WO2014156685A1 - Film conducteur anisotrope - Google Patents

Film conducteur anisotrope Download PDF

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Publication number
WO2014156685A1
WO2014156685A1 PCT/JP2014/056707 JP2014056707W WO2014156685A1 WO 2014156685 A1 WO2014156685 A1 WO 2014156685A1 JP 2014056707 W JP2014056707 W JP 2014056707W WO 2014156685 A1 WO2014156685 A1 WO 2014156685A1
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WO
WIPO (PCT)
Prior art keywords
anisotropic conductive
conductive film
mass
film
polymerization
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PCT/JP2014/056707
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English (en)
Japanese (ja)
Inventor
西村　淳一
Original Assignee
デクセリアルズ株式会社
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Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020157023481A priority Critical patent/KR20150138176A/ko
Publication of WO2014156685A1 publication Critical patent/WO2014156685A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention provides an anisotropic conductive film for anisotropic conductive connection between a terminal of a substrate and a terminal of an electronic component, a manufacturing method of a connection structure using the anisotropic conductive film, and a manufacturing method thereof.
  • Connection structure for anisotropic conductive connection between a terminal of a substrate and a terminal of an electronic component, a manufacturing method of a connection structure using the anisotropic conductive film, and a manufacturing method thereof.
  • anisotropic conductive films When electrically connecting electronic components such as IC chips and liquid crystal panels to a substrate, anisotropic conductive films are widely used.
  • anisotropic conductive films film forming components, epoxy-based curing components, A film in which an imidazole-based latent curing agent and conductive particles are uniformly mixed and formed on a base film is widely used (Patent Document 1).
  • Such an anisotropic conductive film is usually stored wound on a reel in consideration of convenience during use.
  • the normal cleaning process may not be sufficient. In such a case, “floating” at the anisotropic conductive connection interface using the anisotropic conductive film. Increased risk of occurrence of inevitability. For this reason, there is a demand for an anisotropic conductive film that does not cause “floating” even when a substrate or electronic component that is not sufficiently cleaned by a normal cleaning process is used.
  • the anisotropic conductive film that is wound and stored on a reel may be difficult to peel off from the base film or may be blocked from being peeled off from the base film. There is also a need for an anisotropic conductive film that can be easily peeled off and blocking is also suppressed.
  • the present invention is intended to solve the conventional problems, and is applied to anisotropic conductive connection for anisotropic conductive film for anisotropic conductive connection between a terminal of a substrate and a terminal of an electronic component. It is an object of the present invention to prevent “floating” from occurring at the same time, and to easily peel off from a base film when wound on a reel, and to suppress blocking.
  • the inventor comprises an anisotropic conductive film composed of two layers, an anisotropic conductive layer and an insulating resin layer, and by setting the residual solvent amount in the anisotropic conductive layer within a predetermined range, The inventors have found that the above object can be achieved and have completed the present invention.
  • the present invention is an anisotropic conductive film for anisotropic conductive connection between the terminal of the substrate and the terminal of the electronic component, It has a two-layer structure in which an anisotropic conductive layer containing a film forming component, a polymerization component, a polymerization initiator and conductive particles and an insulating resin layer containing a film forming component are laminated,
  • the amount of residual solvent in the anisotropic conductive layer is 2% by mass or more and 8% by mass or less,
  • an anisotropic conductive film in which the polymerization initiator is substantially unaffected by the residual solvent.
  • the present invention also provides a method for manufacturing a connection structure in which a terminal of a substrate and a terminal of an electronic component are anisotropically conductively connected by an anisotropic conductive film, comprising the following steps (A) to (C): The manufacturing method which has, and the connection structure manufactured by the manufacturing method are provided.
  • the anisotropic conductive film of the present invention comprises an anisotropic conductive layer containing a film forming component, a polymerization component, a polymerization initiator, and conductive particles, and an insulating resin layer containing a film forming component.
  • the anisotropic conductive film of the present invention is for anisotropically conductively connecting a terminal of a substrate and a terminal of an electronic component, and contains a film forming component, a polymerization component, a polymerization initiator, and conductive particles. It has a two-layer structure in which an anisotropic conductive layer and an insulating resin layer containing a film-forming component are laminated. Furthermore, the amount of residual solvent in the anisotropic conductive layer is adjusted to 2% by mass or more and 8% by mass or less, and a polymerization initiator that does not substantially affect the polymerization initiation characteristics by the residual solvent is used. Is.
  • the residual solvent amount in the anisotropic conductive layer is adjusted to 2% by mass or more and 8% by mass or less, preferably more than 5% by mass and 8% by mass or less. For this reason, when a substrate or electronic component is bonded with an anisotropic conductive film, contaminants such as cyclic silicone oligomers on the surface of the substrate or electronic component on the side in contact with the anisotropic conductive layer should be excluded from the surface. Can do. Although the mechanism of exclusion is not clear, contaminants such as cyclic silicone oligomers are washed away from the surface by the residual solvent contained in a relatively large amount or taken into the anisotropic conductive film and further diffused to the outside. It is speculated that it has been excluded.
  • the amount of residual solvent is small, there is a concern that the effect of eliminating contaminants such as cyclic silicone oligomers will be insufficient, and if the amount is large, the peelability of the base film from the anisotropic conductive film is reduced, and the anisotropic conductive film.
  • the amount of residual solvent is 2% by mass or more and 8% by mass or less, such a concern does not occur.
  • the kind and amount of the solvent used in the anisotropic conductive layer forming composition can be done by adjusting the coating conditions and the drying conditions. For example, with respect to the drying time, the amount of residual solvent can be increased if the time is short, and the amount of residual solvent can be decreased if the time is long.
  • the residual solvent can be appropriately selected from known solvents in consideration of dissolving power, boiling point, and the like according to the type of film forming component and polymerization component used.
  • Preferred solvents include propylene glycol monomethyl ether acetate, polyethylene glycol monomethyl ether acetate, toluene, ethyl acetate, methyl ethyl ketone and the like.
  • propylene glycol monomethyl ether from the viewpoint of preventing deterioration in workability when applying the composition for forming an anisotropic conductive layer (for example, problems caused by excessive drying of the coating film) and obtaining good film characteristics.
  • Acetate can be preferably used.
  • the film forming component used in the anisotropic conductive layer of the anisotropic conductive film of the present invention among the film forming components used in the conventional anisotropic conductive film, the application target of the anisotropic conductive film And the compatibility with cellulose ester derivatives can be selected as appropriate.
  • phenoxy resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin resin, and the like can be given. Two or more of these may be used in combination.
  • a phenoxy resin can be preferably employed in terms of film formability, processability, and connection reliability.
  • the content of the film-forming component in the anisotropic conductive layer is preferably 15% by mass or more and 55% by mass or less, more preferably 30% by mass, in order to maintain good film strength and anisotropic conductivity. % To 40% by mass.
  • the polymerization component used in the anisotropic conductive layer of the anisotropic conductive film of the present invention the application target of the anisotropic conductive film or polymerized from the polymerization components used in the conventional anisotropic conductive film It can be appropriately selected in consideration of compatibility with the polymerization component.
  • the polymerization initiator is a radical polymerization initiator, a radical polymerizable acrylic monomer or oligomer can be preferably used.
  • the polymerization initiator is a cationic polymerization initiator
  • an epoxy compound or an oxetane compound can be preferably used.
  • Preferred examples of the epoxy compound include compounds, oligomers, and polymers having one or more epoxy groups in the molecule. These may be liquid or solid. Specifically, bisphenol A, bisphenol F, bisphenol S, hexahydrobisphenol A, tetramethylbisphenol A, diaryl bisphenol A, hydroquinone, catechol, resorcin, cresol, tetrabromobisphenol A, trihydroxybiphenyl, benzophenone, bisresorcinol, Glycidyl ether obtained by reacting polychlorophenol and epichlorohydrin such as bisphenol hexafluoroacetone, tetramethylbisphenol A, tetramethylbisphenol F, tris (hydroxyphenyl) methane, bixylenol, phenol novolak, cresol novolak, or glycerin, Neopentyl glycol, ethylene glycol, propylene glycol, tylene glycol Lumpur, hexylene glycol
  • oxetane compounds include bis (3-ethyl-3-oxetanylmethyl) ether, 3-ethyl-3-hydroxymethyloxetane, and 1,4-bis ⁇ [(3-ethyl-3-oxetanyl) methoxy] methyl ⁇ benzene.
  • the content of the polymerization component in the anisotropic conductive layer is preferably 15% by mass or more and 65% by mass or less, more preferably 30% by mass or more in order to keep the film strength and anisotropic conductivity favorable. It is 50 mass% or less.
  • Polymerization initiator As the polymerization initiator, it can be used by appropriately selecting from known polymerization initiators according to the kind of the polymerization component, but the polymerization initiator is not substantially affected by the residual solvent. There is a need to. This is because if the polymerization initiation characteristics are affected by the residual solvent, it is difficult to realize the intended polymerization reaction. For example, in the case of an imidazole-based latent curing agent which is an example of an anionic polymerization initiator, the microcapsule may be attacked by the residual solvent, in which case the potential is lowered, and as a result, the intended polymerization is performed. The reaction cannot be realized, and the storage stability is also lowered.
  • substantially means that the polymerization initiation characteristics are not significantly deviated from the scope of the present invention as long as the effects of the present invention can be obtained, even if the polymerization initiation characteristics are slightly affected by the residual solvent. .
  • the polymerization component is a radical polymerizable acrylic monomer or oligomer
  • a polymerization initiator that generates free radicals by heat or light can be preferably used.
  • azo compounds Among these, organic peroxides can be preferably used. Specific examples of the organic peroxide include benzoyl peroxide, tertiary butyl peroxide, di-2-ethylhexyl peroxydicarbonate, dilauroyl peroxide, 1,1-di (t-butylperoxy) cyclohexane, and the like. Is mentioned.
  • azo compound examples include 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (2,4-dimethylvaleronitrile) (V-65), 2,2 ′. -Azobisisobutyronitrile (AIBN), 2,2'-azobis (2-methylbutyronitrile), 1,1-azobis (cyclohexane-1-carbonitrile), 2,2'-azobis [2-methyl -N- [1,1-bis (hydroxymethyl) -2-hydroxyethyl] propionamide], dimethyl 2,2'-azobis (2-methoxypropionate) and the like.
  • alkylphenone, benzoin, benzophenone, dicarbonyl compound, thioxanthone, acylphosphine oxide, derivatives thereof and the like can also be used as a polymerization initiator.
  • a cationic polymerization initiator that initiates polymerization by the action of light or heat, preferably by the action of heat, can be preferably used.
  • cationic polymerization initiators known ones can be used.
  • aryldiazonium salt polymerization initiators, aryliodonium salt polymerization initiators, arylsulfonium salt polymerization initiators, allene ions A complex polymerization initiator, a chelate polymerization initiator of a metal (for example, aluminum, titanium, zinc, tin, etc.) and an acetoacetate ester or a diketone can be used.
  • cationic polymerization initiators that can be used in the present invention include, for example, aryldiazonium salts [for example, PP-33 (manufactured by ADEKA)], aryliodonium salts, arylsulfonium salts [for example, FC-509, FC-540 (manufactured by 3M), UVE1014 (manufactured by GE), UVI-6974, UVI-6970, UVI-6990, UVI-6950 (manufactured by Union Carbide), SP-170, SP-150, CP-66, CP-77, etc.
  • aryldiazonium salts for example, PP-33 (manufactured by ADEKA)
  • aryliodonium salts for example, FC-509, FC-540 (manufactured by 3M), UVE1014 (manufactured by GE)
  • the content of these polymerization initiators in the anisotropic conductive layer is preferably based on 100 parts by mass of the polymerization component in order to improve the curing rate of the anisotropic conductive layer and suppress the decrease in the particle capture rate. 1 part by mass or more and 20 parts by mass or less, more preferably 3 parts by mass or more and 10 parts by mass or less.
  • the conductive particles contained in the anisotropic conductive layer of the anisotropic conductive film of the present invention among the known conductive particles applied to anisotropic conductive connection, the intended use of the anisotropic conductive film It can be appropriately selected and used depending on.
  • conductive particles include metal particles and metal-coated resin particles.
  • the metal particles include nickel particles, cobalt particles, silver particles, copper particles, gold particles, and palladium particles.
  • the surface of core resin particles such as styrene-divinylbenzene copolymer particles, benzoguanamine resin particles, crosslinked polystyrene resin particles, acrylic resin particles, styrene-silica composite resin particles, nickel, copper, gold, And those coated with a metal such as palladium.
  • core resin particles such as styrene-divinylbenzene copolymer particles, benzoguanamine resin particles, crosslinked polystyrene resin particles, acrylic resin particles, styrene-silica composite resin particles, nickel, copper, gold, And those coated with a metal such as palladium.
  • a thin film of gold or palladium, or an insulating resin thin film that is torn during anisotropic conductive connection may be formed as necessary.
  • the average particle diameter of the conductive particles is preferably 1 ⁇ m or more and 10 ⁇ m or less, more preferably 2 ⁇ m or more and 5 ⁇ m or less, in order to achieve reliable anisotropic conductive connection according to the purpose of use of the anisotropic conductive film.
  • the content of the conductive particles in the anisotropic conductive layer of the anisotropic conductive film is preferably on a mass basis in order to realize a reliable anisotropic conductive connection according to the purpose of use of the anisotropic conductive film. It is 5% or more and 50% or less, more preferably 10% or more and 35% or less.
  • the anisotropic conductive layer of the anisotropic conductive film of the present invention can contain a known silane coupling agent in order to improve adhesion to a particularly inorganic substrate such as a glass substrate.
  • a silane coupling agent for example, an epoxy-based silane coupling agent, an acrylic silane coupling agent, a thiol-based silane coupling agent, an amine-based silane coupling agent, and the like are appropriately selected according to the purpose of use of the anisotropic conductive film. Can do.
  • the content of the silane coupling agent in the anisotropic conductive layer of the anisotropic conductive film is set to 100 parts by mass in total of the film-forming component and the curing component in order to achieve a reliable addition effect of the silane coupling agent. On the other hand, it is preferably 0.5 to 5 parts by mass, more preferably 1 to 3 parts by mass.
  • the anisotropic conductive layer of the anisotropic conductive film of this invention can contain various additives, such as a coloring agent, antioxidant, and a rust inhibitor, as needed.
  • the thickness of the anisotropic conductive layer is preferably 3 ⁇ m or more and 12 ⁇ m or less, more preferably 4 ⁇ m or more and 6 ⁇ m or less, in relation to the particle size of the conductive particles. Further, if the thickness of the anisotropic conductive layer is too thick, there is a tendency that the conductive particles are not easily captured between the terminals to be anisotropically conductive, and if it is too thin, the conductive particles in the anisotropic conductive film The dispersion state of the film tends to be non-uniform, and the applicability of the composition for forming an anisotropic conductive layer tends to decrease. Therefore, the total thickness of the anisotropic conductive film is preferably 10% to 40%, more preferably Preferably they are 20% or more and 30% or less.
  • the insulating resin layer constituting the anisotropic conductive film of the present invention is a layer for ensuring the adhesion between the substrate to be connected and the electronic component and the insulation between the wirings, and contains at least a film forming component To do.
  • the film forming component can be selected from those applicable to the anisotropic conductive layer.
  • the insulating resin layer includes, if necessary, the same polymerization component as the anisotropic conductive layer, a polymerization initiator, a silane coupling agent, a colorant, an antioxidant, a rust inhibitor, Various additives such as a solvent can be contained.
  • it is comprised from the same compounding component as an anisotropic conductive layer except not containing electroconductive particle.
  • the amount of residual solvent in the insulating resin layer is preferably 0.1% by mass or more and 10% from the viewpoint of suppressing the occurrence of problems due to the protrusion of the resin component on the side surface of the reel when the anisotropic conductive film is wound around the reel. It is not more than mass%, more preferably not less than 0.1 mass% and not more than 5 mass%.
  • the thickness of the insulating resin layer is preferably 5 ⁇ m or more and 25 ⁇ m or less, more preferably from the viewpoint of filling a sufficient amount of insulating resin for adhesion between the substrate to be anisotropically conductively connected and the electronic component. It is 10 ⁇ m or more and 20 ⁇ m or less.
  • the anisotropic conductive film of the present invention can be produced as follows. First, an insulating resin layer forming composition is prepared by uniformly mixing a film-forming component and other components as necessary with a solvent such as propylene glycol monomethyl ether acetate by a known mixing method, Apply to a predetermined dry thickness (usually 8 ⁇ m or more and 20 ⁇ m or less) on the release sheet by a technique, and dry for 2 minutes or more and 8 minutes or less in a drying furnace adjusted to 60 ° C. or more and 80 ° C. or less. An insulating resin layer is formed by the above.
  • a solvent such as propylene glycol monomethyl ether acetate
  • a composition for forming an anisotropic conductive layer is prepared by uniformly mixing by a technique, and this composition is applied to another release sheet by a known coating technique, with a predetermined dry thickness (usually a thickness of 4 ⁇ m to 10 ⁇ m). ) And drying in a drying oven adjusted to 60 ° C. or higher and 80 ° C. or lower to form an anisotropic conductive layer.
  • the anisotropic conductive film of the present invention can be obtained by laminating the obtained anisotropic conductive layer and insulating resin layer by a known method and conditions.
  • the anisotropic conductive film of the present invention thus obtained can be applied to substrates such as an ITO glass substrate, a flexible substrate, a rigid substrate, an IC module, and a mother board, an IC chip, a TAB tape, a liquid crystal panel, and various substrates.
  • substrates such as an ITO glass substrate, a flexible substrate, a rigid substrate, an IC module, and a mother board, an IC chip, a TAB tape, a liquid crystal panel, and various substrates.
  • the present invention can be preferably applied when manufacturing a connection structure by anisotropically connecting electronic components. The manufacturing method of the connection structure of this invention is demonstrated below.
  • the method for manufacturing a connection structure of the present invention is a method for manufacturing a connection structure in which a terminal of a substrate and a terminal of an electronic component are anisotropically conductively connected by an anisotropic conductive film, and includes the following step (A): Have (C).
  • the anisotropic conductive film of the present invention is temporarily attached on the terminal of the substrate as described above from the anisotropic conductive layer side.
  • the temporarily pasting technique and conditions can be appropriately selected from known techniques and conditions.
  • temporary sticking is carried out by heating and pressurizing to such an extent that an anisotropic conductive film does not fully cure.
  • step (B)) the electronic component is placed on the temporarily attached anisotropic conductive film so that the terminal faces the terminal of the substrate.
  • a mounting method a known method can be employed.
  • substrate and an electronic component are temporarily fixed by heat-pressing so that an anisotropic conductive film may not fully cure.
  • connection structure in which the terminals of the substrate and the terminals of the electronic component are anisotropically conductively connected by heating and pressing the electronic component placed on the substrate through the heat pressing member through the placing step of the step (B). Get the body.
  • the connection structure thus obtained is also part of the present invention.
  • a heating and pressing device conventionally used in anisotropic conductive connection can be used.
  • a heating condition and a pressing condition can also be appropriately set according to the type of material used for the anisotropic conductive film.
  • Reference Example 1 (Preparation of composition for forming anisotropic conductive layer) 40 parts by mass of phenoxy resin (YP50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) as a film forming component, 40 parts by mass of bisphenol A type liquid epoxy resin (EP828, manufactured by Mitsubishi Chemical Corporation) as a polymerization component, and start of cationic polymerization As an agent, 5 parts by mass of an arylsulfonium salt compound (SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) and conductive particles (Ni plating on a resin core having an average particle size of 3 ⁇ m, manufactured by Sekisui Chemical Co., Ltd.) 40 parts by mass and 85 parts by mass of propylene glycol monomethyl ether acetate (PMA) as a solvent were uniformly mixed using a mixer to obtain a composition for forming an anisotropic conductive layer of an anisotropic conductive film.
  • phenoxy resin YP50, manufactured by
  • Reference Example 2 (Preparation of insulating resin layer forming composition) 40 parts by mass of phenoxy resin (YP50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) as a film forming component, 40 parts by mass of bisphenol A type liquid epoxy resin (EP828, manufactured by Mitsubishi Chemical Corporation) as a polymerization component, and start of cationic polymerization 5 parts by mass of an arylsulfonium salt compound (SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) as an agent and 85 parts by mass of propylene glycol monomethyl ether acetate (PMA) as a solvent are uniformly mixed using a mixer. Thus, an insulating resin layer forming composition for an anisotropic conductive film was obtained.
  • phenoxy resin YP50, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
  • EP828 bisphenol A type liquid epoxy resin
  • Reference Example 3 (Creation of anisotropic conductive layer) Using a bar coater, the anisotropic conductive layer forming composition obtained in Reference Example 1 is a 25 ⁇ m-thick base film (a polyethylene terephthalate film subjected to a release treatment) so as to have the dry thickness and residual solvent amount shown in Table 1.
  • An anisotropic conductive layer was obtained by applying to an oven and drying in an oven at 70 ° C. The thickness of the anisotropic conductive layer is adjusted by adjusting the gap of the bar coater at the time of coating, and the residual solvent amount is adjusted by changing the drying time within the constraint of a maximum of 6 minutes. It was.
  • the residual solvent amount was measured by peeling the obtained anisotropic conductive layer from the base film, measuring the weight [W 0 ] of the single anisotropic conductive layer, and then measuring the anisotropic conductive layer at 135 ° C. After removing the volatile components by putting them in the oven for 5 minutes, the weight [W 1 ] was measured again and calculated according to the following formula.
  • Reference example 4 (creation of an insulating resin layer) Using a bar coater, the composition for forming an insulating resin layer obtained in Reference Example 2 was applied to a 50 ⁇ m-thick base film (peeled polyethylene terephthalate film) so as to have the dry thickness and residual solvent amount shown in Table 1.
  • the insulating resin layer was obtained by applying and drying. In addition, each adjustment of the thickness of an insulating resin layer and the amount of residual solvents was performed similarly to the anisotropic conductive layer.
  • a glass substrate for a liquid crystal panel from which surface contaminants have been removed with acetone is placed on a hot plate set at 80 ° C. from the back side, and a 400 ⁇ m thick silicone rubber sheet (HC ⁇ ) is placed on the front ITO wiring surface. 30A, manufactured by Shin-Etsu Chemical Co., Ltd.), and pressed with a hand roller for 60 seconds.
  • an anisotropic conductive film was temporarily attached from the side of the anisotropic conductive layer, and further an IC chip for flip chip connection (1.8 mm ⁇ 2.0 mm ⁇ 0.
  • thermocompression bonded IC chip 5 mm thick was placed and thermocompression bonded with a flip chip bonder (TBX, manufactured by Panasonic Factory Solutions Co., Ltd.) under the conditions of a pressure bonding temperature of 170 ° C., a pressure bonding pressure of 125 N / IC, and a pressure bonding time of 5 seconds.
  • a flip chip bonder TBX, manufactured by Panasonic Factory Solutions Co., Ltd.
  • the “floating” of the interface between the thermocompression bonded IC chip and the glass substrate was observed and evaluated according to the following criteria.
  • ⁇ When “floating” is not observed at all ⁇ : When “floating” is observed only in an area of less than 1% of the total area of the anisotropic conductive film side surface of the IC chip ⁇ : IC When “floating” is observed in an area of 1% or more of the total area of the chip's anisotropic conductive film side surface
  • ⁇ When no peak is observed ⁇ : When the detected intensity of the specific peak with respect to the internal standard peak (styrene) is less than 5% ⁇ : The detected intensity of the specific peak with respect to the internal standard peak (styrene) is 5% If it is above
  • the anisotropic conductive film was cut to a width of 5 cm, and the peel force between the anisotropic conductive film and the base film (peeled PET film) was measured using a tensile tester (Tensilon, manufactured by Orientec Co., Ltd.). . It is desirable that it is 0.1N / 5cm or less practically.
  • the anisotropic conductive film was slit to a width of 1.5 mm, and wound about 100 m on a plastic reel to produce a reel product having a width of 1.5 mm ⁇ 100 m. After the central axis is passed through the center of the reel product and the reel product is fixed so as not to rotate around the central axis, a 50 g weight is attached to the outermost anisotropic conductive film, Left in the room for 3 hours. After leaving, the anisotropic conductive film was pulled out from the reel product, checked for the presence of blocking, and evaluated according to the following criteria.
  • the anisotropic conductive films of Examples 1 to 5 showed good results for the evaluation items of “crimp appearance”, “residual amount of contaminants”, “base film peelability”, and “blocking characteristics”.
  • the anisotropic conductive film of Comparative Example 1 has a single layer and a thick anisotropic conductive layer with a large amount of residual solvent, the evaluation results of “base film peelability” and “blocking characteristic” are examples. It was inferior compared.
  • the anisotropic conductive films of Comparative Examples 2 and 3 since the amount of residual solvent in the anisotropic conductive layer is small, the evaluation results of “crimped appearance” and “residual amount of contaminants” are inferior to those of Examples. It was.
  • the anisotropic conductive film of the present invention does not generate “float” when applied to anisotropic conductive connection, and is easily peeled off from the base film even when wound on a reel, and blocking is also suppressed. Therefore, the anisotropic conductive film of the present invention is useful for anisotropic conductive connection between various substrates and electronic components.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Non-Insulated Conductors (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

L'invention concerne un film conducteur anisotrope pour connecter électriquement de manière anisotrope des bornes d'un substrat à des bornes de composants électroniques, le film ayant une structure à double couche qui consiste en une couche conductrice anisotrope qui comprend un ingrédient filmogène, un ingrédient de polymérisation, un amorceur de polymérisation et des particules électroconductrices, et une couche de résine isolante superposée sur celle-ci et qui comprend un ingrédient filmogène. La couche conductrice anisotrope possède une teneur en solvant résiduel de 2 à 8 % en masse. L'amorceur de polymérisation est un amorceur dans lequel les caractéristiques d'amorçage de polymérisation ne sont sensiblement pas affectées par le solvant résiduel.
PCT/JP2014/056707 2013-03-27 2014-03-13 Film conducteur anisotrope WO2014156685A1 (fr)

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JP2013065959A JP6142612B2 (ja) 2013-03-27 2013-03-27 異方性導電フィルム

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KR101780544B1 (ko) * 2015-05-20 2017-09-21 삼성에스디아이 주식회사 접착 필름 및 이를 이용한 반도체 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064613A (ja) * 1999-06-24 2001-03-13 Sony Chem Corp 熱硬化型接着剤
JP2006252980A (ja) * 2005-03-11 2006-09-21 Sumitomo Bakelite Co Ltd 異方導電性フィルム及びそれを用いた電子機器
JP2012116958A (ja) * 2010-12-01 2012-06-21 Furukawa Electric Co Ltd:The 接着フィルムおよび配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064613A (ja) * 1999-06-24 2001-03-13 Sony Chem Corp 熱硬化型接着剤
JP2006252980A (ja) * 2005-03-11 2006-09-21 Sumitomo Bakelite Co Ltd 異方導電性フィルム及びそれを用いた電子機器
JP2012116958A (ja) * 2010-12-01 2012-06-21 Furukawa Electric Co Ltd:The 接着フィルムおよび配線基板

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JP6142612B2 (ja) 2017-06-07
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