KR20130059871A - Light emitting modul - Google Patents
Light emitting modul Download PDFInfo
- Publication number
- KR20130059871A KR20130059871A KR1020110126089A KR20110126089A KR20130059871A KR 20130059871 A KR20130059871 A KR 20130059871A KR 1020110126089 A KR1020110126089 A KR 1020110126089A KR 20110126089 A KR20110126089 A KR 20110126089A KR 20130059871 A KR20130059871 A KR 20130059871A
- Authority
- KR
- South Korea
- Prior art keywords
- unit
- light emitting
- emitting module
- pcbs
- pin
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 3
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
The present invention relates to a light emitting module, and more particularly, to a light emitting module including a structure in which a plurality of printed circuit boards (PCBs) on which semiconductor optical devices are mounted are connected by a connection unit. In particular, the present invention is suitable for a light emitting module using MCPCB (Metal Core Printed Circuit Board) as a PCB.
As a circuit board for semiconductor devices, a printed circuit board (PCB) based on an insulator such as FR-4 is known. A typical PCB is based on an insulator such as FR-4, forming a conductive pattern on the insulator, and mounting a terminal thereon to form a desired circuit.
In recent years, semiconductor optical devices such as light emitting diodes (LEDs) are emerging as new light sources. The LED is mounted on a circuit board at a package level or a chip level to configure a light emitting module, and the light emitting module is used for lighting equipment or a BLU (Back Light Unit).
LEDs generate a lot of heat during the light-emitting operation, even more so in the case of recently developed high-power LEDs. For this reason, when manufacturing a light emitting module including an LED, it is necessary to fully consider the heat dissipation problem. In the development of a light emitting module including a semiconductor optical device that generates a lot of heat, such as an LED, one approach to improving heat dissipation performance is to use a metal-based MCPCB having good heat dissipation performance.
In order to make the light emitting module long or large, a plurality of PCBs must be used in a long line. In addition, electrical connection between long PCBs is required. However, when connecting and using a plurality of MCPCBs, electrical separation must be preceded between metal substrates of neighboring MPCBs. In the MCPCB, the heat sink must be bonded in many areas. Due to its characteristics, the lower part of the MPCB is made of metal, which makes it difficult to make the terminal in the lower part. Due to this problem of the MCPCB, it was forced to place the terminal on top of the MPCB.
Although a method of mechanically and physically connecting MCPCBs using a socket type connector has been proposed, the method using a socket type connector is difficult to apply such as contacting the bottom of the MCPCB to a heat sink, and the size of the MCPCB is small. In case of having, the process of connecting the MCPCBs using the socket type connector itself is excessively complicated, cumbersome, and excessive cost increase.
Accordingly, one problem to be solved by the present invention includes a connection structure of a plurality of unit PCBs (especially MPCBs) in which semiconductor optical devices are mounted, but the connection structure is simple, inexpensive and reliable, and has an improved light emitting module. To provide.
Another object of the present invention is to include a connection structure of a plurality of unit PCBs in which a semiconductor optical device is mounted, the connection structure has little effect on the lower portion that can be in contact with the heat sink, when using the MPCB as a unit PCB It is to provide a light emitting module particularly suitable for.
The light emitting module according to an aspect of the present invention includes a plurality of unit PCBs arranged so that end surfaces thereof are adjacent to each other, a semiconductor optical element mounted on each of the unit PCBs, and a connection unit connecting neighboring unit PCBs. It includes. The connection unit includes a conductive connection member in common contact with terminals of neighboring unit PCBs, and fastening portions fastened to each of the neighboring unit PCBs in a state of being mechanically connected to each other.
According to an embodiment, the fastening parts may be pin type fastening parts inserted into fastening holes formed in the unit PCBs. The pin-type fastening parts may be inserted into through holes formed in the conductive connection member to be mechanically connected to each other, and may be fastened to the unit PCBs through the through holes. The connection unit may include a plurality of pin-type fastening portions with respect to one unit PCB, and the plurality of pin-shaped fastening portions may be integrally connected to a single head portion formed on the pin-shaped fastening portions. In contrast, the plurality of pin-shaped fastening parts may be separated from each other, including separate head parts formed on the pin-shaped fastening parts.
According to one embodiment, the conductive connecting member further comprises an insulating connecting frame coupled, the pin-type fastening portions may be integrally connected to the insulating connecting frame and connected to each other mechanically. The connection frame may include a top plate portion and a pair of side plate portions formed on both sides of the top plate portion, the conductive connection member may be coupled to the bottom surface of the top plate portion, and the pin-shaped fastening portions may be integrated. The connection frame may further include support jaws extending inwardly from each of the pair of side plates to support the unit PCBs. The connection frame may be elastically deformed so that the pair of side plates may be opened by an external force.
According to one embodiment, the fastening portions may be mechanically interconnected by an insulating connecting frame integrated with the fastening portions. The connection frame may include a top plate portion and a pair of side plate portions formed on both sides of the top plate portion, and the conductive connection member may be coupled to a bottom surface of the top plate portion. The fastening parts may be hook type fastening parts extending inwardly from each lower end of the pair of side plate parts, and the hook type fastening parts may be inserted into and fastened to fastening grooves formed at side lower ends of the unit PCBs.
According to an embodiment, the unit PCBs may be disposed on a heat sink, and the fastening portions may be fastened to the unit PCBs and the heat sink.
According to an embodiment, the unit PCBs may be disposed on a heat sink, and the pin type fastening portions may be inserted into fixing holes of the heat sink through the fastening holes formed in the unit PCBs.
According to an embodiment, each of the unit PCBs may include a metal substrate.
According to the present invention, a plurality of unit PCBs on which semiconductor optical elements are mounted can be reliably mechanically and electrically connected by a connection unit having a simple structure. The connection unit includes a conductive connection member for electrically connecting the terminals of the neighboring unit PCBs, and fastening portions for mechanically connecting the neighboring unit PCBs. There is no danger. Holes are created in each of the unit PCBs and heat sinks of the MPCB type based on the metal substrate, and the pin-type fastening portions of the connection unit are continuously inserted into the holes to mechanically connect the unit PCBs, and at the same time, fix the heat sink. In this case, the pinned fastening portions may include an insulating material in whole or in part, and may be electrically and completely insulated from the conductive connecting member, the metal substrate of the unit PCBs and the heat sink by the insulating material. In this process, the conductive connecting member electrically connects the terminals to allow energization between the unit PCBs.
In addition, according to the present invention, since the conductive connection member is located on the unit PCB, the height can be easily adjusted as compared with the conventional socket type connector or the method of connecting the conductive wire, so as not to hinder the orientation angle of the semiconductor optical device. It also shows advantages in optical properties.
1 is a partial cross-sectional view showing a light emitting module including a connection unit according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing the connection unit shown in FIG. 1 in an exploded state. FIG.
3 is a plan view of the light emitting module shown in FIGS. 1 and 2.
4 is a plan view illustrating a light emitting module of another embodiment in which a part of the light emitting module of FIG. 3 is modified.
5 is a perspective view showing a light emitting module according to another embodiment of the present invention with one unit PCB separated;
6 is a cross-sectional view for explaining a connection unit of the light emitting module shown in FIG.
7 is a perspective view showing a light emitting module according to another embodiment of the present invention with one unit PCB separated;
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.
1 is a partial cross-sectional view showing a light emitting module including a connection unit according to an embodiment of the present invention, Figure 2 is a cross-sectional view showing the connection unit shown in Figure 1 in an exploded state. 3 is a plan view of the light emitting module illustrated in FIGS. 1 and 2, and FIG. 4 is a plan view showing a light emitting module according to an embodiment in which a part of the light emitting module of FIG. 3 is modified.
1 to 3, a
The
In addition, the
The semiconductor
In the present exemplary embodiment, each of the
Subsequently, an insulating
Each of the
The
The conductive connecting
Fastening holes 25 and 25 are formed in each of the
In addition, the
As shown in FIG. 3, since one
4 is a plan view showing another embodiment of the present invention including the pinned fastening portions of the modified structure. Referring to FIG. 4, two pin-shaped
5 is a perspective view illustrating a light emitting module according to another embodiment of the present invention with one unit PCB separated, and FIG. 6 is a cross-sectional view illustrating a connection unit of the light emitting module shown in FIG. 5.
As shown in FIGS. 5 and 6, the
The
In the above embodiment, the pinned
The insulating connecting
The pair of
When connecting two neighboring
As illustrated in FIG. 6, the
Subsequently, pin-
The
7 is a cross-sectional view illustrating a light emitting module according to another embodiment of the present invention.
Referring to FIG. 7, the
The
Meanwhile, the
The insulating connecting
The remaining configurations are the same as or similar to the previous embodiment, so further description is omitted to avoid duplication.
Claims (16)
A semiconductor optical device mounted on each of the unit PCBs; And
A connection unit for connecting between neighboring unit PCBs,
The connection unit,
Conductive connection members in common contact with terminals of neighboring unit PCBs;
The light emitting module comprising fastening parts fastened to each of the neighboring unit PCBs in a state connected to each other mechanically.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110126089A KR20130059871A (en) | 2011-11-29 | 2011-11-29 | Light emitting modul |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110126089A KR20130059871A (en) | 2011-11-29 | 2011-11-29 | Light emitting modul |
Publications (1)
Publication Number | Publication Date |
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KR20130059871A true KR20130059871A (en) | 2013-06-07 |
Family
ID=48858620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020110126089A KR20130059871A (en) | 2011-11-29 | 2011-11-29 | Light emitting modul |
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KR (1) | KR20130059871A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015012611A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Method for manufacturing structure for flexible printed circuit boards |
WO2015012608A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Structure for flexible printed circuit boards |
WO2015012612A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Flexible printed circuit board structure |
WO2015012613A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Flexible printed circuit boards structure |
WO2015012610A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Organic light-emitting element |
-
2011
- 2011-11-29 KR KR1020110126089A patent/KR20130059871A/en active IP Right Grant
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015012611A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Method for manufacturing structure for flexible printed circuit boards |
WO2015012608A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Structure for flexible printed circuit boards |
WO2015012612A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Flexible printed circuit board structure |
WO2015012613A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Flexible printed circuit boards structure |
WO2015012610A1 (en) * | 2013-07-24 | 2015-01-29 | 주식회사 엘지화학 | Organic light-emitting element |
KR20150012107A (en) * | 2013-07-24 | 2015-02-03 | 주식회사 엘지화학 | Method for manufacturing structure of flexible printed circuit board |
KR20150012108A (en) * | 2013-07-24 | 2015-02-03 | 주식회사 엘지화학 | Structure of flexible printed circuit board |
KR20150012106A (en) * | 2013-07-24 | 2015-02-03 | 주식회사 엘지화학 | Organic Light Emitting Diodes |
KR20150012109A (en) * | 2013-07-24 | 2015-02-03 | 주식회사 엘지화학 | Structure of flexible printed circuit board |
KR20150012105A (en) * | 2013-07-24 | 2015-02-03 | 주식회사 엘지화학 | Structure of flexible printed circuit board |
CN105393380A (en) * | 2013-07-24 | 2016-03-09 | 株式会社Lg化学 | Method for manufacturing structure for flexible printed circuit boards |
CN105409026A (en) * | 2013-07-24 | 2016-03-16 | 株式会社Lg化学 | Flexible printed circuit board structure |
CN105409028A (en) * | 2013-07-24 | 2016-03-16 | 株式会社Lg化学 | Structure for flexible printed circuit boards |
CN105409027A (en) * | 2013-07-24 | 2016-03-16 | 株式会社Lg化学 | Organic light-emitting element |
CN105409028B (en) * | 2013-07-24 | 2017-12-01 | 乐金显示有限公司 | The structure of flexible printed circuit board |
US9872389B2 (en) | 2013-07-24 | 2018-01-16 | Lg Display Co., Ltd. | Flexible printed circuit board structure |
US9899627B2 (en) | 2013-07-24 | 2018-02-20 | Lg Display Co., Ltd. | Organic light emitting diode |
US9907171B2 (en) | 2013-07-24 | 2018-02-27 | Lg Display Co., Ltd. | Flexible printed circuit boards structure |
US9974164B2 (en) | 2013-07-24 | 2018-05-15 | Lg Display Co., Ltd. | Structure for flexible printed circuit boards |
US10206290B2 (en) | 2013-07-24 | 2019-02-12 | Lg Display Co., Ltd. | Method for manufacturing structure for flexible printed circuit boards |
US10264670B2 (en) | 2013-07-24 | 2019-04-16 | Lg Display Co., Ltd. | Structure for flexible printed circuit boards |
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