WO2014013876A1 - 高強度チタン銅箔及びその製造方法 - Google Patents

高強度チタン銅箔及びその製造方法 Download PDF

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Publication number
WO2014013876A1
WO2014013876A1 PCT/JP2013/068263 JP2013068263W WO2014013876A1 WO 2014013876 A1 WO2014013876 A1 WO 2014013876A1 JP 2013068263 W JP2013068263 W JP 2013068263W WO 2014013876 A1 WO2014013876 A1 WO 2014013876A1
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WIPO (PCT)
Prior art keywords
copper foil
rolling
titanium copper
cold rolling
less
Prior art date
Application number
PCT/JP2013/068263
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English (en)
French (fr)
Japanese (ja)
Inventor
真之 長野
健志 小池
Original Assignee
Jx日鉱日石金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Jx日鉱日石金属株式会社 filed Critical Jx日鉱日石金属株式会社
Priority to CN201380038387.3A priority Critical patent/CN104487600A/zh
Priority to KR1020157004286A priority patent/KR101704941B1/ko
Publication of WO2014013876A1 publication Critical patent/WO2014013876A1/ja

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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys

Definitions

  • the present invention relates to a Cu—Ti alloy foil having excellent strength suitable as a conductive spring material for an autofocus camera module or the like.
  • An electronic component called an autofocus camera module is used for the camera lens part of a mobile phone.
  • the autofocus function of a mobile phone camera moves the lens in a certain direction by the spring force of the material used in the autofocus camera module, while the lens is moved by the electromagnetic force generated by passing a current through a coil wound around it. Move in the direction opposite to the direction in which the spring force of the material works.
  • the camera lens is driven by such a mechanism and the autofocus function is exhibited (for example, Patent Documents 1 and 2).
  • the copper alloy foil used in the autofocus camera module needs to be strong enough to withstand material deformation caused by electromagnetic force. If the strength is low, the material cannot withstand displacement due to electromagnetic force, and permanent deformation (sagging) occurs. When the sag occurs, the lens cannot move to a desired position when a constant current is passed, and the autofocus function is not exhibited.
  • Cu-Ni-Sn based copper alloy foil having a 0.2% proof stress of 1100 MPa or more and a foil thickness of 0.1 mm or less has been used for the autofocus camera module.
  • demand for cost reduction has led to the use of titanium copper foil, which is relatively cheaper than Cu—Ni—Sn based copper alloys, and its demand is increasing.
  • Patent Document 3 adjusts the average crystal grain size by final recrystallization annealing, then cold rolling and aging treatment in order, Patent Document 4 after solution treatment, A method of sequentially performing cold rolling, aging treatment, and cold rolling.
  • Patent Document 5 after performing hot rolling and cold rolling, a solution treatment for holding at a temperature range of 750 to 1000 ° C. for 5 seconds to 5 minutes.
  • Patent Documents 3 to 6 some titanium copper having a 0.2% proof stress of 1100 MPa or more can be seen.
  • the foil thickness is as thin as 0.1 mm or less, the material is deformed by applying a load and then the load is removed. It turned out that it cannot be used as a conductive spring material.
  • the present inventors have found that as the 0.2% proof stress is higher and the surface roughness is smaller, the sag The amount was found to be smaller.
  • the present invention has been completed against the background of the above findings, and is specified by the following.
  • the ingot contains one or more of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of 0 to 1.0% by mass.
  • Manufacturing method of titanium copper foil (7)
  • a rolled copper product provided with the titanium copper foil according to any one of (1) to (4).
  • An electronic device component comprising the titanium copper foil according to any one of (1) to (4).
  • a lens a spring member that elastically biases the lens to an initial position in the optical axis direction, and an electromagnetic that can drive the lens in the optical axis direction by generating an electromagnetic force that resists the biasing force of the spring member
  • An autofocus camera module comprising drive means, wherein the spring member is the titanium copper foil according to any one of (1) to (4).
  • High strength Cu-Ti alloy foil suitable as a conductive spring material used for electronic equipment parts such as autofocus camera modules can be obtained.
  • FIG. 2 is an exploded perspective view of the autofocus camera module of FIG. 1. It is sectional drawing which shows operation
  • Ti concentration in the titanium copper foil according to the present invention is 1.5 to 5.0 mass%. Titanium copper increases strength and electrical conductivity by dissolving Ti in a Cu matrix by solution treatment and dispersing fine precipitates in the alloy by aging treatment. If the Ti concentration is less than 1.5% by mass, precipitation of precipitates is insufficient and desired strength cannot be obtained. If the Ti concentration exceeds 5.0% by mass, the workability deteriorates and the material is easily cracked during rolling. Considering the balance between strength and workability, the preferable Ti concentration is 2.9 to 3.5% by mass.
  • the 0.2% proof stress necessary for a titanium copper foil suitable as a conductive spring material for an autofocus camera module is 1100 MPa or more.
  • the rolling direction The 0.2% proof stress in the direction parallel to 1 can be 1100 MPa or more.
  • the 0.2% yield strength of the titanium copper foil according to the present invention is 1200 MPa or more in a preferred embodiment, and is 1300 MPa or more in a more preferred embodiment.
  • the upper limit value of 0.2% proof stress is not particularly restricted from the viewpoint of the intended strength of the present invention, but it takes time and money, so the 0.2% proof stress of the titanium copper foil according to the present invention is generally 2000 MPa. Below, typically below 1600 MPa.
  • the 0.2% proof stress in the direction parallel to the rolling direction of the titanium copper foil is measured in accordance with JIS Z2241 (metal material tensile test method).
  • the foil thickness of a conductive spring material used for an autofocus camera module or the like is 0.1 mm or less.
  • the stress is concentrated at the thinnest part of the material. If the surface roughness of the material is large, that is, if a portion where the foil thickness is thick and a portion where the material is thin are locally present, the stress is concentrated on the portion where the foil thickness is thin, and sag occurs.
  • the surface roughness of the material is small, even when a load is applied to the material, the stress is less likely to be concentrated at a specific location, so that sag is less likely to occur.
  • the arithmetic mean roughness (Ra) of the titanium copper foil according to the present invention is 0.1 ⁇ m or less, preferably 0.08 ⁇ m or less, and more preferably 0.06 ⁇ m or less.
  • the lower limit of the surface roughness is not particularly restricted from the viewpoint of the strength intended by the present invention.
  • the arithmetic average roughness (Ra) is 0.01 ⁇ m or more in a typical embodiment, and is more typical. In such an embodiment, it is 0.02 ⁇ m or more.
  • a roughness curve having a reference length of 300 ⁇ m is taken along a direction perpendicular to the rolling direction of the titanium copper foil, and the arithmetic average roughness (Ra) is measured based on the curve in accordance with JIS B 0601. To do.
  • the foil thickness is 0.1 mm or less, and in a typical embodiment, the foil thickness is 0.08 to 0.03 mm. In a more typical embodiment, the foil thickness is 0.05 to 0.03 mm.
  • the conditions for the hot rolling and the subsequent cold rolling 1 may be the conventional conditions used in the production of titanium copper, and there are no special requirements.
  • the solution treatment may be performed under conventional conditions, but may be performed, for example, at 700 to 1000 ° C. for 5 seconds to 30 minutes.
  • the rolling reduction of the cold rolling 2 is regulated to 55% or more. More preferably, it is 60% or more, More preferably, it is 65% or more. When the rolling reduction is less than 55%, it becomes difficult to obtain a 0.2% yield strength of 1100 MPa or more.
  • the upper limit of the rolling reduction is not particularly defined from the viewpoint of the strength intended by the present invention, but industrially does not exceed 99.8%.
  • the heating temperature for the aging treatment is 200 to 450 ° C., and the heating time is 2 to 20 hours.
  • the heating temperature is less than 200 ° C. or exceeds 450 ° C., it becomes difficult to obtain a 0.2% yield strength of 1100 MPa or more.
  • the heating time is less than 2 hours or exceeds 20 hours, it becomes difficult to obtain a 0.2% yield strength of 1100 MPa or more.
  • the rolling reduction of the cold rolling 3 is preferably regulated to 35% or more. More preferably, it is 40% or more, More preferably, it is 45% or more. When the rolling reduction is less than 35%, it becomes difficult to obtain a 0.2% yield strength of 1100 MPa or more.
  • the upper limit of the rolling reduction is not particularly defined from the viewpoint of the strength intended by the present invention, but industrially does not exceed 99.8%.
  • the arithmetic mean roughness (Ra) of the work roll is set to a roughness curve having a reference length of 400 ⁇ m with respect to the longitudinal direction, that is, the direction corresponding to the direction perpendicular to the rolling direction of the material. Collected and measured in accordance with JIS B 0601.
  • the arithmetic average roughness (Ra) of the work roll used for rolling is Generally, it is 0.13 ⁇ m or more. Therefore, as far as the present inventor is aware, the use of a low-roughness work roll as described above has not been conventionally performed.
  • the titanium copper foil according to the present invention is not limited, it can be suitably used as a material for electronic equipment parts such as switches, connectors, jacks, terminals, relays, etc., and in particular, an autofocus camera module. It can use suitably as an electroconductive spring material used for electronic device components, such as.
  • the autofocus camera module generates a lens, a spring member that elastically biases the lens toward an initial position in the optical axis direction, and an electromagnetic force that resists the biasing force of the spring member to cause the lens to light.
  • Electromagnetic drive means that can be driven in the axial direction is provided.
  • the electromagnetic driving means includes a U-shaped cylindrical yoke, a coil accommodated inside the inner peripheral wall of the yoke, and a magnet surrounding the coil and accommodated inside the outer peripheral wall of the yoke. Can do.
  • FIG. 1 is a cross-sectional view showing an example of an autofocus camera module according to the present invention
  • FIG. 2 is an exploded perspective view of the autofocus camera module of FIG. 1
  • FIG. 3 is an autofocus camera module of FIG. It is sectional drawing which shows this operation
  • the autofocus camera module 1 includes a U-shaped cylindrical yoke 2, a magnet 4 attached to the outer wall of the yoke 2, a carrier 5 having a lens 3 at a central position, a coil 6 attached to the carrier 5, a yoke 2, a frame 8 that supports the base 7, two spring members 9 a and 9 b that support the carrier 5 at the top and bottom, and two caps 10 a and 10 b that cover these top and bottom.
  • the two spring members 9a and 9b are the same product, support the carrier 5 sandwiched from above and below in the same positional relationship, and function as a power feeding path to the coil 6. By applying a current to the coil 6, the carrier 5 moves upward.
  • the terms “upper” and “lower” are used as appropriate, but the upper and lower parts in FIG. 1 are pointed out, and the upper part represents the positional relationship from the camera toward the subject.
  • the yoke 2 is a magnetic material such as soft iron, has a U-shaped cylindrical shape with a closed top surface, and has a cylindrical inner wall 2a and an outer wall 2b.
  • a ring-shaped magnet 4 is attached (adhered) to the inner surface of the U-shaped outer wall 2b.
  • the carrier 5 is a molded product made of a synthetic resin or the like having a cylindrical structure having a bottom surface portion, supports a lens at a central position, and is mounted with a pre-formed coil 6 bonded to the outside of the bottom surface.
  • the yoke 2 is fitted and incorporated in the inner peripheral portion of the base 7 of the rectangular upper resin molded product, and the entire yoke 2 is fixed by the frame 8 of the resin molded product.
  • the spring members 9a and 9b are both fixed with the outermost peripheral part sandwiched between the frame 8 and the base 7, respectively, and the notch groove part for each inner peripheral part 120 ° is fitted to the carrier 5 and fixed by thermal caulking or the like. Is done.
  • the spring member 9b and the base 7 and the spring member 9a and the frame 8 are fixed by adhesion, heat caulking, or the like. Further, the cap 10b is attached to the bottom surface of the base 7, and the cap 10a is attached to the upper portion of the frame 8, respectively. 9b is sandwiched between the base 7 and the cap 10b, and the spring member 9a is sandwiched and fixed between the frame 8 and the cap 10a.
  • One lead wire of the coil 6 extends upward through a groove provided on the inner peripheral surface of the carrier 5 and is soldered to the spring member 9a.
  • the other lead wire extends downward through a groove provided on the bottom surface of the carrier 5 and is soldered to the spring member 9b.
  • the spring members 9a and 9b have the same shape and are attached in the same positional relationship as shown in FIGS. 1 and 2, the axial displacement when the carrier 5 moves upward can be suppressed. Since the coil 6 is manufactured by pressure molding after winding, the accuracy of the finished outer diameter is improved, and the coil 6 can be easily arranged in a predetermined narrow gap. Since the carrier 5 hits the base 7 at the lowermost position and hits the yoke 2 at the uppermost position, the carrier 5 is provided with an abutting mechanism in the vertical direction, thereby preventing the carrier 5 from falling off.
  • FIG. 3 shows a cross-sectional view when a current is applied to the coil 6 to move the carrier 5 having the lens 3 for autofocus upward.
  • a current flows through the coil 6 and an upward electromagnetic force acts on the carrier 5.
  • the restoring force of the two connected spring members 9a and 9b acts downward on the carrier 5.
  • the upward moving distance of the carrier 5 is a position where the electromagnetic force and the restoring force are balanced. Thereby, the amount of movement of the carrier 5 can be determined by the amount of current applied to the coil 6.
  • the restoring force acts equally downward on the upper surface and lower surface of the carrier 5, so that the lens 3 Axis misalignment can be kept small.
  • the magnet 4 has been described as having a cylindrical shape, the magnet 4 is not limited to this, and may be divided into three or four parts and magnetized in the radial direction, and this may be adhered and fixed to the inner surface of the outer wall 2b of the yoke 2.
  • Hot rolling The ingot was heated at 950 ° C. for 3 hours and rolled to a thickness of 10 mm.
  • Cold rolling 2 Rolled to a predetermined thickness according to the rolling reduction.
  • Aging treatment Heated in an Ar atmosphere at the temperature and time shown in Table 1. The temperature was selected to maximize the tensile strength after aging.
  • the punch processed into the edge was pressed at a moving speed of 1 mm / min to give a deflection of distance d to the sample, and then the punch was returned to the initial position and unloaded. After unloading, the amount of sag ⁇ was determined.
  • the arithmetic average roughness (Ra) of the work roll was obtained by the above-described measurement method using a contact-type roughness measuring machine.
  • Table 1 shows the test results. The case where the cold rolling 3 was not performed was described as “none”. Inventive Examples 1 to 32, which are within the specified range of the present invention, have a 0.2% proof stress of 1100 MPa or more and a surface roughness of 0.1 ⁇ m or less. was gotten.
  • the surface roughness Ra of Comparative Examples 9 to 11 using a work roll having a roughness exceeding 0.1 ⁇ m in the final pass of the cold rolling 3 exceeded 0.1 ⁇ m, and the amount of sag thereof exceeded 0.1 mm. .
  • Comparative Example 12 having a Ti concentration of less than 1.5% by mass was less than 1100 MPa, and the amount of sag exceeded 0.1 mm.
  • the 0.2% proof stress of Comparative Example 15 in which the cold rolling 3 was not performed is less than 1100 MPa, the surface roughness exceeds 0.1 mm, and the amount of sag Exceeded 0.1 mm.

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Conductive Materials (AREA)
  • Lens Barrels (AREA)
  • Focusing (AREA)
  • Automatic Focus Adjustment (AREA)
  • Metal Rolling (AREA)
  • Non-Insulated Conductors (AREA)
PCT/JP2013/068263 2012-07-19 2013-07-03 高強度チタン銅箔及びその製造方法 WO2014013876A1 (ja)

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Application Number Priority Date Filing Date Title
CN201380038387.3A CN104487600A (zh) 2012-07-19 2013-07-03 高强度钛铜箔及其制备方法
KR1020157004286A KR101704941B1 (ko) 2012-07-19 2013-07-03 고강도 티탄 동박 및 그 제조 방법

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JP2012160798 2012-07-19
JP2012-160798 2012-07-19
JP2012-232972 2012-10-22
JP2012232972A JP5723849B2 (ja) 2012-07-19 2012-10-22 高強度チタン銅箔及びその製造方法

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CN (2) CN110042269A (zh)
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JP2017179572A (ja) * 2016-03-31 2017-10-05 Jx金属株式会社 めっき層を有するチタン銅箔
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JP6618410B2 (ja) * 2016-03-31 2019-12-11 Jx金属株式会社 チタン銅箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール
JP6703878B2 (ja) * 2016-03-31 2020-06-03 Jx金属株式会社 チタン銅箔および、その製造方法
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JP6650987B1 (ja) 2018-11-09 2020-02-19 Jx金属株式会社 チタン銅箔、伸銅品、電子機器部品及びオートフォーカスカメラモジュール
JP6953465B2 (ja) * 2019-03-27 2021-10-27 Jx金属株式会社 チタン銅箔及びチタン銅箔の製造方法
JP2019199650A (ja) * 2019-07-10 2019-11-21 Jx金属株式会社 めっき層を有するチタン銅箔
CN111101016B (zh) * 2020-02-26 2021-01-19 宁波博威合金材料股份有限公司 一种时效强化型钛铜合金及其制备方法

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JP2017179572A (ja) * 2016-03-31 2017-10-05 Jx金属株式会社 めっき層を有するチタン銅箔
EP3845675A4 (en) * 2018-08-30 2021-12-22 JX Nippon Mining & Metals Corporation TITANIUM COPPER PLATE, PRESSED PRODUCT AND METHOD FOR MANUFACTURING PRESSED PRODUCTS

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TW201410886A (zh) 2014-03-16
KR20150034275A (ko) 2015-04-02
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