KR200470636Y1 - High ceiling LED lamp with converter - Google Patents

Abstract

The present invention relates to an LED lamp with a built-in converter for high ceiling lighting, and more particularly, to propose an improved heat dissipation structure in which a plurality of LED-mounted LED substrates and an aluminum heat dissipation fin are in direct contact with each other. The present invention relates to an LED lamp with a built-in converter that minimizes thermal resistance generated between heat dissipation structures and maximizes heat dissipation effect by securing a sufficient heat dissipation area.
The present invention has a hemispherical converter case in which the converter is built, a plurality of heat dissipation insert grooves have a cylindrical central column formed on the outer circumferential surface, and a coupling piece fitted to the heat dissipation insert insert grooves at the side thereof, A plurality of heat dissipation fins having openings and threaded through holes formed therein, a plurality of fin fixing members having screw inserting holes formed at both ends and a plurality of support protrusions at the lower end of the center, an LED substrate on which a plurality of LEDs are mounted, and a plurality of screws The fastening hole is characterized in that it comprises a circular base formed on the top, and an acrylic fixing material coupled to the circular base to fix the acrylic.

Description

High ceiling LED lamp with converter}

The present invention relates to an LED lamp with a built-in converter for high ceiling lighting, and more particularly, to propose an improved heat dissipation structure in which a plurality of LED-mounted LED substrates and an aluminum heat dissipation fin are in direct contact with each other. The present invention relates to an LED lamp with a built-in converter that minimizes thermal resistance generated between heat dissipation structures and maximizes heat dissipation effect by securing a sufficient heat dissipation area.

In general, LED (Light Emitting Diode) has a high luminous efficiency and a very long life compared to the conventional light source, and is rapidly replacing the existing light source.

However, since the LED used as the light source of the LED luminaire is a semiconductor device, the temperature of the junction inside the device must be maintained at a predetermined temperature, that is, in the case of LED, below 85 ° C. It is possible to maintain a long life (about 50,000 hours) of the LED, and therefore, it is important to make a heat dissipation structure that can sufficiently dissipate heat generated during LED operation to the outside to maintain the luminous efficiency and life of the LED. Do.

In a conventional general LED lamp with a converter, the heat of the LED transferred to the LED substrate is surface-contacted by using a heat conductive tape or a heat-dissipating adhesive tape or the like to transfer to a heat-dissipating structure formed of an aluminum die-casting molding, and the heat-dissipating structure is exposed to the atmosphere. The structure which radiates heat | heat | fever to air | atmosphere through the heat radiating area which is made is employ | adopted.

For example, as described in the registered Patent Publication No. 10-0956653 (registered on April 29, 2010, hereinafter referred to as 'Prior Art 1'), the heat dissipation structure of the LED lighting device of the prior art is LED and LED module including a ceramic PCB on which the LED is mounted, has a mounting portion and a coupling portion for the LED module, and a double-sided adhesive tape for heat dissipation includes a housing attached to the lower surface.

In addition, as described in Published Patent Publication No. 10-2011-0122257 (published November 10, 2011, hereinafter referred to as 'Prior Art 2'), the heat dissipation structure of the LED lamp of the prior art is placed inside the housing. A converter built-in unit that separates the upper and lower spaces to embed the converter in the upper space, a light source unit in which the LED is mounted on the substrate in the lower space, and a plurality of thin plate heat sinks each laminated with thermal conductive tape to cool the heat generated by the light source. It is comprised including the heat radiating part comprised.

However, the heat dissipation method according to the prior arts 1 and 2 is not suitable for high efficiency LED lamps because the heat dissipation performance is not sufficient due to low thermal conductivity (usually 5 W / mK or less) due to the material characteristics of the heat conductive tape. It is used in low power LED lamps, which do not require a relatively good heat dissipation effect and do not cause much heat dissipation. It is used.

Therefore, LED lamps having an improved heat dissipation structure in view of the reality that high-intensity discharge (HID) lamps and sodium lamps, which are existing high-cost light sources, are still mainly used for high-ceiling lightings of 5 m or more used in warehouses and factories. It is necessary to introduce.

In addition, as a configuration for increasing the heat dissipation performance of the LED lamp, there is a method of increasing the heat dissipation area of the heat dissipation structure formed by aluminum die casting, but this makes the size of the heat dissipation structure too large, the weight becomes heavy, and the manufacturing cost is very high. Since the product quality and economical efficiency are deteriorated, it is very detrimental in the economic and reliability review stage to be considered when replacing an existing luminaire with an LED lamp, which is an obstacle in spreading and distributing LED lighting.

Accordingly, the present invention is proposed to solve the above problems, and proposes a light weight LED lamp having a more efficient heat dissipation structure, thereby minimizing the heat resistance generated between the LED and the heat dissipation structure, and further provides sufficient heat dissipation area. The purpose of the present invention is to implement an LED lamp having a high heat dissipation effect.

In addition, the present invention in the configuration of the LED lamp as described above, by using a high-power LED instead of the conventional low-power LED lamp that could not be used to additionally enable to emit a sufficient amount of light required in high ceiling lighting The purpose.

In order to achieve the above object, the present invention is a hemispherical converter case in which a converter is built, a plurality of heat dissipation insert grooves are formed in the cylindrical center column formed on the outer circumferential surface, coupled to the heat dissipation insert insert grooves on the side A plurality of heat dissipation fins having a piece, at the lower end of which a plurality of heat dissipation fins having openings and threaded through holes formed therein, screw inserting holes formed at both ends, and a plurality of fin fixing members formed with a plurality of support protrusions at the lower end of the center, and a plurality of LEDs are mounted. The LED substrate, a plurality of screw fastening holes are formed in the upper base, characterized in that it comprises an acrylic fixing material for fixing the acrylic is coupled to the circular base.

In addition, the LED substrate and the heat dissipation fins are inserted into the screw insertion holes of the fin fixing member, and the LED substrate and the heat dissipation fins are closely attached to each other by fastening screws fastened to the screw fastening holes of the circular base.

Here, the converter bottom plate may be configured to further include a converter bottom plate between the lower end of the converter case and the upper end of the center pillar, wherein the heat dissipation fin is formed in a “∪” shape in which left and right sides and bottom surfaces are perpendicular to each other. The upper protrusion is formed to extend to the outside so that the seat is seated, a plurality of support protrusions are formed at the bottom of the center, the length of the center bottom from the top is lower than both ends of the screw insertion hole is formed that the "∩" shape It features.

According to the present invention, by using instead of the conventional LED lamp with a built-in converter that can not be used due to the shortage of light, the use of high ceiling lighting can be extended, and the structure and manufacturing method is very simple, manufacturing cost of the product produced In addition, the energy saving effect is very high because it can replace the lighting of homes or businesses that still rely on existing low-efficiency light sources.

In addition, according to the present invention, since the heat dissipation area of the heat dissipation fin can be greatly increased, and the heat generated from the LED can be effectively dissipated, the life of the LED lamp can be greatly extended, and it is much lighter than the conventional die casting heat dissipation structure. Since it is possible to reduce the weight, it is very advantageous in terms of production cost and cost reduction.

1 is a view showing a schematic appearance of a high ceiling lighting converter LED lamp according to the present invention.
Figure 2 is an exploded perspective view of a high ceiling lighting converter built-in LED lamp according to the present invention.
(A), (b), (c) is a figure which shows the structure of the heat radiation fin (Fin) among the structure of the LED lamp by this invention.
Figure 4 (a), (b) is a view showing the configuration of the fin fixing member of the configuration of the LED lamp according to the present invention.
5 (a) and 5 (b) are diagrams showing a coupling relationship between heat dissipation configurations among the LED lamps according to the present invention.
6 is a view showing a coupling configuration of the circular base and the acrylic fixing of the configuration of the LED lamp according to the present invention.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings, wherein: FIG.

1 is a view showing a schematic appearance of the LED lamp with a built-in converter for high ceiling lighting according to the present invention, Figure 2 is an exploded perspective view of the LED lamp shown in Figure 1, each configuration and coupling state constituting the LED lamp It is shown to understand in detail.

As shown in FIG. 2, the main configuration of the LED lamp according to the present invention includes a hemispherical converter case 11 in which a converter is embedded, a converter base plate 12 supporting the converter, and a plurality of heat dissipation inserts 21. It has a cylindrical center column 13 formed on the outer circumferential surface, and a coupling piece to be fitted to the heat dissipation 휜 insertion groove 21 on the side, the lower end is formed with an opening and a screw through hole 24 to which the 휜 fixing material is seated. A plurality of heat dissipation fins 15, a screw insertion hole 22 formed at both ends, a plurality of fin fixing members 14 having a plurality of support protrusions formed at the lower end of the center, and a LED substrate 16 on which a plurality of high-power LEDs are mounted. And, a plurality of screw fastening holes 25 includes a circular base 17 formed on the upper end, and an acrylic fixing member 19 for screwing and fastening the acrylic base 18 is coupled to the circular base 17.

In addition, according to FIG. 2, a socket coupling part 10 coupled to a power socket (not shown) is formed at the outer circumference of the upper center of the converter case 11 in which the converter is embedded, and the bottom surface of the converter case 11 is formed. The converter base plate 12 which supports the converter which is not shown inward is attached.

Although not specifically illustrated, the converter may include an AC / DC converter, which is generally used in an LED lamp, which is connected to a power socket coupling part 10 of the LED lamp in a power socket. When the power is applied, the external AC power is converted to DC power to drive the LED lamp.

In addition, the lower end of the converter base plate 12 attached to the bottom of the converter case 11 and the plurality of heat dissipation insert grooves 21 are formed on the outer circumferential surface is connected to the upper end of the column-shaped central column 13, and A connection hole is formed in the center of the converter base plate 12 so that an electric wire for supplying the DC power converted from the converter to the LED substrate 16 with the LED penetrates therethrough. The through hole is formed so that a line passes.

Next, with reference to Figure 3 will be described a heat radiation Fin (15) that is fitted with the heat radiation 휜 insertion groove 21 of the central column 13 shown in FIG.

The heat dissipation fin 15 is formed by bending an aluminum plate through a pressing operation or the like, and FIG. 3 illustrates one of the configurations of the heat dissipation fin 15 arranged in a circle as shown in FIG. 2. The schematic outline is the same as the perspective view of FIG.

In other words, when viewed from the side of the assembled LED lamp (see Fig. 1), the left and right sides and the bottom are substantially "∪" shape formed at right angles to each other, based on the inner part located in the center column, left / right According to a predetermined angle between the side has a form that the opening of the outer portion is wider than the inner portion coupled to the central column (13).

3 (b) shows a side view of the heat dissipation fin 15, and as shown in FIG. 3 (b), the heat dissipation fin insertion groove 21 of the central column 13 is located inside the heat dissipation fin 15. FIG. Coupling piece (32) is fitted in the vertical direction from the upper side to the lower side, and the fixing member 14 to be described later can be inserted between the coupling piece 32 and the bottom surface of the heat dissipation fin (15). An opening 33 is formed.

In addition, an upper end 31 extends outward from an upper end of the heat dissipation fin 15 so that the converter case 11 may be seated at a correct position. The bottom surface leads to a curved curve, and at the same time, the radial length of the bottom surface of the heat dissipation fin 15 forms a right trapezoidal trapezoid having a shape larger than the upper radial length.

In addition, (c) of Figure 3 shows the form of the bottom surface of the heat dissipation fin (15), the screw through hole 24 is formed at a predetermined point on both the inner side and the outer end of the heat dissipation fin (15), respectively, This is a hole through which the set screw 41 for fastening the pinned member 14 and the circular base 17 which are mentioned later passes.

Next, with reference to FIG. 4, the fin fixing material 14 which mounts on the bottom surface of the said heat radiation fin 15, and is inserted into the opening part 33 of the heat radiation fin 15 is demonstrated.

As shown in FIG. 4, FIG. 4 (a) shows the upper part, the side part, and the lower part of the fin fixing material 14, respectively, and FIG. 4 (b) is a structure by which the fin fixing material 14 is arrange | positioned , Which shows a form in which a plurality of fin fixing members 14 are arranged in a win type.

As shown in (a) of FIG. 4, the shock fixing member 14 has a shape of a rectangular shape having a substantially long transverse direction, and screw insertion holes 22 are formed at both ends of the left and right sides, and a length from an upper end to a lower center of the center is provided. It is characterized in that the screw insertion hole 22 is lower than the "∩" shape of both ends are formed.

In addition, a plurality of support protrusions 42 are provided at the lower end of the center of the bottom fixing member 14 so as to apply pressure to the heat dissipation fin 15 located at the bottom of the heat dissipation assembly.

Regarding the function of the support protrusion 42, a heat dissipation structure composed of the heat dissipation fin 15 and the fin fixing member 14 described above with reference to FIG. 5 will be described.

FIG. 5 shows a coupling configuration of the heat dissipation fin 15, the fin fixing member 14, the circular base 17, and the LED substrate 16 on which the LED 43 is mounted, and FIG. Fig. 5 (b) has shown the longitudinal section of the said connection structure, respectively.

As can be seen from FIG. 5, an LED substrate 16 is formed between the circular base 17 and the heat dissipation fin 15, and the heat dissipation fin 15 is formed by the fin fixing material 14 and the LED substrate. It is formed between the (16), the shock fixing member 14 and the circular base 17 is screwed to each other by a fixing screw 41.

In other words, the lower surface of the bottom surface of the heat dissipation fin 15 and the upper surface of the LED substrate 16 are in direct contact with each other between the fin fixing member 14 and the circular base 17. Through such a combined configuration, the heat generated from the LED 43 can be effectively conducted from the LED substrate 16 to the heat radiation fins 15.

The LED substrate 16 is, for example, a substrate made of an aluminum metal printed circuit board (Metal PCB), which is very advantageous in heat dissipation performance, is connected to a power line drawn from a converter, and is soldered to a lower portion of the plurality The power is applied to the LED 43.

In addition, the pressure is applied to the support protrusion 42 at the lower end of the shock fixing member 14 by the fastening pressure between the fastening screw 41 inserted into both ends of the shock fixing member 14 and the circular base 17 fastened thereto. Since the pressure has an effect of further pushing the bottom surface of the heat dissipation fin 15 between the fin fixing members 14 to be in close contact with the LED substrate 16, the pressure is more excellent than the heat dissipation structure through the conventional heat conductive tape or heat-sensitive adhesive tape. The heat dissipation effect can be expected, and through such a configuration, an additional heat dissipation structure is not necessary, which is advantageous in the manufacturing process.

6 illustrates the configuration of the circular base 17, the acrylic 18, and the acrylic fixing material 19 configured under the LED substrate 16 and the LED substrate 16, and the acrylic fixing material 19 ) Is in the form of a cap (Cap) is open at the bottom, the outer peripheral surface of the circular base 17 is screwed to each other on the inner circumferential surface of the acrylic fixing material 19, the acrylic 18 is fixed between them have.

The circular base 17 has a shape of a wheel that is supported by a plurality of support members in which a ring-shaped outer circle is radially disposed in a center circle, and is formed in the inner circumferential direction of the outer circle and the center circle. (2) A plurality of screw fastening holes for fastening with the fixing screw (41) of the fixing member (14) are formed, and a connection hole is formed at the center of the central circle part to pass the electric wire for applying power to the LED substrate (16), A fastening hole for fastening with the pillar 13 is also formed.

The LED substrate 16 is also in the form of a ring, the center of which is located at the center of the circular base 17, the LED between the center of the circular base 17 and the plurality of support members for supporting the outer circle To be located, a certain number of LEDs 43 are arranged at equal intervals radially from the center.

In the above, with reference to the drawings according to a preferred embodiment for carrying out the present invention.

Comparing the heat dissipation method of the present invention with the heat dissipation method of a conventional LED lamp with a built-in converter, the heat dissipation path of the LED lamp with a built-in converter is a heat dissipation path because it consists of LED → LED substrate → heat conduction tape → aluminum die casting heat dissipation structure → atmosphere. The process and steps are very complex, and the thermal resistance of the heat conducting tape or heat dissipation adhesive tape which is brought into contact with the die-cast heat dissipation structure is about 600 times larger than that of aluminum and is very disadvantageous in terms of heat dissipation performance.

However, the heat dissipation path of the LED lamp with a built-in converter of the present invention is LED → LED substrate → heat dissipation 휜 (aluminum plate) → atmosphere, so the heat dissipation process is very simple and the thermal resistance can be reduced to a minimum. Instead of the bulky and heavy aluminum die-casting heat-dissipating structure, the more efficient aluminum plate is used as the heat sink, which is advantageous in the production and manufacture of lightweight LED lamps.

In addition, since the heat dissipation structure of the present invention evenly compresses the entire contact surface between the LED substrate and the heat dissipation fins, swelling does not occur even after repeated thermal expansion and contraction, and the adhesion can be maintained evenly.

10. Socket coupling section 11. Converter case
12. Converter base plate 13. Center column
14. 휜 fixing material 15. heat dissipation 휜
16.LED Board 17.Circle Case
18. Acrylic 19. Acrylic fixing material
21. Heat Resistant 휜 Insertion Slot 22. Screw Insertion Hole
24. Screw through hole 25. Screw fastener
31. Top projection 32. Joining piece
33. Opening 41. Fixing screw
42. Supporting protrusion 43. LED

Claims (5)

A hemispherical converter case (11) having a built-in converter,
A central column 13 having a columnar shape in which a plurality of heat dissipation inserts 21 are formed on an outer circumferential surface thereof;
A plurality of heat dissipation fins having a coupling part 32 fitted to the heat dissipation fin insertion groove 21 at a side thereof, and having an opening 33 and a screw passage hole 24 in which the fin fixing member 14 is seated at a lower end thereof; 15) and,
A plurality of pinned fixing members 14 having screw insertion holes 22 formed at both ends and a plurality of support protrusions 42 formed at the lower end of the center,
An LED substrate 16 on which a plurality of LEDs 43 are mounted;
A circular base 17 having a plurality of screw fastening holes 25 formed thereon,
Combination with the circular base 17 is configured to include an acrylic fixing material 19 for fixing the acrylic 18,
The LED substrate 16 and the heat dissipation beam are inserted into the screw insertion hole 22 of the fin fixing member 14 by a fixing screw 41 fastened to the screw fastening hole 25 of the circular base 17. 15 are closely supported with each other,
The circular base (17) is a built-in converter LED lamp, characterized in that the ring-shaped outer circle is supported by the center circle by a plurality of support members arranged radially. The method of claim 1,
Between the lower end of the converter case 11 and the upper end of the center pillar (13) is a converter built-in LED lamp, characterized in that the converter further comprises a bottom plate (12). The method of claim 1,
The heat dissipation fin 15 is a "∪" shape consisting of right and left sides and bottom surfaces at right angles to each other, the upper protrusion 31 is formed to extend to the outside so that the converter case 11 is seated LED lamp with built-in converter. The method of claim 1,
The 휜 fixing member 14, a plurality of support projections 42 are formed at the center lower end, the length of the center lower end from the upper end is characterized in that the "∩" shape is lower than both ends of the screw insertion hole 22 is formed LED lamp with built-in converter. delete

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