystallization.
  • T g of the oxide glass of the present example was 277 ° C..
  • the detergency of the oxide glass was evaluated by immersing in water for 2 hours.
  • the evaluation sample is a paste for printing by pulverizing the oxide with a jet mill until the average particle size (D 50 ) is 2 ⁇ m or less, and adding and mixing a solvent containing 4% resin binder into the oxide powder.
  • D 50 average particle size
  • ethyl cellulose was used as the resin binder
  • butyl carbitol acetate was used as the solvent.
  • This paste was applied to a Ni-based alloy with a thermal barrier coating layer formed of ceramic, dried at 150 ° C., held at about 500 ° C. to 700 ° C. for 10 minutes and fired.
  • oxide Nos. 1 to 38 were excellent in water solubility and could be easily removed from the test piece.
  • FIG. 2 shows a process diagram of laser drilling.
  • Reference numeral 1 denotes a Ni-based alloy
  • 2 denotes an underlayer
  • 3 denotes a thermal barrier coating (ceramic layer)
  • 4 denotes an oxide glass layer
  • 5 denotes a laser
  • 6 denotes a processing residue (sputtering)
  • 7 denotes a hole processing portion.
  • the spatter that is presumed to be a Ni-based alloy metal component was adhered to the surface after processing.
  • the processed test piece was immersed in water, and the spatter was removed together with the oxide glass.
  • the oxide glass could not be confirmed with the naked eye and was almost removed.
  • there was no oxide glass layer there was no spatter or dross adhesion in appearance, and a hole processed part excellent in surface cleaning was obtained.
  • V was detected as a result of analyzing the vicinity of the laser machined part using a high frequency inductively coupled plasma optical emission spectrometer. Since the V component is not contained in the ceramic layer and the Ni-based alloy, it is considered to be a residue of oxide glass. Since the ceramic layer is attached to the Ni-based alloy by thermal spraying, there are fine irregularities on the surface, and it is considered that the oxide glass has penetrated into the irregularities. It was also confirmed that the thermal insulation performance did not change even if a slight V component remained on the surface of the ceramic thermal barrier coating.
  • a fiber laser is used as the laser, but the present invention is not limited to this as long as the hole can be drilled.
  • the gas type and gas pressure can be changed as appropriate, and the same applies to the following examples.
  • the oxide glass composition was 40 mol% for V 2 O 5 , 40 mol% for TeO 2 , and 20 mol% for Ag 2 O (No. 4 in the comparative example). Sputters and dross adhered to the surface after processing. The test piece was immersed in water for 2 hours, but the oxide glass did not dissolve in water, and the sputter, dross, and oxide glass remained attached to the thermal barrier coating.
  • Example 2 the oxide glass layer was formed using the oxide glass paste, but in this example, the oxide glass layer was formed by spraying the oxide glass powder onto the thermal barrier coating by cold spraying. .
  • the particle size of the powder used is 10-30 ⁇ m.
  • Other experimental conditions are the same as in Example 2.
  • the spatter that is presumed to be a Ni-based alloy metal component was adhered to the surface after processing.
  • the processed test piece was immersed in water, and the spatter was removed together with the oxide glass.
  • the oxide glass could not be confirmed with the naked eye and was almost removed.
  • there was no oxide glass layer there was no spatter or dross adhesion in appearance, and a hole processed part excellent in surface cleaning was obtained.
  • V was detected as a result of analyzing the vicinity of the laser machined part using a high frequency inductively coupled plasma optical emission spectrometer. Since the V component is not contained in the ceramic layer and the Ni-based alloy, it is considered to be a residue of oxide glass.
  • the oxide glass layer can be efficiently formed even in a large apparatus such as a power plant, so that the processing time can be shortened.
  • Ni alloy powder was added to the oxide glass paste produced in Example 1 to drill a Ni-based alloy with a ceramic thermal barrier coating.
  • the particle size of the Ni-based alloy powder was 30-60 ⁇ m, and the content in the paste was 30% by volume.
  • Other experimental conditions are the same as in Example 2.
  • the spatter that is presumed to be a Ni-based alloy metal component was adhered to the surface after processing.
  • the processed test piece was immersed in water, and the spatter was removed together with the oxide glass.
  • the oxide glass could not be confirmed with the naked eye and was almost removed.
  • there was no oxide glass layer there was no spatter or dross adhesion in appearance, and a hole processed part excellent in surface cleaning was obtained.
  • V was detected as a result of analyzing the vicinity of the laser machined part using a high frequency inductively coupled plasma optical emission spectrometer. Since the V component is not contained in the ceramic layer and the Ni-based alloy, it is considered to be a residue of oxide glass.
  • the thickness of the copper foil is 18 ⁇ m.
  • the oxide glass composition was 70 mol% for V 2 O 5 and 30 mol% for P 2 O 5 .
  • the oxide glass paste was applied to a copper-clad plate by screen printing and dried on a hot plate heated to 150 ° C. for 10 minutes. After drying, the laser was drilled.
  • the laser used was a CO 2 laser. Hole processing was performed by irradiating a CO 2 laser on the oxide glass layer. The hole diameter was ⁇ 0.1 mm and the hole angle was 90 °. Since the oxide glass layer absorbs the CO 2 laser well, it was possible to drill holes in the copper foil. The processing residue presumed to be Cu adhered to the surface after processing.
  • the processed test piece was immersed in water, and the processing residue was removed together with the oxide glass.
  • the oxide glass could not be confirmed with the naked eye and was almost removed.
  • V was not detected. Since the surface of the copper foil is very smooth, it is considered that the oxide glass was completely removed by washing with water.
  • the oxide glass is applied by screen printing, but the same effect can be obtained by applying only to the hole processed portion by the dispenser method.
  • the oxide glass composition was 40 mol% for V 2 O 5 , 40 mol% for TeO 2 , and 20 mol% for Ag 2 O (No. 4 in the comparative example). Sputters and dross adhered to the surface after processing. Although this test piece was immersed in water for 2 hours, the oxide glass did not dissolve in water, and the sputter, dross, and oxide glass remained attached to the copper foil, and there was no effect.
  • 316 stainless steel was cut as shown in FIG. 10 is 316 stainless steel, 11 is a cutting part.
  • the oxide glass composition was 70 mol% for V 2 O 5 and 30 mol% for P 2 O 5 .
  • the oxide glass paste was applied to 316 stainless steel and dried for 10 minutes on a hot plate heated to 150 ° C. After drying, 316 stainless steel was cut with a laser.
  • the laser used is a fiber laser.
  • the plate thickness was 6 mm, and Ar gas was used as the cutting gas.
  • the gas was 0.5 MPa. Spatter adhered to the surface after processing.
  • the processed test piece was immersed in water, and the spatter was removed together with the oxide glass. In the test piece after washing with water, the oxide glass could not be confirmed with the naked eye and was removed. Compared with the case without the oxide glass layer, there was no spatter or dross adhesion on the appearance, and a cut processed part excellent in surface cleaning was obtained.
  • the oxide glass paste was 70 mol% for V 2 O 5 and 30 mol% for P 2 O 5 .
  • the oxide glass paste was applied to 316 stainless steel and dried for 10 minutes on a hot plate heated to 150 ° C. After drying, 316 stainless steel was butted and laser welding was performed.
  • the laser used is a fiber laser.
  • the plate thickness was 6 mm, and Ar gas was used as the shielding gas.
  • the gas flow rate was 30 L / min. Spatter adhered to the surface after processing.
  • the processed test piece was immersed in water, and the spatter was removed together with the oxide glass. In the test piece after washing with water, the oxide glass could not be confirmed with the naked eye and was removed. Compared to the case without the oxide glass layer, there was no spatter or dross adhesion in appearance, and a welded part excellent in surface cleaning was obtained.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Glass Compositions (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2013/067170 2013-06-24 2013-06-24 レーザ加工部品の製造方法及びレーザ加工方法 WO2014207790A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2013/067170 WO2014207790A1 (ja) 2013-06-24 2013-06-24 レーザ加工部品の製造方法及びレーザ加工方法
CN201380076295.4A CN105189019B (zh) 2013-06-24 2013-06-24 激光加工部件的制造方法和激光加工方法
JP2015523671A JP6038313B2 (ja) 2013-06-24 2013-06-24 レーザ加工部品の製造方法及びレーザ加工方法
TW103116713A TWI556896B (zh) 2013-06-24 2014-05-12 Manufacturing method of laser processing member and laser processing method

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PCT/JP2013/067170 WO2014207790A1 (ja) 2013-06-24 2013-06-24 レーザ加工部品の製造方法及びレーザ加工方法

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CN109641269A (zh) * 2016-09-29 2019-04-16 Ｊｘ金属株式会社 激光烧结用表面处理金属粉
WO2020081318A1 (en) * 2018-10-19 2020-04-23 Corning Incorporated Device including vias and method and material for fabricating vias

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JP2018047503A (ja) * 2016-09-19 2018-03-29 フラウンホファー ゲセルシャフト ツール フェールデルンク ダー アンゲヴァンテン フォルシュンク エー．ファオ． レーザアブレーションによって微細機械加工されるワークピースの製造のための方法
JP7078366B2 (ja) 2016-09-19 2022-05-31 フラウンホファー ゲセルシャフト ツール フェールデルンク ダー アンゲヴァンテン フォルシュンク エー．ファオ． レーザアブレーションによって微細機械加工されるワークピースの製造のための方法
CN109641269A (zh) * 2016-09-29 2019-04-16 Ｊｘ金属株式会社 激光烧结用表面处理金属粉
JPWO2018062527A1 (ja) * 2016-09-29 2019-06-24 Ｊｘ金属株式会社 レーザー焼結用表面処理金属粉
JP2020073727A (ja) * 2016-09-29 2020-05-14 Ｊｘ金属株式会社 レーザー焼結用表面処理金属粉
JP7079237B2 (ja) 2016-09-29 2022-06-01 Ｊｘ金属株式会社 レーザー焼結用表面処理金属粉
WO2020081318A1 (en) * 2018-10-19 2020-04-23 Corning Incorporated Device including vias and method and material for fabricating vias
US20210359185A1 (en) * 2018-10-19 2021-11-18 Corning Incorporated Device including vias and method and material for fabricating vias

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JP6038313B2 (ja) 2016-12-07
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