KR20130059871A - Light emitting modul - Google Patents

Light emitting modul Download PDF

Info

Publication number
KR20130059871A
KR20130059871A KR1020110126089A KR20110126089A KR20130059871A KR 20130059871 A KR20130059871 A KR 20130059871A KR 1020110126089 A KR1020110126089 A KR 1020110126089A KR 20110126089 A KR20110126089 A KR 20110126089A KR 20130059871 A KR20130059871 A KR 20130059871A
Authority
KR
South Korea
Prior art keywords
unit
light emitting
emitting module
pcbs
pin
Prior art date
Application number
KR1020110126089A
Other languages
Korean (ko)
Inventor
서승민
김오석
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020110126089A priority Critical patent/KR20130059871A/en
Publication of KR20130059871A publication Critical patent/KR20130059871A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting module is provided to control the directional angle of a semiconductor optical device by arranging a conductive bonding member on a unit PCB. CONSTITUTION: A unit PCB(20) is arranged in a row. The unit PCB includes a conductive pattern layer(23). A semiconductor optical device(3) is mounted on the unit PCB. A connection unit combines adjacent unit PCBs. The connection member includes a conductive bonding member(32) and a connection part(34) for connecting adjacent unit PCBs.

Description

Light emitting module {LIGHT EMITTING MODUL}

The present invention relates to a light emitting module, and more particularly, to a light emitting module including a structure in which a plurality of printed circuit boards (PCBs) on which semiconductor optical devices are mounted are connected by a connection unit. In particular, the present invention is suitable for a light emitting module using MCPCB (Metal Core Printed Circuit Board) as a PCB.

As a circuit board for semiconductor devices, a printed circuit board (PCB) based on an insulator such as FR-4 is known. A typical PCB is based on an insulator such as FR-4, forming a conductive pattern on the insulator, and mounting a terminal thereon to form a desired circuit.

In recent years, semiconductor optical devices such as light emitting diodes (LEDs) are emerging as new light sources. The LED is mounted on a circuit board at a package level or a chip level to configure a light emitting module, and the light emitting module is used for lighting equipment or a BLU (Back Light Unit).

LEDs generate a lot of heat during the light-emitting operation, even more so in the case of recently developed high-power LEDs. For this reason, when manufacturing a light emitting module including an LED, it is necessary to fully consider the heat dissipation problem. In the development of a light emitting module including a semiconductor optical device that generates a lot of heat, such as an LED, one approach to improving heat dissipation performance is to use a metal-based MCPCB having good heat dissipation performance.

In order to make the light emitting module long or large, a plurality of PCBs must be used in a long line. In addition, electrical connection between long PCBs is required. However, when connecting and using a plurality of MCPCBs, electrical separation must be preceded between metal substrates of neighboring MPCBs. In the MCPCB, the heat sink must be bonded in many areas. Due to its characteristics, the lower part of the MPCB is made of metal, which makes it difficult to make the terminal in the lower part. Due to this problem of the MCPCB, it was forced to place the terminal on top of the MPCB.

Although a method of mechanically and physically connecting MCPCBs using a socket type connector has been proposed, the method using a socket type connector is difficult to apply such as contacting the bottom of the MCPCB to a heat sink, and the size of the MCPCB is small. In case of having, the process of connecting the MCPCBs using the socket type connector itself is excessively complicated, cumbersome, and excessive cost increase.

Accordingly, one problem to be solved by the present invention includes a connection structure of a plurality of unit PCBs (especially MPCBs) in which semiconductor optical devices are mounted, but the connection structure is simple, inexpensive and reliable, and has an improved light emitting module. To provide.

Another object of the present invention is to include a connection structure of a plurality of unit PCBs in which a semiconductor optical device is mounted, the connection structure has little effect on the lower portion that can be in contact with the heat sink, when using the MPCB as a unit PCB It is to provide a light emitting module particularly suitable for.

The light emitting module according to an aspect of the present invention includes a plurality of unit PCBs arranged so that end surfaces thereof are adjacent to each other, a semiconductor optical element mounted on each of the unit PCBs, and a connection unit connecting neighboring unit PCBs. It includes. The connection unit includes a conductive connection member in common contact with terminals of neighboring unit PCBs, and fastening portions fastened to each of the neighboring unit PCBs in a state of being mechanically connected to each other.

According to an embodiment, the fastening parts may be pin type fastening parts inserted into fastening holes formed in the unit PCBs. The pin-type fastening parts may be inserted into through holes formed in the conductive connection member to be mechanically connected to each other, and may be fastened to the unit PCBs through the through holes. The connection unit may include a plurality of pin-type fastening portions with respect to one unit PCB, and the plurality of pin-shaped fastening portions may be integrally connected to a single head portion formed on the pin-shaped fastening portions. In contrast, the plurality of pin-shaped fastening parts may be separated from each other, including separate head parts formed on the pin-shaped fastening parts.

According to one embodiment, the conductive connecting member further comprises an insulating connecting frame coupled, the pin-type fastening portions may be integrally connected to the insulating connecting frame and connected to each other mechanically. The connection frame may include a top plate portion and a pair of side plate portions formed on both sides of the top plate portion, the conductive connection member may be coupled to the bottom surface of the top plate portion, and the pin-shaped fastening portions may be integrated. The connection frame may further include support jaws extending inwardly from each of the pair of side plates to support the unit PCBs. The connection frame may be elastically deformed so that the pair of side plates may be opened by an external force.

According to one embodiment, the fastening portions may be mechanically interconnected by an insulating connecting frame integrated with the fastening portions. The connection frame may include a top plate portion and a pair of side plate portions formed on both sides of the top plate portion, and the conductive connection member may be coupled to a bottom surface of the top plate portion. The fastening parts may be hook type fastening parts extending inwardly from each lower end of the pair of side plate parts, and the hook type fastening parts may be inserted into and fastened to fastening grooves formed at side lower ends of the unit PCBs.

According to an embodiment, the unit PCBs may be disposed on a heat sink, and the fastening portions may be fastened to the unit PCBs and the heat sink.

According to an embodiment, the unit PCBs may be disposed on a heat sink, and the pin type fastening portions may be inserted into fixing holes of the heat sink through the fastening holes formed in the unit PCBs.

According to an embodiment, each of the unit PCBs may include a metal substrate.

 According to the present invention, a plurality of unit PCBs on which semiconductor optical elements are mounted can be reliably mechanically and electrically connected by a connection unit having a simple structure. The connection unit includes a conductive connection member for electrically connecting the terminals of the neighboring unit PCBs, and fastening portions for mechanically connecting the neighboring unit PCBs. There is no danger. Holes are created in each of the unit PCBs and heat sinks of the MPCB type based on the metal substrate, and the pin-type fastening portions of the connection unit are continuously inserted into the holes to mechanically connect the unit PCBs, and at the same time, fix the heat sink. In this case, the pinned fastening portions may include an insulating material in whole or in part, and may be electrically and completely insulated from the conductive connecting member, the metal substrate of the unit PCBs and the heat sink by the insulating material. In this process, the conductive connecting member electrically connects the terminals to allow energization between the unit PCBs.

In addition, according to the present invention, since the conductive connection member is located on the unit PCB, the height can be easily adjusted as compared with the conventional socket type connector or the method of connecting the conductive wire, so as not to hinder the orientation angle of the semiconductor optical device. It also shows advantages in optical properties.

1 is a partial cross-sectional view showing a light emitting module including a connection unit according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing the connection unit shown in FIG. 1 in an exploded state. FIG.
3 is a plan view of the light emitting module shown in FIGS. 1 and 2.
4 is a plan view illustrating a light emitting module of another embodiment in which a part of the light emitting module of FIG. 3 is modified.
5 is a perspective view showing a light emitting module according to another embodiment of the present invention with one unit PCB separated;
6 is a cross-sectional view for explaining a connection unit of the light emitting module shown in FIG.
7 is a perspective view showing a light emitting module according to another embodiment of the present invention with one unit PCB separated;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

1 is a partial cross-sectional view showing a light emitting module including a connection unit according to an embodiment of the present invention, Figure 2 is a cross-sectional view showing the connection unit shown in Figure 1 in an exploded state. 3 is a plan view of the light emitting module illustrated in FIGS. 1 and 2, and FIG. 4 is a plan view showing a light emitting module according to an embodiment in which a part of the light emitting module of FIG. 3 is modified.

1 to 3, a light emitting module 1 according to an embodiment of the present invention includes a plurality of unit PCBs 20 and 20 and a semiconductor optical device mounted on each of the unit PCBs 20. 3) and a connection unit 30 for connecting between neighboring unit PCBs 20, 20.

The unit PCBs 20 and 20 are arranged so that end surfaces thereof are adjacent to each other, and are continuously connected by the connection unit 30 to form one integrated (or arrayed) PCB. Although only some of the two unit PCBs 20 and 20 are shown in the figure, it is noted that the number of the unit PCBs 20 and 20 may be more than two.

In addition, the light emitting module 1 includes a heat sink 40 made of a metal material having good thermal conductivity under the unit PCBs 20 and 20. The unit PCBs 20 may be attached to the top surface of the heat sink 40 by an adhesive material having good thermal conductivity.

The semiconductor optical device 3 may be an LED chip mounted directly on the unit PCB 20, and an LED package mounted on the unit PCB 20 with the LED chip mounted or stored on a separate substrate or reflector. Can be. For example, other semiconductor optical devices such as laser diodes may be used. Although only one semiconductor optical device 3 is shown on one unit PCB 20 in the drawing, a plurality of semiconductor optical devices 3 may be mounted on one unit PCB 20. The elements 3 may constitute one or more arrays.

In the present exemplary embodiment, each of the unit PCBs 20 and 20 is made of a metal core PCB (MCPCB) based on the metal substrate 21. In addition, each of the unit PCBs 20 and 20 includes a conductive pattern layer 23, and an insulating layer 22 is formed between the conductive pattern layer 23 and the metal substrate 21. The unit PCBs 20 and 20 include terminals at ends of the conductive pattern layer 23 as part of the conductive pattern layer 23. Here, since the terminal is part of the conductive pattern layer 23, the same member number "23" is also given to the terminal in the following for convenience.

Subsequently, an insulating reflective film 24 may be formed to cover the conductive pattern layer 23. The insulating reflective film 24 may be an area requiring exposure such as a portion where the terminal or the semiconductor optical device 3 is mounted. Is partially removed. The metal substrate 21 may be formed of, for example, Cu, Zn, Au, Ni, Al, Mg, Cd, Be, W, Mo, Si, Fe, or at least one alloy thereof. In addition, the metal substrate 21 may have a thickness of about 0.2 mm to 10 mm. In addition, the insulating film 22 is formed on the metal substrate 21 in a stacked manner, for example, it is preferable to be made of at least one of a silicon-based, acrylic- or ceramic-based material having good heat dissipation. The insulating layer 22 may have a thickness of 50 μm to 500 μm.

Each of the unit PCBs 20 may include two terminals 23 formed on an upper surface near an end portion, and the two terminals 23 and 23 may have different polarities.

The connection unit 30 is connected to the conductive connection members 32 in common contact with the corresponding terminals 23 and 23 of the neighboring unit PCBs 20 and 20. It includes fastening parts 34 fastened to each of the unit PCB (20, 20). The conductive connecting member 32 may include protruding contact ends 324 and 324 in an area in contact with the terminals 23 and 23.

The conductive connecting member 32 may be made of a metal material having good electrical conductivity and have a long thin plate structure in the longitudinal direction. Two through holes 322 and 322 are formed at both sides of the thin plate-shaped conductive connection member 32. The fastening parts 34 and 34 have a pin shape fitted into the through holes 322 and 322. The pinned fasteners 34, 34 may be at least partially electrically insulating. The two pin-shaped fastening portions 34 and 34 are fitted into each of the two through holes 322 and 322, so that they are connected to each other mechanically. Each of the pin-shaped fastening parts 34 and 34 includes a head part 342 having a larger size than the through-holes 322 and 322, and the pin-shaped fastening parts 34 and 34 by the head part 342. 34 is prevented from being separated from the through holes 322 and 322.

Fastening holes 25 and 25 are formed in each of the unit PCBs 20 to correspond to the pin-type fastening parts 34 and 34, respectively. Pin-shaped fastening portions 34 and 34 of the connection unit 30 are inserted into the fastening holes 25 and 25 of the two unit PCBs 25 and 25. Since the pin-shaped fastening parts 34 and 34 are mechanically connected by the thin plate-shaped conductive connecting member 32, the pin-shaped fastening parts 34 and 34 are inserted into the fastening holes 25 and 25. Two neighboring unit PCBs 20 and 20 are connected to each other and fixed in an end state adjacent to each other.

In addition, the heat sink 40 includes two fixing holes 45 and 45 to correspond to the pin-type fastening portions 34 and 34. The heat sink 40 may be more firmly fixed by inserting the pin-shaped fastening parts 34 and 34 through the fastening holes 25 and 25 into the fixing holes 45 and 45.

As shown in FIG. 3, since one unit PCB 20 has two terminals 23 and 23 which may be different in polarity from each other, the connection unit 30 may have terminals of two neighboring unit PCBs 20. Two thin plate conductors 32 are used to electrically connect them. In addition, the connection unit 30 has two pin-shaped fastening parts 34 and 34 used in combination with one thin plate-shaped conductor 32 and the other two pin-shaped pieces used in combination with another thin plate-shaped conductor 32. Fasteners 34, 34. Each of the pinned fastenings 34 is separated.

4 is a plan view showing another embodiment of the present invention including the pinned fastening portions of the modified structure. Referring to FIG. 4, two pin-shaped fastening parts 34 and 34 fastened to the unit PCB 20 are integrated by a single head part 342 ′. The remaining configuration can follow the previous embodiment as it is.

5 is a perspective view illustrating a light emitting module according to another embodiment of the present invention with one unit PCB separated, and FIG. 6 is a cross-sectional view illustrating a connection unit of the light emitting module shown in FIG. 5.

As shown in FIGS. 5 and 6, the light emitting module 100 according to the present embodiment, like the previous embodiment, has a plurality of unit PCBs 200 and 200 and the unit PCBs 200 and 200. And a connection unit 300 for connecting between the semiconductor optical elements 3 mounted in each, and the neighboring unit PCBs 200 and 200. The unit PCBs 200 and 200 are arranged so that end surfaces thereof are adjacent to each other, and are continuously connected by the connection unit 300 to form one integrated (or arrayed) PCB.

The connection unit 300 is connected to the conductive connection member 320 in common contact with corresponding terminals of the neighboring unit PCBs 200 and 200, and the neighboring unit PCB 200 in a state of being mechanically connected to each other. Insulating pin-type fastening portion 340 is fastened to each of the, 200.

 In the above embodiment, the pinned fastening portions 340 are mechanically connected via the conductive connecting member 320, but in the present embodiment, the pinned fastening portions 340 have an insulated connection having a channel-shaped cross section. It is integrated with the frame 330 and connected to each other mechanically.

The insulating connecting frame 330 integrally includes an upper plate portion 331 and a pair of side plate portions 332 and 332 extending downward from both sides of the upper plate portion 331. In this case, the insulating connection frame 330 may be formed of, for example, a material having good heat resistance, and formed of white color.

The pair of support jaws 334 and 334 protrude inwards from each other at the lower ends of the side plates 332 and 332. The upper plate portion 331 and the support jaw 334 is parallel. The pin-shaped fastening portions 340 are integrally formed side by side on the bottom surface of the upper plate portion 331.

When connecting two neighboring unit PCBs 200 and 200, the pin type fastening parts 340 are inserted into the fastening holes 250 formed in the unit PCBs 200 and 200, respectively. In this case, the unit PCB 200 is supported by the support jaw 334 while being positioned between the upper plate 331 and the support jaw 334 in the insulating connection frame 330. The insulating connecting frame 330 may be elastically deformed by a force spreading between the pair of side plates 332 and 332. By the elastic deformation and restoration, the unit PCBs 200 and 200 may be positioned between the upper plate 331 and the support jaw 334.

As illustrated in FIG. 6, the conductive connection member 320 is installed on the bottom surface of the upper plate portion 331 of the insulating connection frame 320, and the terminals 230 of the two neighboring unit PCBs 200 and 200 are provided. 230) in common. The conductive connection member 320 may be integrally coupled when the insulating connection frame 320 is formed, and may be installed by a coating method that is attached to the bottom surface of the upper plate portion 331 of the preformed insulating connection frame 320. . The conductive connection member 320 may include a protruding contact end in an area in contact with the terminals 230.

Subsequently, pin-type fastening parts 340 and 340, which are mechanically connected to each other by the connecting frame 330, are inserted into the fastening holes 250 and 250 of two adjacent unit PCBs 200 and 200. When the conductive connection member 320 is in common contact with the terminals 230 and 230, the connection unit 300 mechanically and electrically connects two neighboring unit PCBs 200 and 200. You can.

The unit PCBs 200 and 200 may be MCPCBs based on a metal substrate as described in the foregoing embodiments. In addition, the unit PCBs 200 and 200 may be coupled to an upper surface of a heat sink, not shown. In this case, the heat sink may have a shape in which the heat sink is in contact with the unit PCBs 200 and 200 while avoiding interference with the support jaw 334. Fixing holes, such as those described in the foregoing embodiments, may be provided in the heat sink, and the lengths of the pinned fastening parts 340 and 340 may be increased so that the pinned fastening parts 340 and 34 may be inserted into the fixing holes of the heat sink. .

7 is a cross-sectional view illustrating a light emitting module according to another embodiment of the present invention.

Referring to FIG. 7, the light emitting module 100 according to the present embodiment may include a plurality of unit PCBs 200 and 200 and semiconductors mounted on each of the unit PCBs 200 and 200, as in the previous embodiment. The optical device 3 and a connection unit 300 for connecting the neighboring unit PCBs 200 and 200 are included. The unit PCBs 200 and 200 are arranged so that end surfaces thereof are adjacent to each other, and are continuously connected by the connection unit 300 to form one integrated (or arrayed) PCB.

The connection unit 300 includes an insulating connecting frame 330 having a channel-shaped cross section as in the previous embodiment. Like the previous embodiment, the insulating connecting frame 330 integrally includes a top plate portion 331 and a pair of side plate portions 332 and 332 extending downward from both sides of the top plate portion 331.

Meanwhile, the connection unit 300 includes a plurality of hook type fastening parts 340 ′ instead of the pin type fastening parts of the foregoing embodiment. The hook type fastening portions 340 ′ extend inward from the side plates 332 and 332 of the insulating connecting frame 330 and have a narrower width than the side plates 332 and 332. The hook type fastening parts 340 ′ are integrated with the insulating connecting frame 330, and thus are connected to each other mechanically. When connecting two neighboring unit PCBs 200 and 200, the hook type fastening portions 340 ′ are inserted into fastening grooves 250 ′ formed at lower sides of respective side of the unit PCBs 200 and 200. do. The fastening grooves 250 'are formed at both sides of each of the unit PCBs 200 and 200, and the hook type fastening portions 340' are positioned correspondingly. The fastening groove 250 ′ may be an elongated groove in a width direction extending from one side of the unit PCB 200 to the other side thereof.

The insulating connecting frame 330 may be elastically deformed by a force spreading between the hook-type fastening portions 340 ′ on both sides.

The remaining configurations are the same as or similar to the previous embodiment, so further description is omitted to avoid duplication.

Claims (16)

A plurality of unit PCBs arranged such that end surfaces thereof are adjacent to each other;
A semiconductor optical device mounted on each of the unit PCBs; And
A connection unit for connecting between neighboring unit PCBs,
The connection unit,
Conductive connection members in common contact with terminals of neighboring unit PCBs;
The light emitting module comprising fastening parts fastened to each of the neighboring unit PCBs in a state connected to each other mechanically. The light emitting module of claim 1, wherein the fastening parts are pin-type fastening parts inserted into fastening holes formed in the unit PCBs.  The light emitting module according to claim 2, wherein the pin type fastening parts are inserted into through holes formed in the conductive connection member and connected to each other mechanically, and are fastened to the unit PCBs through the through holes. The method of claim 3, wherein the connection unit comprises a plurality of pin-shaped fastening portions for one unit PCB, the plurality of pin-shaped fastening portions is characterized in that the integrally connected to a single head portion formed on top of the pin-shaped fastening portions Light emitting module. The method according to claim 3, wherein the connection unit comprises a plurality of pin-shaped fastening portions for one unit PCB, the plurality of pin-shaped fastening portions are separated from each other including a separate head portion formed on top of the pin-shaped fastening portions Light emitting module characterized in that. The light emitting module of claim 2, further comprising an insulating connecting frame coupled to the conductive connecting member, wherein the pin-type fastening parts are integrally connected to the insulating connecting frame and mechanically connected to each other. The light emitting module according to claim 6, wherein the connection frame includes a top plate portion and a pair of side plate portions formed on both sides of the top plate portion, wherein the conductive connection member is coupled to the bottom surface of the top plate portion, and the pin type fastening portions are integrated. .   The light emitting module of claim 7, wherein the connection frame further comprises support jaws extending inwardly from each of the pair of side plate parts to support the unit PCBs. The light emitting module according to claim 6, wherein the connection frame is elastically deformable so as to be opened between the pair of side plates by an external force. The light emitting module of claim 1, wherein the fastening parts are mechanically interconnected by an insulating connecting frame integrated with the fastening parts.  The light emitting module according to claim 10, wherein the connection frame includes a top plate portion and a pair of side plate portions formed on both sides of the top plate portion, and the conductive connection member is coupled to a bottom surface of the top plate portion. The method of claim 10, wherein the fastening portions are hook-type fastening portions formed to extend inwardly from each lower end of the pair of side plate portions, the hook-type fastening portions are inserted into the fastening grooves formed in the lower side of the unit PCB Light emitting module, characterized in that fastened. The light emitting module of claim 1, wherein the unit PCBs are disposed on a heat sink, and the fastening parts are fastened to the unit PCBs and the heat sink. The light emitting module according to claim 2, wherein the unit PCBs are disposed on a heat sink, and the pin-shaped fastening portions are inserted into fixing holes of the heat sink through the fastening holes formed in the unit PCBs. The light emitting module of claim 1, wherein each of the unit PCBs comprises a metal substrate. The light emitting module of claim 1, wherein the fastening portions include an insulating material.
KR1020110126089A 2011-11-29 2011-11-29 Light emitting modul KR20130059871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110126089A KR20130059871A (en) 2011-11-29 2011-11-29 Light emitting modul

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110126089A KR20130059871A (en) 2011-11-29 2011-11-29 Light emitting modul

Publications (1)

Publication Number Publication Date
KR20130059871A true KR20130059871A (en) 2013-06-07

Family

ID=48858620

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110126089A KR20130059871A (en) 2011-11-29 2011-11-29 Light emitting modul

Country Status (1)

Country Link
KR (1) KR20130059871A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012611A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Method for manufacturing structure for flexible printed circuit boards
WO2015012608A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Structure for flexible printed circuit boards
WO2015012612A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Flexible printed circuit board structure
WO2015012613A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Flexible printed circuit boards structure
WO2015012610A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Organic light-emitting element

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012611A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Method for manufacturing structure for flexible printed circuit boards
WO2015012608A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Structure for flexible printed circuit boards
WO2015012612A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Flexible printed circuit board structure
WO2015012613A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Flexible printed circuit boards structure
WO2015012610A1 (en) * 2013-07-24 2015-01-29 주식회사 엘지화학 Organic light-emitting element
KR20150012107A (en) * 2013-07-24 2015-02-03 주식회사 엘지화학 Method for manufacturing structure of flexible printed circuit board
KR20150012108A (en) * 2013-07-24 2015-02-03 주식회사 엘지화학 Structure of flexible printed circuit board
KR20150012106A (en) * 2013-07-24 2015-02-03 주식회사 엘지화학 Organic Light Emitting Diodes
KR20150012109A (en) * 2013-07-24 2015-02-03 주식회사 엘지화학 Structure of flexible printed circuit board
KR20150012105A (en) * 2013-07-24 2015-02-03 주식회사 엘지화학 Structure of flexible printed circuit board
CN105393380A (en) * 2013-07-24 2016-03-09 株式会社Lg化学 Method for manufacturing structure for flexible printed circuit boards
CN105409026A (en) * 2013-07-24 2016-03-16 株式会社Lg化学 Flexible printed circuit board structure
CN105409028A (en) * 2013-07-24 2016-03-16 株式会社Lg化学 Structure for flexible printed circuit boards
CN105409027A (en) * 2013-07-24 2016-03-16 株式会社Lg化学 Organic light-emitting element
CN105409028B (en) * 2013-07-24 2017-12-01 乐金显示有限公司 The structure of flexible printed circuit board
US9872389B2 (en) 2013-07-24 2018-01-16 Lg Display Co., Ltd. Flexible printed circuit board structure
US9899627B2 (en) 2013-07-24 2018-02-20 Lg Display Co., Ltd. Organic light emitting diode
US9907171B2 (en) 2013-07-24 2018-02-27 Lg Display Co., Ltd. Flexible printed circuit boards structure
US9974164B2 (en) 2013-07-24 2018-05-15 Lg Display Co., Ltd. Structure for flexible printed circuit boards
US10206290B2 (en) 2013-07-24 2019-02-12 Lg Display Co., Ltd. Method for manufacturing structure for flexible printed circuit boards
US10264670B2 (en) 2013-07-24 2019-04-16 Lg Display Co., Ltd. Structure for flexible printed circuit boards

Similar Documents

Publication Publication Date Title
EP2216858B1 (en) Jumper connector for a lighting assembly
US7622795B2 (en) Light emitting diode package
JP5714899B2 (en) Solderless integrated package connector and LED for LED
US8492777B2 (en) Light emitting diode package, lighting device and light emitting diode package substrate
JP5669188B2 (en) LED lighting assembly
JP6031666B2 (en) Light-emitting device having spring-type LED holding part
JP5871621B2 (en) LED device, manufacturing method thereof, and light emitting device
CN102313170B (en) Light emitting device and illumination apparatus
US20140160747A1 (en) Inter-connectable modular lighting fixtures
JP2012004391A (en) Light-emitting device and luminaire
KR20130059871A (en) Light emitting modul
US9046252B2 (en) LED lamp
JP5711240B2 (en) Light source module and light emitting device
CN100483712C (en) Light emitting diode assembly
JP5404705B2 (en) Manufacturing method of semiconductor light emitting element mounting module, and manufacturing method of semiconductor light emitting element module
JP2009088373A (en) Led lamp module
TW201324883A (en) Semiconductor light-emitting element mounting module, and semiconductor light-emitting element module
KR102476138B1 (en) Connector, light source module and light source module array using the same
US20100027277A1 (en) Light emitting diode package
JP7054429B2 (en) Light emitting device, light emitting module and its manufacturing method
KR20180026497A (en) LED lighting device
KR20110097212A (en) Led lamp comprising led module and module case
KR100638881B1 (en) Led assembly having led package inserted into metal board
KR20110023402A (en) Electric connection element for metal core printed circuit board and light emitting device comprising the same
TW201243225A (en) Light-emitting device with spring-loaded LED-holder

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right