KR20180005331A - PCB Patern Structure for Radiation of LED Module - Google Patents

PCB Patern Structure for Radiation of LED Module Download PDF

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Publication number
KR20180005331A
KR20180005331A KR1020160085204A KR20160085204A KR20180005331A KR 20180005331 A KR20180005331 A KR 20180005331A KR 1020160085204 A KR1020160085204 A KR 1020160085204A KR 20160085204 A KR20160085204 A KR 20160085204A KR 20180005331 A KR20180005331 A KR 20180005331A
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South Korea
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pattern
cathode
anode
pcb
connection pattern
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KR1020160085204A
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Korean (ko)
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오형희
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(주) 유영일렉컴
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Publication of KR20180005331A publication Critical patent/KR20180005331A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a structure of a heat radiation pattern of a PCB of an LED module, which is provided to radiate heat generated by an LED more efficiently by forming a copper foil pattern of a circuit pattern of the PCB of the module for LED lighting as wide as possible. The structure of the heat radiation pattern of the PCB comprises: anode side and a cathode side power supply terminals formed at the center of the PCB to supply power to each LED device; an anode parallel connection pattern connected to the anode side power supply terminal and configured so that the anode side lands of the central first land patterns in respective sectors are connected in parallel around a center hole; a cathode parallel connection pattern formed in a closed circuit on the peripheral surface of the PCB so that cathode lands of the last land patterns in the respective sectors are connected in parallel; a series connection pattern connecting the land patterns from the first land pattern to the last land pattern in each sector are connected in series; and a cathode power connection pattern connecting the cathode side power supply terminal and the cathode parallel connection pattern, wherein the anode and cathode parallel connection patterns, the series connection pattern, and a cathode power supply pattern are formed of a copper foil pattern, and the width of the copper foil pattern is greater than the width of an insulation region for insulating the copper foil pattern at predetermined intervals.

Description

엘이디모듈 PCB의 방열패턴{PCB Patern Structure for Radiation of LED Module}[0001] The present invention relates to an LED module,

본 발명은 발광소자(LED)조명용 모듈의 방열효과를 높이기 위한 인쇄회로기판(PCB)패턴 구조에 관한 것으로서, LED조명용 모듈의 PCB 회로패턴을 최대한 넓은 면적으로 구성하므로 LED에서 발생된 열을 보다 효율적으로 방출하도록 하는 LED모듈 PCB 방열패턴 형성구조에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board (PCB) pattern structure for enhancing a heat radiation effect of a module for lighting a light emitting device (LED), and a PCB circuit pattern of the module for LED lighting is configured as wide as possible, To an LED module PCB heat radiation pattern forming structure.

최근 LED는 조명용 광원으로 각광받고 있으며 많은 등기구에서 이를 채택하여 사용하고 있다. LED 자체는 50000시간 이상의 긴수명을 보장하고 있으나 이를 채택한 조명기구에서는 전원공급장치의 내구성 및 LED에서 발생하는 열을 효과적으로 방출하지 못하면 이로 인하여 고장 및 제품 수명의 현저한 저하가 발생하게 된다.In recent years, LED has been widely used as a light source for lighting, and many luminaire have adopted it. The LED itself guarantees a long service life of more than 50000 hours. However, in a lighting apparatus employing the LED, the durability of the power supply and the heat generated by the LED can not be effectively released.

또한, 전력효율의 저하와 LED 밝기의 감소등 성능에 있어서도 열화가 발생한다. 특히 전력소비가 커지는 3W, 5W급의 LED를 사용하는 경우 방열문제가 매우 중요하게 되며 이를 위하여 Metal PCB 및 방열 페인트의 도포, 방열판의 부착등 비용이 커지게 되는 문제점이 있었다.In addition, deterioration also occurs in performance, such as lowering of power efficiency and reduction of LED brightness. Particularly, when 3W and 5W class LEDs having high power consumption are used, heat dissipation problem becomes very important and there is a problem in that the cost of application of metal PCB, heat radiation paint, attachment of heat sink is increased.

도 1은 종래기술에 따른 LED조명 PCB패턴 구조도로서, PCB(10)에 LED소자를 직렬로 연결하기 위한 애노드단자와 캐소드단자의 직렬연결선(11)은 단지 전기적인 연결만을 고려하여 좁은 전원라인으로 연결되어 있어, 발생된 열을 방출하는데 전혀 효과를 기대할 수 없는 문제점이 있었다.FIG. 1 is a structural view of an LED lighting PCB pattern according to the prior art, in which an anode terminal for connecting an LED element in series to a PCB 10 and a series connection line 11 of a cathode terminal are connected to a narrow power line There is a problem in that no effect can be expected at the time of releasing the generated heat.

따라서, 본 발명은 LED 조명용 모듈의 방열효과를 높이기 위한 인쇄회로기판(PCB)패턴 구조에 관한 것으로서, 보다 상세하게는 LED조명용 모듈의 PCB 동박회로패턴을 최대한 넓은 면적으로 구성하므로 LED에서 발생된 열을 보다 효율적으로 방출하도록 하는 LED모듈 PCB 방열패턴 형성구조를 제공하는데 그 목적이 있다.Accordingly, the present invention relates to a printed circuit board (PCB) pattern structure for enhancing the heat radiation effect of an LED lighting module, and more particularly, to a PCB pattern of a LED lighting module, And more particularly, to an LED module PCB heat dissipation pattern forming structure that allows the LED module to emit light more efficiently.

본 발명에 따른 LED모듈 PCB 방열패턴 형성구조는 중앙에 홀(111)이 형성된 원형의 PCB 상에 상기 중앙홀을 중심으로 다수개의 부채꼴 섹터(101~106)로 나누고, 각 섹터(101~106)별로 다수개의 LED소자가 방사형으로 직렬연결되도록 각 LED소자에 해당하는 랜드패턴이 형성되고, 상기 각 섹터(101~106)는 병렬로 연결되도록 회로가 구성된 LED모듈 PCB의 패턴 형성구조에 있어서, 상기 PCB(100)의 중앙에 형성되어 각 LED소자에 전원을 공급하는 애노드(+)측 및 캐소드(-)측 전원공급단자(112)(113); The LED module PCB heat dissipation pattern forming structure according to the present invention includes a circular PCB having a hole 111 formed at the center thereof, a plurality of sector sectors 101 to 106 centering on the center hole, A pattern forming structure of a LED module PCB having a circuit pattern in which a plurality of LED elements are connected in series so as to be radially connected in series, and a circuit is formed so that each of the sectors 101 to 106 is connected in parallel, (+) Side and cathode (-) side power supply terminals 112 and 113 formed at the center of the PCB 100 to supply power to the respective LED elements;

상기 애노드측 전원공급단자(112)와 연결되며, 중앙 홀(111) 주변에서 각 섹터별로 중앙의 첫번째 랜드패턴(121~126)들 각각의 애노드측 랜드가 병렬연결 되도록 형성된 원형의 애노드 병렬연결패턴(120); 상기 각 섹터별 마지막 랜드패턴(161~166)들 각각의 캐소드측 랜드가 병렬 연결되도록 PCB(100)의 외주면에 폐회로로 형성된 캐소드 병렬연결패턴(160); A circular anode parallel connection pattern formed to be connected to the anode side power supply terminal 112 and configured such that the anode lands of each of the center first land patterns 121 to 126 are connected in parallel around the center hole 111, (120); A cathode parallel connection pattern 160 formed on the outer circumferential surface of the PCB 100 as a closed circuit so that the cathode lands of the last land patterns 161 to 166 of each sector are connected in parallel;

상기 각 섹터별 랜드패턴(121~126)에서 마지막 랜드패턴(161~166)까지의 각 랜드패턴들을 직렬연결하는 직렬연결패턴(130); 및 상기 캐소드측 전원공급단자(113)와 상기 캐소드 병렬연결패턴(160)을 연결하는 캐소드 전원연결패턴(114);으로 구성하되, 상기 애노드, 캐소드 병렬연결패턴(120)(160), 직렬연결패턴(130) 및 캐소드 전원공급패턴(114)은 동박패턴으로 형성되며, 상기 동박패턴의 폭이 상기 각 동박패턴을 일정간격으로 절연시키기 위한 절연영역 폭보다 더 넓게 형성된 것을 특징으로 한다.A serial connection pattern 130 for serially connecting each land pattern from the land patterns 121 to 126 to the last land patterns 161 to 166; And a cathode power connection pattern 114 connecting the cathode side power supply terminal 113 and the cathode parallel connection pattern 160. The anode connection pattern 120, The pattern 130 and the cathode power supply pattern 114 are formed in a copper foil pattern, and the width of the copper foil pattern is formed to be wider than an insulating region width for insulating the respective copper foil patterns at regular intervals.

본 발명의 실시예에 따른 LED모듈 PCB의 방열패턴 형성구조는 PCB기판의 동박패턴 영역의 면적을 최대로 하고, 동박패턴의 절연영역의 면적을 최소화하여 전체 PCB기판에 열이 고르게 분포하도록 하며, 별도의 방열판 또는 방열도료의 도포를 하는 경우라도 방열판, 방열도료에서의 복사 및 대류에 의한 방열효과를 높여주는 효과가 있으며, 메탈기판으로의 열전달이 매우 빠르게 이루어져 방열효과를 높여주는 효과가 있다.The heat dissipation pattern forming structure of the LED module PCB according to the embodiment of the present invention maximizes the area of the copper foil pattern area of the PCB substrate and minimizes the area of the insulating area of the copper foil pattern, Even when a separate heat radiating plate or heat radiating coating is applied, heat radiating effect by radiation and convection in the heat radiating plate and heat radiating coating is enhanced, and heat transfer to the metal substrate is performed very quickly, thereby enhancing the heat radiating effect.

또한, 본 발명에 따른 방열 패턴을 적용한 회로는 동박 패턴의 면적이 최대가 되므로 전기 저항이 최소화되어 전원공급장치에서 여러단의 LED소자를 거쳐가면서 전류가 입력되는 경우 최소한의 전압강하를 만들어주며 불필요한 전력소모를 줄여주는 효과가 있다.In addition, since the area of the copper foil pattern is maximized in the circuit using the heat radiation pattern according to the present invention, the electric resistance is minimized, and when a current is inputted through the LED devices in the power supply device, the voltage drop is minimized. It has the effect of reducing power consumption.

도 1은 종래기술에 따른 LED조명용 PCB 패턴의 구조도이고,
도 2는 본 발명의 실시예에 따른 LED모듈 PCB의 방열패턴 형성 구조도이고,
도 3은 도 2에 장착된 LED 회로도이고,
도 4는 도 2에서 PCB의 중앙부의 확대 구조도이고,
도 5는 도 2에서 랜드패턴의 상세 구성도이다.1 is a structural view of a conventional PCB pattern for LED illumination,
FIG. 2 is a view illustrating a heat radiation pattern forming structure of an LED module PCB according to an embodiment of the present invention,
Fig. 3 is an LED circuit diagram mounted in Fig. 2,
FIG. 4 is an enlarged structural view of a central portion of the PCB in FIG. 2,
5 is a detailed configuration diagram of the land pattern in FIG.

본 발명의 실시예에 따른 LED모듈 PCB의 방열패턴 형성구조는 도 2 내지 도 5를 참조하여 보다 상세히 설명하면 다음과 같다.The heat dissipation pattern forming structure of the LED module PCB according to the embodiment of the present invention will be described in more detail with reference to FIG. 2 to FIG.

도 2는 본 발명의 실시예에 따른 LED모듈 PCB의 평면 구성도이고, 도 4는 도 2에서 PCB기판에 LED소자를 연결하는 회로 구성도로서, 중앙에 홀(111)이 형성된 원형의 PCB(100) 상에 상기 중앙홀을 중심으로 6개의 부채꼴 섹터(101~106)로 나누고, 각 섹터(101~106)내에 12개의 LED소자가 방사형으로 직렬연결되도록 랜드패턴이 형성되며, 상기 PCB(100)의 중앙홀 주변은 LED소자의 애노드(+)단자와 병렬 연결되도록 애노드 병렬연결패턴(120)을 형성하며, PCB(100)의 외주면은 각 섹터의 마지막 랜드패턴(161~166)의 캐소드측이 병렬연결되도록 캐소드 병렬연결패턴(160)을 형성한다.FIG. 2 is a plan view of an LED module PCB according to an embodiment of the present invention. FIG. 4 is a circuit diagram of an LED device connected to a PCB substrate in FIG. A land pattern is formed so that twelve LED elements are radially connected in series in each of the sectors 101 to 106, and the PCB 100 (100) is divided into six sectors 101 to 106, The anode parallel connection pattern 120 is formed so as to be connected in parallel with the anode terminal of the LED device and the outer circumferential surface of the PCB 100 is connected to the cathode side of the last land patterns 161 to 166 of each sector The cathode parallel connection pattern 160 is formed.

상기 캐소드 병렬연결패턴(160)은 넓은 폭을 갖는 폐회로의 동박패턴으로 구성된다.The cathode parallel connection pattern 160 is composed of a copper foil pattern of a closed circuit having a wide width.

또한, 상기 PCB(100)의 각 병렬 연결패턴(120)(160), 직렬연결패턴(130) 및 각 랜드패턴(121~126)(161~166)를 포함한 모든 랜드패턴은 동박패턴으로 형성하되, 상기 각 동박패턴의 면적을 최대한 넓게 형성하고, 각 동박패턴을 절연하기 위한 절연영역의 면적보다 최대한 좁게 형성한다. 바람직하게는 상기 동박패턴 영역의 면적은 90%~95%로 형성하고, 상기 절연영역의 면적은 10~5%로 형성하도록 한다.In addition, all the land patterns including the parallel connection patterns 120, 160, the serial connection patterns 130 and the land patterns 121 to 126 (161 to 166) of the PCB 100 are formed in a copper foil pattern , The area of each of the copper foil patterns is formed as wide as possible, and the area of the insulating area for insulating each copper foil pattern is formed as narrow as possible. Preferably, the area of the copper foil pattern region is 90% to 95%, and the area of the insulating region is 10% to 5%.

이와 같이 동박패턴을 넓게 형성하므로 LED구동시 발생된 열을 메탈 기판에 빠르게 전달하여, 방열효과를 높이게 된다.Since the copper foil pattern is widely formed in this manner, the heat generated during the operation of the LED is rapidly transferred to the metal substrate, thereby enhancing the heat radiation effect.

도 3은 도 2의 PCB에 LED소자를 연결하는 회로 구성도로서, 12개의 직렬연결된 LED소자(LED1~LED12)가 6개 섹터(101~106)로 병렬연결 된다.FIG. 3 is a circuit configuration diagram for connecting LED devices to the PCB of FIG. 2, in which twelve serially connected LED devices LED1 to LED12 are connected in parallel to six sectors 101 to 106. FIG.

도 4는 도 2에서 중앙부의 상세 구성도로서, 상기 중앙홀(111) 주변에 각 섹터(101~106)의 LED소자에 전원을 공급하는 애노드(+)측 및 캐소드(-)측 전원공급단자(112)(113)가 각각 형성되고, 상기 중앙홀(111)을 통해 PCB(100)의 하단으로부터 전원공급라인(+)(-)이 관통하여 각 애노드(+)측 및 캐소드(-)측 전원공급단자(112)(113)와 와어어 본딩을 하게 된다.FIG. 4 is a detailed view of the central part in FIG. 2, showing the anode (+) side and the cathode (-) side power supply terminal for supplying power to the LED elements of the respective sectors 101 to 106 around the center hole 111, (+) (-) from the lower end of the PCB 100 pass through the center hole 111 and are connected to the anode (+) side and the cathode (-) side And the power supply terminal 112 (113).

각 섹터(101~106)별로 중앙의 첫번째 랜드패턴(121~126)들 각각의 애노드측 랜드가 병렬연결 되도록 중앙 홀(111) 주변에서 원형의 애노드 병렬연결패턴(120)을 형성한다.A circular anode parallel connection pattern 120 is formed around the center hole 111 so that the anode lands of each of the first land patterns 121 to 126 in the center are connected in parallel for each sector 101 to 106.

여기서, 상기 애노드 병렬연결패턴(120)의 일측은 개방부(116)를 형성하여 상기 개방부(116)를 통해 캐소드 전원연결패턴(114)이 상기 캐소드측 전원공급단자(113)와 외주면에 형성된 상기 캐소드 병렬연결패턴(160)이 연결되도록 한다.One side of the anode parallel connection pattern 120 forms an opening 116 and a cathode power connection pattern 114 is formed on the outer peripheral surface of the cathode side power supply terminal 113 through the opening 116 So that the cathode parallel connection pattern 160 is connected.

도 5는 도 4에서 LED가 본딩장착되는 랜드패턴의 형상을 설명하기 위한 일실예를 보인 도로서, 랜드패턴은 LED제조사에 따라 형상이 다양하나, 본 발명에서는 애노드 및 캐소드측에 각각 3개씩의 랜드를 형성된 랜트패턴에 대하여 설명하면 다음과 같다.FIG. 5 shows an example for explaining the shape of the land pattern to which the LED is bonded in FIG. 4. The shape of the land pattern varies depending on the manufacturer of the LED. In the present invention, The land pattern formed by the land will be described as follows.

상기 LED소자가 장착되는 각 랜드패턴은 애노드 및 캐소드측 랜드(140)(150)가 형성되며, 상기 각 랜드(140)(150)는 각각 3개의 솔더단자(141)(151)를 형성하고, 상기 애노드측 랜드(140)는 애노드측 3개의 솔더단자(141)를 하나로 3점 연결하고, 3점 연결된 솔더단자(141)와 직렬연결패턴(130)을 연결하는 하나의 애노드 단자연결부(142)가 형성되고, 상기 캐소드측 랜드(150)는 상기 캐소드측 3개의 솔더단자(151)가 각각 직렬연결패턴(130)에 연결되도록 캐소드단자 연결부(152)를 형성한다.Each of the land patterns 140 and 150 on which the LED elements are mounted are formed with anode and cathode lands 140. The lands 140 and 150 form three solder terminals 141 and 151, The anode side land 140 includes three anode terminal 141 and one anode terminal connection 142 for connecting the solder terminal 141 and the serial connection pattern 130, And the cathode side land 150 forms a cathode terminal connection part 152 such that the three cathode side solder terminals 151 are connected to the series connection pattern 130, respectively.

특히, LED소자에서 발생된 열은 애노드측 보다 캐소드측이 더 많이 발생하므로, 캐소드측 랜드(150)의 패턴은 3개의 솔더단자(151)와 직렬연결패턴(130)을 각각 캐소드단자 연결부(152)로 연결되도록 구성한다.In particular, since the heat generated from the LED device is more on the cathode side than on the anode side, the pattern of the cathode side land 150 is formed by connecting the three solder terminals 151 and the series connection pattern 130 to the cathode terminal connection 152 ).

이와 같이 형성된 연결패턴은 LED패키지 작업시 상기 전원공급단자(112)(113)에 전원연결라인을 와이어본딩시 발생되는 열이 캐소드 병렬연결패턴(160)을 통해 외부로 전달되도록 하고, LED소자를 PCB(100)에 솔더링시 랜드패드를 통해 전도되는 열을 효율적으로 확산시킴으로 LED의 접합온도(Tj)가 높아지지 않도록 하여 LED소자의 수명 및 성능에 영향을 미치지 않도록 한다.In this connection pattern, the heat generated when the power supply line is wire-bonded to the power supply terminals 112 and 113 during the LED package operation is transmitted to the outside through the cathode parallel connection pattern 160, It is possible to effectively diffuse the heat conducted through the land pad to the PCB 100 during soldering so that the junction temperature Tj of the LED is not increased so that the lifetime and the performance of the LED device are not affected.

한편, PCB(100)에 LED소자가 장착되는 하단 위치에 방열패드를 부착하여 LED소자 동작시 방열 효과를 더 높이도록 한다.On the other hand, a heat dissipation pad is attached to the lower end of the PCB 100 where the LED device is mounted, so that the heat dissipation effect during operation of the LED device is further enhanced.

100 : PCB 101 ~ 106 : 부채꼴 섹터
111 : 중앙홀 112,113 : 애노드, 캐소드 전원공급단자
114 : 캐소드 전원공급라인 116 : 개방부
120 : 애노드 병렬연결패턴 121 ~ 126 : 각 섹터별 첫번째 랜드패턴
130 : 직렬연결패턴 140, 150 : 애노드, 캐소드측 랜드
141,151 : 애노드, 캐소드측 3점 솔더단자
142,152 : 애노드, 캐소드 솔더단자 연결부
160 : 캐소드 병렬연결패턴 161 ~ 166 : 각 섹터별 마지막 랜드패턴100: PCB 101 ~ 106: sector of the sector
111: center hole 112, 113: anode, cathode power supply terminal
114: cathode power supply line 116:
120: anode parallel connection pattern 121 ~ 126: first land pattern for each sector
130: serial connection pattern 140, 150: anode, cathode side land
141,151: anode, cathode side three-point solder terminal
142,152: anode, cathode solder terminal connection
160: Cathode parallel connection pattern 161 to 166: Last land pattern for each sector

Claims (4)

중앙에 홀(111)이 형성된 원형의 PCB(100) 상에 상기 중앙홀(111)을 중심으로 다수개의 부채꼴 섹터(101~106)로나누고, 각 섹터(101~106)별로 다수개의 LED소자가 방사형으로 직렬연결되도록 각 LED소자에 해당하는 랜드패턴이 형성되고, 상기 각 섹터(101~106)는 병렬로 연결되도록 회로가 구성된 LED모듈 PCB의 패턴 형성구조에 있어서,
상기 PCB(100)의 중앙에 형성되어 각 LED소자에 전원을 공급하는 애노드(+)측 및 캐소드(-)측 전원공급단자(112)(113);
상기 애노드측 전원공급단자(112)와 연결되며, 중앙 홀(111) 주변에서 각 섹터별로 중앙의 첫번째 랜드패턴(121~126)들 각각의 애노드측 랜드가 병렬연결 되도록 형성된 원형의 애노드 병렬연결패턴(120);
상기 각 섹터별 마지막 랜드패턴(161~166)들 각각의 캐소드측 랜드가 병렬 연결되도록 PCB(100)의 외주면에 폐회로로 형성된 캐소드 병렬연결패턴(160); 및
상기 각 섹터별 첫번째 랜드패턴(121~126)에서 마지막 랜드패턴(161~166)까지의 각 랜드패턴들을 직렬연결하는 직렬연결패턴(130); 및
상기 캐소드측 전원공급단자(113)와 상기 캐소드 병렬연결패턴(160)을 연결하는 캐소드 전원연결패턴(114);으로 구성하되,
상기 애노드, 캐소드 병렬연결패턴(120)(160), 직렬연결패턴(130) 및 캐소드 전원공급패턴(114)은 동박패턴으로 형성되며, 상기 동박패턴의 폭이 상기 각 동박패턴을 일정간격으로 절연시키기 위한 절연영역 폭보다 더 넓게 형성된 것을 특징으로 하는 LED모듈 PCB의 방열패턴 형성구조.A plurality of sector units 101 to 106 are formed on the circular PCB 100 having a hole 111 at the center and the center hole 111 as a center and a plurality of LED elements are arranged for each sector 101 to 106 A pattern forming structure of a LED module PCB having a land pattern corresponding to each LED element so as to be connected in series in a radial manner and a circuit configured to connect the sectors 101 to 106 in parallel,
An anode (+) side and a cathode (-) side power supply terminal 112 (113) formed at the center of the PCB 100 to supply power to each LED element;
A circular anode parallel connection pattern formed to be connected to the anode side power supply terminal 112 and configured such that the anode lands of the first land patterns 121 to 126 in the center of each sector are connected in parallel around the center hole 111, (120);
A cathode parallel connection pattern 160 formed on the outer circumferential surface of the PCB 100 as a closed circuit so that the cathode lands of the last land patterns 161 to 166 of each sector are connected in parallel; And
A serial connection pattern 130 for serially connecting the land patterns from the first land patterns 121 to 126 to the last land patterns 161 to 166 for each sector; And
And a cathode power connection pattern 114 connecting the cathode side power supply terminal 113 and the cathode parallel connection pattern 160,
The anode, cathode parallel connection patterns 120, 160, the series connection pattern 130, and the cathode power supply pattern 114 are formed in a copper foil pattern, and the width of the copper foil pattern is set so that each of the copper foil patterns is insulated The width of the insulation layer is greater than the width of the insulation layer. 제 1 항에 있어서,
상기 애노드 병렬연결패턴(120)은 중앙 홀(111) 주변에 원형의 동박으로 형성하되, 일측에 개방부(116)를 형성하여 상기 캐소드 전원연결패턴(114)이 상기 캐소드측 전원공급단자(113)와 상기 캐소드 병렬연결패턴(160)을 연결하도록 형성된 것을 특징으로 하는 LED모듈 PCB의 방열패턴 형성구조.The method according to claim 1,
The anode parallel connection pattern 120 is formed as a circular copper foil around the center hole 111 and the opening portion 116 is formed at one side so that the cathode power connection pattern 114 is electrically connected to the cathode side power supply terminal 113 ) And the cathode parallel connection pattern (160) are connected to each other. 제 1 항에 있어서,
상기 랜드패턴은 LED소자가 장착되는 애노드 및 캐소드측 랜드(140)(150)가 형성되며, 상기 각 랜드(140)(150)는 각각 3개의 솔더단자(141)(151)를 형성하고,
상기 애노드측 랜드(140)는 애노드측 3개의 솔더단자(141)를 하나로 3점 연결하고, 3점 연결된 솔더단자(141)와 직렬연결패턴(130)을 연결하는 하나의 애노드 단자연결부(142)가 형성되고,
상기 캐소드측 랜드(150)는 상기 캐소드측 3개의 솔더단자(151)가 각각 직렬연결패턴(130)에 연결되도록 캐소드단자 연결부(152)가 포함하여 형성된 것을 특징으로 하는 LED모듈 PCB의 방열패턴 형성구조.The method according to claim 1,
The lands 140 and 150 are formed with three solder terminals 141 and 151, respectively. The lands 140 and 150 are formed on the anode side and the cathode side lands 140 and 150, respectively,
The anode side land 140 includes three anode terminal 141 and one anode terminal connection 142 for connecting the solder terminal 141 and the serial connection pattern 130, Is formed,
The cathode side land 150 includes a cathode terminal connection part 152 such that the three cathode side solder terminals 151 are connected to the serial connection pattern 130. rescue. 제 1 항에 있어서,
상기 동박으로 형성된 각 패턴 영역의 면적은 90%~95%로 형성하고, 상기 절연영역의 면적은 10~5%로 형성한 것을 특징으로 하는 LED모듈 PCB의 방열패턴 형성구조.The method according to claim 1,
Wherein the area of each pattern region formed by the copper foil is 90% to 95%, and the area of the insulation region is 10% to 5%.
KR1020160085204A 2016-07-06 2016-07-06 PCB Patern Structure for Radiation of LED Module KR20180005331A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102093517B1 (en) 2019-05-21 2020-03-25 채영도 Mask For Cutting Off Fine Dusts
KR102222516B1 (en) 2020-03-05 2021-03-04 김정일 Portable Fitering Mask
KR20220069251A (en) 2020-11-20 2022-05-27 신남식 window mask
KR20220116614A (en) 2021-02-15 2022-08-23 신남식 double window mask

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102093517B1 (en) 2019-05-21 2020-03-25 채영도 Mask For Cutting Off Fine Dusts
KR102222516B1 (en) 2020-03-05 2021-03-04 김정일 Portable Fitering Mask
KR20220069251A (en) 2020-11-20 2022-05-27 신남식 window mask
KR20220116614A (en) 2021-02-15 2022-08-23 신남식 double window mask

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