WO2014157248A1 - 導電性及び曲げたわみ係数に優れる銅合金板 - Google Patents

導電性及び曲げたわみ係数に優れる銅合金板 Download PDF

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WO2014157248A1
WO2014157248A1 PCT/JP2014/058361 JP2014058361W WO2014157248A1 WO 2014157248 A1 WO2014157248 A1 WO 2014157248A1 JP 2014058361 W JP2014058361 W JP 2014058361W WO 2014157248 A1 WO2014157248 A1 WO 2014157248A1
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hkl
copper alloy
copper
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mass
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PCT/JP2014/058361
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波多野　隆紹
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Jx日鉱日石金属株式会社
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Priority to CN201480001282.5A priority Critical patent/CN104334759B/zh
Priority to KR1020147030372A priority patent/KR101631402B1/ko
Publication of WO2014157248A1 publication Critical patent/WO2014157248A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a copper alloy plate and electronic parts for energization or heat dissipation, and in particular, electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. mounted on electric machines / electronic devices, automobiles and the like.
  • the present invention relates to a copper alloy plate used as a material for the above and an electronic component using the copper alloy plate.
  • copper alloys suitable for use in high current electronic parts such as high current connectors and terminals used in electric vehicles, hybrid cars, etc., or in heat dissipation electronic parts such as liquid crystal frames used in smartphones and tablet PCs.
  • the present invention relates to a plate and an electronic component using the copper alloy plate.
  • Electrical and electronic equipment, automobiles, etc. have built-in components for conducting electricity or heat, such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks, etc. These components are made of copper alloy. It is used. Here, electrical conductivity and thermal conductivity are in a proportional relationship.
  • the leaf spring portion of the connector or the like is usually collected in a direction in which the longitudinal direction is perpendicular to the rolling direction (the bending axis in bending deformation is parallel to the rolling direction).
  • this direction is referred to as a plate width direction (TD). Therefore, an increase in the bending deflection coefficient is particularly important in TD.
  • the cross-sectional area of the copper alloy in the current-carrying part tends to become smaller.
  • heat generation from the copper alloy when energized increases.
  • electronic parts used in fast-growing electric vehicles and hybrid electric vehicles include parts through which a remarkably high current flows, such as a connector of a battery unit, and heat generation of a copper alloy during energization is a problem. When the heat generation becomes excessive, the copper alloy is exposed to a high temperature environment.
  • the copper alloy plate is deflected, and the contact force is obtained by the stress generated by this deflection.
  • the stress that is, the contact force is lowered due to the stress relaxation phenomenon, and the contact electric resistance is increased.
  • the copper alloy is required to be more excellent in conductivity so that the amount of generated heat is reduced, and is also required to be superior in stress relaxation characteristics so that the contact force does not decrease even if heat is generated.
  • a copper alloy plate for heat dissipation is also desired to have excellent stress relaxation characteristics from the viewpoint of suppressing creep deformation of the heat dissipation plate due to external force.
  • stress relaxation characteristics are improved when Zr or Ti is added to Cu (for example, see Patent Documents 1 and 2).
  • materials having high electrical conductivity, relatively high strength, and good stress relaxation characteristics include C15100 (0.1 mass% Zr-residual Cu), C15150 (0.02 mass% Zr-residual Cu), C18140 (0 .1 mass% Zr-0.3 mass% Cr-0.02 mass% Si-residual Cu), C18145 (0.1 mass% Zr-0.2 mass% Cr-0.2 mass% Zn-residual Cu) C18070 (0.1% by mass Ti-0.3% by mass Cr-0.02% by mass Si-residual Cu), C18080 (0.06% by mass Ti-0.5% by mass Cr-0.1% by mass Ag) Alloys such as -0.08 mass% Fe-0.06 mass% Si-residual Cu) are registered in CDA (Copper Development Association).
  • a copper alloy obtained by adding Zr or Ti to Cu (hereinafter referred to as a Cu-Zr-Ti alloy) has high electrical conductivity and strength, but its bending deflection coefficient of TD is used for parts that carry a large current. Or it was not the level which can be satisfied as a use of the part which dissipates a large amount of heat.
  • the conventional Cu-Zr-Ti alloy has relatively good stress relaxation characteristics, the level of the stress relaxation characteristics is not necessarily sufficient for the use of parts that carry a large current or the use of parts that dissipate a large amount of heat. I could't.
  • a Cu—Zr—Ti alloy having both a high bending deflection coefficient and excellent stress relaxation properties has not been reported so far.
  • the bending rate of TD is adjusted by adjusting the area ratio of a crystal whose (111) plane normal to TD has an angle of 20 degrees or less to more than 50%.
  • the deflection coefficient has been improved.
  • the stress relaxation rate after holding for 1000 hours at 150 ° C. of the alloy whose bending deflection coefficient is improved by this method is 16.9 to 47.2%, which is not a sufficient level.
  • a special process called second type high temperature rolling is added after normal hot rolling, which leads to a significant increase in manufacturing cost.
  • the copper alloy plate disclosed in Patent Document 2 contains 0.05 to 0.3% by mass of Zr, and includes Mg, Ti, Zn, Ga, Y, Nb, Mo, Ag, In, and Sn.
  • the stress relaxation characteristics were improved by adding 0.01 to 0.3% by mass of one or more of the above and further adjusting the crystal grain size after intermediate annealing to 20 to 100 ⁇ m.
  • the stress relaxation rate after holding for 1000 hours is 17.2 to 18.6%, which cannot be said to be sufficiently improved.
  • improvement of the bending deflection coefficient is not studied.
  • an object of the present invention is to provide a copper alloy plate having high strength, high conductivity, a high bending deflection coefficient, and excellent stress relaxation characteristics, and an electronic component suitable for large current use or heat radiation use.
  • the present inventors have found that the orientation of crystal grains oriented on the rolling surface affects the bending deflection coefficient of TD in the Cu—Zr—Ti alloy plate. Specifically, in order to increase the bending deflection coefficient, it is effective to increase the (111) plane and the (220) plane on the rolled surface, and conversely, the increase of the (200) plane is harmful.
  • the inventors have invented a crystal orientation index that serves as an index of the bending deflection coefficient, and the bending deflection coefficient can be improved by controlling this index. Furthermore, in addition to the above-mentioned crystal orientation control, it has also been found that the stress relaxation characteristics are remarkably improved by adjusting the thermal expansion / contraction rate to an appropriate range.
  • the present invention completed on the basis of the above knowledge, in one aspect, contains one or two of Zr and Ti in a total of 0.01 to 0.50 mass%, with the balance consisting of copper and inevitable impurities, A copper alloy plate having a tensile strength of 350 MPa or more and an A value given by the following formula of 0.5 or more.
  • A 2X (111) + X (220) -X (200)
  • X (hkl) I (hkl) / I 0 (hkl)
  • I (hkl) and I 0 (hkl) are diffraction integrated intensities of the (hkl) plane obtained for the rolled surface and the copper powder using the X-ray diffraction method, respectively.
  • one or two of Zr and Ti are contained in a total amount of 0.01 to 0.50 mass%, and Ag, Fe, Co, Ni, Cr, Mn, Zn, Mg , Si, P, Sn and B are contained in an amount of 1.0% by mass or less, the balance is made of copper and inevitable impurities, the tensile strength is 350 MPa or more, and the A value given by the following formula: Is a copper alloy plate having 0.5 or more.
  • I (hkl) and I 0 (hkl) are diffraction integrated intensities of the (hkl) plane obtained for the rolled surface and the copper powder using the X-ray diffraction method, respectively.
  • the copper alloy sheet according to the present invention has a thermal expansion / contraction rate in the rolling direction adjusted to 80 ppm or less when heated at 250 ° C. for 30 minutes.
  • the copper alloy plate according to the present invention has a conductivity of 70% IACS or more and a bending deflection coefficient in the plate width direction of 115 GPa or more.
  • the electrical conductivity is 70% IACS or more
  • the bending deflection coefficient in the plate width direction is 115 GPa or more
  • the stress relaxation rate in the plate width direction after holding at 150 ° C. for 1000 hours is 15% or less.
  • the present invention is a high-current electronic component using the copper alloy plate.
  • the present invention is an electronic component for heat dissipation using the copper alloy plate.
  • a copper alloy plate having high strength, high conductivity, a high bending deflection coefficient, and excellent stress relaxation characteristics, and an electronic component suitable for large current use or heat radiation use.
  • This copper alloy plate can be suitably used as a material for electronic parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, etc., and particularly dissipates the material or large amount of heat of electronic parts that carry a large current. It is useful as a material for electronic parts.
  • the Cu—Zr—Ti alloy plate according to the embodiment of the present invention has a conductivity of 70% IACS or more and a tensile strength of 350 MPa or more. If the electrical conductivity is 70% IASC or more, it can be said that the amount of heat generated when energized is equivalent to that of pure copper. Further, if the tensile strength is 350 MPa or more, it can be said that the material has a strength necessary for a material for a component that conducts a large current or a material for a component that dissipates a large amount of heat.
  • the bending deflection coefficient of TD of the Cu—Zr—Ti alloy plate according to the embodiment of the present invention is 115 GPa or more, more preferably 120 GPa or more.
  • the spring deflection coefficient is a value calculated from the amount of deflection at the time when a load is applied to the cantilever beam within a range not exceeding the elastic limit.
  • As an index of the elastic modulus there is a Young's modulus obtained by a tensile test, but the spring deflection coefficient shows a better correlation with the contact force at a leaf spring contact such as a connector.
  • the bending deflection coefficient of the conventional Cu-Zr-Ti alloy plate is about 110 GPa, and by adjusting this to 115 GPa or more, the contact force is clearly improved after being processed into a connector or the like. After processing, it becomes apparently difficult to elastically deform against external force.
  • the stress relaxation rate when 80% stress of 0.2% proof stress is added to TD and held at 150 ° C. for 1000 hours. (Hereinafter simply referred to as stress relaxation rate) is 15% or less, more preferably 10% or less.
  • the stress relaxation rate of the conventional Cu—Zr—Ti alloy plate is about 25 to 35%.
  • a total of one or two of Zr and Ti is 0.01 to 0.50% by mass, more preferably 0.02 to 0.00. Contains 20% by mass.
  • the total of one or two of Zr and Ti is less than 0.01% by mass, it becomes difficult to obtain a tensile strength of 350 MPa or more and a stress relaxation rate of 15% or less. If the total of one or two of Zr and Ti exceeds 0.5% by mass, it becomes difficult to produce an alloy due to hot rolling cracks or the like.
  • the amount added is preferably adjusted to 0.01 to 0.45 mass%, and when adding Ti, the amount added is adjusted to 0.01 to 0.20 mass%. It is preferable.
  • the addition amount is less than the lower limit value, it is difficult to obtain the effect of improving the stress relaxation characteristics, and when the addition amount exceeds the upper limit value, conductivity and manufacturability may be deteriorated.
  • Cu-Zr-Ti alloy contains at least one of Ag, Fe, Co, Ni, Cr, Mn, Zn, Mg, Si, P, Sn and B in order to improve strength and heat resistance. Can be made. However, if the amount added is too large, the electrical conductivity may be reduced to be less than 70% IACS, or the manufacturability of the alloy may be deteriorated. Therefore, the amount added is preferably 1.0% by mass or less in total. Is 0.5 mass% or less. Moreover, in order to acquire the effect by addition, it is preferable to make addition amount into 0.001 mass% or more in total amount.
  • the crystal orientation index A (hereinafter simply referred to as A value) given by the following formula is adjusted to 0.5 or more, more preferably 1.0 or more.
  • I (hkl) and I 0 (hkl) are diffraction integrated intensities of the (hkl) plane obtained for the rolled surface and copper powder using the X-ray diffraction method, respectively.
  • A 2X (111) + X (220) -X (200)
  • X (hkl) I (hkl) / I 0 (hkl)
  • the A value typically takes a value of 10.0 or less.
  • thermal expansion / contraction rate When heat is applied to a copper alloy plate, a very small dimensional change occurs.
  • the ratio of the dimensional change is referred to as “thermal expansion / contraction rate”.
  • the present inventor has found that the stress relaxation rate can be remarkably improved by adjusting the thermal expansion / contraction rate of the Cu—Zr—Ti based copper alloy sheet in which the A value is controlled.
  • a dimensional change rate in the rolling direction when heated at 250 ° C. for 30 minutes is used as the thermal expansion / contraction rate.
  • the absolute value of the thermal expansion / contraction rate (hereinafter simply referred to as thermal expansion / contraction rate) is preferably adjusted to 80 ppm or less, and more preferably adjusted to 50 ppm or less.
  • the lower limit value of the thermal expansion / contraction rate is not limited from the viewpoint of the characteristics of the copper alloy sheet, but the thermal expansion / contraction rate is rarely 1 ppm or less. In addition to adjusting the A value to 0.5 or more, by adjusting the thermal expansion / contraction rate to 80 ppm or less, the stress relaxation rate becomes 15% or less.
  • the thickness of the product is preferably 0.1 to 2.0 mm. If the thickness is too thin, the cross-sectional area of the current-carrying part will decrease and heat generation will increase during energization, making it unsuitable as a material for connectors that carry large currents, and because it will deform with a slight external force, It is also unsuitable as a material. On the other hand, if the thickness is too thick, bending becomes difficult. From such a viewpoint, a more preferable thickness is 0.2 to 1.5 mm. When the thickness is in the above range, the bending workability can be improved while suppressing heat generation during energization.
  • the copper alloy plate according to the embodiment of the present invention can be suitably used for applications of electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, etc. used in electric / electronic devices, automobiles and the like.
  • electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, etc. used in electric / electronic devices, automobiles and the like.
  • high current electronic components such as connectors and terminals for high current used in electric vehicles, hybrid vehicles, etc.
  • heat dissipation electronic components such as liquid crystal frames used in smartphones and tablet PCs. is there.
  • an ingot heated to 850 to 1000 ° C. is repeatedly passed between a pair of rolling rolls to finish the target plate thickness.
  • the degree of processing per pass affects the A value.
  • R it is preferable that the maximum value (Rmax) of all paths is 25% or less and the average value (Rave) of all paths is 20% or less. By satisfying both of these conditions, the A value becomes 0.5 or more. More preferably, Rave is set to 19% or less.
  • recrystallization annealing part or all of the rolled structure is recrystallized. Further, by annealing under appropriate conditions, Zr, Ti, etc. are precipitated, and the electrical conductivity of the alloy is increased. In the recrystallization annealing before the final cold rolling, the average crystal grain size of the copper alloy sheet is adjusted to 50 ⁇ m or less. When the average crystal grain size is too large, it becomes difficult to adjust the tensile strength of the product to 350 MPa or more.
  • the conditions for recrystallization annealing before final cold rolling are determined based on the target crystal grain size after annealing and the target product conductivity.
  • the annealing may be performed using a batch furnace or a continuous annealing furnace at a furnace temperature of 250 to 800 ° C.
  • the heating time may be appropriately adjusted within the range of 30 minutes to 30 hours at a furnace temperature of 250 to 600 ° C.
  • the heating time may be appropriately adjusted within the range of 5 seconds to 10 minutes at a furnace temperature of 450 to 800 ° C.
  • higher conductivity can be obtained with the same crystal grain size.
  • the material is repeatedly passed between a pair of rolling rolls to finish the target plate thickness.
  • the working degree of the final cold rolling is preferably 25 to 99%.
  • the stress relaxation rate is 15% or less by adjusting the thermal expansion / contraction rate of the product to 80 ppm or less.
  • the method for adjusting the thermal expansion / contraction rate to 80 ppm or less is not limited to a specific method, but it can be performed, for example, by performing strain relief annealing under appropriate conditions after the final rolling.
  • the thermal expansion / contraction rate is reduced. 80 ppm or less. If the amount of decrease in tensile strength is too small, it is difficult to adjust the thermal expansion / contraction rate to 80 ppm or less. If the decrease in tensile strength is too large, the tensile strength of the product may be less than 350 MPa.
  • the heating time is appropriately adjusted in the range of 30 minutes to 30 hours at a furnace temperature of 100 to 500 ° C., and when a continuous annealing furnace is used, 300 to 700 ° C. What is necessary is just to adjust the fall amount of tensile strength to the said range by adjusting a heating time suitably in the range for 5 second to 10 minutes in the furnace temperature of this.
  • annealing before final cold rolling a batch furnace is used, the heating time is 5 hours, the furnace temperature is adjusted in the range of 250 to 700 ° C, and the crystal grain size and conductivity after annealing are adjusted. Changed. In the final cold rolling, the degree of work (r) was varied. In strain relief annealing, a continuous annealing furnace was used, the furnace temperature was 500 ° C., the heating time was adjusted between 1 second and 10 minutes, and the amount of decrease in tensile strength was variously changed. In some examples, strain relief annealing was not performed.
  • the X-ray diffraction integrated intensity (I (hkl) ) of the (hkl) plane was measured in the thickness direction with respect to the rolled surface of the material after strain relief annealing. Further, the X-ray diffraction integrated intensity (I 0 (hkl) ) of the (hkl) plane is also applied to the copper powder copper powder (manufactured by Kanto Chemical Co., Inc., copper (powder), 2N5,> 99.5%, 325 mesh). Was measured.
  • RINT 2500 manufactured by Rigaku Corporation was used as the X-ray diffractometer, and measurement was performed with a Cu tube bulb at a tube voltage of 25 kV and a tube current of 20 mA.
  • the measurement surface ((hkl)) was defined as three surfaces (111), (220), and (100), and the A value was calculated by the following equation.
  • A 2X (111) + X (220) -X (200)
  • X (hkl) I (hkl) / I 0 (hkl)
  • test piece was taken from the material after strain relief annealing so that the longitudinal direction of the test piece was parallel to the rolling direction, and the conductivity at 20 ° C. was measured by a four-terminal method in accordance with JIS H0505.
  • the bending deflection coefficient of TD was measured according to the Japan Copper and Brass Association (JACBA) technical standard “Method of measuring bending deflection coefficient by cantilever of copper and copper alloy strip”.
  • B 4 ⁇ P ⁇ (L / t) 3 / (w ⁇ d)
  • Table 1 shows the evaluation results.
  • the notation of “ ⁇ 10 ⁇ m” in the crystal grain size after the final recrystallization annealing in Table 1 indicates that when all of the rolling structure is recrystallized and the average crystal grain size is less than 10 ⁇ m, and only a part of the rolling structure is used. Both cases of recrystallization are included.
  • Table 2 also shows examples of Invention Example 1, Invention Example 4, Comparative Example 1, and Comparative Example 3 in Table 1 as the finished thickness of the material in each pass of hot rolling and the degree of processing per pass.
  • the total concentration of Zr and Ti was adjusted to 0.01 to 0.50 mass%, Rmax was 25% or less and Rave was 20% or less in hot rolling, and the final re- The crystal grain size was adjusted to 50 ⁇ m or less in the crystal annealing, and the workability was set to 25 to 99% in the final cold rolling.
  • the A value was 0.5 or more, and an electrical conductivity of 70% IACS or higher, a tensile strength of 350 MPa or higher, and a bending deflection coefficient of 115 GPa or higher were obtained.
  • Comparative Example 7 the degree of work in final cold rolling was less than 25%, and in Comparative Example 8, the crystal grain size after recrystallization annealing before final cold rolling exceeded 50 ⁇ m.
  • the tensile strength was less than 350 MPa.
  • Comparative Example 9 is obtained by processing an ingot to a thickness of 15 mm according to the process disclosed in Patent Document 1.
  • a 200 mm thick ingot heated at 950 ° C. for 3 hours (homogenized heat treatment) is rolled to a thickness of 100 mm at a processing temperature of 700 to 1000 ° C. (first type high temperature rolling, processing degree 50%), and then 5 to Cooled to room temperature at 100 ° C./second. Thereafter, it was reheated to 550 ° C. and rolled to a thickness of 15 mm at a processing temperature of 400 to 550 ° C. (second type high temperature rolling, processing degree 70%).
  • Rmax and Rave in Table 1 are those during the first type high temperature rolling.
  • the process after thickness 15mm was performed similarly to the other Example.
  • Comparative Example 9 In comparison with Comparative Example 9, when the area ratio of the region having an atomic plane whose angle formed by the normal of the (111) plane and TD is within 20 degrees was measured by the EBSD method disclosed in Patent Document 1, the area ratio was 50%. It was over. Although the bending deflection coefficient of Comparative Example 9 was 115 GPa or more, the stress relaxation rate was reduced despite the fact that the stress relief annealing was performed under the condition that the tensile strength was reduced by 10 to 100 MPa and the thermal expansion / contraction rate was adjusted to 80 ppm or less. It exceeded 15%.

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PCT/JP2014/058361 2013-03-25 2014-03-25 導電性及び曲げたわみ係数に優れる銅合金板 WO2014157248A1 (ja)

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KR1020147030372A KR101631402B1 (ko) 2013-03-25 2014-03-25 도전성 및 굽힘 변형 계수가 우수한 구리 합금판

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JPH0843785A (ja) * 1994-08-02 1996-02-16 Casio Comput Co Ltd 液晶プロジェクタ
JP5427971B1 (ja) * 2013-03-25 2014-02-26 Ｊｘ日鉱日石金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6223057B2 (ja) * 2013-08-13 2017-11-01 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6296727B2 (ja) * 2013-09-03 2018-03-20 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6085633B2 (ja) * 2015-03-30 2017-02-22 Ｊｘ金属株式会社 銅合金板および、それを備えるプレス成形品
JP7133326B2 (ja) * 2018-03-16 2022-09-08 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板、通電用電子部品、放熱用電子部品
JP7133327B2 (ja) * 2018-03-16 2022-09-08 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板、通電用電子部品、放熱用電子部品
JP7451964B2 (ja) * 2019-01-16 2024-03-19 株式会社プロテリアル Ｃｕ合金板およびその製造方法

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JP2014208872A (ja) 2014-11-06
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