WO2014080935A1 - エッチング方法、マスク、機能部品、及び機能部品の製造方法 - Google Patents
エッチング方法、マスク、機能部品、及び機能部品の製造方法 Download PDFInfo
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- WO2014080935A1 WO2014080935A1 PCT/JP2013/081267 JP2013081267W WO2014080935A1 WO 2014080935 A1 WO2014080935 A1 WO 2014080935A1 JP 2013081267 W JP2013081267 W JP 2013081267W WO 2014080935 A1 WO2014080935 A1 WO 2014080935A1
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- glass substrate
- film
- mask
- etching
- chromium
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0042—Controlling partial pressure or flow rate of reactive or inert gases with feedback of measurements
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
- C03C2218/33—Partly or completely removing a coating by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/355—Temporary coating
Definitions
- the present invention relates to an etching method, a mask, a functional component, and a method for manufacturing the functional component, and a method for forming a fine uneven pattern or a through hole on a glass substrate by etching, an etching mask used for the method, and a MEMS using the method
- the present invention relates to a technique suitable for use in the manufacture of functional parts such as mask blanks and biochips or intermediates.
- a biochip in which a biomolecule such as DNA or protein or a cell having the biomolecule is fixed in the thickness direction of the glass substrate, or a semiconductor chip in a semiconductor device manufacturing process
- an interposer between the semiconductor chip and the mounting substrate (see, for example, Patent Document 2).
- the interposer is provided with a through hole penetrating in the thickness direction, and a via contact is formed by filling the through hole with a metal material or forming a metal film on the inner surface of the through hole.
- the semiconductor chip and the mounting substrate are electrically connected through the via contact.
- the above conventional example discloses that a glass substrate is used as a substrate constituting the interposer.
- the glass substrate is preferably used for a specific application or for miniaturization of devices.
- a method for forming a through hole in a glass substrate the following is known.
- a tapered pattern is formed by forming a resist pattern on one surface of a glass substrate, forming a protective film on the other surface of the glass substrate, and wet-etching the glass substrate from one surface through the resist pattern.
- a tapered hole that tapers from one surface of the glass substrate to a substantially intermediate position similarly, a tapered hole that tapers from the other surface of the glass substrate to a substantially intermediate position. Form. In this way, the holes formed from both surfaces of the glass substrate communicate with each other to form a through hole.
- Chromium (Cr) is used as a metal mask material in wet etching with a hydrofluoric acid-based etchant on a glass substrate.
- Patent Document 3 Chromium (Cr) is used as a metal mask material in wet etching with a hydrofluoric acid-based etchant on a glass substrate.
- the chromium film when a chromium film is used in wet etching with a hydrofluoric acid-based etchant for a glass substrate, the chromium film can sufficiently withstand the etchant in a short time etching such as a shallow groove, but a deep groove, a through hole, etc.
- a short time etching such as a shallow groove, but a deep groove, a through hole, etc.
- the chromium film When etching is performed for a long time when forming the film, the chromium film is corroded by the hydrofluoric acid-based etchant and the resistance is deteriorated to cause pinholes. In the worst case, the chromium film is completely dissolved.
- minute pinholes in the chromium film cause defects on the glass substrate surface, damage to the chromium film due to corrosion becomes a cause of defects due to pinholes even when etching is performed for a short time.
- the present invention has been made in view of the above circumstances, has a simple structure, can improve the resistance to an etchant, can reduce the film thickness, and can improve the yield. It is possible to provide a mask capable of processing that can maintain in-plane uniformity, a glass substrate etching method that can be processed for a long time and can improve yield, mask, functional components, And a method of manufacturing a functional component.
- a mask having a film containing at least chromium and nitrogen is formed on a glass substrate, and etching is performed using a hydrofluoric acid etchant.
- the mask may contain chromium as a main component, and the mask may contain 15 atom% or more and less than 39 atom% nitrogen.
- the film may have a broad halo pattern by X-ray diffraction and may not have a diffraction peak.
- the depth of the recess formed in the glass substrate by the etching may be set to 10 to 500 ⁇ m.
- the average thickness of the mask may be 5 to 500 nm.
- the mask which concerns on the 2nd aspect of this invention is arrange
- the mask which concerns on the 2nd aspect of this invention contains chromium as a main component, and may contain 15 atom% or more and less than 39 atom% nitrogen.
- the functional component according to the third aspect of the present invention includes a glass substrate and a film formed on the glass substrate and containing at least chromium and nitrogen.
- the film contains chromium as a main component, and nitrogen of 15 atom% or more and less than 39 atom% May be included.
- a mask having a film containing at least chromium and nitrogen is formed on a glass substrate, and the surface of the glass substrate is etched using a hydrofluoric acid-based etchant.
- a hole or recess having a depth of ⁇ 500 ⁇ m is formed on the glass substrate.
- a mask having a film containing chromium as a main component and containing nitrogen of 15 atom% or more and less than 39 atom% may be formed on a glass substrate.
- the composition ratio of nitrogen contained in the chromium film is optimized by having the film containing nitrogen of 15 atom% or more and less than 39 atom%, so that the chromium film has a fluorine content. Resistance to acid-based etchants is improved, and it is possible to wet-etch glass with less pinholes without using noble metals such as gold. As a result, the chromium single layer mask containing nitrogen has sufficient etchant resistance at a film thickness that does not affect the supply of the etchant into the hole being processed, and is capable of processing even large glass substrates. In-plane uniformity can be maintained.
- the nitrogen content of the mask is outside the above range (15 atom% or more and less than 39 atom%), the resistance to the etchant deteriorates, and pinholes (pits) are generated as the processing time increases. Therefore, it is not preferable.
- a main structure of the etching mask (mask) is chromium, and a stacked structure including 15 atom% or more and less than 39 atom% of nitrogen can be formed.
- the mask may contain 15 atom% or more and less than 39 atom%. Further, the mask may contain 15 atom% or more and 37 atom% or less of nitrogen.
- the mask may have a plurality of layers including layers other than a film containing nitrogen of 15 atom% or more and less than 39 atom% whose main component is chromium.
- the mask may have a layer made of a different metal other than chromium or a material that becomes a resist. Further, the mask may have a plurality of layers made of a chromium film.
- the adhesion layer, the main layer, and the antireflection layer made of a chromium film may be used, and the main layer may be a film containing the above-mentioned main component of chromium and containing nitrogen at 15 atom% or more and less than 39 atom%.
- the etching method according to the first aspect of the present invention means in which the depth of the recess formed in the glass is set to 10 to 500 ⁇ m, or means in which the average thickness of the mask is 5 to 500 nm is employed. You can also. According to the etching method according to the first aspect of the present invention, it is possible to prevent the occurrence of pinholes even in the processing of a surface area condition or a processing depth condition in which in-plane uniformity or processing reliability cannot be guaranteed conventionally. The resistance to the etchant can be maintained until the end time of the processing to ensure the accuracy of the processing dimensions.
- the film of the mask can contain a small amount of carbon and a small amount of oxygen in addition to nitrogen. It is possible to add without.
- the mask has the above-described film having a film having a broad halo pattern by X-ray diffraction and having no sharp diffraction peak as a main component. Has etching resistance.
- the mask according to the second aspect of the present invention is a nitrogen that is disposed between the etchant and the glass substrate in etching using a hydrofluoric acid-based etchant, contains chromium as at least a main component, and is 15 atom% or more and less than 39 atom%. It is possible to have a film comprising
- the functional component according to the third aspect of the present invention is necessary by including a glass substrate and a film formed on the glass substrate, containing chromium as at least a main component, and containing nitrogen of 15 atom% or more and less than 39 atom%.
- a mask having a film containing at least chromium as a main component and nitrogen of 15 atom% or more and less than 39 atom% is formed on a glass substrate.
- Etching is performed on the surface using a hydrofluoric acid-based etchant to form holes or recesses having a depth of 10 to 500 ⁇ m, thereby making it possible to prevent the accuracy of processing dimensions and the generation of pinholes.
- the composition ratio of nitrogen contained in the chromium film is optimized to improve the resistance of the chromium film to the hydrofluoric acid-based etchant, and even without using noble metals such as gold, It is possible to achieve an effect that it is possible to wet-etch glass with less generation.
- FIGS. 1A to 1F are cross-sectional process diagrams showing an etching method in the present embodiment, in which the reference numeral 10 denotes a glass substrate.
- the processed surface 10A of the glass substrate 10 on which the fine concavo-convex structure is formed is polished, and the polished glass substrate 10 is cleaned.
- the constituent material of the glass substrate 10 prepared in this pretreatment process is not particularly limited.
- alkali-free glass soda glass, crystalline glass (for example, neoceram), quartz glass, lead glass, potassium glass, borosilicate glass (Tempax float made by Schott) synthetic quartz glass, soda lime glass, aluminosilicate glass
- Various glasses may be mentioned, such as glass for low-temperature anodic bonding (SW series manufactured by Asahi Glass Co., Ltd.), white plate, and the like, and glass close to pure SiO 2 to glass containing many impurities (additives) other than SiO 2 .
- the processing surface 10A of the glass substrate 10 is polished using a polishing pad 50 and a polishing liquid containing cerium oxide as a main component.
- This polishing step can be performed from 0 times to any number of times.
- the glass substrate 10 after the polishing treatment is cleaned using a known cleaning method, and the polishing liquid and the like adhering to the substrate surface is removed.
- a method for cleaning the glass substrate 10 it is common to perform cleaning with pure water after cleaning with a detergent.
- a mask material film (mask) 11A to be the etching mask 11 is formed on the glass substrate 10.
- the laminated structure 30 is comprised by the glass substrate 10 and the mask material film
- the mask material film 11A has, as a main layer, a film containing nitrogen as a main component and containing 15 atom% or more and less than 39 atom% nitrogen.
- the average thickness of the chromium film of the mask material film 11A can be set to 5 to 500 nm, for example, 100 to 300 nm.
- a sputtering method As a film forming method of the chromium film as the mask material film 11A, it is preferable to use a sputtering method in consideration of mass productivity. In this case, it is preferable to use a mixed gas of argon gas, nitrogen gas, and carbon dioxide gas as the sputtering gas, and the flow rate ratio can be set so that desired stress and reflectance can be obtained. In particular, conditions such as a nitrogen gas flow rate are set so that the nitrogen concentration in the film falls within the above range (15 atom% or more and less than 39 atom%). Note that a device having a known structure can be used as the sputtering device. A detailed description of the film forming conditions and the apparatus configuration will be given later.
- a resist pattern 12 is formed on the mask material film 11A, and the mask material film 11A is partially removed through the resist pattern 12 as a mask to obtain the etching mask 11.
- a resist is applied to the mask material film 11A of the laminated structure 30, and this is exposed and developed to form a resist pattern 12 having an opening 12a as shown in FIG. 1C.
- the mask material film 11A is partially removed by wet etching using the resist pattern 12 as a mask, so that the opening 11a leading to the opening 12a of the resist pattern 12 becomes the mask material film 11A. To form. Thereby, the etching mask 11 having a plane pattern of a predetermined shape is obtained.
- a wet etching process using a hydrofluoric acid-based etchant is performed using the etching mask 11 and the resist pattern 12 formed on the glass substrate 10 as a mask.
- a hydrofluoric acid-based etchant for example, an etchant containing hydrofluoric acid (hydrofluoric acid-based etchant) can be used.
- the etching solution containing hydrofluoric acid is not particularly limited, but the concentration of hydrofluoric acid can be increased when the target processing speed is high, and the concentration of hydrofluoric acid can be decreased when the processing speed is low.
- etching of the glass substrate 10 isotropically proceeds from the opening 11a of the etching mask 11 continuous with the opening 12a of the resist pattern 12, and corresponds to the opening 11a as shown in FIG. 1E.
- a recess 10b having a semicircular cross section is formed at the position.
- a hydrofluoric acid-based etchant is used for etching the glass substrate 10.
- hydrofluoric acid-based etchant hydrofluoric acid, a mixed solution of hydrofluoric acid and an inorganic acid, or BFH in which ammonium fluoride is added to hydrofluoric acid can be used.
- the concave portion 10b constituting the fine concavo-convex structure is formed on the first surface.
- a formed glass substrate can be obtained.
- This glass substrate can also be used as a specific functional component (for example, MEMS, DNA chip, etc.).
- the film composition of the mask material film 11A is adjusted so that the main component is chromium and contains nitrogen of 15 atom% or more and less than 39 atom%.
- the etchant resistance of the mask material film 11A since it is necessary to contain nitrogen in the mask material film 11A, it is preferable to form the film by a reactive sputtering method.
- a target having a predetermined composition chromium
- nitrogen may be added to an inert gas such as argon as a sputtering gas.
- a gas containing oxygen such as various nitrogen oxides and various carbon oxides, nitrogen, carbon, or the like can be appropriately added.
- the nitrogen concentration of the mask material film 11A is adjusted by controlling the sputtering gas ratio and the sputtering power.
- the mask material film 11A is a film that shows a broad halo pattern by X-ray diffraction and does not have a diffraction peak.
- chromium By adding nitrogen to chromium, it is possible to generally improve the hydrofluoric acid resistance.
- a state in which a broad halo pattern is exhibited by X-ray diffraction and a diffraction peak is not present (amorphous state) can be obtained.
- the crystal grain boundary can be eliminated, liquid penetration from the crystal grain boundary is eliminated, and the hydrofluoric acid resistance can be further improved.
- An amorphous chromium film containing nitrogen exhibits the above performance and has a sufficient hydrofluoric acid resistance effect even if it contains a small amount of carbon and oxygen.
- the glass substrate 10 on which the fine concavo-convex structure (recessed portion 10b) is formed on the processing surface 10A by the wet etching process, and the wet etching processing etching are arranged on the processing surface 10A of the glass substrate 10 in a stacked manner.
- the mask material film 11A is composed of a chromium single layer film to which nitrogen is added.
- the desired recess 10b can be formed without causing a defect such as a chip at the edge of the recess 10b formed on the processing surface 10A of the glass substrate 10. That is, the structure can be simplified because it can be realized only by forming the mask material film 11A (etching mask 11) of the nitrogen-containing chromium single layer film on the glass substrate 10. Moreover, since the recessed part 10b can be reliably formed in the to-be-processed surface 10A of the glass substrate 10, a yield can be improved.
- the mask material film 11A (etching mask 11) is made of a nitride film containing chromium as a main component.
- the adhesion to the glass substrate 10 can be enhanced by using the mask material film 11A as a main component of chromium.
- the nitride film as the mask material film 11A the etchant resistance can be improved, and the opening 11a corresponding to the recess 10b can be easily formed. Therefore, the concave portion 10b can be reliably formed on the processing surface 10A of the glass substrate 10 without forming a defect due to the pinhole, and the yield can be improved.
- wet etching was performed with the resist pattern 12 formed on the etching mask 11 remaining.
- the resist pattern 12 prevents the occurrence of a defect in the recess 10b of the glass substrate 10 due to the defect. be able to.
- the mask material film 11A is a nitrogen-containing chromium single-layer film.
- an oxide film, a nitride film or a carbonized film containing chromium as a main component, or a composite compound thereof is further formed on the surface of the chromium single-layer film.
- an oxide film, a nitride film, or an oxynitride film mainly composed of a metal or alloy such as Ni, Mo, Ti, Al, Cu, Au, or Pt may be laminated. it can.
- an oxide film can be stacked in order to make the reflectance within a desired range.
- the addition of nitrogen gas is effective in improving the resistance of the chromium film to the hydrofluoric acid-based etchant, and the composition ratio of nitrogen contained in the chromium film was optimized. This enables wet etching of glass with few pinholes without using noble metals such as gold. As an object to be processed, it is possible to adapt even a substrate having a non-flat surface shape such as a substrate.
- FIGS. 2A to 2C are cross-sectional process diagrams illustrating an etching method according to the present embodiment, in which reference numeral 10 denotes a glass substrate.
- the etching method of the present embodiment when one surface of the glass substrate is an upper surface, a metal mask is formed on the upper surface, and the glass substrate is wet-etched from the upper surface through the metal mask to form a through hole.
- the etching method according to the present embodiment includes a pretreatment process, a mask material film forming process, an etching mask forming process, a glass etching process, and a removing process.
- the chromium films (mask material films) 11 and 13 containing nitrogen in the same range as in the first embodiment are formed to have an upper surface 10A and a lower surface of the glass substrate 10 with a thickness of, for example, 100 to 300 nm. 10B is formed (mask material film forming step).
- the material of the glass substrate 10 include the same materials as those in the first embodiment.
- the film formation rate of the chromium film 13 by the sputtering method is not so high, and increasing the thickness of the chromium film 13 decreases the productivity. Considering this, the thickness of the chromium film 13 is set within the above range.
- a resist pattern 12 is formed on the surface of the chromium film 11 (mask material film forming step).
- the resist is applied by a spin coating method with a thickness of 1 to 3 ⁇ m, for example.
- the applied resist is exposed to a pattern for forming a through hole, and developed with a developer to form a resist pattern 12.
- the chromium film 11 is wet-etched through the resist pattern 12 and patterned to form the chromium mask 11 (etching mask forming step) as shown in FIG. 2A.
- an etchant for the chromium film 11 for example, an etchant containing cerium ammonium nitrate can be used, and an acid such as nitric acid or perchloric acid may be added.
- the glass substrate 10 is wet etched through the chrome mask 11 (glass etching step).
- a hydrofluoric acid-based etchant can be used as the etchant.
- a mixed solution of diluted hydrofluoric acid, buffered hydrofluoric acid (BHF), and inorganic acid can be used in accordance with the material of the glass substrate 10 and a desired etching rate.
- BHF buffered hydrofluoric acid
- inorganic acid can be used in accordance with the material of the glass substrate 10 and a desired etching rate.
- the through hole 10c having a depth of 100 ⁇ m is formed under the condition of a processing speed of 0.3 ⁇ m / min and a processing time of 5 hours.
- the through-hole 10c having a depth of 300 ⁇ m is formed under the condition of a processing speed of 1 ⁇ m / min and a processing time of 5 hours.
- the through hole 10c is formed, the chromium film 13 is exposed in the lower part.
- the through hole 10c has a tapered peripheral wall portion 10d that tapers from the upper surface 10A to the lower surface 10B of the glass substrate 1, and the line forming the peripheral wall portion 10d reaches the lower surface 10B without having an inflection point. . That is, it is possible to prevent the flange from being generated in the middle of the cross section of the through hole 10 of the glass substrate 1.
- the resist pattern 12 is peeled off, and the chrome mask 11 and the chrome film 13 are dissolved and removed in an etching solution (removal step). Thereby, the glass substrate 10 with the through-hole 10c can be manufactured.
- etching solution a known alkaline resist stripping solution can be used, and as the etching solution, the above cerium ammonium nitrate can be used.
- the etching of the glass substrate 10 proceeds and the chromium film 13 exposed at the bottom of the through hole 10c is the glass substrate.
- the etchant soaks into the gap, the glass substrate lower surface 10B is etched in the surface direction, and the collar portion is formed on the peripheral wall of the through hole 10.
- a protective member protecting film
- the protective member may be a film similar to the resist 12 or a resinous adhesive protective film.
- the same effect as that of the first embodiment can be obtained. Further, in the process of forming a deeper structure than the through-hole 10c, that is, in the process having a longer processing time, even higher etchant resistance is required. Even in this case, a good process is performed. It becomes possible.
- the metal films 11 and 13 may have a film having high adhesion to the glass substrate 10 or a laminated film in which at least two kinds of metal films are laminated as long as a nitrogen-containing chromium film having good etching resistance is included.
- a laminated film of one kind of film selected from a Cr film, a Si film, and a Ni film and an Au film, or a laminated film of a Cr film, a Ni film, and an Au film can be used.
- the glass substrate 10 with the through-hole 10c can naturally be used also for a biochip, an interposer, or other uses.
- FIG. 3 is a surface view showing a glass substrate in the present embodiment, and in the figure, reference numeral 10 denotes a glass substrate.
- the difference from the first and second embodiments is only the size of the glass substrate 10 and the location of the recess 10b to be formed, and the other components corresponding thereto are denoted by the same reference numerals. The description is omitted.
- the glass substrate 10 has a surface size of 1500 cm 2 or more, for example, a dimension of 370 mm ⁇ 470 mm, and a large number of recesses 12b having a depth of 50 ⁇ m and a diameter of 10 ⁇ m are provided on the surface 10A. Yes.
- the distance between adjacent recesses 10b is about 1 mm.
- the mask 11 of this embodiment is the same mask as the first and second embodiments described above.
- the variation in the depth is within 1%.
- the surface of the glass substrate when a large number of holes having a depth of about 50 to 500 times the mask thickness are formed in a glass substrate having a large area of about 500 to 5000 cm 2 in a long time etching, the surface of the glass substrate. It is possible to prevent variations in the depth and diameter of each hole from occurring in the inward direction.
- Borosilicate glass (Tempax: manufactured by Schott) was used as the glass substrate. After the glass substrate was washed with detergent and pure water, a chromium film was formed under the following conditions using a DC sputtering method.
- a positive photosensitive resist was applied to the formed chromium film with a thickness of 1 ⁇ m by a spin coater.
- the photosensitive resist was exposed and developed, and the chromium film was etched with a chromium etching solution containing cerium ammonium nitrate as a main component to obtain a glass etching mask pattern.
- the glass substrate was immersed in a glass etching solution containing hydrofluoric acid as a main component, and the surface was observed every hour, and the surface after being immersed for 5 hours was observed. The results are shown in Table 1 and Photo 1 in FIG.
- Borosilicate glass (Tempax: manufactured by Schott) was used as the glass substrate.
- a chromium film was formed under the following conditions using a DC sputtering method.
- Sputtering gas: Ar / N 2 71 (sccm) / 34 (sccm)
- a positive photosensitive resist was applied to the formed chromium film with a thickness of 1 ⁇ m by a spin coater.
- the photosensitive resist was exposed and developed, and the chromium film was etched with a chromium etching solution containing cerium ammonium nitrate as a main component to obtain a glass etching mask pattern.
- the substrate was immersed in a glass etching solution containing hydrofluoric acid as a main component, and the surface was observed every hour, and the surface after being immersed for 5 hours was observed. The results are shown in Table 1 and Photo 2 in FIG.
- Borosilicate glass (Tempax: manufactured by Schott) was used as the glass substrate.
- a chromium film was formed under the following conditions using a DC sputtering method.
- Sputtering gas: Ar / N 2 80 (sccm) / 0 (sccm)
- a positive photosensitive resist was applied to the formed chromium film with a thickness of 1 ⁇ m by a spin coater.
- the photosensitive resist was exposed and developed, and the chromium film was etched with a chromium etching solution containing cerium ammonium nitrate as a main component to obtain a glass etching mask pattern.
- the substrate was immersed in a glass etching solution containing hydrofluoric acid as a main component, and the surface was observed every hour, and the surface after being immersed for 5 hours was observed. The results are shown in Table 1 and Photo 3 in FIG.
- Borosilicate glass (Tempax: manufactured by Schott) was used as the glass substrate.
- a chromium film was formed under the following conditions using a DC sputtering method.
- Sputtering gas: Ar / N 2 61 (sccm) / 51 (sccm) CD power: 1.7 kW
- a positive photosensitive resist was applied to the formed chromium film with a thickness of 1 ⁇ m by a spin coater.
- the photosensitive resist was exposed and developed, and the chromium film was etched with a chromium etching solution containing cerium ammonium nitrate as a main component to obtain a glass etching mask pattern.
- the substrate was immersed in a glass etching solution containing hydrofluoric acid as a main component, and the surface was observed every hour, and the surface after being immersed for 5 hours was observed. The results are shown in Table 1 and Photo 4 in FIG.
- the sputtered film containing the main component of the present invention of chromium and containing nitrogen in the range of 15 atom% or more and less than 39 atom% has extremely high etchant resistance in the etching process on the glass substrate.
- the above results show that the ratio of O / C contained does not affect the etchant resistance of the chromium film.
- the peak of the (1,1,0) plane of Cr is observed below the lower limit of nitrogen (15 atom%) shown in Experimental Example 3, and the upper limit of nitrogen (39 atom%) shown in Experimental Example 4 shows CrN ( It can be seen that peaks with overlapping (1,1,0) and (0,1,1) planes are observed.
- the peak of the (1, 1, 0) plane of Cr and the peak of the (1, 1, 0) and (0, 1, 1) plane of CrN are shown below in Experimental Examples 1 to 4 as FIG. ing.
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Abstract
Description
本願は、2012年11月21日に日本に出願された特願2012-255742号に基づき優先権を主張し、その内容をここに援用する。
ガラス基板に微細な凹部を形成するために、ガラス基板上にマスクを形成してエッチングし、所望の凹部を形成する方法としては、特許文献1のように、ガラス基板上に、複数の膜でマスクを形成して、凹部をエッチングする方法が提案されている。
たとえば、ガラス基板の一方の面にレジストパターンを形成し、ガラス基板の他方の面に保護膜を形成し、レジストパターン越しにガラス基板をその一方の面からウェットエッチングすることによりテーパ状の貫通孔を形成する。あるいは、同様の方法を用いて、ガラス基板の一方の面から略中間位置まで先細りのテーパ状の孔を形成した後、同様にガラス基板の他方の面から略中間位置まで先細りのテーパ状の孔を形成する。このようにガラス基板の両面から形成された孔が連通して貫通孔が形成される。
本発明の第一態様に係るエッチング方法において、前記マスクは主成分としてクロムを含み、前記マスクは15atom%以上、39atom%未満の窒素を含んでいてもよい。
本発明の第一態様に係るエッチング方法において、前記膜は、X線回折にてブロードなハローパターンを示し、回折ピークを有さなくてもよい。
本発明の第一態様に係るエッチング方法において、前記エッチングによって前記ガラス基板に形成される凹部の深さは10~500μmに設定されてもよい。
本発明の第一態様に係るエッチング方法において、前記マスクの平均厚さは、5 ~ 500nmであってもよい。
本発明の第二態様に係るマスクは、フッ酸系エッチャントを用いたエッチングにおいて、前記エッチャントとガラス基板との間に配置され、少なくともクロム及び窒素を含む膜を有する。
本発明の第二態様に係るマスクは、主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含んでいてもよい。
本発明の第三態様に係る機能部品は、ガラス基板と、前記ガラス基板上に形成され、少なくともクロム及び窒素を含む膜と、を含む。
なお、量産性の観点で安定して本性能を発揮させるために、本発明の第三態様に係る機能部品において、前記膜は、主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含んでいてもよい。
本発明の第四態様に係る機能部品の製造方法は、少なくともクロム及び窒素を含む膜を有するマスクをガラス基板上に形成し、前記ガラス基板表面にフッ酸系エッチャントを用いてエッチングを施し、10~500μmの深さを有する孔または凹部を前記ガラス基板上に形成する。
本発明の第四態様に係る機能部品の製造方法において、主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含む膜を有するマスクをガラス基板上に形成してもよい。
本発明の第一態様に係るエッチング方法では、前記マスクが15atom%以上、39atom%未満の窒素を含むことができる。また、前記マスクが15atom%以上、37atom%以下の窒素を含むことができる。
本発明の第一態様に係るエッチング方法では、前記マスクが、上述した主成分がクロムで15atom%以上、39atom%未満の窒素を含む膜以外の層を含む複数の層を有することができる。この際、前記マスクは、クロム以外の異種金属やレジストとなる材料から構成される層を有することができる。
さらに前記マスクは、クロム膜から構成される複数の層を有することができる。この際、クロム膜から構成される密着層、主層、反射防止層により構成され、主層が上述した主成分がクロムで15atom%以上、39atom%未満の窒素を含む膜であってもよい。
なお、本発明の第一態様に係るエッチング方法において、マスクが有する膜は、窒素以外に、微量の炭素、微量の酸素も含有させることができ、耐フッ酸性においては微量であれば、大きな影響なく添加することが可能である。
本発明の第四態様に係る機能部品の製造方法は、少なくとも、主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含む膜を有するマスクをガラス基板上に形成し、前記ガラス基板表面にフッ酸系エッチャントを用いてエッチングを施し、10~500μmの深さを有する孔または凹部を形成することにより処理寸法の正確性とピンホールの発生を防止することが可能となる。
図1Aから図1Fは、本実施形態におけるエッチング方法を示す断面工程図であり、図において、符号10はガラス基板である。
この前処理工程において用意するガラス基板10の構成材料は、特に限定されない。例えば、無アルカリガラス、ソーダガラス、結晶性ガラス(例えば、ネオセラム等)、石英ガラス、鉛ガラス、カリウムガラス、ホウ珪酸ガラス(Schott製のテンパックスフロート)合成石英ガラス、ソーダライムガラス、アルミノシリケートガラス、低温陽極接合用ガラス(旭硝子株式会社製のSWシリーズ)、白板等、また純粋なSiO2に近いガラスからSiO2以外の不純物(添加物)を多く含むガラスまで、種々のガラスが挙げられる。
マスク材膜11Aは、主成分がクロムで、15atom%以上、39atom%未満の窒素を含む膜を主層として有する。マスク材膜11Aのクロム膜の平均厚さは、5 ~ 500nm、例えば100~300nmと設定することができる。
ここではまず、積層構造体30のマスク材膜11Aにレジストを塗布し、これを露光、現像処理することで、図1Cに示すように、開口部12aを有するレジストパターン12を形成する。次いで、図1Dに示すように、レジストパターン12をマスクとする湿式エッチング処理によりマスク材膜11Aを部分的に除去することで、レジストパターン12の開口部12aに通じる開口部11aをマスク材膜11Aに形成する。これにより、所定形状の平面パターンを有するエッチングマスク11を得る。
この湿式エッチング処理では、レジストパターン12の開口部12aに連続するエッチングマスク11の開口部11aから等方的にガラス基板10のエッチングを進行させ、図1Eに示すように、開口部11aに対応する位置に断面半円型の凹部10bを形成する。ガラス基板10のエッチング処理にはフッ酸系のエッチャントを用いるのが一般的である。フッ酸系のエッチャントとしては、フッ酸、フッ酸と無機酸の混合液、フッ酸にフッ化アンモニウムを加えたBFH、を用いることができる。
また、窒素含有雰囲気にてクロムをスパッタリングした場合、窒素含有量を制御することで、X線回折にてブロードなハローパターンを示し回折ピークを有さない状態(アモルファス状態)とさせることができる。この状態とさせることにより、結晶粒界を無くすことができるために、結晶粒界からの液のしみ込みがなくなり、耐フッ酸性能をより向上させることが可能となる。窒素を含有したアモルファス状態のクロム膜であれば、上記性能を発揮し、微量の炭素、酸素を含有しても十分な耐フッ酸性能の効果を有する。
このように、マスク材膜11Aを、クロムを主成分とすることで、ガラス基板10への密着性を高めることができる。また、マスク材膜11Aを窒化膜とすることでエッチャント耐性を向上し、凹部10bに対応する開口部11aを形成し易くすることができる。したがって、ガラス基板10の被加工面10Aにピンホールに起因する欠陥を形成することなく確実に凹部10bを形成することができ、歩留まりを向上することができる。
このように構成したため、エッチングマスク11にピンホールまたはピンホールになる異物などの欠陥があった場合にも、それらに起因するガラス基板10の凹部10bへの欠陥の発生をレジストパターン12により防止することができる。
図2Aから図2Cは、本実施形態におけるエッチング方法を示す断面工程図であり、図において、符号10はガラス基板である。
本実施形態におけるエッチング方法も、第1実施形態と同様に、前処理工程と、マスク材膜形成工程と、エッチングマスク形成工程と、ガラスエッチング工程と、除去工程と、を有している。
この場合、保護部材は、レジスト12と同様の膜や、樹脂製の粘着保護フィルムでもよい。
図3は、本実施形態におけるガラス基板を示す表面図であり、図において、符号10はガラス基板である。
本実施形態においては、ガラス基板10が、表面の大きさが1500cm2以上、例えば、370mm×470mmの寸法であり、この表面10Aに、深さ50μmで径寸法10μmの凹部12bが多数設けられている。隣り合う凹部10bどうしの距離は1mm程度である。
本実施形態のマスク11は上記の第1、第2実施形態と同様のマスクである。
本実施形態においては、エッチャントが侵入してその内部を処理することが必要な凹部10bの形成においても、マスク11の厚さ寸法を薄くすることで、その深さ寸法のバラツキを1%以内とすることが可能である。
特に、長時間のエッチングにおいて、500~5000cm2程度の大面積を有するガラス基板に、マスク厚さ寸法の50~500倍程度の深さ寸法を有する孔を多数形成する場合など、ガラス基板の面内方向で、各孔の深さ寸法、径寸法などのバラツキが出てしまうことを防止できる。
ガラス基板としては硼珪酸ガラス(テンパックス:Schott社製)を使用した。ガラス基板を洗剤、純水を用いて洗浄後、DCスパッタリング法を用いて次の条件でクロム膜を成膜した。
成膜されたクロム膜は膜厚が150.0nmでAESによる分析の結果、含まれるガス成分はO/C/N = 10atom%/6atom%/15atom%であった。
その結果を表1および図4の写真1に示す。
ガラス基板としては硼珪酸ガラス(テンパックス:Schott社製)を使用した。同様に、基板洗浄後、DCスパッタリング法を用いて次の条件でクロム膜を成膜した。
スパッタガス:Ar/N2 = 71(sccm)/34(sccm)CDパワー:1.6kW
成膜されたクロム膜は膜厚が150.0nmでAESによる分析の結果、含まれるガス成分はO/C/N = 8atom%/7atom%/37atom%であった。成膜されたクロム膜の上にポジ型感光性レジストを1μmの膜厚でスピンコーターで塗布した。次いで、感光性レジストを露光し、現像処理し、硝酸セリウムアンモニウムを主成分とするクロム用エッチング液でクロム膜をエッチングし、ガラスエッチング用マスクパターンを得た。前記基板をフッ酸を主成分とするガラスエッチング液に浸漬してその表面を1時間ごとに観察するとともに、5時間浸漬させた後の表面を観察した。
その結果を表1および図4の写真2に示す。
ガラス基板としては硼珪酸ガラス(テンパックス:Schott社製)を使用した。同様に、基板洗浄後、DCスパッタリング法を用いて次の条件でクロム膜を成膜した。
スパッタガス:Ar/N2 = 80(sccm)/0(sccm)CDパワー:1.6kW
成膜されたクロム膜は膜厚が150.0nmでAESによる分析の結果、含まれるガス成分はO/C/N = 20atom%/2atom%/2atom%であった。成膜されたクロム膜の上にポジ型感光性レジストを1μmの膜厚でスピンコーターで塗布した。次いで、感光性レジストを露光し、現像処理し、硝酸セリウムアンモニウムを主成分とするクロム用エッチング液でクロム膜をエッチングし、ガラスエッチング用マスクパターンを得た。前記基板をフッ酸を主成分とするガラスエッチング液に浸漬してその表面を1時間ごとに観察するとともに、5時間浸漬させた後の表面を観察した。
その結果を表1および図4の写真3に示す。
ガラス基板としては硼珪酸ガラス(テンパックス:Schott社製)を使用した。同様に、基板洗浄後、DCスパッタリング法を用いて次の条件でクロム膜を成膜した。
スパッタガス:Ar/N2 = 61(sccm)/51(sccm)CDパワー:1.7kW
成膜されたクロム膜は膜厚が150.0nmでAESによる分析の結果、含まれるガス成分はO/C/N = 8atom%/8atom%/39atom%であった。成膜されたクロム膜の上にポジ型感光性レジストを1μmの膜厚でスピンコーターで塗布した。次いで、感光性レジストを露光し、現像処理し、硝酸セリウムアンモニウムを主成分とするクロム用エッチング液でクロム膜をエッチングし、ガラスエッチング用マスクパターンを得た。前記基板をフッ酸を主成分とするガラスエッチング液に浸漬してその表面を1時間ごとに観察するとともに、5時間浸漬させた後の表面を観察した。
その結果を表1および図4の写真4に示す。
また、上記の結果から、O/Cの含まれる割合がクロム膜のエッチャント耐性に影響を与えないことがわかる。
特に、実験例3に示す窒素下限値(15atom%)未満では、Crの(1,1,0)面のピークが観測され、また、実験例4に示す窒素上限(39atom%)ではCrNの(1,1,0),(0,1,1)面が重なったピークが観測されていることがわかる。これらのCrの(1,1,0)面のピーク、および、CrNの(1,1,0),(0,1,1)面のピークを図6として実験例1~4の下に示している。
Claims (11)
- ガラス基板上に、少なくともクロム及び窒素を含む膜を有するマスクを形成し、
フッ酸系エッチャントを用いてエッチングを施すエッチング方法。 - 前記マスクは、主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含む請求項1に記載のエッチング方法。
- 前記膜は、X線回折にてブロードなハローパターンを示し、回折ピークを有さない請求項1又は2に記載のエッチング方法。
- 前記エッチングによって前記ガラス基板に形成される凹部の深さは10~500μmに設定される請求項1または2に記載のエッチング方法。
- 前記マスクの平均厚さは、5 ~ 500nmである請求項1から3のいずれか一項に記載のエッチング方法。
- フッ酸系エッチャントを用いたエッチングにおいて、前記エッチャントとガラス基板との間に配置され、少なくともクロム及び窒素を含む膜を有するマスク。
- 主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含む請求項6に記載のマスク。
- ガラス基板と、
前記ガラス基板上に形成され、少なくともクロム及び窒素を含む膜と、を含む機能部品。 - 前記膜は、主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含む請求項8に記載の機能部品。
- 少なくとも、クロム及び窒素を含む膜を有するマスクをガラス基板上に形成し、
前記ガラス基板表面にフッ酸系エッチャントを用いてエッチングを施し、
10~500μmの深さを有する孔または凹部を前記ガラス基板上に形成する機能部品の製造方法。 - 主成分としてクロムを含み、15atom%以上、39atom%未満の窒素を含む膜を有するマスクをガラス基板上に形成する、請求項10に記載の機能部品の製造方法。
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Also Published As
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JP5922254B2 (ja) | 2016-05-24 |
KR20150080586A (ko) | 2015-07-09 |
CN104755441A (zh) | 2015-07-01 |
JPWO2014080935A1 (ja) | 2017-01-05 |
CN104755441B (zh) | 2018-04-13 |
KR101679034B1 (ko) | 2016-11-24 |
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