WO2014058131A1 - Procédé de fabrication de module del de type fixation sur couche à circuit imprimé - Google Patents

Procédé de fabrication de module del de type fixation sur couche à circuit imprimé Download PDF

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Publication number
WO2014058131A1
WO2014058131A1 PCT/KR2013/006114 KR2013006114W WO2014058131A1 WO 2014058131 A1 WO2014058131 A1 WO 2014058131A1 KR 2013006114 W KR2013006114 W KR 2013006114W WO 2014058131 A1 WO2014058131 A1 WO 2014058131A1
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WO
WIPO (PCT)
Prior art keywords
film
adhesive
printed circuit
led
printing
Prior art date
Application number
PCT/KR2013/006114
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English (en)
Korean (ko)
Inventor
이풍우
김정헌
Original Assignee
주식회사 이티엘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이티엘 filed Critical 주식회사 이티엘
Publication of WO2014058131A1 publication Critical patent/WO2014058131A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Definitions

  • the present invention relates to a method for manufacturing an LED module for mounting a plurality of LED elements on a base heat sink attached with a film type printed circuit printed with an electric circuit pattern using a conductive ink.
  • the film printed with the electric circuit pattern using the conductive ink has a simple manufacturing process and is easy to manufacture, and the film with the printed electric circuit pattern is attached to the base having a structure capable of dissipating heat generated from the LED. By doing so, problems caused by heat generation can be solved.
  • the conductive ink is a linear or branched saturated or unsaturated fatty acid substituted with an amino group, a nitrile group, etc.
  • the solution for forming a conductive line pattern consisting of a reactive organic solvent and a polar or nonpolar dilution solvent for viscosity adjustment may be an organosol ink or a conductive ink using metal nanoparticles.
  • FIG. 1 is a plan view of a conventional flexible LED module
  • FIG. 2 is a configuration diagram of a current supply unit printed by screen printing using conductive ink applied to a conventional flexible LED module.
  • the conventional flexible LED module includes a flexible heat sink 100, an LED 10, a current supply line unit 60, a current supply pad unit 50, and an LED support unit 20.
  • the flexible heat sink 100 is a heat sink that can be bent, for example, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyether, polyether It may be one of an imide (Polyether lmide) and polyarylate (PAR: polyarylate), the flexible heat sink 100 may be a heat sink that can be bent a metal heat sink may be used.
  • the metal heat sink may be a metal heat sink including a metal material of any one of aluminum, copper, gold, silver, and nickel having excellent thermal conductivity.
  • the LED 10 is a light emitting device, and is connected to the current supply line unit 60.
  • the connecting portion is to electrically connect the current supply line unit 60 and the LED 10 as a connecting means such as cream soldering, conductive adhesive.
  • the LEDs 10 are regularly arranged along the current supply line unit 60, and may be connected in series, and the current supply pad unit 50 may be formed at both sides of the flexible heat sink 100.
  • the current supply pad unit 50 is formed on the top and bottom surfaces of the flexible heat sink 100, respectively, and a conductive material including any one of gold, silver, copper, and nickel may be formed by a screen printing method. will be.
  • the current supply pad unit 50 may be formed of a conductive ink such as carbon paste on the flexible heat sink 100 by a screen printing method.
  • At least one current supply line unit 60 is formed on one surface of the flexible heat sink in one direction to supply current to the LED 10.
  • a plurality of the current supply line unit 60 is formed perpendicular to the current supply pad unit 50, and a plurality of the current supply line unit 60 is formed to be parallel to each other between the current supply pad units 50 on both sides of the current supply line unit 60.
  • Is a conductive material containing any one of gold, silver, copper and nickel is formed by the screen printing method or the current supply line unit 60 is formed by the screen printing method on the flexible heat sink 100 conductive ink such as carbon paste. Can be.
  • the current supply line unit 60 may be formed in the same process in the same manner as the current supply pad unit 50.
  • the current supply line unit 60 may be formed in a plurality of parallel arrangement, and the first current supply line 61a, the second current supply line 61b, the first connection bump 62a and the second connection bump ( 62b), the first current supply line 61a is connected to the first connection bump 62a, and the first current supply line 61a includes a plurality of current supply lines, and the number of LEDs 10 It will be formed in a corresponding number.
  • the second current supply line 61b is connected to the second connection bump 62b, and the second current supply line 61b includes a plurality of current supply lines, and corresponds one-to-one with the first current supply line 61a. It is formed to be a number.
  • the ⁇ terminal of the LED 10 is connected to the first connection bump 62a, and the + terminal of the LED 10 is connected to the second connection bump 62b, but the ⁇ terminal of the LED 10 is the first terminal. It is connected to the second connection bump 62b, the + terminal may be connected to the first connection bump 62a.
  • the LED 10 may be driven by its own resistance even though the current supply line unit 60 does not have a resistance.
  • the sum of the lengths of the first current supply line 61a and the second current supply line 61b connected to one LED is equal to the length of the first current supply line 61a and the second current supply line 61b connected to the other LED. Since the total resistance value between the lines of each current supply line of the current supply line unit 60 is the same as the sum of the lengths, the current supplied to the LED is uniform, and the luminance of the LED 10 can be made uniform. There is a characteristic.
  • the flexible heat sink applied to the conventional flexible LED module as described above is a metal heat sink including any one of metal materials of copper, gold, silver and nickel, and the current supply line 60 is printed on the flexible heat sink by a printing method.
  • the current supply line is electrically connected to each LED element through a connecting portion.
  • the flexible heat sink and the current supply line are made of a conductive conductor and are not electrically insulated, thereby increasing resistance. There is a problem such as a deviation of the brightness of the generated, low adhesion strength between the conductive ink particles to generate heat during conduction, or short circuit.
  • the conventional flexible LED module as described above includes a complex and difficult process to solve the need to apply the epoxy, silicon, acrylic material to each LED on a separate LED support to lower the adhesive strength of the printed circuit.
  • the LED module manufacturing method of the present invention film-type printed circuit attachment method for solving the problems of the prior art as described above to improve the adhesive force by printing the conductive pattern with conductive ink after printing the epoxy, silicon, acrylic-based on the PI film as a whole.
  • the manufacturing process is easy by attaching a PI film printed with a conductive pattern through various steps of electroplating through the electrode circuit pattern for forming 0 ⁇ resistance between the electrode circuits and attaching the LED element to heat sinks of various shapes.
  • circuit resistance of the electrical supply line of a conductive pattern is small, and to reduce the risk of a short circuit.
  • another object of the present invention is to facilitate the configuration of the conductive pattern in the heat sink of various shapes by using a film printed with a conductive pattern.
  • LED module manufacturing method of the film-type printed circuit attachment method of the present invention for solving the problems of the prior art as described above, the step of removing the release paper of the PI (polyimide) film, coating the PI film by applying heat and pressure to the adhesive And printing an electric circuit pattern using a paste containing a conductive material on a PI film surface coated with an adhesive, immersing the PI film printed with a conductive paste in a Cu electrolyte, and plating the same through electrolysis; Printing SR paste on Cu plated PI film surface, printing cream solder on PI film surface soldering part, automatically mounting LED on cream solder printing part, and putting on cream solder after LED mounting Soldering the LED chip by applying heat, attaching the adhesive to the aluminum bar, cutting the PI film ledger and separating it into unit products, and printing the unit It is by heating the PI film on the adhesive used in contact with the step, air pressure and heat to maximize adhesion and will, characterized in that made in a step for removing air bubbles
  • LED module manufacturing method of the film-type printed circuit attachment method of the present invention made as described above has the effect of having a low withstand cost characteristics and simple manufacturing process.
  • the LED module manufacturing method of the film-type printed circuit attachment method of the present invention has an effect that the electrical circuit configuration is easy to heat sink of various shapes.
  • 1 is a plan view of a conventional flexible LED module
  • FIG. 2 is a configuration diagram of a current supply printed by screen printing using conductive ink applied to a conventional flexible LED module
  • Figure 3 is a flow chart of the LED module manufacturing method of the film-type printed circuit attachment method of the present invention
  • Figure 4 is a separation configuration of the PI film ledger and release paper
  • FIG. 5 is a view showing that the adhesive coating on the PI film by applying heat and pressure
  • FIG. 6 is a view showing a pattern printed with a conductive paste
  • FIG. 10 is a view of a state in which the LED element is soldered to the PI film
  • FIG. 11 is a perspective view of an adhesive attached to an upper portion of a base heat sink
  • FIG. 13 is a perspective view of a state in which the LED element is mounted on the base heat sink.
  • FIG. 3 is a flow chart of the LED module manufacturing method of the film-type printed circuit attachment method of the present invention.
  • 3 is a method of manufacturing an LED module of a film-type printed circuit attachment method of the present invention, the first step (S21) of removing a release paper of a PI (polyimide) film, and an epoxy, silicone or acrylic adhesive on a PI film
  • Cu electrolyte After immersed in the electroplating step (S24), Cu-plated SR film on the PI film surface printing step (S25), PI film surface soldering portion printing step (S26) and Automatically mounting the LED to the cream solder printing unit (S27), and after mounting the LED to heat the cream solder soldering the LED chip (S28), and attaching the adhesive
  • the step of attaching the adhesive to the heat sink is attached to the adhesive by applying heat for 7 seconds at a temperature of 100 °C
  • the step of applying the unit printed circuit PI film by applying heat to the adhesive for 7 seconds at a temperature of 100 °C. It is appropriate to apply heat, and also by using the air pressure and heat to maximize the adhesive force and removing bubbles (S32) the air pressure is 8kg / cm2 and the temperature is heated at 150 °C for 1 hour to maximize the adhesive force To remove bubbles.
  • FIG. 4 is a separation configuration diagram of the PI film ledger 110 and the release paper 101. In Figure 4 it is shown to separate the release paper 101 from the PI film ledger 110 in order to coat the adhesive on the PI film.
  • FIG. 5 is a diagram illustrating coating an adhesive on a PI film by applying heat and pressure.
  • the adhesive shows coating by applying heat and pressure using a squeegee rubber and a screen frame.
  • FIG. 6 is a view showing a pattern on which a conductive paste is printed.
  • the conductive paste printed pattern forms various patterns and configures Cu to be plated on the patterns.
  • FIG. 7 is a view showing a pattern after Cu plating and a pattern on which an SR paste is printed.
  • the Cu plating and the SR paste are printed, after forming a pattern with a conductive paste, immersing in a Cu electrolyte and plating the Cu through electrolysis to print an SR paste.
  • FIG. 8 is a view of a cream solder printed on the PI film pattern surface.
  • the cream solder is printed on the PI film pattern side in FIG. 8 to solder and attach the LED to the pattern side.
  • FIG. 9 is a diagram in which an LED is mounted on a PI film cream solder part.
  • FIG. 9 shows that the plurality of LED elements 120 are mounted in various forms such as a matrix in the PI film cream solder part.
  • FIG 10 is a view of a state in which the LED element 120 is soldered to the PI film.
  • the solder is melted by applying heat to the PI film cream solder and soldering the LED element to the PI film pattern.
  • 11 is a perspective view of the adhesive attached to the base heat sink. 11 is to form an adhesive layer 300 by heating the adhesive on the base heat sink 200 made of a heat dissipating material.
  • the heat dissipating material in the above may be a metal, ceramic, carbide, nitride, boride or composite, and the temperature for heating to attach the adhesive is to heat for 7 seconds at 100 °C.
  • 12 is a perspective view separated by cutting a unit product standard in the printed circuit PI film.
  • 12 is a printed circuit film 400, the electrical circuit pattern is completed on the PI film ledger to cut the unit product 150 specifications in the printed circuit PI film to attach the unit product 150 on the base heat sink 200 The separation is shown.
  • FIG. 13 is a perspective view of a state in which an LED device is mounted on a heat sink base heat sink; FIG. After separating the LED device attached to the printed circuit PI film in the matrix form in FIG. 13 according to the unit product 150, the adhesive layer 300 is formed on the base heat sink 200, and then the unit printed circuit PI film is attached to the adhesive. After the layer 300 is formed on the base heat sink is formed by applying heat to attach. The temperature for heating in order to attach the unit printed circuit PI film attached to the upper part of the base heat sink is to heat for 7 seconds at 100 °C. In addition, in order to maximize the adhesive force and remove bubbles, the air pressure of about 8kg / cm2 and a temperature of 150 °C hot air is heated for 1 hour to maximize the adhesive force and remove the bubbles.
  • the LED module of the film type printed circuit attachment method manufactured through the manufacturing method as described above has advantages of low withstand voltage characteristics and simple manufacturing process, and thus has low manufacturing cost and low power consumption.
  • LED manufactured by the manufacturing method as described above has the advantage that can be used a lot in industry because the manufacturing method is easy to reduce the cost.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un module DEL de type accessoire sur couche à circuit imprimé consistant : à retirer le papier anti-adhérent d'une couche polyimide (PI) ; à revêtir la couche PI d'un adhésif en appliquant de la chaleur et de la pression ; à imprimer, à l'aide d'une pâte conductrice, divers motifs sur la surface de la couche PI revêtue d'adhésif ; à plaquer la couche PI par électrolyse une fois la couche PI insérée, imprimée à l'aide d'une pâte conductrice, dans un électrolyte de cuivre ; à étaler une colle SR sur la surface de la couche PI plaquée de cuivre ; à étaler une crème à braser sur des pièces de soudure de la surface de la couche PI ; à monter, automatiquement, des puces DEL sur les pièces sur lesquelles de la crème à braser a été appliquée ; une fois les DEL montées, à souder les DEL par application de chaleur ; à appliquer un adhésif sur une tôle pare-chaleur ; à découper la couche PI et à la séparer en des produits unitaires ; à fixer les unités de couche PI à circuit imprimé à un adhésif par application de chaleur ; et à éliminer des bulles et renforcer l'adhérence au moyen de pression d'air et de chaleur.
PCT/KR2013/006114 2012-10-09 2013-07-10 Procédé de fabrication de module del de type fixation sur couche à circuit imprimé WO2014058131A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120111826A KR101241271B1 (ko) 2012-10-09 2012-10-09 필름형 인쇄회로 부착방식의 led 모듈 제조 방법
KR10-2012-0111826 2012-10-09

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WO2014058131A1 true WO2014058131A1 (fr) 2014-04-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3324713A1 (fr) * 2016-11-22 2018-05-23 OSRAM GmbH Procédé de production de structures de support pour dispositifs d'éclairage et dispositif correspondant
CN111182735A (zh) * 2020-02-26 2020-05-19 东莞市天晖电子材料科技有限公司 一种led灯带用高透射单面板及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101535440B1 (ko) * 2015-02-11 2015-07-13 주식회사 에스티씨 필름형 인쇄회로 부착방식의 led 조명모듈 및 그 제조방법
JP2020159758A (ja) * 2019-03-25 2020-10-01 豊田合成株式会社 発光装置の製造方法および半田接合部検査装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090010982A (ko) * 2007-05-29 2009-01-30 파나소닉 주식회사 회로 기판 및 그 제조 방법
KR20090112626A (ko) * 2006-10-12 2009-10-28 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체 및 그의 응용
KR20110114494A (ko) * 2010-04-13 2011-10-19 박재순 발광 모듈 및 발광 모듈의 제조 방법
KR20120065273A (ko) * 2009-05-12 2012-06-20 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 변형가능 및 반투과 디스플레이를 위한 초박형, 미세구조 무기발광다이오드의 인쇄 어셈블리

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090112626A (ko) * 2006-10-12 2009-10-28 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체 및 그의 응용
KR20090010982A (ko) * 2007-05-29 2009-01-30 파나소닉 주식회사 회로 기판 및 그 제조 방법
KR20120065273A (ko) * 2009-05-12 2012-06-20 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 변형가능 및 반투과 디스플레이를 위한 초박형, 미세구조 무기발광다이오드의 인쇄 어셈블리
KR20110114494A (ko) * 2010-04-13 2011-10-19 박재순 발광 모듈 및 발광 모듈의 제조 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3324713A1 (fr) * 2016-11-22 2018-05-23 OSRAM GmbH Procédé de production de structures de support pour dispositifs d'éclairage et dispositif correspondant
CN111182735A (zh) * 2020-02-26 2020-05-19 东莞市天晖电子材料科技有限公司 一种led灯带用高透射单面板及其制备方法
CN111182735B (zh) * 2020-02-26 2024-01-26 东莞市天晖电子材料科技有限公司 一种led灯带用高透射单面板及其制备方法

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