KR102060115B1 - Led substrate with individually controllable of led module - Google Patents

Abstract

The present invention relates to an LED substrate whose LED chips can be individually controlled, in which a first substrate to an (N-1)^th substrate, and an N^th substrate, formed in a configuration of stacking conductive patterns on upper sides of insulation layers, are integrated to be stacked in a vertical direction, a first LED module to an (N-1)^th LED module, and an N^th LED module in connection with conductive patterns of the first substrate to the (N-1)^th substrate are mounted on an upper part of the N^th substrate, respectively, while being in connection with a conductive pattern of the N^th substrate, and an N^th terminal corresponding to the N^th LED module and individual terminals corresponding to the first conductive pattern to the (N-1)^th conductive pattern are installed to be exposed in an integrated manner. According to the present invention, the LED modules can be individually and selectively controlled.

Description

LED board for individual control of LED module {LED SUBSTRATE WITH INDIVIDUALLY CONTROLLABLE OF LED MODULE}

The present invention consists of a structure in which the conductive substrate is laminated on the upper side of the insulating layer, the first substrate to the N-1 substrate, the Nth substrate is integrally stacked in the vertical direction, N on the N substrate The first LED module, the N-1 LED module, and the Nth LED module, which are connected to the conductive pattern of the substrate and connected to the conductive patterns of the first to N-1 substrates, are respectively mounted, and correspond to the Nth LED module. The present invention relates to an LED substrate capable of individually controlling an LED chip having a configuration in which the N-th terminal and the individual terminals corresponding to the N-th conductive pattern to the N-th conductive pattern are integrally exposed.

In general, an LED (Light Emitting Diode) is a device that emits light by the combination of electrons and holes in the vicinity of the PN junction or the active layer by passing a current through the compound semiconductor terminal, it is environmentally friendly, does not use mercury, it is a solid device long life In addition, power consumption is significantly lower, which has attracted much attention in recent years as a new light source.

Among them, white LEDs emitting white light have been put into practical use as backlights for LCD-TVs, automobile headlamps, general lighting, and the like, and are being used as lightings to replace conventional incandescent and fluorescent lamps.

As the LED replaces the existing lighting, the development of high brightness LED is accelerated, and the high brightness LED developed in this way generates a lot of heat in a narrow area where light is emitted. Dislocations and mismatches in the crystal structure directly adversely affect the light emitting performance and lifetime of the LED.

Accordingly, various researches and developments for rapidly dissipating heat generated from LEDs are being actively performed.

In connection with such a technique, a technology of a flexible printed circuit board is disclosed in Patent No. 986214. The configuration of the flexible printed circuit board 1 is a flexible base layer 30 having insulation properties. The first copper layer 20 and the second copper layer 40 stacked on upper and lower portions of the base layer 30 are included.

In addition, the base layer 30 has not only insulation characteristics but also flexible characteristics such that the first copper layer 20 and the second copper layer 40 are electrically blocked, and the first copper layer 20 has a plurality of characteristics. Copper plates 20a and 20b are included in an electrically independent state, and the copper plates 20a and 20b of the first copper layer 20 are in electrical and / or thermal communication with the second copper layer 40. Via holes are formed.

In addition, the heat generated from the LED package 100 connected to the first copper layer is radiant heat (T1) to the top, conduction heat (T2) to the copper plate, conduction heat through the via hole (HE / T) for both current and heat transfer ( T3), conduction heat T4 to the second copper layer 40 and conduction heat T5 to the backlight unit frame 60 are evenly distributed.

However, the LED package as described above has a disadvantage in that individual control is impossible because a plurality of the same structure is connected to each other through a plurality of first copper layers provided only on the upper portion.

An object of the present invention for improving the conventional problems as described above, by individually installing the LED module mounting pattern to enable individual and selective control of the LED module, and facilitates a plurality of LED chips through a multi-layer substrate The present invention provides an LED board which enables individual control of the LED chip so that it can be installed, the individual LED chips can be easily connected in a minimum space, and the heat of the LED module can be quickly discharged.

In order to achieve the above object, the present invention is made of a structure in which the first substrate to the N-th substrate, the N-th substrate is integrally laminated in the vertical direction, the conductive pattern is laminated on the upper side of the insulating layer,

The Nth substrate has an Nth conductive pattern connected to an Nth terminal exposed to an edge while corresponding to the Nth LED module while the first substrate to the N-1 LED module and the Nth LED module are respectively mounted on the Nth substrate. The individual terminals corresponding to the first conductive pattern to the N-1th conductive pattern separated from the Nth terminal may be integrally exposed.

The N-1th substrate has an N-1 conductive pattern connected to an N-1 terminal exposed at an edge while corresponding to the N-1 LED module, and the N-1 conductive pattern is a via hole. Are electrically connected to individual terminals and the N-th LED module through

The first substrate has a first conductive pattern connected to a first terminal exposed to an edge while corresponding to the first LED module, and the first conductive pattern is electrically connected to the individual terminals and the first LED module through a via hole. It provides LED boards that can individually control the LED chips connected to each other.

Further, in the present invention, the first conductive pattern to the N-1 conductive pattern and the Nth conductive pattern are heat-transferred from the upper side of the N-th substrate through heat-transfer via holes through which the conductive particles are filled while the interference is prevented from the different conductive patterns. It provides LED board which can control LED chip installed so far.

In addition, the present invention provides an LED substrate capable of individual control of the LED chip is installed so that a plurality of the first to N-th substrate, the N-th substrate is connected to the individual terminal or the N-terminal at the same time to be lit at the same time.

In addition, in the present invention, a common electrode layer is integrally stacked on the lower side of the Nth substrate so that the common electrodes of the first conductive pattern, the N-1 conductive pattern, and the Nth conductive pattern are simultaneously connected through a via hole, and the common electrode is also upper part. It provides an LED substrate capable of individual control of the LED chip connected to the via via holes to the individual terminals provided in the.

Subsequently, the LED module of the present invention provides an LED substrate capable of individually controlling an LED chip that is thermally compressed in a BGA method using a spherical solder ball in a via hole.

In addition, the present invention provides an LED substrate capable of individually controlling an LED chip which integrally forms an air hole by exposure, etching, and etching on one side of the insulating layer.

As described above, according to the present invention, by individually installing the LED module mounting pattern, it is possible to individually and selectively control the LED module, and to easily mount a plurality of LED chips through the multilayer board, and individual LEDs in a minimum space. Connection of the chip is made easily, it is possible to quickly discharge the heat generated from the LED module.

1 is a perspective view showing a conventional LED substrate.
Figure 2 is an external view showing the LED substrate according to the present invention.
Figure 3 is a side view showing the LED substrate according to the present invention.
4 is an exploded state diagram of the LED substrate according to the present invention.
5 to 7 are each an external view and a side view of the LED substrate according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is an external view showing the LED substrate according to the present invention, Figure 3 is a side view showing the LED substrate according to the present invention, Figure 4 is an exploded view of the LED substrate according to the present invention, Figures 5 to 7 Are respectively an external view and a side view of the LED substrate according to another embodiment of the present invention.

In the LED substrate S of the present invention, the first substrate 100 to the N-th substrate 400 and the N-th substrate (100) having a structure in which the conductive pattern P is stacked on the insulating layer I are stacked. 200 is made of a configuration that is integrally stacked in the vertical direction.

In addition, the N-th substrate 200 is mounted on the N-th LED module 450 while the first LED module 410 to the N-1 LED module 430 and the N-th LED module 450 are respectively mounted on the N-th substrate 200. The N-th conductive pattern 530 is formed to correspond to the N-th terminal 510 exposed to the edge.

In addition, the individual terminals 590, which are separated from the N-th terminal 510 and correspond to the first conductive patterns 130 to the N-th conductive pattern 230, are integrally exposed.

Subsequently, the N-th substrate 400 has an N-th conductive pattern connected to the N-th terminal 210 exposed at an edge thereof, corresponding to the N- 1 LED module 430 at an upper portion thereof. 230 is formed, and the N-th terminal and the N-th conductive pattern 230 are electrically connected to the individual terminal 590 and the N-th LED module 430 through via holes V, respectively. .

In addition, the first substrate 100 is formed with a first conductive pattern 130 connected to the first terminal 110 exposed to the edge corresponding to the first LED module 410, the first conductive pattern 130 and the first terminal are electrically connected to the individual terminal 590 and the first LED module 410 through the via hole (V), respectively.

In addition, the first conductive pattern to the N-th conductive pattern, and the N-th conductive pattern are prevented from interfering with other conductive patterns and penetrate through the heat transfer hole V1 through which the conductive particles 760 are filled. It may be provided for heat transfer from above.

In addition, as shown in FIG. 7, a plurality of the first substrate 100 to the N-th substrate and the N-th substrate may be simultaneously connected to the individual terminal 590 or the N-th terminal to be turned on at the same time.

In addition, the ground via hole 710 in which the common electrode 750 is integrally stacked below the first substrate 100 so that the common electrodes of the first to N-th conductive patterns and the N-th conductive pattern are filled with conductive paste. Are connected at the same time.

In this case, the common electrode may also be connected to an individual terminal provided at an upper portion thereof through a via hole to expose the electrode at an upper portion thereof.

Subsequently, the first LED module 410 to the N-1 LED module 430 and the Nth LED module 450 may be thermally compressed by a BGA method using a spherical solder ball in the via hole.

In addition, the air holes 800 may be integrally formed on one side of the insulating layer I by exposure, etching, and etching.

The operation of the present invention having the above configuration will be described.

As shown in FIGS. 2 to 7, the LED substrate S of the present invention includes a first substrate 100 to an N-th structure in which a conductive pattern P is laminated on the insulating layer I. Since the first substrate 400 and the N-th substrate 200 are integrally stacked in the vertical direction, a conductive pattern made of a metal material is separated into each layer to secure an area, thereby increasing heat dissipation effect.

At this time, the conductive pattern formed between the insulating layers is exposed to the outside through the heat transfer via hole (V1) or the air hole 800 to realize the desired heat transfer effect.

In addition, the N-th substrate 200 is mounted on the N-th LED module 450 while the first LED module 410 to the N-1 LED module 430 and the N-th LED module 450 are respectively mounted on the N-th substrate 200. The N-th conductive pattern 530 is formed to be connected to the N-th terminal 510 exposed to the edge, and is separated from the N-th terminal 510 to correspond to the first to N-th conductive patterns. Since the individual terminals 590 are integrally installed and exposed, the N-th terminal and the individual terminals are all exposed to the upper portion, thereby facilitating supply of power.

Subsequently, the N-th substrate 400 has an N-th conductive pattern connected to the N-th terminal 210 exposed at an edge thereof, corresponding to the N- 1 LED module 430 at an upper portion thereof. 230 is formed, and the N-th conductive pattern 230 is electrically connected to the individual terminals 590 and the N-1 LED module 430 through via holes V, respectively, and mounted on the N substrate. It becomes easy to connect the N-1 LED module 430 to be.

In addition, the first substrate 100 is formed with a first conductive pattern 130 connected to the first terminal 110 exposed to the edge corresponding to the first LED module 410, the first conductive pattern 130 is electrically connected to the individual terminal 590 and the first LED module 410 through the via hole (V), respectively, so that it is easy to connect the first LED module 100 mounted on the N substrate. .

In addition, the first conductive pattern to the N-th conductive pattern and the N-th conductive pattern are exposed to the outside through the heat transfer hole hole V1 through which the conductive patterns 700 are filled while the interference with the other conductive patterns is prevented. By being installed so as to be in contact with air, heat transfer of each conductive pattern becomes easy on the upper side of the N-th substrate.

In addition, the present invention may control the individual LED module, but as shown in FIG. 7, a plurality of the first substrate 100 to the N-th substrate and the N-th substrate are simultaneously connected to the individual terminal 590 or the N-th terminal. It may be connected and turned on at the same time.

In addition, the common electrode 750 is integrally stacked on the lower side of the first substrate 100 so that the common electrodes of the first to N-th conductive patterns and the N-th conductive pattern are simultaneously connected through the ground via hole 710. Heat transfer becomes easy.

At this time, the common electrode is also connected to the individual terminal provided in the upper through the via hole so that the electrode is exposed to the upper portion to facilitate power supply.

Subsequently, when the first LED module 410 to the N-1 LED module 430 and the N LED module 450 are thermally compressed in a BGA method using a spherical solder ball in the via hole, a connection operation is easily performed. do.

In addition, when the air holes 800 are integrally formed on one side of the insulating layer I by exposure, etching, and etching, the conductive patterns stacked between the insulating layers are exposed in the air to increase the heat transfer effect.

100 ... First substrate 400 ... N-1 substrate
200 ... N substrate 410 ... 1 LED module
510 ... N terminal 590 ... Individual terminal
700 ... conductive particles 710 ... ground via hole
750 Common electrode

Claims (6)

The first to N-th substrate, consisting of a configuration in which the conductive pattern is laminated on the upper side of the insulating layer, the N-th substrate is made of a configuration in which the laminated in the vertical direction integrally,
The Nth substrate may include an Nth conductive pattern connected to an Nth terminal exposed to an edge while corresponding to the Nth LED module, wherein the first LED module, the N-1 LED module, and the Nth LED module are mounted on the Nth substrate, respectively. A plurality of individual terminals formed on the insulating layer and separated from the N-th terminal and corresponding to the first conductive pattern to the N-1 conductive pattern are integrally exposed.
The N-1th substrate has an N-1 conductive pattern connected to the N-1 terminal exposed at the edge corresponding to the N-1 LED module and formed on the insulating layer, and the N-1 terminal And the N-1 conductive pattern are electrically connected to one individual terminal and the Nth LED module through via holes, respectively.
The first substrate has a first conductive pattern connected to a first terminal exposed to an edge while corresponding to a first LED module, and is formed on an upper portion of the insulating layer, and the first terminal and the first conductive pattern are separated through a via hole. Electrically connected to one individual terminal and the first LED module,
An LED substrate capable of individually controlling an LED chip in which an air hole is integrally formed by exposure, etching, and etching on one side of the insulating layer so that a conductive pattern is in contact with air. The N-th conductive pattern of claim 1, wherein the first conductive pattern to the N-1 conductive pattern and the N-th conductive pattern are penetrated or prevented from interfering with other conductive patterns and filled with conductive particles to form an upper side of the N-th substrate. LED board capable of individual control of the LED chip, characterized in that installed in the heat transfer. The LED of claim 1, wherein a plurality of the first to N-th substrates and the N-th substrate are simultaneously connected to individual terminals or N-th terminals and installed to light at the same time. Board. The LED chip of claim 1, wherein the common electrodes are integrally stacked on the lower side of the first substrate so that the first conductive pattern, the N-1 conductive pattern, and the Nth conductive pattern are simultaneously connected through the ground via hole. LED board with individual control. The LED substrate of claim 4, wherein the common electrode is connected to an individual terminal provided at an upper portion thereof through a via hole. delete

Images