WO2014068848A1 - Connecteur - Google Patents

Connecteur Download PDF

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Publication number
WO2014068848A1
WO2014068848A1 PCT/JP2013/005909 JP2013005909W WO2014068848A1 WO 2014068848 A1 WO2014068848 A1 WO 2014068848A1 JP 2013005909 W JP2013005909 W JP 2013005909W WO 2014068848 A1 WO2014068848 A1 WO 2014068848A1
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WO
WIPO (PCT)
Prior art keywords
base material
hole
conductive
substrate
connector
Prior art date
Application number
PCT/JP2013/005909
Other languages
English (en)
Japanese (ja)
Inventor
橋本　信一
文章 宇崎
Original Assignee
タイコエレクトロニクスジャパン合同会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タイコエレクトロニクスジャパン合同会社 filed Critical タイコエレクトロニクスジャパン合同会社
Priority to CN201380057490.2A priority Critical patent/CN104769781A/zh
Publication of WO2014068848A1 publication Critical patent/WO2014068848A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Definitions

  • the present invention relates to a connector that is used for electrically interconnecting the inside and outside of an airtight chamber defined by a partition wall, and plugs an opening formed in the partition wall that penetrates the inside and the outside of the airtight chamber.
  • FIG. 10 is a schematic diagram of an electrical connection structure for electrically interconnecting the inside and the outside of a hermetic chamber, which is partitioned by a partition wall and adjusted in pressure, according to a conventional example.
  • An electrical connection structure 101 shown in FIG. 10 electrically connects the inside A side and the outside B side of a chamber (not shown) that is partitioned by a partition wall (not shown) and whose internal pressure is adjusted.
  • the partition wall has an opening (not shown) penetrating the inside A side and the outside B side of the chamber. The opening is closed by the connector 110.
  • the base material of the connector 110 is provided with a plurality of via holes 112.
  • Each via hole 112 is formed by filling a through hole penetrating between an inner surface and an outer surface of a base material with a conductor.
  • the through hole is formed by conducting conductive plating on the inner peripheral surface of the through hole that passes between the inner surface and the outer surface of the substrate.
  • a pair of conductive pads 113 a and 113 b interconnected by the conductors of the via holes 112 are provided on the inner surface and the outer surface of the connector 110.
  • a plurality of first connectors 120 ⁇ / b> A are disposed inside the connector 110, and a plurality of second connectors 120 ⁇ / b> B are disposed outside the connector 110.
  • Each first connector 120A is disposed so as to extend in a direction orthogonal to the connector 110, and is disposed along the longitudinal direction (vertical direction in FIG. 10) of the connector 110.
  • Each of the second connectors 120B is disposed so as to extend in a direction orthogonal to the connector 110, and is disposed along the longitudinal direction of the connector 110 so as to face the first connector 120A.
  • each of the first connectors 120A is arranged so as to extend in a direction orthogonal to the connector 110, and the width direction of the second substrate 121 (direction orthogonal to the paper surface in FIG. 10). And a plurality of contacts 123 arranged at a predetermined pitch along the line. On the surface of the second substrate 121 (upper surface in FIG. 10), a plurality of conductive patterns 124 are provided at a predetermined pitch along the width direction of the second substrate 121. Each contact 123 is connected to one end side of each conductive pattern 124. A signal line 122 is connected to the other end side of each conductive pattern 124.
  • Each second connector 120B has the same configuration as each first connector 120A.
  • the first connector 120A is advanced in the direction of arrow F in FIG. 10, and the contact 123 is brought into contact with the conductive pad 113a provided on the inner surface of the connector 110.
  • the second connector 120B is advanced in the direction of the arrow F ′ in FIG. 10, and the contact 123 is brought into contact with the conductive pad 113 b provided on the outer surface of the connector 110.
  • the signal lines 122 and 122 on the chamber inner side A and the outer side B are connected to the conductive pattern 124 on the chamber inner side A, the contact 123, the conductive pad 113a on the inner surface of the connector 110, the via hole 112, and the outer surface of the connector 110.
  • the conductive pads 113b, the contacts 123, and the conductive pattern 124 on the chamber outside B side are electrically connected.
  • patent document 2 what was described in patent document 2 is known as an airtight terminal which ensured the airtightness between an electrode pin and a package, for example.
  • conductive plating is formed on the inner peripheral surface of the through hole formed in the package.
  • a lid that covers the opening of the through hole is formed on the electrode pin disposed in the through hole. And this lid
  • cover is joined to electroconductive plating so that an opening part may be plugged up.
  • the gap between the electrode pin in the through hole where the electrode pin is disposed and the conductive plating is filled with solder and sealed.
  • JP 2004-349073 A Japanese Patent Laid-Open No. 11-40223
  • the electrical connection structure 101 described in Patent Document 1 and the airtight terminal described in Patent Document 2 shown in FIG. 10 have the following problems. That is, in the case of the electrical connection structure 101 described in Patent Document 1 shown in FIG. 10, when the via hole 112 is formed in the base material of the connector 110, a step of filling the conductor into the through hole formed in the base material. Is required. This conductor filling step is an additional step to the normal step of forming a through hole in the base material, and also requires special equipment for filling the conductor, resulting in poor productivity. .
  • the present invention has been made to solve these problems, and its purpose is to achieve airtightness inside the chamber without filling a through hole formed in the base material with a conductor such as solder. It is another object of the present invention to provide a connector that can ensure reliable electrical connection between the inside and the outside of a chamber.
  • a connector according to an aspect of the present invention is used to electrically interconnect the inside and outside of an airtight chamber partitioned by a partition, and is formed in the partition.
  • a connector for closing an opening penetrating the inside and the outside of the housing comprising a multilayer substrate for closing the opening, the multilayer substrate comprising a flat plate-like first base material and an inner surface side of the first base material A flat plate-like second base material that is disposed on the opening and closes the opening, and a flat plate-like third base material that is arranged on the outer surface side of the first base material, While having a first through hole formed by applying a first conductive plating extending between the inner surface and the outer surface on the inner peripheral surface of the through hole penetrating between the inner surface and the outer surface of the first substrate, Connected to the inner surface side of the first conductive plating provided on the inner surface of the first base material A first conductive layer and a second conductive layer provided on an outer surface of the first base material and connected to an
  • the connector according to the present invention includes a multilayer board that closes an opening that penetrates the inside and the outside of the hermetic chamber, and in this multilayer board, the outer surface of the second base is in contact with the inner surface of the first base.
  • the inner surface side of the first through hole formed in the first substrate is closed by the second substrate, and the inner surface of the third substrate is in contact with the outer surface of the first substrate. Since the outer surface side of the first through hole is closed by the third base material, the inner surface side of the first through hole of the first substrate and the second base material and the third base material constituting the multilayer substrate The outer surface side can be closed, and the airtightness inside the chamber can be maintained.
  • the 1st base material was provided in the inner surface of the 1st base material, the 1st conductive layer connected to the inner surface side of the 1st conductive plating of the 1st through hole, and the outer surface of the 1st base material And a second conductive layer connected to the outer surface side of the first conductive plating, and a second base material provided on the inner surface of the second base material.
  • the third base material connected to the outer surface side of the third conductive plating of the third through hole provided on the outer surface of the third base material Since the fourth conductive layer is connected, the first conductive layer and the outer surface side of the second conductive plating are connected, and the second conductive layer and the inner surface side of the third conductive plating are connected. From the inner surface side to the outer surface side, the third conductive layer, the second conductive plating, the first conductive layer, the first conductive plating, the second conductive layer, the third conductive plating, Beauty is in turn connected to the fourth conductive layer. For this reason, reliable electrical connectivity between the inside and outside of the chamber can be obtained.
  • FIG. 2 is a cross-sectional view showing in detail the periphery of the connector in the electrical connection structure using the connector shown in FIG. 1.
  • FIG. 4 is a cross-sectional view taken along line 4-4 in FIG.
  • FIG. 6 is a cross-sectional view taken along line 6-6 in FIG.
  • It is sectional drawing of the principal part of the 1st modification of a multilayer substrate.
  • It is sectional drawing of the principal part of the 2nd modification of a multilayer substrate.
  • It is sectional drawing of the principal part of the 3rd modification of a multilayer substrate.
  • the inside and outside of an airtight chamber C that is partitioned by a partition wall 90 and is kept airtight inside are electrically interconnected using a connector 1.
  • the inside of the hermetic chamber C may be in a state close to a vacuum, or may be filled with a gas having a low molecular weight such as He gas to reduce the pressure to a state lower than the external pressure. Further, the inside of the airtight chamber C may be in a state of a pressure higher than the external pressure.
  • the partition wall 90 is formed with an opening 91 that penetrates the inside and the outside of the hermetic chamber C.
  • the partition wall 90 is formed with a gas injection / discharge opening 92 for injecting gas into the airtight chamber C of the partition wall 90 (or discharging gas from the airtight chamber C).
  • the partition wall 90 is made of metal.
  • the connector 1 includes a multilayer substrate (a four-layer substrate in this embodiment) 10 that closes the opening 91.
  • the multilayer substrate 10 includes a flat plate-like first base material 20 and a flat plate-like first base material 20 disposed on the inner surface 20 a side of the first base material 20 to block the opening 91.
  • positioned at the outer surface 20b side of the 1st base material 20 are provided.
  • the first base material 20 is a substantially rectangular flat plate-like member extending in the width direction (left-right direction in FIG. 5) and the longitudinal direction (up-down direction in FIG. 5).
  • the first base material 20 may be circular.
  • the first base material 20 has an inner surface 20 a and an outer surface 20 b located on the inner side of the airtight chamber C.
  • the inner surface 20a of the first base material 20 is formed with a notch 20c having a predetermined width that extends continuously and endlessly along the outer periphery of the first base material 20.
  • the first base material 20 is made of glass-filled epoxy, for example.
  • a plurality of first through holes 23 that electrically interconnect the inner surface 20 a and the outer surface 20 b of the first substrate 20 are formed in the first substrate 20.
  • the plurality of first through holes 23 are formed in two rows in the width direction of the first base material 20.
  • the first through holes 23 in each row are formed at a predetermined pitch along the front-rear direction.
  • each 1st through hole 23 is the inner peripheral surface of the through-hole 21 which penetrates between the inner surface 20a and the outer surface 20b of the 1st base material 20, and the inner surface 20a and the outer surface of the 1st base material 20
  • An annular first conductive plating 22 extending between 20b is applied.
  • the first conductive plating 22 is formed by, for example, tin plating or gold plating. Further, a resin 26 is filled in the central space of the annular first conductive plating 22. This space may be filled with a conductor instead of the resin 26, and the space 27 may not be filled with anything as shown in FIG. 7.
  • a plurality of first conductive layers 24 connected to the inner surface 20 a side of the first conductive plating 22 are provided on the inner surface 20 a of the first base material 20. Each first conductive layer 24 is formed so as to include a portion surrounding the periphery of the first conductive plating 22 and a portion extending outward from the portion in the width direction.
  • a plurality of second conductive layers 25 connected to the outer surface 20 b side of the first conductive plating 22 are provided on the outer surface 20 b of the first base material 20.
  • Each second conductive layer 25 is also formed to include a portion surrounding the periphery of the first conductive plating 22 and a portion extending outward from the portion in the width direction.
  • the 2nd base material 30 is a substantially rectangular flat plate-shaped member extended in the width direction (left-right direction in FIG. 5) and a longitudinal direction (up-down direction in FIG. 5), as shown in FIG.
  • the second base material 30 has the same width and length as the inner surface 20a of the cut first base material 20.
  • the 2nd base material 30 has the inner surface 30a and the outer surface 30b which are located in the inside of the airtight chamber C, as shown in FIG.2, FIG4 and FIG.6.
  • the second substrate 30 is made of glass-containing epoxy, for example. As shown in FIGS.
  • the notch 20 c portion of the first base material 20, the outer peripheral end face portion of the second base material 30, and the outer peripheral portion of the inner surface 30 a of the second base material 30 are continuous.
  • An endless soldering layer 11 is formed.
  • the soldering layer 11 is formed by, for example, tin plating or gold plating.
  • the second base material 30 is formed with a plurality of second through holes 33 that electrically interconnect the inner surface 30 a and the outer surface 30 b of the second base material 30.
  • the plurality of second through holes 33 are formed in two rows at positions outside the first through holes 23 in the width direction of the second base material 30.
  • the second through holes 33 in each row are formed at a predetermined pitch along the front-rear direction.
  • each 2nd through hole 33 is the inner peripheral surface of the through-hole 31 which penetrates between the inner surface 30a and the outer surface 30b of the 2nd base material 30, and the inner surface 30a and the outer surface of the 2nd base material 30
  • a second conductive plating 32 extending between 30b is applied. As shown in FIG.
  • the second conductive plating 32 is formed so as to completely fill the inside of the through hole 31.
  • the second conductive plating 32 may be formed in an annular shape extending between the inner surface 30a and the outer surface 30b, and a space 35 may be formed in the center.
  • the second conductive plating 32 is formed by, for example, tin plating or gold plating.
  • a plurality of third conductive layers 34 connected to the inner surface side of the second conductive plating 32 are provided on the inner surface 30 a of the second base material 30. As shown in FIGS. 5 and 6, each third conductive layer 34 is formed in a rectangular shape that covers the inner surface side end of the second conductive plating 32 and extends inward in the width direction.
  • the 3rd base material 40 is a substantially rectangular flat plate-shaped member extended in the width direction (left-right direction in FIG. 5) and the longitudinal direction (up-down direction in FIG. 5).
  • the third substrate 40 has the same width and length as the outer surface 20 b of the first substrate 20.
  • the 3rd base material 40 has the inner surface 40a and the outer surface 40b which are located in the inside of the airtight chamber C, as shown in FIG.2, FIG4 and FIG.6.
  • the third base material 40 is made of glass-filled epoxy, for example.
  • a plurality of third through holes 43 that electrically connect the inner surface 40 a and the outer surface 40 b of the third substrate 40 are formed in the third substrate 40.
  • the plurality of third through holes 43 are formed in two rows at positions outside the first through holes 23 in the width direction of the third base material 40.
  • the third through holes 43 in each row are formed at a predetermined pitch along the front-rear direction.
  • each 3rd through-hole 43 is the inner peripheral surface of the through-hole 41 which penetrates between the inner surface 40a and the outer surface 40b of the 3rd base material 40, and the inner surface 40a and the outer surface of the 3rd base material 40
  • a third conductive plating 42 extending between 40b is applied.
  • the third conductive plating 42 is formed so as to completely fill the inside of the through hole 41.
  • the third conductive plating 42 may be formed in an annular shape extending between the inner surface 40a and the outer surface 40b, and a space 45 may be formed in the center.
  • the third conductive plating 42 is formed by, for example, tin plating or gold plating.
  • a plurality of fourth conductive layers 44 connected to the outer surface side of the third conductive plating 42 are provided on the outer surface 40 b of the third base material 40.
  • Each fourth conductive layer 44 is formed in a rectangular shape that covers the outer surface side end of the third conductive plating 42 and extends inward in the width direction.
  • the outer surface 30 b of the second base material 30 is disposed so as to contact the inner surface 20 a of the first base material 20, and is formed on the first base material 20 by the second base material 30. Further, the inner surface side of the first through hole 23 is closed. Further, the first conductive layer 24 and the outer surface side of the second conductive plating 32 are connected. Further, the inner surface 40 a of the third base material 40 is disposed so as to be in contact with the outer surface 20 b of the first base material 20, and the first through hole 23 formed in the first base material 20 by the third base material 40. The outer surface side is blocked. Further, the second conductive layer 25 and the inner surface side of the third conductive plating 42 are connected.
  • the multilayer substrate 10 in the layer direction of the second base material 30, the first base material 20, and the third base material 40 from the inner surface side to the outer surface side, a third conductive layer 34, a first conductive layer 24, Four conductive layers of the first conductive layer 25 and the fourth conductive layer 44 are arranged. For this reason, the multilayer substrate 10 constitutes a four-layer substrate.
  • the connector 1 is disposed on the first connector 50 disposed on the inner surface 30 a side of the second substrate 30 and on the outer surface 40 b side of the third substrate 40.
  • a second connector 60 the first connector 50 includes an insulating housing 51 and a plurality of electrical contacts 52 accommodated in the housing 51.
  • the plurality of electrical contacts 52 are arranged in two rows in the width direction of the housing 51 as shown in FIG. 3 corresponding to the second through holes 33 and the third conductive layer 34 formed in the second base material 30.
  • the electrical contacts 52 in each row are arranged at a predetermined pitch along the front-rear direction.
  • Each electrical contact 52 includes a connection portion 52a that is solder-connected to the third conductive layer 34 formed on the second base material 30, and an elastic contact portion 52b.
  • the second connector 60 includes an insulating housing 61 and a plurality of electrical contacts 62 accommodated in the housing 61, as shown in FIG.
  • the plurality of electrical contacts 62 are arranged in two rows in the width direction of the housing 61 corresponding to the third through holes 43 and the fourth conductive layer 44 formed in the third base material 40.
  • the electrical contacts 62 in each row are arranged at a predetermined pitch along the front-rear direction.
  • Each electrical contact 62 includes a connection portion 62a that is solder-connected to the fourth conductive layer 44 formed on the third base material 40, and an elastic contact portion 62b.
  • the second circuit board 80 is brought into contact with the elastic contact portion 62 c of the electrical contact 62 in the second connector 60.
  • the first circuit board 70 and the second circuit board 80 are electrically interconnected via the connector 1.
  • the multilayer substrate 10 that closes the opening 91 that penetrates the inside and the outside of the airtight chamber C is provided.
  • the outer surface 30b of the 2nd base material 30 was arrange
  • the inner surface 40 a of the third base material 40 is disposed so as to be in contact with the outer surface 20 b of the first base material 20, and the outer surface side of the first through hole 23 is blocked by the third base material 40. Therefore, the inner surface side and the outer surface side of the first through hole 23 of the first substrate 20 can be closed by the second base material 30 and the third base material 40 constituting the multilayer substrate 10, and the inside of the chamber C Airtightness can be maintained.
  • the first base material 20 is connected to the inner surface side of the first conductive plating 22 of the first through hole 23, and the second conductive layer is connected to the outer surface side of the first conductive plating 22. And a conductive layer 25.
  • the second base material 30 includes a third conductive layer 34 connected to the inner surface side of the second conductive plating 32 of the second through hole 33.
  • the third base material 40 includes a fourth conductive layer 44 connected to the outer surface side of the third conductive plating 42 of the third through hole 43. Then, the first conductive layer 24 and the outer surface side of the second conductive plating 32 were connected, and the second conductive layer 25 and the inner surface side of the third conductive plating 42 were connected.
  • the third conductive layer 34, the second conductive plating 32, the first conductive layer 24, the first conductive plating 22, the second conductive layer 25, the second The three conductive plating 42 and the fourth conductive layer 44 are connected in this order. For this reason, reliable electrical connectivity between the inside and the outside of the chamber C can be obtained.
  • the airtightness inside the chamber C is maintained without filling the inside of the through hole (first through hole 23) formed in the base material (first base material 20) with a conductor such as solder. , Reliable electrical connectivity between the inside and the outside of the chamber C can be obtained. Therefore, a step of filling a conductor such as solder, which is an additional step to the normal step of forming a through hole in the base material, is not necessary, and the productivity of the connector 1 can be improved.
  • the multilayer substrate 10 of the first modification shown in FIG. 7 is different from the multilayer substrate 10 shown in FIG. 6 in the space 27 in the center of the first conductive plating 22 of the annular first through hole 23 as described above.
  • the second conductive plating 32 is formed in an annular shape extending between the inner surface 30a and the outer surface 30b of the second base material 30, and a space 35 is formed in the center.
  • the third conductive plating 42 is formed in an annular shape extending between the inner surface 40a and the outer surface 40b of the third substrate 40, and a space 35 is formed in the center.
  • the chamber C can be formed without filling a conductor such as solder in the through hole (first through hole 23) formed in the base material (first base material 20).
  • the internal airtightness of the can be maintained.
  • reliable electrical connectivity between the inside and the outside of the chamber C can be obtained.
  • FIG. 6 when the space in the center of the annular first conductive plating 22 is filled with the resin 26 or the space is filled with a conductor, the airtightness inside the chamber C is maintained. The effect can be enhanced. Further, even if the second conductive plating 32 is formed so as to fill the entire inside of the through hole 31 as in the multilayer substrate 10 shown in FIG.
  • the effect of maintaining the hermeticity inside the chamber C can be enhanced.
  • the third conductive plating 42 is formed so as to completely fill the inside of the through hole 41, the airtightness maintaining effect inside the chamber C can be enhanced.
  • the multilayer substrate 10 of the second modified example shown in FIG. 8 differs from the multilayer substrate 10 shown in FIG. 6 in that the plurality of second through holes 33 and the first through holes 23 in the width direction of the second base material 30. They are formed at the same position.
  • the plurality of third through holes 43 are also formed at the same position as the first through holes 23 in the width direction of the third base material 40. That is, the first through hole 23, the second through hole 33, and the third through hole 43 are linearly arranged from the inner side to the outer side of the multilayer substrate 10.
  • the first conductive layer 24 has an end on the inner surface side of the first conductive plating 22 formed in an annular shape. It is formed concentrically with the first conductive plating 22 so as to cover it. Moreover, the 2nd conductive layer 25 is formed concentrically with the 1st conductive plating 22 so that the outer surface edge part of the 1st conductive plating 22 formed in cyclic
  • the plurality of second through holes 33 and the plurality of third through holes 43 are formed at positions different from the first through holes 23 in the width direction of the second base material 30. In this way, the effect of maintaining the airtightness inside the chamber C can be enhanced.
  • the multilayer substrate 10 of the third modified example shown in FIG. 9 has the same basic configuration as the multilayer substrate 10 shown in FIG. 8, but differs from the multilayer substrate 10 shown in FIG. It is formed in an annular shape extending between 30a and the outer surface 30b, and a space 35 is formed in the center.
  • the third conductive plating 42 is formed in an annular shape extending between the inner surface 40a and the outer surface 40b, and a space 45 is formed in the center.
  • the chamber C can be formed without filling a conductor such as solder in the through hole (first through hole 23) formed in the base material (first base material 20). The internal airtightness of the can be maintained. At the same time, reliable electrical connectivity between the inside and the outside of the chamber C can be obtained.
  • the first base material 20, the second base material 30, and the third base material 40 are each composed of a single layer, but may be composed of a plurality of layers.
  • the multilayer substrate 10 may be composed of not only four layers but also four or more layers such as five layers and six layers.
  • the connector 1 does not necessarily include the first connector 50 and the second connector 60.
  • Multilayer substrate 20 1st base material 20a Inner surface 20b Outer surface 21 Through-hole 22 1st electroconductive plating 23 1st through-hole 24 1st conductive layer 25 2nd conductive layer 30 2nd base material 30a Inner surface 30b Outer surface 31 Through hole 32 Second conductive plating 33 Second through hole 34 Third conductive layer 40 Third substrate 40a Inner surface 40b Outer surface 41 Through hole 42 Third conductive plating 43 Third through hole 44 Fourth conductive layer 90 Partition 91 Opening C Airtight chamber

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

L'invention porte sur un connecteur, grâce à quoi l'étanchéité à l'air d'une partie intérieure d'une chambre est préservée même si une partie intérieure d'un trou traversant qui est formé dans un substrat n'est pas remplie avec un conducteur tel qu'une soudure, et simultanément, une connectivité électrique fiable peut être obtenue entre la partie intérieure et une partie extérieure de la chambre. Un connecteur (1) comprend un substrat à multiples couches (10) qui scelle de manière étanche une partie d'ouverture (91) qui est formée dans une cloison (90) et qui assemble une partie intérieure et une partie extérieure d'une chambre étanche à l'air (C). Dans le substrat à multiples couches (10), le côté de surface intérieure d'un premier trou traversant (23), qui est formé dans un premier substrat (10), est fermé par un second substrat (30), et une première couche conductrice (24) qui est reliée au côté de surface intérieure d'un premier placage conducteur (22) est reliée à un côté de surface extérieure d'un second placage conducteur (32) du second substrat (30). Le côté de surface extérieure du premier trou traversant (23) est scellé de manière étanche par un troisième substrat (40), et la seconde couche conductrice (25) qui est reliée au côté de surface extérieure du premier placage conducteur (22) est reliée au côté de surface intérieure du troisième placage conducteur (42) du troisième substrat (40).
PCT/JP2013/005909 2012-10-31 2013-10-03 Connecteur WO2014068848A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201380057490.2A CN104769781A (zh) 2012-10-31 2013-10-03 连接器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012240799A JP6208935B2 (ja) 2012-10-31 2012-10-31 コネクタ
JP2012-240799 2012-10-31

Publications (1)

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WO2014068848A1 true WO2014068848A1 (fr) 2014-05-08

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PCT/JP2013/005909 WO2014068848A1 (fr) 2012-10-31 2013-10-03 Connecteur

Country Status (4)

Country Link
JP (1) JP6208935B2 (fr)
CN (1) CN104769781A (fr)
TW (1) TWM468796U (fr)
WO (1) WO2014068848A1 (fr)

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US9870806B2 (en) 2016-03-24 2018-01-16 Western Digital Technologies, Inc. Hermetic sealing with high-speed transmission for hard disk drive
EP3470681A1 (fr) * 2017-10-10 2019-04-17 Pfeiffer Vacuum Gmbh Traverse électrique pour appareil à vide, sous la forme d'une plaque de circuit imprimé

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MX2018003866A (es) * 2015-09-28 2018-06-15 Tactotek Oy Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.
JP6768730B2 (ja) * 2018-03-30 2020-10-14 株式会社東芝 電子機器

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JPH07231165A (ja) * 1994-02-15 1995-08-29 Hitachi Cable Ltd 多層配線基板及びその製造方法
JPH1140223A (ja) * 1997-07-23 1999-02-12 Yamatake Honeywell Co Ltd 気密端子およびその形成方法
JP2004349073A (ja) * 2003-05-21 2004-12-09 Tyco Electronics Amp Kk 電気接続構造、コネクタ、および電気接続システム
JP2005259801A (ja) * 2004-03-09 2005-09-22 Matsushita Electric Ind Co Ltd 多層ガラス基板の製造方法
JP2009093806A (ja) * 2007-10-03 2009-04-30 Kitagawa Ind Co Ltd 表面実装コンタクト
WO2012144326A1 (fr) * 2011-04-20 2012-10-26 タイコエレクトロニクスジャパン合同会社 Connecteur et procédé de fabrication de connecteur
JP2013012408A (ja) * 2011-06-29 2013-01-17 Tyco Electronics Japan Kk 電気接続構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9870806B2 (en) 2016-03-24 2018-01-16 Western Digital Technologies, Inc. Hermetic sealing with high-speed transmission for hard disk drive
EP3470681A1 (fr) * 2017-10-10 2019-04-17 Pfeiffer Vacuum Gmbh Traverse électrique pour appareil à vide, sous la forme d'une plaque de circuit imprimé

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CN104769781A (zh) 2015-07-08
JP2014093121A (ja) 2014-05-19
JP6208935B2 (ja) 2017-10-04
TWM468796U (zh) 2013-12-21

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