WO2014192694A1 - 酸窒化物蛍光体粉末 - Google Patents
酸窒化物蛍光体粉末 Download PDFInfo
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- WO2014192694A1 WO2014192694A1 PCT/JP2014/063838 JP2014063838W WO2014192694A1 WO 2014192694 A1 WO2014192694 A1 WO 2014192694A1 JP 2014063838 W JP2014063838 W JP 2014063838W WO 2014192694 A1 WO2014192694 A1 WO 2014192694A1
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- Prior art keywords
- oxynitride phosphor
- powder
- oxynitride
- light
- silicon nitride
- Prior art date
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- 239000000843 powder Substances 0.000 title claims abstract description 145
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 142
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 66
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 41
- 239000002245 particle Substances 0.000 claims description 33
- 239000001301 oxygen Substances 0.000 claims description 31
- 229910052760 oxygen Inorganic materials 0.000 claims description 31
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 25
- 239000011575 calcium Substances 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 239000011261 inert gas Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229910052693 Europium Inorganic materials 0.000 claims description 13
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 229910052791 calcium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 7
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims description 7
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims description 7
- 229910003564 SiAlON Inorganic materials 0.000 abstract 2
- 238000000034 method Methods 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 18
- 238000010304 firing Methods 0.000 description 16
- -1 lanthanide metals Chemical class 0.000 description 16
- 239000002994 raw material Substances 0.000 description 16
- 229910021419 crystalline silicon Inorganic materials 0.000 description 15
- 230000005284 excitation Effects 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 238000002189 fluorescence spectrum Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229910021417 amorphous silicon Inorganic materials 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 229910000077 silane Inorganic materials 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- 239000012190 activator Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 6
- 238000005979 thermal decomposition reaction Methods 0.000 description 6
- 150000002500 ions Chemical group 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 229910001424 calcium ion Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000000695 excitation spectrum Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 229910052692 Dysprosium Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- 238000004438 BET method Methods 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen(.) Chemical compound [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 229920003196 poly(1,3-dioxolane) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- JHGCXUUFRJCMON-UHFFFAOYSA-J silicon(4+);tetraiodide Chemical compound [Si+4].[I-].[I-].[I-].[I-] JHGCXUUFRJCMON-UHFFFAOYSA-J 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- 229910018509 Al—N Inorganic materials 0.000 description 1
- 229910018516 Al—O Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- UDGPSUJHSJAIAU-UHFFFAOYSA-N N(Cl)Cl.[Si] Chemical compound N(Cl)Cl.[Si] UDGPSUJHSJAIAU-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910007991 Si-N Inorganic materials 0.000 description 1
- 229910006294 Si—N Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- PSBUJOCDKOWAGJ-UHFFFAOYSA-N azanylidyneeuropium Chemical compound [Eu]#N PSBUJOCDKOWAGJ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 229910001940 europium oxide Inorganic materials 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- IDBFBDSKYCUNPW-UHFFFAOYSA-N lithium nitride Chemical compound [Li]N([Li])[Li] IDBFBDSKYCUNPW-UHFFFAOYSA-N 0.000 description 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- UZLYXNNZYFBAQO-UHFFFAOYSA-N oxygen(2-);ytterbium(3+) Chemical compound [O-2].[O-2].[O-2].[Yb+3].[Yb+3] UZLYXNNZYFBAQO-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- AIFMYMZGQVTROK-UHFFFAOYSA-N silicon tetrabromide Chemical compound Br[Si](Br)(Br)Br AIFMYMZGQVTROK-UHFFFAOYSA-N 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- CFTHARXEQHJSEH-UHFFFAOYSA-N silicon tetraiodide Chemical compound I[Si](I)(I)I CFTHARXEQHJSEH-UHFFFAOYSA-N 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 229910003454 ytterbium oxide Inorganic materials 0.000 description 1
- 229940075624 ytterbium oxide Drugs 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/77928—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the present invention relates to an oxynitride phosphor powder made of ⁇ -sialon activated with a rare earth metal element, suitable for an ultraviolet to blue light source. Specifically, the present invention relates to an oxynitride phosphor powder exhibiting a practical fluorescence intensity in a fluorescence dominant wavelength range of 565 to 577 nm.
- LEDs blue light emitting diodes
- white LEDs using these blue LEDs have been vigorously developed.
- White LEDs have lower power consumption and longer life than existing white light sources, and are therefore being used for backlights for liquid crystal panels, indoor and outdoor lighting devices, and the like.
- the white LED that has been developed is one in which YAG (yttrium, aluminum, garnet) doped with Ce is applied to the surface of a blue LED.
- the Ce-doped YAG phosphor exhibits a fluorescence spectrum having a fluorescence peak wavelength near 560 nm and a dominant wavelength near 570 nm.
- the YAG phosphor activated with Ce has a problem that the fluorescence intensity deteriorates with increasing temperature, that is, the temperature characteristics are poor.
- the ⁇ -sialon phosphor activated by Eu has excellent temperature characteristics, and has a fluorescence peak wavelength (580 to 590 nm) ( It is known to generate fluorescence of yellow to orange (see Patent Document 1).
- the main wavelength is about 570 nm as described above, and the fluorescence temperature characteristic is good.
- ⁇ -type sialon phosphors are not known.
- An object of the present invention is to provide an oxynitride phosphor powder which is an ⁇ -sialon-based phosphor having a dominant wavelength of 565 to 577 nm and which has practically high fluorescence intensity and external quantum efficiency.
- the present inventors have Composition formula: Ca x1 Eu x2 Yb x3 Si 12- (y + z) Al (y + z) O z N 16-z (However, in the formula, 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇ 1.4, 1.
- the oxynitride phosphor powder made of ⁇ -sialon represented by 0 ⁇ y ⁇ 4.0 and 0.5 ⁇ z ⁇ 2.0) is excited by light having a wavelength of 450 nm, so that the main wavelength Found that an oxynitride phosphor powder exhibiting yellow light emission of 565 nm to 577 nm and having high fluorescence intensity and external quantum efficiency was obtained, and the present invention was achieved.
- the present invention provides a composition formula: Ca x1 Eu x2 Yb x3 Si 12- (y + z) Al (y + z) O z N 16-z (However, in the formula, 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇ 1.4, 1.
- the present invention relates to an oxynitride phosphor powder made of ⁇ -sialon represented by 0 ⁇ y ⁇ 4.0 and 0.5 ⁇ z ⁇ 2.0.
- x1, x2, x3, y, and z are 0.9 ⁇ x1 ⁇ 1.5, 0.0035 ⁇ x2 ⁇ 0.0060, 0.0040 ⁇ x3 ⁇ 0.0080, 0
- the present invention relates to an oxynitride phosphor powder satisfying .6 ⁇ x2 / x3 ⁇ 1.1, 2.0 ⁇ y ⁇ 3.0, and 1.0 ⁇ z ⁇ 1.5.
- the present invention also relates to an oxynitride phosphor powder that emits fluorescence having a dominant wavelength in the wavelength range of 565 nm to 577 nm when excited by light having a wavelength of 450 nm and has an external quantum efficiency of 41% or more.
- the present invention provides a composition formula: Ca x1 Eu x2 Yb x3 Si 12- (y + z) Al (y + z) O z N 16-z (However, in the formula, 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇ 1.4, 1. 0 ⁇ y ⁇ 4.0, 0.5 ⁇ z ⁇ 2.0), a silicon source, an aluminum source, a calcium source, a europium source, and an ytterbium source are mixed.
- the present invention relates to a method for producing an oxynitride phosphor powder.
- the silicon source is a silicon nitride powder
- the oxygen content of the silicon nitride powder is 0.2 to 0.9% by mass
- the average particle size is 1.0 to 12.0 ⁇ m.
- the present invention also relates to a method for producing an oxynitride phosphor having a specific surface area of 0.2 to 3.0 m 2 / g.
- the present invention provides a light emitting device comprising a light emitting source and a phosphor, wherein the light emitting source comprises a light emitting diode, and the phosphor uses an oxynitride phosphor powder comprising at least the ⁇ -sialon. Relates to the device.
- the composition formula Ca x1 Eu x2 Yb x3 Si 12- (y + z) Al (y + z) O z N 16-z
- the ⁇ -type sialon-based phosphor represented by 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇ 1.4, 1.0 ⁇ y ⁇ 4.
- the main wavelength is 565 nm to 577 nm when excited by light having a wavelength of 450 nm.
- an oxynitride phosphor that emits yellow fluorescent light and has high fluorescence intensity and high external quantum efficiency.
- FIG. 1 is a scanning electron micrograph showing silicon nitride powders for producing oxynitride phosphor powders of Examples 1 to 22.
- FIG. 2 is a diagram showing an excitation spectrum and a fluorescence spectrum of Example 2 and a Ce-activated YAG phosphor (P46Y3).
- FIG. 3 is a diagram showing an excitation spectrum and a fluorescence spectrum of Example 2 and Comparative Example 1.
- FIG. 4 is a cross-sectional view showing the light emitting device of the present invention.
- FIG. 5 is a cross-sectional view showing a modification of the light emitting device of the present invention.
- the present invention comprises a composition formula: Ca x1 Eu x2 Yb x3 Si 12- (y + z) Al (y + z) O z N 16-z
- ⁇ -sialon represented by: 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇ 1.4, 1.0 ⁇ y ⁇ 4.
- An oxynitride phosphor powder composed of ⁇ -sialon represented by 0, 0.5 ⁇ z ⁇ 2.0, and is excited by light having a wavelength of 450 nm, so that the main wavelength is 565 nm to 577 nm.
- the present invention relates to an oxynitride phosphor powder that emits fluorescence in the region and has high fluorescence intensity and high external quantum efficiency.
- ⁇ -type sialon is that part of Si-N bond of ⁇ -type silicon nitride is replaced by Al-N bond and Al-O bond, and Ca ions penetrate into the lattice and form a solid solution. It is a solid solution that maintains electrical neutrality.
- the Ca- ⁇ -type sialon is activated by the entry of Eu ions into the lattice and solid solution in addition to the Ca ions.
- the phosphor When excited, the phosphor emits yellow to orange fluorescence represented by the above general formula.
- General rare earth elements ⁇ type was activated sialon phosphors, as described in Patent Document 1, MeSi 12- (m + n ) Al (m + n) O n N 16-n (Me is Ca, Mg, Y, or one or more of lanthanide metals excluding La), and the metal Me has three ⁇ -sialon large unit cells containing four formula amounts of (Si, Al) 3 (N, O) 4 From 1 at a minimum to 1 at a maximum per unit cell.
- the metal element Me is divalent
- the solid solubility limit is 0.6 ⁇ m ⁇ 3.0 and 0 ⁇ n ⁇ 1.5 in the above general formula, and the metal Me is trivalent. When 0.9 ⁇ m ⁇ 4.5 and 0 ⁇ n ⁇ 1.5.
- the inventors have found that a Ca- ⁇ -type sialon-based phosphor co-activated with Eu and Yb is the same as a Ce-activated YAG phosphor. It has been found that the main wavelength, which is a light emission color of a certain degree, has a light emission color of 565 nm to 577 nm, and the light emission intensity and external quantum efficiency at that time are high.
- the oxynitride phosphor powder of the present invention has a composition formula: Ca x1 Eu x2 Yb x3 Si 12- (y + z) Al (y + z) O z N 16-z In 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇ 1.4, 1.0 ⁇ y ⁇ 4.
- the x1, x2, and x3 are values indicating the amount of Ca ions, Eu ions, and Yb ions penetrating into sialon, and when x3 is greater than 0.01, the dominant wavelength (the chromaticity of the phosphor emission is displayed). Therefore, it is known that the dominant wavelength can be used instead of the chromaticity coordinate, which is the color of the achromatic color and emission spectrum in the chromaticity diagram as described in JIS Z 7801. This is the wavelength at which the extension coordinates are connected by a straight line, and the extension line and the spectrum locus intersect. In other words, when white light and spectral monochromatic light are additively mixed, it becomes equal to the emission color of the phosphor.
- x2 is larger than 0.01, the dominant wavelength is larger than 577 nm.
- x1 is larger than 2.0, the fluorescence intensity and the external quantum efficiency are decreased.
- x2 and x3 are preferably 0.4 ⁇ x2 / x3 ⁇ 1.4.
- x2 / x3 is in this range, a highly efficient oxynitride phosphor having a dominant wavelength of 565 to 577 nm and a higher fluorescence intensity is provided.
- the y is a value determined to maintain electrical neutrality when the metal element is solid-dissolved in sialon.
- the coefficient 2 of x1 in the formula is from the valence of Ca ions dissolved in the Ca- ⁇ type sialon phosphor
- the coefficient 3 of x2 is from the valence of Eu ions dissolved in the Ca- ⁇ type sialon phosphor.
- the coefficient 3 of x3 is a numerical value given from the valence of the Yb ion dissolved in the Ca- ⁇ type sialon phosphor.
- the ranges of y and z are 1.0 ⁇ y ⁇ 4.0 and 0.5 ⁇ z ⁇ 2.0.
- the dominant wavelength is 565 to 577 nm, and an oxynitride phosphor with high fluorescence intensity is provided.
- y When y is larger than 4.0, the dominant wavelength is larger than 577 nm, and the fluorescence intensity and the external quantum efficiency are decreased. When y is smaller than 1.0, the fluorescence intensity and the external quantum efficiency are decreased. Furthermore, z is a value relating to the substitutional solid solution amount of oxygen in ⁇ -sialon. When z is larger than 2.0, the dominant wavelength is smaller than 565 nm, and the fluorescence intensity and the external quantum efficiency are decreased. Furthermore, in the range of y ⁇ 1.0 and z ⁇ 0.5, ⁇ -sialon is generated, and the fluorescence intensity is remarkably reduced.
- X1, x2, x3, y, z are 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇
- the dominant wavelength is 565 to 577 nm
- the fluorescence intensity is large
- the external quantum efficiency is as high as 41% or more.
- An efficient oxynitride phosphor is provided.
- x1, x2, x3, y, and z are 0.9 ⁇ x1 ⁇ 1.5, 0.0035 ⁇ x2 ⁇ 0.0060, 0.0040 ⁇ x3 ⁇ 0.0080, 0 .6 ⁇ x2 / x3 ⁇ 1.1, 2.0 ⁇ y ⁇ 3.0, and 1.0 ⁇ z ⁇ 1.5 are preferable.
- the main wavelength is 565 to 575 nm
- the fluorescence intensity is large
- the external quantum efficiency is 47% or more, providing a highly efficient oxynitride phosphor. Is done.
- x1, x2, x3, y, and z are 1.2 ⁇ x1 ⁇ 1.5, 0.0035 ⁇ x2 ⁇ 0.0060, 0.0050 ⁇ x3 ⁇ 0.0080, 0 More preferably, 0.7 ⁇ x2 / x3 ⁇ 1.1, 2.0 ⁇ y ⁇ 3.0, and 1.2 ⁇ z ⁇ 1.3.
- the dominant wavelength is 565 to 575 nm
- the fluorescence intensity is further increased
- the external quantum efficiency is 48% or more, which is more preferable.
- the oxynitride phosphor powder of the present invention comprises an ⁇ -type sialon crystal phase classified as a trigonal crystal when the crystal phase is identified by an X-ray diffraction (XRD) apparatus using CuK ⁇ rays.
- XRD X-ray diffraction
- an aluminum nitride crystal phase classified as a hexagonal crystal may be included, but if the aluminum nitride crystal phase is excessive, the fluorescence intensity decreases, which is not preferable.
- the amount of aluminum nitride contained is preferably 10% by mass or less, and more preferably 5% by mass or less.
- what does not contain aluminum nitride and consists only of alpha sialon is preferable.
- the crystal phase in XRD measurement can be identified using X-ray pattern analysis software.
- analysis software include PDXL manufactured by Rigaku Corporation.
- the XRD measurement of the ⁇ -type sialon phosphor powder was performed using an Rigaku X-ray diffractometer (Ultima IV IV Protectus) and analysis software (PDXL).
- D 50 which is a 50% diameter (median value on a volume basis) in the particle size distribution curve is 10.0 to 20. It is preferably 0 ⁇ m.
- D 50 is smaller than 10.0 ⁇ m and the specific surface area is larger than 0.6 m 2 / g, the emission intensity may be lowered, D 50 is larger than 20.0 ⁇ m, and the specific surface area is 0.1. If it is smaller than 2 m 2 / g, it is difficult to uniformly disperse in the resin that seals the phosphor, and the color tone of the white LED may vary.
- the oxynitride phosphor powder of the present invention after firing, is classified as it is without being pulverized or just pulverized, and D 50 is in the above range (10.0 to 20.0 ⁇ m). There is an advantage that particles can be obtained. When pulverized, the crystal structure is distorted and the light emission characteristics such as luminance are lowered.
- the particle diameter and specific surface area of the oxynitride phosphor powder of the present invention it is possible to control the particle diameter of the silicon nitride powder as a raw material.
- D 50 of the oxynitride phosphor powder is 10 to 20 ⁇ m and the specific surface area is 0.2 to 0.6 m 2. / G, which is preferable because the external quantum efficiency is further increased.
- D 50 of the oxynitride phosphor powder is a 50% diameter in a particle size distribution curve measured with a laser diffraction / scattering particle size distribution measuring apparatus.
- the specific surface area of the oxynitride phosphor powder can be measured with a flowsorb 2300 type specific surface area measuring device (BET method by nitrogen gas adsorption method) manufactured by Shimadzu Corporation.
- the oxynitride phosphor powder of the present invention can emit fluorescence having a dominant wavelength in the wavelength range of 565 nm to 577 nm by excitation of light in the wavelength range of 450 nm, and the fluorescence intensity at that time is good.
- long-wave yellow fluorescence can be efficiently obtained by blue excitation light, and color rendering properties are good in combination with blue light used as excitation light.
- White light can be obtained efficiently.
- Fluorescence characteristics can be measured with a fluorescence spectrophotometer (FP6500) manufactured by JASCO Corporation. Although the fluorescence spectrum can be corrected using a sub-standard light source, the fluorescence peak wavelength may slightly vary depending on the measurement equipment used and the correction conditions.
- the external quantum efficiency can be calculated from the product of the absorption rate and the internal quantum efficiency measured by a solid state quantum efficiency measuring device combining an integrating sphere with FP6500 manufactured by JASCO Corporation.
- the fluorescence dominant wavelength and the chromaticity coordinates (Cx, Cy) can be measured by using color analysis software provided in the fluorescence spectrophotometer.
- the absorptance is a value indicating how much of the irradiated excitation light is absorbed by the sample
- the internal quantum efficiency is a conversion when the absorbed light is converted into light emitted as fluorescence. Efficiency (number of photons emitted as fluorescence / number of photons absorbed by the sample) is called internal quantum efficiency.
- the fluorescence peak wavelength and the fluorescence intensity at that wavelength were derived from the obtained fluorescence spectrum.
- the relative fluorescence intensity as an index of luminance is the fluorescence peak wavelength when the value of the maximum intensity of the emission spectrum by the same excitation wavelength of a commercially available YAG: Ce-based phosphor (P46Y3 manufactured by Kasei Optonix) is 100%. The relative value of emission intensity was used.
- the oxynitride phosphor powder of the present invention can be used in various lighting devices as a light emitting device in combination with a known light emitting source such as a light emitting diode.
- an emission source having a peak wavelength of excitation light in the range of 330 to 500 nm is suitable for the oxynitride phosphor powder of the present invention.
- the light emission efficiency of the oxynitride phosphor powder is high, and a light emitting element with good performance can be configured.
- the luminous efficiency is high even with a blue light source, and a good light-white to daylight light-emitting element can be constituted by a combination of yellow to orange fluorescence of the oxynitride phosphor powder of the present invention and blue excitation light.
- the object color of the oxynitride phosphor powder of the present invention is yellow to orange, it can be used as an alternative material for pigments containing heavy metals such as iron oxide, iron, copper, manganese, chromium, etc. Can be applied to. Furthermore, it can be used for a wide range of applications as an ultraviolet and visible light absorbing material.
- the oxynitride phosphor powder of the present invention has a composition formula: Ca x1 Eu x2 Yb x3 Si 12- (y + z) Al (y + z) O z N 16-z 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, 0.4 ⁇ x2 / x3 ⁇ 1.4, 1.0 ⁇ y ⁇ 4.0, 0.5 ⁇ z ⁇ 2.0
- a mixture of a silicon source, an aluminum source, a calcium source, a europium source, and an ytterbium source so as to have an inert gas atmosphere It is obtained by firing at a temperature range of 1500 to 2000 ° C.
- the obtained fired product is further heat-treated at 1100 to 1600 ° C. in an inert gas atmosphere.
- the raw silicon source is selected from silicon nitride, oxynitride, oxide, or precursor material that becomes oxide by thermal decomposition.
- crystalline silicon nitride is preferable.
- an oxynitride phosphor having high luminance can be obtained.
- raw material aluminum source examples include aluminum oxide, metal aluminum, and aluminum nitride. Each of these powders may be used alone or in combination.
- the raw material calcium source is selected from calcium nitride, oxynitride, oxide, or a precursor substance that becomes oxide by thermal decomposition.
- the raw europium source is selected from a europium nitride, oxynitride, oxide, or precursor material that becomes an oxide by thermal decomposition.
- the starting ytterbium source is selected from ytterbium nitrides, oxynitrides, oxides, or precursor materials that become oxides by thermal decomposition.
- the average particle size of the silicon nitride powder as the raw material for producing the oxynitride phosphor powder of the present invention is preferably 1.0 ⁇ m or more and 12.0 ⁇ m or less. More preferably, it is 3.0 ⁇ m or more and 12.0 ⁇ m or less. If the average particle size is less than 1.0 ⁇ m, the oxygen content tends to increase, and the external quantum efficiency tends to be small. If the average particle size exceeds 12.0 ⁇ m, it is difficult to produce and practical.
- the average particle size of the silicon nitride powder was measured from a scanning electron micrograph of the silicon nitride powder.
- a circle is drawn in a scanning electron micrograph image, and for each particle in contact with the circle, the maximum circle inscribed in the particle is determined, and the diameter of the circle is defined as the particle diameter.
- the average particle diameter of the powder was calculated by taking the average of the diameters.
- the number of target measurement particles was about 50 to 150.
- the specific surface area of the silicon nitride powder is preferably 0.2 to 3.0 m 2 / g. More preferably 0.2 m 2 / g or more and 1.0 m 2 / g or less. Setting the specific surface area of the crystalline silicon nitride powder to less than 0.2 m 2 / g is difficult and impractical for manufacturing, and causes inconvenience for device fabrication. When the specific surface area exceeds 3 m 2 / g, the external quantum efficiency tends to be small, and 0.2 to 3.0 m 2 / g is preferable.
- the specific surface area was measured with a Flowsorb 2300 type specific surface area measuring device (BET method by nitrogen gas adsorption method) manufactured by Shimadzu Corporation.
- crystalline silicon nitride powder can be preferably used as the silicon nitride powder used in the production of the oxynitride phosphor powder of the present invention, and ⁇ -type silicon nitride powder is preferable.
- a crystalline silicon nitride powder and an ⁇ -type silicon nitride powder with a low oxygen content can be preferably used as the silicon nitride powder used for the production of the oxynitride phosphor powder of the present invention.
- the silicon nitride powder as a conventional phosphor material has an oxygen content of 1.0 to 2.0% by mass, and as a preferred embodiment of the present invention, the oxygen content is as low as 0.2 to 0.9% by mass.
- the oxygen content in silicon nitride is preferably 0.2 to 0.8 mass%, more preferably 0.2 to 0.4 mass%. It is difficult to produce an oxygen content of less than 0.2% by mass. When the oxygen content exceeds 0.9% by mass, the fluorescence of the oxynitride phosphor powder of the present invention is higher than that when a conventional silicon nitride powder is used. It becomes difficult to obtain a significant improvement in characteristics.
- the oxygen content was measured with an oxygen-nitrogen simultaneous analyzer manufactured by LECO.
- the silicon nitride powder that can be preferably used for producing the oxynitride phosphor powder of the present invention can be obtained by thermally decomposing a nitrogen-containing silane compound and / or an amorphous silicon nitride powder.
- the nitrogen-containing silane compound include silicon diimide (Si (NH) 2 ), silicon tetraamide, silicon nitrogen imide, and silicon chlorimide.
- Si (NH) 2 silicon diimide
- silicon tetraamide silicon nitrogen imide
- silicon chlorimide silicon chlorimide.
- the amorphous silicon nitride powder can be obtained by a known method, for example, a method in which the nitrogen-containing silane compound is thermally decomposed at a temperature in the range of 1200 ° C. to 1460 ° C. in a nitrogen or ammonia gas atmosphere. Those produced by a method of reacting silicon halide such as silicon iodide or silicon tetraiodide with ammonia at a high temperature are used.
- the average particle size of the amorphous silicon nitride powder and the nitrogen-containing silane compound is usually 0.003 to 0.05 ⁇ m.
- the nitrogen-containing silane compound and the amorphous silicon nitride powder are easily hydrolyzed and oxidized, these raw material powders are weighed in an inert gas atmosphere.
- the oxygen concentration in the nitrogen gas circulated in the heating furnace used for the thermal decomposition of the nitrogen-containing silane compound can be controlled in the range of 0 to 2.0 vol%.
- the oxygen concentration in the atmosphere during the thermal decomposition of the nitrogen-containing silane compound is regulated to, for example, 100 ppm or less, preferably 10 ppm or less, and amorphous silicon nitride powder having a low oxygen content is obtained.
- the metal impurity mixed in the amorphous silicon nitride powder is reduced to 10 ppm or less by a known method in which the friction state between the powder and the metal in the reaction vessel material and the powder handling device is improved.
- the nitrogen-containing silane compound and / or the amorphous silicon nitride powder is fired at 1300 to 1700 ° C. in a nitrogen or ammonia gas atmosphere to obtain a crystalline silicon nitride powder.
- the particle size is controlled by controlling the firing conditions (temperature and heating rate).
- the crystalline silicon nitride powder obtained in this way has large primary particles in a substantially monodispersed state and almost no aggregated particles and fused particles.
- the obtained crystalline silicon nitride powder is a high-purity powder having a metal impurity amount of 100 ppm or less.
- a low oxygen crystalline silicon nitride powder can be obtained by chemical treatment such as acid cleaning of the crystalline silicon nitride powder. In this way, the silicon nitride powder for producing an oxynitride phosphor powder having an oxygen content of 0.2 to 0.9% by mass of the present invention can be obtained.
- the silicon nitride powder obtained in this way does not require strong pulverization unlike silicon nitride produced by the direct nitridation method of metal silicon, and therefore the amount of impurities is extremely low at 100 ppm or less.
- Impurities (Al, Ca, Fe) contained in the crystalline silicon nitride powder of the present invention are preferably 100 ppm or less, and preferably 20 ppm or less because an oxynitride phosphor powder having a large external quantum efficiency can be obtained.
- the silicon nitride powder raw material having a low oxygen content can be generally preferably used for the production of the oxynitride phosphor powder of the present invention.
- x1, x2, x3, y, and z are 0.0 ⁇ x1 ⁇ 2.0, 0.0000 ⁇ x2 ⁇ 0.0100, 0.0000 ⁇ x3 ⁇ 0.0100, It is also useful in the production of oxynitride phosphor powders with 0.4 ⁇ x2 / x3 ⁇ 1.4, 1.0 ⁇ y ⁇ 4.0, and 0.5 ⁇ z ⁇ 2.0.
- the silicon nitride powder raw material has the above-mentioned low oxygen content, and the average particle diameter thereof is in the range of 1.0 ⁇ m to 12.0 ⁇ m, preferably 3.0 ⁇ m to 12.0 ⁇ m, a specific surface area of, 0.2 ⁇ 3.0m 2 / g, more preferably in the range of 0.2m 2 /g ⁇ 1.0m 2 / g.
- the oxygen content, average particle diameter, and specific surface area of the silicon nitride powder raw material are in this range, the resulting oxynitride phosphor powder is excited by light having a wavelength of 450 nm and the dominant wavelength of fluorescence emitted is 565 nm. It emits fluorescence with a wavelength of ⁇ 577 nm, and the external quantum efficiency at that time is 41% or more, which is preferable.
- the silicon nitride powder raw material having a low oxygen content is preferably such that, in the composition formula, x1, x2, x3, y, z are 0.9 ⁇ x1 ⁇ 1.5, 0.0035 ⁇ x2. ⁇ 0.0060, 0.0040 ⁇ x3 ⁇ 0.0080, 0.6 ⁇ x2 / x3 ⁇ 1.1, 2.0 ⁇ y ⁇ 3.0, 1.0 ⁇ z ⁇ 1.5 It is also useful in the production of phosphor powders.
- the silicon nitride powder raw material has the above-mentioned low oxygen content, and the average particle diameter thereof is in the range of 1.0 ⁇ m to 12.0 ⁇ m, preferably 3.0 ⁇ m to 12.0 ⁇ m, a specific surface area of, 0.2 ⁇ 3.0m 2 / g, more preferably in the range of 0.2m 2 /g ⁇ 1.0m 2 / g.
- the obtained oxynitride phosphor powder is excited by light having a wavelength of 450 nm and has a peak wavelength of fluorescence of 565. Fluorescence in the wavelength region of ⁇ 575 nm is emitted, and the external quantum efficiency at that time is 47% or more, which is preferable.
- a Li-containing compound serving as a sintering aid for the purpose of promoting sintering and generating an ⁇ -sialon crystal phase at a lower temperature.
- the Li-containing compound used include lithium oxide, lithium carbonate, metallic lithium, and lithium nitride. Each of these powders may be used alone or in combination.
- the addition amount of the Li-containing compound is suitably 0.01 to 0.5 mol as the Li element with respect to 1 mol of the oxynitride fired product.
- the method for mixing the silicon source, the aluminum source, the calcium source, the europium source, and the ytterbium source is not particularly limited, and is a method known per se, for example, a dry mixing method, and substantially each component of the raw material.
- a method of removing the solvent after wet mixing in an inert solvent that does not react with the above can be employed.
- a V-type mixer, a rocking mixer, a ball mill, a vibration mill, a medium stirring mill, or the like is preferably used.
- an acid represented by the above composition formula A fired nitride can be obtained. If it is lower than 1500 ° C., it takes a long time to produce ⁇ -sialon, which is not practical.
- silicon nitride and ⁇ -sialon are sublimated and decomposed to generate free silicon, so that an oxynitride phosphor powder with high external quantum efficiency cannot be obtained.
- the heating furnace used for firing As long as firing in the range of 1500 to 2000 ° C. is possible in an inert gas atmosphere.
- a batch type electric furnace, a rotary kiln, a fluidized firing furnace, a pusher type electric furnace, or the like by a high frequency induction heating method or a resistance heating method can be used.
- a BN crucible, a silicon nitride crucible, a graphite crucible, or a silicon carbide crucible can be used as the crucible for filling the mixture.
- the fired oxynitride obtained by firing is a powder with less aggregation and good dispersibility.
- the oxynitride fired product obtained by the above firing may be further heat-treated.
- the obtained oxynitride fired product is heat-treated in a temperature range of 1100 to 1600 ° C. in an inert gas atmosphere or a reducing gas atmosphere, and is excited by light having a wavelength of 450 nm. It is possible to obtain an oxynitride phosphor powder having a particularly high external quantum efficiency when emitting fluorescence having a wavelength of 565 nm to 577 nm.
- the heat treatment temperature is preferably in the range of 1500 to 1600 ° C. When the heat treatment temperature is less than 1100 ° C.
- the holding time at the maximum temperature when the heat treatment is performed is preferably 0.5 hours or more. Even if the heat treatment is performed for more than 4 hours, the improvement of the external quantum efficiency with the extension of the time remains little or hardly changes. Therefore, the holding time at the maximum temperature when performing the heat treatment is 0.5. It is preferably in the range of 4 hours.
- the heating furnace used for the heat treatment is not particularly limited.
- a batch type electric furnace, a rotary kiln, a fluidized firing furnace, a pusher type electric furnace, or the like by a high frequency induction heating method or a resistance heating method can be used.
- a BN crucible, a silicon nitride crucible, a graphite crucible, a silicon carbide crucible, or an alumina crucible can be used.
- a preferred embodiment of the oxynitride phosphor powder of the present invention is a phosphor powder obtained by the production method described above, and more specifically, a silicon source, an aluminum source, a calcium source, a europium source, and ytterbium.
- the composition formula is obtained by mixing with a source, firing in an inert gas atmosphere at a temperature range of 1500 to 2000 ° C., and then heat-treating in an inert gas atmosphere at a temperature range of 1100 to 1600 ° C.
- the light emitting device examples include a lighting device such as a fluorescent lamp and a display device such as a display.
- a semiconductor light emitting element (light emitting diode) is used as an excitation light source for the wavelength conversion member.
- a light emitting diode that emits visible light
- a light emitting diode that emits near ultraviolet light or deep ultraviolet light can be used as the light emitting element.
- FIG. 4 shows a surface-mounted light-emitting device 1 as one embodiment of the present invention.
- FIG. 4 shows a cross-sectional view of the light emitting device.
- the light emitting element 1 may be a blue light emitting nitride light emitting diode or a near ultraviolet light emitting nitride light emitting diode.
- a blue light emitting diode will be described as an example.
- the light emitting element 1 uses a nitride semiconductor light emitting element having an InGaN semiconductor having an emission peak wavelength of about 460 nm as a light emitting layer.
- An electrode (not shown) formed on the light emitting element 1 and a lead electrode 3 provided on the package 2 are connected by a bonding wire 4 made of Au or the like.
- the phosphor layer 11 can be formed by dispersing the oxynitride phosphor 12 of the present invention in a resin layer made of, for example, a silicone resin at a ratio of 5 wt% to 50 wt%.
- a resin to be used an epoxy resin or a fluorine resin can be used in addition to the silicone resin.
- the phosphor layer 11 can be formed thinly and uniformly on the light emitting diode by using a method such as potting or screen printing. If the phosphor layer 11 is too thick, the phosphor particles overlap each other, which is not preferable because it causes a deviation from the target chromaticity and a decrease in light emission efficiency.
- a phosphor that emits red or green light by blue excitation light may be added to the phosphor layer 11 in order to improve color rendering and color reproducibility. .
- FIG. 5 is a cross-sectional view showing an embodiment different from FIG. FIG. 5 is different from the phosphor layer in that the phosphor sheet 13 is placed away from the light emitting diode 1 instead of the phosphor layer.
- the phosphor sheet 13 can be formed by dispersing the oxynitride phosphor 12 of the present invention in a resin layer sheet made of, for example, a silicone resin at a ratio of 5 wt% to 50 wt%.
- a resin to be used an epoxy resin or a fluorine resin can be used in addition to the silicone resin. Since the phosphor sheet 13 is disposed away from the light emitting diode 1, it is preferable because variation due to the location of light emission can be reduced.
- Example 1 Silicon nitride, europium oxide, ytterbium oxide, aluminum nitride and calcium carbonate are weighed in a glove box purged with nitrogen so as to have the oxynitride composition shown in Table 1, and mixed using a dry vibration mill. A mixed powder was obtained. The specific surface area and average particle diameter of the silicon nitride powder were 0.3 m 2 / g and 8.0 ⁇ m, respectively. The obtained mixed powder was put in a crucible made of BN, charged into a graphite resistance heating type atmospheric pressure firing furnace, nitrogen was introduced into the firing furnace, and maintained at a pressure of 0.8 MPa at 1800 ° C. Was raised to 1800 ° C. for 2 hours to obtain a fired oxynitride.
- the obtained oxynitride fired product was crushed to obtain a powder having a particle size of 5 to 20 ⁇ m by classification, and the obtained powder was put into an alumina crucible and charged into a graphite resistance heating type electric furnace. While flowing nitrogen through the furnace, the temperature was raised to 1600 ° C. while maintaining normal pressure, and then kept at 1600 ° C. for 1 hour to obtain an oxynitride phosphor of the present invention.
- a fluorescence spectrum at an excitation wavelength of 450 nm was measured using a solid-state quantum efficiency measurement device combining an integrating sphere with FP-6500 manufactured by JASCO Corporation, At the same time, the absorption rate and internal quantum efficiency were measured.
- the fluorescence peak wavelength and the emission intensity at that wavelength were derived from the obtained fluorescence spectrum, and the external quantum efficiency was calculated from the absorptance and the internal quantum efficiency. Further, the chromaticity coordinates (Cx, Cy) and the dominant wavelength were obtained using color analysis software provided in the measuring apparatus.
- the relative fluorescence intensity serving as a luminance index is the fluorescence peak when the maximum intensity value of the fluorescence spectrum at the same excitation wavelength of a commercially available YAG: Ce-based phosphor (P46Y3 manufactured by Kasei Optonix) is 100%.
- the relative value of the fluorescence intensity at the wavelength was used.
- Table 2 shows the evaluation results of the fluorescence characteristics of the oxynitride phosphor powder according to Example 1.
- Example 2 The oxynitride phosphor powder was prepared in the same manner as in Example 1 except that the raw material powders according to Examples 2 to 22 were weighed and mixed so that the oxynitride phosphor powder had the design composition shown in Table 1. Obtained.
- the fluorescence characteristics of the obtained oxynitride phosphor powder were measured by the same method as in Example 1. The results are shown in Table 2. Further, FIG. 2 shows the excitation and fluorescence spectra of Example 2 and a commercially available YAG: Ce-based phosphor (P46Y3 manufactured by Kasei Optonics). As is clear from FIG.
- the Ca- ⁇ type sialon-based oxynitride phosphor containing both Yb and Eu as activators has a fluorescence having a dominant wavelength of about 570 nm and a large relative fluorescence intensity. The spectrum is shown.
- the emission wavelength is shifted to the lower wavelength side, and an oxynitride phosphor showing a fluorescence spectrum with a dominant wavelength of about 569.7 nm is obtained.
- the dominant wavelength is 585.9 nm, which shows a fluorescence spectrum that is greatly shifted to the longer wavelength side.
- Example 31 An oxynitride phosphor powder was obtained in the same manner as in Example 3 except that the oxygen concentration of the raw material silicon nitride powder was changed to 0.75% by mass.
- the fluorescence characteristics of the obtained oxynitride phosphor powder were measured by the same method as in Example 1. The results are shown in Table 3.
- the external quantum efficiency of Example 31 in which the oxygen content is 0.75 mass% is: It turns out that it has become small with 47.2%.
- Examples 32 to 37 The oxynitride phosphor powder was obtained in the same manner as in Example 3, except that the silicon nitride powder whose specific surface area, average particle diameter, and oxygen content of the raw material silicon nitride powder were listed in Table 3 was used. .
- the fluorescence characteristics of the obtained oxynitride phosphor powder were measured by the same method as in Example 3. The results are shown in Table 3. From Table 3, the silicon nitride powder has an oxygen content of 0.2 to 0.9 mass%, an average particle size of 1.0 to 12.0 ⁇ m, and a specific surface area of 0.2 to 3.0 m 2 / g or less. In particular, it can be seen that the external quantum efficiency is increased.
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Abstract
Description
組成式:
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
(ただし、式中、0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0)で表される、α型サイアロンからなる酸窒化物蛍光体粉末は、450nmの波長の光により励起されることで、主波長が565nmから577nmの黄色発光を示し、高い蛍光強度と外部量子効率を有する酸窒化物蛍光体粉末が得られることを見出し、本発明に至った。
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
(ただし、式中、0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0)で表されるα型サイアロンからなる酸窒化物蛍光体粉末に関する。
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
(ただし、式中、0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0)で表される組成となるように、ケイ素源と、アルミニウム源と、カルシウム源と、ユーロピウム源と、イッテリビウム源とを混合し、不活性ガス雰囲気中、1500~2000℃の温度範囲で焼成することにより、前記一般式で表される酸窒化物焼成物を得る第1工程と、
前記酸窒化物焼成物を、不活性ガス雰囲気中、1100~1600℃の温度範囲で熱処理する第2工程と、
を有することを特徴とする酸窒化物蛍光体粉末の製造方法に関する。
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
で表されるα型サイアロン系蛍光体において、
0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0で表される、α型サイアロンからなる酸窒化物蛍光体粉末とすることにより、450nmの波長の光により励起されることで、主波長が565nmから577nmの黄色の蛍光を発し、その際の蛍光強度及び外部量子効率が高い酸窒化物蛍光体が提供される。
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
で表されるα型サイアロンからなる酸窒化物蛍光体において、
0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0で表される、α型サイアロンからなる酸窒化物蛍光体粉末であり、450nmの波長の光により励起されることで、主波長が565nmから577nmの波長域の蛍光を発し、その際の蛍光強度と外部量子効率が高い酸窒化物蛍光体粉末に関するものである。
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
において、
0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0で表される、α型サイアロンからなる酸窒化物蛍光体粉末である。
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
において、0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0で表される組成となるように、ケイ素源と、アルミニウム源と、カルシウム源と、ユーロピウム源と、イッテリビウム源とを混合し、不活性ガス雰囲気中、1500~2000℃の温度範囲で焼成することにより得られる。好ましくは、得られた焼成物を、さらに、不活性ガス雰囲気中、1100~1600℃の温度範囲で熱処理する。
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
において、
0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0で表される酸窒化物蛍光体粉末である。
窒化ケイ素と酸化ユウロピウム、酸化イッテリビウム、窒化アルミニウム、炭酸カルシウムを、表1の酸窒化物の設計組成となるように窒素パージされたグローブボックス内で秤量し、乾式の振動ミルを用いて混合して、混合粉末を得た。窒化ケイ素粉末の比表面積及び平均粒子径は、それぞれ、0.3m2/g、8.0μmであった。得られた混合粉末をBN製の坩堝に入れて、黒鉛抵抗加熱式の雰囲気式加圧焼成炉に仕込み、焼成炉内に窒素を導入し、0.8MPaの圧力を保った状態で、1800℃まで昇温した後、1800℃で2時間保持して、酸窒化物焼成物を得た。
酸窒化物蛍光体粉末が表1の設計組成になるように、実施例2~22に係る原料粉末を秤量し混合したこと以外は、実施例1と同様の方法で酸窒化物蛍光体粉末を得た。得られた酸窒化物蛍光体粉末の蛍光特性を実施例1と同様の方法で測定した。その結果を、表2に記載した。また、実施例2及び市販品のYAG:Ce系蛍光体(化成オプトニクス社製P46Y3)の励起及び蛍光スペクトルを図2に示している。図2より明らかなように、賦活剤としてYbとEuを共に含んだCa-α型サイアロン系酸窒化物蛍光体は、従来得られなかった、主波長が570nm程度で、相対蛍光強度の大きな蛍光スペクトルを示す。
酸窒化物蛍光体粉末が表1の設計組成になるように、比較例1~13に係る原料粉末を秤量し混合したこと以外は、実施例1と同様の方法で酸窒化物蛍光体粉末を得た。得られた酸窒化物蛍光体粉末の蛍光特性を実施例1と同様の方法で測定した。その結果を、表2に記載した。また、比較例1および実施例2の励起スペクトル及び蛍光スペクトルを図3に示している。図3より明らかなように、賦活剤としてYbとEuを共に含むことにより、発光波長は低波長側へシフトし、主波長が569.7nm程度の蛍光スペクトルを示す酸窒化物蛍光体が得られる。一方、賦活剤としてEuのみを含んだ場合には、主波長が585.9nmと、大きく長波長側にシフトした蛍光スペクトルを示す。
原料の窒化ケイ素粉末の酸素濃度を、0.75質量%とした以外は、実施例3と同様の方法で酸窒化物蛍光体粉末を得た。得られた酸窒化物蛍光体粉末の蛍光特性を実施例1と同様の方法で測定した。その結果を、表3に記載した。窒化ケイ素粉末の酸素量が0.29質量%である実施例3の熱処理後の外部量子効率47.8%対して、酸素量が0.75質量%である実施例31の外部量子効率は、47.2%と小さくなっていることが分かる。
原料の窒化ケイ素粉末の比表面積、平均粒子径、酸素量が表3に記載されている窒化ケイ素粉末を用いたこと以外は、実施例3と同様の方法で酸窒化物蛍光体粉末を得た。得られた酸窒化物蛍光体粉末の蛍光特性を実施例3と同様の方法で測定した。その結果を、表3に記載した。表3より、窒化ケイ素粉末の酸素含有量が0.2~0.9質量%で、平均粒子径が1.0~12.0μmで、比表面積が0.2~3.0m2/g以下である場合に、特に、外部量子効率が大きくなっていることが分かる。
2 パッケージ
3 リード電極
4 ボンディングワイヤ
11 蛍光体層
12 酸窒化物蛍光体
13 蛍光体シート
Claims (6)
- 組成式:
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
(ただし、式中、0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0)で表される、α型サイアロンからなる酸窒化物蛍光体粉末。 - 前記x1、x2、x3、y、zは、0.9<x1≦1.5、0.0035≦x2≦0.0060、0.0040≦x3≦0.0080、0.6≦x2/x3≦1.1、2.0≦y≦3.0、1.0≦z≦1.5であることを特徴とする請求項1記載の酸窒化物蛍光体粉末。
- 450nmの波長の光により励起されることで、主波長が565nm~577nmとなる蛍光を発し、外部量子効率が41%以上であることを特徴とする請求項1または2記載の酸窒化物蛍光体粉末。
- 組成式:
Cax1Eux2Ybx3Si12-(y+z)Al(y+z)OzN16-z
(ただし、式中、0.0<x1≦2.0、0.0000<x2≦0.0100、0.0000<x3≦0.0100、0.4≦x2/x3≦1.4、1.0≦y≦4.0、0.5≦z≦2.0)
で表される組成となるように、ケイ素源と、アルミニウム源と、カルシウム源と、ユーロピウム源と、イッテリビウム源とを混合し、不活性ガス雰囲気中、1500~2000℃の温度範囲で焼成することにより、前記一般式で表される酸窒化物焼成物を得る第1工程と、
前記酸窒化物焼成物を、不活性ガス雰囲気中、1100~1600℃の温度範囲で熱処理する第2工程と、
を有することを特徴とする、請求項1~3のいずれか一項に記載の酸窒化物蛍光体粉末の製造方法。 - 前記ケイ素源が窒化ケイ素粉末であり、前記窒化ケイ素粉末の酸素含有量が0.2~0.9質量%であり、平均粒子径が1.0~12.0μmであり、比表面積が0.2~3.0m2/gであることを特徴とする請求項4に記載の酸窒化物蛍光体粉末の製造方法。
- 発光源と蛍光体を備えた発光装置において、発光源が発光ダイオードからなり、蛍光体が少なくとも請求項1~3のいずれか一項に記載されている酸窒化物蛍光体粉末を用いることを特徴とする発光装置。
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