WO2014192252A1 - Système de refroidissement et procédé de refroidissement - Google Patents

Système de refroidissement et procédé de refroidissement Download PDF

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Publication number
WO2014192252A1
WO2014192252A1 PCT/JP2014/002663 JP2014002663W WO2014192252A1 WO 2014192252 A1 WO2014192252 A1 WO 2014192252A1 JP 2014002663 W JP2014002663 W JP 2014002663W WO 2014192252 A1 WO2014192252 A1 WO 2014192252A1
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WO
WIPO (PCT)
Prior art keywords
refrigerant
heat exchanger
heat
cooling system
evaporators
Prior art date
Application number
PCT/JP2014/002663
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English (en)
Japanese (ja)
Inventor
吉川　実
暁 小路口
正樹 千葉
賢一 稲葉
有仁 松永
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日本電気株式会社
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Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP2015519629A priority Critical patent/JP6344385B2/ja
Publication of WO2014192252A1 publication Critical patent/WO2014192252A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices

Definitions

  • the present invention relates to a cooling system and a cooling method, and more particularly, to a cooling system that dissipates exhaust heat of a plurality of electronic devices whose loads vary by circulation of a refrigerant.
  • a method of transporting the exhaust heat of the electronic device directly to the outside and radiating it to the outside air there are a method of transporting exhaust heat.
  • a method of transporting exhaust heat there are a method of circulating cold water, a method of using a phase change phenomenon of a refrigerant, and the like.
  • the method using the phase change phenomenon of the refrigerant the movement of latent heat when the refrigerant undergoes phase change is utilized by the cycle of vaporization and condensation of the refrigerant. Therefore, the method using the phase change phenomenon of the refrigerant is expected as a cooling system for a data center or the like because the amount of heat transfer is larger than the method of circulating cold water.
  • FIG. 8 is a schematic diagram showing the configuration of a cooling system for an electronic device related to Patent Document 1.
  • the electronic apparatus cooling system 10 illustrated in FIG. 8 includes a plurality of local cooling units 22 and a single refrigerant condenser 26 provided on the building.
  • Each local cooling unit 22 includes an evaporator 18 and a fan 20 provided in a plurality of server racks 16 that accommodate a plurality of servers 14 in the building.
  • the plurality of evaporators 18 are branched and connected by the refrigerant condenser 26 and the pipes 32 and 34 to form a secondary side cooling system 28 in which the refrigerant naturally circulates.
  • the refrigerant condenser 26 is connected to the refrigerator 40 provided on the building by pipes 42 and 44 to form a primary cooling system for cooling the refrigerant. Furthermore, the pipes 32 and 34 of the secondary side cooling system 28 are provided with a valve 54 for adjusting the supply flow rate of the refrigerant and a flow rate control unit 56 for controlling the opening degree of the valve. On the other hand, the pipings 42 and 44 of the primary side cooling system are provided with a circulation pump 46.
  • the air sent from the fan 20 is heated by exhaust heat from the server 14, and the heated hot air and the refrigerant flowing through the evaporator 18 directly exchange heat to cool the server 14. Then, the refrigerant vaporized by the high heat exchanges heat with the cold water flowing through the primary side cooling system in the refrigerant condenser 26, thereby discharging the heat to the outside of the building.
  • the supply amount of the refrigerant in the secondary side cooling system is controlled by the valve 54, and the air volume of the fan 20 is adjusted. Thereby, the energy consumption of the whole cooling system can be controlled.
  • the refrigerant changes phase from liquid to gas
  • the volume of the refrigerant increases, so that the internal pressure of the refrigerant circulation system increases, and the boiling point of the refrigerant rises accordingly.
  • the boiling point of the refrigerant greatly increases due to heat generated from the high-load server 14.
  • the temperature difference between the temperature of exhaust heat from the low-load server 14 and the boiling point of the refrigerant is reduced, and the amount of heat exchange is reduced.
  • the phase change does not occur, and the cooling performance of the cooling system 10 decreases.
  • the temperature of the cooler is monitored using the temperature sensor 52, and the air flow rate of the fan 20 and the refrigerant amount are changed according to the processing load of each server 14. Control the supply flow rate. In this case, the configuration of the entire cooling system becomes complicated.
  • the present invention has been made in view of the above problems, and in a cooling system and a cooling method for cooling a plurality of electronic devices by a phase change of a refrigerant, the cooling performance can be maintained even when the loads on the electronic devices are uneven.
  • An object of the present invention is to provide a cooling system and a cooling method with a simple configuration.
  • the cooling system of the present invention includes a plurality of evaporators that store a first refrigerant, a plurality of heat exchangers that are respectively disposed above the plurality of evaporators, and a corresponding evaporator and heat exchanger. Circulating the first refrigerant and cooling the first refrigerant through the second refrigerant in the plurality of first pipes constituting the first refrigerant circulation system independent for each evaporator and the plurality of heat exchangers An external heat exchanger, and a second pipe that circulates the second refrigerant between the external heat exchanger and the plurality of heat exchangers to constitute a second refrigerant circulation system.
  • the cooling method of the present invention uses a plurality of evaporators that store the first refrigerant, receives heat from a plurality of objects to be cooled, vaporizes the first refrigerant, and is disposed above the plurality of evaporators.
  • the plurality of heat exchangers are used to dissipate heat from the vaporized first refrigerant so that the first refrigerant is condensed and liquefied, and the condensed and liquefied first refrigerant is recirculated to the plurality of evaporators, respectively.
  • the amount of heat radiated from the first refrigerant is received by the second refrigerant, the second refrigerant flows to the external heat exchanger, and the amount of heat of the second refrigerant is released in the external heat exchanger. And then cooling the second refrigerant back to the heat exchanger.
  • the cooling performance can be maintained even with a non-uniform load on the electronic devices with a simple configuration.
  • FIG. 1 shows a schematic configuration diagram of a cooling system according to the first embodiment of the present invention.
  • the cooling system 100 includes a plurality of evaporators 104, a plurality of heat exchangers 302, an external heat exchanger 303 that cools the first refrigerant through the second refrigerant in the plurality of heat exchangers 302, and a plurality of first heat exchangers 302.
  • a pipe 200 and a second pipe 300 are provided.
  • Each of the plurality of evaporators 104 stores the first refrigerant.
  • Each of the plurality of heat exchangers 302 is disposed above the corresponding evaporator 104.
  • Each of the plurality of first pipes 200 constitutes a first refrigerant circulation system independent for each of the evaporator 104 and the heat exchanger 302, and the first refrigerant is connected between the evaporator 104 and the corresponding heat exchanger 302. Circulate.
  • the second pipe 300 constitutes a second refrigerant circulation system together with the external heat exchanger 303 and the plurality of heat exchangers 302, and the second refrigerant is interposed between the external heat exchanger 303 and the plurality of heat exchangers 302. Circulate.
  • the first refrigerant circulation system is configured independently for each electronic device 102 that is a cooling target. Therefore, the cooling performance can be maintained without adjusting the flow rate of the refrigerant even if the load of the electronic device apparatus 102 becomes uneven. Furthermore, since each heat exchanger 302 is cooled by the second refrigerant circulation system, the entire cooling system can be simplified.
  • FIG. 2 is a schematic configuration diagram of another cooling system according to the present embodiment.
  • the cooling system 110 cools a plurality of electronic device apparatuses 102 such as servers and network devices installed in the server room 101, for example.
  • the electronic device apparatus 102 is mounted on a plurality of racks 103.
  • Each rack 103 is provided with an evaporator 104.
  • the evaporator 104 is connected to a heat exchanger 302 disposed above the evaporator 104 outside the server room 101 by a steam pipe 201 and a liquid pipe 202.
  • the evaporator 104, the heat exchanger 302, and the piping constitute a first refrigerant circulation system.
  • the first refrigerant is injected into the evaporator 104.
  • the evaporator 104 is maintained at the saturated vapor pressure of the first refrigerant by evacuating the first refrigerant after being injected.
  • a low boiling point refrigerant such as hydrofluorocarbon or hydrofluoroether can be used.
  • the electronic device apparatus 102 generates heat when a load such as data processing is applied, and discharges heat into the rack 103. This exhaust heat is transmitted to the evaporator 104 installed in the rack 103, and the first refrigerant in the evaporator 104 changes phase from liquid to gas.
  • the first refrigerant that has become gas rises up the steam pipe 201 by buoyancy and flows into the heat exchanger 302.
  • the first refrigerant is cooled and condensed by exchanging heat with a second refrigerant, which is another refrigerant, and becomes a liquid.
  • the first refrigerant that has become liquid returns to the evaporator 104 through the liquid pipe 202.
  • the first refrigerant circulates without using a driving source such as a pump by using buoyancy in the case of gas and gravity in the case of liquid.
  • the first refrigerant circulation system constitutes an independent circulation system for each rack 103.
  • the volume of the first refrigerant increases, the internal pressure of the first refrigerant circulation system increases, and the boiling point of the first refrigerant rises, The boiling point of the first refrigerant circulating through the other racks 103 is not affected.
  • coolant circulation system is comprised for every rack 103, each flow path length can be made comparatively short. Therefore, the influence of the increase in the boiling point of the refrigerant due to the flow path resistance can be reduced.
  • the cooling system 110 further includes an external heat exchanger 303, a tank 304, and a pump 301 outside the server room 101.
  • a plurality of heat exchangers 302 are connected in parallel by the second pipe 300 to constitute a second refrigerant circulation system.
  • parallel refers to a configuration in which the second refrigerant flowing from the external heat exchanger 303 once branches and passes through the plurality of heat exchangers 302, and then merges again and flows into the external heat exchanger 303. .
  • a refrigerant that can receive heat from the first refrigerant as latent heat and condense the first refrigerant is used.
  • a low-boiling point refrigerant such as hydrofluorocarbon or hydrofluoroether can be used.
  • the liquid amount of the second refrigerant depends on the latent heat of the refrigerant to be used, even when the electronic device 102 is at the maximum load, that is, at the maximum heat generation, all of the second refrigerant in the second refrigerant circulation system. It is set so that the liquid phase second refrigerant can be continuously supplied to the heat exchanger 302 without being vaporized.
  • the second refrigerant circulation system is common to all racks 103. That is, the configuration includes one external heat exchanger 303, one tank 304, and one pump 301, which can save space.
  • FIG. 3 shows a cross-sectional view of the tank 304 used in the cooling system 110 of the present embodiment.
  • “Max” in the figure is the refrigerant height when the amount of the second refrigerant in the tank 304 is the largest.
  • the tank 304 uses the total amount of the second refrigerant even when the amount of the second refrigerant in the tank 304 is the largest, that is, when all the electronic device devices 102 are not operating. It has a capacity that can be accommodated.
  • Min in the figure is the refrigerant height when the amount of the second refrigerant in the tank 304 is the smallest. As shown in FIG. 3, in the tank 304, when the amount of the second refrigerant in the tank 304 is the smallest, that is, all the electronic device devices 102 operate at the maximum load, and the second refrigerant is most vaporized. Even in such a case, the liquid phase refrigerant has a size and shape so as to be immersed in a pipe provided under the tank 304.
  • the tank 304 functions as a buffer. Therefore, it is possible to suppress an increase in internal pressure of the entire second refrigerant circulation system.
  • FIG. 4A is a perspective view of a heat exchanger 302 used in the cooling system according to the embodiment of the present invention
  • FIG. 4B is a cross-sectional view thereof.
  • the second refrigerant inlet 321 into which the second refrigerant flows is lower in the vertical direction, and the second refrigerant outlet 322 from which the second refrigerant flows out is on the upper side in the vertical direction.
  • the first refrigerant inlet 323 into which the first refrigerant flows is connected to the upper side, and the first refrigerant outlet 324 from which the first refrigerant flows out is connected to the lower side.
  • the first refrigerant can use gravity for circulation of the flow path after the phase change from gas to liquid.
  • the second refrigerant that has received the amount of heat from the first refrigerant and has undergone a phase change from the liquid phase to the gas phase can use buoyancy for circulation of the flow path.
  • the cross-sectional area of the second refrigerant flow path 411 indicated by the solid arrow in FIG. 4B is greater than the cross-sectional area of the first refrigerant flow path 412 indicated by the dotted arrow.
  • FIG. 5 is a sectional view showing an example of the connection configuration of the second refrigerant circulation system according to the present embodiment.
  • the tank connection pipe 312 connecting the tank 304 and the external heat exchanger 303 can be applied with a configuration in which the inner diameter is increased or a configuration in which the pipe length is increased. With such a configuration, the volume of the tank connection pipe 312 can be increased to accommodate a part of the second refrigerant, and the volume of the tank 304 can be reduced.
  • the first refrigerant undergoes a phase change from a liquid to a gas in the evaporator 104 due to the exhaust heat of the electronic device apparatus 102, and moves to the heat exchanger 302 disposed on the outer upper side of the server room 101 by buoyancy. .
  • heat exchanger 302 heat is transferred from the first refrigerant to the second refrigerant.
  • heat exchange in the heat exchanger 302 is heat exchange by latent heat, and the first refrigerant is condensed by the heat exchange, while a part of the second refrigerant is vaporized.
  • the condensed first refrigerant returns to the lower evaporator 104 through the liquid pipe 202.
  • the second refrigerant flows into the external heat exchanger 303 as a vapor flow 403.
  • the heat of the second refrigerant is released to the outside air.
  • the second refrigerant is condensed and flows into the tank 304 as the liquid flow 401.
  • the second refrigerant stored in the tank 304 is again discharged to the heat exchangers 302 by the pump 301.
  • the exhaust heat from the electronic device apparatus 102 is discharged to the outside by the circulation of the first refrigerant and the second refrigerant.
  • the temperature rise in the server room 101 is suppressed, and the load on the air conditioner that cools the server room 101 can be reduced.
  • the tank 304 is connected to the suction port 311 of the pump 301.
  • the suction port of the pump 301 has a negative pressure, the boiling point of the refrigerant is lowered, and bubbles may be generated (cavitation). Therefore, it is desirable to provide the tank 304 above the pump suction port 311. Thereby, it is possible to prevent bubbles from entering the pump 301 and reducing the driving force.
  • FIG. 7 shows a schematic configuration diagram of the cooling system 120 according to the present embodiment.
  • the cooling system 120 has a configuration in which a plurality of heat exchangers 302 are connected in series and the second refrigerant is circulated by a pump 301.
  • the series means a configuration in which the second refrigerant flowing from the external heat exchanger 303 flows into the external heat exchanger 303 after passing through all of the plurality of heat exchangers 302.
  • the liquid amount of the second refrigerant is continuously increased without causing the second refrigerant in the second refrigerant circulation system to be completely vaporized even when the electronic device apparatus 102 generates the maximum heat.
  • the amount is set so that the liquid-phase second refrigerant can be continuously supplied.
  • the pump 301 has a driving force sufficient to supply the second refrigerant. With such a configuration, it is possible to avoid the occurrence of a dry-out phenomenon in which the second refrigerant is completely vaporized by the heat exchanger 302 on the way.
  • Each heat exchanger 302 performs heat exchange by latent heat at the time of phase change of the refrigerant.
  • the second refrigerant in the liquid stream 401 is partially vaporized when passing through the heat exchanger 302, and becomes the second refrigerant in the gas-liquid two-phase flow 402 in which the gas phase and the liquid phase are mixed.
  • a part of the liquid phase is vaporized, and after passing through the final stage heat exchanger 302, most of the liquid phase is vaporized and becomes the second refrigerant of the vapor flow 403. It flows into the external heat exchanger 303. Since the heat exchange in the heat exchanger 302 is heat exchange by latent heat, the heat exchange capability is maintained even when the temperature of the liquid second refrigerant rises on the downstream side.
  • the flow rate of the second refrigerant supplied from the pump 301 can be reduced, so that the driving power of the pump 301 can be suppressed.
  • a plurality of evaporators that store the first refrigerant, a plurality of heat exchangers respectively disposed vertically above the first evaporator, and the heat exchangers corresponding to the evaporators
  • the first refrigerant circulates between the plurality of first pipes constituting the first refrigerant circulation system independent for each evaporator and the external heat that cools the heat exchanger via the second refrigerant.
  • a cooling system comprising: an exchanger; and a second pipe that connects the external heat exchanger and the plurality of heat exchangers and constitutes a second refrigerant circulation system through which the second refrigerant circulates.
  • the first pipe includes a gas phase tube that causes the first refrigerant in a vapor phase vaporized by the evaporator to flow to the heat exchanger, and a liquid phase state that is condensed and liquefied by the heat exchanger.
  • Appendix 3 The cooling system according to appendix 1 or 2, wherein the second refrigerant circulation system has a configuration in which the plurality of heat exchangers are connected in parallel to the external exchanger.
  • Additional remark 6 The cooling system of Additional remark 5 which further has a sensing part which measures the sum total of the load of the some electronic device which is cooling object, and a control part which controls the driving force of the said pump according to the said sum total of the load .
  • the said external heat exchanger is provided with the heat exchange plate which comprises the flow path of the said 1st refrigerant
  • the cooling system according to any one of appendices 1 to 7, wherein the cross-sectional area is arranged so as to be larger than the cross-sectional area of the flow path of the first refrigerant.
  • the amount of heat radiated is received by the second refrigerant, the second refrigerant is caused to flow to the external heat exchanger, and after the amount of heat of the second refrigerant is released in the external heat exchanger, the second refrigerant A cooling method in which the refrigerant of 2 is refluxed to the heat exchanger.
  • the present invention can be applied to an application for reducing air-conditioning power when a plurality of racks are mounted as in a data center and the load varies.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Central Air Conditioning (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

L'invention concerne un système de refroidissement ayant une configuration simple, capable de maintenir des performances de refroidissement adéquates même dans des cas où la charge d'un dispositif électronique n'est pas uniforme; et un procédé de refroidissement. Un système de refroidissement selon la présente invention comprend : une pluralité d'évaporateurs stockant chacun un premier réfrigérant; une pluralité d'échangeurs de chaleur respectivement disposés au-dessus de la pluralité d'évaporateurs; une pluralité de premiers tuyaux qui constituent des premiers systèmes de circulation de réfrigérant, qui fonctionnent indépendamment pour des évaporateurs respectifs, chacun d'eux faisant circuler le premier réfrigérant entre un évaporateur et un échangeur de chaleur correspondants; un échangeur de chaleur externe qui refroidit le premier liquide de refroidissement de la pluralité d'échangeurs de chaleur par l'intermédiaire d'un second réfrigérant; et un second tuyau qui constitue un second système de circulation de réfrigérant qui fait circuler le second réfrigérant entre l'échangeur de chaleur extérieur et la pluralité d'échangeurs de chaleur.
PCT/JP2014/002663 2013-05-28 2014-05-21 Système de refroidissement et procédé de refroidissement WO2014192252A1 (fr)

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JP2015519629A JP6344385B2 (ja) 2013-05-28 2014-05-21 冷却システム及び冷却方法

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JP2013111946 2013-05-28
JP2013-111946 2013-05-28

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WO2014192252A1 true WO2014192252A1 (fr) 2014-12-04

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CN105611808A (zh) * 2016-03-07 2016-05-25 苏州硅果电子有限公司 一种智能驱动调速式自动化管道液体散热装置
CN105611809A (zh) * 2016-03-07 2016-05-25 苏州硅果电子有限公司 一种滤波检测管道式液体散热装置
CN105636414A (zh) * 2016-03-07 2016-06-01 苏州硅果电子有限公司 一种智能自动化管道式液体散热装置
WO2017164326A1 (fr) * 2016-03-24 2017-09-28 日本電気株式会社 Appareil de refroidissement, procédé de commande et support de stockage
EP3324716A3 (fr) * 2016-10-27 2018-08-08 Rodolfo Caciolli Système de refroidissement de composants électroniques générateurs de chaleur
EP3404337A4 (fr) * 2016-01-12 2019-01-02 Jiguang Yan Système de climatisation par rayonnement pour dispositif de production de chaleur
CN110996618A (zh) * 2019-12-10 2020-04-10 江苏南通申通机械有限公司 一种数据中心、机房的水冷型相变冷却方法及装置
KR20210061255A (ko) * 2019-11-18 2021-05-27 크로마 에이티이 인코포레이티드 전자 부하 장치 및 방열 기능을 구비한 부하 모듈
US11089719B2 (en) * 2019-08-08 2021-08-10 Changsha University Of Science And Technology Computer room heat-pipe air conditioning system with emergency cooling function and control and method thereof
US20220074626A1 (en) * 2020-09-09 2022-03-10 Fujitsu Limited Cooling device, electronic apparatus, and cooling method

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EP3404337A4 (fr) * 2016-01-12 2019-01-02 Jiguang Yan Système de climatisation par rayonnement pour dispositif de production de chaleur
CN105611809A (zh) * 2016-03-07 2016-05-25 苏州硅果电子有限公司 一种滤波检测管道式液体散热装置
CN105636414A (zh) * 2016-03-07 2016-06-01 苏州硅果电子有限公司 一种智能自动化管道式液体散热装置
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