WO2014154139A1 - 一种电子件安装结构及制作方法、电子件产品 - Google Patents

一种电子件安装结构及制作方法、电子件产品 Download PDF

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Publication number
WO2014154139A1
WO2014154139A1 PCT/CN2014/074099 CN2014074099W WO2014154139A1 WO 2014154139 A1 WO2014154139 A1 WO 2014154139A1 CN 2014074099 W CN2014074099 W CN 2014074099W WO 2014154139 A1 WO2014154139 A1 WO 2014154139A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
metal
metal flange
circuit board
printed circuit
Prior art date
Application number
PCT/CN2014/074099
Other languages
English (en)
French (fr)
Inventor
石秋明
马强
Original Assignee
苏州远创达科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州远创达科技有限公司 filed Critical 苏州远创达科技有限公司
Priority to US14/779,916 priority Critical patent/US9717163B2/en
Publication of WO2014154139A1 publication Critical patent/WO2014154139A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors

Definitions

  • the present invention relates to the field of electronic component manufacturing, and in particular, to an electronic component mounting structure, a manufacturing method thereof, and an electronic component product.
  • PCB Print Circuit Board
  • an electronic component is mounted or inserted on a Print Circuit Board (PCB), for example, by soldering through a through hole in a PCB to a PCB.
  • PCB Print Circuit Board
  • the heat generated by the operation of the electronic component is transmitted to the outside through the air around the electronic component and the PCB, thereby achieving self-heat dissipation. Due to the poor thermal conductivity of PCB and air, this structure is not conducive to heat dissipation of electronic components, especially for electronic components with higher power.
  • FIG. 1 is a schematic structural view of a conventional electronic component mounted on a PCB.
  • the PCB 1 is provided with a groove with an open end.
  • the plurality of electronic components 21 are disposed on a metal flange 22 and are integrally placed in the groove on the PCB 1.
  • the plurality of electronic components 21 are connected to each other by wires, and the output terminals and the output terminals are respectively connected to the two pads (pads) 11 of the PCB, thereby being connected to the external output/output circuits.
  • the electrode corresponding to one of the pads is the gate of the component, and the electrode corresponding to the other pad is the drain.
  • the metal flange 22 connected to the bottom serves as a source.
  • a heat dissipating metal 3 is mounted under the PCB 1, and the heat dissipating metal 3 is in contact with the metal flange 22 to conduct heat generated by the electronic component 21 to the heat dissipating metal 3 via the metal flange 22.
  • a protective cover 5 is provided above the periphery of the electronic component 21.
  • the electronic component mounting structure is to make the electronic component 21 and the metal flange 22 together as a single component.
  • the PCB manufacturer firstly performs slotting on the PCB board and applies it on the back side of the PCB. Heat sink metal block.
  • the electronic components (including metal flanges) supplied by the electronics manufacturer are then mounted into the recess by a reflow process. Finally, lead processing is performed and the encapsulation process is performed over the area of the electronic component.
  • the above manufacturing process has the following problems: First: Since the electronic component and the metal flange are integrated, when the LED is mounted on the PCB, it can only be completed by the solder paste 4, so that the PCB is completed.
  • the groove opening on the upper part is required to be larger than the size of the metal flange.
  • the metal flange has a deviation in the left and right positions in the groove. This positional deviation causes defects in the length between the electronic component on the metal flange and the PCB, and the defect is large. In power devices, such as high-power RF devices, severe impedance fluctuations can occur, affecting product consistency.
  • an object of the present invention is to provide an electronic component mounting structure and a manufacturing method.
  • the electronic component mounting structure can solve the problem of the length of the lead caused by the positional deviation of the metal flange, thereby improving the consistency of the electronic product.
  • the manufacturing method can eliminate the intermediate link in the manufacturing process of the electronic component mounting structure, improve the production efficiency of the product and reduce the production cost. Further, it is an object of the present invention to provide an electronic component product having the above-described electronic component mounting structure.
  • An electronic component mounting structure comprising a printed circuit board embedded in a metal flange on the printed circuit board, and a plurality of electronic components disposed on the metal flange, wherein the printed circuit board is provided with a slot, and the slotted slot wall is covered with a metal layer, the metal The flange is constrained to the metal layer on the wall of the groove, and is fastened in the slot, and the plurality of electronic components are connected by a plurality of leads according to circuit requirements, and the printed circuit board is adjacent to the metal flange
  • the portion is provided with an input electrode and an output electrode, which are respectively connected by leads to an electronic component mounted on the metal flange.
  • the printed circuit board is provided with a peripheral device circuit, and the input electrode and the output electrode are electrically connected to the peripheral device circuit.
  • the printed circuit board is a single piece of material, the size of which satisfies the installation requirements of the metal flange and the electronic component.
  • two electrode pads are provided at positions of the input circuit and the output electrode below the printed circuit board, and at the same time, a through hole is provided in the printed circuit board portion at the position, and is in the through hole
  • the metal hole posts are filled so that the two electrode pads are respectively connected to the input electrodes and the output electrodes located above the printed circuit board.
  • the electronic component on the metal flange is one or a combination of a resistor, an inductor or a capacitor, such that the electronic component mounting structure becomes a surface mount component.
  • a protective cover is provided in the area adjacent the metal flange above the printed circuit board, the protective cover covering the electronic component.
  • the thickness of the metal flange is greater than the thickness of the printed circuit board, such that the lower side of the metal flange protrudes from the printed circuit board, or the thickness of the metal flange is smaller than the thickness of the printed circuit board, so that The lower side of the metal flange is trapped in the printed circuit board.
  • the metal flange is made of one of copper, tungsten bronze or cobalt bronze.
  • a method for fabricating an electronic component mounting structure includes: forming a slot on the printed circuit board, the slot having a size larger than the metal flange; and the slot in the slot The wall is covered with a layer of metal having a thickness such that the slotted slot is sized to match the metal flange;
  • a protective cover is placed over the area where the electronic component is located.
  • the step of forming the through hole is further provided on both sides of the slot.
  • the step of covering the metal layer in the grooved wall further comprises the step of forming a metal hole in the through hole.
  • the patterning process further comprising: forming two electrode pads at positions corresponding to the input electrode and the output electrode under the printed circuit board, the two electrode pads and the metal Insulation between flanges.
  • An electronic component product comprising the electronic component mounting structure as described above, the electronic component product further comprising a heat dissipating metal disposed under the printed circuit board of the electronic component mounting structure, and The metal flange is in contact.
  • a third-party printed circuit board is disposed between the heat-dissipating metal and the electronic component mounting structure, and the third-party printed circuit board is described.
  • the electronic component mounting structure of the present invention has the following technical advantages: First: the electronic component mounting structure directly fixes the metal flange in the PCB, so that the metal flange does not have a positional shift and improves Product consistency.
  • the electronic component manufacturer can directly install the electronic component after obtaining the PCB, which saves the intermediate link, improves the production efficiency and reduces the cost. .
  • the electronic component mounting structure of the present invention can be used as an intermediate product to match an external circuit board For use, it can also be directly fabricated into end products, such as surface mount components, RF devices, etc., thus greatly improving the design freedom of the product.
  • FIG. 1 is a schematic structural view of a conventional electronic component mounted on a PCB
  • FIG. 2 is a schematic view showing the mounting structure of the electronic component in the first embodiment of the present invention.
  • FIG. 3 is a schematic view showing a manufacturing method of an electronic component mounting structure according to a first embodiment of the present invention
  • FIG. 4 is a schematic structural view showing an electronic component mounting structure as an electronic component product according to the first embodiment of the present invention
  • Figure 5 is a schematic view showing the mounting structure of the electronic component in the second embodiment of the present invention.
  • Figure 7 is a schematic view showing the mounting structure of the electronic component in the third embodiment of the present invention.
  • FIG. 9 is a schematic structural view of an electronic component mounting structure according to a third embodiment of the present invention when it is fabricated into an electronic component product;
  • Fig. 10 is a schematic view showing the mounting structure of the electronic component in the fourth embodiment of the present invention. detailed description
  • the electronic component and the metal flange are first fabricated together and then mounted on the PCB.
  • This method treats electronic components and metal flanges as a single component, which is designed by the electronics manufacturer. It reduces the dependence of the electronic component layout on the PCB to a certain extent, and improves the design freedom of some electronic components.
  • this method also has some shortcomings: On the one hand, when the metal flange is embedded in the PCB, since the surface has been provided with electronic components, it is only possible to add solder paste to the bottom of the metal flange for the reflow process. This requires that the slot size on the PCB should be larger than the size of the metal flange.
  • the present invention proposes an electronic component mounting method for mounting a metal flange to a PCB board by integrally connecting a metal flange and a PCB board, and then mounting the metal flange on the metal flange. Install electronic parts. In this way, the positional deviation of the metal flange on the PCB is avoided, and the consistency of the electronic component is greatly improved.
  • the electronic component manufacturer can directly install the electronic component on the PCB to form a complete product, which reduces the intermediate link and greatly improves the production efficiency. It also reduces costs. Referring to FIG. 2, FIG.
  • FIG. 2 is a schematic view showing the mounting structure of the electronic component according to the first embodiment of the present invention.
  • a slot 101 is formed in the PCB 10
  • a metal flange 220 is embedded in the slot 101.
  • a plurality of electronic components 210 are mounted on the metal flange 220, and the electronic components 210 are connected to each other by a lead function in accordance with a circuit function to form a circuit having a certain function.
  • peripheral circuits (not shown) are disposed on the PCB 10, and the peripheral circuit devices are connected, matched, or output/output with respect to the electronic components 210 on the metal flange 220. effect.
  • a signal input circuit is provided in the peripheral circuit device to provide an input signal to the electronic component 210, and the electronic component 210 processes the received signal, such as amplification, filtering, voltage transformation, and the like.
  • a load circuit is mounted in a peripheral circuit device, and operates according to a voltage and a current signal supplied from the electronic component 210.
  • the output signal provided by the electronic component 210 is transmitted to a circuit disposed outside the PCB 10.
  • at least one input electrode 104 and one output electrode 105 are provided in the portion of the PCB 10 adjacent to the metal flange 220.
  • the input electrode 104 and the output electrode 105 are disposed on the same side of the PCB 10 as the electronic component 210 (hereinafter, the side is defined as the upper side of the PCB, the other side opposite to the side is defined as the lower side of the PCB), the input electrode 104 and the output
  • the electrodes 105 are respectively connected to the electronic components 210 mounted on the metal flange 220 by wires, and the input electrodes 104 and the output electrodes 105 are electrically connected to the peripheral device circuits. Normally, these two electrodes need to be insulated from the metal flange 220, otherwise it is easy to cause a short circuit.
  • the metal flange 220 is limited to the metal disposed at both ends of the groove wall of the slot 101, and is fastened in the slot 101.
  • the metal flange 220 can dissipate heat to the electronic component 210 while being active at some In the application of the device, the metal flange 220 also functions as a ground.
  • the material of the metal flange 220 depends on the electronic component 210. For example, when the power and heat of the electronic component 210 are large, a metal material with better heat dissipation performance can be selected, and when the electronic component 210 is a low power device, the ordinary metal can be selected. Metal materials to save costs. Generally, the material of the metal flange may be copper, copper tungsten, copper cobalt or the like.
  • the slot of the slot 101 may be slightly larger, and a layer of metal is formed on the slot wall of the slot 101 to adjust the size of the slot to match the size of the slot with the metal flange 220.
  • the metal flange 220 is then inserted into the slot. Further, after the metal flange 220 is embedded in the slot 101, it is completely fixed together with the PCB 10 by a reflow process to form a unitary body. In this way, for the electronic component 210 mounted on the metal flange 220, there is no problem of positional deviation, the stability of the process is improved, and the fabricated electronic device has good consistency.
  • the electronic component 210 can be any one of a semiconductor active component, a passive component, and a combination thereof.
  • the metal flange 220 is connected to the source in the active component to form the common source S of the electronic component 210.
  • the input end and the output end of the electronic component 210 are respectively connected.
  • the source S is grounded.
  • a protective cover 40 is added on the PCB 10 adjacent to the metal flange 220 to cover the electronic component 210, thereby protecting the electronic component 210.
  • the protective cover 40 is provided in a detachable structure, so that when the electronic component 210 needs to be repaired, replaced, or added with a new electronic component to change the operating function, it is only necessary to disassemble or open the protective cover. 40 is ok, thereby increasing the flexibility of product design while making the electronic component mounting structure of the present invention reusable.
  • the protective cover 40 in the present invention is different from the conventional packaging technology in that the inner space covered by the air is filled with air instead of other insulating medium. Relatively speaking, air has a lower power-saving coefficient, and in some high-power devices such as RF devices, the parasitic capacitance generated by the package medium can be reduced.
  • FIG. 3 is a schematic diagram of a manufacturing method of the electronic component mounting structure of the first embodiment, as shown in the following figure:
  • a PCB 10 is provided, and the surface of the PCB 10 is provided with a metal layer 103.
  • a slot 101 is formed in the PCB 10, and the slot 101 should be larger than the metal flange. When grooving, it can be done by mechanical drilling or laser drilling.
  • Metal deposition is performed at the slot 101, so that the groove wall of the slot 101 is covered with a layer of metal 102.
  • precise control of the slot size of the slot 101 is achieved, thereby making the slotted
  • the slot size of 101 matches the metal flange.
  • the metal flange 220 is embedded in the slot 101. Unlike the prior art, since the size of the metal flange 220 is substantially the same as the slot size of the slot 101, the metal flange 220 after insertion can be relatively compact. The fixing in the slot 101 does not cause a positional shift. Further, after the embedding is completed, the solder paste is applied at the intersection of the metal flange 220 and the slot 101, and the metal flange 220 is completely fixed to the PCB 10 by a reflow soldering process to form the metal flange 220 and the PCB 10. One.
  • the metal layer 60 has the following two functions. The first is to fix the metal flange 220 to the PCB 10 more firmly. It is possible to form a pad for subsequent wire bonding by using the metal layer 60.
  • the manufacturing method may be a conventional metal layer manufacturing process such as electroplating or vapor deposition.
  • the metal layer 60 comprises a superposition of two or more metal layers, such as nickel + gold. It should be noted that the thickness of the metal layer 60 Very thin, on the order of microns, so that the layer of metal 60 is negligible relative to other layers of material.
  • the metal layer 103 and the metal layer 60 on the PCB 10 are patterned on the side of the metal flange 220 where the electronic component is to be mounted, and the subsequent input/output electrodes 104, 105, and peripheral circuit devices are fabricated. Connected circuit graphics.
  • the input/output electrodes 104, 105 are distributed on both sides of the metal flange 220 and insulated from the metal flange 220.
  • the electronic component 210 is mounted on the metal flange 220.
  • the electronic component 210 is usually a combination of a plurality of electronic components, has a certain electrical function, can serve as a complete circuit, or can serve as a module in a circuit, and can even serve as a module. Use of an electronic component.
  • a soldering process with a temperature lower than 250 ° C should be selected for mounting, such as a low temperature silver soldering process.
  • the respective electronic components are connected by a wire bonding process, and the input/output terminals of the electronic components are connected to the input/output electrodes 104, 105 on the PCB 10.
  • a protective cover 40 can be placed over the area where the electronic component 210 is provided.
  • the protective cover has functions such as anti-collision, moisture proof, dustproof, etc., to protect the electronic component 210 inside from the external environment.
  • the process before the installation of electronic components can be done by the PCB manufacturer alone, that is, the PCB manufacturer can provide the PCB manufacturer with a metal flange, and the electronics manufacturer directly on the metal flange. Install the electronics and pull in the leads and cover. In this way, the intermediate link that the original electronic component manufacturer needs to return to the PCB manufacturer for reflow soldering after installing the outer metal flange is omitted, which not only improves the production efficiency, reduces the production cost, but also can be diversified for the electronic component manufacturer.
  • the design of the electronic components provides a basic platform, which greatly enhances the design flexibility of the electronics manufacturer.
  • FIG. 4A-4B is a schematic structural view of the electronic component mounting structure in the first embodiment.
  • the electronic component mounting structure can be used alone as an electronic component product having a complete circuit function.
  • the heat dissipating metal 50 may be attached to the whole PCB 10 or may be only under the metal flange.
  • the heat dissipation metal 50 is mounted in the heat dissipation region as shown in FIG. 4A.
  • the electronic component mounting structure can also be used as a functional module of a certain circuit.
  • the PCB 10 needs to be mounted on a third-party PCB 110 having a complete circuit function, and the input electrode and the output electrode on the PCB 10 are respectively connected to the lead wire through the lead wire.
  • the third-party PCB 110 is then slotted and attached to the heat-dissipating metal 50 at a position corresponding to the heat-dissipating area of the metal flange 220, as shown in FIG. 4B.
  • the metal layer 60 should be present on the upper and lower surfaces of the PCB 10, and the following drawings are the same.
  • FIG. 5 is a schematic view showing the mounting structure of the electronic component according to the second embodiment of the present invention.
  • a slit 101 is formed in the PCB 10
  • a metal flange 220 is embedded in the slot 101.
  • the metal flange 220 is mounted with a plurality of electronic components 210 which are connected to each other through the lead wires 30 in accordance with the circuit function to form a circuit having a certain function.
  • the PCB 10 is a single board.
  • the PCB 10 is only used as a substrate for mounting electronic components, and no other peripheral circuits are provided thereon. Therefore, the size is also designed as long as the metal method is satisfied. Lan and electronic components can be installed.
  • the electronic component mounting structure in the embodiment can be directly designed as an electronic component having a certain function, and in use, the electronic component can be mounted on an external circuit board.
  • the manufacturing method of the electronic component mounting structure in this embodiment is basically the same as the manufacturing method of the electronic component mounting structure in the first embodiment, and the difference is that:
  • the input electrode 104 and the output electrode 105 need to be taken out in the form of a pad to facilitate connection with a third-party PCB. Therefore, when the input electrode 104, the output electrode 105, and the protective cover 40 are fabricated, at least a portion of the two electrodes are left outside to form an external connection pad, and when the electronic component mounting structure is connected to the outside When the PCB is provided, the signal output and output to the electronic component 210 can be realized by simply soldering the leads to the above pads. Schematic diagram of the product time.
  • the electronic component mounting structure in this embodiment is equivalent to an electronic component, it is necessary to mount the electronic component mounting structure to an external PCB 110 having a complete circuit function, and then mount the electronic component through the lead wire. On the pad and PCB110, the input / The output is connected. For some high-power devices, it is also necessary to install a heat-dissipating metal 50 under the PCB 110.
  • the heat dissipating metal 50 can be grooved on the PCB 110 so that the heat dissipating metal 50 is in contact with the metal flange 220 to thereby dissipate heat, as described in FIG. 6A.
  • FIG. 7 is a schematic diagram of a mounting structure of an electronic component according to a third embodiment of the present invention.
  • a slot 101" is formed in the PCB 10
  • a metal flange 220" is embedded in the slot 101.
  • a plurality of electronic components 210" are mounted on the metal flange 220", and these electronic components 210" are connected to each other by a lead function 30" in accordance with a circuit function to form a circuit having a certain function.
  • This embodiment is provided with two electrode pads 106, 107 at the position of the input/output electrodes 104, and 105" below the PCB 10", while the PCB 10" is at the position of the substrate 10" compared to the second embodiment.
  • a through hole is provided in the portion, and a metal hole post is poured in the through hole so that the two electrode pads 106, 107 are respectively connected to the input/output electrodes 104", 105" located above the PCB 10".
  • the lower part of the PCB 10" becomes an electrode pad area connected to an external circuit, and the input electrode, the output electrode and the ground electrode respectively correspond to different pads, so that the electronic component mounting structure is closer to the form of the electronic component.
  • a PCB 10" is provided, and the surface of the PCB 10" is provided with a metal layer 103".
  • a slit 101" is simultaneously formed on the PCB 10" and two through holes 108 are formed on both sides of the slot 101", the slot 101"
  • the size should be larger than the metal flange. When slotting, it can be done by mechanical drilling or laser drilling.
  • Metal deposition is performed at the groove 101" and the two through holes 108, so that the groove wall of the groove 101" is covered with a layer of metal 102", and a metal hole column 109 is formed in the through hole 108.
  • the thickness control enables precise control of the slot size of the slot 101" such that the slot size of the slot 101" matches the metal flange.
  • the metal flange 220 is embedded in the slot 101". Unlike the prior art, since the size of the metal flange 220" is substantially the same as the slot size of the slot 101", the metal flange after the embedding The 220" can be relatively compactly fixed in the slot 101", and no positional offset occurs. Further, after the embedding is completed, the solder paste is applied at the intersection of the metal flange 220" and the slot 101", and the metal flange 220 is completely fixed to the PCB 10 by a reflow soldering process, so that the metal flange 220" Integrated with the PCB10".
  • the metal layer 60" has the following two functions. The first is to fix the metal flange 220" more firmly. On the PCB 10", the second is to use the metal layer 60" to form a pad for subsequent wire bonding.
  • the manufacturing method may be a conventional metal layer fabrication process such as electroplating or evaporation.
  • the metal layer 60" includes A superposition of two or more metal layers, such as nickel + gold. It should be noted that the thickness of the metal layer 60" is very thin, on the order of microns, so that the metal layer 60" is negligible relative to other layers of material.
  • the metal layer 103" and the metal layer 60" are patterned by a patterning process, and the input/output electrodes 104", 105" are formed on the PCB 10", respectively, and the input/output is corresponding under the PCB 10". Electrode pads 106, 107 are formed at the positions of the electrodes 104", 105". The input/output electrodes 104", 105" and the electrode pads 106, 107 are electrically connected through corresponding metal post 109. The four electrodes are distributed on both sides of the metal flange 220" and insulated from the metal flange 220".
  • the electronic component 210" is usually a combination of a plurality of electronic components, has a certain electrical function, can serve as a complete circuit, or can serve as a module in a circuit, even It can also be used as an electronic component.
  • a protective cover 40" can be attached over the PCB 10", which has the functions of anti-collision, moisture proof, dustproof, etc., to protect the electronic component 210 inside from being damaged by the external environment.
  • FIG. 9 is a schematic structural view of the electronic component mounting structure of the third embodiment when it is fabricated into an electronic component product. As shown in the figure, since in this embodiment, all the electrode pads of the electronic component mounting structure are disposed under the PCB 10", when it is mounted on the third-party PCB 110" with respect to the second embodiment, These electrode pads are directly soldered to the corresponding pads 111, 112 of the third-party PCB 110, which saves a process of one lead.
  • the electronic component 210 on the flange 220" is one or a combination of resistors, inductors or capacitors such that the electronic component product constitutes a surface mount component that can be used as a surface mount component (SMD).
  • SMD surface mount component
  • FIG. 10 is a schematic view showing the mounting structure of the electronic component in the fourth embodiment of the present invention.
  • the thickness of the metal flange is set to be larger than the thickness of the PCB so that the underside of the metal flange protrudes from the PCB. In this way, it is convenient to install the heat-dissipating metal under the metal flange. It should be noted that the thickness of the metal flange can also be chosen to be smaller than the thickness of the PCB, so that the underside of the metal flange is trapped in the PCB.
  • a plurality of metal flanges may be embedded on one PCB according to the idea of the present invention, and a plurality of electronic components may be disposed on the plurality of metal flanges to form one Complex, complete circuit.
  • the present invention provides an electronic component mounting structure and a manufacturing method thereof.
  • the metal flange is fastened in the slot of the PCB, so there is no positional deviation.
  • the product consistency is improved.
  • the electronic component mounting structure is manufactured, since the PCB manufacturer has fixed the metal flange on the PCB, the electronic component manufacturer can directly install the electronic component after obtaining the PCB, thereby saving the intermediate link. , increase production efficiency and reduce costs.
  • an embodiment of the present invention further provides an electronic component product.
  • the electronic component product includes the electronic component mounting structure according to any of the above embodiments, the electronic component product further comprising a heat dissipating metal disposed under the printed circuit board of the electronic component mounting structure and in contact with the metal flange. Further, the heat dissipating metal and the electronic component are arranged between the chapters and the third-party printed circuit board on the third-party printed circuit board.
  • the electronic component product has the same beneficial effects as the electronic component mounting structure.

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Abstract

一种电子件安装结构及制作方法、电子件产品，该电子件安装结构包括印刷电路板，金属法兰，以及设置在该金属法兰上的若干个电子件，所述印刷电路板上设有开槽，该开槽的槽壁上覆有金属层，所述金属法兰受限于所述槽壁上的金属层，被紧固于该开槽中。由于金属法兰被紧固在PCB的开槽中，因此不存在位置上的偏移，提高了产品的一致性，另外在该电子件安装结构的制作方法中，由于PCB厂家已经将金属法兰固定在PCB上，因此电子件厂家拿到PCB之后可以直接进行电子件的安装，节省了中间环节，提高了生产效率并降低了成本。

Description

一种电子件安装结构及制作方法、 电子件产品
本申请要求于 2013 年 03 月 27 日提交中国专利局、 申请号为 201310103741.8, 发明名称为"一种电子件安装结构及制作方法、 电子件产品" 的中国专利申请的优先权， 其全部内容通过引用结合在本申请中。
技术领域 本发明属于电子件制造领域，具体地涉及一种电子件安装结构及其制作方 法、 电子件产品。 背景技术 通常， 电子件贴装或者插装在印刷电路板 (Print Circuit Board, 下文简称 PCB)上， 例如通过 PCB上的通孔焊接到 PCB 上。 在这种情况下， 电子件工 作时所产生的热量通过电子件周围空气和 PCB 板传向外界传输， 实现自身散 热。 由于 PCB 和空气导热能力较差， 所以这种结构不利于电子件散热， 尤其 对于功率较大的电子件而言，散热效果更差。 因此需要通过优化插装器件组装 设计， 提高电子件的散热能力。 一种解决方案是将散热要求高的电子件安装在金属法兰上，利用引线将电 子件的引脚与其他电路连接。请参见图 1，图 1是一种现有的电子件安装在 PCB 板上的结构示意图。 其中， PCB1上开设有一个两端开口的凹槽， 多个电子件 21设置于一金属法兰 22上并整体放置于 PCB1上的凹槽中。该多个电子件 21 通过引线互相连接并将输出端和输出端分别接到 PCB 的两个焊盘 （pad ) 11 上， 以此连接到外部的输出 /输出电路中去。 在一种应用中， 当这些电子件包 含有半导体主动元件时， 其中一个焊盘对应的电极即为该元件的栅极 (gate) , 另一个焊盘对应的电极则为漏极 (drain), 而其底部连接的金属法兰 22则作为 源极 (source)。 在 PCB1的下方安装一块散热金属 3， 该散热金属 3与金属法兰 22接触， 以便将电子件 21发出的热量经金属法兰 22传导到散热金属 3上。 在电子件 21的外围上方设有保护盖 5。 该电子件安装结构， 是将电子件 21和 金属法兰 22制作在一起作为一个单独的元件， 在进行制作时， 首先由 PCB厂 家依据要求在 PCB板上进行开槽并在 PCB的背面贴敷散热金属块。 然后将由 电子件厂商提供的电子件（包含金属法兰)通过回流焊工艺安装到该凹槽中。 最 后进行引线处理并在该电子件区域上方进行封装处理。然而上述制作工艺却存 在如下的问题： 第一： 由于电子件与金属法兰为一个整体， 因此其安装到 PCB板上的时 候， 只能通过焊膏 4进行回流焊工艺完成， 这样对于 PCB板上的凹槽开口， 要求其尺寸必须大于金属法兰的尺寸。 这样一来，金属法兰在凹槽中会有左右 位置上的偏差， 这种位置偏差导致金属法兰上的电子件与 PCB之间的引线存 在长短不一的缺陷，这种缺陷在一些大功率器件中，比如高功率的射频器件中， 会产生严重的阻抗波动， 影响产品的一致性。 第二： 在制作该产品时， PCB厂家将制作完成 PCB提供给电子件厂家， 电子件厂家则将制作完成的电子件装入 PCB之后还需返回给 PCB厂家进行最 后的回流焊以及引线处理， 中间步骤多且实际操作十分不便， 影响产品的制作 周期和成本。
有工艺中的技术问题。 发明内容 有鉴于此， 本发明的目的在于提出一种电子件安装结构和制作方法。该电 子件安装结构能够解决由金属法兰的位置偏移引起的引线长短不一的问题，从 而提高电子件产品的一致性。而制作方法能够省去电子件安装结构制作过程中 的中间环节， 提高产品的生产效率并降低制作成本。 另外， 本发明的目的还在 于提出具有上述电子件安装结构的电子件产品。
根据本发明的目的提出的一种电子件安装结构， 包括印刷电路板，镶嵌在 该印刷电路板上的金属法兰， 以及设置在该金属法兰上的若干个电子件， 所述 印刷电路板上设有开槽， 该开槽的槽壁上覆有金属层， 所述金属法兰受限于所 述槽壁上的金属层，被紧固于该开槽中， 所述若干个电子件之间按电路要求由 多个引线连接，所述印刷电路板在邻近金属法兰的部分设有输入电极和输出电 极，所述输入电极和输出电极分别通过引线连接到安装在金属法兰上的电子件 上。
优选的， 所述印刷电路板上设有外围器件电路， 所述输入电极和输出电极 与所述外围器件电路具有电性连接关系。
优选的， 所述印刷电路板为一块单独的板材， 其大小满足对金属法兰及电 子件的安装要求。
优选的，在所述印刷电路板的下方正对输入电极和输出电极的位置处设有 两个电极焊盘， 同时在该位置处的印刷电路板部分中设有通孔， 并在通孔中灌 注金属孔柱， 从而使该两个电极焊盘分别与位于印刷电路板上方的输入电极、 输出电极相连。
优选的， 所述金属法兰上的电子件为电阻、 电感或电容中的一种或几种组 合， 使得所述电子件安装结构成为表面贴装元件。
优选的，在印刷电路板上方邻近金属法兰的区域设有保护罩， 所述保护罩 将电子件覆盖进去。
优选的， 所述金属法兰的厚度大于该印刷电路板的厚度，使该金属法兰的 下方突出于该印刷电路板， 或者所述金属法兰的厚度小于该印刷电路板的厚 度， 使该金属法兰的下方内陷于该印刷电路板。
优选的， 所述金属法兰的材质为铜、 钨化铜或钴化铜中的一种。
根据本发明的同一目的提出的一种电子件安装结构的制作方法， 包括： 在所述印刷电路板上开设开槽， 该开槽的尺寸大于所述金属法兰； 在所述开槽的槽壁上覆盖一层金属，该层金属厚度使得该开槽的槽口尺寸 与金属法兰相匹配；
将金属法兰嵌入开槽； 在印刷电路板的上下表面各电镀上一层金属层；
利用图形化工艺，对印刷电路板上方的金属层进行图形化， 制作出输入电 极和输出电极， 所述输入电极和输出电极分布于金属法兰的两侧，且与该金属 法兰之间绝缘；
在所述金属法兰上安装若干电子件；
通过引线工艺将上述各个电子件进行连接，并将电子件的输入端和输出端 连接到位于印刷电路板上的输入电极和输出电极上去；
在设有电子件的区域上方设置一个保护盖。
优选的， 在制作开槽的同时， 还包括在该开槽两侧开设通孔的步骤。
优选的，在开槽槽壁上覆盖金属层的同时，还包括在所述通孔中形成金属 孔柱的步骤。
优选的，在所述图形化工艺中，还包括在印刷电路板的下方对应该所述输 入电极和输出电极的位置处制作出两个电极焊盘，所述两个电极焊盘与所述金 属法兰之间绝缘。
根据本发明另一目的提出的一种电子件产品，包括如上所述的电子件安装 结构， 所述电子件产品还包括一散热金属，设置在该电子件安装结构的印刷电 路板下方， 并与该金属法兰接触。
优选的，所述散热金属和电子件安装结构之间，还设有第三方印刷电路板， 述第三方印刷电路板上。
本发明的电子件安装结构与现有技术相比， 具有如下的技术优点： 第一： 该电子件安装结构将金属法兰直接固定在 PCB 中， 使得金属法兰 不会存在位置偏移， 提高了产品的一致性。
第二： 由于 PCB厂家在制作 PCB时， 已经将金属法兰固定在 PCB上， 因此电子件厂家拿到 PCB之后可以直接进行电子件的安装，节省了中间环节， 提高了生产效率并降低了成本。
第三： 本发明的电子件安装结构， 即可以作为中间产品配合外接的电路板 进行使用， 也可以直接制作成终端产品， 比如表面贴装元件、 射频器件等， 因 此大大提高了产品的设计自由度。
第四： 当本发明的电子件为高频器件时， 只需将电子件安装结构中所使用 的 PCB板选择为高品质的板材， 而其他部分使用到的 PCB可以选定为普度板 材， 因此可以降低对 PCB板材的要求， 进一步降低成本。 附图说明 为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施 例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地， 下面描述 中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲，在不付 出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图 1是一种现有的电子件安装在 PCB板上的结构示意图；
图 2是本发明第一实施方式下电子件安装结构示意图；
图 3是本发明第一实施方式的电子件安装结构的制作方法示意图； 图 4 是本发明第一实施方式下将电子件安装结构制作成电子件产品时的 结构示意图；
图 5是本发明第二实施方式下电子件安装结构示意图； 结构示意图；
图 7是本发明第三实施方式下电子件安装结构示意图； 意图；
图 9 是本发明第三实施方式的电子件安装结构制作成电子件产品时的结 构示意图；
图 10是本发明第四实施方式下的电子件安装结构示意图。 具体实施方式
正如背景技术中所述，在一些需要考虑散热问题的电子件安装方法中， 先 将电子件和金属法兰制作在一起， 然后再安装到 PCB上。 这种方法将电子件 和金属法兰视为一个单独的元件， 由电子件厂家自行设计，在一定程度上降低 了电子件编排方式对 PCB的依赖程度， 提高了一部分电子件的设计自由度。 然而这种方法也存在一些不足： 一方面， 在将金属法兰嵌入到 PCB 中去时， 由于其表面已经设有电子件，因此只能在金属法兰的底部添加焊膏进行回流焊 工艺， 这就要求在 PCB上的开槽尺寸应大于金属法兰的尺寸， 这样一来， 使 得金属法兰在开槽中的位置精度难以得到保证，容易导致电子件往输入端或者 输出端的偏移， 严重影响产品的稳定性。 另一方面， 由于在制作过程中需要将 电子件和 PCB分多步制作， 增加了中间环节， 使得生产效率低下且提高制作 成本。
因此， 本发明提出了一种电子件安装方法， 该电子件安装方法通过将金属 法兰与 PCB板设置成一个整体， 使金属法兰被固定在 PCB板中， 然后再在该 金属法兰上安装电子件。 如此一来， 避免了金属法兰在 PCB上的位置偏移， 使电子件的一致性大大提高。 同时， 由于在 PCB板上镶嵌金属法兰的工艺可 以由 PCB厂家完成， 电子件厂家拿到 PCB之后可以直接在上面安装电子件形 成完整的产品， 减少了中间环节， 大大提高了生产效率， 同时也降低了成本。 请参见图 2， 图 2是本发明第一实施方式下电子件安装结构示意图。 如图 所示， 在 PCB10上开设了一个开槽 101， 一块金属法兰 220镶嵌在该开槽 101 中。 金属法兰 220上安装了若干电子件 210， 这些电子件 210彼此之间按照电 路功能通过引线 30连接，形成具有一定功能的电路。在该实施方式中， PCB10 上设置了外围的电路器件（图中未示出）， 这些外围的电路器件相对金属法兰 220上的电子件 210来说， 起到连接、 匹配或者输出 /输出的作用。 举例来说， 在该外围电路器件中设置了信号输入电路， 提供给电子件 210—个输入信号， 电子件 210则将接收到的信号进行处理， 比如放大、 滤波、 变压等等。 又比如 说在外围电路器件中搭载负载电路，根据电子件 210提供的电压、 电流信号进 行运作。 又或者为单纯的连接电路，将电子件 210提供的输出信号传输给设置 于 PCB10之外的电路中去。 上述无论哪种形式的外围电路器件， 在邻近金属 法兰 220的 PCB10部分， 都至少设有一个输入电极 104和一个输出电极 105。 该输入电极 104和输出电极 105与电子件 210设置在 PCB10的同一侧 （下文 中将该侧定义为 PCB的上方， 与该侧相对的另一侧定义为 PCB的下方） ， 输 入电极 104和输出电极 105分别通过引线与这些安装在金属法兰 220上的电子 件 210连接，同时输入电极 104和输出电极 105又与外围的器件电路具有电性 连接的关系。 通常情况下， 这两个电极需要与金属法兰 220绝缘， 否则容易引 起短路。
金属法兰 220受限于设置在开槽 101的槽壁两端的金属，被紧固在该开槽 101中， 该金属法兰 220可以对电子件 210起到散热的作用， 同时在一些有源 器件的应用中， 该金属法兰 220还起到接地的作用。金属法兰 220的材质视电 子件 210而定， 比如电子件 210的功率和发热较大时， 可以选取散热性能较好 的金属材质， 而当电子件 210为小功率器件时， 则可以选取普通的金属材料， 以节约成本。 一般地， 该金属法兰的材料可以为铜、 钨化铜、 钴化铜等等。 制 作时， 可以先将开槽 101的槽口开设的略大一点，通过在开槽 101的槽壁上制 作一层金属， 调节开槽的大小， 使槽口的尺寸与金属法兰 220匹配， 然后将该 金属法兰 220嵌入到该槽口中。 进一步地， 可以在金属法兰 220嵌入到开槽 101之后， 在通过回流焊工艺使其与 PCB10完全固定在一起， 形成一个整体。 这样一来，对于安装在金属法兰 220上的电子件 210来说， 就不存在位置偏移 的问题， 提高了工艺的稳定性， 使得制作出来的电子器件具有很好的一致性。
电子件 210可以为半导体主动元件、被动元件及其组合中的任意一种。 当 电子件 210中包含主动元件时， 金属法兰 220通过与主动元件中的源极相连， 形成了这些电子件 210的共源极 S， 此时电子件 210的输入端和输出端则分别 连接在栅极 G和漏极 D上， 而源极 S则接地。 进一步的， 在 PCB10上邻近金属法兰 220的区域增加一个保护罩 40， 将 电子件 210覆盖进去， 从而起到保护电子件 210的目的。 较佳地， 该保护罩 40设置成可拆卸式的结构， 如此一来， 当需要对电子件 210进行修理、 更换 或者增加新的电子件从而改变运用功能时，只需拆卸或打开该保护罩 40即可， 从而增加了产品设计的灵活性，同时使得本发明的电子件安装结构具有可重复 利用的价值。 需要指出的， 在本发明中的保护罩 40， 区别于传统的封装技术， 其覆盖的内部空间中填充的是空气而非其它绝缘介质。相对来说， 空气具有较 低的节电系数，在一些大功率器件比如射频器件中， 可以降低封装介质产生的 寄生电容。
请参见图 3，图 3是该第一实施方式的电子件安装结构的制作方法示意图， 如图所示：
首先， 提供一块 PCB10， 该 PCB10的表面设有金属层 103。 在 PCB10开 设开槽 101， 该开槽 101的尺寸应当大于金属法兰。 开槽时， 可釆用机械钻孔 或激光开孔的方式进行。
在开槽 101处进行金属沉积， 使开槽 101的槽壁上覆盖一层金属 102， 通 过对该金属 102厚度的控制， 实现对开槽 101的槽口尺寸的精确控制，从而使 得该开槽 101的槽口尺寸与金属法兰相匹配。
将金属法兰 220嵌入开槽 101中， 与现有技术不同的是， 由于此时金属法 兰 220的尺寸与开槽 101的槽口大小基本相当， 因此嵌入之后的金属法兰 220 能够较为紧凑的固定在该开槽 101中， 不会发生位置上的偏移。 进一步地， 嵌 入完成之后，在金属法兰 220与开槽 101的交接处涂布焊膏， 利用回流焊工艺 将金属法兰 220彻底固定到 PCB 10上，使该金属法兰 220与 PCB 10形成一体。
然后对 PCB10进行镀金（ plating )工艺， 在 PCB10的上下表面各镀上金 属层 60， 该金属层 60具有如下两个作用， 第一是将金属法兰 220更加牢固的 固定在 PCB10上，第二是利用该层金属层 60能够形成后续做引线焊接时的焊 盘。 其制作方法可以是电镀或蒸镀等常规金属层制作工艺。 通常， 该层金属层 60包含两种以上金属层的叠加， 如镍 +金。 需要指出的是， 金属层 60的厚度 非常薄， 大约在微米数量级， 以至于相对其他的材料层， 该层金属层 60可以 忽略不计。
利用图形化工艺， 在金属法兰 220将要安装电子件的一面， 对 PCB10上 的金属层 103 以及金属层 60进行图形化， 制作出后续使用的输入 /输出电极 104、 105， 和与外围电路器件的连接电路图形。 其中输入 /输出电极 104、 105 分布于金属法兰 220的两侧， 且与该金属法兰 220之间绝缘。
在金属法兰 220上安装电子件 210，电子件 210通常为多个电子件的组合， 具有一定的电功能，可以充当完整的电路，也可以充当一个电路中的某个模块， 甚至还可以作为某个电子元件使用。将电子件 210安装到金属法兰 220上去时， 考虑到 PCB10的性质， 应当选择温度低于 250°C的焊接工艺进行安装， 比如 低温银焊工艺。
之后， 通过引线工艺将各个电子件进行连接， 并将电子件的输入 /输出端 连接到位于 PCB 10上的输入 /输出电极 104、 105上去。
最后， 可以在设有电子件 210的区域上方加盖一个保护盖 40， 该保护盖 具有防撞、防潮、防尘等功能，以保护里面的电子件 210不受外部环境的破坏。
这里需要指出的是， 对于安装电子件之前的工艺， 可以由 PCB厂家单独 完成， 即 PCB厂家可以提供给电子件厂家一块包含金属法兰的 PCB板， 而电 子厂家则直接在该金属法兰上安装电子件， 然后拉入引线和封盖即可。如此一 来， 省去了原先需要电子件厂家在安装外金属法兰之后回到 PCB厂家进行回 流焊等的中间环节， 不仅提高了生产效率、 降低了制作成本， 还可以为电子件 厂家进行多元化的电子件设计提供了一个基础的平台，从而使的电子家厂家的 设计灵活性大大提高。
请参见图 4A-4B , 图 4A-4B是该第一实施方式下将电子件安装结构制作 成电子件产品时的结构示意图。 如图所示， 该第一实施方式中， 由于 PCB10 具有外围的器件电路部分，因此该电子件安装结构可以单独作为一块具有完整 电路功能的电子件产品使用。 此时， 只需在 PCB10的背面安装一块散热金属 50即可， 该散热金属 50可以是贴合整块 PCB10， 也可以只在金属法兰下方的 散热区域安装该散热金属 50， 如图 4A所示。该电子件安装结构还可以作为某 个电路的一个功能模块使用， 此时需要将 PCB10安装到一块具有完整电路功 能的第三方 PCB110上， 并将 PCB10上的输入电极和输出电极分别通过引线 连接到该第三方 PCB110上， 然后在金属法兰 220散热区域对应的位置处， 将 第三方 PCB110开槽并贴合散热金属 50， 如图 4B所示。 需要指出的是， 由于 金属层 60的厚度较薄， 在图 4A和 4B所示的结构中并没有示出， 然而该金属 层 60应当存在于 PCB10的上下表面， 以下图示相同。
请参见图 5， 图 5是本发明第二实施方式下电子件安装结构示意图。 如图 所示，在 PCB 10，上开设了一个开槽 101，，一块金属法兰 220，镶嵌在该开槽 101， 中。 金属法兰 220，上安装了若干电子件 210，， 这些电子件 210，彼此之间按照 电路功能通过引线 30，连接， 形成具有一定功能的电路。 在该实施方式中， PCB10，为一块单独的板材， 该 PCB10，仅作为安装电子件所需的基板使用， 其 上不设有其它的外围电路，因此其大小也被设计成只要满足对金属法兰及电子 件的安装要求即可。如此一来， 可以将该实施方式下的电子件安装结构直接设 计成具有一定功能的电子元件，使用时，将该电子元件安装到外部的电路板上 即可。
该实施方式中的电子件安装结构的制作方法与第一实施方式下的电子件 安装结构的制作方法基本相同， 区别之处在于：
由于 PCB10，上没有外围电路， 需要将输入电极 104，和输出电极 105，以焊 盘的形式引出， 以方便连接第三方 PCB。 因此在制作该输入电极 104，和输出 电极 105，， 以及保护盖 40，的时候， 将该两个电极的至少一部分留在外面， 形 成对外的连接焊盘， 当该电子件安装结构连接到外设的 PCB上时， 只需将引 线焊接到上述焊盘上即可实现对电子件 210，的信号输出和输出。 品时的结构示意图。由于在该实施方式中的电子件安装结构相当于某个电子元 件， 因此安装时， 需要将该电子件安装结构安装到一具有完整电路功能的外部 PCB110，上， 然后通过引线把电子件安装结构上的焊盘与 PCB110，上的输入 / 输出端连接。对于一些大功率器件，还需要在 PCB 110，的下方安装一块散热金 属 50，。 散热金属 50，可以通过在 PCB110，上开槽， 使得该散热金属 50，与金属 法兰 220，接触， 从而起到散热的效果， 如图 6A所述。 也可以在 PCB110，上钻 出若干孔洞， 并在这些孔洞中灌注金属， 使得散热金属 50，与金属法兰 220，通 过这些孔洞中的金属进行热传导， 从而起到散热的效果， 如图 6B所示。 在该 实施方式中， 由于电子件安装结构与电子元件类似， 因此在一些高功率产品的 应用中， 可以只将该电子件安装结构中的 PCB板材选择为质量较高的材质， 而第三方的 PCB 板材可以选择为一般的材质， 这样相对于原先需要将整块 PCB板材都选择为高质量的材质， 其成本大大下降。
请参见图 7， 图 7是本发明第三实施方式下电子件安装结构示意图。 如图 所示， 在 PCB10"上开设了一个开槽 101"， 一块金属法兰 220"镶嵌在该开槽 101"中。 金属法兰 220"上安装了若干电子件 210"， 这些电子件 210"彼此之 间按照电路功能通过引线 30"连接， 形成具有一定功能的电路。 该实施方式与 第二实施方式相比，在 PCB10"的下方正对输入 /输出电极 104，，和 105"的位置 处设有两个电极焊盘 106、 107 , 同时在该位置处的 PCB10"部分中设有通孔， 并在通孔中灌注金属孔柱， 从而使该两个电极焊盘 106、 107 分别与位于 PCB10"上方的输入 /输出电极 104"、 105"相连。 如此一来， 可以把 PCB10" 上方的所有区域都覆盖在保护盖 40"内， 形成密封结构。 而 PCB10"的下方则 成为与外部电路相连接的电极焊盘区， 其输入电极、输出电极以及接地极分别 对应在不同的焊盘上， 使该电子件安装结构更接近电子元件的形式。 步骤示意图， 如图所示，
首先，，提供一块 PCB10",该 PCB10"的表面设有金属层 103"。在 PCB10" 上同时开设开槽 101"以及位于开槽 101"两侧的两个通孔 108， 该开槽 101 " 的尺寸应当大于金属法兰。 开槽时， 可釆用机械钻孔或激光开孔的方式进行。
在开槽 101"以及两个通孔 108处进行金属沉积，使开槽 101"的槽壁上覆 盖一层金属 102"， 同时在通孔 108里形成金属孔柱 109。 通过对该金属 102" 厚度的控制， 实现对开槽 101"的槽口尺寸的精确控制， 从而使得该开槽 101" 的槽口尺寸与金属法兰相匹配。
将金属法兰 220"嵌入开槽 101 "中， 与现有技术不同的是， 由于此时金属 法兰 220"的尺寸与开槽 101 "的槽口大小基本相当， 因此嵌入之后的金属法兰 220"能够较为紧凑的固定在该开槽 101"中， 不会发生位置上的偏移。 进一步 地， 嵌入完成之后， 在金属法兰 220"与开槽 101"的交接处涂布焊膏， 利用回 流焊工艺将金属法兰 220"彻底固定到 PCB10"上， 使该金属法兰 220"与 PCB10"形成一体。
然后对 PCB10"进行镀金 ( lating )工艺， 在 PCB10"的上下表面各镀上 金属层 60"， 该金属层 60"具有如下两个作用， 第一是将金属法兰 220"更加 牢固的固定在 PCB10"上， 第二是利用该层金属层 60"能够形成后续做引线焊 接时的焊盘。 其制作方法可以是电镀或蒸镀等常规金属层制作工艺。 通常， 该 层金属层 60"包含两种以上金属层的叠加， 如镍 +金。 需要指出的是， 金属层 60"的厚度非常薄， 大约在微米数量级， 以至于相对其他的材料层， 该层金属 层 60"可以忽略不计。
利用图形化工艺， 对金属层 103"和金属层 60"进行图形化， 分别在 PCB 10"的上方制作出输入 /输出电极 104"、 105"， 以及在 PCB 10"的下方对 应该输入 /输出电极 104"、 105"的位置处制作出电极焊盘 106、 107。 其中输入 /输出电极 104"、 105"和电极焊盘 106、 107通过对应的金属孔柱 109实现电 连接。 该 4个电极两两分布于金属法兰 220"的两侧， 且与该金属法兰 220" 之间绝缘。
在金属法兰 220"上安装电子件 210"， 电子件 210"通常为多个电子件的 组合， 具有一定的电功能， 可以充当完整的电路， 也可以充当一个电路中的某 个模块， 甚至还可以作为某个电子元件使用。
之后， 通过引线工艺将各个电子件进行连接， 并将输入 /输出端连接到位 于？ 810"上的输入/输出电极 104"、 105"上去。 最后， 可以在 PCB10"上方加盖一个保护盖 40"， 该保护盖具有防撞、 防 潮、 防尘等功能， 以保护里面的电子件 210"不受外部环境的破坏。
请参见图 9， 图 9是该第三实施方式的电子件安装结构制作成电子件产品 时的结构示意图。 如图所示， 由于在该实施方式中， 该电子件安装结构的所有 电极焊盘都设置在 PCB10"的下方， 相对于第二实施方式， 其安装到第三方 PCB110"上去时， 只需将这些电极焊盘直接焊接在第三方 PCB110"对应的焊 盘 111、 112上即可， 节省了一道引线的工艺。 同时在该第三实施方式中揭露 的电子件安装结构， 在实际应用中， 金属法兰 220"上的电子件 210"为电阻、 电感或电容中的一种或几种组合，使得所述电子件产品构成表面贴装元件可以 作为一种表面贴装元件 (SMD)使用。
请参见图 10，图 10是本发明的第四实施方式下的电子件安装结构示意图。 在该实施方式中， 将金属法兰的厚度设置成大于 PCB的厚度， 使金属法兰的 下方突出于 PCB。 这样一来， 可以方便的在金属法兰的下方安装散热金属。 需要指出的是， 也可以将金属法兰的厚度选择成小于 PCB的厚度， 这样一来 就使的金属法兰的下方内陷在该 PCB 中。 当然， 对于实际应用中， 需要多个 电子元件时， 可以依据本发明的思想， 在一块 PCB上嵌制多个金属法兰， 并 在多个金属法兰上设置多个电子件， 从而形成一个复杂、 完整的电路。
综上所述， 本发明提出了一种电子件安装结构及其制作方法，在该电子件 安装结构中， 金属法兰被紧固在 PCB的开槽中， 因此不存在位置上的偏移， 提高了产品的一致性， 另外在制作该电子件安装结构时， 由于 PCB厂家已经 将金属法兰固定在 PCB上， 因此电子件厂家拿到 PCB之后可以直接进行电子 件的安装， 节省了中间环节， 提高了生产效率并降低了成本。
基于上述实施例提供的电子件安装结构，本发明实施例还提供了一种电子 件产品。该电子件产品包括上述实施例任一项所述的电子件安装结构， 该电子 件产品还包括一散热金属，设置在该电子件安装结构的印刷电路板下方， 并与 该金属法兰接触。 进一步地， 所述散热金属和电子件按章结构之间，还设有第三方印刷电路 所述第三方印刷电路板上。
该电子件产品具有与电子件安装结构相同的有益效果。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本 发明。 对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见 的， 本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下， 在 其它实施例中实现。 因此， 本发明将不会被限制于本文所示的实施例， 而是要 符合与本文所公开的原理和新颖特点相一致的最宽的范围。对所公开的实施例 的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的 多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般 原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此， 本发明将不会被限制于本文所示的实施例，而是要符合与本文所公开的原理和 新颖特点相一致的最宽的范围。

Claims

权 利 要 求
1、 一种电子件安装结构， 包括印刷电路板， 镶嵌在该印刷电路板上的金 属法兰， 以及设置在该金属法兰上的若干个电子件， 其特征在于： 所述印刷电 路板上设有开槽， 该开槽的槽壁上覆有金属层， 所述金属法兰受限于所述槽壁 上的金属层，被紧固于该开槽中， 所述若干个电子件之间按电路要求由多个引 线连接， 所述印刷电路板在邻近金属法兰的部分设有输入电极和输出电极， 所 述输入电极和输出电极分别通过引线连接到安装在金属法兰上的电子件上。
2、 如权利要求 1所述的电子件安装结构， 其特征在于： 所述印刷电路板 上设有外围器件电路，所述输入电极和输出电极与所述外围器件电路具有电性 连接关系。
3、 如权利要求 1所述的电子件安装结构， 其特征在于： 所述印刷电路板 为一块单独的板材， 其大小满足对金属法兰及电子件的安装要求。
4、 如权利要求 3所述的电子件安装结构， 其特征在于： 在所述印刷电路 板的下方正对输入电极和输出电极的位置处设有两个电极焊盘，同时在该位置 处的印刷电路板部分中设有通孔， 并在通孔中灌注金属孔柱，从而使该两个电 极焊盘分别与位于印刷电路板上方的输入电极、 输出电极相连。
5、 如权利要求 3所述额电子件安装结构， 其特征在于： 所述金属法兰上 的电子件为电阻、 电感或电容中的一种或几种组合，使得所述电子件安装结构 成为表面贴装元件； 或者所述金属法兰上的电子件包括半导体主动元件， 所述 金属法兰连接在所述半导体主动元件上的源极，使得该半导体主动元件上的源 极接地。
6、 如权利要求 1所述的电子件安装结构， 其特征在于： 在印刷电路板上 方邻近金属法兰的区域设有保护罩， 所述保护罩将电子件覆盖进去。
7、 如权利要求 1所述的电子件安装结构， 其特征在于： 所述金属法兰的 厚度大于该印刷电路板的厚度，使该金属法兰的下方突出于该印刷电路板， 或 者所述金属法兰的厚度小于该印刷电路板的厚度，使该金属法兰的下方内陷于 该印刷电路板。
8、 如权利要求 1所述的电子件安装结构， 其特征在于： 所述金属法兰的 材质为铜、 钨化铜或钼化铜中的一种。
9、 一种如权利要求 1所述的电子件安装结构的制作方法， 其特征在于， 包括：
在所述印刷电路板上开设开槽， 该开槽的尺寸大于所述金属法兰； 在所述开槽的槽壁上覆盖一层金属，该层金属厚度使得该开槽的槽口尺寸 与金属法兰相匹配；
将金属法兰嵌入开槽；
在印刷电路板的上下表面各电镀上一层金属层；
利用图形化工艺，对印刷电路板上方的金属层进行图形化， 制作出输入电 极和输出电极， 所述输入电极和输出电极分布于金属法兰的两侧，且与该金属 法兰之间绝缘；
在所述金属法兰上安装若干电子件；
通过引线工艺将上述各个电子件进行连接，并将电子件的输入端和输出端 连接到位于印刷电路板上的输入电极和输出电极上去；
在设有电子件的区域上方设置一个保护盖。
10、 如权利要求 9所述的电子件安装结构的制作方法， 其特征在于： 在制 作开槽的同时， 还包括在该开槽两侧开设通孔的步骤。
11、 如权利要求 10所述的电子件安装结构的制作方法， 其特征在于： 在 开槽槽壁上覆盖金属层的同时， 还包括在所述通孔中形成金属孔柱的步骤。
12、 如权利要求 11所述的电子件安装结构的制作方法， 其特征在于： 在 所述图形化工艺中，还包括在印刷电路板的下方对应该所述输入电极和输出电 极的位置处制作出两个电极焊盘， 所述两个电极焊盘与所述金属法兰之间绝 13、 一种电子件产品， 其特征在于： 包括如权利要求 1至 8任意一项所述 的电子件安装结构， 所述电子件产品还包括一散热金属，设置在该电子件安装 结构的印刷电路板下方， 并与该金属法兰接触。 14、 如权利要求 13所述的电子件产品， 其特征在于： 所述散热金属和电 子件安装结构之间，还设有第三方印刷电路板， 所述电子件安装结构中的印刷 电路板上的输入电极和输出电极同时连接在所述第三方印刷电路板上。
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