KR20110000868A

KR20110000868A - Pcb patern structure for heat radiation of led module

Info

Publication number: KR20110000868A
Application number: KR1020090058175A
Authority: KR
Inventors: 권지홍
Original assignee: (주) 여룩스; 신라컴테크 (주)
Priority date: 2009-06-29
Filing date: 2009-06-29
Publication date: 2011-01-06

Abstract

The present invention relates to a LED module PCB heat dissipation pattern forming structure, so that the copper foil pattern of the PCB circuit pattern of the LED lighting module to the largest area, so as to more efficiently discharge the heat generated from the LED.

An object of the present invention is formed in the center of the PCB, the anode side and the cathode side power supply terminal for supplying power to each LED device; An anode parallel connection pattern connected to the anode side power supply terminal and configured to connect the anode side lands of each of the first land patterns in the center in parallel around the center hole; A cathode parallel connection pattern formed in a closed circuit on an outer circumferential surface of the PCB such that cathode lands of each of the last land patterns of each sector are connected in parallel; A serial connection pattern for serially connecting each land pattern from each sector land pattern to the last land pattern; And a cathode power connection pattern connecting the cathode-side power supply terminal and the cathode parallel connection pattern, wherein the anode and cathode parallel connection patterns, the series connection pattern, and the cathode power supply pattern are formed of a copper foil pattern and have a width of the copper foil pattern. It is characterized in that each copper foil pattern is formed wider than the width of the insulating region for insulating at regular intervals.

LED, PCB, heat dissipation, pattern, copper foil, land,

Description

PCB Module Structure for Heat Radiation of LED Modules

The present invention relates to a printed circuit board (PCB) pattern structure for increasing the heat dissipation effect of the light emitting device (LED) lighting module, and to configure the PCB circuit pattern of the LED lighting module in the widest possible area to more efficiently heat generated from the LED It relates to an LED module PCB heat dissipation pattern forming structure to be emitted to.

Recently, LED has been spotlighted as a light source for lighting, and many luminaires adopt it and use it. The LED itself guarantees a long life of more than 50000 hours, but if the luminaire adopts it, the power supply's durability and failure to effectively dissipate the heat generated by the LED will cause a breakdown and a significant decrease in product life.

In addition, deterioration occurs in performance such as a decrease in power efficiency and a decrease in LED brightness. In particular, when using 3W, 5W class LEDs, which consumes more power, the heat dissipation problem becomes very important. For this purpose, there is a problem in that the cost of applying metal PCB and heat dissipation paint and attaching the heat sink is increased.

1 is a structure diagram of a LED lighting PCB pattern according to the prior art, the serial connection line 11 of the anode terminal and the cathode terminal for connecting the LED device in series to the PCB 10 in a narrow power line considering only the electrical connection There is a problem in that it is not possible to expect any effect on dissipation of generated heat.

Accordingly, the present invention relates to a printed circuit board (PCB) pattern structure for increasing the heat dissipation effect of the LED lighting module, and more specifically, heat generated in the LED because it configures the PCB copper foil circuit pattern of the LED lighting module as wide as possible It is an object of the present invention to provide a heat dissipation pattern forming structure of the LED module PCB to emit more efficiently.

LED module PCB heat dissipation pattern forming structure according to the present invention is divided into a plurality of sector sector (101 ~ 106) around the center hole on a circular PCB with a hole 111 is formed in the center, each sector (101 ~ 106) In the pattern forming structure of the LED module PCB for each of the plurality of LED elements are radially connected in series and a land pattern corresponding to each LED element is formed, each of the sectors (101 ~ 106) is configured to be connected in parallel, An anode (+) side and a cathode (−) side power supply terminals 112 and 113 formed at the center of the PCB 100 to supply power to each LED element; A circular anode parallel connection pattern connected to the anode side power supply terminal 112 and formed so that the anode side lands of each of the first land patterns 121 to 126 in the center are connected in parallel around the center hole 111. 120; A cathode parallel connection pattern 160 formed in a closed circuit on an outer circumferential surface of the PCB 100 so that cathode lands of each of the last land patterns 161 to 166 for each sector are connected in parallel; A serial connection pattern 130 for serially connecting each land pattern from the land patterns 121 to 126 for each sector to the last land patterns 161 to 166; And a cathode power connection pattern 114 connecting the cathode side power supply terminal 113 and the cathode parallel connection pattern 160 to each of the anode and cathode parallel connection patterns 120 and 160. The pattern 130 and the cathode power supply pattern 114 may be formed of a copper foil pattern, and the width of the copper foil pattern may be wider than the width of an insulating region for insulating the copper foil patterns at a predetermined interval.

The heat dissipation pattern forming structure of the LED module PCB according to an embodiment of the present invention maximizes the area of the copper foil pattern area of the PCB substrate, minimizes the area of the insulating area of the copper foil pattern to distribute the heat evenly on the entire PCB board, Even in the case of applying a separate heat sink or heat dissipation paint, the heat dissipation effect is increased by radiation and convection in the heat dissipation plate, heat dissipation paint, and heat transfer to the metal substrate is very fast, thereby improving heat dissipation effect.

In addition, the circuit to which the heat dissipation pattern according to the present invention is applied has the maximum area of the copper foil pattern, thereby minimizing the electric resistance, thereby making a minimum voltage drop when a current is input while passing through a plurality of LED elements in the power supply. It has the effect of reducing power consumption.

The heat radiation pattern forming structure of the LED module PCB according to an embodiment of the present invention will be described in more detail with reference to FIGS. 2 to 5 as follows.

Figure 2 is a plan view of the LED module PCB according to an embodiment of the present invention, Figure 4 is a circuit diagram for connecting the LED element to the PCB substrate in Figure 2, a circular PCB (hole 111) is formed in the center ( The circular pattern is divided into six sectors 101 to 106 around the center hole, and a land pattern is formed such that 12 LED elements are radially connected in series in each sector 101 to 106. Around the central hole to form an anode parallel connection pattern 120 to be connected in parallel with the anode (+) terminal of the LED element, the outer peripheral surface of the PCB 100 is the cathode side of the last land pattern (161 ~ 166) of each sector The cathode parallel connection pattern 160 is formed to be connected in parallel.

The cathode parallel connection pattern 160 is composed of a copper foil pattern of a closed circuit having a wide width.

In addition, all land patterns including the parallel connection patterns 120 and 160, the serial connection patterns 130, and the land patterns 121 to 126 and 161 to 166 of the PCB 100 may be formed of copper foil patterns. In addition, the area of each copper foil pattern is formed to be as wide as possible, and the area of the insulating area for insulating each copper foil pattern is formed to be as narrow as possible. Preferably, the area of the copper foil pattern region is 90% to 95%, and the area of the insulating region is 10 to 5%.

Since the copper foil pattern is formed in this way, the heat generated during the LED driving is quickly transferred to the metal substrate, thereby increasing the heat dissipation effect.

3 is a circuit configuration diagram connecting the LED device to the PCB of FIG. 2, in which 12 series-connected LED devices LED1 to LED12 are connected in parallel to six sectors 101 to 106.

FIG. 4 is a detailed configuration diagram of the central part in FIG. 2, wherein the anode (+) side and the cathode (−) side power supply terminals supplying power to the LED elements of each sector 101 to 106 around the center hole 111. 112 and 113 are formed, respectively, the power supply line (+) (-) penetrates from the lower end of the PCB 100 through the central hole 111 to each anode (+) side and cathode (-) side The wires are wire-bonded with the power supply terminals 112 and 113.

A circular anode parallel connection pattern 120 is formed around the central hole 111 so that the anode side lands of the first land patterns 121 to 126 of the centers are connected in parallel to each sector 101 to 106.

Here, one side of the anode parallel connection pattern 120 forms an opening 116 so that the cathode power connection pattern 114 is formed on the cathode side power supply terminal 113 and the outer circumferential surface through the opening 116. The cathode parallel connection pattern 160 is connected.

FIG. 5 is a view illustrating an example of a shape of a land pattern in which LEDs are bonded in FIG. 4. The land patterns may have various shapes according to LED manufacturers. However, in the present invention, three land patterns may be provided on the anode and cathode sides. Referring to the land pattern formed land is as follows.

Each land pattern on which the LED device is mounted is formed with an anode and cathode side lands 140 and 150, and each land 140 and 150 forms three solder terminals 141 and 151, respectively. The anode side land 140 connects three solder terminals 141 to one anode side and one anode terminal connector 142 which connects the three-point solder terminal 141 and the series connection pattern 130 to each other. Is formed, and the cathode side land 150 forms a cathode terminal connection portion 152 such that the three solder terminals 151 on the cathode side are connected to the series connection pattern 130, respectively.

In particular, since the heat generated from the LED element generates more cathode side than the anode side, the pattern of the cathode side land 150 has three solder terminals 151 and a series connection pattern 130, respectively, the cathode terminal connections 152. To be connected).

The connection pattern formed as described above allows the heat generated when wire-bonding the power connection line to the power supply terminals 112 and 113 to be transmitted to the outside through the cathode parallel connection pattern 160 during the LED package operation. When soldering to the PCB 100, by effectively spreading the heat conducted through the land pad so that the junction temperature (Tj) of the LED does not increase so as not to affect the life and performance of the LED device.

On the other hand, by attaching a heat dissipation pad at the lower position where the LED device is mounted on the PCB 100 to further increase the heat dissipation effect during the operation of the LED device.

1 is a structural diagram of a PCB pattern for LED lighting according to the prior art,

2 is a structural diagram of a heat radiation pattern of the LED module PCB according to an embodiment of the present invention,

3 is an LED circuit diagram mounted on FIG.

4 is an enlarged structural diagram of a central portion of the PCB in FIG.

FIG. 5 is a detailed configuration diagram of the land pattern in FIG. 2.

100: PCB 101 ~ 106: sector sector

111: central hole 112,113: anode, cathode power supply terminal

114: cathode power supply line 116: opening

120: anode parallel connection pattern 121 ~ 126: first land pattern for each sector

130: serial connection pattern 140, 150: anode, cathode side land

141,151: Three-point solder terminal on the anode and cathode sides

142,152: anode, cathode solder terminal connection

160: cathode parallel connection pattern 161 ~ 166: last land pattern of each sector

Claims

On the circular PCB 100 having a hole 111 formed in the center, the plurality of sectors 101 to 106 are divided around the center hole 111, and a plurality of LED elements are formed for each sector 101 to 106. In the pattern formation structure of the LED module PCB is formed in the circuit pattern is formed so that each of the LED elements are connected in parallel to the radially connected in series, wherein each of the sectors (101 ~ 106) is connected in parallel,

An anode (+) side and a cathode (−) side power supply terminals 112 and 113 formed at the center of the PCB 100 to supply power to each LED device;

A circular anode parallel connection pattern connected to the anode side power supply terminal 112 and formed so that the anode side lands of each of the first land patterns 121 to 126 in the center are connected in parallel around the center hole 111. 120;

A cathode parallel connection pattern 160 formed in a closed circuit on an outer circumferential surface of the PCB 100 so that cathode lands of each of the last land patterns 161 to 166 for each sector are connected in parallel; And

A serial connection pattern 130 for serially connecting each land pattern from the first land patterns 121 to 126 to the last land patterns 161 to 166 for each sector; And

A cathode power connection pattern 114 connecting the cathode side power supply terminal 113 and the cathode parallel connection pattern 160;

The anode, the cathode parallel connection pattern 120, 160, the series connection pattern 130, and the cathode power supply pattern 114 are formed of a copper foil pattern, and the width of the copper foil pattern insulates the copper foil patterns at regular intervals. The heat radiation pattern forming structure of the LED module PCB, characterized in that formed wider than the width of the insulating area to.

The method of claim 1,

The anode parallel connection pattern 120 is formed of a circular copper foil around the central hole 111, the opening portion 116 is formed on one side of the cathode power connection pattern 114 is the cathode power supply terminal 113 Heat dissipation pattern forming structure of the LED module PCB, characterized in that formed to connect the) and the cathode parallel connection pattern (160).

The method of claim 1,

The land pattern is formed of the anode and cathode side lands 140 and 150 on which the LED elements are mounted, and each of the lands 140 and 150 forms three solder terminals 141 and 151, respectively.

The anode side land 140 connects three solder terminals 141 to one anode side and one anode terminal connector 142 which connects the three-point solder terminal 141 and the series connection pattern 130 to each other. Is formed,

The cathode side land 150 includes a cathode terminal connection part 152 formed such that the cathode side three solder terminals 151 are connected to the series connection pattern 130, respectively. rescue.

The method of claim 1,

The area of each pattern region formed of the copper foil is formed of 90% to 95%, the area of the insulating region is formed in the heat radiation pattern forming structure of the LED module PCB, characterized in that formed by 10 to 5%.