KR101258120B1 - Led lighting module manufactured by printed circuit of film type - Google Patents

Led lighting module manufactured by printed circuit of film type Download PDF

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Publication number
KR101258120B1
KR101258120B1 KR1020120111841A KR20120111841A KR101258120B1 KR 101258120 B1 KR101258120 B1 KR 101258120B1 KR 1020120111841 A KR1020120111841 A KR 1020120111841A KR 20120111841 A KR20120111841 A KR 20120111841A KR 101258120 B1 KR101258120 B1 KR 101258120B1
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KR
South Korea
Prior art keywords
pi film
film
heat sink
step
led chip
Prior art date
Application number
KR1020120111841A
Other languages
Korean (ko)
Inventor
이풍우
김정헌
Original Assignee
주식회사 이티엘
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Filing date
Publication date
Application filed by 주식회사 이티엘 filed Critical 주식회사 이티엘
Priority to KR1020120111841A priority Critical patent/KR101258120B1/en
Application granted granted Critical
Publication of KR101258120B1 publication Critical patent/KR101258120B1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0522Using an adhesive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Abstract

The LED lighting apparatus according to the present invention includes a step of removing a releasing paper of a PI (polyimide) film, a step of applying heat and pressure to the PI film by applying an adhesive to the PI film, A step of printing in a predetermined pattern using a conductive paste, a step of plating the PI film printed with the conductive paste by electrolysis after immersing the PI film in the Cu electrolyte, printing the SR paste on the surface of the PI film coated with Cu, A step of printing a cream solder on the PI film side soldering portion, a step of automatically mounting the LED chip on the cream solder printing portion, a step of soldering the LED chip by applying heat to the cream solder after mounting the LED chip, Attaching an adhesive to the PI film, separating the PI film ledge into a unit product, contacting the unit printed circuit PI film by applying heat to the adhesive, To the LED lighting device, it characterized in that the step used in manufacture to maximize the adhesive force to remove air bubbles.

Description

(LED Lighting Module manufactured by Printed Circuit of Film Type)

The present invention relates to an LED lighting module in which a plurality of LED chips are mounted on a base heat sink having a film type printed circuit printed with an electric circuit pattern using conductive ink. The film on which the electric circuit pattern is printed using the conductive ink as described above has a structure in which the electric circuit pattern is printed on the base having a structure that is easy to manufacture due to a simple manufacturing process and can dissipate heat generated from the LED Thereby solving the problem caused by heat generation. The conductive ink is disclosed in Korean Patent Laid-Open Publication No. 10-2007-58816, and linear or branched saturated or unsaturated fatty acids substituted with an amino group, a nitro group, or the like having 2 to 16 carbon atoms and 1 to 3 carboxyl groups The aromatic carboxylic acid may be an organosol ink for forming a conductive line pattern composed of an effective amount, a reactive organic solvent forming a silver chelating agent or a complex and a polar or non-polar diluent solvent for controlling viscosity, or may be an organosol ink, May be a conductive ink used.

A conventional technique related to the present invention is disclosed in Korean Patent No. 10-1171984 (Aug. 08, 2012). FIG. 1 is a plan view of a conventional flexible LED module, and FIG. 2 is a configuration diagram of a current supply unit printed by a screen printing method using a conductive ink applied to a conventional flexible LED module. 1 to 2, the conventional flexible LED module includes a flexible heat sink 100, an LED 10, a current supply line portion 60, a current supply pad portion 50, and an LED support portion 20. The flexible heat sink 100 is a flexible heat sink, for example, a polybutylene terephthalate, a polyethylene terephthalate, a polysulfone, a polyether, a polyether, The flexible heat sink 100 may be any one of a polyether laminate and a polyarylate. Also, the flexible heat sink 100 may be a flexible heat sink, and a metal heat sink may be used. The metal heat dissipation plate may be a metal heat dissipation plate including any one of aluminum, copper, gold, silver, and nickel having excellent thermal conductivity. In the above, the LED 10 is formed as a light emitting element connected to the current supply line portion 60. At this time, the connection portion electrically connects the current supply line portion 60 and the LED 10 as connecting means such as cream soldering, conductive adhesive, or the like. The LEDs 10 may be regularly arranged along the current supply line unit 60 and may be connected in series. The current supply pad unit 50 may be formed on both sides of the flexible heat sink 100. In addition, the current supply pad portion 50 is formed on the upper and lower surfaces of the flexible heat sink 100, and a conductive material including any one of gold, silver, copper, and nickel may be formed by a screen printing method will be. In addition, the current supply pad portion 50 can be formed by a screen printing method on the flexible substrate 100 with a conductive ink such as carbon paste. In addition, the current supply line unit 60 is formed by providing at least one current in one direction on one surface of the flexible substrate to supply current to the LED 10. [ A plurality of current supply line portions 60 are formed vertically to the current supply pad portions 50 and a plurality of current supply line portions 60 are formed between the current supply pad portions 50 on both sides. ) Is formed by a screen printing method using a conductive material including any one of gold, silver, copper, and nickel, or a conductive ink such as carbon paste is formed on a flexible substrate 100 by a screen printing method . Here, the current supply line unit 60 can be formed in the same process as the current supply pad unit 50 in the same process. In addition, the current supply line unit 60 may be formed in an array of a plurality of parallel configurations, and the first current supply line 61a, the second current supply line 61b, the first connection bump 62a, The first current supply line 61a is connected to the first connection bump 62a and the first current supply line 61a includes a plurality of current supply lines and the number of the LEDs 10 It is formed in a corresponding number. The second current supply line 61b is connected to the second connection bump 62b. The second current supply line 61b includes a plurality of current supply lines. The second current supply line 61b is connected to the first current supply line 61a in a one- As shown in FIG. The positive terminal of the LED 10 is connected to the first connection bump 62a and the positive terminal of the LED 10 is connected to the second connection bump 62b, 2 connection bump 62b, and the + terminal may be connected to the first connection bump 62a. Further, when the current supply line unit 60 is formed of conductive ink, the LED 10 can be driven by its own resistance even if the current supply line unit 60 is not provided with a resistance. At this time, the sum of the lengths of the first current supply line 61a and the second current supply line 61b connected to any one of the LEDs is the sum of the lengths of the first current supply line 61a and the second current supply line 61b The current supplied to the LEDs is uniform since the total resistance value between the current supply lines of the current supply line unit 60 is equal to each other so that the brightness of the LED 10 can be made uniform There is a feature that is.

The flexible substrate to be applied to the conventional flexible LED module as described above is a metal substrate including a metal material of copper, gold, silver and nickel, and the current supply line 60 is printed on the flexible substrate by a print printing method The current supply line is electrically connected to each LED element through a connection part. The flexible substrate and the current supply line are made of conductive conductors and are not electrically insulated, so that the resistance increases. Therefore, a voltage deviation occurs in each LED part, And the adhesion strength between the conductive ink particles is low, so that heat is generated during the conduction or there is a problem such as short circuit. In addition, the conventional flexible LED module as described above includes a complicated and complicated process for applying epoxy, silicon, and acrylic materials to each LED on a separate LED support part because the adhesion strength of the printed circuit part is low. In order to solve the problems of the prior art as described above, the LED lighting module of the film-type printed circuit-attached method according to the present invention prints a conductive pattern on a PI film entirely with epoxy, silicone, The PI film on which the conductive pattern is printed through the step of energizing and electroplating the electrode circuit pattern for forming the resistance between the circuits to 0 OMEGA is adhered to the heat sinks of various shapes so that the manufacturing process is easy and the circuit of the electric supply line of the conductive pattern It is intended to minimize the resistance and the risk of short circuit. Another object of the present invention is to provide a base plate having various shapes by using a film on which conductive patterns are printed.

In order to solve the problems of the conventional art, the LED lighting module with a film-type printed circuit according to the present invention includes a step of removing a release paper of a PI (polyimide) film, a step of applying heat and pressure to an PI film A step of printing on the surface of the PI film coated with the adhesive with an electric circuit pattern using a paste containing a conductive material, a step of plating the PI film printed with the conductive paste by electrolysis after immersing the PI film in the Cu electrolyte, Printing an SR paste on the surface of the plated PI film; printing the cream solder on the soldered portion of the PI film; automatically mounting the LED chip on the cream solder printing portion; Attaching an adhesive to the base heat sink; separating the PI film ledge into a unit printed circuit PI film; A step of applying heat to the adhesive of the base heat dissipating plate by contacting the unit printed circuit PI film with the adhesive, and a step of maximizing the adhesive force using air pressure and heat and removing the bubbles, Is attached in various forms and is attached by soldering a unit printed circuit PI film.

The LED lighting module with the film-type printed circuit according to the present invention having the above-described structure has an excellent withstanding voltage characteristic and a simple manufacturing process, thereby reducing the manufacturing cost. Further, the LED lighting module of the film-type printed circuit-attaching method of the present invention has an effect of facilitating the formation of an electric circuit pattern on the base heat sink of various shapes.

1 is a plan view of a conventional flexible LED module,
FIG. 2 is a configuration diagram of a current supply unit printed by a screen printing method using a conductive ink applied to a conventional flexible LED module,
FIG. 3 is a flow chart of a method for manufacturing an LED module of a film-type printed circuit attachment method of the present invention,
Fig. 4 is a diagram showing the separation structure of the PI film ledge and release paper,
5 is a view showing that a PI film is coated with heat and pressure by applying an adhesive,
6 is a diagram showing a pattern in which a conductive paste is printed,
7 is a view showing a pattern after Cu plating and a pattern in which an SR paste is printed,
8 is a view showing a state in which cream solder is printed on the PI film pattern surface,
9 is a view showing a state in which an LED chip is mounted on a PI film cream solder portion,
10 is a view showing a state in which the LED chip is soldered to the PI film,
11 is a perspective view showing a state in which an adhesive is attached to the upper part of the base heat sink,
Fig. 12 is a perspective view of a PI film,
13 is a perspective view of the LED chip mounted on the base heat sink.

To achieve the above object, the LED lighting module of the film-type printed circuit board of the present invention will be described with reference to FIG. 3 to FIG.

FIG. 3 is a flowchart illustrating a method of manufacturing an LED module applied to an LED lighting module according to the film-type printed circuit attachment method of the present invention. 3, the method of manufacturing an LED module according to the present invention includes removing a release paper of a PI (polyimide) film (S21), a step of removing a release film of the PI A step (S22) of coating the adhesive with heat and pressure, a step (S23) of printing in various patterns using a paste containing a conductive material on the surface of the PI film coated with the adhesive (S23) (S25) of printing the SR paste on the surface of the PI film plated with Cu, and a step (S25) of printing the SR paste on the surface of the PI film on which the SR paste is printed, A step (S26) of printing the solder (S26), a step (S27) of mounting the LED to the cream solder printing section (S27), a step (S28) of soldering the LED chip by applying heat to the cream solder after the LED mounting, A step (S29) of attaching an adhesive to the plate (S29), a step (S30) of cutting out the PI film that has been soldered with the LED chip to the PI circuit, and heating the unit printed circuit PI film to heat the adhesive And a step S32 of maximizing the adhesive force and removing the air bubbles by using air pressure and heat. The step of printing the cream solder on the PI film side soldering portion may be followed by the step of automatically inspecting the cream solder printing after the step S26. In addition, after the LED chip is mounted, heat is applied to the cream solder to solder the LED chip The step of automatically inspecting the LED chip mounting state, the soldering state, and the like can be further configured. The step of adhering the adhesive to the heat sink is performed by applying heat for 7 seconds at a temperature of 100 ° C to adhere the adhesive to the unit printed circuit PI film. And the air pressure is 8 kg / cm 2 in the step of removing the air bubbles (step S32) by maximizing the adhesion force by using the air pressure and heat, and the temperature is heated at 150 ° C. for 1 hour to maximize the adhesion force And remove the air bubbles.

Fig. 4 is a view showing the separation of the PI film ledger 110 and the release paper 101. Fig. 4, the releasing paper 101 is separated from the PI film ledge 110 in order to coat the PI film with an adhesive.

Fig. 5 is a view showing coating of PI film with application of heat and pressure. Fig. In FIG. 5, the adhesive is applied by applying heat and pressure using a squeegee rubber and a screen frame.

6 is a view showing a pattern in which a conductive paste is printed. In FIG. 6, the conductive paste printing pattern forms various patterns and Cu is plated on the pattern.

7 is a view showing a pattern after Cu plating and a pattern in which an SR paste is printed. In FIG. 7, printing of Cu plating and SR paste is performed by forming a pattern with a conductive paste, immersing it in a Cu electrolyte, electrolyzing and plating Cu, and then printing an SR paste.

8 is a view showing a state in which cream solder is printed on the PI film pattern surface. In FIG. 8, printing the cream solder on the PI film pattern surface is for soldering the LED chip to the pattern surface.

9 is a view showing a state in which an LED chip is mounted on a PI film cream solder portion. In FIG. 9, a plurality of LED chips 120 are mounted on the PI film cream solder in various shapes such as a matrix.

10 is a view showing a state in which soldering of the LED chip 120 to the PI film is completed. PI film cream The solder is melted by applying heat to the solder part and the solder is made on the LED chip and PI film pattern side.

11 is a perspective view of the base heat sink with adhesive attached thereto. 11, the adhesive layer 300 is formed by heating an adhesive on the base heat sink 200 formed of a heat dissipation material. The heat-radiating material may be a metal, a ceramic, a carbide, a nitride, a boride, or a composite material, and the heating temperature for heating the adhesive is 100 ° C for 7 seconds.

Fig. 12 is a perspective view of a printed circuit PI film cut into a unit printed circuit PI film. 12 is a plan view of a printed circuit PI film 400 having an electric circuit pattern formed on a PI film ledge. In order to attach the PI circuit 150 to the upper part of the base heat sink 200, (150).

13 is a perspective view of the LED lighting module of the present invention with the LED chip mounted on the base heat sink. 13, an LED chip attached to various types of printed circuit PI films such as a matrix is separated into a unit printed circuit PI film 150, an adhesive layer 300 is formed on the base heat sink 200, The PI film is placed on the upper part of the base heat sink with the adhesive layer 300 formed thereon, and heat is applied to the PI film. In order to attach the PI film of the unit printed circuit attached to the upper part of the base heat sink, the heating is performed at 100 DEG C for 7 seconds. In order to maximize the adhesive force and to remove the bubbles, hot air having an air pressure of about 8 kg / cm 2 and a temperature of 150 ° C is heated for one hour to maximize the adhesive force and remove the bubbles. In order to dissipate the heat generated from the LED chip, air is circulated in parallel with the heat sink 200 under the base heat sink 200. The heat sink 200 is made of metal, ceramic, carbide, nitride, And the space 220 is formed with various heat dissipation shapes 240 such as a branch shape.

The LED lighting module with a film-type printed circuit manufactured through the above-described manufacturing method is advantageous in that it has a simple withstand voltage characteristic and a simple manufacturing process and thus has a low manufacturing cost and low power consumption.

10, 120: LED chip, 50: current supply pad portion,
60: current supply line portion, 100: flexible heat sink,
101: release paper, 110: PI film director,
150: unit printed circuit PI film, 200: base heat sink, 300: adhesive layer,

Claims (7)

  1. An LED lighting module with a film-type printed circuit for attaching and illuminating an LED chip to a base heat sink,
    In the LED lighting module with a film-type printed circuit for attaching and illuminating the LED chip to the base heat sink,
    A PI (polyimide) film from which release paper has been removed;
    Heat and pressure are applied to the PI film from which the release paper has been removed,
    A paste containing a conductive material printed in various patterns on the surface of the PI film coated with the adhesive;
    A CU plated through electrolysis after immersing the PI film printed with the conductive paste into a Cu electrolyte;
    An SR paste printed on the surface of the PI film coated with Cu;
    A cream solder printed on the patterned surface of the PI film on which the SR paste is printed;
    An LED chip which is mounted on the cream solder printing portion automatically and is soldered by applying heat to the cream solder;
    An adhesive layer 300 is formed on the adhesive layer 300. The adhesive layer 300 is automatically mounted on the cream solder printing portion and the cream solder is soldered to the base heat sink 200 The LED lighting module according to claim 1, wherein the LED chip is mounted on a base heat sink.
  2. The method according to claim 1,
    Wherein the base heat sink comprises:
    Wherein the LED chip is a base heat sink of a metal, a ceramic, a carbide, a nitride, and a boride.
  3. 3. The method of claim 2,
    In the LED lighting module with a film-type printed circuit for attaching and illuminating the LED chip to the base heat sink,
    And a space (220) through which air can flow under the base heat sink. The LED lighting module according to claim 1, wherein the LED chip is mounted on a base heat sink.
  4. The method of claim 3,
    In the LED lighting module with a film-type printed circuit for attaching and illuminating the LED chip to the base heat sink,
    The LED lighting module according to claim 1, further comprising a heat dissipation pattern (240) in the form of a branch in the space (220).


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KR1020120111841A 2012-10-09 2012-10-09 Led lighting module manufactured by printed circuit of film type KR101258120B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120111841A KR101258120B1 (en) 2012-10-09 2012-10-09 Led lighting module manufactured by printed circuit of film type

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120111841A KR101258120B1 (en) 2012-10-09 2012-10-09 Led lighting module manufactured by printed circuit of film type
PCT/KR2013/006133 WO2014058133A1 (en) 2012-10-09 2013-07-10 Printed circuit film attachment-type led lighting apparatus

Publications (1)

Publication Number Publication Date
KR101258120B1 true KR101258120B1 (en) 2013-04-25

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KR (1) KR101258120B1 (en)
WO (1) WO2014058133A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090010982A (en) * 2007-05-29 2009-01-30 파나소닉 주식회사 Circuit board and manufacturing method thereof
KR20110114494A (en) * 2010-04-13 2011-10-19 박재순 Light emitting module and method of producing of the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102324462B (en) * 2006-10-12 2015-07-01 凯博瑞奥斯技术公司 Nanowire-based transparent conductors and applications thereof
TWI573185B (en) * 2009-05-12 2017-03-01 美國伊利諾大學理事會 And a deformable micro-thin translucent printing scale of the display assembly of an inorganic light emitting diode

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090010982A (en) * 2007-05-29 2009-01-30 파나소닉 주식회사 Circuit board and manufacturing method thereof
KR20110114494A (en) * 2010-04-13 2011-10-19 박재순 Light emitting module and method of producing of the same

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