WO2014013871A1 - Structure contenant une couche d'étanchéité, procédé de production correspondant, et connecteur - Google Patents

Structure contenant une couche d'étanchéité, procédé de production correspondant, et connecteur Download PDF

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Publication number
WO2014013871A1
WO2014013871A1 PCT/JP2013/068229 JP2013068229W WO2014013871A1 WO 2014013871 A1 WO2014013871 A1 WO 2014013871A1 JP 2013068229 W JP2013068229 W JP 2013068229W WO 2014013871 A1 WO2014013871 A1 WO 2014013871A1
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Prior art keywords
seal layer
sealing material
resin
polyester
acid
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PCT/JP2013/068229
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English (en)
Japanese (ja)
Inventor
大樹 舩岡
健治 志賀
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東洋紡株式会社
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Priority to JP2014525775A priority Critical patent/JP6237625B2/ja
Publication of WO2014013871A1 publication Critical patent/WO2014013871A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0065—Permeability to gases
    • B29K2995/0067—Permeability to gases non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0068—Permeability to liquids; Adsorption
    • B29K2995/0069—Permeability to liquids; Adsorption non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/36—Plugs, connectors, or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0655—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents

Definitions

  • the present invention relates to a seal layer-containing structure in which a seal layer is provided at a site where high air tightness or liquid tightness (both are referred to as sealability) is required.
  • HumiSeal registered trademark, manufactured by Chase
  • the moisture-proof coating agent such as HumiSeal is an organic solvent type, and it takes time to dry the organic solvent after it is applied to a part that needs to be sealed (for example, a flange part of a pipe joint), and is volatile. There was a need to recover the organic solvent.
  • the other flange corresponding to the lid is pressed and screwed. There was also.
  • Patent Document 1 describes a technique in which a terminal is inserted into a through hole for a terminal of a housing and then the inside of the through hole is sealed with a hot melt adhesive. Since the hot-melt type sealing material is melted by heating to be in a fluid state and cooled to be in a solid state, the above-described problem of the curable adhesive cannot occur. However, in this patent document 1, since the hot melt type sealing material is injected into the seal portion using an applicator (a small melt discharge device dedicated to a hot melt adhesive), the work is complicated and inefficient.
  • an applicator a small melt discharge device dedicated to a hot melt adhesive
  • the applicator works while heating a certain amount of hot melt adhesive in a tank so that hot melt adhesive can be discharged over several tens of shots.
  • the adhesive will cause thermal degradation. If the amount of hot melt adhesive to be placed in the tank is reduced, the time from replenishment to hot melting after use of the hot melt adhesive is wasted.
  • the present invention has been aimed at providing a seal layer-containing structure that can be industrially produced at high speed and has a high performance, and a method for producing the structure.
  • a seal layer made of a hot-melt type seal material is provided at a site that needs to be provided with sealability, and the volume X (mL) of the seal material constituting the seal layer,
  • the seal layer-containing structure is characterized in that the ratio X / Y of the contact area Y (mm 2 ) between the seal layer and the structure is 1.0 ⁇ 10 ⁇ 4 mL / mm 2 or more.
  • the part that needs to be sealed is a gap between the first part and the second part.
  • the hot melt type sealing material is one or more of polyester type hot melt type sealing material, polyamide type hot melt type sealing material and polyolefin type hot melt type sealing material.
  • the hot melt type sealing material is a polyester type hot melt type sealing material
  • the polyester type hot melt type sealing material contains a polyester type resin and a stress relaxation material incompatible with the polyester type resin.
  • the seal layer it is preferable to adopt a sea-island structure in which the polyester-based resin is the sea and the stress relaxation material is the island.
  • the stress relaxation material is preferably a polyolefin resin, a polyamide elastomer or a fluororesin.
  • a hot melt type sealant is prepared after charging a composite I in which a first part and a second part are in contact without a seal layer in a mold.
  • the present invention also includes a connector using the seal layer-containing structure of the present invention.
  • the ratio X / Y between the volume X of the hot-melt type sealing material and the contact area Y between the sealing layer and the structure is appropriately determined, it receives a severe thermal history of 100 cooling cycles. After that, it was possible to provide a seal layer-containing structure showing excellent sealing properties.
  • the hot-melt type sealing material is immediately solidified by cooling, if injection molding or extrusion molding is used, a seal layer-containing structure can be produced in a short time of about several tens of seconds. Since it has an action such as packing, lid, and screwing in the sealing method using the moisture-proof coating agent, the tact time can be shortened, the cost can be reduced, and extremely efficient industrial production becomes possible.
  • the sealing layer is formed in the mold by injection molding or extrusion molding, the operation of positioning or the like is not required even for a complex-shaped structure, and the yield is improved. In addition, since it is solvent-free, a solvent recovery process is no longer necessary.
  • the seal layer-containing structure of the present invention is provided with a seal layer made of a hot-melt type seal material at a site where it is necessary to impart sealability, and the volume X (mL) of the seal material constituting the seal layer is It is characterized in that the ratio X / Y of the contact area Y (mm 2 ) between the seal layer and the structure is 1.0 ⁇ 10 ⁇ 4 mL / mm 2 or more.
  • Sex can be secured.
  • X / Y is smaller than 1.0 ⁇ 10 ⁇ 4 mL / mm 2 , the adhesion between the part that needs to be provided with a sealing property and the sealing layer becomes insufficient, and an excellent sealing property is secured. Can not do it.
  • the upper limit of X / Y is not particularly limited and can be appropriately selected according to the shape of the molded product. However, considering that the sealing property is saturated, 1.0 ⁇ 10 ⁇ 2 mL / mm 2 or less is preferable. 0 ⁇ 10 ⁇ 3 mL / mm 2 or less is more preferable, and 5.0 ⁇ 10 ⁇ 4 mL / mm 2 or less is more preferable.
  • the contact area Y (mm 2 ) between the seal layer and the structure includes not only the area of the bottom of the seal layer but also the area of the portion where the side of the seal layer and the structure are in contact with each other, Literally, it means the area where the structure and the sealing layer are in contact.
  • the “part that needs to be sealed” is a part where a sealing layer is to be formed, for example, a through hole of a cylindrical structure having a fine through hole should be sealed
  • the through-hole is a part that needs to be provided with a sealing property, but usually a gap between two parts (first component and second component) needs to provide a sealing property. It becomes a part.
  • the seal layer-containing structure of the present invention is preferably composed of the first component, the second component, and the seal layer.
  • the material of the first part and the second part is not particularly limited, and examples thereof include metals, thermoplastic resins, cured products of thermosetting resins, ceramics, and the like.
  • the resin may contain a filler, glass fiber, glass cloth and the like.
  • the first component and the second component may be the same type or different types.
  • the high performance sealing material of the present invention exhibits an excellent effect when sealing these parts.
  • Each component may be subjected to a surface treatment. Examples of the surface treatment include itro treatment, plasma treatment, blast treatment, primer treatment, anchor agent treatment and the like.
  • the seal layer is formed in the mold.
  • the mold may be a mold or a resin mold.
  • the material may be selected according to the melting temperature of the hot-melt type sealing material.
  • the seal layer-containing structure of the present invention has a seal layer made of a hot-melt type sealing material.
  • the hot-melt type sealing material is not particularly limited as long as injection molding or extrusion molding is possible.
  • a structure used for an automobile part or the like has excellent sealing properties in a wide temperature range from low temperature to high temperature. Since it is required to be shown, in the present invention, one or more of polyester-based hot-melt-type sealing materials, polyamide-based hot-melt-type sealing materials, and polyolefin-based hot-melt-type sealing materials may be used. preferable. This is because these exhibit excellent adhesion to both metals and plastics, and therefore have excellent performance as sealing materials.
  • polyester hot melt type sealant The polyester-based hot-melt sealing material used in the present invention is not particularly limited, but a polyester obtained by copolymerizing dimer acid, long-chain aliphatic acid or glycol, or polyalkylene ether glycol is preferable. By copolymerizing these soft segments, the resulting polyester-based hot-melt type sealing material exhibits good flexibility, can relieve deformation stress under a wide temperature environment, and exhibits good sealing properties. .
  • an epoxy resin, a phenol-modified alkylbenzene resin, or the like is blended with the crystalline polyester resin as a dispersion aid, or a polyolefin, a polyamide elastomer, a fluororesin, or the like is blended as a stress relaxation material.
  • a dispersion aid When a dispersion aid is blended, it is possible to impart excellent properties such as good initial adhesiveness and excellent sealing properties even after a thermal cycle (cooling cycle property).
  • the dispersion aid exerts a stress relaxation effect by delaying the crystallization of the crystalline polyester resin, contributes as a compatibilizer between the crystalline polyester resin and the stress relaxation material, and the stress relaxation material is contained in the polyester resin.
  • the effect of finely dispersing in the substrate is further exhibited, and further the effect of improving the wettability to the substrate by introducing the functional group is exhibited.
  • a stress relaxation material when blended, it exhibits excellent properties such as good adhesion and adhesion durability against cold cycle and high temperature and high humidity environmental load.
  • the stress relaxation material is considered to exhibit a strain energy relaxation effect due to crystallization of the polyester resin and enthalpy relaxation.
  • suitable components of the polyester-based hot melt type sealing material will be described.
  • the present invention contains a polyester-based resin and a stress relaxation material that is incompatible with the polyester-based resin. It is preferable to use a hot-melt type sealing material having a sea-island structure as an island.
  • the stress relieving material expands even when the polyester resin shrinks under cooling during the thermal cycle because the stress relieving material is an island and finely dispersed in the sea of the polyester resin that is the matrix. Thus, the stress of the entire seal layer is relieved, the seal layer is prevented from peeling off from the part, and good adhesion is maintained.
  • a stress relaxation material exhibits the relaxation effect of the strain energy by crystallization of a polyester-type resin, or enthalpy relaxation.
  • excellent sealing properties can be ensured even if the cooling cycle described below is repeated 100 times.
  • adhesion durability against high temperature and high humidity environmental load is also good.
  • the stress relaxation material used for the polyester-based hot-melt type sealing material of the present invention is preferably a polyolefin-based resin.
  • Polyolefin resin preferably has a density of less than 0.75 g / cm 3 or more 0.91 g / cm 3.
  • the stress relieving material can be easily finely dispersed and mixed with an incompatible polyester resin, and special kneading equipment is required. Instead, a sea-island structure sealing material can be obtained.
  • the low density and low crystallinity also work properly to relieve the residual stress at the time of molding that occurred in the polyester resin over time, providing long-term adhesion durability as a sealing material and reducing the stress generated by environmental loads. It exhibits favorable characteristics such as reduction.
  • the stress relaxation material having such properties polyethylene and ethylene copolymers are particularly preferable because they are easily available and inexpensive, and do not adversely affect the adhesion to metals and plastics.
  • the polyolefin resin preferably does not contain a polar group capable of reacting with a polyester resin such as a carboxyl group or a glycidyl group. If a polar group is present, the compatibility with the polyester-based resin changes, and the strain energy at the time of crystallization of the polyester resin may not be alleviated.
  • a polyolefin having a polar group tends to have a higher compatibility with a polyester resin than a polyolefin having no polar group, but in the present invention, when the compatibility is increased, the adhesion between the sea and the island is excessively increased. On the contrary, there is a tendency that the deterioration of the adhesiveness with time increases.
  • polyamide elastomer in addition to the above-mentioned polyolefin resin, polyamide elastomer, fluororesin, and the like can be suitably used.
  • the polyamide elastomer used for the stress relieving material of the hot melt type sealing material of the present invention is not particularly limited, and nylon resins such as nylon 4, nylon 6, nylon 7, nylon 11, nylon 12, nylon 66, etc., aramid resins, These copolymers and mixtures, and those obtained by copolymerizing these with polyethers, polycarbonates, aliphatic polyesters and the like are preferable.
  • Polyester block amide elastomers of VESTAMID (registered trademark) E series sold by Daicel Evonik Co., Ltd. and PEBAX (registered trademark) series sold by Arkema Co., Ltd. are easily available.
  • the polyamide elastomer of the present invention is preferable.
  • the melting point of the polyamide elastomer is preferably 220 ° C. or lower, more preferably 210 ° C. or lower. If the melting point is too high, the melt viscosity of the sealing material is greatly increased when the sealing layer is produced using the hot melt type sealing material of the present invention, and low pressure molding may be difficult. The compatibility with the polyester resin that is sea) is too small to be well dispersed as an island, and the adhesion of the seal layer may not be sufficiently developed.
  • the melting point is preferably 100 ° C. or higher, more preferably 130 ° C. or higher, still more preferably 140 ° C. or higher. If the melting point is too low, the heat resistance of the sealing layer may be insufficient.
  • the fluororesin used in the hot melt type sealing material of the present invention has a structure in which a part or all of the hydrogen of the polyolefin is substituted with fluorine, or a part of the hydrogen of the polyolefin is other than fluorine. It consists of a structure partially substituted with a perfluoroalkyl ether group.
  • fluororesin used in the present invention include polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-ethylene copolymer, and poly Mention may be made of chlorotrifluoroethylene.
  • the melt viscosity of the sealing material may be greatly increased, and low-pressure molding may be difficult. There is a possibility that the compatibility with the polyester resin which is a matrix resin (sea) is too small to be dispersed well as an island and the adhesiveness of the seal layer is not sufficiently developed.
  • the compounding amount of the stress relieving material is preferably 0.5 to 50 parts by mass with respect to 100 parts by mass of the polyester resin.
  • the stress relieving material is less than 0.5 parts by mass, it is difficult to relieve strain energy by crystallization of the polyester resin or enthalpy relieving, so that the adhesive strength tends to decrease.
  • blends a stress relaxation material over 50 mass parts there exists a tendency for adhesiveness and a sealing performance to fall.
  • the polyester resin and the stress relaxation material are not microscopic sea-island structural phase separation, macroscopic phase separation occurs, the elongation at break decreases, and a smooth surface cannot be obtained. There is.
  • the polyester-based resin that is a matrix of the polyester-based hot-melt type sealing material used in the present invention is a polyester-based resin in order to develop a low melt viscosity capable of injection molding or extrusion molding, and good heat resistance and thermal cycle performance.
  • the constituent components of the resin it is preferable to adjust the composition ratio of the aliphatic component and / or the alicyclic component and the aromatic component.
  • the glycol component is mainly composed of 1,4-butanediol which is rapidly crystallized.
  • the acid component constituting the polyester resin contains terephthalic acid and / or naphthalenedicarboxylic acid, and the total amount of terephthalic acid and naphthalenedicarboxylic acid is 60 mol% or more in 100 mol% of the acid component. It is preferably 70 mol% or more, more preferably 80 mol% or more. If it is less than 60 mol%, the heat resistance may be insufficient.
  • ethylene glycol and 1,4-butanediol are contained, and the total amount of ethylene glycol and 1,4-butanediol is 40 mol in 100 mol% of the glycol component. It is preferably at least mol%, more preferably at least 45 mol%, even more preferably at least 50 mol%, particularly preferably at least 55 mol%. If the amount is less than 40 mol%, the crystallization rate is insufficient, the mold releasability is deteriorated, the moldability is prolonged such as the molding time is prolonged, the crystallinity is also insufficient, and the heat resistance may be insufficient. .
  • a crystalline polyester resin is used as a matrix resin for the sealing material.
  • the crystalline polyester resin in the present invention refers to, for example, a differential scanning calorimeter “DSC220 type” manufactured by Seiko Denshi Kogyo Co., Ltd. Hold the sample at 220 ° C for 5 minutes to completely melt the sample, then quench with liquid nitrogen, and then show the melting point when measured from -150 ° C to 250 ° C at a rate of temperature increase of 20 ° C / min. Point to.
  • adipic acid, azelaic acid, sebacic acid, 1,4-as a copolymer component for imparting adhesiveness to the basic composition composed of the above-mentioned acid component and glycol component giving high heat resistance.
  • Aliphatic or alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 4-methyl-1,2-cyclohexanedicarboxylic acid, dimer acid, hydrogenated dimer acid, etc.
  • aliphatic or alicyclic dicarboxylic acids having 10 or more carbon atoms such as dimer acid and hydrogenated dimer acid and derivatives thereof, or aliphatic and / or fats having 10 or more carbon atoms such as dimer diol and hydrogenated dimer diol.
  • the glass transition temperature can be lowered while maintaining a high melting point, so that both the heat resistance and the sealing property of the polyester resin can be achieved.
  • guide_body of an aliphatic and / or alicyclic dicarboxylic acid means what is a derivative
  • the dimer acid is an aliphatic or alicyclic dicarboxylic acid produced by dimerization of an unsaturated fatty acid by polymerization or Diels-Alder reaction or the like (most dimers, trimers, monomers, etc.
  • the hydrogenated dimer acid is obtained by adding hydrogen to the unsaturated bond portion of the dimer acid.
  • Dimer diol and hydrogenated dimer diol refer to those obtained by reducing two carboxyl groups of dimer acid or hydrogenated dimer acid to hydroxyl groups. Examples of the dimer acid or dimer diol include ENPOL (registered trademark) and Sobamol (registered trademark) manufactured by Cognis, or Prepol manufactured by UNIKEMA.
  • aromatic copolymer component A small amount of an aromatic copolymer component can be used as long as the melt viscosity is within a range.
  • aromatic copolymer component include aromatic dicarboxylic acids such as isophthalic acid and orthophthalic acid, and aromatic glycols such as ethylene oxide adduct and propylene oxide adduct of bisphenol A.
  • an aliphatic component having a relatively high molecular weight such as dimer acid, dimer diol, or polytetramethylene glycol, which exhibits rapid crystal solidification behavior during molding.
  • thermal cycleability means that even if the temperature is raised and lowered between high and low temperatures many times, peeling of the interface between the parts having different linear expansion coefficients and the seal layer and cracking of the seal layer itself are unlikely to occur. Is performance. If the elastic modulus of the sealing material is significantly increased during cooling, peeling and cracking are likely to occur.
  • the glass transition temperature of the polyester resin is preferably ⁇ 10 ° C. or lower in order to provide a material having good heat cycle characteristics. More preferably, it is ⁇ 20 ° C. or less, more preferably ⁇ 40 ° C. or less, and most preferably ⁇ 50 ° C. or less.
  • the lower limit is not particularly limited, but ⁇ 100 ° C. is realistic.
  • Dimer acid, hydrogenated dimer acid, dimer diol, hydrogenated dimer diol, and polytetramethylene glycol for introducing a blocky polymer are 2 moles in a total of 200 mole% of all acid components and all glycol components of the polyester resin. % Or more, preferably 5 mol% or more, more preferably 10 mol% or more, and most preferably 20 mol% or more. Moreover, when heat resistance etc. are considered, 70 mol% or less is preferable, 60 mol% or less is more preferable, and 50 mol% or less is more preferable.
  • the number average molecular weight of polytetramethylene glycol is preferably 400 or more, more preferably 500 or more, further preferably 600 or more, and particularly preferably 700 or more.
  • the upper limit is preferably 10,000, more preferably 6000, still more preferably 4000, and particularly preferably 3000.
  • the number average molecular weight of the polytetramethylene glycol is less than 400, the thermal cycle performance may be deteriorated.
  • it exceeds 10,000 the compatibility with the polyester portion is lowered, and it may be difficult to copolymerize in a block form.
  • the number average molecular weight of the polyester resin used in the present invention is preferably 3000 or more, more preferably 5000 or more, further preferably 7000 or more, preferably 50000 or less, more preferably 40000 or less, and further preferably 30000 or less.
  • the number average molecular weight is less than 3000, the thermal cycleability may be insufficient, and when it exceeds 50000, the melt viscosity at the time of molding may be increased.
  • the target polyester resin can be obtained by subjecting the above dicarboxylic acid and diol components to an esterification reaction at 150 to 250 ° C. and then polycondensation at 230 to 300 ° C. under reduced pressure.
  • the target polyester resin is obtained by performing a transesterification reaction at 150 ° C. to 250 ° C. using a derivative such as dimethyl ester of the above dicarboxylic acid and a diol component, and then performing polycondensation at 230 ° C. to 300 ° C. under reduced pressure. be able to.
  • the polyester hot melt type sealing material of the present invention contains a dispersion aid for finely dispersing the stress relieving material in the polyester resin that is the sea. May be.
  • An epoxy resin is preferably used as the dispersion aid.
  • the epoxy resin exhibits a stress relaxation effect due to the delay in crystallization of the polyester resin, an effect as a dispersion aid for the polyester resin and the stress relaxation material, and an effect of improving the wettability to the substrate by introducing a functional group. It is thought to do.
  • the epoxy resin is preferably an epoxy resin having a number average molecular weight of 450 to 40,000 and having an average of at least 1.1 glycidyl groups in the molecule.
  • glycidyl ether type such as bisphenol A diglycidyl ether, bisphenol S diglycidyl ether, novolak glycidyl ether, brominated bisphenol A diglycidyl ether, glycidyl ester type such as hexahydrophthalic acid glycidyl ester, dimer acid glycidyl ester, triglycidyl isocyanate Nurate, glycidylhindantoin, tetraglycidyldiaminodiphenylmethane, triglycidylparaaminophenol, triglycidylmetaaminophenol, diglycidylaniline, diglycidyltoluidine, tetraglycidylmetaxylenediamine,
  • those having good compatibility with the polyester resin are particularly preferable in order to exhibit a high adhesive force.
  • the preferred number average molecular weight of the epoxy resin is 450 to 40,000. If the number average molecular weight is less than 450, the sealing material is very soft, and the mechanical properties may be inferior. If it exceeds 40000, the compatibility with the polyester resin is lowered, the adhesion to the parts is impaired, and the sealing property May decrease.
  • the compounding amount of the epoxy resin in the hot melt type sealing material is preferably 0.1 to 50 parts by mass with respect to 100 parts by mass of the polyester resin.
  • the blending amount of the epoxy resin is less than 0.1 parts by mass, the stress relaxation effect due to the crystallization delay cannot be exhibited, and the function as a dispersion aid for the stress relaxation material and the epoxy resin may not be exhibited.
  • an epoxy resin is mix
  • the polyester-based hot-melt sealing material used in the present invention preferably has a melt viscosity at 220 ° C. of 5 to 4000 dPa ⁇ s.
  • the melt viscosity at 220 ° C. is a value measured as follows. That is, a polyester-based hot melt type sealing material is dried to a moisture content of 0.1% or less, and then heated to 220 ° C. with a flow tester (model number CFT-500C) manufactured by Shimadzu Corporation. It is a measured value of viscosity when a die seal material is passed through a 10 mm thick die having a hole diameter of 1.0 mm at a pressure of 98 N / cm 2 .
  • melt viscosity exceeds 4000 dPa ⁇ s
  • high cohesive force and durability can be obtained.
  • high pressure injection molding or extrusion molding is required, which is not preferable.
  • a sealing material having a melt viscosity of 1000 dPa ⁇ s or less, preferably 500 dPa ⁇ s or less is used, a structure having excellent sealing properties can be obtained at a relatively low injection pressure of 0.1 to 100 MPa. Further, from the viewpoint of the sealing material injection operation, it is preferable that the melt viscosity at 220 ° C.
  • the melt viscosity is preferably 5 dPa ⁇ s or more, more preferably 10 dPa ⁇ s or more.
  • 50 dPa ⁇ s or more is more preferable, and 100 dPa ⁇ s or more is most preferable.
  • the upper limit of the melting point of the polyester resin is preferably 210 ° C. Preferably it is 200 degreeC, More preferably, it is 190 degreeC.
  • the lower limit is preferably 5 to 10 ° C. higher than the heat-resistant temperature required for the corresponding application.
  • the melting point is preferably 70 ° C or higher, more preferably 100 ° C or higher, further preferably 120 ° C or higher, particularly preferably 140 ° C or higher, and most preferably 150 ° C or higher. .
  • the polyester-based hot melt type sealing material may contain the above-mentioned dispersion aid and stress relieving agent, and further, a curing agent such as an isocyanate compound and melamine; an antioxidant; talc and mica Fillers such as carbon black, titanium oxide and the like; flame retardants such as antimony trioxide and brominated polystyrene may be blended at all.
  • the polyester resin is preferably contained in an amount of 50% by mass or more, more preferably 60% by mass or more, and still more preferably 70% by mass or more based on the whole sealing material. If the content of the polyester resin is less than 50% by mass, the properties such as excellent adhesiveness of the polyester resin itself may be deteriorated.
  • polyamide-based hot-melt sealing material In the present invention, a polyamide-based hot-melt type sealing material may be used, and the polyamide-based hot-melt type sealing material is not particularly limited, but is a polyamide copolymerized with dimer acid or a polyamide copolymerized with long-chain fatty acid.
  • the melting point is preferably 130 ° C. or higher and the glass transition temperature is lower than 20 ° C.
  • polyolefin-based hot-melt sealing material In the present invention, a polyolefin-based hot-melt sealing material may be used, and the polyolefin-based hot-melt sealing material is not particularly limited, but a general-purpose polyolefin such as polyethylene or polypropylene, poly ( ⁇ -olefin), or the like can be used alone. These can be used or blended. Further, copolymers of ⁇ -olefins such as propene, butene, pentene, hexene, octene, 4-methylpentene, (meth) acrylic acid esters, (meth) acrylic acid, glycidyl acrylate, maleic acid, fumaric acid, etc.
  • ⁇ -olefins such as propene, butene, pentene, hexene, octene, 4-methylpentene, (meth) acrylic acid esters, (meth) acrylic acid, glycidyl acrylate,
  • a copolymer of an unsaturated acid, vinyl acetate, or the like and an olefin may be used. Blends of these copolymers with olefin homopolymers are also effective.
  • the polyolefin may contain a block polymer mainly composed of ethylene chains and / or a block polymer mainly composed of propylene chains.
  • the block polymer containing ethylene chain as a main component refers to a polymer containing 50% by mass or more of a block-like ethylene component
  • the block polymer containing propylene chain as a main component includes a block-like propylene component as a main component.
  • the thing containing 50 mass% or more is pointed out.
  • the block polymer mainly composed of ethylene chain or propylene chain can be copolymerized with the above-mentioned ⁇ -olefin, unsaturated acid, vinyl acetate, etc., but (meth) acrylic acid ester is from the viewpoint of imparting adhesiveness. preferable.
  • Polyethylene is desirable as the polyolefin used in the present invention.
  • polyethylene By using polyethylene, the adhesive strength with crosslinked polyethylene can be increased.
  • polyethylene include high-density polyethylene (abbreviation: HDPE), low-density polyethylene (abbreviation: LDPE), linear low-density polyethylene (abbreviation: LLDPE), and LLDPE or HDPE is preferable from the viewpoint of heat resistance.
  • examples of the acid-modified polyolefin as a base of the acid-modified polyolefin include polyethylene, polypropylene, ethylene-propylene copolymer, propylene-butene copolymer, ethylene-propylene-butene copolymer, and the like.
  • An ethylene-propylene copolymer and an ethylene-propylene-butene copolymer are desirable from the viewpoint of heat resistance and compatibility with other resins.
  • the acid-modified polyolefin is polyethylene, the melting point is lowered, and the heat resistance of the resin composition may be lowered.
  • the acid-modified polyolefin a copolymer obtained by copolymerizing (meth) acrylic acid ester, (meth) acrylic acid, unsaturated acid, vinyl acetate, ethylene, ⁇ -olefin, or the like can also be used.
  • the acid-modified polyolefin is preferably obtained by graft polymerization of at least one selected from the group consisting of unsaturated carboxylic acids having 3 to 10 carbon atoms, acid anhydrides and esters thereof.
  • the mass of the graft chain with respect to the whole acid-modified polyolefin is preferably 0.5 to 10% by mass. More preferably, 1 to 6% by mass graft polymerization is performed. When the mass fraction of the graft chain is too small, the adhesion to the substrate is lowered, and when it is too much, the hygroscopicity tends to be increased.
  • Examples of unsaturated carboxylic acids having 3 to 10 carbon atoms, acid anhydrides and esters thereof include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and maleic anhydride And acid anhydrides of unsaturated carboxylic acids such as itaconic anhydride and citraconic anhydride, and unsaturated carboxylic acid esters such as methyl acrylate, methyl methacrylate and dimethyl maleate.
  • maleic acid, itaconic acid and acid anhydrides thereof are preferable in terms of reactivity.
  • Graft polymerization for producing the acid-modified polyolefin can be carried out by a known method, and the method is not particularly limited.
  • an organic peroxide is added to a molten mixture of the polyolefin and the unsaturated carboxylic acid component, or to a mixture solution of the polyolefin and the unsaturated carboxylic acid component using a solvent such as toluene or xylene. It can be carried out.
  • it is preferable to avoid mixing of air and oxygen, and it is preferable to carry out in inert gas atmosphere, such as nitrogen gas.
  • organic peroxide examples include acetylcyclohexylsulfonyl peroxide, benzoyl peroxide, dichlorobenzoyl peroxide, dicumyl peroxide, di-tert-butyl peroxide, lauroyl peroxide and the like.
  • the polyolefin-based hot-melt sealing material preferably has an MFR of 60 g / 10 min or more at 190 ° C. and a load of 2160 gf. All of the polyolefin, the acid-modified polyolefin and the crystalline copolyester are preferably MFR of 60 g / 10 min or more from the viewpoint that the low molecular weight bleed-out after molding can be suppressed. A more preferable MFR is 80 g / 10 min or more. If the MFR is less than 60 g / 10 min, the melt viscosity becomes too high at a temperature that does not damage the first and / or second parts, and the temperature and pressure during molding are set to ensure good moldability. It must be raised, causing damage to the substrate.
  • polyolefin hot melt type sealing material of the present invention various resins and various additives described in the above polyester hot melt type sealing material may be added.
  • the first method is a method in which a composite body in which the first part and the second part are in contact with each other without a seal layer is formed in advance, and this composite body is used.
  • the composite I in which the first part 2 penetrates the second part 3 is used.
  • the part where the first part protrudes from the second part is a part that needs to be sealed.
  • a mold 1 is used in which the composite I can be fitted, and the portion 4a corresponding to the seal layer and the resin introduction portion 4b are spaces.
  • the hot melt type sealing material HM is injected or extruded from the resin introduction portion 4 b and injected into the mold 1.
  • the molded product obtained from the mold 1 is taken out, and the resin introduction portion corresponding portion 5b is cut to complete the structure of the present invention having the seal layer 5a.
  • the second method is a method in which a seal layer is first formed only around the first part.
  • the mold 6 is formed so that the first component 7 can be fitted therein, and the portion 8 a corresponding to the seal layer and the resin introduction portion 8 b become a space.
  • the hot melt type sealing material HM is injected or extruded from the resin introduction portion 8 b and injected into the mold 6.
  • the resin-introduced portion equivalent portion 9b is cut from the obtained molded product to obtain a composite II in which the first component 7 and the seal layer 9a are combined.
  • a mold 10 for molding the second part is prepared.
  • the mold 10 is formed so that the composite II can be fitted thereto, and the portion 11a corresponding to the second part and the resin introduction portion 11b are formed into a space.
  • the composite body II is charged into the mold 10, and the resin R for the second part is injected or extruded from the resin introducing portion 11 b and injected into the mold 10. Since a molded product in which the second component 12a and the resin introduction portion equivalent portion 12b are integrated with the composite II is obtained, the structure of the present invention having the seal layer 9a is obtained by cutting the resin introduction portion equivalent portion 12b. Is completed.
  • the manufacturing method of the structure of the present invention is not limited to the first and second methods described above, and can be changed as appropriate according to the shape of the molded body and the state of combination of the first part and the second part.
  • the conditions for injection molding and extrusion molding are not particularly limited, but hot melt sealing material injection temperature: 130 to 280 ° C., injection and holding pressure: 0.1 to 20 MPa, cooling time 1 second to 5 minutes, injection speed A thickness of 0.5 to 50 mm / sec is preferable because it does not damage the parts.
  • the seal layer-containing structure of the present invention has excellent sealing properties.
  • the standard of sealability is evaluated by air leak test.
  • the procedure of the air leak test method is shown in FIG. First, an air leak test is performed on the seal layer-containing structure (the same structure as in FIG. 1 and FIG. 2, the reference numerals are omitted) with the seal layer facing up so that water can be placed on the seal layer. It fixes to the metal mold
  • the air leak test mold 13 is provided with an air inlet 15.
  • FIG. 3 (b) shows an enlarged view of the vicinity of the seal layer. The ⁇ portion is not originally bonded, so there is no sealing performance. If the ⁇ portion is not tightly sealed, an air leak occurs.
  • the air leak test is performed after 100 cycles of the cooling cycle in which the cycle of holding for 30 minutes at 60 ° C. is performed before the initial (initial) cooling cycle and after holding for 30 minutes at 60 ° C. All of them are 0.1 kPa or more as a standard for passing.
  • P Poor
  • G Good
  • VG Very Good
  • E Excellent
  • a bonded test piece (adhesion test piece 1) was prepared.
  • the test piece was produced by injection molding using a mold.
  • the injection molding conditions were a molding temperature of 220 ° C., a molding pressure of 3 MPa, a holding pressure of 3 MPa, a cooling time of 15 seconds, and an injection speed of 50%.
  • Each adhesion test piece was allowed to stand for 3 hours to 100 hours in an atmosphere of 23 ° C. and 50% RH, and then the test piece was pulled in the longitudinal direction to apply a shearing force, and the strength at break was measured.
  • the tensile speed was 50 mm / min.
  • the strength per adhesion area of 450 mm 2 was defined as the adhesion strength.
  • Production Example 1 (Preparation of polyester-based hot-melt sealing material I) In a reaction vessel equipped with a stirrer, a thermometer, and a condenser for distillation, 1,4-butane corresponding to 60 mol% of 100 mol% of the glycol component with respect to 100 mol% of terephthalic acid and terephthalic acid When diol was charged to a total charge of 100 parts, tetrabutyl titanate corresponding to 0.25 parts was further added, and an esterification reaction was performed at 170 to 220 ° C. for 2 hours.
  • polytetramethylene glycol “PTMG1000” Mitsubishi Chemical Co., Ltd. having a number average molecular weight of 1000 is equivalent to the remaining 40 mol%, and a hindered phenolic antioxidant “Irganox (registered trademark) 1330 is used.
  • Ciba 0.5 parts (amount when the total amount of raw materials is 100 parts) is added, and the temperature is raised to 255 ° C., while the pressure in the system is slowly reduced to 255 over 60 minutes. It was set to 665 Pa at ° C. Further, a polycondensation reaction was performed at 133 Pa or less for 30 minutes to obtain a polyester resin. The melting point of this polyester resin was 165 ° C., and the melt viscosity was 250 dPa ⁇ s.
  • polyester resin 100 parts of this polyester resin, 20 parts of a phenol-modified alkylbenzene resin (“Nikanol (registered trademark)”; manufactured by Fudou; phenol-modified xylene resin; hydroxyl value 3035 equivalent / 10 6 g) as a dispersion aid, and as a stress relaxation material 20 parts of poly ⁇ -olefin (“Excellen® EUL731”; manufactured by Sumitomo Chemical Co., Ltd .; ethylene / ⁇ -olefin copolymer; density 0.90 g / cm 3 ; MFR 10 g / 10 min) is added and biaxially kneaded. A polyester-based hot melt type sealing material I was obtained.
  • a phenol-modified alkylbenzene resin (“Nikanol (registered trademark)”; manufactured by Fudou; phenol-modified xylene resin; hydroxyl value 3035 equivalent / 10 6 g
  • a stress relaxation material 20 parts
  • Production Example 2 (Preparation of polyester hot melt type sealing material II) A polyester resin was obtained by the same reaction as in Production Example 1 using 80 mol% terephthalic acid, 20 mol% dimer acid, and 100 mol% 1,4-butanediol. To 100 parts of this polyester resin, the same dispersion aid and stress relieving material as in Production Example 1 were added in the same amounts as in Production Example 1, and mixed with a biaxial kneader to obtain a polyester-based hot-melt sealing material II.
  • Production Example 3 (Preparation of polyester hot melt type sealing material III) Polybutylene terephthalate was obtained by the same reaction as in Production Example 1. The melting point of this polybutylene terephthalate was 220 ° C., and the MFR at 240 ° C. was 40 g / 10 min). To 100 parts of this polybutylene terephthalate, the same dispersion aid and stress relieving material as in Production Example 1 were added in the same amount as in Production Example 1, and mixed with a biaxial kneader to obtain a polyester-based hot melt type sealing material III. .
  • Polyamide-based hot melt sealant II Gramide (registered trademark) T-602 (manufactured by Toyobo; MFR 55 g / 10 min; melting point 225 ° C.)
  • Polyolefin hot melt sealant I Toyotac (registered trademark) M-300 (manufactured by Toyobo; acid-modified polyolefin; MFR 13 g / 10 min, melting point 160 ° C.)
  • Polyolefin hot melt sealant II Hi-Zex (registered trademark) 2100J (manufactured by Mitsui Chemicals; high-density polyethylene; MFR 5.8 g / 10 min, melting point 131 ° C.)
  • Tin-plated steel sheet Processed product by Toyobo Co., Ltd.
  • Nickel-plated steel sheet Processed product by Toyobo Co., Ltd.
  • Aluminum plate A5052 plate
  • PBT Polybutylene terephthalate (manufactured by Toyobo, Viropet (registered trademark) EMC532, melting point 255 ° C.)
  • PPS Polyphenylene sulfide (Toyobo Co., Ltd., Toyobo PPS resin TS301, deflection temperature under load (18.6 kgf / mm 2 ) 260 ° C. or higher)
  • 66 Nylon Polyamide 66 (Toyobo Co., Ltd., Gramide (registered trademark) T-663G30, containing 30% glass fiber, melt index 7 g / 10 min)
  • Production Example 4 The polyester resin obtained in Production Example 1 was designated as polyester resin IV.
  • Production Example 5 The polyester resin obtained in Production Example 2 was designated as polyester resin V.
  • Examples 13 to 21 and Reference Examples 1 to 4 As shown in Table 2, 30 parts of a stress relaxation material and 10 parts of a dispersion aid were added to 100 parts of each of polyester resins IV to VI, and mixed using a biaxial kneader. In the same manner as described above, a seal layer-containing structure was prepared, and an adhesion test and an air leak test were performed and evaluated. The ratio of X and Y was kept constant at 20 ( ⁇ 10 ⁇ 4 ) mL / mm 2 .
  • Polyolefin Excellen (registered trademark) EUL731 (manufactured by Sumitomo Chemical; ethylene / ⁇ -olefin copolymer; density 0.90 g / cm 3 ; MFR 10 g / 10 min)
  • Polyamide Pebax (registered trademark) MX1205 (manufactured by Arkema; polyether block amide (polyamide elastomer); melting point 147 ° C .; MFR 9 g / 10 min)
  • Fluororesin NEOFLON (registered trademark) EFEP RP-4020 (manufactured by Daikin Industries, Ltd .; modified fluororesin)
  • the seal layer-containing structure of the present invention is useful for electrical and electronic parts such as connectors, ECU parts, sensors, coils, and battery packs.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Sealing Material Composition (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une structure, qui contient une couche d'étanchéité, et qui, d'une part peut être produite industriellement à grande vitesse, et d'autre part présente d'excellentes propriétés d'étanchéité. Cette structure contenant une couche d'étanchéité est caractérisée, non seulement en ce qu'une couche d'étanchéité faite d'une matière d'étanchéité thermofusible est appliquée sur une partie à laquelle il est nécessaire de conférer des propriétés d'étanchéité, mais aussi en ce que le volume X, exprimé en ml, de matière d'étanchéité constituant la couche d'étanchéité, rapporté à la superficie de contact Y, exprimée en mm2, entre la couche d'étanchéité et la structure est d'au moins 1,0 × 10-4 ml/mm2.
PCT/JP2013/068229 2012-07-18 2013-07-03 Structure contenant une couche d'étanchéité, procédé de production correspondant, et connecteur WO2014013871A1 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015157475A (ja) * 2014-01-10 2015-09-03 東洋紡株式会社 シール層含有構造体およびその製造方法
FR3028793A1 (fr) * 2014-11-25 2016-05-27 Plastic Omnium Cie Procede de surmoulage sur un insert plastique et piece automobile obtenue par ce procede
FR3114815A1 (fr) * 2020-10-07 2022-04-08 Bostik Sa Composition polyamide

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005078035A1 (fr) * 2004-02-18 2005-08-25 Mitsubishi Plastics, Inc. Film de protection adhésif pour matériel électrique
JP2009117285A (ja) * 2007-11-09 2009-05-28 Hitachi Ltd 自動車用電子装置
JP2011014260A (ja) * 2009-06-30 2011-01-20 Yazaki Corp コネクタの一体成形方法
JP2012023061A (ja) * 2011-11-01 2012-02-02 Fujikura Ltd 防水コネクタ
JP2012038607A (ja) * 2010-08-09 2012-02-23 Tyco Electronics Japan Kk 防水型電気コネクタ、防水型電気コネクタの組み立て方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057065A (ja) * 1999-08-17 2001-02-27 Matsumura Sekiyu Kenkyusho:Kk ハードディスク装置のシール方法及びホットメルト型シーリング剤組成物
JP2001287229A (ja) * 2000-04-05 2001-10-16 Nordson Kk ガスケットの製造方法
JP5349864B2 (ja) * 2008-08-19 2013-11-20 キヤノン株式会社 シール構造及びプロセスカートリッジ
WO2011158873A1 (fr) * 2010-06-16 2011-12-22 旭硝子株式会社 Dispositif électronique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005078035A1 (fr) * 2004-02-18 2005-08-25 Mitsubishi Plastics, Inc. Film de protection adhésif pour matériel électrique
JP2009117285A (ja) * 2007-11-09 2009-05-28 Hitachi Ltd 自動車用電子装置
JP2011014260A (ja) * 2009-06-30 2011-01-20 Yazaki Corp コネクタの一体成形方法
JP2012038607A (ja) * 2010-08-09 2012-02-23 Tyco Electronics Japan Kk 防水型電気コネクタ、防水型電気コネクタの組み立て方法
JP2012023061A (ja) * 2011-11-01 2012-02-02 Fujikura Ltd 防水コネクタ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015157475A (ja) * 2014-01-10 2015-09-03 東洋紡株式会社 シール層含有構造体およびその製造方法
FR3028793A1 (fr) * 2014-11-25 2016-05-27 Plastic Omnium Cie Procede de surmoulage sur un insert plastique et piece automobile obtenue par ce procede
WO2016083712A1 (fr) * 2014-11-25 2016-06-02 Compagnie Plastic Omnium Procede de surmoulage sur un insert plastique et piece automobile obtenue par ce procede
US10843391B2 (en) 2014-11-25 2020-11-24 Compagnie Plastic Omnium Process for overmoulding over a plastic insert and automobile part obtained by this process
FR3114815A1 (fr) * 2020-10-07 2022-04-08 Bostik Sa Composition polyamide
WO2022074331A1 (fr) * 2020-10-07 2022-04-14 Bostik Sa Composition polyamide

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