WO2014054547A1 - 樹脂組成物、樹脂硬化物、透明複合体、表示素子用基板および面光源用基板 - Google Patents

樹脂組成物、樹脂硬化物、透明複合体、表示素子用基板および面光源用基板 Download PDF

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WO2014054547A1
WO2014054547A1 PCT/JP2013/076393 JP2013076393W WO2014054547A1 WO 2014054547 A1 WO2014054547 A1 WO 2014054547A1 JP 2013076393 W JP2013076393 W JP 2013076393W WO 2014054547 A1 WO2014054547 A1 WO 2014054547A1
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resin composition
epoxy compound
resin
glass
substrate
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PCT/JP2013/076393
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English (en)
French (fr)
Japanese (ja)
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大塚　博之
雄介 井上
江口　敏正
内藤　学
大輔 磯部
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住友ベークライト株式会社
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Priority to JP2014539713A priority Critical patent/JPWO2014054547A1/ja
Publication of WO2014054547A1 publication Critical patent/WO2014054547A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/02—Polyglycidyl ethers of bis-phenols

Definitions

  • the present invention relates to a resin composition, a cured resin, a transparent composite, a display element substrate, and a surface light source substrate.
  • This application claims priority based on Japanese Patent Application No. 2012-219174 for which it applied to Japan on October 1, 2012, and uses the content here.
  • Epoxy compounds are widely used in industrial applications, electronic material applications, optical applications and the like from the viewpoints of heat resistance, moldability, transparency, and the like.
  • Patent Documents 1 and 2 describe a cured resin obtained by curing an epoxy compound with an amine catalyst and imidazole.
  • a polymerization initiator of an epoxy compound there is a cationic polymerization initiator.
  • the polymerization reaction of a glycidyl type epoxy compound does not proceed with a cationic polymerization initiator, and a general alicyclic epoxy compound undergoes a polymerization reaction, but its reactivity is low.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2012-116979
  • Patent Document 2 JP 2012-158719 A
  • An object of the present invention is an epoxy compound-containing resin composition and an epoxy compound-containing resin composition that can obtain a cured resin, a transparent composite, a display element substrate, and a surface light source substrate with low energy.
  • the object is to provide a cured product, a transparent composite, a display element substrate, and a surface light source substrate.
  • the reaction accelerator is an alicyclic epoxy compound (2) represented by the following (2):
  • [4] A cured resin product produced by irradiating the resin composition according to any one of [1] to [3] with light.
  • [5] A transparent composite produced by combining the resin composition according to any one of [1] to [3] above and a glass filler and irradiating with light.
  • [9] A surface light source substrate using the cured resin or transparent composite according to the above [4] or [5].
  • a cured product can be obtained with low energy.
  • curing with a cationic polymerization initiator reduces the water absorption of the cured product because the number of hydroxyl groups decreases.
  • the resin composition of this invention has the reaction accelerator which is an epoxy compound (1), a photocationic polymerization initiator, and an alicyclic epoxy compound (2).
  • the reaction accelerator which is an epoxy compound (1), a photocationic polymerization initiator, and an alicyclic epoxy compound (2).
  • Epoxy compound (1) Of the epoxy compound (1) used in the present invention, (1A) is an alicyclic epoxy compound having an epoxycyclohexane ring (however, the one having the structure shown in (2) is excluded).
  • the reaction of the alicyclic epoxy compound represented by (1A) is initiated and proceeds by the photocationic polymerization initiator, but its reactivity is low when compared with the alicyclic epoxy compound shown in (2).
  • the mixture of the alicyclic epoxy compound represented by (1A) and the alicyclic epoxy compound having the structure represented by (2) has a significantly improved reactivity compared to (1A) alone, The reaction by the photocationic polymerization initiator can proceed with energy.
  • the epoxy compound (1A) is highly flexible compared to (2), the copolymer of (1A) and (2) is more flexible than (2) a single polymer. Can be granted.
  • Examples of the epoxy compound represented by (1A) include, for example, an alicyclic epoxy and an alicyclic carbonyl type epoxy compound containing a carbonyl group, an alicyclic epoxy and an alicyclic ester type epoxy compound containing an ester bond, Examples include alicyclic carbonate type epoxy compounds containing cyclic epoxy and carbonate groups.
  • an alicyclic epoxy compound having two or more alicyclic epoxy structures is desirable, and the alicyclic epoxy structure is particularly preferably an epoxycyclohexane ring.
  • the epoxy group of the epoxycyclohexane is formed between adjacent carbons of cyclohexane.
  • the bond to the epoxycyclohexane is preferably a structure that is carried out through carbon that is not adjacent to the carbon that forms the epoxy group. Specific examples include compounds having the following structure.
  • (1B) is an epoxy compound which has a glycidyl type epoxy among the epoxy compounds (1) used by this invention, and is shown by the following structural formula.
  • the reaction of the glycidyl type epoxy compound represented by (1B) generally does not start and proceed with the photocationic polymerization initiator.
  • the mixture of the glycidyl-type epoxy compound represented by (1B) and the alicyclic epoxy compound having the structure represented by (2) has dramatically improved reactivity compared to (1B) alone, and has low energy.
  • the reaction by the photocationic polymerization initiator can be advanced.
  • the epoxy compound (1B) is highly flexible as compared with (2), the copolymer of (1B) and (2) is more flexible than (2) a single polymer. Can be granted.
  • Examples of the epoxy compound represented by (1B) include a glycidyl ether type epoxy compound containing a glycidyl group and an ether bond, a glycidyl ester type epoxy compound containing a glycidyl group and an ester bond, and a glycidyl amine type epoxy containing a glycidyl group and an amino group.
  • a glycidyl ether type epoxy compound for example, bisphenol A type, bisphenol F type, hydrogenated bisphenol A type, biphenyl type, phenol novolac type, bisphenol A novolak type, glycidyl type having a fluorene skeleton, etc. Is used.
  • the epoxy compound represented by (1B) is a glycidyl type epoxy compound having two or more glycidyl type epoxy structures and having a benzene ring
  • the epoxy compound represented by (1B) is a glycidyl type epoxy compound having two or more glycidyl type epoxy structures and having a benzene ring
  • Due to the high refractive index property it becomes possible to produce a cured product having an adjusted refractive index as compared with (2) a cured resin product consisting of a single resin, and it is particularly suitable for optical applications such as display applications.
  • Alicyclic epoxy compound (2) As the alicyclic epoxy compound (2) used in the present invention, the alicyclic epoxy compound represented by the following (2) is used.
  • X in the formula (2) is —O—, —S—, —SO—, —SO 2 —, —CH 2 —, —CH (CH 3 ) —, —C (CH 3 ) 2 — or Represents a bond.
  • the alicyclic epoxy compound represented by (2) is excellent in reactivity with the photocationic polymerization initiator alone, but a mixture in combination with an epoxy compound having another structure is also reactive with the photocationic polymerization initiator. Excellent. That is, the alicyclic epoxy compound having the structure (2) is considered to have an action of promoting the reaction of the epoxy compound having another structure.
  • it is particularly preferable that X is —CH (CH 3 ) —, —C (CH 3 ) 2 — or a single bond.
  • (1A) is 3 ′, 4′-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (product name of Daicel Corporation: “Celoxide 2021p”) , “Celoxide 2081”, “Epolide GT401”, “Epolide PB4700” (hereinafter, Daicel product name), or (1B) a glycidyl ether type epoxy compound containing a glycidyl group and an ether bond, a glycidyl group and Examples include glycidyl ester type epoxy compounds containing an ester bond, glycidyl amine type epoxy compounds containing a glycidyl group and an amino group, and particularly glycidyl ether type epoxy compounds such as bisphenol A type, bisphenol F type, hydrogenated bisphenol.
  • (2) is (3,3 ′, 4,4′-diepoxy) bi, when it is a compound of a type such as diol A type, biphenyl type, phenol novolak type, bisphenol A novolak type, glycidyl type having a fluorene skeleton.
  • cyclohexyl or 2,2′-bis (3,4′-epoxycyclohexyl) propane and when (1A) is 3 ′, 4′-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate,
  • (1B) is a glycidyl ether-epoxy compound having a bisphenol A type, bisphenol F type, biphenyl type, phenol novolac type, or fluorene skeleton
  • (2) is (3, 3 ′, 4, 4 ′) More preferred is -diepoxy) bicyclohexyl.
  • the weight ratio of (1) and (2) is within the above range, it is possible to efficiently react the epoxy compound of (1) in which the reaction by the cationic polymerization initiator is difficult to proceed. Polymerization with can be performed.
  • the characteristic (1) makes it possible to improve flexibility and / or widen the adjustment range of the refractive index in the same manner as described above.
  • the resin composition of the present invention contains a photocationic polymerization initiator as a polymerization initiator.
  • a photocationic photopolymerization initiator reacts well with an epoxy compound having an epoxycyclohexane structure, and particularly has high reactivity with the alicyclic epoxy compound shown in (2), so that the resin composition of the present invention is concentrated. It is suitable for the process of applying light energy, and the pot life is extended.
  • Examples of the cationic photopolymerization initiator include onium salts such as a diazonium salt of Lewis acid, an iodonium salt of Lewis acid, and a sulfonium salt of Lewis acid.
  • Specific examples of the cationic photopolymerization initiator include boron tetrafluoride phenyldiazonium salt, phosphorus hexafluoride diphenyliodonium salt, antimony hexafluoride diphenyliodonium salt, arsenic hexafluoride tri-4-methylphenylsulfonium Salts, tri-4-methylphenylsulfonium salt of antimony tetrafluoride, and mixtures thereof.
  • Adekaoptomer SP-150 Adekaoptomer SP-170 manufactured by Adeka
  • Kayrad PCI-220 Kayalad PCI-620 manufactured by Nippon Kayaku
  • UVI-6990 manufactured by Union Carbide
  • CIT- manufactured by Nippon Soda 1370 CIT-1682, CIP-1866S, CIP-2048S, CIP-2064S
  • DPI-101 manufactured by Midori Chemical DPI-102, DPI-103, DPI-105, MPI-103, MPI-105, BBI-101, BBI-102, BBI-103, BBI-105, TPS-101, TPS-102, TPS-103, TPS-105, MDS-103, MDS-105, DTS-102, DTS-103, and the like.
  • the resin composition of the present invention is cured with low energy, and can be cured even if the cumulative amount of light irradiated to the resin composition is reduced.
  • the integrated light quantity of necessary light for example, preferably from 50 ⁇ 5000mJ / cm 2, more preferably 100 ⁇ 4000mJ / cm 2, 150 ⁇ Even more preferably, it is 3000 mJ / cm 2 .
  • the light for measuring the integrated light amount is ultraviolet light
  • the integrated light amount is an integrated light amount having a wavelength of 365 nm.
  • “curing” means that many functional groups that can participate in the curing reaction are reacted in the resin composition. Specifically, the epoxy ring opening rate of the resin composition is 50% or more. It means that. What hardened
  • cured the resin composition is called resin cured material.
  • the epoxy ring opening rate is an index corresponding to the ring opening rate of epoxy groups in the resin composition.
  • FT-IR Fourier transform infrared spectroscopy
  • the area of the peak derived from the epoxy group located near the wave number of 914 cm ⁇ 1 was standardized by the area of the peak derived from the methylene group located near the wave number of 2900 cm ⁇ 1.
  • Epoxy relative strength the ratio of the peak area derived from the epoxy group to the peak area derived from the methylene group is defined as the epoxy relative strength X of the sample, and the epoxy ring opening rate of the sample to be obtained is defined as Y (%).
  • the epoxy relative strength of the resin composition before curing is measured in advance. Since it is presumed that the epoxy group is not ring-opened in the resin composition before curing, this can be used as a standard sample.
  • the epoxy relative strength of the resin composition before curing can be regarded as a strength corresponding to an epoxy ring-opening rate of 0%.
  • the epoxy ring-opening rate Y (%) of the sample is calculated as a value obtained by multiplying 100 by the value obtained by dividing the epoxy relative strength X of the sample by the epoxy relative strength of the resin composition before curing. *
  • the resin cured product of the present invention is cured by mixing a resin composition containing each of the above components with various fillers as necessary and forming it into a desired shape, and applying heat energy and / or light energy. It is something to be made.
  • the transparent composite of the present invention is obtained by mixing various fillers with the resin composition containing the above components and molding the resin composition into a plate shape and curing the resin composition.
  • the substrate for a surface light source of the present invention is impregnated with a resin composition in which the above-mentioned components are mixed into glass fiber as a filler, and after being molded (shaped) into a plate shape in this state, the resin composition is cured. It has been made.
  • the water absorption rate of the cured resin, the transparent composite, and the surface light source substrate of the present invention is not particularly limited, but is preferably 0 to 5%, and more preferably 0 to 3%.
  • the water absorption here refers to the water absorption after the resin cured product, transparent composite and / or surface light source substrate is dried at 50 ° C./24 hours and then immersed in pure water at 23 ° C. for 24 hours. Say.
  • the water absorption rate of the cured resin, transparent composite and surface light source substrate of the present invention is within the above range, it is possible to suppress water absorption expansion, especially for industrial use, electronic material use and optical use that require dimensional accuracy. Is suitable.
  • the filler will be described.
  • the cured resin, the transparent composite, and the surface light source substrate of the present invention may contain various fillers as necessary, and in this case, it is preferable to contain a glass filler.
  • the glass filler is a filler (filler) composed of fibers or particles made of an inorganic glass material.
  • FIG. 1 illustrates a surface light source substrate 100 when the glass fiber 2 is a glass cloth.
  • the glass fiber 2 shown in FIG. 1 is composed of a longitudinal glass yarn (warp) 2a and a transverse glass yarn (weft) 2b, and the longitudinal glass yarn 2a and the transverse glass yarn 2b are substantially orthogonal to each other. .
  • Examples of the woven structure of the glass fiber 2 include a plain weave shown in FIG. 1, a nanako weave, a satin weave, and a twill weave.
  • a plain weave is a woven structure in which warps and wefts are alternately woven.
  • Nanako weaving is a woven structure in which a plurality of warp yarns and a plurality of weft yarns are alternately crossed.
  • the satin weave is a woven structure woven so that one of warp and weft is extended to the surface.
  • a twill weave is a weave structure in which warp or weft weaving continues diagonally.
  • Examples of the inorganic glass material include E glass, C glass, A glass, S glass, T glass, D glass, NE glass, quartz, low dielectric constant glass, and high dielectric constant glass.
  • E glass, S glass, T glass, and NE glass which are easy to obtain with few ionic impurities, are preferably used.
  • S glass or T glass having an average linear expansion coefficient of 5 ppm / K or less at 30 ° C. to 250 ° C. is more preferably used, and is easily available and inexpensive.
  • glass E is more preferably used.
  • the content of the glass filler is preferably 1 to 90% by mass, more preferably 10 to 80% by mass, and more preferably 10 to 80% by mass with respect to the cured resin, the transparent composite, and the cured resin in the surface light source substrate.
  • the amount is preferably 30 to 70% by mass. If the content of the glass filler is within this range, it is easy to mold the resin cured product, the transparent composite, and the substrate for the surface light source, and the effect of reducing the linear expansion due to the composite of the resin composition and the glass filler is recognized. Moreover, if there is much glass filler amount, the uniformity of the resin amount per unit volume will improve, and the uniformity of stress will improve. When the resin amount and / or stress uniformity is improved, the undulation of the cured resin, the transparent composite, and the surface light source substrate is reduced. *
  • the diameter which the fiber which comprises glass fiber and glass fiber cloth is 100 nm or less. Glass fibers and glass fiber fabrics that satisfy these conditions are less likely to scatter at the interface regardless of the difference between their refractive index and the refractive index of the epoxy compound, so that the cured resin, transparent composite, and surface light source The transparency of the substrate is relatively high.
  • the average diameter of the glass fibers is more preferably about 2 to 15 ⁇ m, further preferably about 3 to 12 ⁇ m, and most preferably about 3 to 10 ⁇ m.
  • the average diameter of glass fiber is calculated
  • the cured resin, transparent composite and surface light source substrate of the present invention are thermoplastic or thermosetting resin oligomers and monomers, coupling agents, ultraviolet absorbers, as necessary, as long as the characteristics are not impaired. Agents, dyes, pigments, other fillers, etc. may be included.
  • the cured resin, the transparent composite and the surface light source substrate of the present invention can further increase the haze value by including a filler or the like in addition to the glass filler in the resin material. It becomes possible to make a substrate for a body and a surface light source.
  • the refractive index difference between the filler other than the glass filler and the cured resin is preferably 0.01 or more and 3 or less. When this difference in refractive index is less than 0.01, there is a high possibility that a problem that the effect on light diffusibility is not sufficiently exhibited. On the other hand, there are very few materials having a difference in refractive index of 3 or more and lack selectivity.
  • Examples of materials used for fillers other than glass fillers include inorganic materials and mixtures thereof, such as zinc oxide, zirconium oxide, aluminum oxide, calcium oxide, titanium oxide, silica, and mixtures thereof.
  • Examples of the organic material include those using acrylic, styrene, or a mixture thereof.
  • Examples of the shape of the filler other than the glass filler include a spherical shape, a rod shape, a planar shape, and a fibrous shape.
  • the content of the filler other than the glass filler is preferably about 1 to 90 parts by mass and more preferably about 3 to 70 parts by mass with respect to 100 parts by mass of the glass filler.
  • the conversion particle size is 0.1 to 100 micrometer.
  • the thickness is 0.1 ⁇ m or less and 100 ⁇ m or more, there is a problem that the diffusion function cannot be sufficiently exhibited.
  • the fiber diameter is preferably 0.1 ⁇ m or more and 100 ⁇ m or less.
  • the thickness is 0.1 ⁇ m or less and 100 ⁇ m or more, there is a problem that the diffusion function cannot be sufficiently exhibited.
  • Examples of the method for molding the resin composition include a method of casting into a mold.
  • a method in which the resin composition is dissolved in a solvent and cast by a method such as gravure coating, spin coating, bar coating, dip coating or the like can be mentioned.
  • a method of impregnating a component other than the glass filler from one or both sides of the glass fiber cloth to form a resin composition molded into a plate shape is used. Can be mentioned.
  • the curing of the resin composition is performed by irradiating the resin composition with light, that is, by irradiating with ultraviolet rays, electron beams, or the like in the present invention.
  • the reaction can be further advanced by performing a heat treatment as a secondary treatment.
  • the treatment temperature during the secondary treatment is preferably about 150 to 300 ° C., more preferably about 200 to 280 ° C.
  • the treatment time is preferably about 0.1 to 5 hours, more preferably about 0.2 to 3 hours. Thereby, reaction can be advanced efficiently.
  • dissolves a resin composition methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene, ethyl acetate etc. are mentioned, for example.
  • the cured resin product of the present invention is preferably applied to, for example, lamp covers such as lighting fixtures and automobile lamps, optical lenses such as eyeglass lenses and camera lenses, and figurines.
  • the transparent composite of the present invention can be applied to various transparent substrates such as substrates for liquid crystal display devices, substrates for organic EL devices, substrates for color filters, substrates for electronic paper, substrates for solar cells, substrates for touch panels, etc. Preferably applied.
  • the average thickness of the transparent composite is not particularly limited, but is preferably about 10 to 300 ⁇ m, and more preferably about 20 to 200 ⁇ m.
  • the substrate for a surface light source of the present invention has a surface texture on which at least one surface of the substrate has irregularities, and the irregularities have an average roughness (Rz) of 10 points on the surface of 1 ⁇ m to 30 ⁇ m. It is.
  • the method of providing irregularities on the substrate surface is not particularly limited.
  • a method of fixing particles on the substrate surface a method of mixing particles in a substrate and dispersing the particles near the substrate surface, a base substrate subjected to embossing, etc.
  • Examples thereof include a method for forming and transferring a substrate, and a method for mechanically forming irregularities on the surface.
  • FIG. 2 is a cross-sectional view of a surface light source substrate 100 in which a filler 4 is fixed on a composite layer including a resin 1 and glass fibers 2.
  • the substrate when producing the resin substrate, after mixing the particles with the resin composition before curing, the substrate can be produced and the surface can be provided with irregularities by the mixed particles.
  • the particles used here include a filler.
  • the method of transferring the embossed shape to the surface of the substrate with the embossed mold and the substrate on the embossed mold is a method in which after making and curing the substrate, it is removed from the mold and the unevenness of the mold is transferred.
  • the embossed mold is pressed to transfer the unevenness on the mold.
  • the embossed mold is made of metal, the unevenness of the substrate surface can be produced with good reproducibility, which is suitable for mass production.
  • the glass fiber 2 and the resin cured material 1 are further provided with a resin cured material layer 4, and an embossed base substrate 5, which is an embossed mold, is pressed against the resin cured material layer 4. The method for producing the unevenness for transferring the film was shown.
  • a method for mechanically producing irregularities on the surface a method of directly roughing the substrate surface by sand blasting, a method of rubbing with a wire brush or sand paper, and mechanically imparting irregularities to the surface can be used.
  • E glass-based glass cloth (Unitika Glass Fiber Co., Ltd. (# 2319 type) refractive index 1.555) (3, 3 ′, 4, 4′-diepoxy) bicyclohexyl (Celoxide 8000, manufactured by Daicel Corporation) 40 Parts by weight and 60 parts by weight of a bisphenol type epoxy compound (jER828 manufactured by Mitsubishi Chemical Corporation), 4,4′-bis [bis (( ⁇ -hydroxyethoxy) phenyl) sulfonio] phenyl sulfide-bis-hexa as a photocationic polymerization initiator
  • a resin composition consisting of 1 part by weight of fluoroantimonate) (ADEKA OPTMER SP-170 manufactured by ADEKA Corporation) was impregnated in vacuum for 2 hours and defoamed.
  • the physical properties were measured by the following methods.
  • A Total light transmittance, haze Based on JIS-K-7361, the total light transmittance of the composite material was measured using a haze meter NDH: 2000 (manufactured by Nippon Denshoku Industries Co., Ltd.).
  • B Average linear expansion coefficient (CTE) Using a TMA / S S 120 C type thermal stress strain measuring device manufactured by Seiko Instruments Inc., the temperature is raised from 30 ° C. to 230 ° C. at a rate of 5 ° C. per minute and held for 20 minutes. Thereafter, the average linear expansion coefficient was determined by measuring the value when cooled to 230 ° C. to 30 ° C. at a rate of 5 ° C. per minute. The measurement was performed in a tensile mode with a load of 5 g.
  • a resin produced from an epoxy compound-containing resin composition and an epoxy compound-containing resin composition capable of obtaining a cured resin, a transparent composite, a display element substrate, and a surface light source substrate with low energy.
  • a cured product, a transparent composite, a display element substrate, and a surface light source substrate can be obtained. Therefore, the present invention can be suitably used for “a resin composition, a cured resin, a transparent composite, a display element substrate, and a surface light source substrate”, and is extremely important industrially.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2013/076393 2012-10-01 2013-09-27 樹脂組成物、樹脂硬化物、透明複合体、表示素子用基板および面光源用基板 WO2014054547A1 (ja)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017033056A1 (en) * 2015-08-27 2017-03-02 Toray Industries, Inc. Epoxy resin compositions and fiber-reinforced composite materials prepared therefrom
WO2017078006A1 (ja) * 2015-11-06 2017-05-11 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146038A (ja) * 2003-11-12 2005-06-09 Daicel Chem Ind Ltd 紫外線硬化型接着剤およびその接着体
JP2011144214A (ja) * 2010-01-12 2011-07-28 Sumitomo Bakelite Co Ltd 樹脂組成物および透明複合基板
JP2012025833A (ja) * 2010-07-22 2012-02-09 Daicel Corp 繊維強化透明樹脂組成物及びその製造方法並びに透明シート
JP2012140607A (ja) * 2010-12-14 2012-07-26 Daicel Corp 硬化性組成物、及び硬化樹脂

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146038A (ja) * 2003-11-12 2005-06-09 Daicel Chem Ind Ltd 紫外線硬化型接着剤およびその接着体
JP2011144214A (ja) * 2010-01-12 2011-07-28 Sumitomo Bakelite Co Ltd 樹脂組成物および透明複合基板
JP2012025833A (ja) * 2010-07-22 2012-02-09 Daicel Corp 繊維強化透明樹脂組成物及びその製造方法並びに透明シート
JP2012140607A (ja) * 2010-12-14 2012-07-26 Daicel Corp 硬化性組成物、及び硬化樹脂

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017033056A1 (en) * 2015-08-27 2017-03-02 Toray Industries, Inc. Epoxy resin compositions and fiber-reinforced composite materials prepared therefrom
WO2017078006A1 (ja) * 2015-11-06 2017-05-11 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JPWO2017078006A1 (ja) * 2015-11-06 2018-08-23 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤

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