WO2017078006A1 - 有機エレクトロルミネッセンス表示素子用封止剤 - Google Patents
有機エレクトロルミネッセンス表示素子用封止剤 Download PDFInfo
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- WO2017078006A1 WO2017078006A1 PCT/JP2016/082411 JP2016082411W WO2017078006A1 WO 2017078006 A1 WO2017078006 A1 WO 2017078006A1 JP 2016082411 W JP2016082411 W JP 2016082411W WO 2017078006 A1 WO2017078006 A1 WO 2017078006A1
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- WIPO (PCT)
- Prior art keywords
- compound represented
- organic
- formula
- display elements
- sealing agent
- Prior art date
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- 239000000565 sealant Substances 0.000 title abstract description 6
- 150000001875 compounds Chemical class 0.000 claims abstract description 60
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 12
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 12
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 150000001450 anions Chemical class 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 39
- 239000003795 chemical substances by application Substances 0.000 claims description 38
- 125000002091 cationic group Chemical group 0.000 claims description 9
- 238000005401 electroluminescence Methods 0.000 claims description 8
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 claims description 7
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims description 7
- 150000003242 quaternary ammonium salts Chemical group 0.000 claims description 7
- NQEJEMZJOBCYOD-UHFFFAOYSA-N (4-methoxyphenyl)methyl-dimethyl-phenylazanium Chemical group C1=CC(OC)=CC=C1C[N+](C)(C)C1=CC=CC=C1 NQEJEMZJOBCYOD-UHFFFAOYSA-N 0.000 claims description 4
- 238000003860 storage Methods 0.000 abstract description 16
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 238000010943 off-gassing Methods 0.000 abstract description 3
- 150000003863 ammonium salts Chemical class 0.000 abstract 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 10
- -1 borate quaternary ammonium salt Chemical class 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000003381 stabilizer Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000003607 modifier Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical class OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 235000010216 calcium carbonate Nutrition 0.000 description 2
- 238000005341 cation exchange Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000003456 ion exchange resin Substances 0.000 description 2
- 229920003303 ion-exchange polymer Polymers 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- QLGYTJLZFZUDFL-UHFFFAOYSA-N 1,3-bis[1-(1h-imidazol-2-yl)propyl]urea Chemical compound N=1C=CNC=1C(CC)NC(=O)NC(CC)C1=NC=CN1 QLGYTJLZFZUDFL-UHFFFAOYSA-N 0.000 description 1
- VDAIJDKQXDCJSI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)ethylurea Chemical compound CC1=NC=CN1CCNC(N)=O VDAIJDKQXDCJSI-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- GMXOYEFGMAXIIU-UHFFFAOYSA-N C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C Chemical compound C[N+](CC1=CC(=C(C=C1)C)C)(C1=CC=CC=C1)C GMXOYEFGMAXIIU-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- VPSDPCXOOHMTDQ-UHFFFAOYSA-N [B+3].C(C)[N+](C1=CC=CC=C1)(CC1=CC=CC=C1)CC Chemical compound [B+3].C(C)[N+](C1=CC=CC=C1)(CC1=CC=CC=C1)CC VPSDPCXOOHMTDQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000288 alkali metal carbonate Inorganic materials 0.000 description 1
- 150000008041 alkali metal carbonates Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000005349 anion exchange Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- NKWPZUCBCARRDP-UHFFFAOYSA-L calcium bicarbonate Chemical compound [Ca+2].OC([O-])=O.OC([O-])=O NKWPZUCBCARRDP-UHFFFAOYSA-L 0.000 description 1
- 229910000020 calcium bicarbonate Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- HYVNJCOHGOONJK-UHFFFAOYSA-N dibenzyl-methyl-phenylazanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(C)CC1=CC=CC=C1 HYVNJCOHGOONJK-UHFFFAOYSA-N 0.000 description 1
- ONRGBXGMVZEZLY-UHFFFAOYSA-N dimethyl-[(4-methylphenyl)methyl]-phenylazanium Chemical compound C1=CC(C)=CC=C1C[N+](C)(C)C1=CC=CC=C1 ONRGBXGMVZEZLY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- BLGWXSOTAXXXDE-UHFFFAOYSA-N n'-[1-(1h-imidazol-2-yl)propyl]hexanediamide Chemical compound NC(=O)CCCCC(=O)NC(CC)C1=NC=CN1 BLGWXSOTAXXXDE-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Definitions
- the present invention relates to a sealant for organic electroluminescence display elements that can suppress the generation of outgas and is excellent in storage stability and applicability.
- organic EL organic electroluminescence
- organic thin film element can be easily produced by vacuum deposition, solution coating, or the like, and thus has excellent productivity.
- the organic EL display element has a thin film structure in which an organic light emitting material layer is sandwiched between a pair of electrodes facing each other. When electrons are injected from one electrode into the organic light emitting material layer and holes are injected from the other electrode, electrons and holes are combined in the organic light emitting material layer to perform self-light emission. Compared with a liquid crystal display element or the like that requires a backlight, the visibility is better, the thickness can be reduced, and direct current low voltage driving is possible.
- an organic EL display element has a problem that when the organic light emitting material layer and the electrode are exposed to the outside air, the light emission characteristics thereof are rapidly deteriorated and the life is shortened. Therefore, for the purpose of improving the stability and durability of the organic EL display element, in the organic EL display element, a sealing technique for shielding the organic light emitting material layer and the electrode from moisture and oxygen in the atmosphere is indispensable. Yes.
- Patent Document 1 discloses a method of filling a photocurable adhesive between organic EL display element substrates in a top emission organic EL display element or the like, and irradiating light to seal.
- a photocurable adhesive between organic EL display element substrates in a top emission organic EL display element or the like, and irradiating light to seal.
- Such conventional photocurable adhesives have a problem in that they generate outgas during light irradiation to deteriorate the device, and are inferior in storage stability and applicability.
- An object of this invention is to provide the sealing agent for organic electroluminescent display elements which can suppress generation
- the present invention relates to a sealing agent for organic electroluminescence display elements comprising a cationically polymerizable compound and a thermal cationic polymerization initiator, wherein the cationically polymerizable compound is a compound represented by the following formula (1-1) And the thermal cationic polymerization initiator is a sealing agent for an organic electroluminescence display device, wherein the counter anion is a quaternary ammonium salt having a borate system. .
- thermosetting composition instead of the photocurable composition as disclosed in Patent Document 1 as a sealing agent for organic EL display elements.
- thermosetting composition instead of the photocurable composition as disclosed in Patent Document 1 as a sealing agent for organic EL display elements.
- the present inventor used a combination of two specific cationic polymerizable compounds, and furthermore, by using a specific thermal cationic polymerization initiator, it was possible to suppress the generation of outgas and preserve it.
- paintability could be obtained, and came to complete this invention.
- the sealing agent for organic EL display elements of this invention contains a cationically polymerizable compound.
- the cationically polymerizable compound contains a compound represented by the formula (1-1) and a compound represented by the formula (1-2).
- the sealing agent for organic EL display elements of this invention can suppress generation
- the content ratio of the compound represented by the formula (1-1) and the compound represented by the formula (1-2) is a weight ratio of the compound represented by the formula (1-1):
- the compound represented by (1-2) is preferably 9: 1 to 1: 4.
- the content ratio of the compound represented by the formula (1-1) and the compound represented by the formula (1-2) is a weight ratio of the compound represented by the formula (1-1):
- the compound represented by (1-2) is more preferably 7: 1 to 1: 2.
- examples of the commercially available compounds include Celoxide 8000 (manufactured by Daicel), and among the compounds represented by the formula (1-2), Examples of such materials include Celoxide 2021P (manufactured by Daicel Corporation).
- the sealing agent for organic EL display elements of the present invention contains other cationic polymerizable compounds such as bisphenol A type epoxy resin and bisphenol F type epoxy resin as the cationic polymerizable compound as long as the object of the present invention is not impaired.
- the compound represented by the above formula (1-1) and the above formula (1-) is 60 parts by weight.
- a more preferred lower limit of the total content of the compound represented by the formula (1-1) and the compound represented by the formula (1-2) is 70 parts by weight, and a more preferred lower limit is 80 parts by weight.
- the sealing agent for organic EL display elements of this invention contains a thermal cationic polymerization initiator.
- the thermal cationic polymerization initiator is a quaternary ammonium salt whose counter anion is borate (hereinafter also referred to as “borate quaternary ammonium salt”).
- the counter anion of the borate quaternary ammonium salt is BF 4 ⁇ or (BX 4 ) ⁇ (where X represents a phenyl group substituted with at least two fluorine or trifluoromethyl groups). It is preferable.
- borate quaternary ammonium salt examples include dimethylphenyl (4-methoxybenzyl) ammonium tetrakis (pentafluorophenyl) borate, dimethylphenyl (4-methylbenzyl) ammonium hexafluorotetrakis (pentafluorophenyl).
- borate quaternary ammonium salts examples include CXC-1821 (manufactured by King Industries). *
- the content of the borate quaternary ammonium salt is preferably 0.05 parts by weight and preferably 10 parts by weight with respect to 100 parts by weight of the cationic polymerizable compound.
- the content of the borate-based quaternary ammonium salt is within this range, the obtained sealing agent for organic EL display elements is excellent in curability, storage stability, and moisture resistance of the cured product.
- group quaternary ammonium salt is 0.1 weight part, and a more preferable upper limit is 5 weight part.
- the sealing agent for organic EL display elements of this invention contains a stabilizer. By containing the said stabilizer, the sealing agent for organic EL display elements of this invention becomes a thing excellent in storage stability more.
- the stabilizer examples include amine compounds such as benzylamine and aminophenol type epoxy resins.
- the content of the stabilizer is preferably 0.001 part by weight and preferably 2 parts by weight with respect to 100 parts by weight of the cationic polymerizable compound.
- the content of the stabilizer is within this range, the obtained sealing agent for organic EL display elements is more excellent in storage stability while maintaining excellent curability.
- the minimum with more preferable content of the said stabilizer is 0.005 weight part, and a more preferable upper limit is 1 weight part.
- the sealing agent for organic EL display elements of the present invention may contain a silane coupling agent for the purpose of improving the adhesion between the sealing agent for organic EL display elements of the present invention and the substrate. It is preferable not to contain a silane coupling agent from the viewpoint of suppressing generation.
- silane coupling agent examples include 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane, and the like. These silane coupling agents may be used independently and 2 or more types may be used together.
- the upper limit of the content of the silane coupling agent is preferably 0.5 parts by weight with respect to 100 parts by weight of the cationic polymerizable compound.
- the content of the silane coupling agent is 0.5 parts by weight or less, a higher adhesion improvement effect can be exhibited while suppressing generation of outgas and bleeding out of excess silane coupling agent.
- the upper limit with more preferable content of the said silane coupling agent is 0.1 weight part.
- the sealing agent for organic EL display elements of the present invention may contain a thermosetting agent as long as the object of the present invention is not impaired.
- the thermosetting agent include hydrazide compounds, imidazole derivatives, acid anhydrides, dicyandiamides, guanidine derivatives, modified aliphatic polyamines, addition products of various amines and epoxy resins, and the like.
- the hydrazide compound include 1,3-bis (hydrazinocarboethyl) -5-isopropylhydantoin.
- imidazole derivatives examples include 1-cyanoethyl-2-phenylimidazole, N- (2- (2-methyl-1-imidazolyl) ethyl) urea, 2,4-diamino-6- (2′-methylimidazolyl- (1 ′))-ethyl-s-triazine, N, N′-bis (2-methyl-1-imidazolylethyl) urea, N, N ′-(2-methyl-1-imidazolylethyl) -adipamide, 2- Examples include phenyl-4-methyl-5-hydroxymethylimidazole and 2-phenyl-4,5-dihydroxymethylimidazole.
- acid anhydride examples include tetrahydrophthalic anhydride, ethylene glycol bis (anhydro trimellitate), and the like. These thermosetting agents may be used alone or in combination of two or more.
- the sealing agent for organic EL display elements of the present invention may contain a surface modifier as long as the object of the present invention is not impaired.
- a surface modifier By containing the said surface modifier, the flatness of the coating film of the sealing agent for organic EL display elements of this invention can be improved.
- the surface modifier include surfactants and leveling agents.
- Examples of the surface modifier include silicone-based, acrylic-based, and fluorine-based ones.
- Examples of commercially available surface modifiers include BYK-302, BYK-331 (both manufactured by Big Chemie Japan), UVX-272 (manufactured by Enomoto Kasei), Surflon S-611 ( AGC Seimi Chemical Co., Ltd.).
- the encapsulant for organic EL display elements of the present invention reacts with the acid generated in the encapsulant for organic EL display elements in order to improve the durability of the element electrode within a range not impairing the object of the present invention.
- a compound or an ion exchange resin may be contained.
- Examples of the compound that reacts with the generated acid include substances that neutralize the acid, for example, alkali metal carbonates or bicarbonates, or alkaline earth metal carbonates or bicarbonates.
- alkali metal carbonates or bicarbonates or alkaline earth metal carbonates or bicarbonates.
- calcium carbonate, calcium hydrogen carbonate, sodium carbonate, sodium hydrogen carbonate and the like are used.
- any of a cation exchange type, an anion exchange type, and a both ion exchange type can be used, and in particular, a cation exchange type or a both ion exchange type capable of adsorbing chloride ions. Is preferred.
- the sealing agent for organic EL display elements of this invention is a range which does not inhibit the objective of this invention, and is a hardening retarder, a reinforcing agent, a softener, a plasticizer, a viscosity modifier, and an ultraviolet absorber as needed. Further, various known additives such as antioxidants may be contained.
- Examples of the method for producing the sealing agent for organic EL display elements of the present invention include a cationically polymerizable compound using a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, or a three roll. And a method of mixing a cationic polymerization initiator and an additive such as a stabilizer or a silane coupling agent added as necessary.
- a mixer such as a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, or a three roll.
- a method of mixing a cationic polymerization initiator and an additive such as a stabilizer or a silane coupling agent added as necessary.
- the sealing agent for organic EL display elements of this invention the preferable minimum of the viscosity in 25 degreeC measured using the E-type viscosity meter is 50 mPa * s, and a preferable upper limit is 250 mPa * s.
- the sealing agent for organic EL display elements of this invention will be excellent by applicability
- a more preferable lower limit of the viscosity is 70 mPa ⁇ s, and a more preferable upper limit is 120 mPa ⁇ s.
- the viscosity is, for example, a VISCOMETER TV-22 (manufactured by Toki Sangyo Co., Ltd.) as an E-type viscometer, and a rotational speed of 1 to 100 rpm as appropriate from the optimum torque number in each viscosity region using a CP1 cone plate. Can be measured by selecting.
- the sealing agent for organic EL display elements of the present invention is particularly preferably used as an in-plane sealing agent that covers and seals a laminate having an organic light emitting material layer.
- Example 1 As the cationic polymerizable compound, 60 parts by weight of a compound represented by the above formula (1-1) (manufactured by Daicel, “Celoxide 8000”) and a compound represented by the above formula (1-2) (manufactured by Daicel, “ 40 parts by weight of Celoxide 2021P ”) and 0.5 parts by weight of dimethylphenyl (4-methoxybenzyl) ammonium tetrakis (pentafluorophenyl) borate (" CXC-1821 "manufactured by King Industries) as a thermal cationic polymerization initiator Then, the mixture was stirred and mixed uniformly at a stirring speed of 3000 rpm using a stirring mixer (“AR-250” manufactured by Sinky Corporation) to prepare a sealing agent for organic EL display elements.
- a stirring speed 3000 rpm
- a stirring mixer (“AR-250” manufactured by Sinky Corporation)
- Examples 2 to 5, Comparative Examples 1 to 9 The materials described in Tables 1 and 2 were stirred and mixed in the same manner as in Example 1 according to the blending ratios described in Tables 1 and 2, and organic ELs of Examples 2 to 5 and Comparative Examples 1 to 9 were mixed. A sealant for display element was produced.
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Abstract
Description
本発明者は、有機EL表示素子用封止剤として特許文献1に開示されているような光硬化系の組成物に代えて、熱硬化系の組成物を用いることを検討した。しかしながら、このような熱硬化系の組成物においても、アウトガスの発生を抑制する効果と保存安定性と塗布性との全てに優れるものとすることは困難であった。そこで本発明者は更に鋭意検討した結果、特定の2種のカチオン重合性化合物を組み合わせて用い、更に、特定の熱カチオン重合開始剤を用いることにより、アウトガスの発生を抑制することができ、保存安定性及び塗布性に優れる有機EL表示素子用封止剤を得ることができることを見出し、本発明を完成させるに至った。
上記カチオン重合性化合物は、上記式(1-1)で表される化合物及び上記式(1-2)で表される化合物を含有する。上記式(1-1)で表される化合物及び上記式(1-2)で表される化合物を含有し、更に、熱カチオン重合開始剤として対アニオンがボレート系である第4級アンモニウム塩を含有することにより、本発明の有機EL表示素子用封止剤は、アウトガスの発生を抑制することができ、保存安定性及び塗布性に優れるものとなる。
上記熱カチオン重合開始剤は、対アニオンがボレート系である第4級アンモニウム塩(以下、「ボレート系第4級アンモニウム塩」ともいう)である。上記ボレート系第4級アンモニウム塩の対アニオンは、BF4 -又は(BX4)-(ただし、Xは、少なくとも2つ以上のフッ素若しくはトリフルオロメチル基で置換されたフェニル基を表す)であることが好ましい。
上記熱硬化剤としては、例えば、ヒドラジド化合物、イミダゾール誘導体、酸無水物、ジシアンジアミド、グアニジン誘導体、変性脂肪族ポリアミン、各種アミンとエポキシ樹脂との付加生成物等が挙げられる。
上記ヒドラジド化合物としては、例えば、1,3-ビス(ヒドラジノカルボエチル)-5-イソプロピルヒダントイン等が挙げられる。
上記イミダゾール誘導体としては、例えば、1-シアノエチル-2-フェニルイミダゾール、N-(2-(2-メチル-1-イミダゾリル)エチル)尿素、2,4-ジアミノ-6-(2’-メチルイミダゾリル-(1’))-エチル-s-トリアジン、N,N’-ビス(2-メチル-1-イミダゾリルエチル)尿素、N,N’-(2-メチル-1-イミダゾリルエチル)-アジポアミド、2-フェニル-4-メチル-5-ヒドロキシメチルイミダゾール、2-フェニル-4,5-ジヒドロキシメチルイミダゾール等が挙げられる。
上記酸無水物としては、例えば、テトラヒドロ無水フタル酸、エチレングリコールービス(アンヒドロトリメリテート)等が挙げられる。
これらの熱硬化剤は、単独で用いられてもよいし、2種類以上が併用されてもよい。
上記表面改質剤としては、例えば、界面活性剤やレベリング剤等が挙げられる。
上記表面改質剤のうち市販されているものとしては、例えば、BYK-302、BYK-331(いずれも、ビックケミー・ジャパン社製)、UVX-272(楠本化成社製)、サーフロンS-611(AGCセイミケミカル社製)等が挙げられる。
なお、上記粘度は、例えば、E型粘度計としてVISCOMETER TV-22(東機産業社製)を用い、CP1のコーンプレートにて、各粘度領域における最適なトルク数から適宜1~100rpmの回転数を選択することにより測定することができる。
カチオン重合性化合物として、上記式(1-1)で表される化合物(ダイセル社製、「セロキサイド8000」)60重量部及び上記式(1-2)で表される化合物(ダイセル社製、「セロキサイド2021P」)40重量部と、熱カチオン重合開始剤としてジメチルフェニル(4-メトキシベンジル)アンモニウムテトラキス(ペンタフルオロフェニル)ボレート(King Industries社製、「CXC-1821」)0.5重量部とを、撹拌混合機(シンキー社製、「AR-250」)を用い、撹拌速度3000rpmで均一に撹拌混合して、有機EL表示素子用封止剤を作製した。
表1、2に記載された各材料を、表1、2に記載された配合比に従い、実施例1と同様にして撹拌混合して、実施例2~5、比較例1~9の有機EL表示素子用封止剤を作製した。
実施例及び比較例で得られた各有機EL表示素子用封止剤について以下の評価を行った。結果を表1、2に示した。
実施例及び比較例で得られた各有機EL表示素子用封止剤について、E型粘度計(東機産業社製、「VISCOMETER TV-22」)を用いて、25℃における粘度を測定した。
ピペットを用いて実施例及び比較例で得られた各有機EL表示素子用封止剤0.1mLをガラス基板上に塗布し、1分後に広がった直径を測定した。直径が20mm以上であった場合を「◎」、15mm以上20mm未満であった場合を「○」、10mm以上15mm未満であった場合を「△」、10mm未満であった場合を「×」として、塗布性を評価した。
実施例及び比較例で得られた各有機EL表示素子用封止剤について、E型粘度計(東機産業社製、「VISCOMETER TV-22」)を用いて、25℃にて、製造直後の初期粘度と25℃で1週間保管したときの粘度とを測定し、(25℃、1週間保管後の粘度)/(初期粘度)を粘度変化率とし、粘度変化率が1.2倍未満であった場合を「◎」、1.2倍以上1.5倍未満であった場合を「○」、1.5倍以上2.0倍未満であった場合を「△」、2.0倍以上であった場合を「×」として保存安定性を評価した。
実施例及び比較例で得られた各有機EL表示素子用封止剤について、100℃で30分間加熱して硬化させた時のエポキシ基の反応率(エポキシ基由来のピークの減少率)を、赤外分光装置(Agilent Technologies社製、「UMA600」)を用いて測定し、反応率が90%以上であった場合を「◎」、80%以上90%未満であった場合を「○」、60%以上80%未満であった場合を「△」、60%未満であった場合を「×」として硬化性を評価した。
実施例及び比較例で得られた各有機EL表示素子用封止剤を、バイアル瓶中に300mg計量して封入した後、100℃で30分間加熱を行うことで硬化させた。更に、このバイアル瓶を85℃の恒温オーブンで100時間加熱し、バイアル瓶中の気化成分を、ガスクロマトグラフ質量分析計(日本電子社製、「JMS-Q1050」)を用いて測定した。
気化成分量が30ppm未満であった場合を「◎」、30ppm以上50ppm未満であった場合を「○」、50ppm以上100ppm未満であった場合を「△」、100ppm以上であった場合を「×」としてアウトガス防止性を評価した。
Claims (4)
- 対アニオンがボレート系である第4級アンモニウム塩は、ジメチルフェニル(4-メトキシベンジル)アンモニウムテトラキス(ペンタフルオロフェニル)ボレートであることを特徴とする請求項1記載の有機エレクトロルミネッセンス表示素子用封止剤。
- 式(1-1)で表される化合物と式(1-2)で表される化合物との含有割合は、重量比で、前記式(1-1)で表される化合物:前記式(1-2)で表される化合物=9:1~1:4であることを特徴とする請求項1又は2記載の有機エレクトロルミネッセンス表示素子用封止剤。
- カチオン重合性化合物全体100重量部中における式(1-1)で表される化合物及び式(1-2)で表される化合物の合計の含有量が60重量部以上であることを特徴とする請求項1、2又は3記載の有機エレクトロルミネッセンス表示素子用封止剤。
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CN108957952A (zh) * | 2017-05-17 | 2018-12-07 | 东京应化工业株式会社 | 固化性组合物、固化膜、显示面板、及固化物的制造方法 |
WO2020149359A1 (ja) * | 2019-01-18 | 2020-07-23 | 積水化学工業株式会社 | 有機el表示素子用封止剤セット及び有機el表示素子 |
JPWO2021010226A1 (ja) * | 2019-07-17 | 2021-01-21 | ||
JPWO2019203180A1 (ja) * | 2018-04-20 | 2021-03-11 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
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JPWO2019203180A1 (ja) * | 2018-04-20 | 2021-03-11 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
JP7479842B2 (ja) | 2018-04-20 | 2024-05-09 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
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JPWO2020149359A1 (ja) * | 2019-01-18 | 2021-12-02 | 積水化学工業株式会社 | 有機el表示素子用封止剤セット及び有機el表示素子 |
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WO2022239846A1 (en) * | 2021-05-12 | 2022-11-17 | Henkel Japan Ltd. | Visible-laser-curable or infrared-laser-curable cationically polymerizable epoxy resin composition |
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