Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
  • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
  • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
  • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
  • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
  • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
  • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
  • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
  • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation

Definitions

• the present invention relates to a black photosensitive resin composition and a light shielding layer using the same.
• the deep photosensitive resin composition is an essential material for the production of display small and medium such as color filters, liquid crystal display materials, organic light emitting devices (ELs), and display panel materials.
• a color filter such as a color liquid crystal display requires a light shielding layer at a boundary portion between colored layers of red, green, and blue, in order to increase display contrast and color development effects.
• This light shielding layer is mainly formed from a dark photosensitive resin composition.
• One embodiment of the present invention is to provide a photosensitive resin composition capable of forming a fine pattern and excellent chemical resistance.
• Another embodiment of the present invention is to provide a light shielding layer manufactured using the above-mentioned photosensitive resin composition.
• One embodiment of the present invention (A) a colorant comprising a carbon block and silver halide;
• the colorant may include the carbon black and the silver halide in a weight ratio of 1: 1 to 1: 9.
• the colorant may include a first pigment dispersion comprising the carbon black, a first dispersant, and a first solvent; And a second pigment dispersion containing the silver halide, a second dispersant, and a second solvent.
• the colorant may be obtained as a pigment dispersion containing the carbon black, the silver halide, a dispersant, and a solvent.
• the binder resin may include a cardo binder resin, an acrylic binder resin, a polyimide binder resin, a polyurethane binder resin, or a combination thereof.
• the binder resin may include a cardo-based binder resin, and the weight average molecular weight of the cardo-based binder resin may be 1,000 to 50,000 g / mol.
• the deep photosensitive resin composition may include 1 to 50% by weight of the colorant (A); remind
• the (D) photopolymerization initiator may be added in an amount of 0.1 to 10 ⁇ and the remaining amount of the solvent (E).
• Another embodiment of the present invention provides a light shielding layer manufactured using the deep photosensitive resin composition.
• the light shielding layer may have an optical density of 0.5 or more at a thickness of a coating film of 1.0 /.
• a fine pattern may be formed, thereby realizing a light blocking layer having high resolution and excellent chemical resistance.
• FIG. 1 is an optical microscope photograph showing the size of the minimum pattern of the coating film according to Example 1.
• substituted means that at least one hydrogen atom is a halogen atom (F, CI, Br, I), a hydroxy group, a C1 to C20 alkoxy group, nitro group, cyano group, amine Groups, imino groups, azido groups, amidino groups, hydrazino groups, hydrazono groups, carbonyl groups, carbamyl groups, thiol groups, ester groups, ether groups, carboxyl groups or salts thereof, sulfonic acid groups or salts thereof, phosphoric acid or Salts thereof, C1 to C20 alkyl groups, C2 to C20 alkenyl groups, C2 to C20 alkynyl groups, C6 to C30 aryl groups, C3- to C20 cycloalkyl groups, C3 to C20 cycloalkenyl groups, C3 to C20 C20 cycloalky Substituted with a substituent of a sily
• (meth) acrylate means that both “acrylate” and “methacrylate” are possible.
• the black photosensitive resin composition includes (A) a colorant, (B) a binder resin, (C) a semi-aromatic unsaturated compound, (D) a photopolymerization initiator, and (E) a solvent.
• the colorant may comprise carbon black and silver halide.
• the carbon black and the silver halide may be used as a pigment.
• the coloring agent according to one embodiment may be used by mixing the carbon black and the silver halide. When used in this manner, it is possible to obtain a shading layer having a fine pattern and having excellent chemical resistance.
• the carbon black is not particularly limited, and examples thereof include decalcified carbon, furnace black, acetylene black, Ketjen black, and the like.
• the silver halide may use silver fluoride, silver chloride, silver bromide, silver iodide, or a combination thereof.
• Pigments may be used in the dark photosensitive resin composition in the form of a pigment dispersion by mixing together a dispersant, a solvent and the like.
• the colorant may include a first pigment dispersion comprising the carbon black, the first dispersant, and the first solvent; And a second pigment dispersion comprising the silver halide, a second dispersant, and a second solvent.
• the colorant may be obtained as a pigment dispersion containing the carbon block, the silver halide, a dispersant and a solvent.
• the coloring agent in the form of the pigment dispersion liquid thus obtained can be used in the said black photosensitive resin composition.
• the first dispersant may help the carbon black to be uniformly dispersed in the first solvent
• the second dispersant may help the silver halide to be uniformly dispersed in the second solvent
• the dispersant to the carbon black And the silver halide may be uniformly dispersed in the solvent at the same time.
• Examples of the dispersant, the first dispersant and the second dispersant include nonionic compounds, anionic compounds, cationic compounds or combinations thereof, and specific examples thereof include polyalkylene glycols and esters thereof and polyoxyalkyls.
• Examples of commercially available products of the dispersant, the first dispersant and the second dispersant include BYK's DISPERBYK-lOl, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK—161, DISPERBYK-162, DISPERBYK '163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, and the like; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc.
• the dispersant, the crab 1 dispersant, and the second dispersant may be included in an amount of 0.1 to 15 wt% based on the total amount of the photosensitive resin composition.
• the light shielding layer having excellent stability, developability and patternability may be manufactured according to excellent dispersibility of the deep photosensitive resin composition.
• the said solvent, the said 1st solvent, and the said 2nd solvent are the same as the kind of solvent (E) mentioned later.
• the colorant may include the carbon black and the silver halide in an increase ratio of 1: 1 to 1: 9, and specifically, may include a weight ratio of 1: 5 to 1: 8.
• the weight ratio is based on the solids content of each of the carbon black and the silver halide present in each pigment dispersion. When included in the weight ratio range, it is possible to form a fine pattern and to easily obtain a light shielding layer having excellent chemical resistance.
• the colorant may be included in an amount of 1 to 50% by weight, and specifically 10 to 40% by weight, based on the total amount of the photosensitive resin composition.
• the light shielding layer has excellent insulation properties, high optical density, and excellent developability and processability.
• the binder resin may be a cardo binder resin, an acrylic binder resin, a polyimide binder resin, a polyurethane binder resin, or a combination thereof.
• the weight average molecular weight of the binder resin may be 1,000 to 150,000 g / mol.
• the cardo-based binder resin may be preferably used. Can be. When the cardo-based binder resin is used, heat resistance and chemical resistance of the deep photosensitive resin composition may be improved.
• the increase average molecular weight of the cardo-based binder resin may be 1,000 to 50, 000 g / mol, specifically, 3,000 to 35,000 g / mol.
• excellent patternability and developability may be obtained when manufacturing the light shielding layer.
• the cardo-based binder resin may be a compound including a repeating unit represented by Formula 1 below. .
• R 24 to 7 are the same as or different from each other, and are a hydrogen atom, a halogen atom, or a substituted or unsubstituted C1 to C20 alkyl group,
• R 8 and 9 are the same as or different from each other and are a hydrogen atom or CH 2 0R a (R a is a vinyl group, an acrylate group or a methacrylate group),
• Z 2 is an acid anhydride residue or an acid dianhydride residue.
• the cardo-based binder resin may be obtained by reacting a compound represented by the following Chemical Formula 13 with tetracarboxylic dianhydride.
• the tetracarboxylic dianhydride may be an aromatic tetracarboxylic dianhydride.
• aromatic tetracarboxylic dianhydride examples include pyrodelic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3', 4-biphenyltetracarboxylic dianhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 3,3', 4,4'4 benzophenonetetracarboxylic dianhydride, 3,3 ', 4,4'-biphenylethertetra Carboxylic acid dianhydride, 3,3 ', 4,4'-diphenylsulfontetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic acid dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid 2 Anhydr
• the acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.
• the first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof may include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.
• the first ethylenically unsaturated monomer may be included in an amount of 5 to 50% by weight, and specifically 10 to 40% by weight, based on the total amount of the acrylic binder resin.
• the second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene, ⁇ -methylstyrene, vinylluene, vinylbenzylmethyl ether, etc .; Methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxy butyl (meth) acrylate, benzyl (meth) acrylate Unsaturated carboxylic acid ester compounds such as cyclonuclear chamber (meth) acrylate phenyl (meth) acrylate; Unsaturated amino carboxylic acid amino alkyl ester compound of 2-aminoethyl (meth) acrylate 2-dimethylaminoethyl (meth) acrylate; Carboxylic acid vinyl ester compounds, such as vinyl acetate and a vinyl benzoate; Unsaturated carboxylic acid vinyl
• acrylic binder resin examples include methacrylic acid / benzyl methacrylate copolymer, methacrylic acid / benzyl methacrylate / styrene copolymer, methacrylic acid / benzyl methacrylate / 2 'hydroxy Ethyl methacrylate copolymer, methacrylic acid / benzyl methacrylate / styrene / 2 'hydroxyethyl methacrylate copolymer, etc., but are not limited to these, these alone or in combination of two or more It can also be used.
• the weight average molecular weight of the acrylic binder resin may be 3,000 to 150,000 g / mol, specifically 5,000 to 50,000 g / mol, and more specifically 2,000 to 30,000 g / mol.
• the weight average molecular weight of the acrylic binder resin is within the above range, the physical and chemical properties of the deep photosensitive resin composition are excellent, the viscosity is appropriate, and the adhesion to the substrate is excellent when manufacturing the light shielding layer.
• Acid value of the acrylic binder resin may be 15 to 60 mgKOH / g, specific Preferably from 20 to 50 mgKOH / g. When the acid value of the acrylic binder resin is within the above range, the resolution of the pixel pattern is excellent.
• the binder resin may be 0.5 to 0.5 based on the total amount of the photosensitive resin composition.
• the binder resin may be included in 20% by weight, specifically, may be included in 1 to 10% by weight.
• the viscosity is properly maintained to excellent in patternability, processability and developability in manufacturing the light shielding layer.
• a monomer or oligomer generally used in the photosensitive resin composition a monofunctional or polyfunctional ester of (meth) acrylic acid having at least one ethylenically unsaturated double bond may be used.
• the reactive unsaturated compound examples include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1, Dioxaic Diacrerate, 1,6-dinucleic acid dimethacrylate, pentaerythritol triacrylate, pentaerythrol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol The tree may be nucleated acrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethyl propane triacrylate, or trisacryloyl oxyethyl phosphate.
• Examples of commercially available products of the reactive unsaturated compounds are as follows.
• Examples of the functional ester of the (meth) acrylic acid include Toagosei Kagaku Kogyo Co., Ltd.
• Examples of the difunctional ester of the (meth) acrylic acid include Toagosei Chemical Co., Ltd.
• Examples of the trifunctional ester of (meth) acrylic acid include Aronix M-309, Copper M-400, and Copper manufactured by Toagosei Kagaku Kogyo Co., Ltd.
• KAYARAD TMPTA Copper DPCA-20, Copper 30, Copper -60, Copper -120 and the like; Osaka Yuki Gaya And C-2, V-295, Dong-300, Dong-360, Dong-GPT, Dong-3PA, and Dongguan 400.
• the above products can be used alone or in combination of two or more.
• the semi-aromatic unsaturated compound is based on the total amount of the photosensitive resin composition.
• the reactive unsaturated compound may be included in 1 to 20% by weight, specifically, it may be included in 1 to 15% by weight.
• compatibility with the binder resin is improved, the patternability and sensitivity in the presence of oxygen in manufacturing the light shielding layer is excellent, and a smooth surface film can be obtained.
• the photopolymerization initiator is a photopolymerization initiator generally used in the photosensitive resin composition.
• an acetophenone compound, a benzophenone compound, a thioxanthone compound, a benzoin compound, a triazine compound, or the like may be used. Can be.
• acetophenone-based compound examples include 2, 2'-diethoxy acetophenone, 2, 2'-dibutoxy acetophenone, 2—hydroxy-2-methylpropiophenone, and p't- Butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2'methyl-1 '(4' (methylthio) phenyl)- 2—morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- (4—morpholinophenyl) -butan-1-one, and the like.
• benzophenone-based compound examples include benzophenone, benzoyl benzoic acid, benzoyl benzoic acid methyl, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, and 4,4'-bis (dimethylamino) benzophenone. , 4,4'-bis (diethylamino) benzophenone, 4,4'- dimethylaminobenzophenone, 4, 4 ' ⁇ dichloro benzophenone, 3, 3'- dimethyl' 2-methoxy benzophenone, etc. Can be mentioned.
• thioxanthone compound examples include thioxanthone, 2-chloro thioxanthone, 2-methyl thioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2, 4-diisopropyl thioxanthone, 2-chloro thioxanthone, etc. are mentioned.
• benzoin-based compound examples include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal and the like.
• triazine-based compound examples include 2,4, 6-trichloro—s-triazine and 2-phenyl
• the photopolymerization initiator may be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, a biimidazole compound, or the like.
• the photopolymerization initiator may be used together with a photosensitizer that causes a chemical reaction by absorbing light and transferring energy after being excited.
• the photopolymerization initiator may be included in an amount of 0.1 to 10 weight 3 ⁇ 4, and specifically 0.5 to 3 weight%, based on the total amount of the photosensitive resin composition.
• the photopolymerization initiator is included in the above range, the sensitivity of the radical is good, the color concentration of the dark photosensitive resin composition solution is properly maintained, and the decrease in the transmittance due to the unreacted initiator can be prevented.
• the solvent may be a material having compatibility with the colorant, the binder resin, the reactive unsaturated compound, and the photopolymerization initiator but not reacting.
• the solvent examples include alcohols such as methanol and ethanol; Ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether and tetrahydrofuran; Glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; Methyl cellosolve acetate, ethyl cellosolve.
• alcohols such as methanol and ethanol
• Ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether and tetrahydrofuran
• Glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether
• Cellosolve acetates such as acetate and diethyl cellosolve acetate; Carbyl such as methyl ethyl carbye, diethyl carbye, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, diethylene glycol diethyl ether Tols; Propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; Aromatic hydrocarbons such as tluene chexylene; Ketones such as methyl ethyl ketone, cyclonucleus stanone, 4-hydroxy-4'methyl-2-pentanone, methyl'n-propyl ketone, methyl -n-butylkenone, methyl -n-amyl ketone, and 2'heptanone; Satur
• glycol ethers such as ethylene glycol monoethyl ether; Ethylene glycol alkyl ether acetates such as ethyl salosolve acetate; Esters such as 2-hydroxyethyl propionate; Diethylene glycols of diethylene glycol monomethyl ethers; Propylene glycol alkylether acetates such as propylene glycol monomethylether acetate and propylene glycol propylether acetate can be used.
• the solvent may be included in the remainder relative to the total amount of the photosensitive resin composition, and specifically, may be included in 50 to 70% by weight.
• the solvent is included in the above range, as the black photosensitive resin composition has an appropriate viscosity, processability in manufacturing a light shielding layer is excellent.
• the dark photosensitive resin composition may further include a silane coupling agent having a semi-aromatic substituent of a carboxyl group, methacryloyl group, isocyanate group, and epoxy column in order to improve adhesion to the substrate.
• a silane coupling agent having a semi-aromatic substituent of a carboxyl group, methacryloyl group, isocyanate group, and epoxy column in order to improve adhesion to the substrate.
• the silane coupling agent include trimethoxysilyl benzoic acid, methacryloxypropyl trimethoxysilane, vinyl triaceoxysilane, vinyl trimethoxysilane, and Y-isocyanate propyl trie Silane, glycidoxy propyl trimethoxysilane, ⁇ - (3,4-epoxycyclonuclear) ethyltrimethoxysilane, and the like. These may be used alone or in combination of two or more thereof.
• the silane coupling agent may be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the binder resin.
• the black photosensitive resin composition may further include a surfactant for the purpose of improving coating properties and preventing defects from occurring, if necessary.
• Examples of the surfactant include BM-1000, BM-1100, etc. manufactured by BM Chemie; Dynet
• a commercially available bloso-based surfactant can be used under the name SF-8428.
• the surfactant may be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the binder resin.
• the surfactant is included in the above range, coating uniformity is secured, no agglomeration occurs, and wetting is excellent on the glass substrate.
• the deep photosensitive resin composition may be added with a certain amount of other additives such as an oxidation inhibitor stabilizer within a range that does not impair physical properties.
• Another embodiment provides a light shielding layer prepared using the above-mentioned deep photosensitive resin composition.
• the manufacturing method of the said light shielding layer is as follows.
• the desired thickness for example, 0.9 to 4.0, using the spin or slit coating method, the coating method, the screen printing method, or the applicator method on the substrate to which the above-mentioned dark photosensitive resin composition is subjected to a predetermined pretreatment.
• the coating film is formed by heating at a temperature of 70 to 90 ° C for 1 to 10 minutes to remove the solvent.
• the coating film has a value of 0.5 or more at a thickness of 1.0, and the greater the optical density, there is no fear of light leaking out from the bottom.
• Low-pressure mercury lamps high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, argon gas lasers, and the like may be used as light sources used for irradiation, and X-rays and electron beams may be used in some cases.
• the exposure amount varies depending on the kind, the blending amount and the dry film thickness of each component of the dark photosensitive resin composition, but is, for example, 500 mJ / cm 2 or less (by a 365 nm sensor) when using a high pressure mercury lamp.
• an alkaline aqueous solution is used as a developing solution to dissolve and remove unnecessary portions, leaving only the exposed portions to form an image pattern.
• the image pattern obtained by the above phenomenon is heated or cured by performing active ray irradiation or the like. Can be.
• the high optical density and the high resolution pattern of 6 or less required for a light shielding layer can be obtained.
• Black photosensitive resin compositions according to 1 to 4, Comparative Examples 1 to 4, and Reference Example 1 were prepared.
• a pigment dispersion (C1 'M-050, Sakata Co., Ltd.) containing carbon black was used. At this time, the solid content of the carbon black present in the pigment dispersion is 18% by weight.
• silane coupling agent glycidoxy propyl trimethoxysilane (S-510 manufactured by Chisso) was used.
• the numerical values in parentheses in the contents of (A-1) and (A-2) are the contents of the solid dispersion present in the pigment dispersion composition of (A-1) and the pigment dispersion composition of (A-2), respectively.
• Each of the coating films was irradiated with 40 mJ / cm 2 of light having a wavelength of 365 nm using a pattern mask.
• the exposure machine used was an Ushio exposure machine, and the print gap was maintained at 250.
• the solution was developed at 23 ° C. for 1 minute in an aqueous solution diluted with 1 wt 3 ⁇ 4> potassium hydroxide, and then washed with pure water for 1 minute.
• the pattern obtained in this manner was cured by heating in an oven at 220 ° C. for 30 minutes, and then the shape of the pattern was visually observed using an optical microscope.
• the line width of the minimum pattern among the patterns thus obtained was measured, and the results are shown in Table 2 below.
• optical micrographs of the patterns obtained in Example 1 and Comparative Example 1 are shown in FIGS. 1 and 2.
• Figure 1 is an optical microscope photograph showing the size of the minimum pattern of the coating film according to Example 1
• Figure 2 is an optical showing the size of the minimum pattern of the coating film according to Comparative Example 1 Photomicrograph. 1 and 2, in the case of the coating film of Example 1, it can be seen that the size of the micropattern that can be at least realized is smaller than that of the coating film of Comparative Example 1.
• the present invention is not limited to the above embodiments, but may be manufactured in various forms, and a person skilled in the art to which the present invention pertains does not change the technical spirit or essential features of the present invention. It can be understood that this can be implemented. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

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