WO2014034975A1 - Appareil de dépôt destiné à un processus d'encapsulation de diode électroluminescente organique - Google Patents

Appareil de dépôt destiné à un processus d'encapsulation de diode électroluminescente organique Download PDF

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Publication number
WO2014034975A1
WO2014034975A1 PCT/KR2012/006867 KR2012006867W WO2014034975A1 WO 2014034975 A1 WO2014034975 A1 WO 2014034975A1 KR 2012006867 W KR2012006867 W KR 2012006867W WO 2014034975 A1 WO2014034975 A1 WO 2014034975A1
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WO
WIPO (PCT)
Prior art keywords
source
flow
organic light
emitting diode
deposition apparatus
Prior art date
Application number
PCT/KR2012/006867
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English (en)
Korean (ko)
Inventor
유운선
남궁성태
이태성
고재억
Original Assignee
에스엔유 프리시젼 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 에스엔유 프리시젼 주식회사 filed Critical 에스엔유 프리시젼 주식회사
Priority to CN201280074524.4A priority Critical patent/CN104603968B/zh
Publication of WO2014034975A1 publication Critical patent/WO2014034975A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • the present invention relates to a deposition apparatus for an organic light emitting diode encapsulation process, and more particularly, to a deposition apparatus for an organic light emitting diode encapsulation process capable of depositing a source in a uniform thickness on a large area substrate.
  • An organic light emitting diode is a light emitting diode in which a light emitting layer is formed of a thin organic compound.
  • the organic light emitting diode (OLED) uses an electroluminescence phenomenon that generates light by passing a current through a fluorescent organic compound.
  • Such organic light emitting diodes generally implement main colors in three colors (Red, Green, Blue) independent pixel method, bioconversion method (CCM), and Curly filter method, and the amount of organic materials included in the light emitting material used Therefore, it is divided into low molecular organic light emitting diode and high molecular organic light emitting diode.
  • the driving method may be classified into a passive driving method and an active driving method.
  • Such an organic light emitting diode has characteristics such as high efficiency, low voltage driving, and simple driving by self-emission, and has an advantage of expressing a high quality video.
  • applications for flexible displays and organic electronic devices using flexible properties of organic materials are also expected.
  • the organic light emitting diode is manufactured by stacking an organic compound, which is a light emitting layer, on a substrate in the form of a thin film.
  • organic compounds used in organic light emitting diodes are very sensitive to impurities, oxygen, and moisture, and thus have a problem in that their properties are easily deteriorated by external exposure or moisture and oxygen penetration. Such deterioration of organic matters affects the luminescence properties of the organic light emitting diode and shortens its lifespan.
  • a thin film encapsulation is required to prevent oxygen, moisture, and the like from flowing into the organic light emitting layer.
  • the deposition apparatus for thin film encapsulation processes has also been changed to be suitable for depositing large area substrates.
  • the length of the portion where the source is injected that is, the nozzle portion, is also lengthened.
  • FIG. 1 illustrates an example of a deposition apparatus 20 for a conventional encapsulation process.
  • the length of the nozzle portion 21 is increased in order to deposit the large-area substrate 10, and flows in the nozzle portion 21.
  • the pressure drop of the source is generated, there is a problem that the uniformity of the source deposition is degraded by this pressure drop.
  • Figure 2 shows another example of a conventional deposition process deposition apparatus 30.
  • a pair of short nozzle portions 31 are adjacently coupled to each other, and each nozzle portion 31 ends Deposition apparatus 30 for separately supplying a source through was developed.
  • a source is supplied from each supply part 33 to the flow part 31 in a chamber, and in order to mount the nozzle part 32 which is a path
  • Separate fastening space for mounting and fastening the part 32 is required, and because of the fastening space, neighboring nozzle parts 32 are disposed to be spaced apart from each other, so that the source is not sprayed at the interface between the nozzle parts 32. There is a difficulty that the source is not evenly deposited on the substrate 10.
  • an object of the present invention is to solve such a conventional problem, by solving the problem of non-uniform deposition due to pressure drop by receiving the source in the divided injection furnace, it is possible to uniformly deposit the source on a large area substrate
  • the present invention provides a deposition apparatus for an organic light emitting diode encapsulation process.
  • the object is, according to the present invention, in the encapsulation process deposition apparatus for depositing (encapsulating) the source on the organic light emitting diode substrate disposed in the chamber portion, disposed in the chamber portion, for the source to flow therein
  • a plurality of flow portions in which a flow path is formed and the cross sections are in contact with each other;
  • a nozzle unit which is integrally mounted to the plurality of flow units and has an injection passage connected therein to inject the source supplied from the flow unit to the substrate; It is achieved by the deposition apparatus for an organic light emitting diode encapsulation process comprising a; a plurality of source supply for supplying each of the vaporized source to the plurality of flow.
  • a plurality of injection paths may be formed in the nozzle part to be connected to each flow part in the flow part.
  • the surface cut along the longitudinal direction of the injection path may be formed longer than the end of the source side is injected side end of the source is introduced.
  • the surface cut along the longitudinal direction of the injection path may be formed longer and longer toward the end of the source is injected from the end side of the source is introduced.
  • the nozzle part may include a taper part disposed above the contact boundary surface of the plurality of flow parts and having a triangular cross section, and one surface of the taper part constitutes one of the injection paths, and the other surface of the taper part is another one.
  • a pair of injection paths around the tapered portion may be provided adjacent to each other.
  • a deposition apparatus for an organic light emitting diode encapsulation process capable of encapsulating and depositing a source with a uniform thickness on a large area organic light emitting diode substrate is provided.
  • the nozzle unit is mounted on the flow unit without a separate fastening member, it is not necessary to form a space in which the fastening member is fastened on the nozzle unit or the flow unit, so that the source can be sprayed from the front of the nozzle unit, and neighboring nozzle units mutually The source can then be sprayed without interruption.
  • Figure 2 shows another example of a deposition apparatus for a conventional encapsulation process
  • Figure 3 shows a deposition apparatus for an organic light emitting diode encapsulation process according to an embodiment of the present invention
  • FIG. 4 is an exploded perspective view of a flow part, a mounting part, and a nozzle part of the deposition apparatus for organic light emitting diode encapsulation process of FIG. 3;
  • FIG. 5 is a cross-sectional view illustrating an operation of the deposition apparatus for organic light emitting diode encapsulation process of FIG. 3.
  • FIG. 3 is a view illustrating a deposition apparatus for an organic light emitting diode encapsulation process according to an embodiment of the present invention
  • FIG. 4 is an exploded perspective view of a flow part, a mounting portion, and a nozzle portion of the deposition apparatus for an organic light emitting diode encapsulation process of FIG. 3.
  • the deposition apparatus 100 for an organic light emitting diode encapsulation process includes a chamber part 110, a flow part 120, a heating part (not shown), a mounting part 130, and a nozzle part 140. ) And the source supply unit 150.
  • the chamber part 110 is a member for accommodating the substrate 10 therein in order to deposit the substrate 10 by a source injected from the nozzle part 140 which will be described later.
  • the chamber unit 110 is configured to control internal pressure, and a fixing unit 111 is provided therein for adsorbing and fixing the substrate 10 during the deposition process.
  • the fixing part 111 is preferably connected to a drive stage (not shown) for the transfer of the substrate 10 in order to proceed quickly.
  • the chamber 110 is provided with a predetermined vacuum pump (not shown) to generate a pressure difference with the outside and allow the vaporized source gas to fly from the nozzle unit 140 to the upper substrate 10. (110) It is desirable to make the interior into a vacuum state.
  • a plurality of the flow unit 120 is installed inside the chamber unit 110 and is provided to face the substrate 10 below the substrate 10 so as to spray the source upward.
  • the flow part 120 has a flow path 121 through which a source can move, and a through part 122 is formed to mount the nozzle part 140 described later on the substrate 10 side.
  • the pair of flow units 120 are disposed to be adjacent to each other, and the adjacent surfaces are coupled to be in contact with each other. Accordingly, a plurality of flow paths 121 formed in the flow part 120 are also provided, and the neighboring flow paths 121 are intermittently disposed based on the boundary surface between the flow parts 120.
  • the heating part (not shown) is a member that heats the flow part 120 to prevent the source, which is vaporized from the outside, from being liquefied in the flow part 120.
  • the mounting unit 130 is provided with a pair, the supply path 131 which is a path for receiving the source from the flow path 121 to provide to the injection path 141 of the nozzle unit 140 to be described later is formed to pass through.
  • the pair of mounting portions 130 are attached to the lower surface of the nozzle unit 140 in the longitudinal direction and accommodated in each through portion 122 so as to be mounted on the flow portion 120.
  • the nozzle unit 140 is integrally formed, and a pair of injection passages 141 are formed to penetrate the source supplied from the flow unit 120 to the outside, and each injection passage 141 is equipped with a mounting portion ( It is connected to the supply passage 131 of 130 is configured to receive a source from the flow unit 120.
  • the lower surface of the nozzle unit 140 surrounds each of the injection paths 141 and the mounting unit 130 is attached, and the mounting unit 130 is accommodated in the penetrating unit 122 so that the nozzle unit 140 is the flow unit 120. It can be mounted on.
  • each injection path 141 is configured such that the length of the side in contact with the mounting portion 130 is shorter than the length of the longitudinal section of the side on which the source is injected, the contact with the mounting portion 130 As the source is sprayed from the surface to the surface from which it is injected, it becomes longer and has a tapered shape.
  • a tapered portion 142 having a triangular cross section is formed at the center of the nozzle portion 140, and the nozzle portion 140 may be positioned on the boundary surface of the flow portion 120. Is fitted.
  • the tapered portion 142 constitutes one surface of one of the flow paths 121 described above, and the other surface of the tapered portion 142 constitutes one surface of the other flow path 121, thereby providing a pair of pairs.
  • Flow path 121 is provided symmetrically on both sides of the tapered portion 142.
  • the upper surface of the flow path 121 is configured to be connected to each other without being spaced apart on the same plane. That is, the ends of the respective injection paths 141 are configured to be connected to each other so as not to lose the continuity of the source injection in the longitudinal direction from the surface from which the source is discharged.
  • the nozzle unit 140 is mounted to the flow unit 120 in such a way that the mounting unit 130 extending downward is completely accommodated in the through portion 122 area of the flow unit 120, and thus receives a load downward.
  • the nozzle unit 140 may be easily mounted to the flow unit 120 without a separate fastening member only by the simple coupling between the through part 122 and the mounting part 130.
  • the injection path of the nozzle part 140 that receives the source from different source supply parts 150 adjacent to each other. 141 can be continuously connected to each other.
  • the nozzle unit 140 is preferably formed integrally by processing such that the tapered portion 142 is formed in the center portion and the pair of injection passages 141 penetrate the tapered portion 142. .
  • the source supply unit 150 is provided with a pair to vaporize the source of the liquid of the chamber unit 110 into the flow path 121 of the flow unit 120, the storage unit 151 and the vaporization unit 152 ).
  • the storage unit 511 is a member for storing before supplying a monomer solution used as a source in this embodiment.
  • the vaporization unit 152 is connected to the storage unit 151 by applying ultrasonic waves to atomize the monomer in the form of a solution flowing from the storage unit 151, and then heated to vaporize the monomer in the particulate state flow section 120 It is a member for supplying.
  • FIG. 5 is a cross-sectional view illustrating an operation of the deposition apparatus 100 for the organic light emitting diode encapsulation process of FIG. 3.
  • the vaporized source is prevented from being liquefied by heating the flow part 120 using a predetermined heating part before the vaporized source is supplied to the flow part 120 in the chamber part 110.
  • the source is supplied to the vaporization unit 152 from a storage unit 151 in which a monomer used as a source is stored in a solution form. At this time, the ultrasonic wave is applied to the vaporization unit 152 to atomize the source solution.
  • the source atomized in the vaporization unit 152 by increasing the temperature of the vaporization unit 152 is vaporized by causing a phase change to a gas state by the temperature in the heated vaporization unit 152.
  • the monomer sources vaporized in the pair of vaporizers 152 due to the pressure difference between the chamber 110 and the vaporizer 152 in a vacuum state are flow paths 121 in the fluidizer 120. Is transferred to). At this time, the source flows along the flow path 121 to be delivered to the supply path in the mounting unit 130, and passes through the supply path of the mounting unit 130 is transferred to the injection path (141).
  • the gas source provided from the flow part 120 is injected away from the injection path 141 at the end of the injection path 141, and is deposited on the upper substrate 10.
  • the fixing part 111 fixing the substrate by a predetermined driving stage moves at a constant speed
  • the substrate 10 moves by a source sprayed from the nozzle part 140 fixed at a predetermined position.
  • the source is deposited in front of the.
  • the surface of the injection path 141 is sprayed source is continuously connected to the adjacent injection path 141 without intermittent section, so that the source is not interrupted along the longitudinal direction of the injection path 141 Can be sprayed continuously.
  • the taper portion 142 is provided between the pair of injection passages 141, and the source is discharged to the contact surface of the tip portion of the taper portion 142 of the injection passage 141, thereby depositing on the substrate 10.
  • the uniformity of the source can be secured.
  • the conventional encapsulation deposition apparatus it is difficult to deposit a large-area substrate due to the pressure drop in the nozzle.
  • the portions from which the source is discharged are separated from each other.
  • the organic light emitting diode encapsulation process deposition apparatus 100 of the present embodiment it is possible to deposit a large area substrate with a uniform thickness without intermittent section.
  • the effect of using a plurality of nozzles may be realized through an easy processing method of forming a plurality of injection paths in an integrated nozzle unit, rather than combining the nozzle units separately manufactured, and may be more firmly manufactured.
  • a deposition barrier for an organic light emitting diode encapsulation process that solves the problem of uneven deposition due to pressure drop and uniformly deposits a source on a large area substrate is provided.

Abstract

La présente invention concerne un appareil de dépôt destiné à un processus d'encapsulation de diode électroluminescente organique. L'appareil de dépôt destiné à un processus d'encapsulation de diode électroluminescente organique selon la présente invention encapsule la diode électroluminescente organique en déposant un matériau source sur le substrat de diode électroluminescente organique agencé dans une unité de chambre, et comprend : une pluralité d'unités de circulation qui sont agencées dans l'unité de chambre, et qui ont un canal de circulation destiné à la circulation du matériau source, les extrémités des unités de circulation étant en contact les unes avec les autres ; une unité de buse qui est agencée d'un seul tenant avec la pluralité d'unités de circulation, et qui comprend un canal de pulvérisation qui est connecté au canal de circulation de façon à pulvériser le matériau de source alimenté à partir des unités de circulation sur le substrat ; et une unité d'alimentation en matériau source servant à envoyer un matériau source à déposer aux unités de circulation respectives. Ainsi, il est possible de réaliser un appareil de dépôt destiné à un processus d'encapsulation de diode électroluminescente organique qui est capable de déposer sans intermittence des matériaux source sur un grand substrat avec une épaisseur uniforme.
PCT/KR2012/006867 2012-08-27 2012-08-28 Appareil de dépôt destiné à un processus d'encapsulation de diode électroluminescente organique WO2014034975A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280074524.4A CN104603968B (zh) 2012-08-27 2012-08-28 有机发光二极管封装工艺用沉积装置

Applications Claiming Priority (2)

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KR1020120093514A KR101325864B1 (ko) 2012-08-27 2012-08-27 유기발광다이오드 봉지공정용 증착장치
KR10-2012-0093514 2012-08-27

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WO2014034975A1 true WO2014034975A1 (fr) 2014-03-06

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KR (1) KR101325864B1 (fr)
CN (1) CN104603968B (fr)
TW (1) TWI479715B (fr)
WO (1) WO2014034975A1 (fr)

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KR20090073360A (ko) * 2007-12-31 2009-07-03 주성엔지니어링(주) 가스 분사 유닛 및 이를 구비하는 박막 증착 장치
JP2009252400A (ja) * 2008-04-02 2009-10-29 Fujikura Ltd 有機デバイス及びその製造方法
KR20100063292A (ko) * 2008-12-03 2010-06-11 엘지디스플레이 주식회사 상부 발광방식 유기전계발광소자 및 이의 제조방법
JP2011065947A (ja) * 2009-09-18 2011-03-31 Toshiba Mobile Display Co Ltd 有機ｅｌ装置

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US7517551B2 (en) * 2000-05-12 2009-04-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light-emitting device
JP2006010617A (ja) * 2004-06-29 2006-01-12 Konica Minolta Medical & Graphic Inc 放射線変換パネルの製造方法とその製造装置
JP2007332458A (ja) * 2006-05-18 2007-12-27 Sony Corp 蒸着装置および蒸着源ならびに表示装置の製造方法
KR101128745B1 (ko) * 2007-09-10 2012-03-27 가부시키가이샤 알박 증기 방출 장치, 유기 박막 증착 장치 및 유기 박막 증착 방법
KR101182265B1 (ko) * 2009-12-22 2012-09-12 삼성디스플레이 주식회사 증발원 및 이를 포함하는 증착 장치
JP5400749B2 (ja) * 2010-12-01 2014-01-29 株式会社日立ハイテクノロジーズ 蒸着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090073360A (ko) * 2007-12-31 2009-07-03 주성엔지니어링(주) 가스 분사 유닛 및 이를 구비하는 박막 증착 장치
JP2009252400A (ja) * 2008-04-02 2009-10-29 Fujikura Ltd 有機デバイス及びその製造方法
KR20100063292A (ko) * 2008-12-03 2010-06-11 엘지디스플레이 주식회사 상부 발광방식 유기전계발광소자 및 이의 제조방법
JP2011065947A (ja) * 2009-09-18 2011-03-31 Toshiba Mobile Display Co Ltd 有機ｅｌ装置

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TWI479715B (zh) 2015-04-01
TW201409796A (zh) 2014-03-01
CN104603968A (zh) 2015-05-06
KR101325864B1 (ko) 2013-11-05
CN104603968B (zh) 2016-08-24

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