WO2014190536A1 - 介质滤波器,收发信机及基站 - Google Patents
介质滤波器,收发信机及基站 Download PDFInfo
- Publication number
- WO2014190536A1 WO2014190536A1 PCT/CN2013/076539 CN2013076539W WO2014190536A1 WO 2014190536 A1 WO2014190536 A1 WO 2014190536A1 CN 2013076539 W CN2013076539 W CN 2013076539W WO 2014190536 A1 WO2014190536 A1 WO 2014190536A1
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- WIPO (PCT)
- Prior art keywords
- dielectric
- dielectric filter
- hole
- negative coupling
- resonators
- Prior art date
Links
- 230000008878 coupling Effects 0.000 claims abstract description 97
- 238000010168 coupling process Methods 0.000 claims abstract description 97
- 238000005859 coupling reaction Methods 0.000 claims abstract description 97
- 239000007787 solid Substances 0.000 claims abstract description 23
- 239000003989 dielectric material Substances 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 abstract description 8
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
- H01P1/2088—Integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
- H01P1/2084—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/10—Dielectric resonators
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
Definitions
- Dielectric filter Dielectric filter, transceiver and base station
- the present invention relates to a communication device component, and more particularly to a dielectric filter, a transceiver, and a base station. Background technique
- RF filters are commonly used components in communication equipment, in many different types and forms. Among them, the metal coaxial cavity filter is applied to the RF front end of the high-power wireless communication base station because of its excellent performance index (including insertion loss and power capacity).
- the distribution of wireless communication base stations is becoming more and more dense, and the volume requirements of base stations are getting smaller and smaller.
- the volume of the RF front-end filter modules in the base stations is relatively large. Therefore, for the filter Volume requirements are also getting smaller and smaller.
- the volume of the metal coaxial cavity filter it is found that the smaller the volume of the filter, the larger the surface current, the greater the loss, and the lower the power withstand capability, that is, the smaller the power capacity. That is to say, as the volume of the metal coaxial cavity filter decreases, its performance index deteriorates.
- a miniaturized filter in which a body made of a solid dielectric material is used and metallized on the surface of the body (for example, silver plating) to form a resonator (abbreviation: solid dielectric resonator).
- a plurality of resonators and coupling between the respective resonators form a filter (abbreviation: solid dielectric filter).
- the coupling between the respective resonators can be divided into positive coupling (also referred to as inductive coupling) and negative coupling (also referred to as capacitive coupling) according to polarity. Based on the coupling polarity between the individual resonators, a transmission zero can be formed.
- the transmission zero point refers to a frequency point outside the passband of the filter, at which the suppression degree of the signal of the filter on the frequency point is theoretically infinite, and increasing the transmission zero point can effectively enhance the near-end suppression of the filter. Capability (ie, the ability to suppress frequencies closer to the passband).
- a three-cavity filter the coupling between resonators 1 and 2, 2 and 3, 1 and 3 is positively coupled, forming a transmission zero on the right side of the passband, and if resonators 1 and 2, 2 and 3 The coupling between them is positive coupling, and the coupling between 1 and 3 is negative coupling, then the transmission zero is on the left side of the passband.
- the structure shown in Figures la and lb is currently used in a solid dielectric filter: a structure that is at least surface metallized
- the member 10 is connected between two solid dielectric resonators 11 and 12, the two solid dielectric resonators are separated by a groove 13, and the resonator 11 and the structural member 10 are coupled by an electric field to form a current on the structural member 10.
- Embodiments of the present invention provide a dielectric filter that solves the problem that existing solid dielectric filters are difficult to achieve capacitive coupling.
- the present invention provides a dielectric filter comprising at least two dielectric resonators, each dielectric resonator comprising a body made of a solid dielectric material and a debug hole on a surface of the body, the debug hole being a blind hole for debugging the resonant frequency of the dielectric resonator in which it is located; the body of all the dielectric resonators included in the dielectric filter constitutes a body of the dielectric filter, and the dielectric filter further includes:
- each negative coupling hole is located at a surface of the body of the two dielectric resonator connection positions, where the position is opposite to the two dielectric resonators, and the negative coupling hole is a blind hole for Achieving capacitive coupling between the two dielectric resonators;
- the depth of the negative coupling hole is twice or more than twice the depth of the debug hole of the two dielectric resonators at which they are located.
- the depth of the negative coupling aperture is related to the frequency of the transmission zero of the dielectric filter.
- the number of negative coupling holes is equal to the number of transmission zeros of the dielectric filter.
- the two dielectric resonators at which the negative coupling holes are located are connected The frequency dependence of the transmission zero of the dielectric filter.
- the face to which the at least two dielectric resonators are connected comprises a conductive layer.
- the portion of the negative coupling hole surface is not covered by the conductive layer.
- the area of the portion of the negative coupling hole surface not covered by the conductive layer and the position where the negative coupling hole is located The amount of coupling of the capacitive coupling between the dielectric resonators is related.
- the portion of the surface of the debug hole is not covered by the conductive layer.
- the area of the portion of the debug hole surface that is not covered by the conductive layer is related to the resonant frequency of the dielectric resonator in which the debug hole is located.
- the solid dielectric material is a ceramic.
- the present invention provides a transceiver comprising the dielectric filter provided in any one of the first to tenth possible embodiments of the first aspect or the first aspect.
- the present invention provides a base station comprising the transceiver provided by the above second aspect.
- the dielectric filter, the transceiver and the base station provided by the embodiments of the present invention simplify the formation of capacitive coupling between resonators on both sides of the blind via hole by blind holes in the body made of solid dielectric material.
- Figure 1a is a cross-sectional view of a prior art solid dielectric filter for implementing a capacitive coupling structure
- Figure lb is a side view of a solid dielectric filter in the prior art for implementing a capacitive coupling structure
- Figure 2a is a cross-sectional view of a dielectric filter for implementing a capacitive coupling structure according to an embodiment of the present invention
- 2b is a side view of a dielectric filter for implementing a capacitive coupling structure according to an embodiment of the present invention
- FIG. 3 is a schematic diagram of a dielectric filter for implementing a capacitive coupling structure according to an embodiment of the present invention.
- FIG. 4 is a schematic diagram of a dielectric filter for implementing a capacitive coupling structure according to an embodiment of the present invention.
- FIG. 5 is a schematic diagram of a dielectric filter for implementing a capacitive coupling structure according to an embodiment of the present invention. detailed description
- Embodiments of the present invention provide a dielectric filter, as shown in FIGS. 2a and 2b, the dielectric filter includes at least two dielectric resonators (21, 22); each dielectric resonator (21, 22) includes a solid state a body 201 made of a dielectric material, a blind hole (202, 202) for debugging the resonant frequency on the surface of the body (referred to as a debug hole for short), and a body of all the dielectric resonators included in the dielectric filter constitutes the dielectric filter
- the medium filter further includes at least one for implementing the dielectric resonator 21 and a blind hole 23 (referred to as a negative coupling hole;) which is capacitively coupled between the dielectric resonators 22, and the negative coupling hole 23 is located on the surface of the body at the connection position of the two dielectric resonators, where the position is the same as the two
- the dielectric resonators are connected, and the dielectric filter further includes a conductive layer
- the negative coupling hole is usually located on the surface of the body between the two debugging holes.
- the negative coupling hole and the body around it form a resonator-like structure, and the negative coupling hole is similar to the debug hole of the resonator.
- the depth of the negative coupling hole is greater than the depth of the debugging holes on both sides thereof, and is usually twice or more than the depth of the debugging holes on both sides thereof, so that the resonant frequency of the resonator can be relative to the two sides thereof
- the resonant frequency of the resonator is low, usually half or less than the resonant frequency of the resonators on both sides thereof, so that a capacitive coupling can be formed between the dielectric resonator 21 and the dielectric resonator 22.
- the depth of the negative coupling hole is related to the frequency of the transmission zero of the dielectric filter.
- the depth of the negative coupling hole can be designed according to actual needs, such as the frequency of transmitting the zero point, and is not limited herein.
- the number of negative coupling holes between two dielectric resonators is one, achieving one transmission zero.
- the number of negative coupling holes on the dielectric filter can be one or more than one.
- the number and position of the negative coupling holes can be determined according to the number and frequency of transmission zeros actually needed. Between dielectric resonators). Specifically, the number of negative coupling holes is equal to the number of transmission zeros of the dielectric filter.
- the two dielectric resonators at which the negative coupling holes are located are determined according to the frequency of the transmission zero of the dielectric filter.
- the conductive layer may be a metallization layer, and may be formed by plating metal on the surface of the body.
- the metal can be silver or other metals that meet actual needs.
- the body with the debugging hole and the negative coupling hole can be obtained by integral forming, and then the surface is metallized, such as surface plating, to obtain the above dielectric filter.
- the body of the dielectric resonator included in the dielectric filter is continuous. ⁇ Using an integrated forming method to obtain a dielectric filter can make the processing process simpler.
- the surface of the dielectric resonator included in the dielectric filter may also include a conductive layer 301.
- a dielectric resonator having a portion of a debug hole and a negative coupling hole may be prepared, the dielectric resonator being composed of a body and a conductive layer, and the dielectric filter is composed of at least two The conductive layers of the dielectric resonators are connected together, and the specific connection may be soldering or sintering, etc., which may not be limited in the embodiment of the present invention.
- the negative coupling hole portion of the dielectric resonator The portion of the negative coupling hole of another dielectric resonator connected thereto constitutes a complete negative coupling hole.
- the portion 401 of the surface of the negative coupling hole may not be covered by the conductive layer, wherein FIG. 4 is a schematic diagram of the dielectric filter shown in FIG. 2a, and may also be applied to Other dielectric filters provided by embodiments of the present invention.
- the area of the portion of the negative coupling hole surface that is not covered by the conductive layer is related to the coupling amount of the capacitive coupling between the two dielectric resonators where the negative coupling hole is located. That is, the resonance frequency of the resonator-like structure formed by the negative coupling hole and the body around it can be adjusted by removing a part of the conductive layer in the negative coupling hole, thereby adjusting the coupling between the resonators on both sides thereof.
- the amount of coupling of the capacitive coupling between the dielectric resonator 21 and the dielectric resonance 22 can be changed by adjusting the size of the area in which the conductive layer in the negative coupling hole is removed.
- the area of the portion of the negative coupling hole in which the conductive layer is removed may be adjusted by sanding, which may not be limited in the embodiment of the present invention.
- the portion where the conductive layer is removed may be located in the inner bottom portion or the inner portion of the negative coupling hole, which may be one place or a plurality of discontinuous places.
- Each of the dielectric resonators may have one or more debugging holes, and the specific number may be designed according to actual needs.
- FIG. 5 is a schematic diagram of the dielectric filter shown in FIG. 4, and may also be applied to the present invention. Other dielectric filters provided by embodiments of the invention.
- the area of the portion of the debug hole surface that is not covered by the conductive layer is related to the resonant frequency of the dielectric resonator in which the debug hole is located. That is, the resonant frequency of the resonator in which the debug hole is located can be adjusted by removing a portion of the conductive layer in the debug hole.
- the magnitude of the resonant frequency can be changed by adjusting the size of the area in which the conductive layer in the debug hole is removed.
- the area of the portion of the debugging hole in which the conductive layer is removed may be adjusted by sanding, which may not be limited in the embodiment of the present invention.
- the portion where the conductive layer is removed may be located in the inner bottom portion or the inner portion of the debugging hole, and may be one place or a plurality of discontinuous portions, specifically Design according to actual needs.
- the adjustment of the resonant frequency is achieved by the removal of the conductive layer in the blind via on the body, which makes the resonance frequency more maintainable.
- the shape of the debugging hole or the negative coupling hole may be square, circular or other shapes, which may not be limited in this embodiment.
- the dielectric filter provided by the embodiment of the present invention, since capacitive coupling is formed between resonators on both sides of the blind hole by blind holes on the body made of solid dielectric material, the structure for realizing capacitive coupling is simplified. Manufacturing process. Further, the adjustment of the coupling amount of the capacitive coupling can be achieved by adjusting the size of the area of the partially conductive layer removed on the conductive layer in the blind via.
- the dielectric material used in the dielectric filter provided by the above embodiment is preferably ceramic.
- the ceramic has a high dielectric constant (36), and the hardness and high temperature resistance are also good, so it is commonly used in the field of RF filters.
- Solid dielectric material may also be selected from other materials known to those skilled in the art, such as glass, electrically insulating high molecular polymers, and the like.
- the dielectric filter provided by the embodiment of the invention is mainly used for the radio frequency front end of the high power wireless communication base station.
- the embodiment of the present invention further provides a transceiver in which the dielectric filter provided in the above embodiment is used.
- the dielectric filter can be used to filter RF signals.
- the embodiment of the invention further provides a base station in which the transceiver provided in the above embodiment is used.
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Abstract
Description
Claims
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020187023821A KR20180095141A (ko) | 2013-05-31 | 2013-05-31 | 유전체 필터, 송수신기 및 기지국 |
CN201810247185.4A CN108598635B (zh) | 2013-05-31 | 2013-05-31 | 介质滤波器,收发信机及基站 |
CN201380046875.9A CN104604022B (zh) | 2013-05-31 | 2013-05-31 | 介质滤波器,收发信机及基站 |
EP13885503.6A EP3007267B1 (en) | 2013-05-31 | 2013-05-31 | Dielectric filter, transceiver and base station |
KR1020157036210A KR101891332B1 (ko) | 2013-05-31 | 2013-05-31 | 유전체 필터, 송수신기 및 기지국 |
PCT/CN2013/076539 WO2014190536A1 (zh) | 2013-05-31 | 2013-05-31 | 介质滤波器,收发信机及基站 |
EP17180943.7A EP3297091B1 (en) | 2013-05-31 | 2013-05-31 | Dielectric filter, transceiver and base station |
US14/952,615 US9998163B2 (en) | 2013-05-31 | 2015-11-25 | Filter and transceiver comprising dielectric body resonators having frequency adjusting holes and negative coupling holes |
US15/981,070 US10700401B2 (en) | 2013-05-31 | 2018-05-16 | Filter and communication device comprising dielectric resonators having frequency adjusting holes and negative coupling holes of greater depth |
US16/899,027 US11444647B2 (en) | 2013-05-31 | 2020-06-11 | Filter and transceiver comprising dielectric body resonators having frequency adjusting holes and a negative coupling hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2013/076539 WO2014190536A1 (zh) | 2013-05-31 | 2013-05-31 | 介质滤波器,收发信机及基站 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/952,615 Continuation US9998163B2 (en) | 2013-05-31 | 2015-11-25 | Filter and transceiver comprising dielectric body resonators having frequency adjusting holes and negative coupling holes |
Publications (1)
Publication Number | Publication Date |
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WO2014190536A1 true WO2014190536A1 (zh) | 2014-12-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2013/076539 WO2014190536A1 (zh) | 2013-05-31 | 2013-05-31 | 介质滤波器,收发信机及基站 |
Country Status (5)
Country | Link |
---|---|
US (3) | US9998163B2 (zh) |
EP (2) | EP3297091B1 (zh) |
KR (2) | KR20180095141A (zh) |
CN (2) | CN108598635B (zh) |
WO (1) | WO2014190536A1 (zh) |
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WO2017088174A1 (zh) * | 2015-11-27 | 2017-06-01 | 华为技术有限公司 | 介质滤波器,收发信机及基站 |
CN106910968A (zh) * | 2017-04-25 | 2017-06-30 | 四川省韬光通信有限公司 | 一种介质波导滤波器 |
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CN110114934A (zh) * | 2016-12-19 | 2019-08-09 | 华为技术有限公司 | 具有有限传输零点的陶瓷滤波器的设计方法 |
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US11444647B2 (en) | 2022-09-13 |
EP3007267A4 (en) | 2016-06-22 |
KR20180095141A (ko) | 2018-08-24 |
KR20160011663A (ko) | 2016-02-01 |
CN104604022B (zh) | 2018-04-10 |
CN104604022A (zh) | 2015-05-06 |
US20180269914A1 (en) | 2018-09-20 |
CN108598635B (zh) | 2020-07-03 |
CN108598635A (zh) | 2018-09-28 |
US10700401B2 (en) | 2020-06-30 |
EP3007267A1 (en) | 2016-04-13 |
US9998163B2 (en) | 2018-06-12 |
EP3007267B1 (en) | 2017-09-06 |
KR101891332B1 (ko) | 2018-08-23 |
EP3297091B1 (en) | 2022-01-05 |
EP3297091A1 (en) | 2018-03-21 |
US20200381795A1 (en) | 2020-12-03 |
US20160094265A1 (en) | 2016-03-31 |
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