WO2014097575A1 - 熱伝導シート - Google Patents
熱伝導シート Download PDFInfo
- Publication number
- WO2014097575A1 WO2014097575A1 PCT/JP2013/007253 JP2013007253W WO2014097575A1 WO 2014097575 A1 WO2014097575 A1 WO 2014097575A1 JP 2013007253 W JP2013007253 W JP 2013007253W WO 2014097575 A1 WO2014097575 A1 WO 2014097575A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sheet
- adhesive layer
- adhesive
- heat conductive
- separator
- Prior art date
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
Definitions
- the present invention relates to a heat conductive sheet used for various electronic devices such as mobile phones.
- an adhesive layer is provided on the entire high thermal conductive sheet and bonded. For this reason, for example, when bonded to a reflection sheet disposed on the back side of the liquid crystal panel, the reflection sheet is likely to be warped or distorted when bonded to the entire surface.
- a mount separator for protecting the adhesive layer is bonded to the surface provided with the adhesive layer.
- a release layer is formed on the surface to be bonded to the adhesive layer of the mount separator. Therefore, the mount separator can be easily peeled from the adhesive layer.
- Patent Document 1 is known as prior art document information related to the invention of this application.
- an object of this invention is to provide the heat conductive sheet which is easy to process into a defined shape, without producing curvature and distortion with respect to what was bonded.
- the heat conductive sheet of the present invention is provided on the entire first surface side, the first sheet having heat conductivity, the adhesive layer provided on a part of the first surface of the first sheet, and the first surface side.
- a mount separator has slight adhesiveness, and the first sheet and the mount separator can be adhered, and the adhesive force between the first sheet and the adhesive layer is stronger than the adhesive force between the mount separator and the adhesive layer.
- the portion without the adhesive layer is also the first due to the slight adhesiveness of the mount separator.
- the sheet can be held.
- the first sheet can be formed in a predetermined shape without any deviation during processing. Even if the first sheet is bonded to a reflection sheet of a liquid crystal panel, it is only partially bonded, so that it is difficult to cause warping or distortion.
- FIG. 1 is a cross-sectional view of a heat conductive sheet in an embodiment of the present invention.
- FIG. 2 is an exploded perspective view of the heat conductive sheet shown in FIG.
- FIG. 3 is a sectional view of an apparatus using the heat conductive sheet shown in FIG. 4A is a cross-sectional view of the heat conductive sheet in the process of manufacturing in the method of manufacturing the heat conductive sheet shown in FIG. 4B is a perspective view of the heat conductive sheet in the process of manufacturing shown in FIG. 4A.
- FIG. 4C is a cross-sectional view showing a procedure in the method for manufacturing a heat conductive sheet following FIG. 4A.
- FIG. 4D is a perspective view of the heat conductive sheet in the middle of manufacture shown in FIG. 4C.
- FIG. 4E is a cross-sectional view illustrating a procedure in the method for manufacturing a heat conductive sheet subsequent to FIG. 4C.
- 4F is a perspective view of the heat conductive sheet in the process of manufacturing shown in FIG. 4E.
- FIG. 4G is a cross-sectional view showing a procedure in the method for manufacturing a heat conductive sheet following FIG. 4E.
- FIG. 4H is a perspective view of the heat conductive sheet in the process of manufacturing shown in FIG. 4G.
- FIG. 4J is a cross-sectional view illustrating a procedure in the method for manufacturing a heat conductive sheet subsequent to FIG. 4G.
- FIG. 4K is a perspective view of the heat conductive sheet in the process of manufacturing shown in FIG. 4J.
- FIG. 4L is a cross-sectional view of a finished product in the method for manufacturing a heat conductive sheet subsequent to FIG. 4J.
- 4M is a perspective view of the heat conductive sheet shown in FIG. 4L.
- the heat conductive sheet 16 includes a first sheet 11, an adhesive layer 14, and a mount separator 15.
- the first sheet 11 is an insulating sheet 13A composed of, for example, a graphite sheet 12 having a thickness of about 25 ⁇ m, a polyethylene terephthalate (hereinafter referred to as PET) having a thickness of, for example, about 10 ⁇ m bonded to both surfaces, and an acrylic adhesive material. , 13B.
- PET polyethylene terephthalate
- the first sheet 11 has good thermal conductivity in the plane direction due to the graphite sheet 12, and further maintains insulation by bonding insulating sheets 13A and 13B to both sides.
- the first sheet 11 has a rectangular shape of, for example, about 11 cm ⁇ 6 cm, and is provided with an adhesive layer 14 having a width of, for example, about 2 mm along two long sides.
- the adhesive layer 14 is provided along the two long sides of the first sheet 11, but may be provided only at the four corners, for example.
- the adhesive layer 14 is composed of a PET sheet and an acrylic pressure-sensitive adhesive applied on both sides thereof.
- the total thickness of the adhesive layer 14 is, for example, about 10 ⁇ m.
- a mount separator 15 is bonded to the entire surface of the first sheet 11 on which the adhesive layer 14 is provided.
- the mount separator 15 is composed of a PET sheet and a pressure-sensitive adhesive material made of a silicone-based pressure-sensitive adhesive material formed on one surface thereof.
- the surface on which the adhesive material having slight adhesiveness is formed is bonded to the first sheet 11.
- the slight adhesiveness means an adhesive material having an appropriate adhesiveness to the target material and having no adhesive remaining on the target material when peeled off.
- an acrylic adhesive is used for the adhesive layer 14 and a silicone adhesive is used for the mount separator 15. Therefore, an acrylic adhesive material and a silicone adhesive material are interposed between the PET sheet of the adhesive layer 14 and the PET sheet of the mount separator 15, and the PET sheet of the adhesive layer 14 and the insulating sheet 13 ⁇ / b> A of the first sheet 11. Only an acrylic adhesive is interposed between the PET sheet and the PET sheet. As a result, the adhesive force between the first sheet 11 and the adhesive layer 14 is stronger than the adhesive force between the mount separator 15 and the adhesive layer 14. By doing in this way, even if the area of the adhesive layer 14 is reduced, it is possible to prevent the adhesive layer 14 from being peeled off from the first sheet 11 when the mount separator 15 is peeled off.
- the adhesive force between the adhesive layer and the mount separator can be reduced.
- the mount separator does not have slight adhesiveness, the portion without the adhesive layer of the first sheet is not fixed and becomes unstable, and misalignment or the like occurs.
- the portion without the adhesive layer of the first sheet is fixed by the adhesion of the fine adhesive tape.
- the portion of the adhesive layer is strongly bonded to the fine adhesive tape, and the adhesive force of the adhesive layer is stronger in the adhesive layer portion than the adhesive force between the first sheet and the adhesive layer. Therefore, when peeling the mount separator, the adhesive layer is peeled off from the first sheet and cannot be used.
- the adhesive force between the adhesive layer 14 and the mount separator 15 can be reduced.
- seat 11 is fixed by adhesion of a slightly adhesive tape. Therefore, the heat conductive sheet 16 can be easily processed into a predetermined shape without causing warpage or distortion to the laminated sheet.
- FIG. 3 is a cross-sectional view of a device to which the heat conductive sheet 161 from which the mount separator 15 is peeled from the heat conductive sheet 16 is attached.
- a heat conductive sheet 161 from which the mount separator is peeled off is bonded to a reflective sheet (not shown) installed on the back surface of the liquid crystal panel 17 via an adhesive layer 14, and a heat generating component 18 exists on the opposite side.
- the area of the adhesive layer 14 is as narrow as 10% or less of the heat conductive sheet 161, stress is hardly applied even when the layers are bonded, and it is possible to prevent the reflective sheet from being warped or distorted.
- the graphite sheet 12 has high thermal conductivity in the surface direction. Therefore, even if the heat generating component 18 generates heat, it is diffused in the plane direction by the graphite sheet 12 after being transmitted to the heat conductive sheet 161. As a result, heat spots can be prevented from occurring.
- FIGS. 4A to 4M show parts of FIGS. 4B, 4D, 4F, 4H, 4K, and 4M, respectively.
- an adhesive sheet 19 for forming an adhesive layer is bonded to the upper surface of the mount separator 15.
- the mount separator 15 has a PET sheet and a pressure-sensitive adhesive material made of a silicone-based pressure-sensitive adhesive material on its upper surface, and has a thickness of, for example, about 70 ⁇ m.
- the adhesive sheet 19 has a PET sheet and an acrylic pressure-sensitive adhesive material on both sides thereof, and the thickness thereof is, for example, about 10 ⁇ m.
- the adhesive sheet 19 is cut into a predetermined shape with a mold, and unnecessary portions are peeled off to form the adhesive layer 14 as shown in FIGS. 4C and 4D.
- an insulating sheet 13A having, for example, a PET sheet having a thickness of about 10 ⁇ m on the surface on which the adhesive layer 14 is formed and an adhesive material provided on one surface thereof is provided on the upper surface of the adhesive material. Paste to position.
- the insulating sheet 13A Since the insulating sheet 13A is thinner than the mount separator 15, the insulating sheet 13A is deformed with respect to the step formed by the adhesive layer 14. In the portion without the adhesive layer 14, the PET film of the insulating sheet 13A and the adhesive material of the mount separator 15 are bonded.
- the graphite sheet 12 punched into a predetermined shape is bonded onto the insulating sheet 13A.
- the insulating sheet 13B is bonded from above the graphite sheet 12 so that the adhesive material is located on the lower surface.
- the first sheet 11 and the adhesive layer 14 are cut into a predetermined shape with a mold, and unnecessary portions are peeled off to complete the heat conductive sheet 16 as shown in FIGS. 4L and 4M.
- a release agent is applied to the bonding surface.
- the adhesive layer is provided on the entire surface of the heat conductive sheet, the adhesive layer can be cut even when it is cut with a mold due to the adhesive force of the adhesive layer.
- the area of the adhesive layer becomes extremely small as in the present embodiment, the first sheet cannot be sufficiently held, and the positional deviation or the deviation of the cutting position when the graphite sheet is bonded to a predetermined position. Etc. are likely to occur.
- the mount separator 15 is made slightly sticky so that the adhesive force between the first sheet 11 and the mount separator 15 is stronger than the adhesive force between the mount separator 15 and the adhesive layer 14. Yes.
- the first sheet 11 can be mainly held by the mount separator 15, and the heat conductive sheet 16 can be formed in a complicated shape.
- the heat conductive sheet according to the present invention can be easily processed into a predetermined shape without causing warpage or distortion to the laminated sheet. Therefore, it is useful industrially.
- First sheet 12 Graphite sheets 13A and 13B Insulating sheet 14 Adhesive layer 15 Mount separator 16 Thermal conductive sheet 17 Liquid crystal panel 18 Heating component 19 Adhesive sheet 161 Thermal conductive sheet
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
12 グラファイトシート
13A,13B 絶縁シート
14 接着層
15 台紙セパレーター
16 熱伝導シート
17 液晶パネル
18 発熱部品
19 接着シート
161 熱伝導シート
Claims (3)
- 熱伝導性を有する第1のシートと、
前記第1のシートの第1の面の一部に設けられた接着層と、
前記第1の面全体に設けられた台紙セパレーターと、を備え、
前記台紙セパレーターは微粘着性を有し、前記第1のシートと前記台紙セパレーターとは前記台紙セパレーターの微粘着性により粘着可能であり、前記第1のシートと前記接着層との接着力は、前記台紙セパレーターと前記接着層との接着力よりも強い熱伝導シート。 - 前記第1のシートと前記台紙セパレーターとの接着力は、前記台紙セパレーターと前記接着層との接着力よりも強い請求項1記載の熱伝導シート。
- 前記第1のシートにはグラファイトシートの両面に絶縁シートを貼り合せたものを用い、前記接着層にはアクリル系粘着材を用い、前記台紙セパレーターにはシリコーン系粘着材を用いたことを特徴とする請求項1記載の熱伝導シート。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201380023012.XA CN104271693B (zh) | 2012-12-17 | 2013-12-10 | 导热片 |
KR1020147028578A KR102073305B1 (ko) | 2012-12-17 | 2013-12-10 | 열전도 시트 |
JP2014552912A JP6421330B2 (ja) | 2012-12-17 | 2013-12-10 | 熱伝導シート |
US14/385,971 US9488420B2 (en) | 2012-12-17 | 2013-12-10 | Heat conducting sheet |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-274291 | 2012-12-17 | ||
JP2012274291 | 2012-12-17 |
Publications (1)
Publication Number | Publication Date |
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WO2014097575A1 true WO2014097575A1 (ja) | 2014-06-26 |
Family
ID=50977938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/007253 WO2014097575A1 (ja) | 2012-12-17 | 2013-12-10 | 熱伝導シート |
Country Status (5)
Country | Link |
---|---|
US (1) | US9488420B2 (ja) |
JP (1) | JP6421330B2 (ja) |
KR (1) | KR102073305B1 (ja) |
CN (1) | CN104271693B (ja) |
WO (1) | WO2014097575A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5887494B2 (ja) * | 2012-03-22 | 2016-03-16 | パナソニックIpマネジメント株式会社 | グラファイトシートの製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0736172U (ja) * | 1993-12-21 | 1995-07-04 | シーレックス株式会社 | シール用ファイル |
JP2002319653A (ja) * | 2001-04-20 | 2002-10-31 | Matsushita Electric Ind Co Ltd | グラファイトシートおよびそれを用いた放熱部品 |
JP2003347712A (ja) * | 2002-05-29 | 2003-12-05 | Nippon Mektron Ltd | 可撓性回路基板およびその製造方法 |
JP2006186026A (ja) * | 2004-12-27 | 2006-07-13 | Nitto Denko Corp | 異物除去シート |
JP2007283509A (ja) * | 2006-04-12 | 2007-11-01 | Polymatech Co Ltd | 熱伝導性シート及び熱伝導性シート包装体 |
JP2008251746A (ja) * | 2007-03-29 | 2008-10-16 | Polymatech Co Ltd | 熱伝導性シート積層体 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4755249A (en) * | 1984-06-27 | 1988-07-05 | The Bergquist Company | Mounting base pad means for semiconductor devices and method of preparing same |
JP5154834B2 (ja) * | 2007-05-07 | 2013-02-27 | デクセリアルズ株式会社 | 異方導電性接着剤フィルム及び異方導電性接着剤フィルムの製造方法 |
JP5110113B2 (ja) | 2009-03-31 | 2012-12-26 | Dic株式会社 | 放熱シート用粘着テープ及び放熱シート |
-
2013
- 2013-12-10 CN CN201380023012.XA patent/CN104271693B/zh active Active
- 2013-12-10 JP JP2014552912A patent/JP6421330B2/ja active Active
- 2013-12-10 WO PCT/JP2013/007253 patent/WO2014097575A1/ja active Application Filing
- 2013-12-10 KR KR1020147028578A patent/KR102073305B1/ko active IP Right Grant
- 2013-12-10 US US14/385,971 patent/US9488420B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0736172U (ja) * | 1993-12-21 | 1995-07-04 | シーレックス株式会社 | シール用ファイル |
JP2002319653A (ja) * | 2001-04-20 | 2002-10-31 | Matsushita Electric Ind Co Ltd | グラファイトシートおよびそれを用いた放熱部品 |
JP2003347712A (ja) * | 2002-05-29 | 2003-12-05 | Nippon Mektron Ltd | 可撓性回路基板およびその製造方法 |
JP2006186026A (ja) * | 2004-12-27 | 2006-07-13 | Nitto Denko Corp | 異物除去シート |
JP2007283509A (ja) * | 2006-04-12 | 2007-11-01 | Polymatech Co Ltd | 熱伝導性シート及び熱伝導性シート包装体 |
JP2008251746A (ja) * | 2007-03-29 | 2008-10-16 | Polymatech Co Ltd | 熱伝導性シート積層体 |
Also Published As
Publication number | Publication date |
---|---|
US9488420B2 (en) | 2016-11-08 |
JPWO2014097575A1 (ja) | 2017-01-12 |
US20150086780A1 (en) | 2015-03-26 |
KR20150097382A (ko) | 2015-08-26 |
KR102073305B1 (ko) | 2020-02-04 |
CN104271693A (zh) | 2015-01-07 |
CN104271693B (zh) | 2017-03-08 |
JP6421330B2 (ja) | 2018-11-14 |
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