WO2014058131A1

WO2014058131A1 - Method for manufacturing printed circuit film attachment-type led module

Info

Publication number: WO2014058131A1
Application number: PCT/KR2013/006114
Authority: WO
Inventors: 이풍우; 김정헌
Original assignee: 주식회사 이티엘
Priority date: 2012-10-09
Filing date: 2013-07-10
Publication date: 2014-04-17
Also published as: KR101241271B1

Abstract

A method for manufacturing a printed circuit film attachment-type LED module according to the present invention comprises the steps of: discarding the release paper from a polyimide (PI) film; coating the PI film with an adhesive by applying heat and pressure; printing, with a conductive paste, a variety of patterns on the surface of the adhesive-coated PI film; plating the PI film via electrolysis after inserting the PI film, printed with a conductive paste, into a Cu electrolyte; printing SR paste on the surface of the Cu-plated PI film; printing solder cream on soldering parts of the PI film surface; mounting, automatically, LEDs on the solder cream printed parts; after mounting the LEDs, soldering the LED chips by applying heat; applying an adhesive to a base heat-dissipation plate; cutting the PI film and separating into unit product sizes; attaching the printed circuit PI film units to the adhesive by applying heat; and removing bubbles and maximizing adhesion by means of air pressure and heat.

Description

Method of manufacturing LED module with film printed circuit attachment method

The present invention relates to a method for manufacturing an LED module for mounting a plurality of LED elements on a base heat sink attached with a film type printed circuit printed with an electric circuit pattern using a conductive ink. As described above, the film printed with the electric circuit pattern using the conductive ink has a simple manufacturing process and is easy to manufacture, and the film with the printed electric circuit pattern is attached to the base having a structure capable of dissipating heat generated from the LED. By doing so, problems caused by heat generation can be solved. In addition, the conductive ink is a linear or branched saturated or unsaturated fatty acid substituted with an amino group, a nitrile group, etc. having 2 to 16 carbon atoms and having a carboxyl group of 1 to 3 forms an effective amount of silver aromatic carboxylic acid and a chelating agent or complex with silver. The solution for forming a conductive line pattern consisting of a reactive organic solvent and a polar or nonpolar dilution solvent for viscosity adjustment may be an organosol ink or a conductive ink using metal nanoparticles.

Conventional technology related to the present invention is disclosed in Korean Patent Registration No. 10-1171984 (August 08, 2012). 1 is a plan view of a conventional flexible LED module, and FIG. 2 is a configuration diagram of a current supply unit printed by screen printing using conductive ink applied to a conventional flexible LED module. 1 to 2, the conventional flexible LED module includes a flexible heat sink 100, an LED 10, a current supply line unit 60, a current supply pad unit 50, and an LED support unit 20. The flexible heat sink 100 is a heat sink that can be bent, for example, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyether, polyether It may be one of an imide (Polyether lmide) and polyarylate (PAR: polyarylate), the flexible heat sink 100 may be a heat sink that can be bent a metal heat sink may be used. The metal heat sink may be a metal heat sink including a metal material of any one of aluminum, copper, gold, silver, and nickel having excellent thermal conductivity. In the above, the LED 10 is a light emitting device, and is connected to the current supply line unit 60. At this time, the connecting portion is to electrically connect the current supply line unit 60 and the LED 10 as a connecting means such as cream soldering, conductive adhesive. In addition, the LEDs 10 are regularly arranged along the current supply line unit 60, and may be connected in series, and the current supply pad unit 50 may be formed at both sides of the flexible heat sink 100. In addition, the current supply pad unit 50 is formed on the top and bottom surfaces of the flexible heat sink 100, respectively, and a conductive material including any one of gold, silver, copper, and nickel may be formed by a screen printing method. will be. In addition, the current supply pad unit 50 may be formed of a conductive ink such as carbon paste on the flexible heat sink 100 by a screen printing method. In addition, at least one current supply line unit 60 is formed on one surface of the flexible heat sink in one direction to supply current to the LED 10. A plurality of the current supply line unit 60 is formed perpendicular to the current supply pad unit 50, and a plurality of the current supply line unit 60 is formed to be parallel to each other between the current supply pad units 50 on both sides of the current supply line unit 60. ) Is a conductive material containing any one of gold, silver, copper and nickel is formed by the screen printing method or the current supply line unit 60 is formed by the screen printing method on the flexible heat sink 100 conductive ink such as carbon paste. Can be. Here, the current supply line unit 60 may be formed in the same process in the same manner as the current supply pad unit 50. In addition, the current supply line unit 60 may be formed in a plurality of parallel arrangement, and the first current supply line 61a, the second current supply line 61b, the first connection bump 62a and the second connection bump ( 62b), the first current supply line 61a is connected to the first connection bump 62a, and the first current supply line 61a includes a plurality of current supply lines, and the number of LEDs 10 It will be formed in a corresponding number. In addition, the second current supply line 61b is connected to the second connection bump 62b, and the second current supply line 61b includes a plurality of current supply lines, and corresponds one-to-one with the first current supply line 61a. It is formed to be a number. In addition, the − terminal of the LED 10 is connected to the first connection bump 62a, and the + terminal of the LED 10 is connected to the second connection bump 62b, but the − terminal of the LED 10 is the first terminal. It is connected to the second connection bump 62b, the + terminal may be connected to the first connection bump 62a. In addition, when the current supply line unit 60 is formed of a conductive ink, and includes a self resistance, the LED 10 may be driven by its own resistance even though the current supply line unit 60 does not have a resistance. At this time, the sum of the lengths of the first current supply line 61a and the second current supply line 61b connected to one LED is equal to the length of the first current supply line 61a and the second current supply line 61b connected to the other LED. Since the total resistance value between the lines of each current supply line of the current supply line unit 60 is the same as the sum of the lengths, the current supplied to the LED is uniform, and the luminance of the LED 10 can be made uniform. There is a characteristic.

The flexible heat sink applied to the conventional flexible LED module as described above is a metal heat sink including any one of metal materials of copper, gold, silver and nickel, and the current supply line 60 is printed on the flexible heat sink by a printing method. The current supply line is electrically connected to each LED element through a connecting portion. The flexible heat sink and the current supply line are made of a conductive conductor and are not electrically insulated, thereby increasing resistance. There is a problem such as a deviation of the brightness of the generated, low adhesion strength between the conductive ink particles to generate heat during conduction, or short circuit. In addition, the conventional flexible LED module as described above includes a complex and difficult process to solve the need to apply the epoxy, silicon, acrylic material to each LED on a separate LED support to lower the adhesive strength of the printed circuit. The LED module manufacturing method of the present invention film-type printed circuit attachment method for solving the problems of the prior art as described above to improve the adhesive force by printing the conductive pattern with conductive ink after printing the epoxy, silicon, acrylic-based on the PI film as a whole. The manufacturing process is easy by attaching a PI film printed with a conductive pattern through various steps of electroplating through the electrode circuit pattern for forming 0 Ω resistance between the electrode circuits and attaching the LED element to heat sinks of various shapes. It is for the circuit resistance of the electrical supply line of a conductive pattern to be small, and to reduce the risk of a short circuit. In addition, another object of the present invention is to facilitate the configuration of the conductive pattern in the heat sink of various shapes by using a film printed with a conductive pattern.

LED module manufacturing method of the film-type printed circuit attachment method of the present invention for solving the problems of the prior art as described above, the step of removing the release paper of the PI (polyimide) film, coating the PI film by applying heat and pressure to the adhesive And printing an electric circuit pattern using a paste containing a conductive material on a PI film surface coated with an adhesive, immersing the PI film printed with a conductive paste in a Cu electrolyte, and plating the same through electrolysis; Printing SR paste on Cu plated PI film surface, printing cream solder on PI film surface soldering part, automatically mounting LED on cream solder printing part, and putting on cream solder after LED mounting Soldering the LED chip by applying heat, attaching the adhesive to the aluminum bar, cutting the PI film ledger and separating it into unit products, and printing the unit It is by heating the PI film on the adhesive used in contact with the step, air pressure and heat to maximize adhesion and will, characterized in that made in a step for removing air bubbles.

LED module manufacturing method of the film-type printed circuit attachment method of the present invention made as described above has the effect of having a low withstand cost characteristics and simple manufacturing process. In addition, the LED module manufacturing method of the film-type printed circuit attachment method of the present invention has an effect that the electrical circuit configuration is easy to heat sink of various shapes.

1 is a plan view of a conventional flexible LED module,

2 is a configuration diagram of a current supply printed by screen printing using conductive ink applied to a conventional flexible LED module;

Figure 3 is a flow chart of the LED module manufacturing method of the film-type printed circuit attachment method of the present invention,

Figure 4 is a separation configuration of the PI film ledger and release paper,

5 is a view showing that the adhesive coating on the PI film by applying heat and pressure,

6 is a view showing a pattern printed with a conductive paste,

7 shows a pattern after Cu plating and a pattern on which an SR paste is printed;

8 is a view of the cream solder printed on the PI film pattern surface;

9 is a view of the LED mounted on the PI film cream solder portion;

10 is a view of a state in which the LED element is soldered to the PI film,

11 is a perspective view of an adhesive attached to an upper portion of a base heat sink;

12 is a perspective view separated by cutting the individual unit printed circuit PI film in the PI film PCB,

13 is a perspective view of a state in which the LED element is mounted on the base heat sink.

When explaining the LED module manufacturing method of the film-type printed circuit attachment method of the present invention for achieving the above object with reference to Figures 3 to 13 as follows.

Figure 3 is a flow chart of the LED module manufacturing method of the film-type printed circuit attachment method of the present invention. 3 is a method of manufacturing an LED module of a film-type printed circuit attachment method of the present invention, the first step (S21) of removing a release paper of a PI (polyimide) film, and an epoxy, silicone or acrylic adhesive on a PI film The second step (S22) of applying a pressure coating, the step of printing in a variety of patterns using a paste containing a conductive material on the PI film surface coated with an adhesive (S23), and the PI film on which the conductive paste is printed Cu electrolyte After immersed in the electroplating step (S24), Cu-plated SR film on the PI film surface printing step (S25), PI film surface soldering portion printing step (S26) and Automatically mounting the LED to the cream solder printing unit (S27), and after mounting the LED to heat the cream solder soldering the LED chip (S28), and attaching the adhesive to the base heat sink (S29) and Cut PI film ledger, unit Separating into a chain circuit PI film (S30), step of welding the unit printed circuit PI film by applying heat to the adhesive (S31), and maximizing the adhesive force by using air pressure and heat (S32) ) After the step of printing the cream solder to the PI film surface soldering portion (S26) may be added to the step of automatically checking the cream solder printing, and, after the LED mounting by applying heat to the cream solder soldering the LED chip After the step, the step of automatically checking the LED chip mounting state, solder state, etc. can be further configured. In addition, the step of attaching the adhesive to the heat sink is attached to the adhesive by applying heat for 7 seconds at a temperature of 100 ℃, the step of applying the unit printed circuit PI film by applying heat to the adhesive for 7 seconds at a temperature of 100 ℃. It is appropriate to apply heat, and also by using the air pressure and heat to maximize the adhesive force and removing bubbles (S32) the air pressure is 8kg / ㎠ and the temperature is heated at 150 ℃ for 1 hour to maximize the adhesive force To remove bubbles.

4 is a separation configuration diagram of the PI film ledger 110 and the release paper 101. In Figure 4 it is shown to separate the release paper 101 from the PI film ledger 110 in order to coat the adhesive on the PI film.

FIG. 5 is a diagram illustrating coating an adhesive on a PI film by applying heat and pressure. FIG. In FIG. 5, the adhesive shows coating by applying heat and pressure using a squeegee rubber and a screen frame.

6 is a view showing a pattern on which a conductive paste is printed. In FIG. 6, the conductive paste printed pattern forms various patterns and configures Cu to be plated on the patterns.

7 is a view showing a pattern after Cu plating and a pattern on which an SR paste is printed. In FIG. 7, the Cu plating and the SR paste are printed, after forming a pattern with a conductive paste, immersing in a Cu electrolyte and plating the Cu through electrolysis to print an SR paste.

8 is a view of a cream solder printed on the PI film pattern surface. The cream solder is printed on the PI film pattern side in FIG. 8 to solder and attach the LED to the pattern side.

FIG. 9 is a diagram in which an LED is mounted on a PI film cream solder part. FIG. 9 shows that the plurality of LED elements 120 are mounted in various forms such as a matrix in the PI film cream solder part.

10 is a view of a state in which the LED element 120 is soldered to the PI film. The solder is melted by applying heat to the PI film cream solder and soldering the LED element to the PI film pattern.

11 is a perspective view of the adhesive attached to the base heat sink. 11 is to form an adhesive layer 300 by heating the adhesive on the base heat sink 200 made of a heat dissipating material. The heat dissipating material in the above may be a metal, ceramic, carbide, nitride, boride or composite, and the temperature for heating to attach the adhesive is to heat for 7 seconds at 100 ℃.

12 is a perspective view separated by cutting a unit product standard in the printed circuit PI film. 12 is a printed circuit film 400, the electrical circuit pattern is completed on the PI film ledger to cut the unit product 150 specifications in the printed circuit PI film to attach the unit product 150 on the base heat sink 200 The separation is shown.

FIG. 13 is a perspective view of a state in which an LED device is mounted on a heat sink base heat sink; FIG. After separating the LED device attached to the printed circuit PI film in the matrix form in FIG. 13 according to the unit product 150, the adhesive layer 300 is formed on the base heat sink 200, and then the unit printed circuit PI film is attached to the adhesive. After the layer 300 is formed on the base heat sink is formed by applying heat to attach. The temperature for heating in order to attach the unit printed circuit PI film attached to the upper part of the base heat sink is to heat for 7 seconds at 100 ℃. In addition, in order to maximize the adhesive force and remove bubbles, the air pressure of about 8kg / ㎠ and a temperature of 150 ℃ hot air is heated for 1 hour to maximize the adhesive force and remove the bubbles.

The LED module of the film type printed circuit attachment method manufactured through the manufacturing method as described above has advantages of low withstand voltage characteristics and simple manufacturing process, and thus has low manufacturing cost and low power consumption.

LED manufactured by the manufacturing method as described above has the advantage that can be used a lot in industry because the manufacturing method is easy to reduce the cost.

Claims

In the LED module manufacturing method of the film-type printed circuit attachment method for attaching the LED element to the base heat sink for illumination,

The film-type printed circuit attachment method LED module manufacturing method,

A first step (S21) of removing the release paper of the PI (polyimide) film;

A second step (S22) of coating the PI film by applying heat and pressure to the adhesive;

Printing in a variety of patterns using a paste containing a conductive material on the PI film surface coated with an adhesive (S23);

Immersing the PI film printed with the conductive paste in the Cu electrolyte and plating the same through electrolysis (S24);

Printing the SR paste on the Cu-plated PI film surface (S25);

Printing the cream solder on the PI film surface soldering unit (S26);

Automatically mounting the LED on the cream solder printing unit (S27);

Soldering the LED chip by applying heat to the cream solder after the LED is mounted (S28);

Attaching an adhesive to the base heat sink (S29);

Cutting the PI film ledger to separate into unit product standards (S30);

Attaching the unit printed circuit PI film by applying heat to the adhesive (S31);

And maximizing adhesive force by using air pressure and heat and removing bubbles (S32).
The method of claim 1,

Attaching the adhesive to the base heat sink,

Method of manufacturing a LED module of the film type printed circuit, characterized in that the adhesive is attached by applying heat for 7 seconds at a temperature of 100 ℃.
The method of claim 1,

Tempering the unit printed circuit PI film by applying heat to the adhesive,

Method of manufacturing an LED module with a film-type printed circuit, characterized in that the heat is applied for 7 seconds at a temperature of 100 ℃.
Maximizing the adhesive force by using the air pressure and heat and removing bubbles (S32),

The air pressure is 8kg / ㎠ and the temperature is heated for 1 hour at 150 ℃ to maximize the adhesive force and remove the bubbles, the film-type printed circuit attachment method LED module manufacturing method.
In the LED module manufacturing method of the film-type printed circuit attachment method for attaching the LED element to the base heat sink for illumination,

The film-type printed circuit attachment method LED module manufacturing method,

A first step (S21) of removing the release paper of the PI (polyimide) film;

A second step (S22) of coating the PI film by applying heat and pressure to the adhesive;

Printing in a variety of patterns using a paste containing a conductive material on the PI film surface coated with an adhesive (S23);

Immersing the PI film printed with the conductive paste in the Cu electrolyte and plating the same through electrolysis (S24);

Printing the SR paste on the Cu-plated PI film surface (S25);

Printing the cream solder on the PI film surface soldering unit (S26);

Automatically mounting the LED on the cream solder printing unit (S27);

Soldering the LED chip by applying heat to the cream solder after the LED is mounted (S28);

Attaching an adhesive to the base heat sink by applying heat at a temperature of 100 ° C. for 7 seconds;

Cutting and separating the PI film ledger to a unit product standard (S30);

Step S31 of applying heat to the adhesive for 7 seconds at a temperature of 100 ° C .;

And an air pressure of 8 kg / cm 2 and heating at a temperature of 150 ° C. for 1 hour to maximize adhesion and to remove bubbles (S32).
The method of claim 5,

LED module manufacturing method of the film-type printed circuit attachment method,

The method of manufacturing a LED module with a film type printed circuit, characterized in that further comprising the step of automatically printing the cream solder printing step (S26) and then printing the cream solder to the PI film surface soldering portion.
The method of claim 6,

LED module manufacturing method of the film-type printed circuit attachment method,

After the LED is mounted, the step of soldering the LED chip by applying heat to the cream solder, followed by the step of automatically checking the LED chip mounting state, soldering state, etc. Manufacturing method.