WO2014169444A1 - Encres électroconductrices - Google Patents
Encres électroconductrices Download PDFInfo
- Publication number
- WO2014169444A1 WO2014169444A1 PCT/CN2013/074294 CN2013074294W WO2014169444A1 WO 2014169444 A1 WO2014169444 A1 WO 2014169444A1 CN 2013074294 W CN2013074294 W CN 2013074294W WO 2014169444 A1 WO2014169444 A1 WO 2014169444A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrically conductive
- conductive ink
- substrate
- ink according
- present
- Prior art date
Links
- 239000000976 ink Substances 0.000 title abstract description 67
- 239000002245 particle Substances 0.000 claims abstract description 65
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052709 silver Inorganic materials 0.000 claims abstract description 45
- 239000004332 silver Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 125000003118 aryl group Chemical group 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 230000037361 pathway Effects 0.000 claims abstract description 19
- 239000003960 organic solvent Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 229920006287 phenoxy resin Polymers 0.000 claims description 18
- 239000013034 phenoxy resin Substances 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical group OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 2
- 150000002148 esters Chemical group 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 7
- 229910021419 crystalline silicon Inorganic materials 0.000 abstract description 4
- 239000000654 additive Substances 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- -1 poly(hydroxyethers) Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000002525 ultrasonication Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to compositions that are suitable for use as electrically conductive inks in the fabrication of electronic devices, such as c-Si solar modules.
- the electrically conductive ink comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 ⁇ to 40 ⁇ , and a tap density of 1.5 g/cm 3 to 6.5 g/cm 3 and c) one or more organic solvents.
- the present invention further relates to a method of forming an electrically conductive pathway on a substrate and to a method of forming a bonded assembly using said electrically conductive ink.
- Electrically conductive inks are screen printable and are used to form conductive elements in electronic applications.
- conductive inks are utilized as screen-printed electronic circuitry in through hole connection, jumpers, printed board wiring and similar electronic applications to provide stable electrical interconnections.
- electrically conductive inks There are many drawbacks to currently available electrically conductive inks.
- One such drawback is that many conductive inks have an insufficient adhesion to some metallic surfaces, such as aluminum.
- a further drawback of electrically conductive inks is that these materials often do not form a stable and reliable electrical interconnection after being soldered to a further metallic substrate, such as a connection strap, like normal Sn alloy ribbons.
- an electrically conductive ink which would exhibit a good adhesion to various metallic substrates, such as aluminum or aluminum-containing substrates. It would further be advantageous to provide an electrically conductive ink which can be soldered directly to further metallic substrate, thereby forming a stable and reliable electrical interconnection having a good bonding strength.
- the present invention provides an electrically conductive ink having an excellent adhesion to aluminum or aluminum-containing substrates. After having been dried said electrically conductive ink can be soldered directly to further metallic substrates, wherein a stable and reliable electrical interconnection is formed which exhibits a good bonding strength.
- the electrically conductive ink of the present invention comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 ⁇ to 40 ⁇ , and a tap density of 1 .5 g/cm 3 to 6.5 g/cm 3 ; and c) one or more organic solvents.
- aromatic resin refers to oligomeric or polymeric materials comprising at least one aromatic group as part of their molecular structure. Suitable aromatic groups include phenylene groups, phenyl groups, or polycyclic aromatic groups. Preferred aromatic resins exhibit an amount of aromatic groups, based on the total amount of the resin, of at least 5 wt.-%, more preferably of at least 10 wt.-%, and particularly preferably of at least 15 wt.-%.
- aromatic resins in the electrically conductive inks is essential for the present invention, because a sufficient adhesion to various metallic substrates, such as aluminum or aluminum-containing substrates is only achieved, when resins are employed which comprise at least one aromatic group as part their molecular structure.
- the aromatic resin component acts as a film forming agent and/or binder material.
- Suitable aromatic resins may be selected from the group consisting of phenoxy resins, aromatic polyester resins, aromatic thermoplastic polyurethanes, and any combination thereof.
- Phenoxy resins are particularly suitable for use in the present invention.
- phenoxy resin refers to oligomeric or polymeric poly(hydroxyethers) derived from the reaction of polyphenols, such as bisphenols and epichlorohydrin.
- the use of phenoxy resin is advantageous because these resins have a very good thermal stability, exhibit an excellent resistance to oxygen and moisture, and do not decompose in the presence of acid or basic materials.
- phenoxy resins improves the solderability of the electrically conductive ink of the present invention.
- Suitable phenoxy resins for use in the present invention can be prepared by admixing from about 0.98 to about 1 .02 moles of epichlorohydrin with one mole of a dihydric phenol together with from about 0.6 to 1 .5 moles of an alkali metal hydroxide, such as, sodium hydroxide or potassium hydroxide, generally in an aqueous medium, at a temperature of about Q°C to about 50 ⁇ until at least about 60 mole percent of the epich!orhydrin has been consumed.
- an alkali metal hydroxide such as, sodium hydroxide or potassium hydroxide
- carboxyiic acid-grafted phenoxy resins can be prepared, for example, by reacting one or more phenoxy resins with one or more monoanhydrides of di- or polycarboxylic acids.
- Preferred phenoxy resins have a weight average molecular weight (M w ) from 10000 g/mol to 70000 g/mol, more preferably from 20000 g/mol to 55000 g/mol.
- M w weight average molecular weight
- the weight average molecular weight (M w ) is determined by gel permeation chromatography (GPC) preferably using a polystyrene standard.
- Phenoxy resins suitable for use in the present invention include Phenoxy PKHH, a trade designation of InChem Corp. for a condensation polymer derived from bisphenol-A (2,2-bis(p-hydroxyphenyl)propane and epichlorohydrin.
- the total amount of all aromatic resins present in the electrically conductive ink of the present invention is in the range of about 4 to about 25 wt.-%, preferably in the range of about 6 to about 15 wt.-%, and more preferably in the range of about 8 to about 12 wt.-%, each based on the total amount of the electrically conductive ink of the present invention.
- the total amount of all phenoxy resins present in the electrically conductive ink of the present invention is in the range of about 4 to about 25 wt.-%, preferably in the range of about 6 to about 15 wt.-%, and more preferably in the range of about 8 to about 12 wt.-%, each based on the total amount of the electrically conductive ink of the present invention.
- the electrically conductive ink only comprises aromatic resins and no further non-aromatic resins.
- the electrically conductive ink of the present invention further comprises electrically conductive silver particles having an average particle size of 1 ⁇ to 40 ⁇ , and a tap density of 1.5 g/cm 3 to 6.5 g/cm 3 .
- electrically conductive silver particles refers to particles mainly consisting of silver (Ag).
- the electrically conductive silver particles have a silver content of at least 95 wt.-%, more preferably of at least 98 wt.-%, and particularly preferably of at least 99 wt.-%, each based on the total amount of the electrically conductive silver particles. Nevertheless it may be possible that said silver particles comprise small amounts of other metals as impurities.
- the term "average particle size” refers to the D 50 value of the cumulative volume distribution curve at which 50% by volume of the particles have a diameter less than said value.
- the volume average particle size or D 50 value is measured in the present invention through laser diffractometry, preferably using a Malvern Mastersizer 2000 available from Malvern Instruments Ltd. In this technique, the size of particles in suspensions or emulsions is measured using the diffraction of a laser beam, based on application of either Fraunhofer or Mie theory. In the present invention, Mie theory or a modified Mie theory for non-spherical particles is applied and the average particle sizes or D 50 values relate to scattering measurements at an angle from 0.02 to 135 degrees relative to the incident laser beam.
- a dispersion of the particles in a suitable liquid is prepared by using ultrasonication.
- the particle concentration in the dispersion should preferably be chosen in a way that an obscuration between 6% and 20% is obtained.
- the tap density is determined in accordance to ISO 3953 typically using a 25 cm 3 graduated glass cylinder.
- the principle of the method specified is tapping a specified amount of powder in a container by means of a tapping apparatus until no further decrease in the volume of the powder takes place.
- the mass of the powder divided by its volume after the test gives its tap density.
- Electrically conductive silver particles having a tap density of less than 1.5 g/cm 3 are unsuitable for use in the present invention because the resulting soldering strength is insufficient after the electrically conductive ink has been dried and soldered to a further metallic surface. Electrically conductive silver particles having a tap density of more than 6.5 g/cm 3 significantly reduce the processability of the corresponding inks which render these materials unsuitable for use in standard industrial applications.
- Preferred electrically conductive silver particles have an average particle size of 2 ⁇ to 20 ⁇ , and more preferably of 3 ⁇ to 10 ⁇ .
- the preferred tap density of the electrically conductive silver particles is from 2.5 g/cm 3 to 6.0 g/cm 3 , and more preferably from 3.5 g/cm 3 to 5.5 g/cm 3 .
- electrically conductive silver particles which have an average particle size of 2 ⁇ to 20 ⁇ and a tap density of 2.5 g/cm 3 to 6.0 g/cm 3 . More preferably electrically conductive silver particles are used which have an average particle size of 3 ⁇ to 10 ⁇ and a tap density of 3.5 g/cm 3 to 5.5 g/cm 3 .
- the electrically conductive silver particles have a specific surface area of 0.1 m 2 /g to 1.6 m 2 /g.
- the preferred specific surface area of the electrically conductive silver particles is from 0.2 m 2 /g to 1.2 m 2 /g, and more preferably from 0.3 m 2 /g to 0.8 m 2 /g.
- specific surface area refers to the BET specific surface area which is determined in accordance to ASTM B922-10 widely using nitrogen as an analysis gas.
- Electrically conductive silver particles having a specific surface area of more than 1 .6 m 2 /g are not preferred for use in the present invention because the resulting soldering strength is often insufficient after the electrically conductive ink has been dried and soldered to a further metallic surface. Electrically conductive silver particles having a specific surface area of less than 0.1 m 2 /g can significantly reduce the processability of the corresponding inks which render these materials unsuitable for use in standard industrial applications.
- Preferred electrically conductive silver particles have an average particle size of 2 ⁇ to 20 ⁇ , a tap density of 2.5 g/cm 3 to 6.0 g/cm 3 , and a specific surface area of 0.2 m 2 /g to 1 .2 m 2 /g.
- Electrically conductive silver particles having an average particle size of 3 ⁇ to 10 ⁇ , a tap density of 3.5 g/cm 3 to 5.5 g/cm 3 , and a specific surface area of 0.3 m 2 /g to 0.8 m 2 /g are particularly preferably used in the electrically conductive ink of the present invention.
- the electrically conductive silver particles according to the invention may be present in the electrically conductive ink in an amount of 38 to 85 wt.-%, preferably in an amount of 45 to 75 wt.-%, and particularly preferably in an amount of 52 to 68 wt.-%, each based on the total amount of the electrically conductive ink.
- Suitable electrically conductive silver particles are presently available commercially from several companies, such as Metalor Technologies, Ferro Corp., Technic Inc., Eckart GmbH, Ames Goldsmith Corp., Potters Industries Inc., Dowa Holdings Co., Ltd., Mitsui and Fukuda.
- the electrically conductive ink of the present invention may further comprise additional electrically conductive particles, such as metal particles, metal plated particles or metal alloy particles which are substantially free of silver or only partially consist of silver. These particles may comprise other metals, such as platinum, palladium, gold, tin, indium, nickel, copper, aluminum or bismuth and/or combinations thereof. Suitable examples include silver coated copper particles, silver coated boron nitride particles, silver coated aluminum particles, and silver coated glass. Other examples include particles which comprise or consist of carbon black, carbon fibers, or graphite, such as silver coated carbon and silver coated graphite.
- the applicable average particle size will conventionally be in the range of 1 ⁇ to 40 ⁇ ; the desirable tap density and specific surface area of these particles might differ - for instance, from the above defined tap density and specific surface area of the electrically conductive silver particles - due to different densities of non-silver materials used.
- the electrically conductive ink of the present invention further comprises one or more organic solvents.
- Organic solvents are utilized to substantially dissolve the aromatic resin and to adjust the viscosity of the electrically conductive ink.
- Solvents which may be utilized include esters, ethers, ether-esters, ketones or combinations thereof.
- Exemplary organic solvents include amy!
- the organic solvent of the electrically conductive adhesive is a glycol ether acetate, such as Carbitol acetate.
- the electrically conductive ink preferably comprises the organic solvent(s) in a total amount of 5 to 50 wt.-%, more preferably in an amount of 15 to 35 wt.-%, each based on the total amount of the electrically conductive ink.
- the electrically conductive ink of the present invention may further comprise one or more additives, such as flow additives, rheology modifiers, plasticizers, oils, stabilizers, antioxidants, anti-corrosion agents, chelating agents, pigments, dyestuffs, polymeric additives, defoamers, preservatives, thickeners, humectants, adhesion promoters, dispersing agents or any combination thereof.
- additives such as flow additives, rheology modifiers, plasticizers, oils, stabilizers, antioxidants, anti-corrosion agents, chelating agents, pigments, dyestuffs, polymeric additives, defoamers, preservatives, thickeners, humectants, adhesion promoters, dispersing agents or any combination thereof.
- additives When used, additives are used in an amount sufficient to provide the desired properties.
- One or more additives may be present in the inventive electrically conductive ink in an amount in the range of about 0.05 to about 20 wt.-%, preferably in an amount in the range of about 1 wt.-% to about 10 wt.-%, and more preferably in an amount in the range of about 2 wt.-% to about 5 wt.-%, each based on the total amount of the electrically conductive ink.
- One typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
- Another typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
- a further typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
- a further typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
- the electrically conductive ink of the present invention can be applied by any technique known in the art, including screen printing. By exposing said ink to an appropriate temperature, such as to a temperature of 70 °C to 300 °C, the organic solvent is evaporated and the electrically conductive ink is dried. Typically, the electrically conductive ink of the present invention is dried in box oven or conveyor belt oven by heat convection or infrared.
- the preferred drying temperature is in the range of 140 to 200 °C, wherein preferred drying time are in the range of 1 min to 10 min.
- the dried product exhibits an excellent adhesion to various metallic surfaces, such as aluminum, and a low electrical resistance.
- the dried product can be soldered to further metallic substrates thereby forming a stable and reliable electrical
- the dried product of the electrically conductive ink is a further aspect of the present invention.
- the present invention further provides a bonded assembly, comprising a first substrate and a second substrate which are electrically connected, wherein the first substrate exhibits one or more electrically conductive pathways on its surface, which are formed by the dried product of the electrically conductive ink of the present invention and said one or more electrically conductive pathways are attached to the second substrate by a soldering material thereby forming an electrically conductive connection between the first and the second substrate.
- the electrically conductive ink of the present invention can be used to form one or more electrically conductive pathways on various aluminum or aluminum- containing surfaces, wherein said pathway can be soldered directly to further metallic substrates. These unique properties can be used in the fabrication of solar cell modules.
- the electrically conductive ink of the present invention is applied to the rear aluminum surface of c-Si solar cells. After being dried the resulting electrically conductive pathways or busbars are directly soldered to conductive connection straps, such as Sn alloy ribbons.
- another aspect of the present invention is a solar module, comprising the dried product of the electrically conductive ink of the present invention.
- An additional aspect of the present invention relates to a method of forming an electrically conductive pathway on a substrate, comprising the steps of
- a further aspect of the present invention relates to a method of forming a bonded assembly, comprising the steps of:
- the electrically conductive ink of the present invention can be used in the fabrication of electronic devices, such as solar modules, built up from cells with an Al structure on the back (full Al back surface field, full Al emitter, Al containing electrodes,).
- the invention also relates to the use of the electrically conductive ink of the present invention in the fabrication of electronic devices, such as solar modules, built up from cells with an Al structure on the back.
- the invention further relates to the use of said ink to form an electrically conductive pathway on a substrate, which comprises or essentially consists of aluminum.
- Preferred substrates include the rear surface of c-Si solar modules.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Sustainable Energy (AREA)
- Computer Hardware Design (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Power Engineering (AREA)
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- Polymers & Plastics (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
La présente invention concerne des compositions adaptées à un emploi en tant qu'encres électroconductrices dans la fabrication de dispositifs électroniques, tels que des modules solaires C-Si. L'encre électroconductrice comprend a) une ou plusieurs résines aromatiques; des particules d'argent électroconductrices de granulométrie moyenne comprise entre 1 μm et 40 μm, et une masse volumique tassée comprise entre 1,5 g/cm3 et 6,5 g/cm3; et c) un ou plusieurs solvants organiques. La présente invention concerne en outre un procédé de formation d'un circuit électroconducteur sur un substrat ainsi qu'un procédé de formation d'un assemblage lié utilisant ladite encre électroconductrice.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2013/074294 WO2014169444A1 (fr) | 2013-04-17 | 2013-04-17 | Encres électroconductrices |
CN201480022095.5A CN105378005B (zh) | 2013-04-17 | 2014-02-17 | 导电油墨 |
DK14784770.1T DK2986682T3 (da) | 2013-04-17 | 2014-02-17 | Elektrisk ledende blæk |
JP2016507983A JP6370881B2 (ja) | 2013-04-17 | 2014-02-17 | 導電性インク |
PCT/CN2014/072149 WO2014169728A1 (fr) | 2013-04-17 | 2014-02-17 | Encres électroconductrices |
EP14784770.1A EP2986682B1 (fr) | 2013-04-17 | 2014-02-17 | Encres électroconductrices |
KR1020157030003A KR102214300B1 (ko) | 2013-04-17 | 2014-02-17 | 전기 전도성 잉크 |
TW103108581A TWI627236B (zh) | 2013-04-17 | 2014-03-12 | 導電油墨 |
US14/882,648 US20160035910A1 (en) | 2013-04-17 | 2015-10-14 | Electrically conductive inks |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2013/074294 WO2014169444A1 (fr) | 2013-04-17 | 2013-04-17 | Encres électroconductrices |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2013/089199 Continuation WO2015085534A1 (fr) | 2013-04-17 | 2013-12-12 | Encres électroconductrices |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2014/072149 Continuation WO2014169728A1 (fr) | 2013-04-17 | 2014-02-17 | Encres électroconductrices |
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WO2014169444A1 true WO2014169444A1 (fr) | 2014-10-23 |
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PCT/CN2013/074294 WO2014169444A1 (fr) | 2013-04-17 | 2013-04-17 | Encres électroconductrices |
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WO2016147867A1 (fr) * | 2015-03-13 | 2016-09-22 | 昭栄化学工業株式会社 | Pâte électroconductrice pour la formation d'une électrode de cellule solaire |
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JP2004087183A (ja) * | 2002-08-23 | 2004-03-18 | Toppan Forms Co Ltd | 軟ろう金属微粒子を含有する導電性インキ |
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JPWO2016147867A1 (ja) * | 2015-03-13 | 2017-12-21 | 昭栄化学工業株式会社 | 太陽電池電極形成用導電性ペースト |
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