WO2014015632A1 - 封框胶固化装置及真空对合设备 - Google Patents

封框胶固化装置及真空对合设备 Download PDF

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Publication number
WO2014015632A1
WO2014015632A1 PCT/CN2012/087182 CN2012087182W WO2014015632A1 WO 2014015632 A1 WO2014015632 A1 WO 2014015632A1 CN 2012087182 W CN2012087182 W CN 2012087182W WO 2014015632 A1 WO2014015632 A1 WO 2014015632A1
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Prior art keywords
emitting diode
diode chip
ultraviolet light
light emitting
curing
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English (en)
French (fr)
Inventor
井杨坤
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells

Definitions

  • Embodiments of the present invention relate to a frame sealant curing device and a vacuum bonding device. Background technique
  • the specific steps of the liquid crystal panel forming process are as follows: First, the sealant is coated on the periphery of one substrate by using a sealant coating device; then, the drop injection method is used in the center of the other substrate (ODF, One Drop) Fill) Add liquid crystal; After that, vacuum-bond the two substrates to perform the process of the box; finally, cure the sealant: partially cure the sealant by using ultraviolet light (UV, Ultraviolet Rays) for a short time. The photosensitive component in the sealant is further cured in the UV curing chamber, and finally the uncured sealant is completely cured in a high temperature furnace to complete the box forming process.
  • ODF One Drop
  • Add liquid crystal Add liquid crystal
  • UV ultraviolet light
  • the ultraviolet (UV) light source used in the ultraviolet curing machine for curing the sealant in the above process is an ultrahigh pressure mercury lamp.
  • ultrahigh pressure mercury lamp With the widespread use in the LCD manufacturing industry, conventional UV curing machines using ultra-high pressure mercury lamps as light sources expose the following disadvantages:
  • the traditional UV mercury lamp adopts high-voltage drive, high power consumption, electric power is more than tens of kilowatts, and it needs to be preheated after starting up, and the service life is not long. Generally, the lamp should be replaced after working for about 1000 hours;
  • the traditional UV mercury lamp has a large wavelength range of light emission, which will generate more useless visible light and infrared light, and the absorption wavelength of the photoreactive agent in the sealant is in the range of 300 nm to 400 nm, as shown in Fig. 1, therefore,
  • the curing efficiency of the ultraviolet curing frame sealant emitted by the mercury lamp is low, and the luminous intensity of the two ends of the UV mercury lamp is generally smaller than that of the intermediate portion, so that the UV mercury lamp cannot uniformly emit light, which also affects the curing of the frame sealant.
  • the useless visible light and infrared light emitted by the traditional UV mercury lamp will release a large amount of heat.
  • the UV mercury lamp requires a cooling device.
  • the volume of the cooling device is larger than the light source itself, which increases the cost of curing the sealant.
  • the performance of the cooling device will also It affects the quality of the light source, which affects the curing effect of the sealant.
  • the embodiment of the invention provides a frame sealant curing device and a vacuum matching device for improving the curing efficiency and curing effect of the sealant.
  • An aspect of the present invention provides a frame sealant curing apparatus comprising a package substrate and a UV light emitting diode (UV LED) chip disposed on one surface of the package substrate;
  • UV LED UV light emitting diode
  • the wavelength range of the ultraviolet light-emitting diode chip is consistent with the absorption wavelength range of the photoreactive agent in the sealant.
  • Another aspect of the present invention provides a vacuum bonding apparatus comprising the sealant curing apparatus provided by the embodiment of the present invention.
  • the frame sealing glue curing device and the vacuum matching device use the ultraviolet light emitting diode chip as the light emitting source, and the light emitting light of the ultraviolet light emitting diode chip is consistent with the absorption wavelength of the photoreactive agent in the sealing frame glue.
  • the ultraviolet light emitting diode chip is a semiconductor light emitting device, it has small volume, low power consumption, long life, less heat release, no need for a cooling device, and light speaking.
  • the concentrated characteristics therefore, the use of ultraviolet light-emitting diode chips as a light source to cure the sealant, can improve the curing efficiency and curing effect of the sealant.
  • Figure 1 is an absorption light transmission diagram of a photoreactive agent in a sealant
  • FIG. 2 is a schematic view of a frame sealant curing device according to an embodiment of the present invention.
  • FIG. 3 is a schematic view of a frame sealant curing device according to an embodiment of the present invention.
  • FIG. 4 is a schematic view of a frame sealant curing device according to another embodiment of the present invention.
  • FIG. 5 is a schematic view of a frame sealant curing device according to still another embodiment of the present invention.
  • Fig. 6 is a schematic view showing a light intensity control system used in the frame sealant curing device of the embodiment of the present invention.
  • the frame sealant curing device provided by the embodiment of the present invention, as shown in FIG. 2, includes a package substrate 1 and an ultraviolet light emitting diode chip 2 disposed on one surface of the package substrate 1.
  • the wavelength range of the ultraviolet light-emitting diode chip 2 is consistent with the absorption wavelength of the photoreactive agent in the sealant.
  • the frame sealant curing device uses an ultraviolet light-emitting diode chip as a light-emitting source
  • the light-emitting spectrum of the ultraviolet light-emitting diode chip is consistent with the absorption wavelength of the photoreagent in the sealant, compared with the existing UV 7J silver lamp.
  • the ultraviolet light emitting diode chip is a semiconductor light emitting device, it has the characteristics of small volume, low power consumption, long life, less heat release, no need for a cooling device, and light transmission. Therefore, ultraviolet rays are used.
  • the light-emitting diode chip is used as a light source to cure the sealant, which can improve the curing efficiency and curing effect of the sealant.
  • the frame sealant curing device can use an ultraviolet light emitting diode chip with an emission wavelength ranging from 300 nm to 400 nm as a light source to reduce light of other wavelength bands not absorbed by the photoreactive agent, thereby improving Curing efficiency, reducing costs.
  • its luminescence peak can be set at around 365 nm.
  • the frame sealant curing device When used for curing, the frame sealant curing device can be prepared into various sizes according to the size of the liquid crystal panel, and the ultraviolet light emitting diode chip as a light source can be disposed in the frame sealant curing device, and a plurality of ultraviolet light can be disposed.
  • the LED chips are distributed on the package substrate.
  • the package substrate 1 is elongated, and the plurality of ultraviolet light-emitting diode chips 2 can be arranged in a strip shape on the package substrate, as shown in FIG. 3; in another embodiment, the package substrate 1 is In the form of a rectangular plate, a plurality of ultraviolet light-emitting diode chips 2 can be arranged in a matrix on the package substrate, as shown in FIG.
  • the ultraviolet light-emitting diode chip 2 when the package substrate 1 is in the shape of a rectangular plate, the ultraviolet light-emitting diode chip 2 can also be formed into a whole large-plate LED plate, as shown in FIG.
  • the number, shape, and the like of the ultraviolet light emitting diode chips are not limited to the numbers and shapes shown above.
  • the setting may further include: a light intensity control system, wherein the light intensity control system is connected to each of the ultraviolet light emitting diode chips, and is configured to control the operating current of the ultraviolet light emitting diode chip to control the luminous intensity thereof within a set light intensity range .
  • the operating current of the ultraviolet light emitting diode chip can be controlled in two ways:
  • PWM pulse width modulation
  • the light intensity control system may include a light intensity sensor 3 corresponding to the ultraviolet light emitting diode chip 2, and a control for electrically connecting the light intensity sensor 3 and the ultraviolet light emitting diode chip 2.
  • the controller 4 is configured to control the operating current of the ultraviolet light emitting diode chip 2 according to the light intensity sensed by the light intensity sensor 3.
  • the frame sealant curing device can use a high-power ultraviolet light-emitting diode chip. Therefore, in order to increase the heat dissipation of the overall frame seal curing device, the package substrate can be a hard metal-based package substrate having high heat dissipation.
  • the hard metal-based package substrate is a new-generation high-power LED package substrate that uses a conventional resin substrate or a ceramic substrate to impart high thermal conductivity, processability, electromagnetic shielding, and thermal shock resistance.
  • the high-power LED package substrate is obtained by adhering a copper foil to the surface of a metal substrate using an epoxy resin-based adhesive, and changing the combination of the metal substrate and the insulating layer material to form an LED package substrate for various purposes.
  • High heat dissipation is an essential feature of a substrate for high-power LED packaging. Therefore, materials such as aluminum and copper are used as the metal-based LED package substrate, and a high thermal conductivity inorganic filler (Filler) epoxy resin is often used as the insulating layer.
  • Fill filler
  • the use of a hard metal-based package substrate as a package substrate for the frame seal curing device can greatly reduce the temperature of the ultraviolet light-emitting diode chip and prolong its service life.
  • the frame sealant curing device may further be provided with a heat dissipating component having a heat dissipation function, the The thermal component can be located on the side of the package substrate that faces away from the UV light emitting diode chip.
  • the heat dissipating component may be one or a combination of the following: a fan group, a copper tube or a heat dissipating film, that is, a fan group may be added on the back surface of the package substrate encapsulating the ultraviolet light emitting diode chip, and an accelerated heat conduction is added on the package substrate. Copper tube, or a heat-dissipating film on the package substrate to accelerate heat dissipation.
  • the frame sealant curing device may further comprise a quartz cover disposed outside the ultraviolet light emitting diode chip, and the quartz cover protects the ultraviolet light emitting diode chip from external factors to ensure the stability of the operation of the ultraviolet light emitting diode chip. .
  • the quartz cover may be in the shape of a circular arc surface, and the inner surface of the quartz cover may be plated with a light reflection layer, specifically, silver plating or other reflective material may be used, or an angle-adjustable reflector may be added inside the quartz cover and
  • the light guide plate is used to change the path of illumination of each ultraviolet light emitting diode chip, thereby achieving the purpose of controlling the size of the spot of the frame sealant curing device and the uniformity of the light beam.
  • the embodiment of the present invention further provides a vacuum bonding apparatus, which comprises the frame sealant curing device provided by the embodiment of the invention.
  • the frame sealing glue curing device is applied to the vacuum matching machine, and the production process of the traditional vacuum matching machine ⁇ frame sealing glue curing machine ⁇ high temperature curing machine can be simplified into: curing with frame sealing glue
  • the function of the vacuum matching equipment high temperature curing machine which also facilitates the simplification of the production line and reduces the production cost.
  • the vacuum matching process and the frame sealing glue curing process can greatly reduce the possibility of the liquid crystal and the frame sealant contamination caused by the sealing of the sealant before the uncured film, thereby reducing the breakage and bubbles of the sealant.
  • the possibility of such undesirable phenomena improves the curing quality of the sealant.
  • the frame sealing glue curing device and the vacuum matching device use the ultraviolet light emitting diode chip as the light emitting source, and the light emitting light of the ultraviolet light emitting diode chip and the absorption wavelength of the photoreactive agent in the sealing frame glue Consistently, compared with the existing frame sealant curing machine using UV 7j silver lamp as the light source, since the ultraviolet light emitting diode chip is a semiconductor light emitting device, it has small volume, low power consumption, long life, less heat release, and no cooling. The device has the characteristics of concentrated spectrum. Therefore, the ultraviolet light-emitting diode chip is used as a light source to cure the sealant, which can improve the curing efficiency and curing effect of the sealant.
  • the above is only the exemplary embodiments of the present invention, and is not intended to limit the scope of the invention. The scope of the invention is determined by the appended claims.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

一种封框胶固化装置及真空对合设备，该封框胶固化装置包括封装基板（1）和设置在所述封装基板（1）的一个面上的紫外光发光二极管芯片（2），所述紫外光发光二极管芯片（2）发光波长范围与封框胶中光反应剂的吸收波长范围一致。通过使用紫外光发光二极管芯片（2）作为光源对封框胶进行固化，能够提高封框胶的固化效率和固化效果。

Description

封框胶固化装置及真空对合设备 技术领域
本发明实施例涉及一种封框胶固化装置及真空对合设备。 背景技术
目前， 液晶屏成盒工艺的具体步骤为： 首先， 在一张基板的四周使用封 框胶涂布装置涂覆封框胶； 然后， 在另一张基板中央使用滴下注入法（ ODF , One Drop Fill ) 滴加液晶； 之后， 真空贴合两张基板， 即进行对盒工艺； 最 后， 进行封框胶固化： 通过使用紫外光（UV, Ultraviolet Rays )短时间照射 使封框胶部分固化， 放入到 UV固化室中进一步固化封框胶中的光敏成分， 最后在高温炉中将未固化的封框胶完全固化， 从而完成成盒工艺。
目前， 上述过程中用于封框胶固化的紫外线固化机使用的紫外（UV )光 源为超高压水银灯。 随着在 LCD 制造业中的广泛应用， 传统的使用超高压 水银灯作为光源的紫外线固化机暴露出以下缺点：
1、 传统 UV水银灯采取高压驱动， 耗电量高， 电功率多为几十千瓦， 并 且开机后需要预热， 寿命也不长， 一般在工作 1000小时左右就要更换灯管；
2、传统 UV水银灯发光波长范围大，会产生较多的无用的可见光和红外 光，而封框胶中光反应剂的吸收波长范围在 300nm-400nm之间，如图 1所示， 因此， 使用水银灯发出的紫外光固化封框胶的固化效率较低， 并且， UV 水 银灯的两端发光光强一般小于中间部位的发光光强， 使得 UV水银灯不能均 匀发光， 这也影响了封框胶的固化效果；
3、 传统的 UV水银灯发出的无用的可见光和红外光会放出热量大， UV 水银灯需要冷却装置， 冷却装置体积大于光源本身， 这会增加封框胶固化的 成本， 此外， 冷却设备的性能也会影响到光源发光的质量， 从而影响到封框 胶的固化效果。
因此， 综上所述， 现有的使用 UV 7J银灯作为光源的封框胶固化机对封 框胶的固化效率低， 且固化效果不好。 发明内容
本发明实施例提供了一种封框胶固化装置及真空对合设备， 用以提高封 框胶的固化效率和固化效果。
本发明一方面提供了一种封框胶固化装置包括封装基板和设置在所述封 装基板的一个面上的紫外光发光二极管 (UV LED)芯片；
所述紫外光发光二极管芯片发光波长范围与封框胶中光反应剂的吸收波 长范围一致。
本发明另一方面提供了一种真空对合设备， 包括本发明实施例提供的封 框胶固化装置。
本发明实施例提供的封框胶固化装置及真空对合设备， 使用紫外光发光 二极管芯片作为发光光源， 该紫外光发光二极管芯片的发光光讲与封框胶中 光反应剂的吸收波长一致， 相对于现有的使用 UV水银灯作为光源的封框胶 固化机， 由于紫外光发光二极管芯片是半导体发光器件， 具有体积小、 耗电 量少、 寿命长、 放热少、 无需冷却装置且光讲集中的特点， 因此使用紫外光 发光二极管芯片作为光源对封框胶进行固化， 能够提高封框胶的固化效率和 固化效果。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 简单地介绍 ,显而易见地， 下面描述中的附图仅仅涉及本发明的一些实施例 , 而非对本发明的限制。
图 1为封框胶中光反应剂的吸收光傳图；
图 2为本发明实施例提供的封框胶固化装置的示意图；
图 3为根据本发明的一个实施例的封框胶固化装置的示意图；
图 4为根据本发明另一个实施例的封框胶固化装置的示意图；
图 5为根据本发明再一个实施例的封框胶固化装置的示意图；
图 6 为用于本发明实施例的封框胶固化装置中的光强控制系统的示意 图。 具体实施方式 为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图， 对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供的封框胶固化装置， 如图 2所示， 包括封装基板 1和 设置在封装基板 1的一个面上的紫外光发光二极管芯片 2。
该紫外光发光二极管芯片 2发光波长范围与封框胶中光反应剂的吸收波 长一致。
由于上述封框胶固化装置， 使用紫外光发光二极管芯片作为发光光源， 该紫外光发光二极管芯片的发光光谱与封框胶中光反应剂的吸收波长一致， 相对于现有的使用 UV 7J银灯作为光源的封框胶固化机， 由于紫外光发光二 极管芯片是半导体发光器件， 具有体积小、 耗电量少、 寿命长、 放热少、 无 需冷却装置且光傳集中的特点， 因此， 使用紫外光发光二极管芯片作为光源 对封框胶进行固化， 能够提高封框胶的固化效率和固化效果。
从图 1可以看出， 目前封框胶中光反应剂的吸收光谱在 300nm-400nm之 间。 因此， 在具体实施时， 本发明实施例提供的封框胶固化装置可以采用发 光波长范围在 300nm-400nm的紫外光发光二极管芯片作为光源，减少不被光 反应剂吸收的其它波段的光， 提高固化效率， 降低成本。 例如， 其发光峰值 可以设置在 365nm左右。
在用于固化时， 封框胶固化装置可以根据液晶面板的大小， 制备成各种 尺寸， 而在封框胶固化装置中作为光源的紫外光发光二极管芯片可以设置多 个， 且多个紫外光发光二极管芯片在封装基板上分布均勾。 例如： 在一个实 施例中， 封装基板 1为长条状， 多个紫外光发光二极管芯片 2可以在封装基 板上成长条状排列， 如图 3所示； 在另一个实施例中， 封装基板 1为长方形 板状， 多个紫外光发光二极管芯片 2可以在封装基板上成矩阵状排列， 如图 4所示。 在另一个实施例中， 封装基板 1为长方形板状时， 还可以将紫外光 发光二极管芯片 2制作成一整张大板状的 LED板，如图 5所示。 紫外光发光 二极管芯片的个数和形状等不限于以上所示出的个数和形状。
进一步地， 为了稳定紫外光发光二极管芯片的发光光强， 封框胶固化装 置还可以包括： 光强控制系统， 该光强控制系统与每个紫外光发光二极管芯 片连接， 用于通过控制紫外光发光二极管芯片工作电流， 将其发光强度控制 在设定的光强范围内。
例如， 可以通过下述两种方式控制紫外光发光二极管芯片的工作电流大
( 1 )使用设置电阻： 可以通过在紫外光发光二极管芯片的驱动控制 IC 引脚 RSET两端并联不同的转换电阻， 使用一个直流电压设置紫外光发光二 极管芯片驱动 IC引脚: RSET的电流，从而改变紫外光发光二极管芯片的正向 工作电流， 达到调节 紫外光发光二极管芯片发光亮度的效果。
( 2 ) 采用脉冲宽度调制 （ PWM )技术： 以脉宽调制的方法改变紫外光 发光二极管芯片的驱动电流的脉冲占空比， 紫外光发光二极管芯片在 PWM 的调光控制下， 其发光亮度正比于 PWM的脉沖占空比， 采用 PWM技术对 紫外光发光二极管芯片进行调控其调光比范围可达到 3000: 1。
例如， 该光强控制系统， 如图 6所示， 可以包括与紫外光发光二极管芯 片 2对应设置的光强感应器 3、和与光强感应器 3和紫外光发光二极管芯片 2 电连接的控制器 4; 该控制器 4用于才艮据光强感应器 3感应到的光强， 控制 紫外光发光二极管芯片 2的工作电流。
例如， 封框胶固化装置可以使用大功率紫外光发光二极管芯片， 那么， 为了增加整体封框胶固化装置的散热性， 封装基板可以采用具有高散热性的 硬质金属系封装基板。
硬质金属系封装基板是利用传统树脂基板或是陶瓷基板， 赋予高热传导 性、加工性、电磁波遮蔽性、耐热冲击性等金属特性，构成新世代高功率 LED 封装基板。高功率 LED封装基板是利用环氧树脂系接著剂将铜箔黏贴在金属 基材的表面， 透过金属基材与绝缘层材质的组合变化， 制成各种用途的 LED 封装基板。 高散热性是高功率 LED封装用基板不可或缺的基本特性， 因此上 述金属系 LED封装基板使用铝与铜等材料，绝缘层大多使用高热传导性无机 填充物 (Filler)的环氧树脂。
因此， 采用硬质金属系封装基板作为封框胶固化装置的封装基板， 可以 大幅降低紫外光发光二极管芯片的温度， 延长其使用寿命。
进一步地， 封框胶固化装置还可以设置具有散热功能的散热部件， 该散 热部件可以位于封装基板背向紫外光发光二极管芯片的一面。
例如， 散热部件可以为下述之一或其组合： 风扇组、 铜管或散热膜， 即 可以在封装有紫外光发光二极管芯片的封装基板的背面增加风扇组， 在封装 基板上增加加速导热的铜管， 或在封装基板上贴覆散热膜加快散热。
例如,封框胶固化装置还可以包 ϋ置在紫外光发光二极管 芯片外部的 石英外罩， 该石英外罩可以保护紫外光发光二极管芯片不受外界因素影响， 以保证紫外光发光二极管芯片工作的稳定性。
例如， 该石英外罩的形状可以为圓弧面， 该石英外罩的内侧表面可以镀 有光反射层， 具体可以采用镀银或其它反射材料， 或者可以在石英外罩内部 增加可以调节角度的反光片和导光板， 以改变各紫外光发光二极管芯片发光 的路径 , 从而达到控制封框胶固化装置发光的光斑尺寸及光束的均一性等参 数的目的。
基于同一发明构思， 本发明实施例还提供了一种真空对合设备， 包括本 发明实施例提供的封框胶固化装置。
在液晶面板的生产线上， 将封框胶固化装置应用到真空对合机内， 可以 将传统的真空对合机→封框胶固化机→高温固化机的生产流程简化成： 具有 封框胶固化功能的真空对合设备 高温固化机， 这也有利于生产线简化， 降 低生产成本。
并且， 同时进行真空对合工艺与封框胶固化工艺， 能够大大降低封框胶 在未固化前和液晶接触造成液晶和封框胶污染的可能性， 从而降低了封框胶 出现断胶和气泡等不良现象的可能性， 提高了封框胶的固化质量。
当然， 本领域技术人员也可以想到将本发明实施例提供的封框胶固化装 置组合到其他设备中， 在此不再赘述。
本发明实施例提供的一种封框胶固化装置及真空对合设备， 使用紫外光 发光二极管芯片作为发光光源， 该紫外光发光二极管芯片的发光光讲与封框 胶中光反应剂的吸收波长一致， 相对于现有的使用 UV 7j银灯作为光源的封 框胶固化机， 由于紫外光发光二极管芯片是半导体发光器件， 具有体积小、 耗电量少、 寿命长、 放热少、 无需冷却装置且光谱集中的特点， 因此使用紫 外光发光二极管芯片作为光源对封框胶进行固化， 能够提高封框胶的固化效 率和固化效果。 以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、 一种封框胶固化装置， 包括封装基板和设置在所述封装基板的一个面 上的紫外光发光二极管芯片，
所述紫外光发光二极管芯片的发光波长范围与封框胶中光反应剂的吸收 波长范围一致。
2、如权利要求 1所述的装置， 其中， 所述封装基板的面上均匀分布地设 置有多个紫外光发光二极管芯片。
3、如权利要求 1或 2所述的装置， 其中， 所述紫外光发光二极管芯片发 光波长范围为 300-400nm。
4、 如权利要求 1-3中任一项所述的装置， 还包括： 与所述紫外光发光二 极管芯片连接的光强控制系统， 用于通过控制所述紫外光发光二极管芯片工 作电流， 将其发光强度控制在设定的光强范围内。
5、如权利要求 4所述的装置， 其中， 所述光强控制系统包括与所述紫外 光发光二极管芯片对应设置的光强感应器、 及与所述光强感应器和所述紫外 光发光二极管芯片电连接的控制器；
所述控制器用于根据所述光强感应器感应到的光强， 控制所述紫外光发 光二极管芯片的工作电流。
6、 如权利要求 1-5中任一项所述的装置， 还包括散热部件， 所述散热部 件位于所述封装基板背向所述紫外光发光二极管芯片的一面。
7、 如权利要求 6所述的装置， 其中， 所述散热部件为下述之一或组合： 风扇组、 铜管或散热膜。
8、如权利要求 1-7任一项所述的装置， 还包括设置在所述紫外光发光二 极管芯片外部的石英外罩。
9、 如权利要求 8所述的装置， 其中， 所述石英外罩的形状为圓弧面， 所 述石英外罩的内侧表面镀有光反射层。
10、 一种真空对合设备， 包括如权利要求 1-9任一项所述的封框胶固化 装置。
PCT/CN2012/087182 2012-07-27 2012-12-21 封框胶固化装置及真空对合设备 Ceased WO2014015632A1 (zh)

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