KR20090026380A - A led lighting fitting with jump heat sink - Google Patents

A led lighting fitting with jump heat sink Download PDF

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Publication number
KR20090026380A
KR20090026380A KR1020070091293A KR20070091293A KR20090026380A KR 20090026380 A KR20090026380 A KR 20090026380A KR 1020070091293 A KR1020070091293 A KR 1020070091293A KR 20070091293 A KR20070091293 A KR 20070091293A KR 20090026380 A KR20090026380 A KR 20090026380A
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South Korea
Prior art keywords
heat
heat dissipation
jump
led lighting
bridge
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KR1020070091293A
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Korean (ko)
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KR100914610B1 (en
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유영호
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화우테크놀러지 주식회사
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Priority to KR1020070091293A priority Critical patent/KR100914610B1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

An LED lighting fixture is provided to release the central part or the edge of the heat sink rapidly by forming the bridge connected jump as the outer ring. An LED lighting fixture comprises an optical source section, a heat-resisting unit, and a housing(50). The optical source section comprises one or more LEDs(11) and an LED mounting PCB(Printed Circuit Board)(13). The heat-resisting unit comprises a heat radiation fin(33) emitting the heat of the optical source section and the heat sink welded into the LED mounting PCB. The housing comprises a power supply connector(51) combining with the heat-resisting unit. The LED lighting fixture more includes a jump heat-resisting unit(30). A jump heat-resisting unit comprises a bridge(35) connected to the outermost in the central part of the heat sink. A bridge post(312) is protruded from the central part of the heat sink.

Description

점프방열수단을 구비한 엘이디 조명기구{A LED LIGHTING FITTING WITH JUMP HEAT SINK}LED luminaire with jump heat dissipation means {A LED LIGHTING FITTING WITH JUMP HEAT SINK}

본 발명은 엘이디 조명기구에 관한 것으로서, 특히 방열수단에 흡열부 중앙에서 외곽으로 점프 연결하는 브릿지가 구비됨으로써 흡열부의 중앙부나 외곽부의 방열이 균등ㆍ신속하게 이루어져 엘이디 열손상을 방지하고 엘이디 조명기구의 품질특성을 현저히 향상시켜 주도록 하는 점프방열수단을 구비한 엘이디 조명기구에 관한 것이다The present invention relates to an LED lighting device, and in particular, the heat dissipation means is provided with a bridge connecting the jump from the center of the heat absorbing portion to the outside, the heat dissipation of the central portion or the outer portion of the heat absorbing portion is evenly and quickly to prevent the LED thermal damage and The present invention relates to an LED lighting device having jump radiating means for significantly improving the quality characteristics.

엘이디(LED: Light Emitting Diode)는 종래의 광원에 비하여 소형이고 수명이 길뿐만 아니라 전기에너지가 빛에너지로 직접 변환되기 때문에 전력이 적게 소모되어 에너지 효율이 우수한 고광도를 발하며 고속응답 특성을 지니고 있으므로 이러한 엘이디를 광원으로 하는 다양한 조명기구가 개발되고 있다.LED (Light Emitting Diode) is smaller and longer lifespan than conventional light sources, and because electric energy is directly converted into light energy, it consumes less power, emits high brightness with high energy efficiency, and has fast response characteristics. Various lighting fixtures using LEDs as light sources have been developed.

한편으로 엘이디는 점등시 열이 발생되고, 방열이 원활하게 되지 못할 경우 엘이디의 수명을 단축시키고 조도가 떨어지게 되므로 엘이디 조명기구의 상기 장점 은 엘이디의 고열이 원활하게 방열되는 조건을 전제하고 있다. On the other hand, since the heat is generated when the LED is turned on, and the heat dissipation is not smooth, the life of the LED is shortened and the illuminance is lowered. Thus, the above advantages of the LED lighting device presuppose the condition that the high heat of the LED is radiated smoothly.

이러한 엘이디 수명이 좌우되는 온도 상한선은 55℃ 내외로서 엘이디 조명기구의 성패는 방열과 직결된다고 할 수 있다.The upper limit of the temperature on which the LED life is influenced is about 55 ° C., and thus the success or failure of the LED lighting device is directly related to heat dissipation.

일반적으로 엘이디 조명기구는 피씨비에 복수의 엘이디가 설치되는 광원부와 상기 피씨비에 접합되는 방열수단 및 상기 광원부 및 방열수단을 수용지지하는 하우징으로 구성되고, 상기 하우징에 피씨비와 전원을 연결하는 전원연결부가 구비되어 구성된다.In general, the LED lighting device is composed of a light source unit to which a plurality of LEDs are installed in the PCB, the heat dissipation means is bonded to the PC and the housing for receiving the light source and the heat dissipation means, the power connection for connecting the PC and power to the housing It is provided and configured.

그리고 종래 기술의 방열수단(130)은 도 7 및 도 8에 도시된 바와 같이, 피씨비(113)와 접속되는 원판형태로 되는 흡열부(131)와 흡열부(131) 외곽둘레에 소정 간격으로 복수의 방열핀(133)이 울타리형태로 일체로 돌출형성된다.As shown in FIGS. 7 and 8, the heat dissipation means 130 according to the related art has a plurality of heat dissipating portions 131 and the outer periphery of the heat absorbing portions 131 having a disc shape connected to the PCB 113. The heat radiation fins 133 are integrally formed to protrude in the form of a fence.

엘이디(111)가 점등되면서 피씨비(113)에서 발생되는 열기는 흡열부(131)를 통하여 흡열부 외곽둘레로 전달되고 외곽둘레에서 다시 방열핀(133)으로 순차적으로 전달되어 냉각열교환은 외기에 노출되는 흡열부의 외곽둘레와 방열핀에서 이루어진다.When the LED 111 is turned on, the heat generated from the PC 113 is transferred to the outer circumference of the heat absorbing portion through the heat absorbing portion 131, and is sequentially transmitted from the outer circumference to the heat dissipation fin 133, thereby exposing the cooling heat exchange to the outside air. It is made at the outer periphery of the heat absorbing part and the heat radiation fin.

이하에서는 설명을 위한 편의상 상기 흡열부(131)를 '중앙부(a)', '외곽부(c)', 중앙부와 외곽부 사이에 위치하는 '반경 중간구간(b)'으로 나누어 칭한다.Hereinafter, for convenience of description, the heat absorbing part 131 is divided into a 'center part (a)', 'outer part (c)', and a 'radial middle section (b)' located between the center part and the outer part.

흡열부(131)의 방열과정을 좀더 상세히 살펴보면 중앙부(a) →반경 중간구간(b) → 외곽부(c) → 방열핀(133)의 순서로 열기가 이동되면서 냉각열교환이 이루어지는 동시에 한편으로는 흡열부(31) 전구간인 중앙부(a), 반경 중간구간(b), 외곽부(c)에서 계속적으로 광원부(110)로부터의 흡열이 진행된다.Looking at the heat dissipation process of the heat absorbing portion 131 in more detail, the heat is moved in the order of the center portion (a) → the middle radius section (b) → the outer portion (c) → the heat dissipation fins 133 while cooling heat exchange is performed at the same time. The endotherm from the light source unit 110 continuously progresses in the central portion (a), the radial intermediate section (b), and the outer portion (c) which are all sections of the section 31.

이와 같이, 피씨비(113)와 접하는 흡열부(131) 중앙부(a)의 열기가 반경 중간구간(b)을 경유하여야만 외곽둘레 및 방열핀(133)으로 전달되고 반경 중간구간(b) 및 외곽부(c)에서도 흡열이 계속 이루어지는 관계로 흡열부(131) 외곽둘레와 방열핀(133)에서 냉각열교환이 아무리 계속되어도 중앙부(a)는 항시 열기가 높은 상태가 지속된다.As such, the heat of the heat absorbing portion 131 central portion (a) in contact with the PC 113 is transmitted to the outer periphery and the heat dissipation fin 133 only through the middle radius b, and the radius mid section b and the outer portion ( Even in c), the endotherm continues to be heat-retained at all times, regardless of how much the heat exchange is continued at the outer periphery of the heat absorbing portion 131 and the heat dissipation fin 133.

따라서, 피씨비(113)에 동일 와트(W) 레벨의 엘이디(111)가 실장된 경우에도 흡열부 중앙부와 외곽부 사이의 온도차에 의하여 중앙부(a)에 배치된 엘이디가 급속하게 손상을 입는 현상이 나타난다.Therefore, even when the LEDs 111 having the same wattage (W) level are mounted on the PC 113, a phenomenon in which the LED disposed at the center portion a is rapidly damaged by the temperature difference between the center portion and the outer portion of the heat absorbing portion may occur. appear.

이러한 이유로 고 와트(W)급 엘이디 조명기구에서는 휘도가 떨어지므로 엘이디 수량을 불필요하게 증가시켜야 설정 조도를 맞출 수 있고 이에 따라 전기에너지가 낭비되며 엘이디 수량이 많아지므로 제조원가가 상승되는 문제점이 있다.For this reason, in the high-watt (W) class LED lighting fixtures, the brightness is reduced, so that the number of LEDs need to be increased unnecessarily to meet the set illumination, and thus, the energy cost is increased and the number of LEDs increases, leading to a problem in manufacturing cost.

이러한 문제점에 대하여 흡열부의 두께를 크게 할 경우 방열속도가 증대될 수 있으나 이러한 구성은 원자재가 과다하게 소요되어 제조원가가 낭비되고 중량부담이 큰 문제점이 있다.When the thickness of the heat absorbing portion is increased for this problem, the heat dissipation rate may be increased, but such a configuration has a problem in that the raw material is excessively consumed and the manufacturing cost is wasteful.

본 발명은 상기한 문제점을 해소하기 위하여 안출된 것으로서,The present invention has been made to solve the above problems,

본 발명의 목적은 방열수단에 흡열부 중앙에서 외곽으로 점프 연결하는 브릿지가 구비됨으로써 흡열부의 중앙부나 외곽부의 방열이 균등ㆍ신속하게 이루어져 엘이디 열손상을 방지하고 엘이디 조명기구의 품질특성을 현저히 향상시켜 주도록 하는 점프방열수단을 구비한 엘이디 조명기구를 제공함에 있다An object of the present invention is provided with a bridge for the jump connection from the center of the heat absorbing portion to the outside of the heat absorbing means is equally and fast heat dissipation in the center or the outer portion of the heat absorbing portion to prevent the LED thermal damage and significantly improve the quality characteristics of the LED lighting fixture The present invention provides an LED lighting device having a jump heat dissipation means.

상기한 목적을 달성하는 본 발명에 따른 점프방열수단을 구비한 엘이디 조명기구는LED lighting device having a jump heat dissipation means according to the present invention for achieving the above object is

하나 이상의 엘이디(LED: Light Emitting Diode) 및 엘이디 실장 피씨비를 포함하는 광원부와 상기 엘이디 실장 피씨비에 접합되는 흡열부 외곽에 방열핀이 둘러 형성되며 광원부의 열기를 방출하기 위한 방열수단 및 상기 방열수단과 결합되고 전원연결부가 구비된 하우징이 구비되는 엘이디 조명기구에 있어서,A light source unit including at least one light emitting diode (LED) and an LED mounting PC, and a heat dissipation fin is formed around the heat absorbing unit joined to the LED mounting PC, and coupled with heat dissipation means for dissipating heat from the light source unit. In the LED lighting device is provided with a housing having a power connection,

흡열부 중앙부의 열기를 흡열부 반경 중간구간을 점프(jump)하여 외곽으로 전달하기 위하여 상기 흡열부 중앙부에서 최외곽으로 연결되는 브릿지가 구비된 점프방열수단을 포함하여 구성됨을 특징으로 한다.It characterized in that it comprises a jump heat dissipation means having a bridge connected to the outermost in the heat absorbing portion central portion to transfer the heat of the heat absorbing portion central portion of the heat absorbing portion radius (jump) to the outside.

상기한 구성을 지닌 본 발명에 따른 점프방열수단을 구비한 엘이디 조명기구는 방열수단에 흡열부 중앙에서 외곽으로 점프 연결하는 브릿지가 구비됨으로써 흡열부의 중앙부나 외곽부의 방열이 균등ㆍ신속하게 이루어져 엘이디 열손상을 방지하고 엘이디 조명기구의 품질특성을 현저히 향상시켜 주는 뛰어난 효과가 있다LED lighting device having a jump heat dissipation means according to the present invention having the above-described configuration is provided with a bridge to the jump connection from the center of the heat absorbing portion to the heat dissipation means by the heat dissipation of the central portion or the outer portion of the heat absorbing portion evenly and quickly It has an excellent effect of preventing damage and significantly improving the quality characteristics of LED lighting fixtures.

이하, 본 발명의 점프방열수단을 구비한 엘이디 조명기구에 대한 실시예를 첨부도면을 참조하여 보다 상세히 설명한다.Hereinafter, with reference to the accompanying drawings an embodiment of an LED lighting device having a jump radiating means of the present invention will be described in more detail.

도 1은 본 발명에 따른 일 실시예의 구성을 보이는 단면도, 도 2는 도 1에서 점프방열수단 발췌 분해도, 도 3은 도 2의 결합 평면도이다.1 is a cross-sectional view showing the configuration of an embodiment according to the present invention, Figure 2 is an exploded view of the jump radiating means in Figure 1, Figure 3 is a combined plan view of FIG.

도 1 내지 도 3에 도시된 바와 같이, 본 발명에 따른 일 실시예의 점프방열수단을 구비한 엘이디 조명기구(1)는 하나 이상의 엘이디(LED: Light Emitting Diode)(11) 및 엘이디 실장 피씨비를 포함하는 광원부(10)와 상기 엘이디 실장 피씨비(13)에 접합되는 흡열부(31) 외곽에 방열핀(33)이 둘러 형성되며 광원부(10)의 열기를 방출하기 위한 방열수단 및 상기 방열수단과 결합되고 전원연결부(51)가 구비된 하우징(50)이 구비되는 엘이디 조명기구에 있어서, 흡열부(31) 중앙부(a)의 열기를 흡열부 반경 중간구간(b)을 점프(jump)하여 외곽으로 전달하기 위하여 상기 흡열부(31) 중앙부에서 최외곽으로 연결되는 브릿지(35)가 구비된 점프방열수단(30)을 포함하여 구성되는 것이다.As shown in Figures 1 to 3, the LED lighting device 1 with a jump heat dissipation means of one embodiment according to the present invention includes one or more LED (Light Emitting Diode) (11) and LED mounting PC The heat dissipation fin 33 is formed around the heat absorbing portion 31 joined to the light source unit 10 and the LED mounting PC 13, and is combined with heat dissipation means for dissipating heat from the light source unit 10 and the heat dissipation means. In the LED lighting device is provided with a housing 50 having a power connection portion 51, the heat of the heat absorbing portion 31 central portion (a) jumps to the outer end of the heat absorbing portion radius intermediate section (b) In order to comprise a jump heat dissipation means 30 is provided with a bridge (35) connected to the outermost in the heat absorbing portion (31) center.

즉, 점프방열수단(30)이 흡열부(31)와 방열핀(33)으로 이루어지는 본체(30a) 에 브릿지(35)가 추가되는 것이다.That is, the bridge 35 is added to the main body (30a) consisting of the heat dissipation portion 31 and the heat dissipation fin (33).

여기서, 상기 점프방열수단(30)은 흡열부(31) 중앙부에 교각(312)이 일체로 돌출형성되며 방열핀(33)에는 내측으로 단턱부(332)가 돌출형성되고, 상기 브릿지(35)는 상기 교각(312)과 단턱부(332)를 연결하는 판체(352)로 구성됨이 바람직하다.Here, the jump heat dissipation means 30 is a pier 312 is integrally protruded in the central portion of the heat absorbing portion 31, the stepped portion 332 protrudes inward to the heat dissipation fin 33, the bridge 35 is Preferably, the pier 312 and the plate 352 connect the stepped portion 332.

본 발명에 따른 일 실시예로서, 4 내지 도 6에 도시된 바와 같이, 상기 점프방열수단(30)은 브릿지(35)가 흡열부(31) 중앙부(a) 일지점에서 점프하여 복수의 방열핀(33) 중 어느 하나로 연결되는 선형(線型)브릿지(354)로 되어 흡열부(31) 및 방열핀(33)에 방사상으로 배설될 수도 있다.As one embodiment according to the present invention, as shown in Figure 4 to 6, the jump heat dissipation means 30 is a bridge 35 is a plurality of heat dissipation fin ( 33 may be a linear bridge 354 connected to any one of the heat radiation portion 31 and the heat radiation fin 33 to be radially disposed.

상기 브릿지(35)는 열전도율이 높은 동(銅)이나 알루미늄 등으로 이루어지며, 본체(30a)에 대하여 나사결합 또는 열전도 접착제를 통한 부착, 또는 요철끼워맞춤 등 다양한 방법으로 일체화 조립된다.The bridge 35 is made of copper, aluminum, or the like having high thermal conductivity, and is integrally assembled by various methods such as attaching or screwing together with the main body 30a through an adhesive or thermally conductive adhesive.

상기 브릿지(35)는 본체(30a)에 일체로 형성될 수도 있다.The bridge 35 may be integrally formed with the main body 30a.

또한, 상기 점프방열수단(30)은 흡열부(31) 둘레 하방으로 주벽(32)이 연장형성되어 광원부 설치공간(37)을 형성하고, 상기 흡열부(31)에는 온도센서 설치홈(314) 및 케이블통공(316)이 형성된다.In addition, the jump heat dissipation means 30 has a circumferential wall 32 extending downwardly around the heat absorbing portion 31 to form a light source unit installation space 37, and the temperature sensor mounting groove 314 in the heat absorbing portion 31. And a cable through hole 316 is formed.

한편, 상기 광원부(10)는 열전도율이 높은 메탈피씨비가 채택됨이 바람직하다. 도면 중(도 1) 미설명 부호 '70'은 엘이디 광유도확산수단이다.On the other hand, the light source unit 10 is preferably a metal PC ratio of high thermal conductivity is adopted. In the drawing (Fig. 1), reference numeral 70 denotes an LED light induction diffusion means.

상기한 구성을 지닌 본 발명에 따른 점프방열수단을 구비한 엘이디 조명기구(1)의 작용상태를 살펴본다.It looks at the operating state of the LED lighting device (1) having a jump radiating means according to the present invention having the above configuration.

본 발명에 따른 점프방열수단(30)은 흡열부(31) 중앙부에서 최외곽으로 연결하는 브릿지(35)가 구비됨으로써 흡열부 중앙부(a)의 열기가 반경 중간구간(b)을 점프하여 직접 냉각열교환이 이루어지는 외곽의 방열핀(33)으로 전달되므로 방열이 신속 균등하게 이루어진다.The jump heat dissipation means 30 according to the present invention is provided with a bridge 35 connected from the center of the heat absorbing portion 31 to the outermost portion, so that the heat of the heat absorbing portion central portion (a) jumps directly to the radius intermediate section (b) to cool it directly. Since the heat transfer is delivered to the heat dissipation fin 33, the heat dissipation is made evenly and quickly.

즉, 흡열부(31) 중앙부(a)의 열기가 반경 중간구간(b) 및 외곽부(c)를 거치지 않고 외곽의 방열핀으로 점프 전달되어 냉각열교환이 이루어지므로 중앙부(a)나 반경 외곽부(c)의 온도가 균등하게 냉각열교환되어 방열이 효과적으로 이루어지는 것이다.That is, the heat of the heat absorbing portion 31 central portion (a) is jumped and transferred to the heat radiating fins of the outer portion without passing through the radial middle section (b) and the outer portion (c), so that the cooling heat exchange is made, the central portion (a) or the radius outer portion ( The temperature in c) is equally cooled and heat exchanged to effectively radiate heat.

이와 같이 본 발명은 방열수단에 상기 브릿지(35)가 구비됨으로써 흡열부(31)의 중앙부나 외곽부의 방열이 균등하게 신속히 이루어져 엘이디 열손상을 방지하고 엘이디 조명기구의 품질특성을 현저히 향상시켜 준다.Thus, the present invention is provided with the bridge 35 in the heat dissipation means is equally rapid heat dissipation of the central portion or the outer portion of the heat absorbing portion 31 to prevent the LED thermal damage and significantly improve the quality characteristics of the LED lighting fixtures.

여기에, 더하여 광원부의 피씨비(13)가 알루미늄 등의 열전도율이 높은 금속재질로 이루어지는 메탈피씨비를 사용함으로써 방열속도를 더욱 가속시킨다.In addition, the heat dissipation rate is further accelerated by the use of a metal PC made of a metal material having a high thermal conductivity such as aluminum.

이상, 본 발명의 바람직한 실시예를 첨부된 도면들을 참조로 설명하였다. 여기서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.In the above, preferred embodiments of the present invention have been described with reference to the accompanying drawings. Here, the terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, but should be interpreted as meanings and concepts corresponding to the technical spirit of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

도 1은 본 발명에 따른 일 실시예의 구성을 보이는 단면도1 is a cross-sectional view showing the configuration of an embodiment according to the present invention

도 2는 도 1에서 방열수단 발췌 분해도Figure 2 is an exploded view of the heat dissipation means in Figure 1

도 3은 도 2의 결합 평면도3 is a plan view of the combination of FIG.

도 4는 본 발명에 따른 일 실시예의 방열수단 단면도Figure 4 is a cross-sectional view of the heat radiation means of one embodiment according to the present invention

도 5는 도 4의 평면도5 is a plan view of FIG.

도 6은 본 발명에 따른 일 실시예의 방열수단 단면도Figure 6 is a cross-sectional view of the heat radiation means of one embodiment according to the present invention

도 7은 종래 기술 일 실시예의 방열수단 단면도Figure 7 is a cross-sectional view of the heat radiation means of one embodiment of the prior art

도 8은 도 7의 평면도8 is a plan view of FIG.

*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

1: 본 발명의 점프방열수단을 구비한 엘이디 조명기구1: LED lighting device having a jump heat dissipation means of the present invention

10: 광원부 11: 엘이디 13: 피씨비10: light source unit 11: LED 13: PCB

30: 방열수단 31: 흡열부 312: 교각30: heat dissipation means 31: heat absorbing portion 312: piers

314: 온도센서 설치홈 316: 케이블 통공 32: 주벽314: temperature sensor mounting groove 316: cable hole 32: main wall

33: 방열핀 332: 단턱부 35: 브릿지33: heat radiation fin 332: stepping portion 35: bridge

40: 전원공급 제어부 50: 하우징 51: 전원연결부40: power supply control unit 50: housing 51: power connection

Claims (3)

하나 이상의 엘이디(LED: Light Emitting Diode)(11) 및 엘이디 실장 피씨비를 포함하는 광원부(10)와 상기 엘이디 실장 피씨비(13)에 접합되는 흡열부(31) 외곽에 방열핀(33)이 둘러 형성되며 광원부(10)의 열기를 방출하기 위한 방열수단 및 상기 방열수단과 결합되고 전원연결부(51)가 구비된 하우징(50)이 구비되는 엘이디 조명기구에 있어서,A heat dissipation fin 33 is formed around the light source unit 10 including one or more LEDs (LEDs) 11 and LED mounting PCs and the heat absorbing unit 31 bonded to the LED mounting PCs 13. In the LED lighting device is provided with a heat dissipation means for dissipating heat of the light source unit 10 and the housing 50 is coupled to the heat dissipation means and provided with a power connection portion 51, 흡열부(31) 중앙부(a)의 열기를 흡열부 반경 중간구간(b)을 점프(jump)하여 외곽으로 전달하기 위하여 상기 흡열부(31) 중앙부에서 최외곽으로 연결되는 브릿지(35)가 구비된 점프방열수단(30)을 포함하여 구성됨을 특징으로 하는 점프방열수단을 구비한 엘이디 조명기구.The bridge 35 is connected to the outermost part of the heat absorbing part 31 in the outermost part in order to jump the heat of the heat absorbing part 31 to the outer part of the heat absorbing part radius middle section b. LED lighting device having a jump heat dissipation means, characterized in that it comprises a jump heat dissipation means (30). 청구항 1에 있어서,The method according to claim 1, 상기 점프방열수단(30)은 흡열부(31) 중앙부에 교각(312)이 일체로 돌출형성되며 방열핀(33)에는 내측으로 단턱부(332)가 돌출형성되고,The jump heat dissipation means 30 is a pier 312 is integrally formed in the central portion of the heat absorbing portion 31 and the stepped portion 332 is formed to protrude inward to the heat dissipation fin 33, 상기 브릿지(35)는 상기 교각(312)과 단턱부(332)를 연결하는 판체(352)로 구성됨을 특징으로 하는 점프방열수단을 구비한 엘이디 조명기구.The bridge 35 is an LED lighting device having a jump radiating means, characterized in that consisting of a plate body 352 connecting the pier 312 and the stepped portion (332). 청구항 1에 있어서,The method according to claim 1, 상기 점프방열수단(30)은 브릿지(35)가 흡열부(31) 중앙부 일지점에서 점프하여 복수의 방열핀(33) 중 어느 하나로 연결되는 선형(線型)브릿지(354)로 되어 흡열부(31) 및 방열핀(33)에 방사상으로 배설됨을 특징으로 점프방열수단을 구비한 엘이디 조명기구.The jump heat dissipation means 30 is a heat absorbing portion 31 is a bridge (35) is a linear bridge (354) connected to any one of the plurality of heat dissipation fins (33) by jumping at the central portion of the heat absorbing portion (31) And LED lighting device having a heat radiating means characterized in that it is radially disposed on the heat radiation fin (33).
KR1020070091293A 2007-09-10 2007-09-10 A led lighting fitting with jump heat sink KR100914610B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200446554Y1 (en) * 2009-03-26 2009-11-10 (주)에이치맥스 Led lamp for socket
KR100933990B1 (en) * 2009-05-20 2009-12-28 주식회사 파인테크닉스 Led lamp for power saving
KR100948315B1 (en) * 2009-04-06 2010-04-01 (주)솔라이트 Radiant heat plate of downright led lamp

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100756897B1 (en) * 2007-01-26 2007-09-07 주식회사 혜성엘앤엠 Led lighting lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200446554Y1 (en) * 2009-03-26 2009-11-10 (주)에이치맥스 Led lamp for socket
KR100948315B1 (en) * 2009-04-06 2010-04-01 (주)솔라이트 Radiant heat plate of downright led lamp
KR100933990B1 (en) * 2009-05-20 2009-12-28 주식회사 파인테크닉스 Led lamp for power saving

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