WO2014174860A1 - Élément de connexion électrique pour dispositif électroluminescent, module de dispositif électroluminescent, et procédé de fabrication de module de dispositif électroluminescent - Google Patents

Élément de connexion électrique pour dispositif électroluminescent, module de dispositif électroluminescent, et procédé de fabrication de module de dispositif électroluminescent Download PDF

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Publication number
WO2014174860A1
WO2014174860A1 PCT/JP2014/051131 JP2014051131W WO2014174860A1 WO 2014174860 A1 WO2014174860 A1 WO 2014174860A1 JP 2014051131 W JP2014051131 W JP 2014051131W WO 2014174860 A1 WO2014174860 A1 WO 2014174860A1
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WO
WIPO (PCT)
Prior art keywords
emitting device
light emitting
substrate
electrode
electrical connection
Prior art date
Application number
PCT/JP2014/051131
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English (en)
Japanese (ja)
Inventor
宗久 三谷
恭也 大薮
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Publication of WO2014174860A1 publication Critical patent/WO2014174860A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Definitions

  • the present invention relates to an electrical connection member of a light-emitting device, a light-emitting device module, and a method for manufacturing the same, and more particularly to a light-emitting device module, an electrical connection member for a light-emitting device for manufacturing the light-emitting device,
  • a light emitting device module including an optical semiconductor element such as an LED as a light source is known.
  • the terminal of the LED package and the pad of the electric insulator are electrically connected by solder bonding or wire bonding.
  • An object of the present invention is to provide an electrical connection member of a light emitting device, a light emitting device module, and a method for manufacturing the same, in which the light emitting device can be easily replaced.
  • An electrical connecting member of a light emitting device of the present invention is a light emitting device comprising a substrate, an optical semiconductor element mounted on the substrate, and an electrode provided on the substrate so as to be electrically connected to the optical semiconductor element.
  • An electrical connection member of a light emitting device configured to be electrically connected to the electrode, the clamping member configured to sandwich the substrate in the thickness direction of the substrate, and a biasing force of the clamping member And a conducting member configured to come into contact with the electrode.
  • the conducting member can come into contact with the electrode by the biasing force of the clamping member. Therefore, the conduction between the conducting member and the electrode can be easily ensured.
  • the light emitting device can be easily detached from the clamping member. Therefore, the light emitting device can be easily replaced.
  • the clamping member includes a pair of facing surfaces facing each other, and the pair of facing surfaces can generate a biasing force in a direction close to each other.
  • the conducting member is preferably disposed on at least one of the pair of opposed surfaces.
  • the conductive member can be securely held by the biasing force generated on the pair of facing surfaces and is disposed on at least one of the pair of facing surfaces.
  • the conductive member can be securely held by the biasing force generated on the pair of facing surfaces and is disposed on at least one of the pair of facing surfaces.
  • both the clamping member and the conducting member extend in a direction orthogonal to the thickness direction of the substrate.
  • the substrate can be slid in the orthogonal direction with respect to the sandwiching member while the substrate is sandwiched by the sandwiching member and the conduction between the conducting member and the electrode is ensured. Therefore, the position and / or number of light emitting devices in the orthogonal direction can be freely adjusted.
  • the clamping member is made of resin.
  • the sandwiching member is made of resin, the sandwiching member can be easily formed into a desired shape.
  • the conducting member is made of a conductive foil.
  • the conducting member is formed thin from the conductor foil, so that the conducting member and the substrate can be securely sandwiched by the sandwiching member to electrically connect the conducting member and the electrode. it can.
  • the light emitting device module of the present invention comprises a substrate, an optical semiconductor element mounted on the substrate, and an electrode provided on the substrate so as to be electrically connected to the optical semiconductor element; And an electrical connection member of the above-described light emitting device.
  • the conductive member can come into contact with the electrode by the biasing force of the clamping member. Therefore, the conduction between the conducting member and the electrode can be easily ensured.
  • the light emitting device can be easily replaced. Therefore, the light emitting device can be easily replaced.
  • both the clamping member and the conducting member extend in a direction orthogonal to the thickness direction of the substrate, and the clamping member extends in the orthogonal direction with respect to the substrate. And slidably hold.
  • the substrate can be slid in the orthogonal direction with respect to the sandwiching member while the substrate is sandwiched by the sandwiching member and the conduction between the conducting member and the electrode is ensured.
  • the position and / or number in the orthogonal direction can be freely adjusted.
  • a method of manufacturing a light emitting device module includes a substrate, an optical semiconductor element mounted on the substrate, and an electrode provided on the substrate so as to be electrically connected to the optical semiconductor element.
  • a holding step of the electrical connection member of the light-emitting device described above, and the conductive member is brought into contact with the electrode by the urging force of the clamping member, whereby the electrode and the electrode It is characterized by comprising a connecting step of electrically connecting through a conducting member.
  • the sandwiching member sandwiches the substrate, and the conducting member is brought into contact with the electrode by the urging force of the sandwiching member, and is electrically connected to the electrode through the conducting member.
  • the conduction between the conducting member and the electrode can be easily ensured.
  • the light emitting device can be easily replaced with the electrical connecting member.
  • FIG. 1 is a side sectional view of an electrical connection member of a light emitting device according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view of an electrical connection member of the light emitting device of FIG.
  • FIG. 3 shows a sectional side view of the preparation process.
  • FIG. 4 shows a plan view of the preparation process of FIG.
  • FIG. 5 shows a side sectional view of the connecting step.
  • FIG. 6 shows a plan view of the connecting step of FIG.
  • FIG. 7 shows a plan view of an embodiment in which two light emitting devices are provided.
  • FIG. 8 shows a plan view of a mode in which the light emitting device assembly is provided.
  • 9 is a preparation process of a modification of the first embodiment, FIG.
  • FIG. 9A is a plan view showing the relative positions of the electrical connection member and the light emitting device
  • FIG. 9B is an electrical connection member in the light emitting device of FIG. 9A.
  • omitted and the sealing layer is shown.
  • FIG. 10 is a plan view of a connection process according to a modification of the first embodiment.
  • FIG. 11 is a side sectional view of the light emitting device module according to the second embodiment of the present invention.
  • FIG. 12 is a side sectional view of a light emitting device module according to a third embodiment of the present invention.
  • FIG. 13 is a side sectional view of a light emitting device module according to a fourth embodiment of the present invention.
  • FIG. 10 is a plan view of a connection process according to a modification of the first embodiment.
  • FIG. 11 is a side sectional view of the light emitting device module according to the second embodiment of the present invention.
  • FIG. 12 is a side sectional view of a light
  • FIG. 14 is a side sectional view of a light emitting device module according to a fifth embodiment of the present invention.
  • FIG. 15 is a side sectional view of a sixth embodiment of the present invention, FIG. 15A is a side sectional view of an electrical connection member, and FIG. 15B is a partial side / side sectional view of a light emitting device module.
  • FIG. 16 is a side sectional view of a seventh embodiment of the present invention, FIG. 16A is a side sectional view of an electrical connecting member, and FIG. 16B is a partial side / side sectional view of a light emitting device module.
  • 17 is a side sectional view of an eighth embodiment of the present invention, FIG. 17A is a side view of an electrical connection member, and FIG. 17B is a partial side / side sectional view of a light emitting device module.
  • the upper side of the paper is “upper side” (one side in the first direction or one side in the thickness direction of the substrate 13 described later), and the lower side of the page is “lower side” (the other side in the first direction or the thickness of the substrate 13 described later).
  • an electrical connecting member 1 is an electrical connecting member for electrically connecting a light emitting device 11 (described later, see FIG. 4) to an external power source 22 (described later, see FIG. 4).
  • the electrical connection member 1 includes a clamping member 2 and a conduction member 3.
  • the sandwiching member 2 is formed so as to extend in the left-right direction. Specifically, the sandwiching member 2 is formed in a substantially U shape (a U shape) whose front side is opened in a side sectional view.
  • the sandwiching member 2 is integrally provided with an upper piece 4 and a lower piece 5 that are opposed to each other with an interval in the vertical direction, and a connecting piece 6 that connects the upper piece 4 and the lower piece 5.
  • Each of the upper piece 4 and the lower piece 5 is formed in a substantially rectangular flat plate shape that extends in the left-right direction and the front-rear direction and is long in the left-right direction.
  • the upper piece 4 and the lower piece 5 are formed such that their distance (opposite distance) gradually decreases in the side view as they approach the front side (front side).
  • the upper piece 4 is formed in an inclined shape that goes downward as it goes to the front side (front side)
  • the lower piece 5 is an inclination that goes upward as it goes to the front side (front side). It is formed in a shape.
  • the upper piece 4 and the lower piece 5 are provided with a pair of facing surfaces 7 and 8 that face each other in the vertical direction.
  • the opposed surface of the upper piece 4 that faces the lower piece 5 is a first opposed surface 7, and the first opposed surface 7 forms the lower surface of the upper piece 4.
  • the facing surface facing the upper piece 4 in the lower piece 5 is a second facing surface 8, and the second facing surface 8 forms the upper surface of the lower piece 5.
  • the connecting piece 6 connects the rear end portions of the upper piece 4 and the lower piece 5, extends in the left-right direction and the up-down direction, and is formed in a substantially flat plate shape that is substantially rectangular in rear view and long in the left-right direction.
  • the clamping member 2 is made of a flexible material.
  • the flexible material include resins such as polyethylene, polyolefin, polycarbonate, polyester, polystyrene, acrylic, and cellulose, and natural materials such as wood.
  • resin is used, more preferably polyolefin, and still more preferably polypropylene.
  • the holding member 2 is formed by forming the flexible material into a shape having the above-mentioned side view shape by a forming method such as integral extrusion.
  • the dimension of the clamping member 2 is appropriately set according to the dimension, number and / or arrangement of the light emitting device 11.
  • the length in the left-right direction of the clamping member 2 is, for example, 10 mm or more, preferably 50 mm or more, and for example, 3000 mm or less, preferably 2500 mm or less.
  • the lengths in the front-rear direction of the upper piece 4 and the lower piece 5 are, for example, 1 mm or more, preferably 3 mm or more, and for example, 100 mm or less, preferably 50 mm or less.
  • the length of the connecting piece 6 in the vertical direction is, for example, 0.1 mm or more, preferably 0.5 mm or more, and, for example, 100 mm or less, preferably 50 mm or less.
  • the angle ⁇ formed by the first virtual plane 41 including the first facing surface 7 and the second virtual plane 42 including the second facing surface 8 is an acute angle, and specifically, for example, 0.1 Degrees or more, preferably 1 degree or more, and for example, 45 degrees or less, preferably 30 degrees or less.
  • the thickness of each of the upper piece 4, the lower piece 5 and the connecting piece 6 is, for example, 0.01 mm or more, preferably 0.05 mm or more, and for example, 10 mm or less, preferably 5 mm or less. .
  • the distance (vertical direction distance) L1 between the front end portions of the first facing surface 7 and the second facing surface 8 (the tip portion constituting the opening, the same applies hereinafter) L1 is the total thickness L0 of the substrate 13 and the electrode 14 (FIG. 3), for example, 99% or less, preferably 90% or less, more preferably 80% or less, and for example 1% or more with respect to L0.
  • L1 is, for example, 0.01 mm or more, preferably 0.1 mm or more, and, for example, 0.9 mm or less, preferably 0.8 mm or less.
  • the clamping member 2 Since L1 is set to the above dimensions and the clamping member 2 is formed of a flexible material, the respective leading ends of the first facing surface 7 and the second facing surface 8 are located with respect to the substrate 13 and the electrode 14. Thus, the first opposing surface 7 and the second opposing surface 8 are configured to generate an urging force in a direction in which they are close to each other, that is, in the vertical direction. Thus, the clamping member 2 is configured to sandwich the substrate 13 (see FIG. 3 described later) in the thickness direction of the substrate 13.
  • the conducting member 3 is provided on at least the first facing surface 7 of the upper piece 4. Specifically, the conductive member 3 is laminated in layers so as to be continuous with the upper surface, the front surface, and the first facing surface 7 at the tip of the upper piece 4. The conducting member 3 is formed over the entire left and right direction of the tip of the upper piece 4 of the clamping member 2. That is, the conducting member 3 is formed to extend in the left-right direction. Note that the lower end portion of the conductive member 3 and the lower piece 5 are spaced slightly apart in the vertical direction.
  • the conducting member 3 is made of a conductive foil, and is bonded to each surface of the conductive foil via an adhesive layer (not shown).
  • the conductor foil is made of a conductor material such as copper, silver, gold, aluminum, nickel, or an alloy thereof.
  • the dimension of the conducting member 3 is appropriately set corresponding to the dimension of the clamping member 2.
  • the length in the longitudinal direction (the length in the left-right direction) of the conductor foil forming the conductive member 3 is, for example, 10 mm or more, preferably 50 mm or more, and for example, 3000 mm or less, preferably 2500 mm or less.
  • the length in the short direction (front-rear direction length) of the conductor foil is, for example, 0.5 mm or more, preferably 1 mm or more, and, for example, 90 mm or less, preferably 50 mm or less.
  • the thickness of the conductive member 3 is, for example, 1 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 1000 ⁇ m or less, preferably 500 ⁇ m or less.
  • each of the sandwiching member 2 and the conductor foil is prepared, and then the conductor foil is placed on the tip of the upper piece 4 of the sandwiching member 2 with an adhesive layer interposed therebetween. To fix.
  • FIG. 4 is a cross-sectional view taken along line AA in FIG. 4
  • FIG. 5 is a cross-sectional view taken along line AA in FIG.
  • the electrical connection member 1 and the light emitting device 11 are prepared (preparation process).
  • two (one pair) electrical connection members 1 and one light emitting device 11 are prepared.
  • the light emitting device 11 extends in the front-rear direction and the left-right direction, and is formed in a substantially rectangular shape in plan view that is long in the front-rear direction.
  • the light emitting device 11 includes a substrate 13, an LED 12 as an optical semiconductor element mounted on the upper surface (front surface) of the substrate 13, and an electrode provided on the upper surface (front surface) of the substrate 13 so as to be electrically connected to the LED 12. 14.
  • the substrate 13 is formed in a substantially rectangular flat plate shape in plan view having the same shape as the outer shape of the light emitting device 11.
  • Examples of the substrate 13 include substrates generally used in light emitting devices such as a ceramic substrate such as alumina, a resin substrate such as polyimide, and a metal core substrate using a metal plate as a core.
  • the LEDs 12 are arranged on the upper surface of the substrate 13 so as to secure a region in which the electrodes 14 to be described below are formed. 12) are provided.
  • the plurality of LEDs 12 are arranged in a staggered manner on the upper surface of the substrate 13 at intervals in the left-right direction and the front-rear direction.
  • a plurality of (for example, 2) LEDs 12 are provided in the light-emitting device 11 with a space therebetween in the left-right direction, and a plurality of LEDs 12 in each row are spaced apart from each other in the front-rear direction (for example, 6). ) Are provided. Then, the LEDs 12X in the left column and the LEDs 12Y in the right column arranged on the right side with respect to them are arranged so as to be displaced in the front-rear direction when projected in the left-right direction. Specifically, the LEDs 12X in the left column are arranged to be shifted rearward with respect to the LEDs 12Y in the right column when projected in the left-right direction. In other words, the LED 12X in the left column is disposed obliquely rearward on the left side with respect to the LED 12Y in the right column.
  • the light emitting device 11 includes a wire 15 for electrically connecting the plurality of LEDs 12 to each other.
  • a plurality (for example, 12) of LEDs 12 are electrically connected in series by a plurality (for example, 11) of wires 15.
  • each wire 15 electrically connects each of the LEDs 12X in the left row and each of the LEDs 12Y in the right row alternately, and thereby, a series arrangement composed of the LEDs 12 and the wires 15 is established.
  • the frontmost LED 12Y in the right row, the wire 15, the frontmost LED 12X in the left row, the wire 15, and the LED 12Y disposed adjacent to the rear side of the frontmost LED 12Y in the right row.
  • they are electrically connected in series, and are arranged so that such a connection is repeated from the front side toward the rear side.
  • the electrode 14 is formed in a substantially rectangular shape in plan view extending in the left-right direction at each of the front end portion and the rear end portion of the substrate 13.
  • the front end face of the front end electrode 14A and the front end face of the substrate 13 are formed so as to be arranged at the same position in plan view, that is, they are flush with each other.
  • the rear end surface of the electrode 14 at the rear end portion and the rear end surface of the substrate 13 are formed so as to be arranged at the same position in plan view, that is, they are flush with each other.
  • the electrode 14 is formed over the entire horizontal direction of the substrate 13.
  • the electrode 14 is electrically connected to the LED 12 through the wire 15. Specifically, the front end electrode 14A is electrically connected to the foremost LED 12Y in the right column by a wire 15. On the other hand, the rear end electrode 14 ⁇ / b> B is electrically connected to the rearmost LED 12 ⁇ / b> X in the left column by a wire 15.
  • a wire 15 is connected to the rear end edge of the upper surface of the electrode 14A at the front end, and a wire 15 is connected to the front end edge of the upper surface of the electrode 14B at the rear end.
  • Examples of the material constituting the electrode 14 include conductive materials such as silver, gold, copper, iron, platinum, and alloys thereof. Preferably, silver is used.
  • the electrode 14 is formed by, for example, plating, coating, bonding of a conductor layer, or the like.
  • the size of the electrode 14 is appropriately selected, and the width (length in the front-rear direction) W1 of the front end electrode 14A and the rear end electrode 14B is, for example, 0.3 mm or more, preferably 1 mm or more. For example, it is 5 mm or less, preferably 3 mm or less.
  • the thickness of the electrode 14 is, for example, 1 ⁇ m or more, preferably 5 ⁇ m or more, and for example, 100 ⁇ m or less, preferably 50 ⁇ m or less.
  • the light emitting device 11 includes a sealing layer 16.
  • the sealing layer 16 is formed on the substrate 13 so as to seal the plurality of LEDs 12. Specifically, the sealing layer 16 is continuous on the upper surface (front surface) of the substrate 13 so as to extend in the left-right direction and the front-rear direction. Is formed.
  • the sealing layer 16 has a substantially rectangular shape in plan view extending in the front-rear direction, and is formed so as to continuously cover the LED 12 and the wire 15.
  • the sealing layer 16 is formed so as to cover the upper surface and side surfaces (front surface, rear surface, right surface, and left surface) of each LED 12 and at least the inner surface of the electrode 14.
  • the sealing layer 16 is formed so as to cover the rear end edge of the upper surface of the electrode 14A at the front end portion and to expose the front end edge and the front-rear direction center portion of the upper surface of the electrode 14A at the front end portion.
  • the sealing layer 16 is formed so as to cover the front end edge of the upper surface of the rear end electrode 14B and to expose the rear end edge and the front-rear direction center of the upper surface of the rear end electrode 14B.
  • the sealing layer 16 is formed in the shape described above from a sealing resin composition containing a transparent sealing resin.
  • the sealing resin include thermoplastic resins that are plasticized by heating, for example, thermosetting resins that are cured by heating, for example, active energy rays that are cured by irradiation with active energy rays (for example, ultraviolet rays and electron beams). Examples thereof include curable resins.
  • the thermoplastic resin include vinyl acetate resin, ethylene / vinyl acetate copolymer (EVA), vinyl chloride resin, EVA / vinyl chloride resin copolymer, and the like.
  • the thermosetting resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin.
  • sealing resin composition can contain phosphors and fillers in appropriate proportions, if necessary.
  • the phosphor examples include a yellow phosphor that can convert blue light into yellow light.
  • a phosphor for example, a phosphor in which a metal atom such as cerium (Ce) or europium (Eu) is doped in a composite metal oxide, a metal sulfide, or the like can be given.
  • Y 3 Al 5 O 12 Ce (YAG (yttrium aluminum garnet): Ce), (Y, Gd) 3 Al 5 O 12 : Ce, Tb 3 Al 3 Garnet-type phosphors having a garnet-type crystal structure such as O 12 : Ce, Ca 3 Sc 2 Si 3 O 12 : Ce, Lu 2 CaMg 2 (Si, Ge) 3 O 12 : Ce, for example, (Sr, Ba) Silicate phosphors such as 2 SiO 4 : Eu, Ca 3 SiO 4 Cl 2 : Eu, Sr 3 SiO 5 : Eu, Li 2 SrSiO 4 : Eu, Ca 3 Si 2 O 7 : Eu, for example, CaAl 12 O 19 : Aluminate phosphors such as Mn, SrAl 2 O 4 : Eu, for example, ZnS: Cu, Al, CaS: Eu, CaGa 2 S 4 : Eu, SrG Sulfide phosphors such as
  • the filler examples include silicone fine particles, glass, alumina, silica (fused silica, crystalline silica, ultrafine amorphous silica, hydrophobic ultrafine silica, etc.), titania, zirconia, talc, clay, barium sulfate, and the like. These fillers can be used alone or in combination of two or more. Preferably, silicone fine particles and silica are used.
  • known additives such as a modifier, a surfactant, a dye, a pigment, a discoloration inhibitor, and an ultraviolet absorber can be added to the sealing resin composition at an appropriate ratio.
  • the sealing region 17 includes at least the LEDs 12 in a plan view, specifically, includes all the LEDs 12 and all the wires 15 and is defined by the sealing layer 16. That is, the sealing region 17 is partitioned by the peripheral edge of the sealing layer 16 in plan view.
  • the sealing region 17 corresponds to the sealing layer 16 and is partitioned into a substantially rectangular shape in plan view so as to extend in the front-rear direction and the left-right direction.
  • the electrode region 18 is a region other than the sealing region 17 in the substrate 13, specifically, a region partitioned by the electrode 14 exposed from the sealing layer 16 in plan view.
  • the electrode region 18 includes a front end electrode region 18A and a rear end electrode region 14A corresponding to the front end electrode 14A and the rear end electrode 14B exposed from the sealing layer 16, respectively.
  • Each of the electrode regions 18B is formed.
  • Each of the electrode region 18A at the front end and the electrode region 18B at the rear end is partitioned into a substantially rectangular shape in plan view so as to extend in the front-rear direction and the left-right direction.
  • a plurality of (for example, two) electrode regions 18 are formed on the substrate 13 in a pattern that sandwiches a single sealing region 17 in the front-rear direction.
  • the dimensions of the light emitting device 11 are appropriately set. Specifically, the distance (interval) in the front-rear direction of each LED 12X in the left column, the distance (interval) in the front-rear direction of each LED 12Y in the right column, and projection in the front-rear direction.
  • the distance (interval) between the LED 12X and the rear end electrode 14B is, for example, 0.3 mm or more, preferably 0.5 mm or more, and, for example, 5 mm or less, preferably 3 mm or less.
  • the front-rear direction length and the left-right direction length of the LED 12 are not particularly limited, and are determined according to the illuminance of the target light-emitting device module 10.
  • the height of the wire 15 is, for example, 0.01 mm or more, preferably 0.1 mm or more, and, for example, 1.0 mm or less, preferably 0.6 mm or less.
  • the width (length in the front-rear direction) W2 of the electrode region 18A at the front end and the electrode region 18B at the rear end is, for example, 0.5 mm or more, preferably 0.75 mm or more, and, for example, 5 mm or less. Preferably, it is 3 mm or less.
  • the two electrical connection members 1, that is, the first electrical connection member 1A and the second electrical connection member 1B are arranged on both the front side and the rear side of the light emitting device 11. To place.
  • connection process is performed after the preparation process.
  • the tip portions of the upper piece 4 and the lower piece 5 of the electrical connecting member 1 are opened. Specifically, the tip portions of the upper piece 4 and the lower piece 5 are moved so that they are separated from each other. Specifically, the tip portions of the upper piece 4 and the lower piece 5 so that the distance L1 between the tip portion of the first facing surface 7 and the tip portion of the second facing surface 8 is larger than the total thickness L0 of the substrate 13 and the electrode 14. open.
  • the electrode 14 and the substrate 13 on which the electrode 14 is stacked are insert. Specifically, the substrate 13 is inserted between the tip portions of the upper piece 4 and the lower piece 5 so that the electrode 14 and the conducting member 3 face each other in the vertical direction. Further, the substrate 13 is sandwiched by the right side portion of the electrical connecting member 1.
  • the tip of the upper piece 4 and the lower piece 5 is closed. Specifically, the leading end portions of the upper piece 4 and the lower piece 5 are moved so that they are close to each other, and the conductive member 3 formed on the first facing surface 7 of the upper piece 4 is moved to the upper surface of the electrode 14. Contact. At the same time, the second facing surface 8 of the lower piece 5 is brought into contact with the lower surface of the substrate 13. Then, in the first facing surface 7 and the second facing surface 8, a difference (L0) obtained by subtracting the distance L1 between the tips of the first facing surface 7 and the second facing surface 8 from the total thickness L0 of the substrate 13 and the electrode 14. An urging force corresponding to -L1) is generated as a reaction force when the first facing surface 7 and the second facing surface 8 abut (contact) the substrate 13.
  • the substrate 13 is inserted between the tip portions of the upper piece 4 and the lower piece 5 from the right side (one side in the left-right direction) of the clamping member 2. You can also.
  • the electrode 14 and the substrate 13 are fixed by the sandwiching member 2 by the urging force of the first facing surface 7 and the second facing surface 8.
  • the electrical connecting member 1 is fixed to the clamping member 2 by the clamping member 2 based on an urging force that can slide in the left-right direction.
  • each of the conductive members 3 at the left end portions of the two electrical connection members 1 is electrically connected to the external power source 22 via the wiring 23.
  • the light emitting device module 10 including the light emitting device 11 and the electrical connection member 1 connected to the electrode 14 of the light emitting device 11 is manufactured.
  • the position and / or number of the electrical connection members 1 in the light-emitting device module 10 can be freely adjusted.
  • the light emitting device 11 is slid to the left side, and the light emitting device 11 is arranged on the left side portion of the holding member 2 to freely adjust the position of the light emitting device 11. it can. At this time, the light emitting device 11 is slid to the left relative to the holding member 2 while maintaining the holding state of the light emitting device 11 by the holding member 2.
  • the number of light emitting devices 11 can be freely changed. Specifically, one light emitting device 11 is added, and a total of two light emitting devices 11 are connected to two electric connections. It can be provided for the member 1.
  • the light emitting device 11 for example, the light emitting device 11 whose illuminance is insufficient is first pulled out from the holding member 2, and then the two light emitting devices 11 are arranged at intervals in the left-right direction to hold them. The member 2 is held together. Alternatively, the light emitting device 11 to be added is inserted from the side (left side) of the electrical connection member 1.
  • the two light-emitting devices 11 are provided at intervals in the left-right direction.
  • a light-emitting device assembly 21 including a plurality of light-emitting devices 11 can be configured.
  • the light-emitting device assembly 21 is configured by a plurality of light-emitting devices 11 that are continuously arranged in the left-right direction, and are continuously integrated.
  • the light emitting device assembly 21 does not have a space (gap) between the light emitting devices 11 described above, and includes a substrate 13 and electrodes 14 common to the plurality of light emitting devices 11 and LEDs 12 arranged in series corresponding to the light emitting devices 11.
  • a plurality of units 31 are provided. In the light emitting device assembly 21, the plurality of units 31 of the LEDs 12 are collectively covered with one sealing layer 16.
  • the sealing layer 16 includes a phosphor
  • the light whose wavelength is converted by the sealing layer 16 can be converted into continuous light continuous in the left-right direction. Therefore, the light-emitting device module 10 including such a light-emitting device assembly 21 is used as line illumination in which the light source extends in the left-right direction.
  • the conducting member 3 can come into contact with the electrode 14 by the urging force of the clamping member 2. Therefore, the conduction between the conducting member 3 and the electrode 14 can be easily ensured.
  • the substrate 13 is separated from the clamping member 2 against the urging force of the clamping member 2, specifically, the substrate 13 is pulled out from the clamping member 2 toward the front side, or the right side (or
  • the light emitting device 11 can be easily detached from the clamping member 2 by sliding it to the right side (or the left side) while sliding it to the left side. Therefore, the light emitting device 11 can be easily replaced.
  • the substrate 13 can be securely held by the urging force generated on the first facing surface 7 and the second facing surface 8, and the first facing surface 7.
  • the conductive member 3 disposed on the electrode can reliably contact the electrode 14 and ensure the conduction between the conductive member 3 and the electrode 14.
  • the clamping member 2 is made of resin, the clamping member 2 can be easily formed into a desired shape.
  • the conductive member 3 is formed thinly from the conductive foil, the conductive member 3 and the substrate 13 are securely held by the holding member 2, and the conductive member 3 and the electrode 14 are Can be electrically connected.
  • the conducting member 3 can come into contact with the electrode 14 by the urging force of the clamping member 2. Therefore, the conduction between the conducting member 3 and the electrode 14 can be easily ensured.
  • the substrate 13 is separated from the clamping member 2 against the urging force of the clamping member 2, specifically, the substrate 13 is pulled out from the clamping member 2 toward the front side, or the substrate 13 is removed.
  • the light emitting device 11 can be easily replaced by sliding it to the right (or left side) and pulling it out to the right (or left side) as it is.
  • the substrate 13 can be securely held by the urging force generated on the first facing surface 7 and the second facing surface 8, and the first facing surface 7.
  • the conductive member 3 disposed on the electrode can reliably contact the electrode 14 and ensure the conduction between the conductive member 3 and the electrode 14.
  • the sandwiching member 2 sandwiches the substrate 13, the conducting member 3 is brought into contact with the electrode 14 by the biasing force of the sandwiching member 2, and the electrode 14 and the conducting member 3 are interposed therebetween. Therefore, electrical connection between the conductive member 3 and the electrode 14 can be easily ensured.
  • the sealing region 17 and the electrode region 18 are formed on the substrate 13 of the light emitting device 11 (light emitting device assembly 21) on the substrate 13.
  • the substrate 13 can further form an exposed region 19 exposed from the sealing layer 16 and the electrode 14.
  • the exposed region 19 is formed on the front side and the rear side of the sealing region 17 described below, and is continuously formed in the left-right direction as a region excluding the electrode region 18 described below.
  • the electrode region 18 is a region corresponding to the plurality of electrodes 14, and each electrode 14 is formed in a substantially circular shape in plan view, one on the front side and one on the rear side, corresponding to the unit 31 of the LED 12. ing. Each electrode 14 is electrically connected to the LED 12 of each unit 31 via an internal wiring (not shown) provided on the substrate 13.
  • each unit 31 a plurality (for example, 8) of LEDs 12 are arranged in a line in the front-rear direction and the left-right direction, and each LED 12 is electrically connected via a wire 15.
  • the clamping member 2 holds the electrode region 18 and the exposed region 19 together so that the conducting member 3 can contact the electrode 14 of the electrode region 18.
  • the light diffusion layer 20 can be provided on the sealing layer 16.
  • the light diffusion layer 20 is laminated on the entire upper surface of the sealing layer 16.
  • the light diffusion layer 20 is formed from a light diffusion composition containing the above-described transparent resin and a light reflection component in a flat plate shape that extends in the front-rear direction and the left-right direction (plane direction) and is substantially rectangular in plan view and long in the left-right direction. Yes.
  • the blending ratio of the light reflection component is, for example, 0.5 parts by mass or more, preferably 1.5 parts by mass or more, and for example, 90 parts by mass or less, preferably 100 parts by mass of the transparent resin. It is 70 mass parts or less.
  • the thickness of the light diffusion layer 20 is, for example, 50 ⁇ m or more, preferably 100 ⁇ m or more, and for example, 2000 ⁇ m or less, preferably 1000 ⁇ m or less.
  • the light emitting device module 10 when the light emitted from the LED 12 and transmitted through the sealing layer 16 reaches the light diffusion layer 20, the light diffuses in the surface direction. Therefore, a plurality of LEDs 12 can be used as a surface light source.
  • the conduction member 3 can also be used as the conduction member without providing the conduction member 3 separately from the upper piece 4.
  • this electrical connecting member 1 it is possible to omit the trouble of separately providing the conducting member 3 with the upper piece 4, thereby reducing the manufacturing cost of the light emitting device module 10, and the configuration of the electrical connecting member 1 and thus the light emitting device module 10. Can be easy.
  • the lower end portion of the conducting member 3 and the lower piece 5 are spaced slightly apart in the vertical direction.
  • the holding member 2 is placed so that they are in contact with each other. It can also be configured.
  • the sandwiching member 2 can be made to contain a light reflection component so that the sandwiching member 2 acts as a reflector.
  • the clamping member 2 is formed into the shape described above from a composition containing a flexible material and a light reflection component.
  • the light reflection component may be the same as described above, and is uniformly dispersed and mixed in the flexible material (preferably resin) of the sandwiching member 2.
  • the blending ratio of the light reflection component is, for example, 0.5 parts by mass or more, preferably 1.5 parts by mass or more, for example, 90 parts by mass or more, preferably 100 parts by mass of the flexible material. Is 70 parts by mass or more.
  • the conducting member 3 is provided only on the first facing surface 7 at the tip of the upper piece 4.
  • the same effect as the first embodiment can be obtained, and the light emitted forward and backward from the light emitting device 11 is reflected by the distal end surface of the upper end portion of the upper piece 4. Can also be used.
  • the light emitting device module 10 includes a reflector 24 separately from the sandwiching member 2.
  • Each reflector 24 extends in the left-right direction and the up-down direction, and is formed in a substantially flat plate shape that is long in the left-right direction.
  • the reflector 24 corresponding to the rear end electrode 14B is provided so as to incline backward as it goes upward, and the reflector 24 corresponding to the front end electrode 14A is inclined forward as it goes upward. Is provided.
  • the lower end portion of each reflector 24 uses an adhesive layer (not shown) as necessary between the sealing layer 16 and the conductive member 3 formed on the distal end surface of the upper piece 4 on the upper surface of the electrode 14. Is fixed.
  • the same operational effects as those of the first embodiment can be obtained, and the light emitted forward and backward from the light emitting device 11 can be reflected by the reflector 24 and used. it can.
  • the back surfaces of the substrates 13 of the two light emitting devices 11 can be brought into contact with each other, and the substrates 13 of the two light emitting devices 11 can be sandwiched by the sandwiching member 2 of the electrical connecting member 1. .
  • the conducting member 3 is continuously formed over the entire top surface, front surface, first facing surface 7, second facing surface 8, and front surface (front surface) of the connecting piece 6. . That is, the conducting member 3 is formed at least on the entire inner surface of the clamping member 2.
  • the conducting member 3 formed on the second facing surface 8 contacts the lower electrode 14, and the conducting member 3 formed on the first facing surface 7 contacts the upper electrode 14. As a result, the conducting member 3 is electrically connected to the lower electrode 14 and the upper electrode 14.
  • the LEDs 12 and the sealing layer 16 are provided on the upper side and the lower side with respect to the two substrates 13, whereby the light emitting device module 10 emits light on both the upper and lower sides (double-sided light emission). Used as a type of lighting device.
  • the same effects as those of the first embodiment can be obtained, and further, light emitted downward from the light emitting device 11 can be used.
  • FIG. 14 the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the light emitting device module 10 includes a heat dissipation member 25.
  • the heat dissipating member 25 integrally includes a flat plate portion 26 that extends in the left-right direction and the front-rear direction and is long in the left-right direction and is substantially rectangular in bottom view, and a plurality of protrusion portions 27 that protrude downward from the flat plate portion 26.
  • the flat plate part 26 is laminated on the entire lower surface (excluding the peripheral edge) of the substrate 13.
  • the projecting portions 27 are arranged at intervals in the front-rear direction in the region excluding the front end portion and the rear end portion of the flat plate portion 26.
  • the heat dissipating member 25 is made of a heat dissipating material, and examples of the heat dissipating material include metals such as stainless steel and copper.
  • the front end portion and the rear end portion of the flat plate portion 26 are sandwiched by the clamping member 2.
  • the clamping member 2 is preferably made of metal.
  • produces from LED12 is diffused by the thermal radiation member 25, and the clamping member 2 is formed from a metal The heat can be radiated from the heat radiating member 25 to the holding member 2. Therefore, it is possible to prevent a decrease in the light emission amount of the LED 12 due to heat generation.
  • the clamping member 2 is formed in a substantially U-shaped (U) shape in a side sectional view, but the shape is not particularly limited. For example, as shown in FIG. It can also be formed in a C shape.
  • 1st opposing surface 7 and 2nd opposing surface 8 which are mutually opposed to the up-down direction, are extended in the left-right direction and the front-back direction, and are long in the left-right direction are formed in the front-end
  • the distance between the first facing surface 7 and the second facing surface 8 is set to be smaller than the total thickness L0 of the substrate 13 and the electrode 14 (see FIG. 3). Further, when the clamping member 2 is inserted into the substrate 13 and the electrode 14, the above-described interval is widened as indicated by an arrow in FIG. 15A, and then, as shown in FIG. And sandwich the electrode 14.
  • the conducting member 3 provided on the first facing surface 7 contacts the electrode 14 and is electrically connected.
  • the clamping member 2 includes an upper piece 4 and a lower piece 5 that are independent from each other, and a washer 29.
  • the clamping member 2 can be formed of a hard material other than the flexible material described above.
  • the hard material include an insulating material such as a ceramic material, and a conductive material such as a metal material such as aluminum, iron, and copper.
  • the upper piece 4 and the lower piece 5 are opposed to each other with an interval in the vertical direction.
  • Each of the upper piece 4 and the lower piece 5 is formed with a through hole 28 penetrating in the thickness direction.
  • the through hole 28 is formed in the rear end portions of the upper piece 4 and the lower piece 5.
  • a female thread corresponding to a bolt 30 (described later) is cut in the through hole 28 of the lower piece 5.
  • the upper piece 4 and the lower piece 5 are made of a metal such as stainless steel or copper.
  • the washer 29 is disposed so as to be interposed between the upper piece 4 and the lower piece 5.
  • the washer 29 has a through hole 28 through which the bolt 30 passes.
  • the washer 29 is arranged so that the through hole 28 corresponds to the through hole 28 of the upper piece 4 and the lower piece 5.
  • the sandwiching member 2 is a material that can be plated and is made of an insulating material (specifically, a ceramic material)
  • the conductive member 3 can be formed by plating, for example.
  • the upper piece 4 In order to sandwich the substrate 13 and the electrode 14 by the sandwiching member 2, the upper piece 4, the washer 29 and the lower piece 5 to which the conducting member 3 is bonded and fixed in advance are prepared so that they are sequentially arranged on the upper side. Then, as shown by the arrows in FIG. 16A, the bolts 30 are inserted into the through holes 28 of the upper piece 4, the washer 29 and the lower piece 5.
  • the bolt 30 is tightened, whereby the conductive member 3 comes into contact with the electrode 14 and the second facing surface 8 of the lower piece 5 comes into contact with the lower surface of the substrate 13. Subsequently, the bolt 30 is tightened (tightened) with respect to the female screw of the lower piece 5. As a result, an urging force is generated by tightening (intensifying) the lower piece 5 of the bolt 30 with respect to the female screw after the conducting member 3 contacts the electrode 14. Thereby, the tip portions of the upper piece 4 and the lower piece 5 sandwich the substrate 13 and the electrode 14.
  • the urging force of the tip portions of the upper piece 4 and the lower piece 5 is, for example, 100 Pa or more, preferably 500 Pa or more, and for example, 1 MPa or less, preferably 0.5 MPa or less.
  • the same operational effects as those of the first embodiment can be obtained. Further, the urging force of the clamping member 2 is based on the screwing of the lower piece 5 of the bolt 30 with respect to the female screw, so that the substrate 13 In addition, the electrode 14 can be firmly held. Therefore, the electrical connection between the conducting member 3 and the electrode 14 can be ensured more reliably.
  • the holding member 2 may not be provided separately from the upper piece 4 in the sandwiching member 2, and the upper piece 4 may be formed of a conductive material so that the sandwiching member 2 also functions as the conducting member.
  • the upper piece 4 and the lower piece 5 can be formed of a ceramic material while the conducting member 3 is provided.
  • FIG. 17 members similar to those in the first embodiment and the seventh embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the clamping member 2 includes an upper piece 4, a lower piece 5, and a spring 34.
  • the rear ends of the upper piece 4 and the lower piece 5 are rotatably supported by a common shaft 32 so that the front end portions thereof can be rotated in the vertical direction.
  • the spring 34 connects the upper piece 4 and the lower piece 5 in the longitudinal direction of the upper piece 4 so as to be close to each other so as to be close to each other.
  • the shaft 32 is formed to extend in the left-right direction.
  • an urging force is always generated in the direction in which the tip portions of the upper piece 4 and the lower piece 5 are close to each other based on the tensile force of the spring 34.
  • the same operational effects as those of the first embodiment can be obtained, and further, the screwing tool can be compared with the screwing of the lower piece 5 of the bolt 30 of the seventh embodiment with respect to the female screw. Since it is unnecessary, the light emitting device 11 can be easily replaced by easily separating the light emitting device 11 from the clamping member 2 by separating the substrate 13 from the tip portions of the upper piece 4 and the lower piece 5. .
  • the holding member 2 may not be provided separately from the upper piece 4 in the sandwiching member 2, and the upper piece 4 may be formed of a conductive material so that the sandwiching member 2 also functions as the conducting member.
  • the upper piece 4 and the lower piece 5 can be formed of a ceramic material while the conducting member 3 is provided.
  • the LED 12 is described as an example of the optical semiconductor element in the present invention.
  • an LD (laser diode) 12 may be used.
  • the sealing layer 16 is provided in the light emitting device 11, but the light emitting device 11 can be configured without providing the sealing layer 16.
  • the electrical connection member is used for electrical connection of the light emitting device.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un élément de connexion électrique pour un dispositif électroluminescent. Cet élément de connexion électrique est configuré pour être connecté électriquement à une électrode du dispositif électroluminescent qui comprend un substrat, un élément semi-conducteur optique monté sur le substrat, et l'électrode qui est disposée sur le substrat de façon à ce que l'électrode soit connectée électriquement à l'élément semi-conducteur optique. L'élément de connexion électrique comprend : un élément d'encadrement, qui est configuré pour encadrer le substrat dans la direction de l'épaisseur du substrat ; et un élément conducteur, qui est configuré pour être en contact avec l'électrode au moyen d'une force de pression de l'élément d'encadrement.
PCT/JP2014/051131 2013-04-24 2014-01-21 Élément de connexion électrique pour dispositif électroluminescent, module de dispositif électroluminescent, et procédé de fabrication de module de dispositif électroluminescent WO2014174860A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013091699A JP2014216435A (ja) 2013-04-24 2013-04-24 発光装置の電気接続部材、発光装置モジュールおよびその製造方法
JP2013-091699 2013-04-24

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WO2014174860A1 true WO2014174860A1 (fr) 2014-10-30

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JP (1) JP2014216435A (fr)
CN (3) CN104124322A (fr)
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WO (1) WO2014174860A1 (fr)

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JP6941923B2 (ja) * 2016-08-24 2021-09-29 日亜化学工業株式会社 Ｌｅｄモジュールの製造方法及びｌｅｄモジュール
JP7307874B2 (ja) * 2019-04-26 2023-07-13 日亜化学工業株式会社 発光装置及び発光モジュール

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170642A (ja) * 2008-01-16 2009-07-30 Toshiba Lighting & Technology Corp 電気装置
JP2009200011A (ja) * 2008-02-25 2009-09-03 Sony Corp 光源ユニット、および光源装置ならびに表示装置
JP2011187973A (ja) * 2010-02-10 2011-09-22 Panasonic Corp Ｌｅｄランプ及び照明装置
WO2011124974A1 (fr) * 2010-04-08 2011-10-13 Marco Gaeta Lampe remplaçable à diodes électroluminescentes de forte puissance à composants montés en surface miniature
WO2012096288A1 (fr) * 2011-01-12 2012-07-19 イリソ電子工業株式会社 Connecteur
JP2012204020A (ja) * 2011-03-23 2012-10-22 Toshiba Lighting & Technology Corp Ｌｅｄモジュール及び照明器具

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170642A (ja) * 2008-01-16 2009-07-30 Toshiba Lighting & Technology Corp 電気装置
JP2009200011A (ja) * 2008-02-25 2009-09-03 Sony Corp 光源ユニット、および光源装置ならびに表示装置
JP2011187973A (ja) * 2010-02-10 2011-09-22 Panasonic Corp Ｌｅｄランプ及び照明装置
WO2011124974A1 (fr) * 2010-04-08 2011-10-13 Marco Gaeta Lampe remplaçable à diodes électroluminescentes de forte puissance à composants montés en surface miniature
WO2012096288A1 (fr) * 2011-01-12 2012-07-19 イリソ電子工業株式会社 Connecteur
JP2012204020A (ja) * 2011-03-23 2012-10-22 Toshiba Lighting & Technology Corp Ｌｅｄモジュール及び照明器具

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CN204118129U (zh) 2015-01-21
CN104124322A (zh) 2014-10-29
JP2014216435A (ja) 2014-11-17
CN203746894U (zh) 2014-07-30
TW201442304A (zh) 2014-11-01

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