RU2638027C1 - Light-emitting module - Google Patents

Light-emitting module Download PDF

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Publication number
RU2638027C1
RU2638027C1 RU2016152659A RU2016152659A RU2638027C1 RU 2638027 C1 RU2638027 C1 RU 2638027C1 RU 2016152659 A RU2016152659 A RU 2016152659A RU 2016152659 A RU2016152659 A RU 2016152659A RU 2638027 C1 RU2638027 C1 RU 2638027C1
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RU
Russia
Prior art keywords
board
light
crystals
emitting
holes
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Application number
RU2016152659A
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Russian (ru)
Inventor
Олег Валерьевич Осипов
Юрий Наумович Зельдин
Григорий Владимирович Иткинсон
Original Assignee
Закрытое акционерное общество "Инновационная фирма "ИРСЭТ-Центр"
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Priority to RU2016152659A priority Critical patent/RU2638027C1/en
Application granted granted Critical
Publication of RU2638027C1 publication Critical patent/RU2638027C1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources

Abstract

FIELD: electricity.
SUBSTANCE: in light-emitting module including a group of electrically connected semiconductor light-emitting crystals disposed on a common board made of a textolite and having a coating made of a polymeric compound, the upper and the lower surfaces of the board have a metal coating. In the board are formed through metallized holes through which the metal coating available on the upper surface of the board and the metal coating available on the lower surface of the board are communicated with each other. These holes are made on the areas not occupied by crystals, and the coating of the polymeric compound is made in the form of a layer of polymer material located on top of the board with the crystals arranged on it. In this case, the ratio of the area of the metal coating available on the lower surface of the board to the total cross-sectional area of the metallized portion of the through holes is not more than 65.
EFFECT: ensuring high heat-transmitting properties of the light-emitting module.
2 cl, 2 dwg

Description

The invention relates to semiconductor technology, namely to light emitting modules used in lighting devices.
Currently, LED emitting systems are widely used light-emitting modules containing mounted on a common board and electrically connected to each other semiconductor light sources.
So, for example, a light-emitting module [RU 102278] is known, which is used as part of an LED lamp, which contains a chain of semiconductor light sources located on a common printed circuit board made of foil-coated textolite made in the form of a strip (LED bar).
As light sources, LEDs are used, the cases of which are soldered to a foil board. Through-circuit metallized holes are made in the printed circuit board, which have a size smaller than the cross-sectional size of the LED housing, with at least one indicated hole placed under each LED. These through holes are used to remove heat from the LEDs.
The light-emitting module under consideration has significant weight and size characteristics, which is also associated with the use of housing LEDs as light sources.
Known light-emitting module [JP 2008294309], which is selected as the closest analogue.
This light-emitting module includes a group (matrix) of electrically connected located on a common board made of PCB, in particular fiberglass, semiconductor light-emitting crystals having a polymer, in particular silicone, coating. The specified coating is made in the form of a combination of lenses, each of which covers one of the crystals, and tracks placed between the lenses, deposited on the upper surface of the board.
The use of light-emitting crystals as light sources in the light-emitting module under consideration contributes to a decrease in its overall dimensions compared to light-emitting modules containing housing LEDs.
However, this light-emitting module, in which fiberglass has a relatively low thermal conductivity as the board material, does not have sufficiently high heat-removing properties.
Meanwhile, insufficiently efficient heat removal from the active region of the crystals released during their operation can lead to overheating of these regions, which negatively affects the light characteristics and durability of the crystals.
The problem, the solution of which is achieved by carrying out the invention, is to provide high heat-removing properties of the light-emitting module.
The essence of the invention lies in the fact that in a light-emitting module, including a group of electrically connected semiconductor light-emitting crystals located on a common board made of PCB and having a coating made of a polymer compound, according to the invention, the upper and lower surfaces of the board have a metal coating in the board through metallized holes are formed by which the metal coating on the upper surface of the board and the metal coating have which is located on the bottom surface of the board are communicated with each other, while these holes are made in areas not occupied by crystals, and the coating of the polymer compound is made in the form of a layer of polymer material located on top of the board with crystals located on it.
In the particular case of the invention, the board is made in the form of a strip, and the crystals are located on it in a row with the formation of a light-emitting line.
In the particular case of the invention, the ratio of the area of the metal coating on the bottom surface of the board to the total cross-sectional area of the metallized part of the through holes is not more than 65.
The presence in the inventive device installed on a common basis (on a PCB board) of electrically connected semiconductor light-emitting crystals enables the device to emit light, which allows it to be used as part of lighting devices.
Each semiconductor light-emitting crystal is made on the basis of a semiconductor light-emitting heterostructure and is equipped with electrical contacts that provide power to it.
The use of PCB in the inventive device for the manufacture of a board, which is a relatively cheap and technologically advanced material that can be machined well, makes it possible to obtain thin flexible boards with small weight and size characteristics, including boards suitable for use in the construction of filamentous light-emitting elements - filaments.
Of fundamental importance in the inventive device is the presence of metal coatings located on the upper and lower surfaces of the board and formed through metallized holes in the board.
Due to the presence on the board of these metal coatings with high thermal conductivity and occupying almost the entire area of the upper and lower surfaces of the board, as well as due to the presence of through metallized holes through which these surfaces are communicated with each other, a high heat dissipation ability of the claimed device is achieved. The indicated metallized structural elements of the light-emitting module form a single thermal circuit and are an effective heat sink, which ensures the dissipation of heat emitted during operation of the light-emitting crystals.
In this case, using the indicated metallized surfaces of the board, the required topology of the light-emitting module is organized, including the electrical circuit for connecting the light-emitting crystals and the circuit for connecting them to an external electrical circuit.
Used in the light-emitting module, the coating of a polymer compound performs a protective function, and also serves to achieve the required light and color characteristics of the claimed device.
In particular, a silicone-phosphor mixture is used as said coating.
Thus, the technical result achieved by using the claimed invention is to provide high heat-removing properties of the light emitting module.
In the case when the board is made in the form of a strip and the crystals are arranged on it in a row with the formation of a light emitting line, the light emitting module takes the form of a threadlike light emitting element (filament).
Such light-emitting elements are widely used, in particular, in filament lamps, replacing incandescent lamps.
To improve heat removal, taking into account the fact that the lower metallized surface is the main heat-removing surface of the light-emitting module, it is advisable that the ratio of the area of the metal coating on the bottom surface of the board to the total cross-sectional area of the metallized part of the through holes be no more than 65.
As the authors showed, with such a ratio of these areas, conditions are created under which the temperature pn of the transition of light-emitting crystals in the operating mode does not exceed 115 ° C, which indicates effective heat removal.
In FIG. 1 presents a General view of the inventive device (top view); in FIG. 2 - the same (front view).
The device comprises a board 1 made in the form of a thin plate having the shape of a strip made of textolite, in particular fiberglass. The thickness of the plate, in particular, is selected from the range of 80-150 microns.
On the upper and lower surfaces of the board 1, metal coatings are applied that are similar in configuration and location. In particular, the metal coating deposited on the upper surface of the board 1 contains the upper edge zones 2 and 3 of metallization and the upper central zone 4 of metallization, which occupies most of the upper surface of the board 1 and is electrically isolated from the upper edge zones 2 and 3, in particular with using sections of insulation 5 and 6, formed near the edge sections of the board 1 due to the formation of a gap in the metal coating in these areas. Similarly, a metal coating deposited on the lower surface of the board 1 contains the lower edge zones 7 and 8 of metallization and the lower central zone 9 of metallization, which occupies most of the lower surface of the board 1 and is electrically isolated from the lower edge zones 7 and 8, in particular, using sections insulation 10 and 11, formed near the edge sections of the board 1 due to the formation of a gap of the metal coating in these areas.
Using these metallization zones, the selected topology of the light emitting module is organized. In particular, zones 7 and 8 form contact pads designed to connect the light-emitting module to an external electrical circuit.
On the upper metallized portions of the board 1, semiconductor light-emitting crystals 12 are installed, in particular glued with heat-conductive glue (in the figure, one crystal is indicated by one). In particular, the crystals are located on the metallized sections 2, 3, 4 of the board 1 in a row with the formation of a light-emitting line.
The board 1 has through metallized holes 13 (in the figure, two through holes are indicated), by means of which the upper and lower edge zones 2 and 7 and 3 and 8, as well as the upper and lower central zones 4 and 9 communicate with each other. In this case (from the side of the upper surface of the board 1), the holes 13 are located in areas not occupied by crystals 12.
The crystals 12 have electrical positive and negative terminals 14 (two terminals are indicated in the drawing), made in particular in the form of wire welds, by means of which the crystals are connected to each other to form a series electric circuit.
Moreover, each of the extreme crystals 12 in the light-emitting line using one of the conclusions 14 is connected to one of the upper metallized sections 2 or 3.
On top of the board 1 and crystals 12 are filled with a translucent polymer compound 15 (see Fig. 2), in particular silicone, with phosphor particles distributed in it.
The device operates as follows.
Provide a current supply to the light-emitting module from an external electrical circuit (not shown) through positive and negative contact pads 7 and 8 connected to the external circuit contacts. Current flows through a circuit including metallized through holes 13, upper metallized sections 2 and 3, leads 14 and crystals 12. Crystals 12 emit light. During the operation of the crystals 12, heat is released, which is dissipated into the external medium from the upper metallized surface of the board 1, is removed through the metallized through holes 13, and also dissipated into the external environment from the lower metallized surface of the board 1.

Claims (2)

1. A light-emitting module, including a group of electrically connected semiconductor light-emitting crystals located on a common board made of textolite and having a coating made of a polymer compound, characterized in that the upper and lower surfaces of the board are metal coated, through-hole metallized holes are formed by which a metallic coating present on the upper surface of the circuit board and a metallic coating present on the lower surface of the circuit board are communicated with each other, these holes are made in areas not occupied by crystals, and the coating of the polymer compound is made in the form of a layer of polymer material located on top of the board with crystals located on it, while the ratio of the area of the metal coating on the bottom surface of the board to the total the cross-sectional area of the metallized part of the through holes is not more than 65.
2. The LED module according to claim 1, characterized in that the board is made in the form of a strip, and the crystals are located on it in a row with the formation of a light emitting line.
RU2016152659A 2016-12-29 2016-12-29 Light-emitting module RU2638027C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
RU2016152659A RU2638027C1 (en) 2016-12-29 2016-12-29 Light-emitting module

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Application Number Priority Date Filing Date Title
RU2016152659A RU2638027C1 (en) 2016-12-29 2016-12-29 Light-emitting module

Publications (1)

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RU2638027C1 true RU2638027C1 (en) 2017-12-11

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH096258A (en) * 1995-06-23 1997-01-10 Takiron Co Ltd Light emitting display body
RU72527U1 (en) * 2007-03-19 2008-04-20 Трансрегиональное потребительское общество "ЕвроАзиатская сервисная корпорация" Linear LED MATRIX
JP2008294309A (en) * 2007-05-25 2008-12-04 Showa Denko Kk Light emitting device and display device
RU102278U1 (en) * 2010-10-28 2011-02-20 Федеральное Государственное Унитарное Предприятие "Государственный Завод "ПУЛЬСАР" LIGHT-Emitting Module and LED Luminaire
RU119972U1 (en) * 2012-02-13 2012-08-27 Общество с ограниченной ответственностью "Тегас Электрик" BOARD PRINTED COMPOSITION
RU2499374C2 (en) * 2012-01-24 2013-11-20 Общество с ограниченной ответственностью "Тегас Электрик" Printed circuit board
RU2550740C1 (en) * 2014-05-22 2015-05-10 Открытое Акционерное Общество "Государственный завод "Пульсар" Wide beam pattern led lamp (versions)

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH096258A (en) * 1995-06-23 1997-01-10 Takiron Co Ltd Light emitting display body
RU72527U1 (en) * 2007-03-19 2008-04-20 Трансрегиональное потребительское общество "ЕвроАзиатская сервисная корпорация" Linear LED MATRIX
JP2008294309A (en) * 2007-05-25 2008-12-04 Showa Denko Kk Light emitting device and display device
RU102278U1 (en) * 2010-10-28 2011-02-20 Федеральное Государственное Унитарное Предприятие "Государственный Завод "ПУЛЬСАР" LIGHT-Emitting Module and LED Luminaire
RU2499374C2 (en) * 2012-01-24 2013-11-20 Общество с ограниченной ответственностью "Тегас Электрик" Printed circuit board
RU119972U1 (en) * 2012-02-13 2012-08-27 Общество с ограниченной ответственностью "Тегас Электрик" BOARD PRINTED COMPOSITION
RU2550740C1 (en) * 2014-05-22 2015-05-10 Открытое Акционерное Общество "Государственный завод "Пульсар" Wide beam pattern led lamp (versions)

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MM4A The patent is invalid due to non-payment of fees

Effective date: 20181230