WO2014157665A1 - Composition de résine durcissable par rayon d'énergie et produit durci correspondant - Google Patents

Composition de résine durcissable par rayon d'énergie et produit durci correspondant Download PDF

Info

Publication number
WO2014157665A1
WO2014157665A1 PCT/JP2014/059287 JP2014059287W WO2014157665A1 WO 2014157665 A1 WO2014157665 A1 WO 2014157665A1 JP 2014059287 W JP2014059287 W JP 2014059287W WO 2014157665 A1 WO2014157665 A1 WO 2014157665A1
Authority
WO
WIPO (PCT)
Prior art keywords
meth
acrylate
resin composition
skeleton
acrylate compound
Prior art date
Application number
PCT/JP2014/059287
Other languages
English (en)
Japanese (ja)
Inventor
潤 木戸場
雄一朗 松尾
伸彦 内藤
Original Assignee
日本化薬株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本化薬株式会社 filed Critical 日本化薬株式会社
Publication of WO2014157665A1 publication Critical patent/WO2014157665A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F216/38—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an acetal or ketal radical
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Definitions

  • Energy beam curable resin is generally excellent in workability because it can be processed without solvent. Further, since the curing speed is fast and the energy requirement is low, the energy beam curing technique is an important technique in various industries including display peripheral materials.
  • thin displays called flat panel displays (FPD), in particular, plasma displays (PDP) and liquid crystal displays (LCD) have been put on the market and are widely used.
  • organic EL displays OLEDs are expected as next-generation self-luminous thin film displays, and some products have already been put into practical use.
  • An organic EL element of an organic EL display has a structure in which an element body composed of a thin film laminate including a light emitting layer sandwiched between a cathode and an anode is formed on a glass substrate on which a driving circuit such as a TFT is formed.
  • a layer such as a light emitting layer or an electrode of the element portion is easily deteriorated by moisture or oxygen, and the deterioration of brightness, life, and discoloration occurs due to the deterioration. Therefore, the organic EL element is sealed so as to block moisture or impurities from entering from the outside.
  • a higher-performance sealing material is desired, and various sealing techniques have been studied.
  • Patent Document 1 As a typical sealing method of an organic EL element, a method of fixing a metal or glass sealing cap in which a desiccant is inserted in advance to a substrate of an organic EL element using a sealing adhesive has been studied.
  • Patent Document 1 an adhesive is applied to the outer peripheral portion of the substrate of the organic EL element, a sealing cap is placed thereon, and then the adhesive is solidified to fix the substrate and the sealing cap. It is sealed.
  • sealing with a glass sealing cap is the mainstream.
  • a glass sealing cap is produced by processing a digging for inserting a desiccant into a flat glass substrate, and thus tends to be expensive.
  • the sealing with the sealing cap cannot extract light from the sealing cap side.
  • the light emitted from the light source is extracted from the substrate side of the element, and is limited to the bottom emission type element.
  • a bottom emission type element there are problems of a decrease in aperture ratio due to the drive circuit portion formed on the substrate and a decrease in extraction efficiency due to light being partially blocked by the drive circuit portion. Therefore, development of a sealing method applicable to a top emission type element that extracts light from the opposite side of the substrate of the organic EL element is desired.
  • the thin film sealing method is a method in which a thin film made of an inorganic or organic material is laminated on an organic EL element to form a passivation film (Patent Document 2).
  • Patent Document 2 In order to impart sufficient moisture resistance to the device by this method, it is necessary to sequentially stack a number of thin films on the device. Therefore, in the thin film sealing method, the film forming process is long and expensive, and the initial investment tends to be high due to the introduction of a large vacuum system required for film formation.
  • the solid sealing method is a method in which a passivation film is provided so as to cover the entire element portion of the organic EL element, and a transparent substrate for sealing is provided thereon via a sealing material (see Patent Document 3).
  • a passivation film is formed by vapor deposition or sputtering of an inorganic material, and it is often an incomplete film having pinholes or a film having low mechanical strength. Therefore, in the solid sealing method, after providing a passivation film on the element, a sealing transparent substrate such as a glass substrate is provided through a sealing adhesive to improve sealing reliability.
  • a sealing method is attracting attention as a method capable of sealing a top emission type element simply and at low cost.
  • the sealing adhesive used for these has high transmittance in the visible light region, light resistance that can withstand light emission, stable moldability, low curing shrinkage for suppressing residual stress, and light emitting elements in moisture. For example, a low water vapor transmission rate for protecting from water is required.
  • a solid sealing method using a known adhesive as an organic EL element sealing adhesive, satisfactory results are obtained with reliability, productivity, and water vapor transmission rate. It is difficult to do so, and it has been desired to develop a sealing adhesive that can be suitably used for the solid sealing method.
  • Japanese Patent No. 3876630 Japanese Patent No. 2679586 Japanese Patent No. 4421938 Japanese Patent No. 4655172 Japanese Unexamined Patent Publication No. 2001-81182 Japanese Unexamined Patent Publication No. 2000-169552
  • An object of the present invention is to provide a resin composition suitable for an organic EL device sealing material and a cured product having excellent visible light transmittance, low brittleness, curing shrinkage, and moisture permeability.
  • an energy beam curable resin composition having a specific composition and a cured product thereof can solve the above problems, and have completed the present invention.
  • the present invention relates to the following (1) to (6).
  • R 8 represents a direct bond or an alkylene group or alkyleneoxy group having 1 to 6 carbon atoms.
  • R 9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • Z represents a carbon atom, oxygen Represents an atom or nitrogen atom
  • a (meth) acrylate compound (B) having a heterocyclic skeleton having a skeleton different from the (meth) acrylate compound (A) having a heterocyclic skeleton is tetrahydrofurfuryl (meth) acrylate, alkoxylated tetrahydrofur It is a (meth) acrylate compound selected from the group consisting of furyl acrylate caprolactone-modified tetrahydrofurfuryl (meth) acrylate, isocyanuric acid EO-modified di- and triacrylate, pentamethylpiperidinyl methacrylate and tetramethylpiperidinyl methacrylate (2
  • the content of the (meth) acrylate compound represented by the above formula (1) is 10 to 90 parts by weight with respect to 100 parts by weight of the resin composition, according to (2) or (3) Resin composition.
  • a low moisture-permeable barrier film obtained by curing the resin composition according to any one of (1) to (4).
  • the resin composition of the present invention and its cured product are particularly suitable for an organic EL device sealing material because of its excellent visible light transmittance and low brittleness, moisture permeability and cure shrinkage.
  • the resin composition of the present invention contains a mixture of a (meth) acrylate compound having a heterocyclic skeleton having two different structures as a (meth) acrylate compound having a heterocyclic skeleton, and a polymerization initiator (C).
  • (meth) acrylate compounds having two different types of heterocyclic skeletons are mutually introduced into the curing system at the time of curing, and a compound having a cyclic skeleton is achieved while achieving a low shrinkage. It becomes possible to achieve an extremely excellent effect of low water vapor transmission rate that could not be achieved only by adding the kind.
  • the skeleton described in the present invention may or may not have a substituent.
  • the substituent is an alkyl group having 1 to 6 carbon atoms or An alkoxy group having 1 to 6 carbon atoms and an alkenyl group having 1 to 6 carbon atoms are preferable.
  • the (meth) acrylate compound (A) having a heterocyclic skeleton that can be used in the present invention will be described below.
  • the thing similar to what was mentioned by the compound (A) can be used, and if it has a structure different from the (meth) acrylate compound (A) which has a heterocyclic skeleton in a composition, it can be used without a problem. .
  • the heterocyclic skeleton Compared with other skeletons such as those with a chain structure, the heterocyclic skeleton has an effect of preventing the permeation of water vapor, and is disposed in a curing system together with a (meth) acrylate compound having an aromatic hydrocarbon skeleton, for example. By doing so, it becomes possible to prevent permeation
  • Specific examples of the heterocyclic skeleton that can be used include a dioxane structure, a trioxane structure, and an isocyanurate structure. Furthermore, it is preferable that a (meth) acryloyl group is connected to the heterocyclic skeleton.
  • a (meth) acryloyl group is linked directly or via a hydrocarbon group to the heterocyclic skeleton, and as a hydrocarbon group when linked via a hydrocarbon group, And an alkylene group having 1 to 10 carbon atoms or an alkylene group having 1 to 10 carbon atoms having an ether bond.
  • such a (meth) acrylate compound having a heterocyclic skeleton include, for example, the following (meth) acrylate compounds. That is, tetrahydrofurfuryl (meth) acrylate, alkoxylated tetrahydrofurfuryl acrylate caprolactone modified tetrahydrofurfuryl (meth) acrylate, morpholine (meth) acrylate, isocyanuric acid EEO modified diacrylate (M-215), ⁇ -caprolactone modified tris ( Acoxyethyl) isocyanurate (M-327), isocyanuric acid EO-modified di- and triacrylate (M-313 or M-315), hydroxypivalaldehyde-modified trimethylolpropane diacrylate (R-604), pentamethylpiperidi Nyl methacrylate (FA-711), tetramethylpiperidinyl methacrylate (FA-712HM), cyclic trimethyl
  • Examples of the (meth) acrylate compound having such a heterocyclic skeleton include, for example, morpholine skeleton, tetrahydrofuran skeleton, oxane skeleton, dioxane skeleton, triazine skeleton, carbazole skeleton, pyrrolidine skeleton, piperidine skeleton as examples of the heterocyclic ring,
  • a (meth) acrylate compound having a structure represented by the following formula (2) can be used.
  • R 8 is a direct bond or an alkylene group or alkyleneoxy group having 1 to 6 carbon atoms
  • R 9 is a hydrogen atom or an alkyl group or alkenyl group having 1 to 4 carbon atoms
  • X is a nitrogen atom or oxygen atom
  • Y represents a methylene group or a carbonyl group
  • m represents an integer of 1 to 4, provided that X is not all a methylene group.
  • a compound represented by the following formula (1) can be preferably used.
  • R 8 represents a direct bond or an alkylene group or alkyleneoxy group having 1 to 6 carbon atoms.
  • R 9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • Z represents a carbon atom, oxygen Represents an atom or a nitrogen atom.
  • the content of the (meth) acrylate compound having a heterocyclic skeleton in the resin composition is usually preferably 5 to 95 parts by weight, more preferably 10 to 80 parts by weight with respect to 100 parts by weight of the resin composition. 70 parts by weight are particularly preferred.
  • a (meth) acrylate compound having a structure represented by the following partial structural formula (A) (hereinafter, polyEO-modified (meth) acrylate)
  • the total weight of the compound (referred to as a compound) is preferably less than the total weight of the (meth) acrylate compound other than the polyEO-modified (meth) acrylate compound, and more preferably 1 ⁇ 2 or less.
  • t represents an integer of 2 or more.
  • the total weight of the polyEO-modified (meth) acrylate compound in the resin composition is preferably 10 parts by weight or less, more preferably 5 parts by weight or less with respect to 100 parts by weight of the resin composition. 2 parts by weight or less is particularly preferable.
  • the EO-modified (meth) acrylate compound having a heterocyclic skeleton which is a (meth) acrylate compound having a heterocyclic skeleton and is a polyEO-modified (meth) acrylate compound, has the heterocyclic skeleton of the present invention. Since it is preferable not to use it as the (meth) acrylate compound, even if it is used, it is preferably 20 parts by weight or less, particularly preferably 10 parts by weight or less, based on 100 parts by weight of the resin composition.
  • the content of the (meth) acrylate compound having a heterocyclic skeleton contained in the resin composition is particularly preferably 10 to 90 parts by weight with respect to 100 parts by weight of the resin composition. By setting it as the said preferable range, it becomes possible to obtain the resin composition excellent in water-vapor-permeation rate.
  • polymerization initiator (C) used in the present invention various polymerization initiators such as a photopolymerization initiator and a thermal radical polymerization initiator can be used.
  • the photopolymerization initiator include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; acetophenone, 2,2-diethoxy-2-phenylacetophenone, 2, 2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-phenylpropan-1-one, diethoxyacetophenone, 1-hydroxycyclohexyl-phenylketone, 2-methyl-1- [ Acetophenones such as 4- (methylthio) phenyl] -2-morpholinopropan-1-one and oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone]; 2-ethyl Anthraquinone Anthraquinones such as 2-tert-butylanthraquinone, 2-chloroanthraquino
  • Benzophenones such as benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 4,4′-bismethylaminobenzophenone; 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6 -Phosphine oxides such as -trimethylbenzoyl) -phenylphosphine oxide and diphenyl- (2,4,6-trimethylbenzoyl) phosphine oxide It can be.
  • Preferred are acetophenones, and more preferred are 2-hydroxy-2-methyl-phenylpropan-1-one and 1-hydroxycyclohexyl-phenyl ketone.
  • a photoinitiator may be used independently and may be used in mixture of multiple types.
  • the thermal radical polymerization initiator is not particularly limited as long as it is a compound that generates radicals by heating and initiates a chain polymerization reaction, but is not limited to organic peroxides, azo compounds, benzoin compounds, benzoin ether compounds, acetophenone compounds, benzoates. Examples thereof include pinacol, and benzopinacol is preferably used.
  • organic peroxides include Kayamek (trademark) A, M, R, L, LH, SP-30C, Parkadox (trademark) CH-50L, BC-FF, Kadox (trademark) B-40ES, and Parkadox.
  • thermal radical polymerization initiator (b) preferred are benzopinacol-based thermal radical polymerization initiators (including those obtained by chemically modifying benzopinacol).
  • benzopinacol 1,2-dimethoxy-1,1,2,2-tetraphenylethane, 1,2-diethoxy-1,1,2,2-tetraphenylethane, 1,2-diphenoxy- 1,1,2,2-tetraphenylethane, 1,2-dimethoxy-1,1,2,2-tetra (4-methylphenyl) ethane, 1,2-diphenoxy-1,1,2,2-tetra (4-methoxyphenyl) ethane, 1,2-bis (trimethylsiloxy) -1,1,2,2-tetraphenylethane, 1,2-bis (triethylsiloxy) -1,1,2,2-tetraphenyl Ethane, 1,2-bis (t-butyldimethylsiloxy) -1,1,2,2-tetraphenylethane, 1-hydroxy-2-trimethylsiloxy-1,1,2,2-tetraphenylethane, 1- And droxy-2-triethylsiloxy-1,1,2,2-tetraphenyle
  • the benzopinacol is commercially available from Tokyo Chemical Industry Co., Ltd., Wako Pure Chemical Industries, Ltd. Moreover, etherification of the hydroxy group of benzopinacol can be easily synthesized by a known method. Moreover, silyl etherification of the hydroxy group of benzopinacol can be obtained by synthesizing by a method in which the corresponding benzopinacol and various silylating agents are heated under a basic catalyst such as pyridine.
  • silylating agents examples include trimethylchlorosilane (TMCS), hexamethyldisilazane (HMDS), N, O-bis (trimethylsilyl) trifluoroacetamide (BSTFA) and triethylsilylating agents, which are generally known trimethylsilylating agents.
  • TMCS trimethylchlorosilane
  • HMDS hexamethyldisilazane
  • BSTFA O-bis (trimethylsilyl) trifluoroacetamide
  • triethylsilylating agents which are generally known trimethylsilylating agents.
  • the triethylchlorosilane (TECS) and t-butyldimethylsilylating agent examples include t-butylmethylsilane (TBMS). These reagents can be easily obtained from markets such as silicon derivative manufacturers.
  • the reaction amount of the silylating agent is preferably 1.0 to 5.0 times mol for 1 mol of the hydroxy
  • the amount is less than 1.0 mole, the reaction efficiency is poor and the reaction time is prolonged, so that thermal decomposition may be promoted.
  • the amount is more than 5.0 times, the separation may be deteriorated during the recovery or the purification may be difficult.
  • the content of the component (C) of the present invention is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the total amount of the resin composition.
  • a polymerization initiator (C) may be used independently and may be used in mixture of multiple types.
  • the (meth) acrylate compound (D) having an aromatic hydrocarbon skeleton that can be optionally contained in the resin composition of the present invention
  • known compounds are usable as long as they have at least one aromatic ring in the molecule. Either can be used.
  • the resin composition can have water repellency, and the water vapor transmission rate can be reduced.
  • the said effect can fully be show
  • the said effect will be more excellent by having two or more aromatic rings in a molecule
  • Examples of such a skeleton having two or more aromatic rings in the molecule include a biphenyl skeleton and a bisphenol skeleton, and these skeletons can exhibit excellent water vapor permeability.
  • (meth) acrylate compounds having an aromatic hydrocarbon skeleton include the following monofunctional (meth) acrylate compounds and bifunctional or higher (meth) acrylate compounds.
  • monofunctional (meth) acrylate compounds include benzyl (meth) acrylate, ethoxy modified cresol (meth) acrylate, propoxy modified cresol (meth) acrylate, neopentyl glycol benzoate (meth) acrylate, o-phenylphenol (meth) Acrylate, o-phenylphenol monoethoxy (meth) acrylate, o-phenylphenol polyethoxy (meth) acrylate, p-phenylphenol (meth) acrylate, p-phenylphenol monoethoxy (meth) acrylate, p-phenylphenol polyethoxy (Meth) acrylate compounds having a single ring such as (meth) acrylate, o-phenylbenzyl acrylate,
  • Bifunctional or higher functional (meth) acrylate compounds include (poly) ethoxy modified bisphenol A di (meth) acrylate, (poly) propoxy modified bisphenol A di (meth) acrylate, and (poly) ethoxy modified bisphenol F di (meth) acrylate.
  • Examples of the (meth) acrylate compound having an aromatic hydrocarbon skeleton include epoxy (meth) acrylate compounds in addition to the above (meth) acrylate monomers.
  • Epoxy (meth) acrylates include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, biphenyl type phenol aralkyl resin, terminal glycidyl ether of bisphenol A propylene oxide adduct, fluorene epoxy resin, bisphenol S. And a reaction product of epoxy resin such as epoxy resin and (meth) acrylic acid.
  • the (meth) acrylate compound having an aromatic hydrocarbon skeleton specifically, for example, a (meth) acrylate compound having a partial skeleton represented by the following formula (3) can be preferably used.
  • X represents a direct bond or an alkylene group having 1 to 3 carbon atoms.
  • X represents a direct bond or an alkylene group having 1 to 3 carbon atoms.
  • a (meth) acrylate compound having a bisphenol skeleton or a biphenyl skeleton corresponds to the above formula (3) and can be preferably used.
  • a (meth) acryloyl group is connected to the aromatic hydrocarbon skeleton.
  • a (meth) acryloyl group is connected to the aromatic hydrocarbon skeleton directly or via a hydrocarbon group, and the hydrocarbon group in the case of being connected via a hydrocarbon group
  • examples thereof include an alkylene group having 1 to 10 carbon atoms or an alkylene group having 1 to 10 carbon atoms having an ether bond.
  • the (meth) acrylate compound having an aromatic hydrocarbon skeleton used in the present invention is preferably a (meth) acrylate compound represented by the following formula (4).
  • R 1 represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a halogen atom, or the following formula: (5) and R 2 represents a direct bond or a (poly) alkyleneoxy group having 1 to 10 carbon atoms.
  • R 2 represents a direct bond or a (poly) alkyleneoxy group having 1 to 10 carbon atoms
  • Y represents a hydrogen atom or a methyl group
  • * represents a bond to the benzene skeleton.
  • Specific examples of such (meth) acrylate compounds include o-phenylphenol (meth) acrylate, o-phenylphenol monoethoxy (meth) acrylate, o-phenylphenol polyethoxy (meth) acrylate, p-phenylphenol (meta ) Acrylate, p-phenylphenol monoethoxy (meth) acrylate, p-phenylphenol polyethoxy (meth) acrylate, o-phenylbenzyl acrylate, p-phenylbenzyl acrylate, (poly) propoxy-modified bisphenol A di (meth) acrylate, (Poly) ethoxy modified bisphenol F di (meth) acrylate, (poly)
  • the content of the (meth) acrylate compound having an aromatic hydrocarbon skeleton in the resin composition is usually preferably 5 to 95 parts by weight, more preferably 10 to 80 parts by weight with respect to 100 parts by weight of the resin composition. 20 to 70 parts by weight are particularly preferred.
  • the (meth) acrylate compound (E) having an alicyclic hydrocarbon skeleton that can be optionally used in the present invention
  • known compounds can be used without any particular limitation, and the alicyclic hydrocarbon skeleton can be used. Is preferably a saturated hydrocarbon skeleton.
  • Such a cyclic skeleton has an effect of preventing permeation of water vapor as compared with other skeletons such as those having a chain structure, and is cured together with, for example, a (meth) acrylate compound having an aromatic hydrocarbon skeleton.
  • a synergistic effect By being arranged in the system, it becomes possible to remarkably prevent the permeation of water vapor by a synergistic effect.
  • alicyclic hydrocarbon skeleton examples include a cyclopentane skeleton, a cyclohexane skeleton, a cycloheptane skeleton, a dicyclodecane structure, a tricyclodecane ring, an adamantane ring, and an isobornyl ring.
  • (meth) acrylate compounds having a bridged cyclic hydrocarbon skeleton such as a tricyclodecane ring and an adamantane ring are preferred.
  • a (meth) acryloyl group is connected to the cyclic hydrocarbon skeleton directly or via a hydrocarbon group, and the hydrocarbon group in the case of being connected via a hydrocarbon group
  • examples thereof include an alkylene group having 1 to 10 carbon atoms or an alkylene group having 1 to 10 carbon atoms having an ether bond.
  • (meth) acrylate compounds having an alicyclic hydrocarbon skeleton include the following monofunctional (meth) acrylate compounds and bifunctional or higher (meth) acrylate compounds.
  • Monofunctional (meth) acrylate compounds include isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, cyclohexyl (meth) acrylate, 1,3-adamantanediol di (meth) acrylate, 1,3-adamantane dimethanol di (meth) acrylate, 2-methyl-2-adamantyl (meth) acrylate, 2-ethyl-2-adamantyl (meth) acrylate, 3 And alicyclic (meth) acrylate compounds such as -hydroxy-1-adamantyl (meth) acrylate and 1-adamantyl (meth
  • a (meth) acrylate compound having a structure represented by the following formula (6) can be preferably used.
  • each R 3 independently represents a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a halogen atom or the following formula (7), and at least one of R 3 is represented by the following formula (7): is there.
  • R 2 represents a direct bond or a (poly) alkyleneoxy group having 1 to 10 carbon atoms
  • Y represents a hydrogen atom or a methyl group
  • * represents a bond to a cyclic skeleton.
  • Specific examples of the (meth) acrylate compound of the above formula (6) include alicyclic (meth) acrylates such as tricyclodecane dimethanol (meth) acrylate.
  • the content of the (meth) acrylate compound having an alicyclic hydrocarbon skeleton in the resin composition is usually preferably 5 to 95 parts by weight, more preferably 10 to 80 parts by weight with respect to 100 parts by weight of the resin composition. 20 to 70 parts by weight is particularly preferable.
  • the cyclic (meth) acrylate compound (E) used in the present invention (meth) acrylate having an alicyclic hydrocarbon skeleton or (meth) acrylate having a heterocyclic skeleton can be used.
  • the resin composition contains a (meth) acrylate compound having a heterocyclic skeleton having two different structures. Will be.
  • the (meth) acrylate compound same as the above can be used for the (meth) acrylate which has an alicyclic hydrocarbon skeleton which can be used as a cyclic (meth) acrylate compound.
  • the resin composition of the present invention includes a compound (A), a compound (B), a compound (D), a compound (E) in consideration of the viscosity, refractive index, adhesion, and the like of the resin composition of the present invention to be obtained.
  • (Meth) acrylate compounds other than) may be used. Specific examples include (meth) acrylate monomers, which include monofunctional (meth) acrylate, bifunctional (meth) acrylate, and three or more (meth) acryloyl groups in the molecule. Polyfunctional (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate, and the like can be used.
  • Examples of the monofunctional (meth) acrylate include imide (meth) acrylate having an imide ring structure, butanediol mono (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2- Hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, (meth) acrylate having a hydroxyl group such as dipropylene glycol (meth) acrylate, dimethylaminoethyl (meth) acrylate, butoxyethyl (meth) acrylate, caprolactone ( (Meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, octafluoropentyl (meth) acrylate, octyl (meth) acrylate, decyl (meth) acrylate, Alkyl groups such as sode
  • Examples include (meth) acrylates of polyhydric alcohols such as (meth) acrylates, ethoxydiethylene glycol (meth) acrylates, 2-ethylhexyl carbitol (meth) acrylates, polyethylene glycol (meth) acrylates, and polypropylene glycol (meth) acrylates. Can do.
  • Examples of the (meth) acrylate monomer having two functional groups include acrylates such as diacrylated isocyanurate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, , 9-nonanediol di (meth) acrylate, (meth) acrylate having a linear methylene structure such as polytetramethylene glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene Examples thereof include di (meth) acrylates of polyhydric alcohols such as glycol di (meth) acrylate and polypropylene di (meth) acrylate.
  • acrylates such as diacrylated isocyanurate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, ,
  • polyfunctional (meth) acrylate monomer examples include polyfunctional (meth) acrylate having an isocyanurate ring such as tris (acryloxyethyl) isocyanurate, (poly) caprolactone-modified tris (acryloxyethyl) isocyanurate, pentaerythritol tri ( (Meth) acrylate, pentaerythritol tetra (meth) acrylate, (poly) ethoxy modified pentaerythritol tetra (meth) acrylate, (poly) propoxy modified pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, (poly) Caprolactone-modified dipentaerythritol penta (meth) acrylate, (poly) ethoxy-modified dipentaerythritol penta (meth) acryl
  • the content of the (meth) acrylate monomer other than the compound (A) and the compound (B) in the resin composition is usually preferably 5 to 95 parts by weight with respect to 100 parts by weight of the resin composition. 80 parts by weight is more preferable, and 20 to 70 parts by weight is particularly preferable.
  • urethane (meth) acrylate (F) can be used to the extent that the properties are not impaired.
  • the urethane (meth) acrylate include diol compounds (for example, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,4-butanediol, neopentyl glycol, 1,6- Hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 3-methyl-1,5-pentanediol, 2,4-diethyl-1,5-pentane Diol, 2-butyl-2-ethyl-1,3-propanediol, cyclohexane-1,4-dimethanol, polyethylene glycol, polypropylene glycol, bisphenol A polyethoxyd
  • the content of the urethane (meth) acrylate compound in the resin composition is usually preferably 5 to 95 parts by weight, more preferably 10 to 80 parts by weight, and more preferably 20 to 70 parts by weight with respect to 100 parts by weight of the resin composition. Particularly preferred.
  • fine particles can be appropriately contained in the resin composition.
  • the fine particles include organic fine particles and inorganic fine particles.
  • the fine particles (G) can be used alone or in combination of a plurality of types in consideration of the required light transmittance, hardness, scratch resistance, curing shrinkage rate, and refractive index. From the viewpoint of improving the transmittance (particularly, the transmittance at 380 nm to 780 nm), it is preferable not to contain fine particles.
  • a glass transition temperature is 70 degreeC or more, and 100 degreeC or more is especially preferable.
  • organic fine particles examples include polystyrene resin beads, acrylic resin beads, urethane resin beads, polycarbonate resin beads and other organic polymer beads, porous polystyrene resin beads, porous acrylic resin beads, and porous urethane resin beads.
  • Porous organic polymer beads such as porous polycarbonate resin beads, benzoguanamine-formalin condensate resin powder, benzoguanamine-melamine-formalin condensate resin powder, urea-formalin condensate resin powder, aspartic acid ester derivative powder, Examples include zinc stearate powder, stearic acid amide powder, epoxy resin powder, polyethylene powder, cross-linked polymethyl methacrylate resin beads and cross-linked polymethyl methacrylate / styrene resin beads. Etc. are preferred. These organic fine particles can be easily obtained as a commercial product, and can also be prepared with reference to known literature.
  • inorganic fine particles examples include conductive metal oxides, transparent metal oxides, and other inorganic fillers.
  • Examples of the conductive metal oxide that can be used in the present invention include zinc antimonate, tin oxide-doped indium oxide (ITO), antimony-doped tin oxide (ATO), antimony pentoxide, tin oxide, aluminum-doped zinc oxide, and gallium-doped zinc oxide. And fluorine-doped tin oxide.
  • transparent metal oxide examples include silica, titanium oxide, zirconium oxide, cerium oxide, zinc oxide, iron oxide, titanium oxide / zirconium oxide / tin oxide / antimony pentoxide composite, and zirconium oxide / tin oxide. / Antimony pentoxide composite, titanium oxide / zirconium oxide / tin oxide composite, and the like.
  • inorganic fillers that can be used in the present invention include calcium oxide, calcium chloride, zeolite, silica gel and the like.
  • the fine particles that can be used in the present invention are preferably fine particles having excellent hardness and scratch resistance and a high refractive index. Titanium oxide, zirconium oxide, cerium oxide, zinc oxide, iron oxide, titanium oxide / zirconium oxide / tin oxide / pentoxide An antimony composite, a zirconium oxide / tin oxide / antimony pentoxide composite, and a titanium oxide / zirconium oxide / tin oxide composite are preferably used.
  • the primary particle diameter of the fine particles is preferably 100 nm or less. The blending ratio of these is preferably 1 to 30 parts by mass, more preferably 5 to 20 parts by mass with respect to 100 parts by mass of the total amount of component (A) + component (B).
  • a fine particle dispersant a polycarboxylic acid dispersant, a silane coupling agent, a titanate coupling agent, a silicone dispersant such as a modified silicone oil, or an organic copolymer dispersant may be used in combination. Is possible.
  • the blending ratio of these is preferably about 0 to 30% by mass, more preferably about 0.05 to 5% by mass with respect to the total mass of the resin composition of the present invention.
  • the primary particle size means the smallest particle size of the particles when the aggregation is broken. That is, in the case of elliptical fine particles, the minor axis is the primary particle diameter.
  • the primary particle size can be measured by a dynamic light scattering method, observation with an electron microscope, or the like. Specifically, using a JSM-7700F field emission scanning electron microscope manufactured by JEOL Ltd., the primary particle size can be measured under an acceleration voltage of 30 kV.
  • the primary particle size is preferably 100 nm or less. Fine particles having a size of 5 to 100 nm can be preferably used. By being 100 nm or less, it becomes possible to provide a cured product having high transmittance while imparting scratch resistance.
  • fine particles can be used by dispersing in a solvent.
  • inorganic fine particles are readily available as commercial products in a form dispersed in water or an organic solvent.
  • organic solvents used include aromatic hydrocarbon solvents such as toluene, xylene, ethylbenzene, and tetramethylbenzene, hexane, and octane.
  • Aliphatic hydrocarbon solvents such as decane, and mixtures thereof such as petroleum ether, white gasoline, solvent naphtha, etc.
  • ester solvents include alkyl acetates such as ethyl acetate, propyl acetate and butyl acetate, and ⁇ -butyrolactone Cyclic esters such as ethylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether monoacetate, diethylene glycol monoethyl ether monoacetate, triethylene glycol monoethyl ether monoacetate, diethylene glycol monoacetate (Mono or poly) alkylene glycol monoalkyl ether monoacetates such as tilether monoacetate, propylene glycol monomethyl ether monoacetate, butylene glycol monomethyl ether monoacetate, polycarboxylic acids such as dialkyl glutarate, dialkyl succinate, dialkyl adipate Alkyl esters, etc., ether solvents include alkyl ethers such as diethyl ether and ethyl butyl ether, ethylene glycol dimethyl ether, ethylene glycol diethy
  • the content of fine particles is usually preferably 0.001 to 20 parts by weight, more preferably 0.001 to 10 parts by weight, and more preferably 0.001 to 100 parts by weight of the resin composition. ⁇ 5 parts by weight is particularly preferred.
  • the resin composition of the present invention includes a mold release agent, an antifoaming agent, a leveling agent, a light stabilizer, an antioxidant, a polymerization inhibitor, and a plasticizer in order to improve convenience during handling. Further, an antistatic agent or the like can be used in combination depending on the situation.
  • plasticizers are used to obtain durability and flexibility.
  • the material used is selected depending on the desired viscosity, durability, transparency, flexibility and the like.
  • olefin polymers such as polyethylene and polypropylene, dimethyl phthalate, diethyl phthalate, dibutyl phthalate, bis (2-ethylhexyl) phthalate, diisodecyl phthalate, butyl benzyl phthalate, diisononyl phthalate, dicyclohexyl phthalate, ethyl phthalyl ethyl glycol Phthalates such as butyl phthalyl butyl glycolate, trimellitic esters such as tris (2-ethylhexyl) trimellitate, dibutyl adipate, diisobutyl adipate, bis (2-ethylhexyl) adipate, diisononyl adipate, diisodecyl
  • polymers such as acrylic polymer, polyester elastomer, urethane polymer and nitrile rubber can be added as necessary.
  • the weight average molecular weight is preferably 10,000 g / mol or less, particularly preferably 5,000 g / mol or less, from the viewpoint of compatibility.
  • the content of the organic compound having no reactive group in the resin composition is preferably 1.5% by weight or less, and 1.0% by weight or less, based on the resin composition. Is more preferable, and 0.5% by weight or less is particularly preferable.
  • An organometallic compound such as alkylaluminum can also be added to reduce the water vapor permeability. Although a solvent can also be added, what does not add a solvent is preferable.
  • the light transmittance at each wavelength in the wavelength range of 380 to 780 nm is preferably 90% or more.
  • the light transmittance can be measured with a measuring instrument such as a spectrophotometer U-3900H manufactured by Hitachi High-Technologies Corporation.
  • the resin composition of the present invention can be prepared by mixing and dissolving each component according to a conventional method.
  • each component can be charged into a round bottom flask equipped with a stirrer and a thermometer and stirred at 20 to 80 ° C., preferably 40 to 80 ° C. for 0.5 to 6 hours.
  • the viscosity of the resin composition of the present invention is a composition having a viscosity of 1000 mPa ⁇ s or less at 25 ° C. measured using an E-type viscometer (TV-200: manufactured by Toki Sangyo Co., Ltd.) as a viscosity suitable for workability. Is preferable, and 500 mPa ⁇ s or less is particularly preferable.
  • the resin composition of the present invention can be easily cured by energy rays.
  • energy rays include electromagnetic waves such as ultraviolet rays, visible rays, infrared rays, X-rays, gamma rays and laser rays, particle rays such as alpha rays, beta rays and electron rays.
  • ultraviolet rays, laser beams, visible rays, or electron beams are preferred in the present invention.
  • the cured product of the present invention can be obtained by irradiating the resin composition of the present invention with the energy beam.
  • the liquid refractive index of the resin composition of the present invention is usually preferably from 1.45 to 1.55, more preferably from 1.48 to 1.52.
  • the refractive index can be measured with an Abbe refractometer (model number: DR-M2, manufactured by Atago Co., Ltd.).
  • the water vapor transmission rate at 60 ° C. with a thickness of 100 ⁇ m is preferably 200 g / m 2 ⁇ day or less, more preferably 100 g / m 2 ⁇ day or less, and 60 g / m. 2 ⁇ day or less is particularly preferable. By being in the said range, it becomes possible to prevent effectively that a device is damaged by permeation
  • the organic EL element solid sealing method using the resin composition of the present invention includes a step of forming a passivation film on the organic EL element formed on the substrate, and applying a sealing adhesive on the passivation film. It is preferable to have a step of providing a sealing transparent substrate and a step of curing the sealing adhesive, and the curable resin composition according to the present invention described above can be used as the sealing adhesive. .
  • the organic EL element to be sealed includes, for example, a substrate, a lower electrode, an organic EL layer including at least a light emitting layer, and an element unit body including an upper electrode.
  • the substrate is a flat substrate made of an electrically insulating material such as a glass substrate, a transparent organic material made of cycloolefin, polycarbonate, polymethyl methacrylate, or the like, or an organic / inorganic hybrid transparent substrate made of the transparent organic material made of high-rigidity glass fiber or the like.
  • a simple substrate can be used.
  • the following are mentioned as a typical structure of an element part main body.
  • a lower electrode (cathode) made of an Al—Li alloy or the like is deposited on one side of a substrate by resistance heating deposition.
  • an electron transport layer made of an oxadiazole derivative or a triazole derivative, a light-emitting layer, a hole transport layer made of TPD or the like and an upper electrode (anode) are formed by resistance heating vapor deposition.
  • the organic EL element can be manufactured by sequentially laminating by a thin film forming method such as an ion beam sputtering method.
  • the layer structure or material of the organic EL element is not particularly limited as long as it functions as a display element.
  • the resin composition of the present invention can be applied to any structure of organic EL elements.
  • the passivation film is formed so as to cover the organic EL element.
  • the passivation film can be formed by a method such as vapor deposition or sputtering of an inorganic material such as silicon nitride or silicon oxide.
  • the passivation film is provided to prevent moisture, ionic impurities, and the like from entering the organic EL element.
  • the thickness of the passivation film is preferably in the range of 10 nm to 100 ⁇ m, and more preferably in the range of 100 nm to 10 ⁇ m.
  • the passivation film is generally an incomplete film with pinholes or a film with low mechanical strength, although it depends on the film forming method. Therefore, in the solid sealing method using the resin composition of the present invention, an adhesive is further applied onto the passivation film, the adhesive is pressure-bonded using a transparent substrate for sealing, and the adhesive is cured by curing. Reliability can be increased.
  • the ultraviolet curable resin composition and cured product of the present invention were obtained with the compositions shown in the following examples.
  • the evaluation method and evaluation criteria for the resin composition and the cured film were as follows.
  • the Example containing an organic solvent it evaluated, after volatilizing an organic solvent fully with an evaporator.
  • Moisture permeability The resin composition is sandwiched between 5 mm thick glass substrates, the film thickness is adjusted using a 100 ⁇ m spacer, and cured at 3000 mJ / cm 2 with a high pressure mercury lamp (120 W / cm, ozone-less). Produced. The moisture permeability of the obtained test piece was measured with a Lyssy water vapor permeability meter L80-5000 (manufactured by Systech Illinois), 60 ° C. ⁇ 90% RH. The results are shown in Table 1.
  • Tg (glass transition point) The Tg point of the cured resin composition was measured with a viscoelasticity measurement system EXSTAR DMS-6000 (manufactured by SII Nanotechnology Co., Ltd.), tensile mode, and frequency 1 Hz. The results are shown in Table 1.
  • Curing shrinkage From the liquid specific gravity before curing at 25 ° C. and the film specific gravity at 25 ° C. obtained by curing, the curing shrinkage was calculated using the following formula (1). In addition, the test piece hardened
  • cured by the same method as the test piece of moisture permeability was used for the test piece of hardening shrinkage rate. (Formula 1) Curing shrinkage (film specific gravity ⁇ liquid specific gravity) / film specific gravity ⁇ 100 (1)
  • R-604 Neopentyl glycol-modified trimethylolpropane diacrylate, Nippon Kayaku Co., Ltd. M-315: Isocyanuric acid EO-modified di- and triacrylate, Toa Gosei Co., Ltd. THFA: Tetrahydrofurfuryl acrylate, Irgacure, Osaka Organic Chemical Co., Ltd. 184D: 1-hydroxycyclohexyl phenyl ketone, manufactured by BASF Corporation
  • the resin composition of the present invention having a specific composition has excellent visible light transmittance, high Tg, brittleness, curing shrinkage, and moisture permeability. . Therefore, for example, it is suitable for various sealing materials, especially for organic EL device sealing materials.
  • the resin composition of the present invention and its cured product have excellent visible light transmittance, high Tg, brittleness, cure shrinkage, and low moisture permeability. It is suitable.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne une composition de résine contenant des composés (méth)acrylate (A) ayant un squelette hétérocyclique, un composé (méth)acrylate (B) ayant un squelette hétérocyclique différent du squelette des composés (méth)acrylate (A) ayant un squelette hétérocyclique, et un amorceur de polymérisation (C). Au moins l'un des composés (méth)acrylate (A) ayant un squelette hétérocyclique est de préférence un composé (méth)acrylate dans lequel le squelette hétérocyclique est une structure spécifique.
PCT/JP2014/059287 2013-03-29 2014-03-28 Composition de résine durcissable par rayon d'énergie et produit durci correspondant WO2014157665A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-071028 2013-03-29
JP2013071028A JP6112603B2 (ja) 2013-03-29 2013-03-29 エネルギー線硬化型樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
WO2014157665A1 true WO2014157665A1 (fr) 2014-10-02

Family

ID=51624622

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/059287 WO2014157665A1 (fr) 2013-03-29 2014-03-28 Composition de résine durcissable par rayon d'énergie et produit durci correspondant

Country Status (3)

Country Link
JP (1) JP6112603B2 (fr)
TW (1) TW201504264A (fr)
WO (1) WO2014157665A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113192973A (zh) * 2021-04-02 2021-07-30 Tcl华星光电技术有限公司 阵列基板及微型发光二极管显示面板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6818761B2 (ja) 2016-10-14 2021-01-20 デンカ株式会社 組成物
KR101826020B1 (ko) 2016-11-15 2018-02-06 (주)휴넷플러스 무용제형 광경화 잉크젯 조성물 및 투명 경화막
JP6895917B2 (ja) * 2017-03-28 2021-06-30 三洋化成工業株式会社 活性エネルギー線硬化性組成物
CN111345116B (zh) 2017-10-26 2023-04-04 电化株式会社 有机电致发光显示元件用封装剂
JP2019143057A (ja) * 2018-02-22 2019-08-29 東洋インキＳｃホールディングス株式会社 光硬化性組成物およびディスプレイ
KR20200143442A (ko) 2018-04-16 2020-12-23 덴카 주식회사 유기 일렉트로루미네센스 표시 소자용 봉지제

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170933A (en) * 1981-04-15 1982-10-21 Showa Denko Kk Surface treating method of transparent plastic sheet
JPS6385031A (ja) * 1986-09-30 1988-04-15 Nippon Kayaku Co Ltd 光学ガラスフアイバ用コ−テイング剤
JP2003048271A (ja) * 2001-08-07 2003-02-18 Sumitomo Bakelite Co Ltd 透明水蒸気バリアフィルム
JP2004009395A (ja) * 2002-06-05 2004-01-15 Sumitomo Bakelite Co Ltd 透明水蒸気バリアフィルム及びその製造方法
JP2004020697A (ja) * 2002-06-13 2004-01-22 Ricoh Co Ltd 電子写真方式の画像形成装置及び複写機
WO2005014748A1 (fr) * 2003-08-12 2005-02-17 Nippon Kayaku Kabushiki Kaisha Composition adhesive et disque optique fabrique a l'aide de cette derniere
JP2007045951A (ja) * 2005-08-10 2007-02-22 Sumitomo Bakelite Co Ltd 透明基板の製造方法、透明基板およびそれを備えた電子デバイス
WO2012020763A1 (fr) * 2010-08-11 2012-02-16 積水化学工業株式会社 Composition durcissable et feuille composite transparente
JP2012183519A (ja) * 2011-03-08 2012-09-27 Kansai Paint Co Ltd 複層塗膜形成方法及び塗装物品
JP2013010954A (ja) * 2011-06-03 2013-01-17 Mitsubishi Rayon Co Ltd 活性エネルギー線硬化型樹脂組成物及び光記録媒体
JP2013028776A (ja) * 2011-03-10 2013-02-07 Sekisui Chem Co Ltd 透明複合シート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000066039A (ja) * 1998-08-25 2000-03-03 Hitachi Chem Co Ltd 光伝送用プラスチックロッド
JP5780003B2 (ja) * 2011-06-08 2015-09-16 住友大阪セメント株式会社 無機酸化物粒子とシリコーン樹脂との複合組成物及び透明複合体
JP2013020888A (ja) * 2011-07-13 2013-01-31 Ulvac Japan Ltd 封止膜形成方法、リチウム二次電池の製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170933A (en) * 1981-04-15 1982-10-21 Showa Denko Kk Surface treating method of transparent plastic sheet
JPS6385031A (ja) * 1986-09-30 1988-04-15 Nippon Kayaku Co Ltd 光学ガラスフアイバ用コ−テイング剤
JP2003048271A (ja) * 2001-08-07 2003-02-18 Sumitomo Bakelite Co Ltd 透明水蒸気バリアフィルム
JP2004009395A (ja) * 2002-06-05 2004-01-15 Sumitomo Bakelite Co Ltd 透明水蒸気バリアフィルム及びその製造方法
JP2004020697A (ja) * 2002-06-13 2004-01-22 Ricoh Co Ltd 電子写真方式の画像形成装置及び複写機
WO2005014748A1 (fr) * 2003-08-12 2005-02-17 Nippon Kayaku Kabushiki Kaisha Composition adhesive et disque optique fabrique a l'aide de cette derniere
JP2007045951A (ja) * 2005-08-10 2007-02-22 Sumitomo Bakelite Co Ltd 透明基板の製造方法、透明基板およびそれを備えた電子デバイス
WO2012020763A1 (fr) * 2010-08-11 2012-02-16 積水化学工業株式会社 Composition durcissable et feuille composite transparente
JP2012183519A (ja) * 2011-03-08 2012-09-27 Kansai Paint Co Ltd 複層塗膜形成方法及び塗装物品
JP2013028776A (ja) * 2011-03-10 2013-02-07 Sekisui Chem Co Ltd 透明複合シート
JP2013010954A (ja) * 2011-06-03 2013-01-17 Mitsubishi Rayon Co Ltd 活性エネルギー線硬化型樹脂組成物及び光記録媒体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113192973A (zh) * 2021-04-02 2021-07-30 Tcl华星光电技术有限公司 阵列基板及微型发光二极管显示面板

Also Published As

Publication number Publication date
JP2014193971A (ja) 2014-10-09
TW201504264A (zh) 2015-02-01
JP6112603B2 (ja) 2017-04-12

Similar Documents

Publication Publication Date Title
JP6099198B2 (ja) エネルギー線硬化型樹脂組成物及びその硬化物
JP6284217B2 (ja) エネルギー線硬化型樹脂組成物及びその硬化物
JP6112603B2 (ja) エネルギー線硬化型樹脂組成物及びその硬化物
JP6363508B2 (ja) 樹脂組成物及びその硬化物（１）
JP5916220B2 (ja) エネルギー線硬化型樹脂組成物及びその硬化物
KR101846960B1 (ko) 유기 el 소자 밀봉용 수지 조성물 및 그 경화물
JP5967654B2 (ja) 樹脂組成物及びその硬化物（２）
JP6012433B2 (ja) 樹脂組成物及びその硬化物（３）
JP2013227395A (ja) 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物（６）
JP6474432B2 (ja) エネルギー線硬化型樹脂組成物及びその硬化物
JP2013227394A (ja) 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物（５）
JP6057409B2 (ja) 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物（１）
JP2013227393A (ja) 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物（４）
JP2013227391A (ja) 光学レンズシート用エネルギー線硬化型樹脂組成物及びその硬化物（２）

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14775525

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14775525

Country of ref document: EP

Kind code of ref document: A1