WO2014199526A1 - 金めっき被覆ステンレス材、および金めっき被覆ステンレス材の製造方法 - Google Patents
金めっき被覆ステンレス材、および金めっき被覆ステンレス材の製造方法 Download PDFInfo
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- WO2014199526A1 WO2014199526A1 PCT/JP2013/075562 JP2013075562W WO2014199526A1 WO 2014199526 A1 WO2014199526 A1 WO 2014199526A1 JP 2013075562 W JP2013075562 W JP 2013075562W WO 2014199526 A1 WO2014199526 A1 WO 2014199526A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/50—Treatment of iron or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
- C23G1/081—Iron or steel solutions containing H2SO4
Definitions
- the present invention relates to a gold-plated coated stainless steel material and a gold-plated coated stainless steel material.
- a gold-plated stainless steel material in which a gold-plated layer is coated on the surface of a stainless steel plate is used.
- a gold-plated coated stainless steel material having a gold plating layer formed on such a surface in order to improve the adhesion of the gold plating layer on the surface, it is usually necessary to provide a base on the stainless steel plate before forming the gold plating layer.
- Nickel plating is performed to form a base nickel plating layer.
- a gold plating layer is formed on such a base nickel plating layer, if a defect such as a pin pole occurs in the gold plating layer, nickel is eluted from the base nickel plating layer, and thereby the gold plating layer There is a problem of causing peeling of the film.
- Patent Document 1 discloses a technique for directly forming a gold plating layer on a stainless steel plate without performing such base nickel plating.
- the present invention has been made in view of such a situation, and even when the gold plating layer on the surface is thinned, the coverage and adhesion of the gold plating layer can be improved.
- Another object of the present invention is to provide a gold-plated coated stainless steel material that is excellent in conductivity and advantageous in cost.
- the present inventors have found that the above object can be achieved by forming a predetermined passive film on a stainless steel plate and forming a gold plating layer on the passive film.
- the inventor has completed the present invention.
- a passive film having a Cr / O value of 0.05 to 0.2 and a Cr / Fe value of 0.5 to 0.8 on the surface by Auger electron spectroscopy is formed.
- a gold-plated coated stainless steel material comprising: a stainless steel plate that is formed; and a gold plating layer formed on the passive film of the stainless steel plate.
- the gold plating layer preferably has a coverage of 95% or more.
- a method for producing a gold-plated coated stainless steel material comprising a dipping step of immersing a stainless steel plate in a sulfuric acid aqueous solution, and a plating step of forming a gold plating layer on the stainless steel plate.
- the sulfuric acid concentration when dipping the stainless steel plate in the sulfuric acid aqueous solution was x [volume%] (where 20 ⁇ x ⁇ 25), the temperature was y [° C.], and the dipping time was z [seconds].
- a method for producing a gold-plated stainless steel material satisfying the following formula (1) is provided.
- the Cr / O value by Auger electron spectroscopy analysis on the surface of the stainless steel plate is 0.05 to 0.2, and Cr / Fe
- a method for producing a gold-plated coated stainless steel material is provided.
- the gold plating layer formed on the stainless steel plate can be improved in coverage and adhesion even when the thickness is reduced, thereby being excellent in corrosion resistance and conductivity and cost-effective.
- An advantageous gold-plated stainless steel material can be provided.
- FIG. 1 is a configuration diagram of a gold plating coated stainless steel material 100 according to the present embodiment.
- FIG. 2 is a graph showing the results of measurement by X-ray photoelectron spectroscopy (XPS) of the passive film 11 of the stainless steel plate 10 obtained in Examples and Comparative Examples.
- FIG. 3 is a graph showing the results of measuring the Cr / O value and the Cr / Fe value by Auger electron spectroscopy analysis on the surface of the passive film 11 of the stainless steel plate 10 obtained in Examples and Comparative Examples.
- FIG. 4 is a diagram showing the results of measuring the surface roughness of the passive film 11 of the stainless steel plate 10 obtained in Examples and Comparative Examples.
- FIG. XPS X-ray photoelectron spectroscopy
- FIG. 5 is a graph showing the results of XRD analysis using a fluorescent X-ray diffractometer for the passive film 11 of the stainless steel plate 10 obtained in the example.
- FIG. 6 is a cross-sectional photograph of the passive film 11 of the stainless steel plate 10 obtained in Examples and Comparative Examples.
- FIG. 7 is a diagram showing electron beam diffraction patterns in the passive film 11 of the stainless steel plate 10 obtained in the examples and comparative examples.
- FIG. 8 is an SEM photograph of the surface of the gold plating coated stainless steel material 100 obtained in the example.
- FIG. 9 is a graph showing the results of evaluating the corrosion resistance of the gold-plated coated stainless steel material 100 obtained in the example.
- FIG. 10 is a diagram for explaining a method for measuring the contact resistance of the gold-plated coated stainless steel material 100 obtained in the example.
- FIG. 11 is a graph showing the results of measuring the contact resistance of the gold-plated coated stainless steel material 100 obtained in the example.
- the gold plating coated stainless steel material 100 of the present embodiment is configured by forming a gold plating layer 20 on a stainless steel plate 10 on which a passive film 11 is formed.
- the passive film 11 has a Cr / O value of 0.05 to 0.2 and a Cr / Fe value of 0.5 to 0.8 according to Auger electron spectroscopic analysis on the surface.
- stainless steel plate 10 Although it does not specifically limit as the stainless steel plate 10 used as the board
- the shape of the stainless steel plate 10 is not particularly limited and can be appropriately selected depending on the intended use. For example, a conductive metal part or plate processed into a linear shape or plate shape is processed into an uneven shape.
- the thickness (diameter) and thickness (plate thickness) of the stainless steel plate 10 are not particularly limited, and can be appropriately selected according to the intended use.
- the stainless steel plate 10 has a passive film 11 formed on the surface.
- the passive film 11 has a Cr / O value (Cr / O molar ratio) and a Cr / Fe value (Cr / Fe molar ratio) by the Auger electron spectroscopic analysis on the surface in the following ranges. . That is, the Cr / O value is in the range of 0.05 to 0.2, preferably 0.05 to 0.15.
- the Cr / Fe value is in the range of 0.5 to 0.8, preferably 0.5 to 0.7.
- the surface of the passive film 11 formed on the stainless steel plate 10 is formed on the passive film 11 by controlling the Cr / O value and the Cr / Fe value by Auger electron spectroscopy analysis within the above ranges.
- the coverage ratio that is, the ratio of the area covered with the gold plating layer 20 on the surface on which the gold plating layer 20 is formed on the passive film 11
- the adhesion is also improved. It will be excellent.
- the Cr / O value and the Cr / Fe value by Auger electron spectroscopy can be measured by the following method, for example. That is, first, the surface of the passive film 11 is measured using a scanning Auger electron spectrometer (AES), and the atomic% of Cr, O, and Fe on the surface of the passive film 11 is calculated. And about 5 places among the surfaces of the passive film 11, the measurement by a scanning Auger electron spectrometer is performed, and the obtained results are averaged to obtain a Cr / O value (atomic% of Cr / atomic of O). %) And Cr / Fe value (Cr atomic% / Fe atomic%) can be calculated.
- AES scanning Auger electron spectrometer
- a peak at 510 to 535 eV is a Cr peak
- a peak at 485 to 520 eV is an O peak
- 570 The atomic% of Cr, O, and Fe is measured by setting the peak at ⁇ 600 eV as the Fe peak and the total of these Cr, O, and Fe as 100 atomic%.
- the method for forming the passive film 11 on the surface of the stainless steel plate 10 is not particularly limited.
- the sulfuric acid concentration of the sulfuric acid aqueous solution is preferably 20 to 25% by volume.
- the temperature at which the stainless steel material is immersed is preferably 50 to 70 ° C., more preferably 60 to 70 ° C.
- the time for immersing the stainless steel material in the sulfuric acid aqueous solution is preferably 5 to 600 seconds, more preferably 5 to 300 seconds.
- the immersion temperature is y [° C.]
- the immersion time is When z is z [seconds], it is preferable to satisfy the following formula (1).
- the passive film 11 when a method of immersing a stainless steel material in an aqueous sulfuric acid solution is used to form the passive film 11, the sulfuric acid concentration x [volume%], the temperature y [° C.], and the immersion time z [
- the oxide film originally formed on the surface of the stainless steel material is removed, and Cr / O by surface Auger electron spectroscopy analysis is performed on the stainless steel material.
- the passive film 11 in which the value and the Cr / Fe value are controlled in the above-described range can be formed.
- the gold plating layer 20 is a layer formed by performing a gold plating process on the passive film 11 of the stainless steel plate 10.
- the plating method for forming the gold plating layer 20 is not particularly limited, but is preferably formed by electroless plating.
- the coverage of the gold plating layer 20, that is, the ratio of the area covered with the gold plating layer 20 on the surface on which the gold plating layer 20 is formed on the passive film 11 is preferably 95% or more. is there.
- the coverage of the gold plating layer 20 is preferably 95% or more.
- the thickness of the gold plating layer 20 is preferably 2 to 20 nm, more preferably 2 to 5 nm. If the thickness of the gold plating layer 20 is too thin, the uniform gold plating layer 20 is not formed on the passive film 11 of the stainless steel plate 10, and the corrosion resistance and conductivity decrease when used as the gold plating coated stainless steel material 100. There is a risk. On the other hand, if the thickness of the gold plating layer 20 is too thick, it is disadvantageous in terms of cost.
- the gold plating-coated stainless steel material 100 can be obtained by performing the gold plating process on the passive film 11 of the stainless steel plate 10 to form the gold plating layer 20.
- the gold-plated coated stainless steel material 100 of the present embodiment as described above, the Cr / O value and the Cr / Fe value obtained by Auger electron spectroscopic analysis of the surface of the passive film 11 formed on the stainless steel plate 10 are as described above. Since the range is controlled, the coverage and adhesion of the gold plating layer 20 formed on such a passive film 11 can be improved.
- the gold plating coated stainless steel material 100 of the present embodiment has a high coverage and adhesion of the gold plating layer 20, thereby improving corrosion resistance and conductivity. It is excellent and advantageous in terms of cost, and is suitably used as an electrical contact material used for connectors, switches, printed wiring boards, and the like.
- the gold plating coated stainless steel material 100 according to the present embodiment, the Cr / O value and the Cr / Fe value obtained by Auger electron spectroscopy analysis on the surface of the passive film 11 formed on the stainless steel plate 10.
- the gold plating layer 20 having excellent coverage and adhesion can be formed on the passive film 11. Therefore, according to the present embodiment, even when the thickness of the gold plating layer 20 is reduced, the obtained gold plating coated stainless steel material 100 is excellent in corrosion resistance and conductivity, and is further advantageous in cost. it can.
- the sulfuric acid concentration, the immersing temperature, and the immersing time satisfy the relationship of the above formula (1).
- the passive film 11 in which the Cr / O value and the Cr / Fe value by the Auger electron spectroscopic analysis on the surface are controlled within the above ranges, whereby the coverage ratio and A gold plating layer 20 having excellent adhesion can be formed.
- FIG. 2 is data of examples and comparative examples to be described later, when an austenitic stainless steel material (SUS316L) is immersed in a sulfuric acid aqueous solution having a sulfuric acid concentration of 25% by volume at a temperature of 70 ° C. It is a graph which shows the measurement result by X-ray photoelectron spectroscopy (XPS).
- XPS X-ray photoelectron spectroscopy
- FIG. 2A shows the results of measuring Fe2p
- FIG. 2B of Ni2p shows the results of measuring Fe2p
- FIG. 2C of Cr2p shows the results of measuring Fe2p
- FIG. 2D shows the results of measuring Fe2p
- FIG. 2B of Ni2p shows the results of measuring Fe2p
- FIG. 2C of Cr2p shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C of Cr2p shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe2p
- FIG. 2C shows the results of measuring Fe
- peaks near 712 eV and 725 eV indicate iron oxide (Fe—O), and peaks near 707 eV indicate single iron (Fe (metal)), respectively.
- peaks near 874 eV and 856 eV indicate nickel oxide (Ni—O), and peaks near 853.5 eV indicate single nickel (Ni (metal)), respectively.
- peaks near 586 eV and 577 eV indicate chromium oxide (Cr (III) -O)
- peaks near 574 eV indicate single chromium (Cr (metal)).
- a peak near 531 eV indicates oxygen (O-metal) bonded to a metal such as iron, nickel, or chromium.
- the peak size of Fe (metal) in the vicinity of 707 eV is as follows: It is larger than the untreated state that is not immersed in the sulfuric acid aqueous solution. Therefore, by immersing the stainless steel material in a sulfuric acid aqueous solution, the oxide film containing a large amount of Cr atoms on the stainless steel plate is appropriately removed, and active single iron (Fe (Fe ( metal)) is exposed.
- the stainless steel material when the stainless steel material is immersed in a sulfuric acid aqueous solution, if the sulfuric acid concentration is too low, if the immersion temperature is too low, or if the immersion time is too short, the oxide film containing a lot of Cr atoms on the stainless steel plate And the content ratio of Cr atoms on the outermost surface becomes large (that is, the Cr / O value and the Cr / Fe value become too high), and single iron on the surface of the passive film 11 to be formed. Since the exposure of (Fe (metal)) becomes insufficient, the coverage and adhesion of the gold plating layer 20 are reduced.
- the immersion time is 60 seconds or more, for example, the relationship between the sulfuric acid concentration, the temperature, and the immersion time satisfies the above formula (1), thereby forming For the passive film 11 to be formed, the decrease in the peak of Fe (metal) on the surface is suppressed, whereby the value of Fe (metal) / Fe (total) can be controlled within the above range.
- the coverage and adhesion of the gold plating layer 20 formed thereon can be improved appropriately.
- the surface of the formed passive film 11 is composed of simple iron (Fe (metal) with respect to the total amount of Fe atoms (Fe (total)). )) Ratio (Fe (metal) / Fe (total)) is preferably 14% or more, more preferably 18% or more. By setting the value of Fe (metal) / Fe (total) to 14% or more, active single iron can be appropriately exposed on the surface of the passive film 11, so that The coverage and adhesion of the gold plating layer 20 formed on the dynamic film 11 can be further improved.
- the ratio (Ni (metal) / Ni (total)) of simple nickel (Ni (metal)) to the total amount of Ni atoms (Ni (total)) is preferably 18% or more, more preferably 25% or more. It is. By setting the value of Ni (metal) / Ni (total) to 18% or more, the ratio of nickel oxide having very brittle properties on the surface of the passive film 11 can be reduced. The coverage and adhesion of the gold plating layer 20 can be further improved.
- the stainless steel plate is subjected to the sulfuric acid aqueous solution after the formation of the passive film 11.
- Fe preferentially elutes from the stainless steel plate, so that the content ratio of Cr atoms is relatively large on the surface of the passive film 11 (that is, the Cr / O value and Cr / Fe value becomes too high) and the nickel oxide (Ni—O) is generated, and the coverage of the gold plating layer 20 formed due to the influence of the Cr and nickel oxides and Adhesion will be reduced.
- the nickel oxide has a very brittle nature
- the gold plating layer 20 is formed on the portion of the passive film 11 containing a large amount of nickel oxide
- the nickel oxide is oxidized.
- the object itself is peeled off from the stainless steel plate 10, thereby reducing the coverage and adhesion of the gold plating layer 20.
- the ratio of single nickel is increased and it has a very brittle property. Since the ratio of the nickel oxide can be reduced, the coverage and adhesion of the gold plating layer 20 can be further improved.
- Ni (metal) / Ni (total) for example, based on the measurement result by X-ray photoelectron spectroscopy (XPS) as shown in FIG. After subtracting the ground, single nickel (Ni (metal)) with respect to the sum of the integrated value of the nickel oxide (Ni—O) peak and the integrated value of the single nickel (Ni (metal)) peak.
- XPS X-ray photoelectron spectroscopy
- Ni (metal) / Ni (total) on the surface of the passive film 11 for example, sulfuric acid concentration, temperature, and immersion time when a stainless steel material is immersed in a sulfuric acid aqueous solution are set. And a method satisfying the above formula (1).
- the surface roughness of the formed passive film 11 is preferably an arithmetic average roughness Ra of 0.015 ⁇ m or more, more preferably 0.018 ⁇ m. That's it.
- Examples of the method of setting the surface roughness of the passive film 11 in the above range include a method of increasing the immersion time when the stainless steel material is immersed in a sulfuric acid aqueous solution. In this case, the longer the immersion time, the larger the surface roughness of the formed passive film 11. Similarly, even when the sulfuric acid concentration or temperature when the stainless steel material is immersed in the sulfuric acid aqueous solution is increased, the surface roughness of the formed passive film 11 is increased, and the coverage and adhesion of the gold plating layer 20 are increased. More improved.
- the gold-plated stainless steel material 100 can be used as a fuel cell separator.
- a fuel cell separator is used as a member of a fuel cell constituting a fuel cell stack, and has a function of supplying fuel gas or air to an electrode through a gas flow path, and a function of collecting electrons generated at the electrode It is.
- the stainless steel plate 10 has a surface on which irregularities (gas flow paths) that function as fuel gas or air flow paths are formed in advance. It is preferable to use it.
- a method for forming the gas flow path is not particularly limited, and for example, a method of forming by a press working can be mentioned.
- the gold-plated coated stainless steel material 100 of the present embodiment as described above, the gold-plated layer 20 excellent in coverage and adhesion is formed, and thus as such a fuel cell separator. Can also be suitably used.
- ⁇ XRD analysis> The crystal
- XPS measurement> By measuring the peaks of Fe2p, Ni2p, Cr2p, and O1s on the surface of the passive film 11 formed on the stainless steel plate 10 using an X-ray photoelectron spectrometer (manufactured by ULVAC-PHI, model number: VersaProbe II). XPS measurement was performed. In addition, XPS measurement was performed only about Example 2 and Comparative Example 2 among the Example and Comparative Example which are mentioned later. For comparison, XPS measurement was also performed on a stainless steel material (SUS316L) that was not immersed in a sulfuric acid aqueous solution.
- SUS316L stainless steel material
- the plating property of the gold plating layer 20 was evaluated for the gold plating coated stainless steel material 100 obtained by forming the gold plating layer 20 on the stainless steel plate 10 on which the passive film 11 was formed.
- the presence or absence of Au was detected on the surface of the gold plating coated stainless steel material 100 with a fluorescent X-ray analyzer (model number: ZSX100e), and evaluated according to the following criteria. .
- the evaluation of the plating property was performed for all examples and comparative examples described later.
- ⁇ Au was detected from the surface of the gold plating coated stainless steel material 100.
- X Au was not detected from the surface of the gold plating coated stainless steel material 100.
- ⁇ Measurement of coverage of gold plating layer 20> The surface of the gold-plated coated stainless steel material 100 was observed with a scanning electron microscope SEM (manufactured by Hitachi High-Technologies Corporation, S-4800), and the coverage of the gold-plated layer 20 was measured based on the obtained SEM photograph. .
- the measurement of the coverage of the gold plating layer 20 is obtained by performing image processing after binarizing the SEM photograph with a lightness threshold value that can identify defects such as pinholes in the gold plating layer 20.
- the ratio of the area where the gold plating layer 20 was formed was measured based on the obtained image.
- the measurement of the coverage of the gold plating layer 20 was performed only about Example 4 among the Example and the comparative example which are mentioned later.
- the gold-plated coated stainless steel 100 is masked with polyimide tape so that the area of 35 mm in length and 20 mm in width is exposed, immersed in a sulfuric acid aqueous solution at pH: 1.0 and temperature: 90 ° C. for 100 hours, and then gold-plated stainless steel 100, and the mass concentration (g / L) of ions (Fe, Cr, Mo, Ni) eluted from the gold-plated coated stainless steel material 100 into the sulfuric acid aqueous solution was determined by inductively coupled plasma emission spectrometer (ICPE-, manufactured by Shimadzu Corporation). 9000).
- ICPE- inductively coupled plasma emission spectrometer
- the contact resistance value was measured using a measurement system as shown in FIG.
- the measurement system shown in FIG. 10 includes a gold plating coated stainless steel 100, a carbon cloth 200 used as a gas diffusion layer stainless steel plate in a fuel cell separator, a copper plating 300 coated with gold plating, a voltmeter 400, and an ammeter. 500.
- the contact resistance value is measured by first processing the gold-plated coated stainless steel material 100 into a size of 20 mm in width, 20 mm in length, and 1.27 mm in thickness, and as shown in FIG.
- Example 10 was obtained by being sandwiched and fixed from both sides by a copper electrode 300 coated with gold via a Toray Co., Ltd. product number: TGP-H-090. Next, while applying a constant load to the copper electrode 300 coated with gold plating, a contact resistance value between the upper and lower carbon cloths 200 with the test piece sandwiched between them using a resistance meter (manufactured by Hioki Electric Co., Ltd., milliohm high tester 3540). was measured. The contact resistance value was measured only for Example 14 among Examples and Comparative Examples described later.
- a stainless steel material (SUS316L) not immersed in a sulfuric acid aqueous solution was processed into a size of 20 mm in width, 20 mm in length, and 1.0 mm in thickness, and then the contact resistance value was similarly measured. Went.
- Example 1 First, a stainless steel material (SUS316L) for forming the stainless steel plate 10 was prepared. Next, the prepared stainless steel material is immersed in an aqueous sulfuric acid solution having a sulfuric acid concentration of 25% by volume under conditions of a temperature of 70 ° C. and an immersion time of 5 seconds, whereby the stainless steel plate 10 having a passive film 11 formed on the surface thereof. Got.
- SUS316L stainless steel material
- FIG. 3 is a graph showing the measurement results of the Cr / O value and the Cr / Fe value.
- the horizontal axis represents the immersion time in which the stainless steel material was immersed in the sulfuric acid aqueous solution, and the vertical axis represents the scanning Auger electron spectroscopy analyzer.
- the Cr / O value and Cr / Fe value measured by (AES) are shown.
- FIG. 4 is a graph showing the measurement results of the surface roughness, where the horizontal axis indicates the immersion time in which the stainless steel material is immersed in the sulfuric acid aqueous solution, and the vertical axis indicates the arithmetic average roughness Ra.
- the stainless steel plate 10 on which the passive film 11 is formed is subjected to electroless plating treatment at 70 ° C. for 5 minutes using an electroless gold plating bath (Okuno Pharmaceutical Co., Ltd., product number: Flash Gold NF).
- an electroless gold plating bath (Okuno Pharmaceutical Co., Ltd., product number: Flash Gold NF).
- a gold plating layer 20 having a thickness of about 23 nm was formed on the passive film 11 to obtain a gold plating coated stainless steel material 100.
- Examples 2 to 13 A gold-plated coated stainless steel material 100 was produced in the same manner as in Example 1 except that the concentration, temperature, and immersion time when the stainless steel material was immersed in the sulfuric acid aqueous solution were as shown in Table 1, and the above-described method was used. Therefore, Cr / O value and Cr / Fe value measurement, XRD analysis, XPS measurement, surface roughness measurement, cross-sectional observation, electron beam diffraction pattern measurement, plating property evaluation, and adhesion evaluation were performed. The results are shown in Table 1 and FIGS.
- FIG. 2 has shown the result of having measured the peak of Fe2p, Ni2p, Cr2p, O1s, respectively about the surface of the passive film 11 formed on the stainless steel plate 10 by XPS measurement.
- FIG. 2 (A) shows the results of measuring Fe2p
- FIG. 2 (B) shows the Ni2p
- FIG. 2 (C) shows the Cr2p
- FIG. 2 (D) shows the results of measuring the O1s peak.
- the result of Example 2 is indicated by a broken line
- the result of Comparative Example 2 described later is indicated by a dotted line
- Measurement results are indicated by solid lines.
- FIG. 5 is a graph showing the results of XRD analysis, wherein the horizontal axis indicates the diffraction angle, and the vertical axis indicates the intensity of the diffracted X-ray detected by the fluorescent X-ray diffractometer.
- the graph of FIG. 5 information on the crystal and crystal plane orientation from which the peak originates is shown together in each peak portion.
- FeCrNiC is an FeCrNiC compound crystal
- CrOxide is a chromium oxide crystal
- Cr0.4Ni0.6 has a Cr: Ni ratio of 0.4: 0.6 (atomic%).
- the crystals of the CrNi alloy are shown respectively.
- FIG. 6 is a diagram showing a result of cross-sectional observation in the stainless steel plate 10 having the passive film 11 formed on the surface.
- 6A shows the results of Example 2
- FIG. 6B shows the results of Comparative Example 2 described later
- FIG. 6C shows the results of the stainless steel material (SUS316L) not immersed in the sulfuric acid aqueous solution.
- FIG. 7 shows the result of measuring the electron beam diffraction pattern for the surface of the passive film 11 formed on the stainless steel plate 10.
- 7A shows the result of Example 2
- FIG. 7B shows the result of Comparative Example 2 described later
- FIG. 7C shows the result of stainless steel (SUS316L) not immersed in the sulfuric acid aqueous solution.
- FIG. 7A shows the measurement result of the diffraction pattern from a crystal (element ratio: Fe 2.96 Cr 0.03 Ni 0.01 O 4 ) containing a relatively large amount of simple iron. Yes.
- FIG. 7B shows a measurement result of a diffraction pattern from a crystal (element ratio: Cr 0.19 Fe 0.7 Ni 0.11 ) containing a relatively large amount of nickel oxide.
- 7 (C) shows the measurement result of the diffraction pattern from the chromium oxide crystal (MnCr 2 O 4 ).
- Comparative Examples 1 to 9 A gold-plated coated stainless steel material 100 was prepared in the same manner as in Example 1 except that the concentration of the sulfuric acid aqueous solution and the immersion time in immersing the stainless steel material in the sulfuric acid aqueous solution were as shown in Table 1, and described above. According to the method, Cr / O value and Cr / Fe value measurement, XRD analysis, XPS measurement, surface roughness measurement, cross-sectional observation, electron diffraction pattern measurement, plating property evaluation, and adhesion evaluation were performed. . The results are shown in Table 1 and FIGS.
- Comparative Examples 10-22 Instead of the treatment of immersing the stainless steel material in the sulfuric acid aqueous solution, the treatment was carried out except that the treatment of immersing the stainless steel material in hydrochloric acid was performed, and the hydrochloric acid concentration, temperature, and immersion time when immersed in hydrochloric acid were as shown in Table 2.
- a gold-plated coated stainless steel material 100 was produced in the same manner as in Example 1, and the plating property and adhesion were evaluated according to the methods described above. The results are shown in Table 2.
- Comparative Examples 23 to 25 In place of the treatment of immersing the stainless steel material in the sulfuric acid aqueous solution, the stainless steel material is treated by immersing the stainless steel material in an acidic aqueous solution having a sulfuric acid concentration: 6% by volume and a phosphoric acid concentration: 4% by volume.
- a gold-plated coated stainless steel material 100 was produced in the same manner as in Example 1 except that the immersion time was as shown in Table 2, and the plating property and adhesion were evaluated according to the methods described above. The results are shown in Table 2.
- Comparative Example 26 A gold-plated coated stainless steel material 100 was prepared in the same manner as in Example 1 except that the gold-plated layer was formed directly on the stainless steel plate 10 without immersing the stainless steel material in the sulfuric acid aqueous solution. Measurement of / O value and Cr / Fe value, evaluation of plating property, and evaluation of adhesion were performed. The results are shown in Table 2 and FIG.
- Examples 1, 2, and 4 in which the concentration, temperature, and immersion time when the stainless steel material is immersed in the sulfuric acid aqueous solution satisfy the relationship of the above formula (1) are passive. It was confirmed that the Cr / O value and the Cr / Fe value on the surface of the film 11 were controlled within the above ranges by Auger electron spectroscopy analysis. From the results shown in Table 1, it was confirmed that the gold plating layer 20 formed on the passive film 11 was excellent in plating properties and adhesion.
- Example 3 where the stainless steel material was immersed in the sulfuric acid aqueous solution, the crystal orientation of the CrOxide crystal (2.2.0) was compared with SUS316L which was not immersed in the sulfuric acid aqueous solution.
- the peak near the diffraction angle of 66 ° derived from the crystal and the peak near the diffraction angle of 75 ° derived from the crystal orientation of the crystal of Cr0.4Ni0.6 (2.2.0) are small. It was confirmed that the content ratio of CrOxideCr and Cr0.4Ni0.6 in the steel was lowered.
- Example 3 it is thought that Cr intensity
- Example 2 in which the concentration, temperature, and immersion time when the stainless steel material is immersed in the sulfuric acid aqueous solution satisfies the relationship of the above formula (1) is shown in FIG. From the graph, the peak of Fe (metal) in the vicinity of 707 eV is larger than that of SUS316L (untreated) that is not immersed in the sulfuric acid aqueous solution, which is active on the surface of the formed passive film 11. It can be confirmed that single iron (Fe (metal)) is exposed.
- Examples 1 to 4 in which the concentration, temperature, and immersion time when the stainless steel material is immersed in the sulfuric acid aqueous solution satisfy the relationship of the above formula (1) are immersed in the sulfuric acid aqueous solution.
- the arithmetic average roughness Ra is larger than before the immersion (immersion time 0 second), and thereby the plating property and adhesion of the gold plating layer 20 formed on the passive film 11 due to the anchor effect. It was confirmed to be excellent.
- Example 2 in which the concentration, temperature, and immersion time when the stainless steel material is immersed in the sulfuric acid aqueous solution satisfies the relationship of the above formula (1) is SUS316L (untreated ), The crystal structure on the surface of the stainless steel material 10 was confirmed to have changed.
- Example 2 the surface shape of the stainless steel material 10 is roughened by the aqueous sulfuric acid solution as compared with SUS316L (untreated). .
- Example 2 as shown in FIG. 7A, a diffraction pattern from a crystal containing a relatively large amount of simple iron was measured, while SUS316L (untreated) was measured in FIG. 7C. As shown, diffraction from crystals of chromium oxide was measured. As a result, it was confirmed that in Example 2, the crystal structure on the surface of the stainless steel material 10 was changed as compared with SUS316L (untreated), and crystals containing a relatively large amount of simple iron were exposed.
- the stainless steel plate is eroded by the sulfuric acid aqueous solution, so that iron is preferentially eluted, Since the amount of Cr increases, the Cr / O value and the Cr / Fe value become too high.
- the concentration, temperature, and immersion time when the stainless steel material is immersed in the sulfuric acid aqueous solution do not satisfy the relationship of the above formula (1). It can be confirmed that the structure is fragile due to the corrosion of the ant nest.
- Comparative Example 2 as shown in FIG. 7B, a diffraction pattern from a crystal containing a relatively large amount of nickel oxide was measured, and the crystal structure on the surface of the stainless steel material 10 was changed. It can be confirmed that the proportion of nickel oxide having brittle properties is increased.
- Example 4 the thickness of the gold plating layer 20 was measured, and the coverage of the gold plating layer 20 was measured according to the method described above. The results are shown in Table 3 and FIGS. 8 (A) to 8 (C).
- FIG. 8A is an SEM photograph before the gold plating layer 20 is formed
- FIG. 8B is an SEM photograph after the gold plating layer 20 is formed
- FIG. 8C is an SEM photograph of FIG. 8B. It is the image obtained by processing.
- the white part in the image shows the part where the gold plating layer 20 is formed
- the black part in the image shows the part where the gold plating layer 20 is not formed. Show.
- Example 4 From the results shown in Table 3 and FIGS. 8A to 8C, on the stainless steel plate 10, the Cr / O value by Auger electron spectroscopy analysis on the surface is 0.05 to 0.2, and the Cr / Fe value is In Example 4 in which the passivation film 11 in the range of 0.5 to 0.8 was formed, and the gold plating layer 20 was formed on the passivation film 11, the gold plating layer 20 was well formed, It was confirmed that the coverage was as high as 98.2%.
- Example 14 The gold plating coated stainless steel material 100 is the same as in Example 4 except that the gold plating layer 20 having a thickness of 2.8 nm is formed by changing the conditions of the electroless plating treatment when forming the gold plating layer 20.
- the corrosion resistance was evaluated and the contact resistance value was measured according to the method described above. The results are shown in FIGS.
- Example 14 in which the kinetic film 11 was formed and the gold plating layer 20 was formed on the passivation film 11, even when the thickness of the gold plating layer 20 was as thin as several nanometers, As compared with SUS316L used as a material, it was confirmed that ion elution from the stainless steel plate can be effectively suppressed and the corrosion resistance is excellent.
- Example 14 in which a certain passive film 11 was formed and a gold plating layer 20 was formed on this passive film 11, it was used as a material for a conventional fuel cell separator at any load value. Compared with SUS316L, the contact resistance value was low, and the conductivity was excellent.
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Abstract
Description
本実施形態の金めっき被覆ステンレス材100は、図1に示すように、不動態膜11が形成されたステンレス鋼板10上に、金めっき層20が形成されることで構成され、ステンレス鋼板10の不動態膜11は、表面におけるオージェ電子分光分析によるCr/O値が0.05~0.2、かつCr/Fe値が0.5~0.8の範囲であることを特徴とする。
本実施形態の金めっき被覆ステンレス材100の基板となるステンレス鋼板10としては、特に限定されないが、SUS316L、SUS304などのステンレス鋼材が挙げられる。また、ステンレス鋼板にはマルテンサイト系、フェライト系、オーステナイト系などの種類があるが、特にオーステナイト系ステンレス鋼板が好適である。ステンレス鋼板10の形状としては、特に限定されず、使用用途に応じて適宜選択することができるが、たとえば、線形状や板形状に加工された導電性の金属部品、板を凹凸形状に加工してなる導電性部材、ばね形状や筒形状に加工された電子機器の部品などの用途に応じて必要な形状に加工したもの用いることができる。また、ステンレス鋼板10の太さ(直径)や厚み(板厚)は、特に限定されず、使用用途に応じて適宜選択することができる。
金めっき層20は、ステンレス鋼板10の不動態膜11上に、金めっき処理を施すことにより形成される層である。なお、金めっき層20を形成するめっき方法は特に限定されないが、無電解めっきにより形成することが好ましい。
なお、各特性の定義および評価方法は、以下のとおりである。
表面に不動態膜11を形成したステンレス鋼板10について、走査型オージェ電子分光分析装置(AES)を用いて、5箇所について、Cr、OおよびFeの原子%を測定し、得られた結果を平均することにより、Cr/O値(Crの原子%/Oの原子%)およびCr/Fe値(Crの原子%/Feの原子%)を求めた。なお、Cr/O値およびCr/Fe値の測定は、後述する実施例および比較例のうち、実施例1,2,4および比較例1,2,26についてのみ行った。
表面に不動態膜11を形成したステンレス鋼板10の表面を、蛍光X線回折装置を用いて、ステンレス鋼板10の表面に含まれる結晶の同定を行った。なお、XRD分析は、後述する実施例および比較例のうち、実施例3についてのみ行った。また、比較のため、併せて、硫酸水溶液に浸漬させていないステンレス鋼材(SUS316L)についても、同様にXRD分析を行った。
ステンレス鋼板10上に形成した不動態膜11の表面について、X線光電子分光装置(アルバック・ファイ社製、型番:VersaProbeII)を用いて、Fe2p、Ni2p、Cr2p、O1sのピークをそれぞれ測定することにより、XPS測定を行った。なお、XPS測定は、後述する実施例および比較例のうち、実施例2、および比較例2についてのみ行った。また、比較のため、併せて、硫酸水溶液に浸漬させていないステンレス鋼材(SUS316L)についても、同様にXPS測定を行った。
ステンレス鋼板10上に形成した不動態膜11の表面について、レーザー顕微鏡(オリンパス社製、LEXT OLS3500)を用い、JIS B 0601:1994に準拠して算術平均粗さRaを測定した。なお、表面粗さの測定は、後述する実施例および比較例のうち、実施例1,2,4、および比較例1,2についてのみ行った。また、比較のため、併せて、硫酸水溶液に浸漬させていないステンレス鋼材(SUS316L)についても、同様に表面粗さの測定を行った。
表面に不動態膜11を形成したステンレス鋼板10について、炭素蒸着により炭素蒸着膜を形成した後で切断し、切断した断面を、走査型電子顕微鏡(日立ハイテクノロジーズ社製、型番:HD-2700)により測定することで断面写真を得た。なお、断面観察は、後述する実施例および比較例のうち、実施例2、および比較例2についてのみ行った。また、比較のため、併せて、硫酸水溶液に浸漬させていないステンレス鋼材(SUS316L)についても、同様に断面観察を行った。
ステンレス鋼板10上に形成した不動態膜11の表面について、透過型電子顕微鏡(日立ハイテクノロジーズ社製、型番:HF-2000)により測定することで、電子線回折パターンを得た。なお、電子線回折パターンの測定は、後述する実施例および比較例のうち、実施例2、および比較例2についてのみ行った。また、比較のため、併せて、硫酸水溶液に浸漬させていないステンレス鋼材(SUS316L)についても、同様に電子線回折パターンの測定を行った。
不動態膜11を形成したステンレス鋼板10上に金めっき層20を形成して得られた金めっき被覆ステンレス材100について、金めっき層20のめっき性を評価した。めっき性の評価は、具体的には、金めっき被覆ステンレス材100の表面について、蛍光X線分析装置(リガク社製、型番:ZSX100e)により、Auの有無を検知し、以下の基準で評価した。なお、めっき性の評価は、後述するすべての実施例および比較例について行った。
○:金めっき被覆ステンレス材100の表面からAuが検出された。
×:金めっき被覆ステンレス材100の表面からAuが検出されなかった。
金めっき被覆ステンレス材100について、金めっき層20の密着性を評価した。密着性の評価は、具体的には、金めっき被覆ステンレス材100の金めっき層20に粘着テープ(ニチバン社製、ナイスタック強力タイプ)を貼付した後、剥がすことにより剥離試験を実施し、その後、金めっき層20の剥離状態を観察して、以下の基準で評価した。なお、密着性の評価は、後述するすべての実施例および比較例について行った。
○:金めっき層20の剥離が確認されなかった。
△:金めっき層20が粘着テープの一部に剥離した。
×:金めっき層20が粘着テープの全面に剥離した。
ND:金めっき層20が形成されておらず、評価不能であった。
金めっき被覆ステンレス材100の表面を、走査型電子顕微鏡SEM(日立ハイテクノロジーズ社製、S-4800)にて観察し、得られたSEM写真に基づいて、金めっき層20の被覆率を測定した。金めっき層20の被覆率の測定は、上記SEM写真を、金めっき層20のピンホールなどの欠陥が特定できるような明度閾値で二値化することで画像処理した後、画像処理して得た画像に基づいて金めっき層20が形成された面積の割合を測定することにより行った。なお、金めっき層20の被覆率の測定は、後述する実施例および比較例のうち、実施例4についてのみ行った。
金めっき被覆ステンレス材100を縦35mm、横20mmの面積が露出するようにポリイミドテープでマスキングし、pH:1.0、温度:90℃の硫酸水溶液に100時間浸漬した後、金めっき被覆ステンレス材100を取り出し、金めっき被覆ステンレス材100から硫酸水溶液中に溶出したイオン(Fe、Cr、Mo、Ni)の質量濃度(g/L)を誘導結合プラズマ発光分析装置(島津製作所社製、ICPE-9000)により測定することにより行った。なお、耐食性の評価は、後述する実施例および比較例のうち、実施例14についてのみ行った。また、比較として、併せて、硫酸水溶液に浸漬させていないステンレス鋼材(SUS316L)についても、同様に耐食性の評価を行った。
金めっき被覆ステンレス材100について、図10に示すような測定系を用いて、接触抵抗値の測定を行った。なお、図10に示す測定系は、金めっき被覆ステンレス材100、燃料電池用セパレータにおいてガス拡散層ステンレス鋼板として用いられるカーボンクロス200、金めっき被覆された銅電極300、電圧計400、および電流計500によって構成される。接触抵抗値の測定は、具体的には、まず、金めっき被覆ステンレス材100を幅20mm、長さ20mm、厚さ1.27mmの大きさに加工し、図10に示すように、カーボンクロス200(東レ社製、品番:TGP-H-090)を介して、金めっき被覆された銅電極300によって両側から挟んで固定することで、図10に示す測定系とした。次いで、金めっき被覆された銅電極300に一定の荷重を加えながら、抵抗計(日置電機社製、ミリオームハイテスタ3540)を用いて、試験片を挟んだ上下のカーボンクロス200間の接触抵抗値を測定した。なお、接触抵抗値の測定は、後述する実施例および比較例のうち、実施例14についてのみ行った。また、比較として、併せて、硫酸水溶液に浸漬させていないステンレス鋼材(SUS316L)についても、幅20mm、長さ20mm、厚さ1.0mmの大きさに加工した後、同様に接触抵抗値の測定を行った。
まず、ステンレス鋼板10を形成するためのステンレス鋼材(SUS316L)を準備した。次いで、準備したステンレス鋼材を、硫酸濃度:25体積%の硫酸水溶液に、温度:70℃、浸漬時間:5秒の条件で浸漬させることにより、表面に不動態膜11が形成されたステンレス鋼板10を得た。
ステンレス鋼材を硫酸水溶液に浸漬させる際の濃度、温度、および浸漬時間を、表1に示すものとした以外は、実施例1と同様にして金めっき被覆ステンレス材100を作製し、上述した方法にしたがって、Cr/O値およびCr/Fe値の測定、XRD分析、XPS測定、表面粗さの測定、断面観察、電子線回折パターンの測定、めっき性の評価、密着性の評価を行った。結果を表1、図2~7に示す。
ステンレス鋼材を硫酸水溶液に浸漬させる際における、硫酸水溶液の濃度、および浸漬時間を、表1に示すものとした以外は、実施例1と同様にして金めっき被覆ステンレス材100を作製し、上述した方法にしたがって、Cr/O値およびCr/Fe値の測定、XRD分析、XPS測定、表面粗さの測定、断面観察、電子線回折パターンの測定、めっき性の評価、密着性の評価を行った。結果を表1、図2~4,6,7に示す。
ステンレス鋼材を硫酸水溶液に浸漬させる処理に代えて、ステンレス鋼材を塩酸に浸漬させる処理を行い、塩酸に浸漬させる際における塩酸濃度、温度、および浸漬時間を表2に示すものとした以外は、実施例1と同様にして金めっき被覆ステンレス材100を作製し、上述した方法にしたがって、めっき性の評価、密着性の評価を行った。結果を表2に示す。
ステンレス鋼材を硫酸水溶液に浸漬させる処理に代えて、ステンレス鋼材を硫酸濃度:6体積%、リン酸濃度:4体積%の酸性水溶液に浸漬させる処理を行い、この酸性水溶液に浸漬させる際における温度および浸漬時間を表2に示すものとした以外は、実施例1と同様にして金めっき被覆ステンレス材100を作製し、上述した方法にしたがって、めっき性の評価、密着性の評価を行った。結果を表2に示す。
ステンレス鋼材を硫酸水溶液に浸漬させることなく、ステンレス鋼板10上に直接金めっき層を形成した以外は、実施例1と同様にして金めっき被覆ステンレス材100を作製し、上述した方法にしたがって、Cr/O値およびCr/Fe値の測定、めっき性の評価、密着性の評価を行った。結果を表2、図3に示す。
金めっき層20を形成する際の無電解めっき処理の条件を変更することで、厚さ2.8nmの金めっき層20を形成した以外は、実施例4と同様にして金めっき被覆ステンレス材100を作製し、上述した方法にしたがって、耐食性の評価、および接触抵抗値の測定を行った。結果を図9,11に示す。
Claims (4)
- 表面におけるオージェ電子分光分析によるCr/O値が0.05~0.2、かつCr/Fe値が0.5~0.8の範囲である不動態膜が形成されたステンレス鋼板と、
前記ステンレス鋼板の不動態膜上に形成された金めっき層と、を備えることを特徴とする金めっき被覆ステンレス材。 - 前記金めっき層の被覆率が95%以上であることを特徴とする請求項1に記載の金めっき被覆ステンレス材。
- ステンレス鋼板を、硫酸水溶液に浸漬させることで、前記ステンレス鋼板上に、表面におけるオージェ電子分光分析によるCr/O値が0.05~0.2、かつCr/Fe値が0.5~0.8の範囲となる不動態膜を形成する浸漬工程と、
前記ステンレス鋼板の不動態膜上に、金めっき層を形成するめっき工程と、を有することを特徴とする金めっき被覆ステンレス材の製造方法。
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WO2018177545A1 (en) * | 2017-03-31 | 2018-10-04 | Toyota Motor Europe | System and method for charge protection of a lithium-ion battery |
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