WO2014058133A1 - Printed circuit film attachment-type led lighting apparatus - Google Patents

Printed circuit film attachment-type led lighting apparatus Download PDF

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Publication number
WO2014058133A1
WO2014058133A1 PCT/KR2013/006133 KR2013006133W WO2014058133A1 WO 2014058133 A1 WO2014058133 A1 WO 2014058133A1 KR 2013006133 W KR2013006133 W KR 2013006133W WO 2014058133 A1 WO2014058133 A1 WO 2014058133A1
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WO
WIPO (PCT)
Prior art keywords
film
led
printed circuit
adhesive
printing
Prior art date
Application number
PCT/KR2013/006133
Other languages
French (fr)
Korean (ko)
Inventor
이풍우
김정헌
Original Assignee
주식회사 이티엘
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Filing date
Publication date
Application filed by 주식회사 이티엘 filed Critical 주식회사 이티엘
Publication of WO2014058133A1 publication Critical patent/WO2014058133A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Definitions

  • the present invention relates to an LED lighting apparatus, wherein a plurality of LED elements are mounted on a base heat sink to which a film type printed circuit on which an electric circuit pattern is printed using conductive ink.
  • the film printed with the electric circuit pattern using the conductive ink has a simple manufacturing process and is easy to manufacture, and the film with the printed electric circuit pattern is attached to the base having a structure capable of dissipating heat generated from the LED. By doing so, problems caused by heat generation can be solved.
  • the conductive ink is disclosed in the Republic of Korea Patent Publication No. 10-2007-58816, a straight or branched saturated or unsaturated fatty acid substituted with an amino group, nitrile group, etc.
  • the aromatic carboxylic acid may be a solution silver organosol ink for forming a conductive line pattern composed of an effective amount and a reactive organic solvent forming a chelating agent or a complex with silver and a polar or nonpolar diluent for controlling viscosity, or a metal nanoparticle. It may be used conductive ink.
  • FIG. 1 is a plan view of a conventional flexible LED module
  • FIG. 2 is a configuration diagram of a current supply unit printed by screen printing using conductive ink applied to a conventional flexible LED module.
  • the conventional flexible LED module includes a flexible heat sink 100, an LED 10, a current supply line unit 60, a current supply pad unit 50, and an LED support unit 20.
  • the flexible heat sink 100 is a heat sink that can be bent, for example, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyether, polyether It may be one of an imide (Polyether lmide) and polyarylate (PAR: polyarylate), the flexible heat sink 100 may be a heat sink that can be bent a metal heat sink may be used.
  • the metal heat sink may be a metal heat sink including a metal material of any one of aluminum, copper, gold, silver, and nickel having excellent thermal conductivity.
  • the LED 10 is a light emitting device, and is connected to the current supply line unit 60.
  • the connecting portion is to electrically connect the current supply line unit 60 and the LED 10 as a connecting means such as cream soldering, conductive adhesive.
  • the LEDs 10 are regularly arranged along the current supply line unit 60, and may be connected in series, and the current supply pad unit 50 may be formed at both sides of the flexible heat sink 100.
  • the current supply pad unit 50 is formed on the top and bottom surfaces of the flexible heat sink 100, respectively, and a conductive material including any one of gold, silver, copper, and nickel may be formed by a screen printing method. will be.
  • the current supply pad unit 50 may be formed of a conductive ink such as carbon paste on the flexible heat sink 100 by a screen printing method.
  • At least one current supply line unit 60 is formed on one surface of the flexible heat sink in one direction to supply current to the LED 10.
  • a plurality of the current supply line unit 60 is formed perpendicular to the current supply pad unit 50, and a plurality of the current supply line unit 60 is formed to be parallel to each other between the current supply pad units 50 on both sides of the current supply line unit 60.
  • Is a conductive material containing any one of gold, silver, copper and nickel is formed by the screen printing method or the current supply line unit 60 is formed by the screen printing method on the flexible heat sink 100 conductive ink such as carbon paste. Can be.
  • the current supply line unit 60 may be formed in the same process in the same manner as the current supply pad unit 50.
  • the current supply line unit 60 may be formed in a plurality of parallel arrangement, and the first current supply line 61a, the second current supply line 61b, the first connection bump 62a and the second connection bump ( 62b), the first current supply line 61a is connected to the first connection bump 62a, and the first current supply line 61a includes a plurality of current supply lines, and the number of LEDs 10 It will be formed in a corresponding number.
  • the second current supply line 61b is connected to the second connection bump 62b, and the second current supply line 61b includes a plurality of current supply lines, and corresponds one-to-one with the first current supply line 61a. It is formed to be a number.
  • the ⁇ terminal of the LED 10 is connected to the first connection bump 62a, and the + terminal of the LED 10 is connected to the second connection bump 62b, but the ⁇ terminal of the LED 10 is the first terminal. It is connected to the second connection bump 62b, the + terminal may be connected to the first connection bump 62a.
  • the LED 10 may be driven by its own resistance even though the current supply line unit 60 does not have a resistance.
  • the sum of the lengths of the first current supply line 61a and the second current supply line 61b connected to one LED is equal to the length of the first current supply line 61a and the second current supply line 61b connected to the other LED. Since the total resistance value between the lines of each current supply line of the current supply line unit 60 is the same as the sum of the lengths, the current supplied to the LED is uniform, and the luminance of the LED 10 can be made uniform. There is a characteristic.
  • the flexible substrate applied to the conventional flexible LED module is a metal substrate including any one of copper, gold, silver and nickel, and a current supply line 60 is printed on the flexible substrate by a print printing method.
  • the current supply line is electrically connected to each LED element through a connecting portion.
  • the flexible substrate and the current supply line are made of a conductive conductor and are not electrically insulated, thereby increasing resistance. There is a problem such as a deviation of the brightness of the generated, the adhesion strength between the conductive ink particles is low, generating heat during conduction or short circuit.
  • the conventional flexible LED module as described above includes a complicated and difficult process for solving the need to apply the epoxy, silicon, acrylic material to each LED on a separate LED support to a low adhesion strength of the printed circuit.
  • LED lighting module of the present invention film-type printed circuit attachment method for solving the problems of the prior art as described above after printing the epoxy, silicon, acrylic-based on the PI film as a whole, the conductive pattern is printed with conductive ink to improve the adhesion It is easy to manufacture the process by attaching the PI film printed with conductive pattern through various steps of electroplating through the electrode circuit pattern for forming resistance between circuits to 0 ⁇ . This is to reduce the resistance and to reduce the risk of short circuit.
  • another object of the present invention by using a film printed with a conductive pattern to facilitate the configuration of the conductive pattern to the base heat sink of various shapes can be applied to various types of lighting device.
  • the LED lighting module of the film-type printed circuit attachment method of the present invention for solving the problems of the prior art as described above, the step of removing the release paper of the PI (polyimide) film, coating the PI film by applying heat and pressure to the adhesive And printing an electric circuit pattern using a paste containing a conductive material on the PI film surface coated with an adhesive, immersing the PI film printed with a conductive paste in a Cu electrolyte, and plating the same through electrolysis; Printing SR paste on the plated PI film surface, printing the cream solder on the PI film surface soldering part, automatically mounting the LED chip on the cream solder printing part, and cream solder after mounting the LED chip.
  • the LED lighting module of the film-type printed circuit attachment method of the present invention made as described above has the effect of having a low withstand cost because of excellent withstand voltage characteristics and a manufacturing process.
  • the LED lighting module of the film-type printed circuit attachment method of the present invention is easy to form an electric circuit pattern in the base heat sink of various shapes.
  • 1 is a plan view of a conventional flexible LED module
  • FIG. 2 is a configuration diagram of a current supply printed by screen printing using conductive ink applied to a conventional flexible LED module
  • Figure 3 is a flow chart of the LED module manufacturing method of the film-type printed circuit attachment method of the present invention
  • Figure 4 is a separation configuration of the PI film ledger and release paper
  • FIG. 5 is a view showing that the adhesive coating on the PI film by applying heat and pressure
  • FIG. 6 is a view showing a pattern printed with a conductive paste
  • FIG. 9 is a view showing a state in which the LED chip mounted to the PI film cream solder portion
  • FIG. 11 is a perspective view of an adhesive attached to an upper portion of a base heat sink
  • FIG. 13 is a perspective view of a state in which the LED chip is mounted on the base heat sink.
  • LED lighting module of the film-type printed circuit attachment method of the present invention for achieving the above object as follows.
  • FIG. 3 is a flow chart of the LED module manufacturing method applied to the LED lighting module of the film-type printed circuit attachment method of the present invention.
  • 3 is a method of manufacturing an LED module of a film-type printed circuit attachment method of the present invention (S21) of removing the release paper of the PI (polyimide) film, and the epoxy film of the release film is removed, epoxy, silicone or acrylic Coating the adhesive by applying heat and pressure (S22), printing the adhesive film on the PI film surface by using a paste including a conductive material in various patterns (S23), and the PI film on which the conductive paste is printed Immersing in a Cu electrolyte and plating through electrolysis (S24), printing the SR paste on the Cu-plated PI film surface (S25), and creaming on the PI film pattern surface on which the SR paste is printed Printing the solder (S26), automatically mounting the LED to the cream solder printing unit (S27), after mounting the LED and soldering the LED chip by applying heat to the cream solder (S
  • the step of printing the cream solder on the PI film surface soldering portion may be added to the step of automatically checking the cream solder printing, in addition, after the LED chip is mounted by applying heat to the cream solder solder the LED chip After the step of performing the step of automatically checking the LED chip mounting state, solder state, etc. can be further configured.
  • the step of attaching the adhesive to the heat sink is attached to the adhesive by applying heat for 7 seconds at a temperature of 100 °C
  • the step of applying the unit printed circuit PI film by applying heat to the adhesive for 7 seconds at a temperature of 100 °C It is appropriate to apply heat, and also by using the air pressure and heat to maximize the adhesive force and removing bubbles (S32) the air pressure is 8kg / cm2 and the temperature is heated at 150 °C for 1 hour to maximize the adhesive force To remove bubbles.
  • FIG. 4 is a separation configuration diagram of the PI film ledger 110 and the release paper 101. In Figure 4 it is shown to separate the release paper 101 from the PI film ledger 110 in order to coat the adhesive on the PI film.
  • FIG. 5 is a diagram illustrating coating an adhesive on a PI film by applying heat and pressure.
  • the adhesive shows coating by applying heat and pressure using a squeegee rubber and a screen frame.
  • FIG. 6 is a view showing a pattern on which a conductive paste is printed.
  • the conductive paste printed pattern forms various patterns and configures Cu to be plated on the patterns.
  • FIG. 7 is a view showing a pattern after Cu plating and a pattern on which an SR paste is printed.
  • the Cu plating and the SR paste are printed, after forming a pattern with a conductive paste, immersing in a Cu electrolyte and plating the Cu through electrolysis to print an SR paste.
  • FIG. 8 is a view of a cream solder printed on the PI film pattern surface.
  • the cream solder is printed on the PI film pattern side to solder the LED chip to the pattern side.
  • FIG. 9 is a diagram in which an LED chip is mounted on a PI film cream solder part.
  • FIG. 9 shows that the plurality of LED chips 120 are mounted in various forms such as a matrix in the PI film cream solder part.
  • FIG 10 is a view of a state in which the LED chip 120 is soldered to the PI film.
  • the solder is melted by applying heat to the PI film cream solder to solder the LED chip and PI film pattern.
  • 11 is a perspective view of the adhesive attached to the base heat sink. 11 is to form an adhesive layer 300 by heating the adhesive on the base heat sink 200 made of a heat dissipating material.
  • the heat dissipating material may be a metal, ceramic, carbide, nitride, boride or composite material, and the temperature for heating to attach the adhesive is heated at 100 ° C. for 7 seconds.
  • 12 is a perspective view of the printed circuit PI film separated by cutting unit PI circuit film.
  • 12 is a printed circuit PI film 400 in which electrical circuit patterns are completed on a PI film ledger, and a unit printed circuit PI film on a PI film ledger for attaching the unit printed circuit PI film 150 on the base heat sink 200. It cuts to 150 and shows separating.
  • Figure 13 is a perspective view of the present invention LED lighting module mounted LED chip on the base heat sink.
  • the air pressure of about 8kg / cm2 and a temperature of 150 °C hot air is heated for 1 hour to maximize the adhesive force and remove the bubbles.
  • the base heat sink 200 is made of a heat-dissipating material of metal, ceramic, carbide, nitride, boride, and in order to dissipate heat generated from the LED chip, air flows in parallel to the heat sink under the base heat sink 200.
  • Forming the space portion 220 and the inside of the space portion 220 is characterized in that formed in a variety of heat dissipation form 240, such as a branch form.
  • the LED lighting module of the film type printed circuit attachment method manufactured through the above manufacturing method has the advantages of excellent withstand voltage characteristics and simple manufacturing process, which has low manufacturing cost and low power consumption.
  • the LED lighting device of the present invention film-type printed circuit configured as described above is easy to manufacture and low power consumption can be widely used for general lighting and industrial lighting.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

A printed circuit film attachment-type lighting apparatus according to the present invention is manufactured by a method comprising the steps of: discarding the release paper from a polyimide (PI) film; coating the PI film with an adhesive by applying heat and pressure; printing, with a conductive paste, a set pattern on the surface of the adhesive-coated PI film; plating the PI film via electrolysis after inserting the PI film, printed with a conductive paste, into a Cu electrolyte; printing SR paste on the surface of the Cu-plated PI film; printing solder cream on soldering parts of the PI film surface; mounting, automatically, LED chips on the solder cream printed parts; after mounting the LEDs, soldering the LED chips by applying heat; applying adhesive to a heat-dissipation plate; cutting the PI film and separating into unit products; attaching the printed circuit PI film units to an adhesive by applying heat; and removing bubbles and maximizing adhesion by means of air pressure and heat.

Description

필름형 인쇄회로 부착방식의 엘이디 조명장치LED lighting device with film printed circuit attachment method
본 발명은 전도성 잉크를 이용하여 전기 회로 패턴을 인쇄한 필름형 인쇄회로를 부착한 베이스 방열판에 다수의 LED 소자를 실장한 것을 특징으로 하는 LED 조명장치에 관한 것이다. 상기와 같이 전도성 잉크를 이용하여 전기회로 패턴을 인쇄한 필름은 제조 공정이 간단하여 제조가 용이하고, 또한 LED로부터 발생하는 열을 방열할 수 있는 구조의 베이스에 전기회로 패턴이 인쇄된 필름을 부착함으로써 열 발생으로 인한 문제도 해결할 수 있는 것이다. 또한 상기 전도성 잉크는 대한민국 공개 특허공보 10-2007-58816호에 개시되어 있는 것으로 탄소수 2~16이고 1~3의 카르복실기를 가지는 아미노기, 니르토기 등으로 치환되는 직쇄 또는 분지상의 포화 또는 불포화 지방산은 방향족 카르복실산 은 유효량과 은과 킬레이트제 또는 착제를 형성하는 반응성 유기용매와 점도 조절용 극성 또는 비극성 희석용매로 이루어지는 도전선 패턴 형성을 위한 용액성 은 오르가노 졸 잉크일 수 있으며 또는 금속 나노 입자를 이용한 전도성 잉크일 수 있는 것이다.The present invention relates to an LED lighting apparatus, wherein a plurality of LED elements are mounted on a base heat sink to which a film type printed circuit on which an electric circuit pattern is printed using conductive ink. As described above, the film printed with the electric circuit pattern using the conductive ink has a simple manufacturing process and is easy to manufacture, and the film with the printed electric circuit pattern is attached to the base having a structure capable of dissipating heat generated from the LED. By doing so, problems caused by heat generation can be solved. In addition, the conductive ink is disclosed in the Republic of Korea Patent Publication No. 10-2007-58816, a straight or branched saturated or unsaturated fatty acid substituted with an amino group, nitrile group, etc. having 2 to 16 carbon atoms and having 1 to 3 carboxyl groups The aromatic carboxylic acid may be a solution silver organosol ink for forming a conductive line pattern composed of an effective amount and a reactive organic solvent forming a chelating agent or a complex with silver and a polar or nonpolar diluent for controlling viscosity, or a metal nanoparticle. It may be used conductive ink.
본 발명과 관련한 종래의 기술은 대한민국 등록 특허 제10-1171984호(2012. 08. 08)에 개시되어 있다. 도 1은 종래 플렉서블 LED 모듈 평면도이고, 도 2는 종래 플렉서블 LED 모듈에 적용되는 전도성 잉크를 이용하여 스크린 인쇄방식으로 인쇄된 전류 공급부 구성도이다. 상기도 1 내지 2에서 종래의 플렉서블 LED 모듈은 플렉서블 방열판(100), LED(10), 전류 공급 라인부(60), 전류 공급 패드부(50) 및 LED 지지부(20)를 포함하여 구성된 것이다. 상기에서 플렉서블 방열판(100)은 휘어질 수 있는 방열판으로 예를 들면, 폴리뷰틸렌 테레프탈레이트(Polybutylene Terephthalate), 폴리에틸렌 테레프탈레이트(polyethylene terephthalate), 폴리술폰(polysulfone), 폴리 에테르(polyether), 폴리 에테르 이미드(Polyether lmide) 및 폴리아릴레이트(PAR:polyarylate) 중 어느 하나일 수 있으며, 또한, 플렉서블 방열판(100)은 휘어질 수 있는 방열판으로 금속 방열판이 사용될 수 있다. 금속 방열판으로는 열 전도성이 우수한 알루미늄, 구리, 금, 은 및 니켈 중 어느 하나의 금속 물질을 포함하는 금속 방열판일 수 있는 것이다. 상기에서 LED(10)는 발광 소자로서, 전류 공급 라인부(60)와 연결되어 형성된다. 이때, 연결부는 크림솔더링, 전도성 접착제 등의 연결수단으로서 전류 공급 라인부(60)와 LED(10)를 전기적으로 연결하는 것이다. 또한, LED(10)는 전류 공급 라인부(60)를 따라 규칙적으로 배열되며, 직렬로 연결될 수 있으며, 전류 공급 패드부(50)는 플렉서블 방열판(100)의 양측에 형성될 수 있다. 또한, 전류 공급 패드부(50)는 플렉서블 방열판(100)의 상단면과 하단면에 각각 형성되는 것으로 금, 은, 구리 및 니켈 중 어느 하나를 포함하는 전도성 물질이 스크린 인쇄방법으로 형성될 수 있는 것이다. 또한, 전류 공급 패드부(50)는 카본 페이스트 등의 전도성 잉크가 플렉서블 방열판(100) 위에 스크린 인쇄방법으로 형성될 수는 것이다. 또한, 전류 공급 라인부(60)는 플렉서블 방열판의 일 면에 일 방향으로 적어도 하나가 형성되는 것으로 LED(10)에 전류를 공급하는 것이다. 이러한 전류 공급 라인부(60)는 전류 공급 패드부(50)에 수직으로 복수개가 형성되며, 양측의 전류 공급 패드부(50) 사이에 복수개가 서로 나란하게 형성되는 것으로 상기 전류 공급 라인부(60)는 금, 은, 구리 및 니켈 중 어느 하나를 포함하는 전도성 물질이 스크린 인쇄방법으로 형성되거나 전류 공급 라인부(60)는 카본 페이스트 등의 전도성 잉크가 플렉서블 방열판(100) 위에 스크린 인쇄방법으로 형성될 수 있다. 여기서, 전류 공급 라인부(60)는 전류 공급 패드부(50)와 동일한 방법으로 동일 공정에서 형성될 수 있는 것이다. 또한, 전류 공급 라인부(60)는 다수가 병렬 형태의 배열로 형성될 수 있으며 제1 전류 공급선(61a), 제2 전류 공급선(61b), 제1 연결 범프(62a) 및 제2 연결 범프(62b)를 포함하는 것으로 제1 전류 공급선(61a)은 제1 연결 범프(62a)와 연결되는 구조이고, 또한 제1 전류 공급선(61a)은 복수의 전류 공급선을 포함하며, LED(10) 개수에 상응하는 개수로 형성되는 것이다. 또한, 제2 전류 공급선(61b)은 제2 연결 범프(62b)와 연결되는 것으로 제2 전류 공급선(61b)은 복수의 전류 공급선을 포함하며, 제1 전류 공급선(61a)과 1대1로 대응되는 개수로 형성되는 것이다. 또한, LED(10)의 - 단자는 제1 연결 범프(62a)에 연결되고, LED(10)의 + 단자는 제2 연결 범프(62b)에 연결되는 것이나, LED(10)의 - 단자는 제2 연결 범프(62b)에 연결되고, + 단자는 제1 연결 범프(62a)와 연결될 수도 있는 것이다. 또한, 전류 공급 라인부(60)가 전도성 잉크로 형성될 경우 자체 저항을 포함하므로 전류 공급 라인부(60)에 별도로 저항이 구비되지 않아도 자체 저항으로 LED(10)의 구동이 가능하다. 이때, 어느 하나의 LED에 연결되는 제1 전류공급선(61a)과 제2 전류 공급선(61b)의 길이의 합은 다른 LED에 연결되는 제1 전류 공급선(61a)과 제2 전류 공급선(61b)의 길이의 합과 동일하게 형성되는 것으로 전류 공급 라인부(60)의 각각의 전류 공급선들의 회선간 전체 저항값이 동일하므로 LED에 공급되는 전류가 균일하여, LED(10)의 휘도를 균일하게 할 수 있는 특징이 있는 것이다.Conventional technology related to the present invention is disclosed in Korean Patent Registration No. 10-1171984 (August 08, 2012). 1 is a plan view of a conventional flexible LED module, and FIG. 2 is a configuration diagram of a current supply unit printed by screen printing using conductive ink applied to a conventional flexible LED module. 1 to 2, the conventional flexible LED module includes a flexible heat sink 100, an LED 10, a current supply line unit 60, a current supply pad unit 50, and an LED support unit 20. The flexible heat sink 100 is a heat sink that can be bent, for example, polybutylene terephthalate, polyethylene terephthalate, polysulfone, polyether, polyether, polyether It may be one of an imide (Polyether lmide) and polyarylate (PAR: polyarylate), the flexible heat sink 100 may be a heat sink that can be bent a metal heat sink may be used. The metal heat sink may be a metal heat sink including a metal material of any one of aluminum, copper, gold, silver, and nickel having excellent thermal conductivity. In the above, the LED 10 is a light emitting device, and is connected to the current supply line unit 60. At this time, the connecting portion is to electrically connect the current supply line unit 60 and the LED 10 as a connecting means such as cream soldering, conductive adhesive. In addition, the LEDs 10 are regularly arranged along the current supply line unit 60, and may be connected in series, and the current supply pad unit 50 may be formed at both sides of the flexible heat sink 100. In addition, the current supply pad unit 50 is formed on the top and bottom surfaces of the flexible heat sink 100, respectively, and a conductive material including any one of gold, silver, copper, and nickel may be formed by a screen printing method. will be. In addition, the current supply pad unit 50 may be formed of a conductive ink such as carbon paste on the flexible heat sink 100 by a screen printing method. In addition, at least one current supply line unit 60 is formed on one surface of the flexible heat sink in one direction to supply current to the LED 10. A plurality of the current supply line unit 60 is formed perpendicular to the current supply pad unit 50, and a plurality of the current supply line unit 60 is formed to be parallel to each other between the current supply pad units 50 on both sides of the current supply line unit 60. ) Is a conductive material containing any one of gold, silver, copper and nickel is formed by the screen printing method or the current supply line unit 60 is formed by the screen printing method on the flexible heat sink 100 conductive ink such as carbon paste. Can be. Here, the current supply line unit 60 may be formed in the same process in the same manner as the current supply pad unit 50. In addition, the current supply line unit 60 may be formed in a plurality of parallel arrangement, and the first current supply line 61a, the second current supply line 61b, the first connection bump 62a and the second connection bump ( 62b), the first current supply line 61a is connected to the first connection bump 62a, and the first current supply line 61a includes a plurality of current supply lines, and the number of LEDs 10 It will be formed in a corresponding number. In addition, the second current supply line 61b is connected to the second connection bump 62b, and the second current supply line 61b includes a plurality of current supply lines, and corresponds one-to-one with the first current supply line 61a. It is formed to be a number. In addition, the − terminal of the LED 10 is connected to the first connection bump 62a, and the + terminal of the LED 10 is connected to the second connection bump 62b, but the − terminal of the LED 10 is the first terminal. It is connected to the second connection bump 62b, the + terminal may be connected to the first connection bump 62a. In addition, when the current supply line unit 60 is formed of a conductive ink, and includes a self resistance, the LED 10 may be driven by its own resistance even though the current supply line unit 60 does not have a resistance. At this time, the sum of the lengths of the first current supply line 61a and the second current supply line 61b connected to one LED is equal to the length of the first current supply line 61a and the second current supply line 61b connected to the other LED. Since the total resistance value between the lines of each current supply line of the current supply line unit 60 is the same as the sum of the lengths, the current supplied to the LED is uniform, and the luminance of the LED 10 can be made uniform. There is a characteristic.
상기와 같은 종래 플렉서블 LED 모듈에 적용되는 플렉서블 기판은 구리, 금, 은 및 니켈 중 어느 하나의 금속 물질을 포함하는 금속 기판으로서 상기 플렉서블 기판에 전류 공급라인(60)이 프린트 인쇄 방법에 의하여 인쇄되고 상기 전류 공급라인은 연결부를 통하여 각 LED 소자에 연결되어 전기적으로 도통하는 것으로 플렉서블 기판과 전류 공급라인이 도전성 도체로 이루어지고 전기적으로 절연되지 아니하여 저항이 커지므로 각 LED부의 전압편차가 발생하여 빛의 밝기의 편차가 발생되고, 전도성 잉크 입자간의 부착강도가 낮아 도통 중에 열을 발생하거나 회로 단락 등의 문제점이 있는 것이다. 또한 상기와 같은 종래 플렉서블 LED 모듈은 인쇄회로부의 부착강도가 낮아 별도의 LED 지지부에 에폭시, 실리콘, 아크릴계의 물질을 각 LED에 도포하여야 해결하는 복잡하고 난해한 공정이 포함되어 있는 것이다. 상기와 같은 종래 기술의 문제점을 해결하기 위한 본 발명 필름형 인쇄회로 부착방식의 LED 조명 모듈은 PI 필름에 에폭시, 실리콘, 아크릴계를 전체적으로 인쇄한 후 전도성 잉크로 도전성 패턴을 인쇄하므로 접착력을 향상시키고 전극회로 간의 저항을 0Ω으로 형성하기 위한 전극회로 패턴에 통전하여 전해 도금하는 단계를 통한 도전성 패턴이 인쇄된 PI필름을 다양한 형상의 방열판에 부착하는 것으로 제조 공정이 용이하고 도전성 패턴의 전기 공급 라인의 회로 저항이 작고 단락 등의 위험이 적도록 하기 위한 것이다. 또한 본 발명의 다른 목적은 전도성 패턴이 인쇄된 필름을 이용함으로써 다양한 형상의 베이스 방열판에도 도전성 패턴 구성이 용이하도록 하여 다양한 형상의 조명 장치에 응용될 수 있는 것이다.The flexible substrate applied to the conventional flexible LED module is a metal substrate including any one of copper, gold, silver and nickel, and a current supply line 60 is printed on the flexible substrate by a print printing method. The current supply line is electrically connected to each LED element through a connecting portion. The flexible substrate and the current supply line are made of a conductive conductor and are not electrically insulated, thereby increasing resistance. There is a problem such as a deviation of the brightness of the generated, the adhesion strength between the conductive ink particles is low, generating heat during conduction or short circuit. In addition, the conventional flexible LED module as described above includes a complicated and difficult process for solving the need to apply the epoxy, silicon, acrylic material to each LED on a separate LED support to a low adhesion strength of the printed circuit. LED lighting module of the present invention film-type printed circuit attachment method for solving the problems of the prior art as described above after printing the epoxy, silicon, acrylic-based on the PI film as a whole, the conductive pattern is printed with conductive ink to improve the adhesion It is easy to manufacture the process by attaching the PI film printed with conductive pattern through various steps of electroplating through the electrode circuit pattern for forming resistance between circuits to 0Ω . This is to reduce the resistance and to reduce the risk of short circuit. In addition, another object of the present invention by using a film printed with a conductive pattern to facilitate the configuration of the conductive pattern to the base heat sink of various shapes can be applied to various types of lighting device.
상기와 같은 종래기술의 문제점을 해결하기 위한 본 발명의 필름형 인쇄회로 부착방식의 LED 조명 모듈은 PI(폴리이미드)필름의 이형지를 제거하는 단계와, PI 필름에 접착제를 열과 압력을 가하여 코팅하는 단계와, 접착제가 코팅된 PI 필름면에 전도성 물질을 포함한 페이스트를 이용한 전기회로 패턴으로 인쇄하는 단계와, 전도성 페이스트가 인쇄된 PI 필름을 Cu 전해액에 담근 후 전기 분해를 통하여 도금하는 단계와, Cu가 도금된 PI 필름 면에 SR 페이스트를 인쇄하는 단계와, PI 필름면 납땜부에 크림솔더를 인쇄하는 단계와, 크림솔더 인쇄부에 LED 칩을 자동으로 실장하는 단계와, LED 칩 실장 후 크림솔더에 열을 가하여 LED 칩을 납땜하는 단계와, 베이스 방열판에 접착제를 부착하는 단계와, PI 필름 원장을 잘라 단위 인쇄회로 PI 필름으로 분리하는 단계와, 단위 인쇄회로 PI 필름을 베이스 방열판의 접착제에 열을 가하여 가접하는 단계와, 공기 압력과 열을 이용하여 접착력을 극대화하고 기포를 제거하는 단계를 포함하여 제조된 것으로 베이스 방열판에 다수의 LED 칩을 다양한 형태로 부착, 납땜된 단위 인쇄회로 PI 필름을 부착하여 이루어진 것을 특징으로 하는 것이다.The LED lighting module of the film-type printed circuit attachment method of the present invention for solving the problems of the prior art as described above, the step of removing the release paper of the PI (polyimide) film, coating the PI film by applying heat and pressure to the adhesive And printing an electric circuit pattern using a paste containing a conductive material on the PI film surface coated with an adhesive, immersing the PI film printed with a conductive paste in a Cu electrolyte, and plating the same through electrolysis; Printing SR paste on the plated PI film surface, printing the cream solder on the PI film surface soldering part, automatically mounting the LED chip on the cream solder printing part, and cream solder after mounting the LED chip. Soldering the LED chip by applying heat to it, attaching an adhesive to the base heat sink, and cutting the PI film ledger and separating it into a unit printed circuit PI film And a step of attaching the unit printed circuit PI film to the base heat sink by applying heat to the adhesive, and maximizing adhesion and removing bubbles by using air pressure and heat. It is characterized in that made in the form of affixed in various forms, a soldered unit printed circuit PI film.
상기와 같이 이루어진 본 발명의 필름형 인쇄회로 부착방식의 LED 조명 모듈은 우수한 내전압 특성과 제조 공정이 단순하여 제조비가 적게 드는 효과가 있는 것이다. 또한 본 발명의 필름형 인쇄회로 부착방식의 LED 조명 모듈은 다양한 형상의 베이스 방열판에도 전기 회로 패턴 형성이 용이한 효과가 있는 것이다. The LED lighting module of the film-type printed circuit attachment method of the present invention made as described above has the effect of having a low withstand cost because of excellent withstand voltage characteristics and a manufacturing process. In addition, the LED lighting module of the film-type printed circuit attachment method of the present invention is easy to form an electric circuit pattern in the base heat sink of various shapes.
도 1은 종래 플렉서블 LED 모듈 평면도, 1 is a plan view of a conventional flexible LED module,
도 2는 종래 플렉서블 LED 모듈에 적용되는 전도성 잉크를 이용하여 스크린 인쇄방식으로 인쇄된 전류 공급부 구성도,2 is a configuration diagram of a current supply printed by screen printing using conductive ink applied to a conventional flexible LED module;
도 3은 본 발명의 필름형 인쇄회로 부착방식의 LED 모듈 제조 방법 흐름도,Figure 3 is a flow chart of the LED module manufacturing method of the film-type printed circuit attachment method of the present invention,
도 4는 PI 필름 원장과 이형지의 분리 구성도,Figure 4 is a separation configuration of the PI film ledger and release paper,
도 5는 PI 필름에 접착제를 열과 압력을 가하여 코팅한 것을 나타내는 도면,5 is a view showing that the adhesive coating on the PI film by applying heat and pressure,
도 6은 전도성 페이스트가 인쇄된 패턴을 나타내는 도면,6 is a view showing a pattern printed with a conductive paste,
도 7은 Cu 도금 후의 패턴과 SR 페이스트가 인쇄된 패턴을 나타낸 도면,7 shows a pattern after Cu plating and a pattern on which an SR paste is printed;
도 8은 PI 필름 패턴면에 크림솔더를 인쇄한 상태의 도면,8 is a view of the cream solder printed on the PI film pattern surface;
도 9는 PI 필름 크림솔더부에 LED 칩을 실장한 상태의 도면,9 is a view showing a state in which the LED chip mounted to the PI film cream solder portion;
도 10은 PI 필름에 LED 칩 납땜이 완료된 상태의 도면,10 is a view of the LED chip soldering is completed on the PI film,
도 11은 베이스 방열판 상부에 접착제를 부착한 상태의 사시도,11 is a perspective view of an adhesive attached to an upper portion of a base heat sink;
도 12는 PI 필름 원장에서 개별 단위 인쇄회로 PI필름을 커팅하여 분리된 사시도,12 is a perspective view separated by cutting the individual unit printed circuit PI film in the PI film ledger,
도 13은 베이스 방열판에 LED 칩이 장착한 상태의 사시도 이다.13 is a perspective view of a state in which the LED chip is mounted on the base heat sink.
상기와 같은 목적을 달성하기 위한 본 발명의 필름형 인쇄회로 부착방식의 LED 조명 모듈을 도 3 내지 도 13을 참고로 하여 설명하면 다음과 같다.Referring to Figures 3 to 13 LED lighting module of the film-type printed circuit attachment method of the present invention for achieving the above object as follows.
도 3은 본 발명의 필름형 인쇄회로 부착방식의 LED 조명 모듈에 적용되는 LED 모듈 제조방법에 관한 흐름도이다. 상기도 3에서 본 발명의 필름형 인쇄회로 부착방식의 LED 모듈 제조 방법은 PI(폴리이미드)필름의 이형지를 제거하는 단계(S21)와, 상기 이형지가 제거된 PI 필름에 에폭시, 실리콘 또는 아크릴계의 접착제를 열과 압력을 가하여 코팅하는 단계(S22)와, 상기 접착제가 코팅된 PI 필름면에 전도성 물질을 포함한 페이스트를 이용하여 다양한 패턴으로 인쇄하는 단계(S23)와, 상기 전도성 페이스트가 인쇄된 PI 필름을 Cu 전해액에 담근 후 전기 분해를 통하여 도금하는 단계(S24)와, 상기 Cu가 도금된 PI 필름 면에 SR 페이스트를 인쇄하는 단계(S25)와, 상기 SR 페이스트가 인쇄된 PI 필름 패턴 면에 크림솔더를 인쇄하는 단계(S26)와, 상기 크림솔더 인쇄부에 LED를 자동으로 실장하는 단계(S27)와, LED 실장 후 크림솔더에 열을 가하여 LED 칩을 납땜하는 단계(S28)와, 베이스 방열판에 접착제를 부착하는 단계(S29)와, LED 칩 납땜이 완료된 PI 필름을 잘라 단위 인쇄회로 PI 필름으로 분리하는 단계(S30)와, 단위 인쇄회로 PI 필름을 상기 베이스 방열판의 접착제에 열을 가하여 가접하는 단계(S31)와, 공기 압력과 열을 이용하여 접착력을 극대화하고 기포를 제거하는 단계(S32)로 이루어진 것이다. 상기에서 PI 필름면 납땜부에 크림솔더를 인쇄하는 단계(S26) 다음에 크림솔더 인쇄를 자동으로 검사하는 단계가 추가될 수 있으며, 또한, LED 칩 실장 후 크림솔더에 열을 가하여 LED 칩을 납땜하는 단계 후에 LED 칩 실장 상태, 납땜 상태 등을 자동으로 검사하는 단계를 추가로 구성할 수 있는 것이다. 또한, 상기 방열판에 접착제를 부착하는 단계는 온도 100℃에서 7초 동안 열을 가하여 접착제를 부착하는 것이고, 상기 단위 인쇄회로 PI 필름을 접착제에 열을 가하여 가접하는 단계는 온도 100℃에서 7초 동안 열을 가하는 것이 적당하며, 또한 상기 공기 압력과 열을 이용하여 접착력을 극대화하고 기포를 제거하는 단계(S32)에서 가하여지는 공기 압력은 8kg/㎠이고 온도는 150℃에서 1시간 가열하여 접착력을 극대화하고 기포를 제거하는 것이다.Figure 3 is a flow chart of the LED module manufacturing method applied to the LED lighting module of the film-type printed circuit attachment method of the present invention. 3 is a method of manufacturing an LED module of a film-type printed circuit attachment method of the present invention (S21) of removing the release paper of the PI (polyimide) film, and the epoxy film of the release film is removed, epoxy, silicone or acrylic Coating the adhesive by applying heat and pressure (S22), printing the adhesive film on the PI film surface by using a paste including a conductive material in various patterns (S23), and the PI film on which the conductive paste is printed Immersing in a Cu electrolyte and plating through electrolysis (S24), printing the SR paste on the Cu-plated PI film surface (S25), and creaming on the PI film pattern surface on which the SR paste is printed Printing the solder (S26), automatically mounting the LED to the cream solder printing unit (S27), after mounting the LED and soldering the LED chip by applying heat to the cream solder (S28), the base room Attaching an adhesive to a plate (S29), cutting the PI film on which LED chip soldering is completed, and separating the unit printed circuit PI film (S30), and applying unit heat to the adhesive of the base heat sink Step (S31) and the step of maximizing the adhesive force by using the air pressure and heat to remove the bubbles (S32). After the step of printing the cream solder on the PI film surface soldering portion (S26) may be added to the step of automatically checking the cream solder printing, in addition, after the LED chip is mounted by applying heat to the cream solder solder the LED chip After the step of performing the step of automatically checking the LED chip mounting state, solder state, etc. can be further configured. In addition, the step of attaching the adhesive to the heat sink is attached to the adhesive by applying heat for 7 seconds at a temperature of 100 ℃, the step of applying the unit printed circuit PI film by applying heat to the adhesive for 7 seconds at a temperature of 100 ℃. It is appropriate to apply heat, and also by using the air pressure and heat to maximize the adhesive force and removing bubbles (S32) the air pressure is 8kg / ㎠ and the temperature is heated at 150 ℃ for 1 hour to maximize the adhesive force To remove bubbles.
도 4는 PI 필름 원장(110)과 이형지(101)의 분리 구성도이다. 상기도 4에서 PI 필름에 접착제를 코팅하기 위하여 PI 필름 원장(110)에서 이형지(101)를 분리하는 것을 나타내고 있는 것이다. 4 is a separation configuration diagram of the PI film ledger 110 and the release paper 101. In Figure 4 it is shown to separate the release paper 101 from the PI film ledger 110 in order to coat the adhesive on the PI film.
도 5는 PI 필름에 접착제를 열과 압력을 가하여 코팅하는 것을 나타내는 도면이다. 상기도 5에서 접착제는 스퀴지 러버와 스크린 프레임을 이용하여 열과 압력을 가하여 코팅하는 것을 나타내고 있는 것이다.FIG. 5 is a diagram illustrating coating an adhesive on a PI film by applying heat and pressure. FIG. In FIG. 5, the adhesive shows coating by applying heat and pressure using a squeegee rubber and a screen frame.
도 6은 전도성 페이스트가 인쇄된 패턴을 나타내는 도면이다. 상기도 6에서 전도성 페이스트 인쇄 패턴은 다양한 패턴을 형성하고 상기 패턴에 Cu가 도금될 수 있도록 구성하는 것이다.6 is a view showing a pattern on which a conductive paste is printed. In FIG. 6, the conductive paste printed pattern forms various patterns and configures Cu to be plated on the patterns.
도 7은 Cu 도금 후의 패턴과 SR 페이스트가 인쇄된 패턴을 나타낸 도면이다. 상기도 7에서 Cu 도금과 SR 페이스트의 인쇄는 전도성 페이스트로 패턴을 형성한 후에 Cu 전해액에 담가 전기 분해를 통하여 Cu를 도금한 후에 SR 페이스트를 인쇄하는 것이다.7 is a view showing a pattern after Cu plating and a pattern on which an SR paste is printed. In FIG. 7, the Cu plating and the SR paste are printed, after forming a pattern with a conductive paste, immersing in a Cu electrolyte and plating the Cu through electrolysis to print an SR paste.
도 8은 PI 필름 패턴 면에 크림솔더를 인쇄한 상태의 도면이다. 상기도 8에서 PI 필름 패턴 면에 크림솔더를 인쇄하는 것은 상기 패턴 면에 LED 칩을 납땜하여 부착하기 위한 것이다.8 is a view of a cream solder printed on the PI film pattern surface. In FIG. 8, the cream solder is printed on the PI film pattern side to solder the LED chip to the pattern side.
도 9는 PI 필름 크림솔더부에 LED 칩을 실장한 상태의 도면이다. 상기도 9에서 PI 필름 크림솔더부에 다수의 LED 칩(120)이 행렬과 같은 다양한 형태로 실장되는 것을 나타내고 있는 것이다.FIG. 9 is a diagram in which an LED chip is mounted on a PI film cream solder part. FIG. 9 shows that the plurality of LED chips 120 are mounted in various forms such as a matrix in the PI film cream solder part.
도 10은 PI 필름에 LED 칩(120)이 납땜이 완료된 상태의 도면이다. PI 필름 크림솔더부에 열을 가하여 크림솔더가 녹아서 LED 칩과 PI 필름 패턴 면에 납땜이 이루어지는 것이다.10 is a view of a state in which the LED chip 120 is soldered to the PI film. The solder is melted by applying heat to the PI film cream solder to solder the LED chip and PI film pattern.
도 11은 베이스 방열판 상부에 접착제를 부착한 상태의 사시도 이다. 상기도 11에서 방열소재로 이루어진 베이스 방열판(200) 상부에 접착제를 가열하여 접착제 층(300)을 형성하는 것이다. 상기에서 방열 소재는 금속,세라믹, 탄화물, 질화물, 붕화물 또는 복합재료 일 수 있으며 또한, 접착제를 부착하기 위하여 가열하는 온도는 100℃에서 7초 동안 가열하는 것이다.11 is a perspective view of the adhesive attached to the base heat sink. 11 is to form an adhesive layer 300 by heating the adhesive on the base heat sink 200 made of a heat dissipating material. The heat dissipating material may be a metal, ceramic, carbide, nitride, boride or composite material, and the temperature for heating to attach the adhesive is heated at 100 ° C. for 7 seconds.
도 12는 인쇄회로 PI 필름에서 단위 인쇄회로 PI 필름으로 커팅하여 분리된 사시도 이다. 상기도 12은 PI 필름 원장에 전기 회로 패턴이 완성된 인쇄회로 PI 필름 (400)으로서 베이스 방열판(200) 상부에 단위 인쇄회로 PI필름(150)을 부착하기 위하여 PI 필름원장에서 단위 인쇄회로 PI필름(150)으로 커팅하여 분리하는 것을 나타내고 있는 것이다.12 is a perspective view of the printed circuit PI film separated by cutting unit PI circuit film. 12 is a printed circuit PI film 400 in which electrical circuit patterns are completed on a PI film ledger, and a unit printed circuit PI film on a PI film ledger for attaching the unit printed circuit PI film 150 on the base heat sink 200. It cuts to 150 and shows separating.
도 13은 베이스 방열판에 LED 칩을 장착한 상태의 본 발명 LED 조명 모듈 사시도 이다. 상기도 13에서 행렬과 같은 다양한 형태의 인쇄회로 PI 필름에 부착된 LED 칩을 단위 인쇄회로 PI필름(150)으로 분리한 후 베이스 방열판(200)에 접착제 층(300)을 형성한 후에 단위 인쇄회로 PI 필름을 상기 접착제 층(300)이 형성된 베이스 방열판 상부에 위치시킨 후 열을 가하여 부착하는 것이다. 상기에서 베이스 방열판 상부에 부착된 단위 인쇄회로 PI 필름을 부착하기 위하여 가열하는 온도는 100℃에서 7초 동안 가열하는 것이다. 또한 접착력을 극대화하고 기포를 제거하기 위하여 공기 압력 8kg/㎠ 정도이고 온도 150℃인 열풍을 1시간 가열하여 접착력을 극대화하고 기포를 제거하는 것이다. 또한 상기에서 베이스 방열판(200)은 금속, 세라믹, 탄화물, 질화물, 붕화물의 방열소재로 이루어지고, LED 칩으로부터 발생하는 열을 방산하기 위하여 베이스 방열판(200) 하부에는 방열판과 평행하게 공기가 유통하는 공간부(220)를 형성하고 상기 공간부(220) 내에는 다시 나뭇가지 형태 등의 다양한 열방산 형태(240)로 형성된 것을 특징으로 하는 것이다.Figure 13 is a perspective view of the present invention LED lighting module mounted LED chip on the base heat sink. After separating the LED chip attached to the printed circuit PI film of various forms such as the matrix in FIG. 13 into the unit printed circuit PI film 150, and then forming the adhesive layer 300 on the base heat sink 200, the unit printed circuit The PI film is positioned on the base heat sink on which the adhesive layer 300 is formed, and then attached by applying heat. The temperature for heating in order to attach the unit printed circuit PI film attached to the base heat sink in the above is to heat for 7 seconds at 100 ℃. In addition, in order to maximize the adhesive force and remove bubbles, the air pressure of about 8kg / ㎠ and a temperature of 150 ℃ hot air is heated for 1 hour to maximize the adhesive force and remove the bubbles. In addition, the base heat sink 200 is made of a heat-dissipating material of metal, ceramic, carbide, nitride, boride, and in order to dissipate heat generated from the LED chip, air flows in parallel to the heat sink under the base heat sink 200. Forming the space portion 220 and the inside of the space portion 220 is characterized in that formed in a variety of heat dissipation form 240, such as a branch form.
상기와 같은 제조 방법을 통하여 제조된 필름형 인쇄회로 부착방식의 LED 조명 모듈은 우수한 내전압 특성과 제조 공정이 단순하여 제조 비용이 적게 들며 전력 소모가 적은 장점이 있는 것이다.The LED lighting module of the film type printed circuit attachment method manufactured through the above manufacturing method has the advantages of excellent withstand voltage characteristics and simple manufacturing process, which has low manufacturing cost and low power consumption.
상기와 같이 구성된 본 발명 필름형 인쇄회로 부착방식의 엘이디 조명장치는 제조가 용이하고 전력 소비가 적어서 일반 조명 및 산업 조명용으로 널리 사용할 수 있는 것이다.The LED lighting device of the present invention film-type printed circuit configured as described above is easy to manufacture and low power consumption can be widely used for general lighting and industrial lighting.

Claims (7)

  1. LED 소자를 베이스 방열판에 부착하여 조명하기 위한 필름형 인쇄회로 부착방식의 LED 조명 모듈에 있어서,In the LED lighting module of the film-type printed circuit attachment method for attaching the LED element to the base heat sink for illumination,
    상기 필름형 인쇄회로 부착방식의 LED 조명 모듈은,The film-type printed circuit attachment method LED lighting module,
    PI(폴리이미드)필름의 이형지를 제거하는 제1단계(S21)와, PI 필름에 접착제를 열과 압력을 가하여 코팅하는 제2단계(S22)와, 접착제가 코팅된 PI 필름면에 전도성 물질을 포함한 페이스트를 이용하여 다양한 패턴으로 인쇄하는 단계(S23)와, 전도성 페이스트가 인쇄된 PI 필름을 Cu 전해액에 담근 후 전기 분해를 통하여 도금하는 단계(S24)와, Cu가 도금된 PI 필름 면에 SR 페이스트를 인쇄하는 단계(S25)와, PI 필름면 납땜부에 크림솔더를 인쇄하는 단계(S26)와, 크림솔더 인쇄부에 LED를 자동으로 실장하는 단계(S27)와, LED 실장 후 크림솔더에 열을 가하여 LED 칩을 납땜하는 단계(S28)와, 베이스 방열판에 접착제를 부착하는 단계(S29)와, PI 필름 원장을 단위제품 규격으로 커팅하여 분리하는 단계(S30)와, 단위인쇄회로 PI 필름을 접착제에 열을 가하여 가접하는 단계(S31)와, 및 공기 압력과 열을 이용하여 접착력을 극대화하고 기포를 제거하는 단계(S32)로 이루어진 것을 특징으로 하는 필름형 인쇄회로 부착방식의 LED 조명 모듈.The first step (S21) of removing the release paper of the PI (polyimide) film, the second step (S22) of applying the adhesive to the PI film by applying heat and pressure, and the conductive film on the PI film surface coated with the adhesive Printing in various patterns using a paste (S23), immersing a PI film printed with a conductive paste in a Cu electrolyte solution, and plating the same through electrolysis (S24), and an SR paste on a Cu-plated PI film surface Printing (S25), printing the cream solder on the PI film surface soldering unit (S26), and automatically mounting the LED on the cream solder printing unit (S27), and heat the cream solder after mounting the LED Applying a soldering step to the LED chip (S28), attaching an adhesive to the base heat sink (S29), cutting the PI film ledger to the unit product standard (S30) and separating the unit printed circuit PI film Step (S31) and the step of applying a heat to the adhesive And, using the air pressure and heat to maximize the adhesive force and removing bubbles (S32) LED type light module of the printed circuit attachment method, characterized in that consisting of.
  2. 제1항에 있어서,The method of claim 1,
    상기 베이스 방열판은,The base heat sink is,
    금속, 세라믹, 탄화물, 질화물, 붕화물 또는 복합재질의 베이스 방열판인 것을 특징으로 하는 필름형 인쇄회로 부착방식의 LED 조명 모듈.Film type printed circuit attachment type LED lighting module, characterized in that the base heat sink of metal, ceramic, carbide, nitride, boride or composite material.
  3. 제2항에 있어서,The method of claim 2,
    상기 필름형 인쇄회로 부착방식의 LED 조명 모듈은,The film-type printed circuit attachment method LED lighting module,
    상기 베이스 방열판 하부에 공기가 흐를 수 있는 공간부(220)를 더 포함하여 구성된 것을 특징으로 하는 필름형 인쇄회로 부착방식의 LED 조명 모듈.Film-type printed circuit attachment method LED lighting module, characterized in that further comprises a space 220 through which air flows under the base heat sink.
  4. 제3항에 있어서,The method of claim 3,
    상기 필름형 인쇄회로 부착방식의 LED 조명 모듈은,The film-type printed circuit attachment method LED lighting module,
    상기 공간부(220) 내부에 열방산 형태(140)를 더 구성하여 이루어진 것을 특징으로 하는 필름형 인쇄회로 부착방식의 LED 조명 모듈.Film-type printed circuit attachment type LED lighting module, characterized in that the heat dissipation form 140 is further configured in the space 220.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 공기 압력과 열을 이용하여 접착력을 극대화하고 기포를 제거하는 단계(S32)는,Maximizing the adhesive force by using the air pressure and heat and removing bubbles (S32),
    상기 공기 압력은 8kg/㎠이고 온도는 150℃에서 1시간 가열하여 접착력을 극대화하고 기포를 제거하는 것을 특징으로 하는 필름형 인쇄회로 부착방식의 LED 조명 모듈.The air pressure is 8kg / ㎠ and the temperature is heated for 1 hour at 150 ℃ to maximize the adhesive force and remove the bubbles LED film module of the method of attaching film type.
  6. 제5항에 있어서,The method of claim 5,
    필름형 인쇄회로 부착방식의 LED 조명 모듈은,LED lighting module of film type printed circuit attachment method,
    상기 PI 필름면 납땜부에 크림솔더를 인쇄하는 단계(S26) 다음에 크림솔더 인쇄를 자동으로 검사하는 단계를 더 포함하여 이루어진 것을 특징으로 하는 필름형 인쇄회로 부착방식의 LED 조명 모듈.The step of printing the cream solder to the PI film surface soldering portion (S26) and then the step of automatically checking the cream solder printing, LED type lighting module of the film type circuit printing method characterized in that it further comprises.
  7. 제6항에 있어서,The method of claim 6,
    필름형 인쇄회로 부착방식의 LED 조명 모듈은,LED lighting module of film type printed circuit attachment method,
    상기 LED 실장 후 크림솔더에 열을 가하여 LED 소자를 납땜하는 단계 다음에 LED 칩 실장 상태, 납땜 상태 등을 자동으로 검사하는 단계를 더 포함하여 이루어진 것을 특징으로 하는 필름형 인쇄회로 부착방식의 LED 조명 모듈.After the LED is mounted, the step of soldering the LED element by applying heat to the cream solder, and then the step of automatically inspecting the LED chip mounting state, soldering state, etc. module.
PCT/KR2013/006133 2012-10-09 2013-07-10 Printed circuit film attachment-type led lighting apparatus WO2014058133A1 (en)

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KR1020120111841A KR101258120B1 (en) 2012-10-09 2012-10-09 Led lighting module manufactured by printed circuit of film type

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Citations (4)

* Cited by examiner, † Cited by third party
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KR20090010982A (en) * 2007-05-29 2009-01-30 파나소닉 주식회사 Circuit board and manufacturing method thereof
KR20090112626A (en) * 2006-10-12 2009-10-28 캄브리오스 테크놀로지즈 코포레이션 Nanowire-based transparent conductors and applications thereof
KR20110114494A (en) * 2010-04-13 2011-10-19 박재순 Light emitting module and method of producing of the same
KR20120065273A (en) * 2009-05-12 2012-06-20 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

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Publication number Priority date Publication date Assignee Title
KR20090112626A (en) * 2006-10-12 2009-10-28 캄브리오스 테크놀로지즈 코포레이션 Nanowire-based transparent conductors and applications thereof
KR20090010982A (en) * 2007-05-29 2009-01-30 파나소닉 주식회사 Circuit board and manufacturing method thereof
KR20120065273A (en) * 2009-05-12 2012-06-20 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
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