WO2014054572A1 - Particule conductrice, matériau conducteur et structure de connexion - Google Patents

Particule conductrice, matériau conducteur et structure de connexion Download PDF

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Publication number
WO2014054572A1
WO2014054572A1 PCT/JP2013/076515 JP2013076515W WO2014054572A1 WO 2014054572 A1 WO2014054572 A1 WO 2014054572A1 JP 2013076515 W JP2013076515 W JP 2013076515W WO 2014054572 A1 WO2014054572 A1 WO 2014054572A1
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Prior art keywords
conductive
particles
conductive layer
layer
particle
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PCT/JP2013/076515
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English (en)
Japanese (ja)
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敬三 西岡
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積水化学工業株式会社
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Priority to KR1020147033188A priority Critical patent/KR102095823B1/ko
Priority to CN201380037610.2A priority patent/CN104471650A/zh
Priority to JP2013546501A priority patent/JP5636118B2/ja
Publication of WO2014054572A1 publication Critical patent/WO2014054572A1/fr

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    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
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    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
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    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to conductive particles in which a conductive material is arranged on the surface of base particles.
  • this invention relates to the electroconductive particle which can be used for the electrical connection between electrodes, for example.
  • the present invention also relates to a conductive material and a connection structure using the conductive particles.
  • Conductive materials such as anisotropic conductive pastes and anisotropic conductive films are widely known.
  • anisotropic conductive materials conductive particles are dispersed in a binder resin.
  • the anisotropic conductive material may be connected between a flexible printed circuit board and a glass substrate (FOG (Film on Glass)), or connected between a semiconductor chip and a flexible printed circuit board (COF ( (Chip on Film)), connection between a semiconductor chip and a glass substrate (COG (Chip on Glass)), connection between a flexible printed circuit board and a glass epoxy substrate (FOB (Film on Board)), and the like.
  • FOG Glass
  • COF Chip on Film
  • Patent Document 1 discloses conductive particles including composite particles and a metal plating layer covering the composite particles.
  • the composite particles include a plastic core and non-conductive inorganic particles adsorbed on the plastic core by chemical bonding.
  • Patent Document 2 a plastic core, a polymer electrolyte layer covering the plastic core, metal particles adsorbed on the plastic core through the polymer electrolyte layer, and the metal particles are covered.
  • surroundings of the said plastic core is disclosed.
  • Patent Document 2 describes that the metal particles to be adsorbed on the plastic core are, for example, metal particles selected from gold, silver, copper, palladium, and nickel.
  • Patent Document 3 discloses conductive particles in which a multilayer conductive layer of a metal plating film layer containing nickel and phosphorus and a gold layer is formed on the surface of a base material particle.
  • a core substance is disposed on the surface of the base particle, and the core substance is covered with a conductive layer.
  • the conductive layer is raised by the core material, and protrusions are formed on the surface of the conductive layer.
  • the conductive material constituting the core material is a metal
  • examples of the metal include nickel, copper, gold, silver, platinum, zinc, iron, lead, tin, aluminum, cobalt, Consists of metals such as indium, chromium, titanium, antimony, bismuth, germanium and cadmium, and two or more metals such as tin-lead alloy, tin-copper alloy, tin-silver alloy and tin-lead-silver alloy Alloys and the like are mentioned.
  • Patent Documents 1 to 3 described above disclose conductive particles having protrusions on the outer surface of the conductive layer.
  • an oxide film is formed on the surfaces of the electrodes connected by the conductive particles and the conductive layer of the conductive particles.
  • the protrusion of the conductive layer is formed so as to contact the conductive layer and the electrode by eliminating the oxide film on the surface of the electrode and the conductive particle when the electrodes are pressure-bonded via the conductive particle. .
  • connection resistance may increase. Further, the oxide film on the surface of the electrode and the conductive particles cannot be sufficiently removed, and the connection resistance tends to be relatively high.
  • An object of the present invention is to provide conductive particles capable of reducing the connection resistance between electrodes when the electrodes are connected, and a conductive material and a connection structure using the conductive particles.
  • the method includes a base particle and a conductive material disposed in a partial region on the surface of the base particle, and the material of the conductive material has a Mohs hardness higher than that of nickel.
  • a conductive particle which is a material, is provided.
  • the conductive particle includes the base particle and the conductive material disposed in a partial region on the surface of the base particle,
  • the material of the conductive material is molybdenum, tungsten carbide, tungsten, titanium carbide, or tantalum carbide.
  • the conductive particle includes a plurality of the conductive materials.
  • this electroconductive particle is on the surface of the said base material particle, the electroconductive layer arrange
  • the conductive material disposed in a part of the region, and the conductive material is embedded in the conductive layer.
  • the conductive layer has a protrusion on an outer surface, and the conductive material is disposed inside the protrusion of the conductive layer.
  • the conductive layer has a nickel layer.
  • the conductive layer has a nickel layer on the base particle side and a palladium layer on the side opposite to the base particle side.
  • the conductive particle further includes an insulating substance attached to the surface of the conductive layer.
  • the conductive material is a particle.
  • the conductive particle includes the base particle and the conductive material disposed in a partial region on the surface of the base particle,
  • the material of the conductive material is molybdenum, tungsten carbide, tungsten, or tantalum carbide.
  • a conductive material including the above-described conductive particles and a binder resin.
  • a first connection target member having a first electrode on the surface
  • a second connection target member having a second electrode on the surface
  • the connection portion is formed of the conductive particles described above or formed of a conductive material including the conductive particles and a binder resin.
  • a connection structure is provided in which the first electrode and the second electrode are electrically connected by the conductive particles.
  • the conductive material is disposed in a partial region on the surface of the base particle, and the material of the conductive material is higher in Mohs hardness than nickel.
  • the connection resistance can be lowered.
  • FIG. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing conductive particles according to the second embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing conductive particles according to the third embodiment of the present invention.
  • FIG. 4 is a front cross-sectional view schematically showing a connection structure using conductive particles according to the first embodiment of the present invention.
  • the electroconductive particle which concerns on this invention is equipped with a base material particle and the electrically conductive material arrange
  • the conductive material is a material having a Mohs hardness higher than that of nickel.
  • the material of the conductive material is preferably molybdenum, tungsten, tungsten carbide, titanium carbide, or tantalum carbide, and is preferably molybdenum, tungsten, tungsten carbide, or tantalum carbide. These materials have high Mohs hardness. When the electrodes are connected using conductive particles including the conductive material of these materials, connection failure between the electrodes hardly occurs, and the connection resistance between the electrodes can be effectively reduced.
  • the electroconductive particle which concerns on this invention is the said base material particle, the electroconductive layer arrange
  • connection resistance can be further reduced.
  • the conductive layer has a protrusion on the outer surface, and the conductive material is disposed inside the protrusion of the conductive layer. It is preferable that the protrusion is formed by the conductive material.
  • An oxide film is often formed on the surface of the electrode connected by the conductive particles. Furthermore, an oxide film is often formed on the outer surface of the conductive layer.
  • the oxide film is eliminated by the protrusions by placing the conductive particles between the electrodes and then pressing them. For this reason, an electrode and electroconductive particle can be contacted still more reliably and the connection resistance between electrodes can be made still lower.
  • FIG. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention.
  • a conductive particle 1 shown in FIG. 1 includes a base particle 2, a conductive layer 3, a plurality of conductive materials 4, and a plurality of insulating substances 5.
  • the conductive layer 3 is disposed on the surface of the base particle 2. In the conductive particles 1, a single conductive layer 3 is formed.
  • the conductive layer 3 covers the base particle 2.
  • the conductive layer 3 also covers the conductive material 4.
  • the conductive layer 3 has a plurality of protrusions 3a on the outer surface.
  • the conductive particle 1 includes a plurality of conductive materials 4.
  • a plurality of conductive materials 4 are arranged in a partial region on the surface of the base particle 2 and are embedded in the conductive layer 3.
  • the conductive material 4 is not disposed in all regions on the surface of the base particle 2.
  • the conductive material 4 does not cover the entire surface of the base particle 2. Since the conductive material 4 is disposed in a partial region on the surface of the base material particle 2, the base material particle 2 has a surface region that is not in contact with the conductive material 4.
  • the conductive material 4 is disposed inside the protrusion 3a.
  • One conductive material 4 is arranged inside one protrusion 3a.
  • the outer surface of the conductive layer 3 is raised by the plurality of conductive materials 4, and a plurality of protrusions 3a are formed.
  • the conductive material 4 is a particle. Since the conductive material 4 is a particle, the conductive material 4 is arranged in a partial region on the surface of the substrate particle 2.
  • the conductive material 4 is in contact with the substrate particles 2.
  • a conductive layer may be disposed between the surface of the base particle and the surface of the conductive material.
  • the conductive material may not be in contact with the base material particle, and the surface of the base material particle and the surface of the conductive material may be separated from each other.
  • the insulating substance 5 is disposed on the surface of the conductive layer 3.
  • the insulating substance 5 is an insulating particle.
  • the insulating substance 5 is made of an insulating material.
  • the conductive particles do not necessarily include an insulating substance.
  • the conductive particles may include an insulating layer that covers the outer surface of the conductive layer as an insulating substance instead of the insulating particles.
  • FIG. 2 is a cross-sectional view showing conductive particles according to the second embodiment of the present invention.
  • a conductive particle 11 shown in FIG. 2 includes a base particle 2, a first conductive layer 12, a second conductive layer 13, a plurality of conductive materials 4, and a plurality of insulating substances 5.
  • the conductive particle 1 has a single-layered conductive layer
  • the conductive particle 11 has a two-layered first conductive layer 12 and second conductive layer 13 formed. Yes.
  • the conductive material 4 is embedded in the first conductive layer 11 and the conductive layer 13.
  • the first conductive layer 12 is disposed on the surface of the base particle 2.
  • the first conductive layer 12 is disposed between the base particle 2 and the second conductive layer 13.
  • the first conductive layer 12 is located on the base particle 2 side and is a conductive layer in contact with the base particle 2.
  • the second conductive layer 13 is located on the side opposite to the base particle 2 side and is not in contact with the base particle 2. Therefore, the first conductive layer 12 is disposed on the surface of the base particle 2, and the second conductive layer 13 is disposed on the surface of the first conductive layer 12.
  • the second conductive layer 13 has a plurality of protrusions 13a on the outer surface.
  • the conductive particles 11 have a plurality of protrusions 11a on the conductive surface.
  • FIG. 3 is a cross-sectional view showing conductive particles according to the third embodiment of the present invention.
  • a conductive particle 21 shown in FIG. 3 includes a base particle 2, a conductive layer 22, and a plurality of conductive materials 4.
  • the conductive layer 22 is disposed on the surface of the base particle 2.
  • the conductive material 4 is embedded in the conductive layer 22.
  • the conductive particles 21 do not have protrusions on the surface.
  • the conductive particles 21 are spherical.
  • the conductive layer 22 does not have a protrusion on the outer surface.
  • the electroconductive particle which concerns on this invention does not need to have a litigation
  • the conductive particles 21 do not have an insulating material.
  • the conductive particles 21 may include an insulating material disposed on the surface of the conductive layer 22.
  • Examples of the substrate particles include resin particles, inorganic particles excluding metal particles, organic-inorganic hybrid particles, and metal particles. Of these, substrate particles excluding metal particles are preferable, and resin particles, inorganic particles excluding metal particles, or organic-inorganic hybrid particles are more preferable.
  • the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; acrylic resins such as polymethyl methacrylate and polymethyl acrylate; Alkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, Polysulfone, polyphenylene oxide, polyacetal, polyimide, polyamid Imide, polyether ether ketone, polyether sulfone, divinyl benzene polymer, and diviny
  • polyolefin resins such as polyethylene, polypropylene,
  • the divinylbenzene copolymer examples include divinylbenzene-styrene copolymer and divinylbenzene- (meth) acrylic acid ester copolymer. Since the hardness of the resin particles can be easily controlled within a suitable range, the resin for forming the resin particles is a polymer obtained by polymerizing one or more polymerizable monomers having an ethylenically unsaturated group. It is preferably a coalescence.
  • the monomer having the ethylenically unsaturated group includes a non-crosslinkable monomer and a crosslinkable monomer. And a polymer.
  • non-crosslinkable monomer examples include styrene monomers such as styrene and ⁇ -methylstyrene; carboxyl group-containing monomers such as (meth) acrylic acid, maleic acid, and maleic anhydride; (Meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl ( Alkyl (meth) acrylates such as meth) acrylate and isobornyl (meth) acrylate; oxygen such as 2-hydroxyethyl (meth) acrylate, glycerol (meth) acrylate, polyoxyethylene (meth) acrylate, and glycidyl (meth) acrylate
  • crosslinkable monomer examples include tetramethylolmethane tetra (meth) acrylate, tetramethylolmethane tri (meth) acrylate, tetramethylolmethane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and dipenta Erythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, glycerol tri (meth) acrylate, glycerol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) Polyfunctional (meth) acrylates such as acrylate, (poly) tetramethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate; triallyl (iso) cyanure Silane-
  • the resin particles can be obtained by polymerizing the polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of this method include a method of suspension polymerization in the presence of a radical polymerization initiator, and a method of polymerizing by swelling a monomer together with a radical polymerization initiator using non-crosslinked seed particles.
  • the substrate particles are inorganic particles or organic-inorganic hybrid particles excluding metal
  • examples of inorganic substances for forming the substrate particles include silica and carbon black.
  • grains formed with the said silica For example, after hydrolyzing the silicon compound which has two or more hydrolysable alkoxysil groups, and forming a crosslinked polymer particle, it calcinates as needed.
  • grains obtained by performing are mentioned.
  • examples of the organic / inorganic hybrid particles include organic / inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin.
  • the substrate particles are metal particles
  • examples of the metal for forming the metal particles include silver, copper, nickel, silicon, gold, and titanium.
  • the metal particles are preferably copper particles.
  • the substrate particles are preferably not metal particles.
  • the particle diameter of the substrate particles is preferably 0.1 ⁇ m or more, more preferably 1 ⁇ m or more, still more preferably 1.5 ⁇ m or more, particularly preferably 2 ⁇ m or more, preferably 1000 ⁇ m or less, more preferably 500 ⁇ m or less, and even more preferably. Is not more than 300 ⁇ m, more preferably not more than 50 ⁇ m, particularly preferably not more than 30 ⁇ m, and most preferably not more than 5 ⁇ m.
  • the particle diameter of the substrate particles is equal to or greater than the above lower limit, the contact area between the conductive particles and the electrodes is increased, so that the conduction reliability between the electrodes is further increased, and the electrodes are connected via the conductive particles. The connection resistance between them becomes even lower.
  • the particle diameter of the base particle indicates a diameter when the base particle is a true sphere, and indicates a maximum diameter when the base particle is not a true sphere.
  • the particle diameter of the substrate particles is particularly preferably 2 ⁇ m or more and 5 ⁇ m or less. When the particle diameter of the substrate particles is in the range of 2 to 5 ⁇ m, even when the distance between the electrodes is small and the conductive layer is thick, small conductive particles can be obtained.
  • the particle diameter of the substrate particles is also preferably 3 ⁇ m or less.
  • the electroconductive particle which concerns on this invention has the electroconductive layer arrange
  • the metal for forming the conductive layer is not particularly limited.
  • the metal include gold, silver, palladium, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, thallium, germanium, cadmium, silicon, and these. And the like.
  • the metal include tin-doped indium oxide (ITO) and solder. Especially, since the connection resistance between electrodes can be made still lower, an alloy containing tin, nickel, palladium, copper or gold is preferable, and nickel or palladium is preferable.
  • the conductive layer may be formed of a single layer.
  • the conductive layer may be formed of a plurality of layers. That is, the conductive layer may have a stacked structure of two or more layers.
  • the outermost layer is a gold layer, a nickel layer, a palladium layer, a copper layer, or an alloy layer containing tin and silver. Is preferable, and a palladium layer or a gold layer is more preferable.
  • the outermost layer is preferably a palladium layer, and is preferably a gold layer.
  • the outermost layer is these preferred conductive layers, the connection resistance between the electrodes is further reduced. Moreover, when the outermost layer is a gold layer, the corrosion resistance is further enhanced.
  • the nickel layer contains 50% by weight or more of nickel.
  • the palladium layer or the gold layer contains 50% by weight or more of palladium or gold.
  • the conductive layer in contact with the substrate particles contains nickel.
  • the conductive layer is a single layer like the conductive particles 1 and 21, the conductive layer preferably contains nickel.
  • the first conductive layer (base The conductive layer in contact with the material particles preferably contains nickel.
  • the conductive layer and the first conductive layer preferably contain nickel as a main component. The conductivity of the conductive layer containing nickel is relatively high. Therefore, when the electrodes are connected by conductive particles having a conductive layer containing nickel, the connection resistance between the electrodes is further reduced.
  • the nickel content is preferably 50% by weight or more.
  • the content of nickel is preferably 50% by weight or more in 100% by weight of the conductive layer.
  • the conductive layer includes the first and second conductive layers, the content of nickel in 100% by weight of the first conductive layer is preferably 50% by weight or more.
  • the connection resistance between the electrodes is considerably low.
  • the nickel content is more preferably 60% by weight or more, still more preferably 70% by weight or more, and particularly preferably 90% by weight or more.
  • the content of nickel in the conductive layer or 100% by weight of the first conductive layer may be 97% by weight or more, 97.5% by weight or more, or 98% by weight or more. Good.
  • the content of nickel in the conductive layer or 100% by weight of the first conductive layer is preferably 99.85% by weight or less, more preferably 99.7% by weight or less, and still more preferably less than 99.45% by weight. .
  • the connection resistance between the electrodes is further reduced.
  • there are few oxide films in the surface of an electrode or a conductive layer there exists a tendency for the connection resistance between electrodes to become low, so that there is much content of the said nickel.
  • the conductive layer or the first conductive layer preferably contains nickel and at least one of boron and phosphorus.
  • nickel and at least one of boron and phosphorus may be alloyed.
  • components other than nickel, boron, and phosphorus may be used.
  • the connection structure when the connection structure is exposed to the presence of an acid, the connection resistance between the electrodes may increase. Therefore, the conductive layer or the first conductive layer has a high phosphorus content in the nickel layer on the base particle side and a low phosphorus content in the nickel layer on the side opposite to the base particle. May be good.
  • the total content of boron and phosphorus in the conductive layer or 100% by weight of the first conductive layer is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and still more preferably 0.1%. % By weight or more, preferably 5% by weight or less, more preferably 4% by weight or less, further preferably 3% by weight or less, particularly preferably 2.5% by weight or less, and most preferably 2% by weight or less.
  • the total content of boron and phosphorus is not less than the above lower limit, the conductive layer or the first conductive layer becomes harder, and the oxide film on the surface of the electrode and conductive particles is more effectively removed.
  • the connection resistance between the electrodes can be further reduced.
  • the total content of boron and phosphorus is not more than the above upper limit, the content of nickel is relatively increased, so that the connection resistance between the electrodes is reduced.
  • the boron content in the conductive layer or 100% by weight of the first conductive layer is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, still more preferably 0.1% by weight or more, preferably Is 5% by weight or less, more preferably 4% by weight or less, further preferably 3% by weight or less, particularly preferably 2.5% by weight or less, and most preferably 2% by weight or less.
  • the boron content is not less than the above lower limit, the conductive layer or the first conductive layer becomes harder, and the oxide film on the surface of the electrode and the conductive particles can be more effectively removed.
  • the connection resistance can be further reduced. If the boron content is less than or equal to the above upper limit, the nickel content is relatively increased, so that the connection resistance between the electrodes is reduced.
  • the conductive layer or the first conductive layer does not contain phosphorus or contains phosphorus, and the content of phosphorus in 100% by weight of the conductive layer or the first conductive layer is less than 10.0% by weight. Is preferred.
  • the content of phosphorus in 100% by weight of the conductive layer is more preferably less than 0.5% by weight, still more preferably 0.3% by weight or less, and particularly preferably 0.1% by weight or less. It is particularly preferable that the conductive layer or the first conductive layer does not contain phosphorus.
  • the method for measuring each content of nickel, boron, phosphorus, etc. in the conductive layer or the first conductive layer is not particularly limited, and various known analytical methods can be used. Examples of this measuring method include absorption spectrometry or spectrum analysis. In the above-mentioned absorption analysis method, a flame absorptiometer, an electric heating furnace absorptiometer, or the like can be used. Examples of the spectrum analysis method include a plasma emission analysis method and a plasma ion source mass spectrometry method.
  • ICP emission spectrometer When measuring the content of nickel, boron, phosphorus, etc. in the conductive layer or the first conductive layer, it is preferable to use an ICP emission spectrometer.
  • ICP emission analyzers include ICP emission analyzers manufactured by HORIBA.
  • the conductive layer preferably has a nickel layer on the base particle side and a second conductive layer on the side opposite to the base particle side.
  • the second conductive layer is preferably a palladium layer or a gold layer, more preferably a palladium layer, and more preferably a gold layer.
  • the method for forming the conductive layer or the first conductive layer on the surface of the substrate particles and the method for forming the second conductive layer on the surface of the first conductive layer are not particularly limited.
  • a method for forming the conductive layer for example, a method by electroless plating, a method by electroplating, a method by physical vapor deposition, and a paste containing metal powder or metal powder and a binder is used for base particles or other conductive layers.
  • a method of coating the surface for example, since formation of a conductive layer is simple, the method by electroless plating is preferable.
  • Examples of the method by physical vapor deposition include methods such as vacuum vapor deposition, ion plating, and ion sputtering.
  • the particle diameter of the conductive particles is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, preferably 100 ⁇ m or less, more preferably 20 ⁇ m or less.
  • the particle diameter of the conductive particles is not less than the above lower limit and not more than the upper limit, when the electrodes are connected using the conductive particles, the contact area between the conductive particles and the electrode is sufficiently large, and the conductive layer is formed. Aggregated conductive particles are less likely to be formed during formation. Further, the distance between the electrodes connected via the conductive particles does not become too large, and the conductive layer is difficult to peel from the surface of the base material particles.
  • the particle diameter of the conductive particles indicates the diameter when the conductive particles are true spherical, and indicates the maximum diameter when the conductive particles are not true spherical.
  • the total thickness of the conductive layer in the conductive particles and the thickness of the conductive layer when the conductive layer is a single layer are preferably 0.005 ⁇ m or more, more preferably 0.01 ⁇ m or more, still more preferably 0.05 ⁇ m or more, preferably It is 1 ⁇ m or less, more preferably 0.3 ⁇ m or less.
  • the thickness of the conductive layer is not less than the above lower limit and not more than the above upper limit, sufficient conductivity is obtained, and the conductive particles do not become too hard, and the conductive particles are sufficiently deformed when connecting the electrodes. To do.
  • the thickness of the conductive layer (first conductive layer) in contact with the substrate particles is preferably 0.001 ⁇ m or more, more preferably 0.01 ⁇ m or more, and still more preferably. It is 0.05 ⁇ m or more, preferably 0.5 ⁇ m or less, more preferably 0.3 ⁇ m or less, and still more preferably 0.1 ⁇ m or less.
  • the thickness of the conductive layer in contact with the substrate particles is not less than the above lower limit and not more than the above upper limit, the coating with the conductive layer can be made uniform and the connection resistance between the electrodes becomes sufficiently low.
  • the thickness of the entire conductive layer in the conductive particles and the thickness of the conductive layer when the conductive layer is a single layer are particularly preferably 0.05 ⁇ m or more and 0.3 ⁇ m or less. Furthermore, when the particle diameter of the substrate particles is 2 ⁇ m or more and 5 ⁇ m or less, and the thickness of the entire conductive layer in the conductive particles and the conductive layer is a single layer, the thickness of the conductive layer is 0.05 ⁇ m or more, 0. It is particularly preferable that the thickness is 3 ⁇ m or less. In this case, the conductive particles can be suitably used for applications in which a large current flows. Furthermore, when the conductive particles are compressed to connect the electrodes, it is possible to further suppress the electrodes from being damaged.
  • the thickness of the conductive layer can be measured by observing the cross section of the conductive particles using, for example, a transmission electron microscope (TEM).
  • TEM transmission electron microscope
  • a method for controlling the contents of nickel, boron and phosphorus in the conductive layer and the first conductive layer for example, a method of controlling the pH of the nickel plating solution when forming the conductive layer by electroless nickel plating
  • a method of adjusting the concentration of the boron-containing reducing agent when forming the conductive layer by electroless nickel plating, a method of adjusting the concentration of the phosphorus-containing reducing agent when forming the conductive layer by electroless nickel plating, and A method for adjusting the nickel concentration in the nickel plating solution is exemplified.
  • a catalytic step and an electroless plating step are performed.
  • an example of a method for forming an alloy plating layer containing nickel and boron on the surface of resin particles by electroless plating will be described.
  • a catalyst serving as a starting point for forming a plating layer by electroless plating is formed on the surface of the resin particles.
  • the surface of the resin particles is activated with an acid solution or an alkali solution
  • the reducing agent a boron-containing reducing agent is preferably used.
  • a conductive layer containing phosphorus can be formed by using a phosphorus-containing reducing agent as the reducing agent.
  • a nickel plating bath containing a nickel-containing compound and the boron-containing reducing agent is preferably used.
  • nickel By immersing the resin particles in the nickel plating bath, nickel can be deposited on the surface of the resin particles on which the catalyst is formed, and a conductive layer containing nickel and boron can be formed.
  • nickel-containing compound examples include nickel sulfate and nickel chloride.
  • the nickel-containing compound is preferably a nickel salt.
  • Examples of the boron-containing reducing agent include dimethylamine borane, sodium borohydride, potassium borohydride, and the like.
  • Examples of the phosphorus-containing reducing agent include sodium hypophosphite.
  • the electroconductive particle which concerns on this invention is equipped with the electrically conductive material arrange
  • the conductive material is made of molybdenum (Mo) (Mohs hardness 5.5), tungsten (W) (Mohs hardness 7.5), tungsten carbide (WC) (Mohs hardness 9), titanium carbide (TiC) (Mohs hardness). 9) or tantalum carbide (TaC) (Mohs hardness 9).
  • the Mohs hardness of the material of the conductive material is higher than the Mohs hardness of nickel (Ni) (Mohs hardness 5.0).
  • the material of the conductive material is preferably tungsten carbide or tantalum carbide.
  • the material of the conductive material is preferably molybdenum, preferably tungsten, preferably tungsten carbide, preferably titanium carbide, and preferably tantalum carbide.
  • the value of the powder resistivity of the conductive material is preferably 0.1 ⁇ ⁇ cm or less.
  • the conductive particles according to the present invention preferably have protrusions on the conductive surface.
  • the conductive layer preferably has a protrusion on the outer surface. It is preferable that there are a plurality of the protrusions.
  • An oxide film is often formed on the surface of the electrode connected by the conductive particles. Furthermore, an oxide film is often formed on the surface of the conductive layer of the conductive particles.
  • an electrode and electroconductive particle can be contacted still more reliably and the connection resistance between electrodes can be made low.
  • the conductive particles have an insulating material on the surface, or when the conductive particles are dispersed in a binder resin and used as a conductive material, the conductive particles are projected between the conductive particles and the electrodes by the protrusions of the conductive particles. Can be effectively eliminated. For this reason, the conduction
  • the conductive layer It is easy for the conductive layer to have a plurality of protrusions on the outer surface by embedding the conductive material in the conductive layer.
  • the conductive material may or may not be in contact with the base material particles.
  • a part of the conductive layer may be disposed between the base particle and the conductive material.
  • the conductive particles according to the present invention preferably include a plurality of the conductive materials.
  • the conductive part of the conductive particles can be hardened at a place where the plurality of conductive materials are arranged inside the conductive layer. Moreover, it is easy to form a plurality of protrusions on the surfaces of the conductive particles and the conductive layer.
  • the conductive material is preferably particles.
  • the conductive part of the conductive particles can be effectively hardened due to the shape of the conductive material that is the particles disposed inside the conductive layer. Moreover, it is easy to form a plurality of protrusions on the surfaces of the conductive particles and the conductive layer.
  • the shape of the conductive material that is a particle is preferably a lump.
  • Examples of the conductive material that is a particle include a particulate lump, an agglomerate in which a plurality of fine particles are aggregated, and an irregular lump.
  • the maximum diameter of the conductive material is preferably 0.005D or more, more preferably 0.015D or more, preferably 0.25D or less, more preferably 0.15D or less. It is.
  • the size of the conductive material in the thickness direction of the conductive layer is preferably 0.005D or more, more preferably 0.015D or more, preferably 0.00. 25D or less, more preferably 0.15D or less.
  • the conductive material is attached to the surface of the base particle, and then the conductive layer is formed by electroless plating, and the conductive layer is formed by electroless plating on the surface of the base particle. Then, the method of making the said conductive material adhere and forming a conductive layer by electroless plating etc. is mentioned.
  • the first conductive layer is formed on the surface of the base particle, and then the conductive material is disposed on the first conductive layer, and then the second conductive layer is formed. Examples thereof include a method of forming a layer, and a method of adding the conductive material in the middle of forming a conductive layer on the surface of the base particle.
  • the number of the conductive material and the number of the protrusions per one conductive particle are preferably 3 or more, more preferably 5 or more.
  • the upper limit of the number of the conductive materials and the number of the protrusions is not particularly limited. The upper limit of the number of the conductive materials and the number of the protrusions can be appropriately selected in consideration of the particle diameter of the conductive particles.
  • the conductive particles according to the present invention preferably include an insulating substance disposed on the surface of the conductive layer.
  • an insulating substance disposed on the surface of the conductive layer.
  • an insulating material is present between the plurality of electrodes, so that it is possible to prevent a short circuit between electrodes adjacent in the lateral direction instead of between the upper and lower electrodes.
  • the insulating substance between the conductive layer of an electroconductive particle and an electrode can be easily excluded by pressurizing electroconductive particle with two electrodes in the case of the connection between electrodes.
  • the insulating substance between the conductive layer of the conductive particles and the electrode can be easily excluded.
  • the insulating substance is preferably an insulating particle because the insulating substance can be more easily removed during crimping between the electrodes.
  • the conductive material according to the present invention includes the conductive particles described above and a binder resin.
  • the conductive particles according to the present invention are preferably dispersed in a binder resin and used as a conductive material.
  • the conductive material is preferably an anisotropic conductive material.
  • the binder resin is not particularly limited.
  • As the binder resin a known insulating resin is used.
  • binder resin examples include vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, and elastomers.
  • vinyl resins examples include vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, and elastomers.
  • the said binder resin only 1 type may be used and 2 or more types may be used together.
  • Examples of the vinyl resin include vinyl acetate resin, acrylic resin, and styrene resin.
  • examples of the thermoplastic resin include polyolefin resin, ethylene-vinyl acetate copolymer, and polyamide resin.
  • examples of the curable resin include an epoxy resin, a urethane resin, a polyimide resin, and an unsaturated polyester resin.
  • the curable resin may be a room temperature curable resin, a thermosetting resin, a photocurable resin, or a moisture curable resin.
  • the curable resin may be used in combination with a curing agent.
  • thermoplastic block copolymer examples include a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a hydrogenated product of a styrene-butadiene-styrene block copolymer, and a styrene-isoprene. -Hydrogenated products of styrene block copolymers.
  • the elastomer examples include styrene-butadiene copolymer rubber and acrylonitrile-styrene block copolymer rubber.
  • the conductive material includes, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, and a light stabilizer.
  • a filler for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, and a light stabilizer.
  • Various additives such as an agent, an ultraviolet absorber, a lubricant, an antistatic agent and a flame retardant may be contained.
  • the method for dispersing the conductive particles in the binder resin is not particularly limited, and a conventionally known dispersion method can be used.
  • Examples of a method for dispersing the conductive particles in the binder resin include a method in which the conductive particles are added to the binder resin and then kneaded and dispersed with a planetary mixer or the like. The conductive particles are dispersed in water. Alternatively, after uniformly dispersing in an organic solvent using a homogenizer or the like, it is added to the binder resin and kneaded with a planetary mixer or the like, and the binder resin is diluted with water or an organic solvent. Then, the method of adding the said electroconductive particle, kneading with a planetary mixer etc. and disperse
  • distributing is mentioned.
  • the conductive material according to the present invention can be used as a conductive paste and a conductive film.
  • the conductive material according to the present invention is a conductive film
  • a film that does not include conductive particles may be laminated on the conductive film that includes the conductive particles.
  • the conductive paste is preferably an anisotropic conductive paste.
  • the conductive film is preferably an anisotropic conductive film.
  • the content of the binder resin is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably 70% by weight or more, preferably 99.% or more. It is 99 weight% or less, More preferably, it is 99.9 weight% or less.
  • the content of the binder resin is not less than the above lower limit and not more than the above upper limit, the conductive particles are efficiently arranged between the electrodes, and the connection reliability of the connection target member connected by the conductive material is further increased.
  • the content of the conductive particles is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 40% by weight or less, more preferably 20% by weight or less, More preferably, it is 10 weight% or less.
  • the content of the conductive particles is not less than the above lower limit and not more than the above upper limit, the conduction reliability between the electrodes is further enhanced.
  • connection structure can be obtained by connecting the connection target members using the conductive particles of the present invention or using a conductive material containing the conductive particles and a binder resin.
  • connection structure includes a first connection target member, a second connection target member, and a connection portion that connects the first connection target member and the second connection target member.
  • the connection structure is preferably formed of the conductive particles of the present invention or formed of a conductive material containing the conductive particles and a binder resin.
  • the connection portion itself is conductive particles. That is, the first and second connection target members are connected by the conductive particles.
  • FIG. 4 is a front cross-sectional view schematically showing a connection structure using conductive particles according to the first embodiment of the present invention.
  • connection portion 54 includes a first connection target member 52, a second connection target member 53, and a connection portion 54 that connects the first and second connection target members 52 and 53.
  • the connection portion 54 is formed by curing a conductive material including the conductive particles 1.
  • the conductive particles 1 are schematically shown for convenience of illustration.
  • the first connection target member 52 has a plurality of first electrodes 52a on the surface (upper surface).
  • the second connection target member 53 has a plurality of second electrodes 53a on the surface (lower surface).
  • the first electrode 52 a and the second electrode 53 a are electrically connected by one or a plurality of conductive particles 1. Therefore, the first and second connection target members 52 and 53 are electrically connected by the conductive particles 1.
  • the manufacturing method of the connection structure is not particularly limited.
  • the conductive material is disposed between the first connection target member and the second connection target member to obtain a laminate, and then the laminate is heated and pressurized. Methods and the like.
  • the pressurizing pressure is about 9.8 ⁇ 10 4 to 4.9 ⁇ 10 6 Pa.
  • the heating temperature is about 120 to 220 ° C.
  • connection target member examples include electronic components such as semiconductor chips, capacitors, and diodes, and electronic components such as printed boards, flexible printed boards, glass epoxy boards, and glass boards.
  • the conductive material is preferably a conductive material for connecting electronic components.
  • the conductive material is a paste-like conductive paste, and is preferably applied on the connection target member in a paste-like state.
  • the electrode provided on the connection target member examples include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a molybdenum electrode, and a tungsten electrode.
  • the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, or a copper electrode.
  • the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, or a tungsten electrode.
  • the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated
  • the material for the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga.
  • the conductive particles can be used as a conductive material for electrical connection between the upper and lower substrates constituting the liquid crystal display element.
  • Conductive particles are mixed with thermosetting resin or thermosetting resin combined with heat UV, dispersed, applied in a dot pattern on one side of the substrate, and bonded to the counter substrate, and the conductive particles are mixed with the peripheral sealant.
  • thermosetting resin or thermosetting resin combined with heat UV, dispersed, applied in a dot pattern on one side of the substrate, and bonded to the counter substrate
  • the conductive particles are mixed with the peripheral sealant
  • the electroconductive particle which concerns on this invention is applicable also to such a usage form.
  • the powder resistivity of the conductive material used in the following examples showed a value of 0.1 ⁇ ⁇ cm or less.
  • the powder resistivity of the conductive material is molybdenum (Mo) (0.001 ⁇ ⁇ cm), tungsten (W) (0.001 ⁇ ⁇ cm), tungsten carbide (WC) (0.005 ⁇ ⁇ cm).
  • Mo molybdenum
  • W tungsten
  • WC tungsten carbide
  • TiC titanium carbide
  • TaC tantalum carbide
  • the powder resistivity was determined by a powder resistivity measurement system “Lorestar GP” manufactured by Mitsubishi Chemical Corporation using 2.5 g of a conductive material and a powder resistivity at a load of 20 kN at 23 ° C. .
  • Example 1 Palladium adhesion process Divinylbenzene resin particles (“Micropearl SP-205” manufactured by Sekisui Chemical Co., Ltd.) having a particle size of 3.0 ⁇ m were prepared. The resin particles were etched and washed with water. Next, resin particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • the nickel plating solution was gradually dropped into the suspension to perform electroless nickel plating. Thereafter, the suspension is filtered to remove the particles, washed with water, and dried to obtain conductive particles having a nickel layer (thickness: 0.1 ⁇ m) disposed on the surface of the resin particles to which the conductive material is attached. Obtained.
  • the content of nickel in 100% by weight of the nickel layer was 98.9% by weight, and the content of boron was 1.1% by weight.
  • the obtained conductive particles have a plurality of conductive materials embedded in the conductive layer, have a plurality of protrusions on the outer surface of the conductive layer, and the conductive material is disposed inside the protrusions of the conductive layer. It was.
  • Example 2 Conductive particles were obtained in the same manner as in Example 1 except that the tungsten carbide particles (average particle size 100 nm) were changed to tungsten particles (average particle size 100 nm).
  • Example 3 Conductive particles were obtained in the same manner as in Example 1 except that the tungsten carbide particles (average particle size 100 nm) were changed to tantalum carbide particles (average particle size 100 nm).
  • Example 4 Conductive particles were obtained in the same manner as in Example 1 except that the tungsten carbide particles (average particle size 100 nm) were changed to molybdenum particles (average particle size 100 nm).
  • Example 5 (1) Preparation of insulating particles Into a 1000 mL separable flask equipped with a four-neck separable cover, stirring blade, three-way cock, cooling tube and temperature probe, 100 mmol of methyl methacrylate and N, N, N-trimethyl Ion-exchanged water containing a monomer composition containing 1 mmol of —N-2-methacryloyloxyethylammonium chloride and 1 mmol of 2,2′-azobis (2-amidinopropane) dihydrochloride so that the solid content is 5% by weight. Then, the mixture was stirred at 200 rpm and polymerized at 70 ° C. for 24 hours under a nitrogen atmosphere. After completion of the reaction, it was freeze-dried to obtain insulating particles having an ammonium group on the surface, an average particle size of 220 nm, and a CV value of 10%.
  • Step of attaching insulating particles The insulating particles were dispersed in ion-exchanged water under ultrasonic irradiation to obtain a 10% by weight aqueous dispersion of insulating particles.
  • Example 2 10 g of the conductive particles obtained in Example 1 were dispersed in 500 mL of ion-exchanged water, 4 g of an aqueous dispersion of insulating particles was added, and the mixture was stirred at room temperature for 6 hours. After filtration through a 3 ⁇ m mesh filter, the particles were further washed with methanol and dried to obtain conductive particles having insulating particles attached thereto.
  • Example 6 Conductive particles were obtained in the same manner as in Example 5 except that the conductive particles obtained in Example 1 before attaching the insulating particles were changed to the conductive particles obtained in Example 2. .
  • Example 7 Conductive particles were obtained in the same manner as in Example 5 except that the conductive particles obtained in Example 1 before attaching the insulating particles were changed to the conductive particles obtained in Example 3. .
  • Example 8 Conductive particles were obtained in the same manner as in Example 5 except that the conductive particles obtained in Example 1 before attaching the insulating particles were changed to the conductive particles obtained in Example 4. .
  • Example 9 10 g of the conductive particles obtained in Example 1 were added to 500 mL of ion-exchanged water and sufficiently dispersed with an ultrasonic processor to obtain a suspension. While stirring the suspension at 50 ° C., 0.02 mol / L of palladium sulfate, 0.04 mol / L of ethylenediamine as a complexing agent, 0.06 mol / L of sodium formate as a reducing agent, and pH 10.0 containing a crystal modifier. An electroless plating solution was prepared.
  • the electroless plating solution was gradually added to the obtained suspension, and electroless palladium plating was performed. When the thickness of the palladium layer reached 0.03 ⁇ m, the electroless palladium plating was finished. Next, by washing and vacuum drying, conductive particles having a palladium layer (thickness: 0.03 ⁇ m) laminated on the surface of the nickel layer were obtained.
  • Example 10 Conductive particles were obtained in the same manner as in Example 9, except that the conductive particles obtained in Example 1 before forming the palladium layer were changed to the conductive particles obtained in Example 2.
  • Example 11 Conductive particles were obtained in the same manner as in Example 9, except that the conductive particles obtained in Example 1 before forming the palladium layer were changed to the conductive particles obtained in Example 3.
  • Example 12 Conductive particles were obtained in the same manner as in Example 9, except that the conductive particles obtained in Example 1 before forming the palladium layer were changed to the conductive particles obtained in Example 4.
  • Divinylbenzene resin particles having a particle size of 3.0 ⁇ m (“Micropearl SP-203” manufactured by Sekisui Chemical Co., Ltd.) and divinylbenzene resin particles having a particle size of 2.5 ⁇ m (“Micropearl SP manufactured by Sekisui Chemical Co., Ltd.) are used. Conductive particles were obtained in the same manner as in Example 1 except for changing to -2025 ").
  • Example 14 (1) Palladium adhesion step Divinylbenzene resin particles (“Micropearl SP-203” manufactured by Sekisui Chemical Co., Ltd.) having a particle size of 3.0 ⁇ m were prepared. The resin particles were etched and washed with water. Next, resin particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • Electroless nickel plating step A nickel plating solution (pH 9.0) containing nickel sulfate 0.25 mol / L, sodium hypophosphite 0.25 mol / L and sodium citrate 0.15 mol / L was prepared.
  • the nickel plating solution was gradually dropped into the suspension to perform electroless nickel plating. Thereafter, the suspension was filtered to take out the particles, washed with water, and dried to obtain conductive particles having a nickel-phosphorous conductive layer (thickness 0.1 ⁇ m) disposed on the surface of the resin particles.
  • Example 15 (1) Palladium adhesion step Divinylbenzene resin particles (“Micropearl SP-203” manufactured by Sekisui Chemical Co., Ltd.) having a particle size of 3.0 ⁇ m were prepared. The resin particles were etched and washed with water. Next, resin particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • the nickel plating solution was gradually dropped into the suspension to perform electroless nickel plating.
  • a nickel plating solution (pH 10.0) containing nickel sulfate 0.25 mol / L, sodium hypophosphite 0.25 mol / L and sodium citrate 0.15 mol / L was gradually added dropwise to the suspension. Electroless nickel plating was performed. Thereafter, the suspension was filtered to take out the particles, washed with water, and dried to obtain conductive particles having a nickel-phosphorous conductive layer (thickness 0.1 ⁇ m) disposed on the surface of the resin particles.
  • Example 16 (1) Palladium adhesion step Divinylbenzene resin particles (“Micropearl SP-203” manufactured by Sekisui Chemical Co., Ltd.) having a particle size of 3.0 ⁇ m were prepared. The resin particles were etched and washed with water. Next, resin particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • Nickel plating solution containing 0.23 mol / L nickel sulfate, 0.92 mol / L dimethylamine borane, 0.5 mol / L sodium citrate and 0.01 mol / L sodium tungstate (pH 8. 5) was prepared.
  • the nickel plating solution was gradually dropped into the suspension to perform electroless nickel plating. Thereafter, by filtering the suspension, the particles are taken out, washed with water, and dried to obtain conductive particles having a nickel-tungsten-boron conductive layer (thickness of about 0.1 ⁇ m) on the surface of the resin particles. Obtained.
  • Example 1 Conductive particles were obtained in the same manner as in Example 1 except that the tungsten carbide particles (average particle size 100 nm) were changed to copper particles (average particle size 100 nm).
  • Example 2 Conductive particles were obtained in the same manner as in Example 1 except that the tungsten carbide particles (average particle size 100 nm) were changed to silica particles (average particle size 100 nm).
  • Example 17 (1) Palladium adhesion step Divinylbenzene resin particles (“Micropearl SP-203” manufactured by Sekisui Chemical Co., Ltd.) having a particle size of 3.0 ⁇ m were prepared. The resin particles were etched and washed with water. Next, resin particles were added to 100 mL of a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • a palladium-catalyzed solution containing 8% by weight of a palladium catalyst and stirred. Then, it filtered and wash
  • connection resistance Fabrication of connection structure 10 parts by weight of bisphenol A type epoxy resin (“Epicoat 1009” manufactured by Mitsubishi Chemical Corporation), 40 parts by weight of acrylic rubber (weight average molecular weight of about 800,000), 200 parts by weight of methyl ethyl ketone, and a microcapsule type curing agent (Asahi Kasei Chemicals) "HX3941HP” manufactured by HX3941) and 2 parts by weight of a silane coupling agent ("SH6040" manufactured by Toray Dow Corning Silicone Co., Ltd.) are mixed, and the conductive particles are added so that the content is 3% by weight.
  • a resin composition was obtained by dispersing.
  • the obtained resin composition was applied to a 50 ⁇ m-thick PET (polyethylene terephthalate) film whose one surface was release-treated, and dried with hot air at 70 ° C. for 5 minutes to produce an anisotropic conductive film.
  • the thickness of the obtained anisotropic conductive film was 12 ⁇ m.
  • the obtained anisotropic conductive film was cut into a size of 5 mm ⁇ 5 mm.
  • a two-layer flexible printed board width 2 cm, length 1 cm having the same aluminum electrode was bonded after being aligned so that the electrodes overlap each other.
  • the laminated body of the glass substrate and the two-layer flexible printed circuit board was thermocompression bonded under pressure bonding conditions of 10 N, 180 ° C., and 20 seconds to obtain a connection structure.
  • a two-layer flexible printed board in which an aluminum electrode is directly formed on a polyimide film was used.
  • connection resistance measurement The connection resistance between the opposing electrodes of the obtained connection structure was measured by the 4-terminal method. Further, the connection resistance was determined according to the following criteria.
  • connection resistance ⁇ : Less than 90% of connection resistance when using conductive particles of Reference Example 1 ⁇ : 90% or more and less than 95% of connection resistance when using conductive particles of Reference Example 1 ⁇ : Reference Example 1 95% or more of connection resistance when using conductive particles of less than 105% ⁇ : 105% or more of connection resistance when using conductive particles of Reference Example 1

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
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Abstract

La présente invention a trait : à une particule conductrice au moyen de laquelle il est possible de réduire la résistance à la connexion dans les cas où les électrodes sont connectées l'une à l'autre ; et à un matériau conducteur utilisant la particule conductrice. Une particule conductrice (1) selon la présente invention est pourvue d'une particule de matière première (2) et d'un matériau conducteur (4) qui est disposé sur une région de la particule de matière première (2), ladite région étant une partie de la surface de la particule de matière première et le matériau conducteur (4) étant un matériau qui est doté d'une dureté Mohs supérieure à celle du nickel.
PCT/JP2013/076515 2012-10-02 2013-09-30 Particule conductrice, matériau conducteur et structure de connexion WO2014054572A1 (fr)

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CN201380037610.2A CN104471650A (zh) 2012-10-02 2013-09-30 导电性粒子、导电材料及连接结构体
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