WO2014069183A1 - Ｌｅｄランプ - Google Patents

Ｌｅｄランプ Download PDF

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Publication number
WO2014069183A1
WO2014069183A1 PCT/JP2013/077327 JP2013077327W WO2014069183A1 WO 2014069183 A1 WO2014069183 A1 WO 2014069183A1 JP 2013077327 W JP2013077327 W JP 2013077327W WO 2014069183 A1 WO2014069183 A1 WO 2014069183A1
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WO
WIPO (PCT)
Prior art keywords
light source
source support
led lamp
gas
led
Prior art date
Application number
PCT/JP2013/077327
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English (en)
French (fr)
Japanese (ja)
Inventor
将幸 松崎
孝佳 今成
守幸 関根
正宗 浪江
Original Assignee
岩崎電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 岩崎電気株式会社 filed Critical 岩崎電気株式会社
Priority to EP13850606.8A priority Critical patent/EP2937624B1/en
Publication of WO2014069183A1 publication Critical patent/WO2014069183A1/ja

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lamp.
  • LED lamp is a lamp using a light emitting diode element as a light source. LED lamps are capable of emitting white light due to the development of blue LED elements, and their use as illumination lamps has recently been expanding.
  • FIG. 1 is a diagram showing an example of an LED lamp that is currently widely sold. These LED lamps 100 are generally lamps having an output of 10 W or less (typically about 7 W). As shown in FIGS. 1A to 1C, although there are various lamp shapes, the lamp basically includes a base 102, a heat radiating portion 104, and a globe 106.
  • the heat dissipating part 104 is formed from aluminum die-casting, and in many cases, heat dissipating fins are formed on the outer peripheral surface.
  • the globe 106 is made of a translucent resin.
  • LED elements are semiconductor elements and do not need to be placed in a vacuum atmosphere or a predetermined gas atmosphere. Accordingly, the aluminum die cast part 104 and the globe 106 are fixed with an appropriate adhesive. For this reason, the internal space formed by the aluminum die cast part 104 and the globe 106 is not hermetically sealed with the outside of the lamp.
  • the present inventors are aware that the following prior patent documents related to the present invention exist.
  • the lamps disclosed in the above-mentioned prior patent documents 1 to 5 are different in the following points.
  • the LED lamp disclosed in the present application is hermetically sealed by covering an LED element with a glass sealed container, and a low molecular weight gas is sealed in the glass sealed container as cooling and heat dissipation means.
  • Patent Document 1 exemplifies resin and glass as a case member.
  • an internal light emitting diode is protected from the external environment, and further, a gas that does not have moisture in the glass container (nitrogen gas in the embodiment).
  • nitrogen gas in the embodiment a gas that does not have moisture in the glass container.
  • Disclosed is the effect that no moisture remains and the glass is not fogged when encapsulated.
  • a low molecular weight gas as a cooling / dissipating means.
  • the bulb for housing the LED lamp is formed of a resin material, and there is no description or suggestion regarding the hermetic sealing described in relation to the present invention.
  • the translucent cover is made of polycarbonate resin, and the heat radiating part is made of metal such as aluminum. This corresponds to the LED lamp illustrated in FIG. 1 and there is no description or suggestion regarding hermetic sealing.
  • Patent Document 4 states, “The lamp (100) according to the present invention is a lamp in which gas is sealed, and is disposed on the globe (10), the base (21), and the base (21). And the LED module (20) housed in the globe (10), wherein the gas in the lamp (100) contains any of hydrogen, helium and nitrogen, and the LED module (20 ) Is enclosed within the clove (10) so as to wrap it around.
  • Patent Document 4 does not describe a cooling gas flow path formed by the light source support disclosed in the present application, a cooling gas flow passing therethrough, a slit that is an inflow / outflow of the cooling gas flow, and the like.
  • Patent Document 5 is an application filed by the applicant of the present application, which is the basis of the present invention. Differences from the present invention will be described in detail below.
  • the LED element is a semiconductor element, and the temperature of the junction of the semiconductor and the element life are closely related. That is, when the temperature of the joint at the time of use is relatively low, the device lifetime becomes long, but as the temperature increases, the device lifetime decreases rapidly. Therefore, in the LED lamp, when the temperature of the LED element is high, the lamp life is shortened and the lamp illuminance is also deteriorated.
  • the cooling / heat dissipating means is an important matter in the LED lamp as well as the cooling / heat dissipating means.
  • a cooling gas low molecular weight gas
  • a light source support having a long shape in the lamp axis direction
  • a plurality of LEDs are mounted around the light source support.
  • a through-hole is formed in the light source support along the lamp axis to form a cooling gas flow path, and the LED is efficiently cooled from the back surface.
  • an object of the present invention is to provide an LED lamp provided with a novel cooling / dissipating means.
  • An LED lamp according to the present invention includes a plurality of LED elements, a light source support that supports the LED elements on a side surface, extends along a lamp axis, surrounds the light source support, and is hermetically sealed.
  • a glass sealed container enclosing a low molecular weight gas as a cooling gas, and the light source support surrounds the cooling gas flow path along the lamp axis, and gas inflow / outflow ports at both ends of the light source support In addition, gas inflow / outflow ports are provided between both ends.
  • the low molecular weight gas may include a mixed gas of any one of helium gas, hydrogen gas and neon gas, or any combination thereof.
  • the light source support is composed of a plurality of light source support pieces arranged so as to surround the cooling gas flow path, and the plurality of light source support pieces are perpendicular to the lamp axis.
  • the light source support is a single rod-shaped body extending along the lamp axis
  • the cooling gas flow path is a through-hole formed in the light source support along the lamp axis.
  • the gas inflow / outflow port formed in the hole and between the both ends of the light source support may be an opening from the side surface of the light source support to the through hole.
  • a mounting substrate on which the plurality of LEDs are mounted may be fixed to the light source support.
  • a mounting substrate on which the plurality of LEDs are mounted is fixed to the light source support, and the mounting substrate may be a metal core substrate.
  • the light source support may be made of a member having good thermal conductivity including at least aluminum, copper, or a heat conductive resin.
  • the light source support is composed of a plurality of light source support pieces arranged so as to surround the cooling gas flow path, and the plurality of light source support pieces are perpendicular to the lamp axis.
  • the light source support may have a shape in which both end portions are widened, and a cross-sectional area of the cooling gas flow path may be relatively narrow in a central portion as compared with both end portions. .
  • the light source support piece is formed to have a thicker central portion than the opposite ends, and the cross-sectional area of the cooling gas flow path is relative to the opposite ends. It may be narrow.
  • the LED lamp may further include a heat transfer unit made of a heat conductive resin fixed to the light source support inside the top portion of the glass sealed container that is opposite to the base. .
  • the LED lamp may further include an additional heat radiator that is in a heat conduction relationship with the glass sealed container sandwiched between the heat transfer device and outside the top portion of the glass sealed container.
  • the LED lamp may further include a gas flow acceleration fan in the vicinity of the upper end, the lower end, or both of the light source support.
  • nitrogen gas may be enclosed in the glass sealed container in addition to the low molecular weight gas.
  • FIG. 1 is a diagram showing an example of an LED lamp that is currently widely sold.
  • FIG. 2 is a diagram illustrating an example of an LED lamp according to the first embodiment of the present invention.
  • (A) is a front view of the LED lamp
  • (B) is a perspective view seen from obliquely below so that the positional relationship of the four light source supports can be understood.
  • FIG. 3A is a diagram illustrating a light source support used in the LED lamp shown in FIG.
  • FIG. 3B is a view for explaining a light source support according to the second embodiment of the present invention.
  • FIG. 4A is a diagram illustrating the flow of the cooling gas flow in the case where there is no slit between the light source supports proposed in Patent Document 5 described above.
  • FIG. 4B is a diagram illustrating the flow of the cooling gas flow when there is a slit between the light source supports according to the first embodiment shown in FIG. 2.
  • FIG. 5A is a graph comparing the LED cooling effect depending on the presence or absence of slits between the light source supports when the lamp is lit vertically (BDB).
  • FIG. 5B is a graph comparing LED element temperatures according to the presence or absence of slits between the light source supports when the lamp is lit horizontally (BH).
  • FIG. 6A is a graph comparing LED element temperatures for vertical lighting (BD) and horizontal lighting (BH) when there is a slit between light source supports.
  • FIG. BD vertical lighting
  • BH horizontal lighting
  • FIG. 6B is a graph comparing LED element temperatures for vertical lighting (BD) and horizontal lighting (BH) when there is no slit between the light source supports.
  • FIG. 7 is a graph comparing the LED element temperatures between horizontal lighting (BH) with slits between the light source supports and vertical lighting (BD) without slits.
  • FIG. 8A is a diagram illustrating an example in which openings are provided between both ends of a light source support according to a third embodiment of the present invention.
  • FIG. 8B is a diagram similarly showing an example in which the light source support is formed in a lattice shape or a mesh shape.
  • FIG. 9 is a flow of the LED lamp manufacturing method according to the present embodiment, and a simple lamp diagram at that stage is shown on the right side of each step.
  • FIG. 9 is a flow of the LED lamp manufacturing method according to the present embodiment, and a simple lamp diagram at that stage is shown on the right side of each step.
  • FIG. 10A is a view for explaining a light source support with an enlarged end according to a fourth embodiment of the present invention.
  • FIG. 10B is also a diagram for explaining a light source support having a thick intermediate portion.
  • FIG. 11 is a diagram for explaining a heat exchanger according to the fifth embodiment of the present invention and an additional heat radiator according to the sixth embodiment.
  • FIG. 12 is a diagram for explaining an example in which a cooling air drive fan is provided in the vicinity of the end of the light source support according to the seventh embodiment of the present invention.
  • FIG. 2 is a diagram illustrating an example of an LED lamp according to the first embodiment of the present invention.
  • (A) is a front view of the LED lamp
  • (B) is a perspective view seen from obliquely below so that the positional relationship of the four light source supports can be understood.
  • This LED lamp 10 is mainly intended for a high-power LED lamp of about 20 W instead of the low-power LED lamp of about 7 W currently widely advertised and sold as described in FIG. For this reason, cooling and heat dissipation means become a further important consideration.
  • a plurality of LED elements 18 are arranged inside an outer sphere 6 whose one end is hermetically sealed with a base 2.
  • the plurality of LED elements 18 are mounted and fixed on the light source support 14 at appropriate intervals.
  • the light source support 14 is positioned and supported at an appropriate position inside the outer sphere 6 by a support column 20 extending from a stem 8 fixed to one end of the outer sphere 6. If desired, an insulating tube (not shown) is placed on the portion of the column 20 adjacent to the light source support 14 to ensure electrical insulation between the light source support 14 and the column 20.
  • a heat shielding member 24 may be provided inside the outer sphere 6 near the base 2.
  • the heat shielding member 24 is formed of, for example, a ceramic, a metal plate, a mica plate, or the like. The function of the heat shielding member 24 will be described later in relation to the manufacturing method shown in FIG.
  • low molecular weight gas is a gas having a large specific heat and good thermal conductivity, and is typically helium gas.
  • neon gas, hydrogen gas, or a mixed gas thereof may be used.
  • hydrogen gas since hydrogen gas has high reactivity, it may be a mixed gas of hydrogen gas and helium gas that suppresses this.
  • hydrogen gas or helium gas please refer to the eighth embodiment described later.
  • the base 2 may be a screw-in type (E type) or an insertion type used in incandescent bulbs or HID lamps.
  • the outer sphere 6 is a BT tube made of translucent hard glass such as borosilicate glass, for example. However, it may be any shape.
  • the outer sphere 6 may be either a transparent type or a diffusion type (a type of frosted glass). Similar to known incandescent bulbs and HID lamps, the space between the base 2 and the outer sphere 6 is hermetically sealed, and the space between the outer space and the outer space is hermetically sealed.
  • the LED lamp 10 includes a light source support piece 14 composed of four light source support pieces 14-1 to 14-4, one or two for each light source support piece.
  • One or more LED elements 18 are mounted.
  • FIG. 3A is a diagram illustrating the light source support 14.
  • the outer shapes of the light source support pieces 14-1 to 14-4 are plate-like bodies made of a material having good heat conductivity, such as copper, aluminum, heat conductive resin, and the like.
  • the heat conductive resin is obtained by mixing a metal powder / metal piece into the resin to increase the heat conduction coefficient.
  • the four light source support pieces 14-1 to 14-4 are arranged so as to form a generally rectangular shape when viewed in the axial cross section. Further, the light source support pieces adjacent to each other are not connected and are arranged with a slit (gap) 26 therebetween.
  • the illustrated light source support 14 is arranged so as to form a rectangle when viewed in the cross section of the four light source support single-axis directions, but is not limited thereto. That is, three light source support pieces may be arranged to form a triangle, or any number (n) of light source support pieces may be arranged to form an arbitrary polygon (n square). May be. Power supply to each LED element 18 is performed by a lead wire (not shown) that connects the LED elements in series. When the light source support 14 is a good electrical conductor, the light source support may be used as a feeder line.
  • FIG. 3B is a diagram illustrating the light source support 14 according to the second embodiment.
  • the second embodiment is different in that the LED element 18 is mounted on the mounting substrate 16 and the mounting substrate 16 is fixed to the light source support 14.
  • a mounting substrate 16 is fixed to the outer peripheral side surface of the light source support 14.
  • a heat conductive sheet (not shown) may be interposed between the outer peripheral side surface of the light source support 14 and the mounting substrate 16.
  • the mounting substrate 16 is fixed to n outer peripheral side surfaces.
  • Each mounting substrate 16 has one or more LED elements 18 mounted thereon.
  • the mounting substrate 16 is made of a printed wiring board, and a necessary circuit pattern for supplying power to the LED element is formed.
  • the mounting substrate 16 has a relatively thin plate thickness or is formed as a metal core substrate (metal core substrate).
  • the metal core substrate is a known technique. Due to the good thermal conductivity of the metal, a high heat dissipation and cooling effect can be expected.
  • the adjacent light source support pieces are not connected but are arranged with a slit (gap) 26 therebetween. Furthermore, you may arrange
  • FIG. 4A is a diagram for explaining the flow of the cooling gas flow when such light source support pieces are connected to each other and there is no slit.
  • an axial gas passage 15 is formed by being surrounded by four light source support pieces 14-1 to 14-4.
  • the light source support 14 becomes high temperature due to the heat generated by the LED element 18, and the cooling gas in the gas flow path 15 heated by the high temperature light source support moves upward to become a warm gas flow 23-2 from the upper end of the gas flow path outside the lamp. Released into the sphere. On the other hand, a new gas flow 23-1 flows into the gas channel from the lower end of the gas channel. By such a chimney effect, the back surface of the light source support 14 is effectively cooled.
  • the LED element 18 is cooled by a cooling gas surrounding its surface. In addition to this, the back surface of the LED element 18 is effectively cooled by the light source support 14. Regarding this idea, it has been confirmed that there is a certain cooling effect, and is shown in a graph in FIG.
  • FIG. 4B is a diagram illustrating the flow of the cooling gas flow when there is a slit between the light source support pieces 14-1 to 14-4.
  • the high cooling effect seems to be due to an increase in the gas flow 23-3 flowing into or out of the gas flow path 15 from the slit in addition to the gas flows 23-1 and 23-2 shown in FIG. 4A.
  • FIG. 5A is a graph comparing the LED cooling effect according to the presence or absence of slits between the light source supports when the lamp is vertically lit (BD).
  • FIG. 5B is a graph comparing LED element temperatures according to the presence or absence of slits between the light source supports when the lamp is lit horizontally (BH).
  • FIG. 6A is a graph comparing LED cooling effects by vertical lighting (BD) and horizontal lighting (BH) when there is a slit.
  • FIG. 6B is a graph comparing LED cooling effects of vertical lighting (BD) and horizontal lighting (BH) when there is no slit.
  • the case temperature of the LSI element in horizontal lighting (BH) is 111.7 ° C. in terms of TC-25 ° C., but vertical.
  • the lighting (BD) is as low as 104.4 ° C.
  • the vertical lighting (BD) of the model IV has a lower temperature and the cooling effect is higher than the horizontal lighting (BH) of the model III.
  • the case temperature of the LSI element in horizontal lighting (BH) is 128.3 ° C. in terms of TC-25 ° C., whereas it is vertical.
  • the lighting (DH) is as low as 122.4 ° C.
  • the vertical lighting (BD) of the model II has a lower temperature and the cooling effect is higher than the horizontal lighting (BH) of the model IV.
  • FIG. 7 is a graph comparing the LED element temperatures of Model III (when horizontally lit (BH) with slits) and Model II (when vertically lit (BD) without slits).
  • the LED driving power is 30 W
  • the case temperature of the LSI element of model III is 122.4 ° C. in terms of TC-25 ° C., whereas it is as low as 111.7 ° C. in model II.
  • model II had a lower temperature and higher cooling effect than model III.
  • the relationship was model II ⁇ model III.
  • model (I, III) ⁇ model (II, IV) is obtained.
  • model (I, II) ⁇ model (III, IV) is obtained.
  • model II ⁇ model III is obtained. Accordingly, it has been found that the LSI element temperature increases in the following order. That is, it turned out that the LED element temperature is higher as it goes to the right and the temperature of the LED element 18 is kept lower as it goes to the left, and the cooling effect is high.
  • Model I (with slit, BD) ⁇ Model II (with slit, BH) ⁇ Model III (without slit, BD) ⁇ Model VI (without slit, BH)
  • the first factor contributing to cooling is “with slit”
  • the second factor is “vertical lighting (BD)”.
  • the lighting method related to the second factor is determined by the structure in which the lamp is installed, the lighting area, the lighting fixture, customer needs, and the like. Therefore, it is important that the light source support is “slit”.
  • FIG. 8A is a view showing an example in which openings are provided between both ends of a light source support according to a third embodiment of the present invention.
  • FIG. 8B is a diagram showing an example in which the light source support 14 is similarly formed in a lattice shape or a mesh shape.
  • the light source support 14 shown in FIG. 8A is not provided with a slit between them, and in addition to the cooling gas inflow / outflow ports at both ends, a plurality of openings 26a are provided between the both ends as cooling gas inflow / outflow ports. ing.
  • the size, shape, and number of openings 26a may be arbitrarily desired.
  • a slit may be provided between the light source support pieces, and a plurality of openings 26a may be provided between the both ends as cooling gas inflow / outflow ports.
  • the light source support 14 shown in FIG. 8B is formed in a lattice shape or a mesh shape, and includes a plurality of openings or meshes as cooling gas inflow / outflow ports between both ends in addition to the cooling gas inflow / outflow ports at both ends.
  • a hole 26b is provided.
  • the size, shape, and number of the openings or mesh holes 26a may be arbitrarily desired.
  • a slit may be provided between the light source support pieces, and a plurality of openings or mesh holes 26a may be provided as cooling gas inflow / outflow ports between both ends.
  • the light source support that forms the cooling gas flow path is not limited to one in which a plurality of light source support pieces are arranged in a rectangular or polygonal shape when viewed in cross section.
  • the cooling gas flow path may be formed substantially along the lamp axis. It may be a single light source support having a circular or elliptical cross section when viewed in cross section. If the cooling gas inflow / outflow port between the two end portions substantially has a function of allowing the cooling gas inside the outer tube and the cooling gas in the cooling gas flow path formed by the light source support to communicate with each other. Good.
  • the opening area between the two ends with respect to the total surface area of the preferred gas flow path (the total of the areas of slits, openings, mesh holes, etc.), that is, the preferred opening ratio, is left to future research and development.
  • FIG. 9 is a flow of the LED lamp manufacturing method according to the present embodiment, and a simple lamp diagram at that stage is shown on the right side of each step.
  • the LED element 18 is fixed to the light source support 14, the light source support is attached to the support column 20, the mount is formed, and the stem 8 is attached.
  • the mount is inserted into the outer sphere 6 and the stem 8 to which the mount is attached and the outer sphere 6 are heated and sealed with a burner to be hermetically sealed.
  • the vacuum is once exhausted from the sealed outer sphere through the exhaust pipe.
  • step S5 low molecular weight gas is sealed and the chip is turned off (the exhaust pipe is melted and sealed with a burner).
  • the top part and the side part of the base 2 are soldered in the base attaching step of step S4.
  • the LED lamp 10 is completed through the lighting test and inspection in step S5.
  • the outer sphere mounting portion, stem, etc. are heated to a high temperature close to 1000 ° C. by the burner.
  • the heat shielding member 24 (see FIGS. 2A and 2B) is provided with a base mounting portion of the outer sphere and the LED element 18. It is provided between.
  • FIG. 10A is a view for explaining a light source support with an enlarged end according to a fourth embodiment of the present invention.
  • FIG. 10B is also a diagram for explaining a light source support having a thick intermediate portion.
  • the cooling gas flow path formed at the light source support is made smaller (narrower) than the cooling gas flow path cross-sectional area at both ends compared to the cooling gas flow path cross-sectional area at both ends.
  • the light source support 14c shown in FIG. 10A has both end portions expanded in a trumpet shape and the center portion is relatively narrow. In the light source support 14d shown in FIG.
  • the thickness of the middle part of each support piece is made thicker than the thickness of both end parts, and the center part is relatively narrow.
  • FIG. 11 is a diagram illustrating a heat transfer device 28 according to the fifth embodiment of the present invention and an additional heat radiator 30 according to the sixth embodiment.
  • the improvement of cooling and heat dissipation performance is aimed at by forming the heat exchanger 28 inside an outer sphere.
  • a heat conductive resin is poured into the outer sphere and cured to form the heat transfer device 28.
  • the vicinity of the cap 2 of the outer sphere 6 is heated and exposed to high temperature, but the outer sphere top portion is not exposed to this heat due to the effect of the heat shielding member 24 or the like.
  • the pre-formed heat transfer device 28 is not affected by heat in the subsequent manufacturing process.
  • the heat transfer device 28 was made using a heat conductive resin in which carbon fiber was mixed into silicon.
  • other heat conductive resins resins mixed with metal powder / metal pieces
  • the end of the light source support 14 is directly fixed to the heat exchanger 28.
  • a notch, a hole, or the like is provided at the end of the light source support, or the end is formed into a plurality of leg portions.
  • the gas flow inlet / outlet should not be blocked.
  • the sixth embodiment is an example in which an additional radiator 30 is additionally employed in addition to the fifth embodiment.
  • an additional heat radiator 30 is attached to the outside of the outer sphere with respect to the heat transfer device of the fifth embodiment.
  • the additional heat radiator 30 is formed so as to match the outer shape of the outer sphere top portion, and is press-fitted into the outer sphere top portion or fixed with an appropriate adhesive.
  • the material of the additional heat radiator 30 may be the same heat conductive resin as the heat transfer device 28 or other good heat conductive material. Since the heat exchanger 28 in the outer sphere and the additional radiator 30 outside the outer sphere are in a thermal conduction relationship through the outer sphere glass, the heat of the heat exchanger 28 is efficiently transmitted through the additional radiator 30. Released into the open air.
  • FIG. 12 is a diagram for explaining an example in which a cooling air drive fan is provided in the vicinity of the end of the light source support according to the seventh embodiment of the present invention.
  • a gas flow accelerating fan 32 may be provided at the cooling gas inlet at the lower end of the light source support 14.
  • the gas flow acceleration fan 32 may be provided at the gas outlet at the upper end of the light source support 14 or may be provided at both ends.
  • the eighth embodiment is an example in which other gases are sealed in addition to the low molecular weight gas sealed in the inner space 22 of the outer sphere 6. Since low molecular weight hydrogen gas and helium gas have small molecules, when the lamp is used for a long time, a phenomenon that the gas gradually escapes from the outer sphere 6 to the outside was observed. When the cooling gas escapes, the amount of cooling gas in the outer sphere decreases and the temperature of the LED element 18 rises. In order to prevent this, when hydrogen gas or helium gas is used, it is preferable to mix and enclose the gas with a relatively large molecule (typically nitrogen gas) that is difficult to escape to the outside of the outer sphere.
  • a relatively large molecule typically nitrogen gas

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
PCT/JP2013/077327 2012-11-01 2013-10-08 Ｌｅｄランプ WO2014069183A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP13850606.8A EP2937624B1 (en) 2012-11-01 2013-10-08 Led lamp

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Application Number Priority Date Filing Date Title
JP2012-242002 2012-11-01
JP2012242002A JP5818167B2 (ja) 2012-11-01 2012-11-01 Ｌｅｄランプ

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WO2016058286A1 (zh) * 2014-10-17 2016-04-21 杨志伟 一种全方位出光led灯
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CN114068790A (zh) * 2021-09-18 2022-02-18 谷麦光电科技股份有限公司 一种应用于动态背光的多芯片封装结构
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