WO2015085534A1 - Encres électroconductrices - Google Patents

Encres électroconductrices Download PDF

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Publication number
WO2015085534A1
WO2015085534A1 PCT/CN2013/089199 CN2013089199W WO2015085534A1 WO 2015085534 A1 WO2015085534 A1 WO 2015085534A1 CN 2013089199 W CN2013089199 W CN 2013089199W WO 2015085534 A1 WO2015085534 A1 WO 2015085534A1
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WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive ink
substrate
ink according
aromatic
Prior art date
Application number
PCT/CN2013/089199
Other languages
English (en)
Inventor
Kily WU
Anja Henckens
Original Assignee
Ablestik (Shanghai) Limited
Henkel Ag & Co. Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ablestik (Shanghai) Limited, Henkel Ag & Co. Kgaa filed Critical Ablestik (Shanghai) Limited
Priority to PCT/CN2013/089199 priority Critical patent/WO2015085534A1/fr
Priority to PCT/CN2014/072149 priority patent/WO2014169728A1/fr
Priority to KR1020157030003A priority patent/KR102214300B1/ko
Priority to CN201480022095.5A priority patent/CN105378005B/zh
Priority to EP14784770.1A priority patent/EP2986682B1/fr
Priority to DK14784770.1T priority patent/DK2986682T3/da
Priority to JP2016507983A priority patent/JP6370881B2/ja
Priority to TW103108581A priority patent/TWI627236B/zh
Publication of WO2015085534A1 publication Critical patent/WO2015085534A1/fr
Priority to US14/882,648 priority patent/US20160035910A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to compositions that are suitable for use as electrically conductive inks in the fabrication of electronic devices, such as c-Si solar modules.
  • the electrically conductive ink comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 ⁇ to 40 ⁇ , and a tap density of 1 .5 g/cm 3 to 6.5 g/cm 3 and c) one or more organic solvents.
  • the present invention further relates to a method of forming an electrically conductive pathway on a substrate and to a method of forming a bonded assembly using said electrically conductive ink.
  • Electrically conductive inks are screen printable and are used to form conductive elements in electronic applications.
  • conductive inks are utilized as screen-printed electronic circuitry in through hole connection, jumpers, printed board wiring and similar electronic applications to provide stable electrical interconnections.
  • electrically conductive inks There are many drawbacks to currently available electrically conductive inks.
  • One such drawback is that many conductive inks have an insufficient adhesion to some metallic surfaces, such as aluminum.
  • a further drawback of electrically conductive inks is that these materials often do not form a stable and reliable electrical interconnection after being soldered to a further metallic substrate, such as a connection strap, like normal Sn alloy ribbons.
  • an electrically conductive ink which would exhibit a good adhesion to various metallic substrates, such as aluminum or aluminum-containing substrates. It would further be advantageous to provide an electrically conductive ink which can be soldered directly to further metallic substrate, thereby forming a stable and reliable electrical interconnection having a good bonding strength.
  • Figure 1 is a cross section SEM of C1 after soldering; before the peel (left) and after the peel (right).
  • Figure 2 is a cross section SEM of C7 after soldering; before the peel (left) and after the peel (right).
  • Figure 3 is a cross section SEM of C1 1 after soldering; before the peel (left) and after the peel (right).
  • Figure 4 is a cross section SEM of C15 after soldering; before the peel (left) and after the peel (right).
  • Figure 5 is a cross section SEM of D1 after soldering; before the peel (left) and after the peel (right).
  • Figure 6 is a cross section SEM of D5 after soldering; before the peel (left) and after the peel (right).
  • the present invention provides an electrically conductive ink having an excellent adhesion to aluminum or aluminum-containing substrates. After having been dried said electrically conductive ink can be soldered directly to further metallic substrates, wherein a stable and reliable electrical interconnection is formed which exhibits a good bonding strength.
  • the electrically conductive ink of the present invention comprises a) one or more aromatic resins; b) electrically conductive silver particles having an average particle size of 1 ⁇ to 40 ⁇ , and a tap density of 1 .5 g/cm 3 to 6.5 g/cm 3 ; and c) one or more organic solvents.
  • aromatic resin refers to oligomeric or polymeric materials comprising at least one aromatic group as part of their molecular structure. Suitable aromatic groups include phenylene groups, phenyl groups, or polycyclic aromatic groups. Preferred aromatic resins exhibit an amount of aromatic groups, based on the total amount of the resin, of at least 5 wt.-%, more preferably of at least 10 wt.-%, and particularly preferably of at least 15 wt.-%.
  • aromatic resins in the electrically conductive inks is essential for the present invention, because a sufficient adhesion to various metallic substrates, such as aluminum or aluminum- containing substrates is only achieved, when resins are employed which comprise at least one aromatic group as part of their molecular structure.
  • the aromatic resin component acts as a film forming agent and/or binder material.
  • Suitable aromatic resins may be selected from the group consisting of phenoxy resins, aromatic polyester resins, aromatic thermoplastic polyurethanes, and any combination thereof. Phenoxy resins are particularly suitable for use in the present invention.
  • phenoxy resin refers to oligomeric or polymeric poly(hydroxyethers) derived from the reaction of polyphenols, such as bisphenols and epichlorohydrin.
  • the use of phenoxy resin is advantageous because these resins have a very good thermal stability, exhibit an excellent resistance to oxygen and moisture, and do not decompose in the presence of acid or basic materials.
  • Suitable phenoxy resins for use in the present invention can be prepared by admixing from about 0.98 to about 1 .02 moles of epichlorohydrin with one mole of a dihydric phenol together with from about 0.6 to 1 .5 moles of an alkali metal hydroxide, such as, sodium hydroxide or potassium hydroxide, generally in an aqueous medium, at a temperature of about 0°C to about ⁇ until at least about 60 mole percent of the epichlorhydrin has been consumed.
  • an alkali metal hydroxide such as, sodium hydroxide or potassium hydroxide
  • carboxylic acid-grafted phenoxy resins can be prepared, for example, by reacting one or more phenoxy resins with one or more monoanhydrides of di- or polycarboxylic acids.
  • Preferred phenoxy resins have a weight average molecular weight (M w ) from 10000 g/mol to 70000 g/mol, more preferably from 20000 g/mol to 55000 g/mol.
  • M w weight average molecular weight
  • the weight average molecular weight (M w ) is determined by gel permeation chromatography (GPC) preferably using a polystyrene standard.
  • Phenoxy resins suitable for use in the present invention include Phenoxy PKHH, a trade designation of InChem Corp. for a condensation polymer derived from bisphenol-A (2,2-bis(p-hydroxyphenyl)propane and epichlorohydrin.
  • the total amount of all aromatic resins present in the electrically conductive ink of the present invention is in the range of about 4 to about 25 wt.-%, preferably in the range of about 6 to about 15 wt.-%, and more preferably in the range of about 8 to about 12 wt.-%, each based on the total amount of the electrically conductive ink of the present invention.
  • the total amount of all phenoxy resins present in the electrically conductive ink of the present invention is in the range of about 4 to about 25 wt.-%, preferably in the range of about 6 to about 15 wt.-%, and more preferably in the range of about 8 to about 12 wt.-%, each based on the total amount of the electrically conductive ink of the present invention.
  • the electrically conductive ink of the present invention further comprises electrically conductive silver particles having an average particle size of 1 ⁇ to 40 ⁇ , and a tap density of 1 .5 g/cm 3 to 6.5 g/cm 3 .
  • electrically conductive silver particles refers to particles mainly consisting of silver (Ag).
  • the electrically conductive silver particles have a silver content of at least 95 wt.-%, more preferably of at least 98 wt.-%, and particularly preferably of at least 99 wt.-%, each based on the total amount of the electrically conductive silver particles. Nevertheless it may be possible that said silver particles comprise small amounts of other metals as impurities.
  • the term "average particle size” refers to the D 50 value of the cumulative volume distribution curve at which 50% by volume of the particles have a diameter less than said value.
  • the volume average particle size or D 50 value is measured in the present invention through laser diffractometry, preferably using a Malvern Mastersizer 2000 available from Malvern Instruments Ltd. In this technique, the size of particles in suspensions or emulsions is measured using the diffraction of a laser beam, based on application of either Fraunhofer or Mie theory. In the present invention, Mie theory or a modified Mie theory for non-spherical particles is applied and the average particle sizes or D 50 values relate to scattering measurements at an angle from 0.02 to 135 degrees relative to the incident laser beam.
  • a dispersion of the particles in a suitable liquid is prepared by using ultrasonication.
  • the particle concentration in the dispersion should preferably be chosen in a way that an obscuration between 6% and 20% is obtained.
  • the tap density is determined in accordance to ISO 3953 typically using a 25 cm 3 graduated glass cylinder.
  • the principle of the method specified is tapping a specified amount of powder in a container by means of a tapping apparatus until no further decrease in the volume of the powder takes place.
  • the mass of the powder divided by its volume after the test gives its tap density.
  • Electrically conductive silver particles having a tap density of less than 1 .5 g/cm 3 are unsuitable for use in the present invention because the resulting soldering strength is insufficient after the electrically conductive ink has been dried and soldered to a further metallic surface.
  • Electrically conductive silver particles having a tap density of more than 6.5 g/cm 3 significantly reduce the processability of the corresponding inks which render these materials unsuitable for use in standard industrial applications.
  • Preferred electrically conductive silver particles have an average particle size of 2 ⁇ to 20 ⁇ , and more preferably of 3 ⁇ to 10 ⁇ .
  • the preferred tap density of the electrically conductive silver particles is from 2.5 g/cm 3 to 6.0 g/cm 3 , and more preferably from 3.5 g/cm 3 to 5.5 g/cm 3 .
  • electrically conductive silver particles which have an average particle size of 2 ⁇ to 20 ⁇ and a tap density of 2.5 g/cm 3 to 6.0 g/cm 3 . More preferably electrically conductive silver particles are used which have an average particle size of 3 ⁇ to 10 ⁇ and a tap density of 3.5 g/cm 3 to 5.5 g/cm 3 .
  • the electrically conductive silver particles have a specific surface area of 0.1 m 2 /g to 1 .6 m 2 /g.
  • the preferred specific surface area of the electrically conductive silver particles is from 0.2 m 2 /g to 1 .2 m 2 /g, and more preferably from 0.3 m 2 /g to 0.8 m 2 /g.
  • specific surface area refers to the BET specific surface area which is determined in accordance to ASTM B922-10 widely using nitrogen as an analysis gas.
  • Electrically conductive silver particles having a specific surface area of more than 1 .6 m 2 /g are not preferred for use in the present invention because the resulting soldering strength is often insufficient after the electrically conductive ink has been dried and soldered to a further metallic surface. Electrically conductive silver particles having a specific surface area of less than 0.1 m 2 /g can significantly reduce the processability of the corresponding inks which render these materials unsuitable for use in standard industrial applications.
  • Preferred electrically conductive silver particles have an average particle size of 2 ⁇ to 20 ⁇ , a tap density of 2.5 g/cm 3 to 6.0 g/cm 3 , and a specific surface area of 0.2 m 2 /g to 1 .2 m 2 /g.
  • Electrically conductive silver particles having an average particle size of 3 ⁇ to 10 ⁇ , a tap density of 3.5 g/cm 3 to 5.5 g/cm 3 , and a specific surface area of 0.3 m 2 /g to 0.8 m 2 /g are particularly preferably used in the electrically conductive ink of the present invention.
  • the electrically conductive silver particles according to the invention may be present in the electrically conductive ink in an amount of 38 to 85 wt.-%, preferably in an amount of 45 to 75 wt.-%, and particularly preferably in an amount of 52 to 68 wt.-%, each based on the total amount of the electrically conductive ink.
  • Suitable electrically conductive silver particles are presently available commercially from several companies, such as Metalor Technologies, Ferro Corp., Technic Inc., Eckart GmbH, Ames
  • the present invention is to address the drawbacks of conventional conductive ink materials, by presenting conductive ink compositions that can be easily soldered after drying and provide good adhesion to various metallic substrates, such as aluminum or aluminum- containing substrates.
  • peel strength is a straight forward way to tell both the adhesion of ink to target substrates and soldering strength of ink to a second bonding solder material.
  • Good peel strength indicates good adhesion and good soldering strength. Therefore, good peel strength is required by many industry interconnection applications.
  • One example is interconnection of solar cells into modules. Module manufacturers require good peel strength of soldered ribbons to cells, which would be essential for module reliability and facilitate transportation of interconnected cell strings.
  • the filler has preferably compatible morphology for compatible packing in the ink, which is not too dense for melted SnPb to penetrate during the soldering process. This can be seen in figures 1 and 2.
  • SEM pictures with x1000 magnification are presented for final formulations.
  • Sample cross section was achieved by extremely low temperature fracture of sample in liquid nitrogen. Therefore, very clear- cut cross section morphology was obtained.
  • SEM pictures were obtained from Hitachi S-3400N under BSE mode with 10-20kV accelerating voltage.
  • a Horiba EDX set was attached to S-3400N to provide elemental analysis of designated area of interest.
  • the electrically conductive ink of the present invention may further comprise additional electrically conductive particles, such as metal particles, metal plated particles or metal alloy particles which are substantially free of silver or only partially consist of silver. These particles may comprise other metals, such as platinum, palladium, gold, tin, indium, nickel, copper, aluminum or bismuth and/or combinations thereof. Suitable examples include silver coated copper particles, silver coated boron nitride particles, silver coated aluminum particles, and silver coated glass. Other examples include particles which comprise or consist of carbon black, carbon fibers, or graphite, such as silver coated carbon and silver coated graphite.
  • the electrically conductive ink of the present invention further comprises one or more organic solvents.
  • Organic solvents are utilized to substantially dissolve the aromatic resin and to adjust the viscosity of the electrically conductive ink.
  • Solvents which may be utilized include esters, ethers, ether-esters, ketones or combinations thereof.
  • Exemplary organic solvents include amy!
  • the organic solvent of the electrically conductive adhesive is a glycol ether acetate, such as Garbitol acetate.
  • the electrically conductive ink preferably comprises the organic solvent(s) in a total amount of 5 to 50 wt.-%, more preferably in an amount of 15 to 35 wt.-%, each based on the total amount of the electrically conductive ink.
  • the electrically conductive ink of the present invention may further comprise one or more additives, such as flow additives, rheology modifiers, plasticizers, oils, stabilizers, antioxidants, anti-corrosion agents, chelating agents, pigments, dyestuffs, polymeric additives, defoamers, preservatives, thickeners, humectants, adhesion promoters, dispersing agents or any combination thereof.
  • additives such as flow additives, rheology modifiers, plasticizers, oils, stabilizers, antioxidants, anti-corrosion agents, chelating agents, pigments, dyestuffs, polymeric additives, defoamers, preservatives, thickeners, humectants, adhesion promoters, dispersing agents or any combination thereof.
  • additives are used in an amount sufficient to provide the desired properties.
  • One or more additives may be present in the inventive electrically conductive ink in an amount in the range of about 0.05 to about 20 wt.-%, preferably in an amount in the range of about 1 to about 10 wt.-%, more preferably in an amount in the range of about 0.1 wt.-% to about 5 wt.-%, more preferably in an amount in the range of about 0.2 wt.-% to about 5 wt.-% and even more preferably in an amount in the range of about 0.2 wt.-% to about 2 wt.-%, each based on the total amount of the electrically conductive ink.
  • One typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
  • Another typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
  • a further typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
  • a further typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
  • a further typical formulation of the electrically conductive ink of the present invention comprises or consists of, based on the total amount of said ink:
  • the electrically conductive ink of the present invention can be applied by any technique known in the art, including screen printing. By exposing said ink to an appropriate temperature, such as to a temperature of 70 °C to 300 °C, the organic solvent is evaporated and the electrically conductive ink is dried. Typically, the electrically conductive ink of the present invention is dried in box oven or conveyor belt oven by heat convection or infrared.
  • the preferred drying temperature is in the range of 140°C to 200 q C, wherein preferred drying time are in the range of 1 min to 10 min.
  • the dried product exhibits an excellent adhesion to various metallic surfaces, such as aluminum, and a low electrical resistance.
  • the dried product can be soldered to further metallic substrates thereby forming a stable and reliable electrical interconnection.
  • the dried product of the electrically conductive ink is a further aspect of the present invention.
  • the present invention further provides a bonded assembly, comprising a first substrate and a second substrate which are electrically connected, wherein the first substrate exhibits one or more electrically conductive pathways on its surface, which are formed by the dried product of the electrically conductive ink of the present invention and said one or more electrically conductive pathways are attached to the second substrate by a soldering material thereby forming an electrically conductive connection between the first and the second substrate.
  • the electrically conductive ink of the present invention can be used to form one or more electrically conductive pathways on various aluminum or aluminum-containing surfaces, wherein said pathway can be soldered directly to further metallic substrates. These unique properties can be used in the fabrication of solar cell modules.
  • the electrically conductive ink of the present invention is applied to the rear aluminum surface of c-Si solar cells. After being dried the resulting electrically conductive pathways or busbars are directly soldered to conductive connection straps, such as Sn alloy ribbons.
  • another aspect of the present invention is a solar module, comprising the dried product of the electrically conductive ink of the present invention.
  • An additional aspect of the present invention relates to a method of forming an electrically conductive pathway on a substrate, comprising the steps of
  • a further aspect of the present invention relates to a method of forming a bonded assembly, comprising the steps of:
  • the electrically conductive ink of the present invention can be used in the fabrication of electronic devices, such as solar modules, built up from cells with an Al structure on the back (full Al back surface field, full Al emitter, Al containing electrodes,).
  • the invention also relates to the use of the electrically conductive ink of the present invention in the fabrication of electronic devices, such as solar modules, built up from cells with an Al structure on the back.
  • the invention further relates to the use of said ink to form an electrically conductive pathway on a substrate, which comprises or essentially consists of aluminum.
  • Preferred substrates include the Al containing rear surface of c-Si solar cells. Examples
  • Phenoxy resin PKHH supplied by InChem Phenolic resin in solvent PF9132KP supplied by Momentive; Polyurethane aromatic ESTANE 5703 supplied by Lubrizol; Ag flake GA238-1 1 supplied by Metalor; Ag powder D-2466P supplied by Metalor; Ag powder C-2462P supplied by Metalor;
  • Pigment to binder ratio i.e. 5.84 6.61 7.33
  • ribbon fluxing ribbon is placed into fluxing agent, i.e. X33-08I (Henkel), for several minutes; subsequently take them out and dried up in heated air flow
  • soldering process soldering is manually done in secs/busbar by using heated solder head with working temperature of 360 2 C
  • Peel strength measurement is done with tester model TR1000 supplied by Chemlnstruments. Peel strength tests are done in Adhesion/Release mode with peel angle of 90 s and speed of 15 cm/min. Strength unit is Newton. The whole testing is similar with what's described in ASTM D6862-1 1 , with the rigid adherend being fired Al and flexible adherend being SnPb ribbon in this case. Filler Filler name Specifications : Peel strength,
  • PVD Al Al formed by physical vapor deposition on cell back
  • Elemental analysis was done for the area of interest: dry ink cross section area from underneath the SnPb/ink interface till half depth of dry ink layer.
  • a Horiba EDX set was attached to section scanning electron microscope S-3400N to provide elemental analysis of designated area of interest. Processing option was all elements analyzed (Normalised).
  • Samples were prepared according to the general formula above and aromatic, non-aromatic and resin blends were varied as specified in the table below, carbitol acetate was used as solvent.
  • Example D shows that aromatic resins provide excellent adhesion especially on fired aluminium, which is essential factor for a good peel. Non-aromatics provide weak adhesion and hence, the peel strength is low. This is also shown in figures 5 and 6.
  • Elemental analysis was done for the area of interest: fired Al cross section area from underneath the ink/AI interface till half depth of fired Al layer.
  • a Horiba EDX set was attached to section scanning electron microscope S-3400N to provide elemental analysis of designated area of interest. Processing option was all elements analyzed (Normalised).

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

La présente invention concerne des compositions qui sont appropriées pour être utilisées comme encres électroconductrices dans la fabrication de dispositifs électroniques, tels que des modules solaires à base de c-Si. Ladite encre électroconductrice comprend a) une ou plusieurs résines aromatiques ; b) des particules électroconductrices d'argent ayant une taille particulaire moyenne comprise entre 1 μm et 40 μm, et une masse volumique après tassement comprise entre 1,5 g/cm3 et 6,5 g/cm3 ; et c) un ou plusieurs solvants organiques. La présente invention concerne en outre un procédé de formation d'un chemin électroconducteur sur un substrat et un procédé pour former un ensemble lié à l'aide de ladite encre électroconductrice.
PCT/CN2013/089199 2013-04-17 2013-12-12 Encres électroconductrices WO2015085534A1 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
PCT/CN2013/089199 WO2015085534A1 (fr) 2013-12-12 2013-12-12 Encres électroconductrices
PCT/CN2014/072149 WO2014169728A1 (fr) 2013-04-17 2014-02-17 Encres électroconductrices
KR1020157030003A KR102214300B1 (ko) 2013-04-17 2014-02-17 전기 전도성 잉크
CN201480022095.5A CN105378005B (zh) 2013-04-17 2014-02-17 导电油墨
EP14784770.1A EP2986682B1 (fr) 2013-04-17 2014-02-17 Encres électroconductrices
DK14784770.1T DK2986682T3 (da) 2013-04-17 2014-02-17 Elektrisk ledende blæk
JP2016507983A JP6370881B2 (ja) 2013-04-17 2014-02-17 導電性インク
TW103108581A TWI627236B (zh) 2013-04-17 2014-03-12 導電油墨
US14/882,648 US20160035910A1 (en) 2013-04-17 2015-10-14 Electrically conductive inks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2013/089199 WO2015085534A1 (fr) 2013-12-12 2013-12-12 Encres électroconductrices

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PCT/CN2013/074294 Continuation WO2014169444A1 (fr) 2013-04-17 2013-04-17 Encres électroconductrices

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017143901A1 (fr) * 2016-02-22 2017-08-31 Henkel Ag & Co. Kgaa Composition électriquement conductrice et applications pour ladite composition
EP3872143A1 (fr) 2020-02-28 2021-09-01 Henkel AG & Co. KGaA Encre conductrice, son utilisation et procédé de fabrication d'un circuit électronique l'utilisant

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