WO2014010455A1 - シャーシおよびシャーシの製造方法 - Google Patents
シャーシおよびシャーシの製造方法 Download PDFInfo
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- WO2014010455A1 WO2014010455A1 PCT/JP2013/068031 JP2013068031W WO2014010455A1 WO 2014010455 A1 WO2014010455 A1 WO 2014010455A1 JP 2013068031 W JP2013068031 W JP 2013068031W WO 2014010455 A1 WO2014010455 A1 WO 2014010455A1
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- layer
- chassis
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- clad material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/227—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded with ferrous layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/16—Ferrous alloys, e.g. steel alloys containing copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/22—Ferrous alloys and copper or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D2211/00—Microstructure comprising significant phases
- C21D2211/001—Austenite
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D2251/00—Treating composite or clad material
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D2251/00—Treating composite or clad material
- C21D2251/02—Clad material
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0068—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for particular articles not mentioned below
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/12—All metal or with adjacent metals
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- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
- Y10T428/12924—Fe-base has 0.01-1.7% carbon [i.e., steel]
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- Y10T428/12771—Transition metal-base component
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- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12951—Fe-base component
- Y10T428/12972—Containing 0.01-1.7% carbon [i.e., steel]
- Y10T428/12979—Containing more than 10% nonferrous elements [e.g., high alloy, stainless]
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- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
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Definitions
- the present invention relates to a chassis suitable for use in a portable device containing electronic components with heat dissipation, for example, and a method for manufacturing the chassis, and more particularly to a chassis using stainless steel and Cu and a method for manufacturing the chassis.
- Japanese Patent Laid-Open No. 2006-113589 discloses a display device that includes a panel unit and a chassis for fixing and supporting the panel unit.
- the chassis of the display device is formed of stainless steel having a plate thickness of about 0.3 mm to about 0.4 mm, which is a plate thickness of a general chassis. It is thought that there is.
- alumina is contained between the electronic component and the chassis to improve the thermal conductivity.
- a graphite sheet described in Japanese Patent Application Laid-Open No. 2010-215441 or Cu foil that is less expensive than the graphite sheet is bonded to the stainless steel chassis described in Japanese Patent Application Laid-Open No. 2006-113589. It is possible to improve.
- disadvantages such as an increase in the number of parts due to the added graphite sheet or the like and an increase in the thickness of the portable device, and improvement of the heat dissipation performance of the chassis itself has been desired.
- a rectangular fitting part 622 made of a Cu—Mo composite material and a rectangular hole 621a into which the fitting part 622 is press-fitted are formed.
- a heat dissipation substrate 602 including a base material 621 made of SUS304 is disclosed.
- the fitting component 622 of the heat dissipation board 602 is formed such that the upper surface 622a is smaller than the lower surface 622b, and a step 622c is formed on the outer surface.
- the hole 621a of the base material 621 into which the fitting component 622 is press-fitted is formed so as to correspond to the shape of the fitting component 622, and a step 621b is formed on the inner surface of the hole 621a.
- the fitting component 622 and the base material 621 are joined by mutually fitting in the state inserted in the hole 621a of the base material 621 from the downward direction (Z2 side).
- a fitting component 622 made of a Cu—Mo composite material having high thermal conductivity and a base material 621 made of SUS304 having high mechanical strength are provided.
- the steps 622c and 621b with respect to the fitting component 622 and the base material 621 it is necessary to secure a certain thickness in both the fitting component 622 and the base material 621.
- the thickness of a chassis becomes large, and there exists a problem that it becomes difficult to reduce in thickness the portable apparatus etc. in which a chassis is used.
- the fitting component 622 inserted into the hole 621a of the base material 621 may drop off, so that the chassis is structurally There is also a problem that the strength is insufficient.
- the present invention has been made in order to solve the above-mentioned problems and also by considering that the chassis is exposed to the atmosphere.
- One object of the present invention is stainless steel having high mechanical strength and thermal conductivity. Taking advantage of the effectiveness of the prior art using Cu or Cu alloy having a high thickness, a stainless steel portion and a Cu or Cu alloy portion are structurally joined with high strength and a thinned chassis and a method for manufacturing the chassis are provided. It is to be.
- the chassis according to the first aspect of the present invention is formed of a first layer formed of austenitic stainless steel, a second layer formed of Cu or Cu alloy and laminated on the first layer, and austenitic stainless steel,
- the second layer is made of a clad material in which a third layer laminated on the opposite side of the first layer is roll-bonded, and the thickness of the second layer is 15% or more of the thickness of the clad material.
- the first layer and the third layer are formed of austenitic stainless steel, and the second layer formed of Cu or Cu alloy is sandwiched between both layers. It is made of a clad material rolled and joined. The clad material is rolled and joined without forming a step in each layer. Therefore, by applying the clad material to the chassis, the thickness of the chassis can be reduced more than the conventional thickness without providing the step. Further, the chassis to which the clad material is applied does not need to have a fitting structure between parts as shown in FIG. Accordingly, the chassis can be prevented from being damaged due to an external force received in a normal usage pattern without fear of dropping off a part of the chassis.
- the “chassis” in the present invention refers to an application that requires good heat dissipation performance and high mechanical strength.
- portable devices such as a chassis for protecting a display unit for displaying an image from an external impact and a chassis for protecting an integrated circuit mounted on a substrate of the portable device.
- the chassis is included.
- a chassis for improving the mechanical strength of the entire portable device such as a frame of the portable device, a chassis having a lead function for electrical connection, a chassis for blocking electromagnetics, and the like are also included. .
- the thickness of the second layer may be somewhat larger than 15% within a range in which a decrease in mechanical strength is allowed practically, and the thickness of the second layer is, for example, 80% or less of the thickness of the clad material. Therefore, it is considered that excellent heat dissipation performance can be obtained.
- the first layer and the third layer are formed of austenitic stainless steel, and unlike the case where the first layer and the third layer are formed of ferromagnetic ferritic stainless steel or martensitic stainless steel, Magnetization (magnetization) of the first layer and the third layer can be suppressed. Thereby, it can suppress that a malfunction arises in the portable apparatus etc. in which a chassis is used resulting from the magnetic force of the magnetized 1st layer and 3rd layer. Further, unlike the case where the first layer and the third layer are formed of ferritic stainless steel, it is possible to suppress the occurrence of rust on the first layer and the third layer.
- a preferable lower limit of the thickness of the second layer is 20% or more of the thickness of the cladding material, and a more preferable lower limit is 30% or more of the thickness of the cladding material. If comprised in this way, since the ratio for which Cu or Cu alloy whose heat conductivity is better than stainless steel will occupy increases, further better heat dissipation performance can be obtained. This point has also been confirmed by the inventor's measurement described later.
- the preferable upper limit of the thickness of the second layer is 60% or less of the thickness of the cladding material, and the more preferable upper limit is 50% or less of the thickness of the cladding material. If comprised in this way, the thickness of the 1st layer and 3rd layer which are formed with austenitic stainless steel with high mechanical strength can fully be ensured. For example, when evaluated with 0.2% proof stress, a mechanical strength of about 400 MPa, which is generally required from the viewpoint of preventing deformation of the chassis, or a high mechanical strength exceeding this can be obtained.
- the first layer and the third layer are made of amber austenitic stainless steel.
- the average value of the thickness of the third layer is preferably 95% or more and 105% or less of the average value of the thickness of the first layer. If comprised in this way, a chassis can be made into a substantially symmetrical structure in the thickness direction. That is, since the same material (austenitic stainless steel) and substantially the same thickness can be used, it is not necessary to distinguish between the front and the back of the chassis, and the handling in the manufacturing process can be facilitated.
- the characteristics of the first layer and the third layer can be obtained at the time of forming a clad material or during press working. It is possible to reduce the risk of occurrence of problems in manufacturing and processing the chassis due to the difference in characteristics.
- the thickness of the clad material can be reduced to 0.3 mm or less. Even when the chassis is thinned in this way, good heat dissipation performance by the second layer occupying 15% or more of the thickness of the clad material, and high mechanical properties by the first and third layers made of austenitic stainless steel Depending on the strength, it is possible to obtain a chassis that has both heat radiation performance and mechanical strength that can withstand practical use.
- the first layer and the third layer are made of austenitic stainless steel and the second layer is made of Cu. If comprised in this way, the thermal radiation performance of a chassis can be improved more by the 2nd layer formed with Cu with higher heat conductivity.
- SUS304 which is generally used and is easy to obtain and recycle.
- SUS304 is demagnetized by a heat treatment or the like performed in the manufacturing process, although the structure may become martensite and become magnetized due to processing such as formation of a clad material or press processing. We estimate that the resulting chassis is very unlikely to be magnetized.
- SUS301 for the first layer and the third layer that are made of the same material. Like SUS304, SUS301 is easy to obtain and recycle, and since mechanical strength is higher than SUS304 as will be described later, the mechanical strength of the chassis can be improved. It should be noted that SUS301 having a smaller amount of Ni than SUS304 is similarly estimated to have a low possibility of being magnetized.
- a surface metal layer is formed on at least a part of the surface of the chassis. If comprised in this way, in a chassis, improvement of corrosion resistance, reduction of contact resistance, improvement of solderability, etc. can be aimed at by a surface metal layer. More preferably, a surface metal layer is formed on substantially the entire surface of the chassis. As a result, it is possible to improve the corrosion resistance, reduce the contact resistance, improve the solderability, etc. over substantially the entire surface of the chassis.
- the surface metal layer is preferably formed by plating on at least a part of the surface of the chassis.
- a surface metal layer can be formed easily.
- the plating method may be electrolytic plating or electroless plating.
- the surface metal layer is preferably roll-bonded to at least a part of the chassis. If comprised in this way, in addition to a 1st layer, a 2nd layer, and a 3rd layer, a surface metal layer is also roll-bonded together, and it is separately attached to the cladding material consisting of a 1st layer, a 2nd layer, and a 3rd layer Since the process of forming the surface metal layer is not necessary, the manufacturing process can be simplified and the productivity can be improved.
- the surface metal layer of at least a part of the chassis is preferably a surface metal layer (for example, a plating layer) made of Sn or Sn alloy.
- a chassis that does not have a surface metal layer (Sn-based surface metal layer) of Sn or Sn alloy is soldered to a support portion or the like, Sn contained in the solder may grow abnormally (whiskers).
- Sn-based surface metal layer is formed on at least a part of the surface of the chassis involved in soldering. It is more preferable that this Sn-based surface metal layer has substantially the entire front and back surfaces (both surfaces) made of austenitic stainless steel of the chassis in consideration of productivity and the like.
- the surface metal layer is preferably made of Ni or Ni alloy. If comprised in this way, it can suppress that the electrical resistance (contact resistance) in the contact part of a chassis and another member becomes large with the surface metal layer (Ni-type surface metal layer) which consists of Ni or Ni alloy. Therefore, it can be used not only as a structural member for protecting the chassis from a heat radiating member or an impact, but also as a current path for grounding an electric circuit. That is, the chassis can be used more effectively. Moreover, the corrosion resistance of a chassis can be improved by having the surface metal layer which consists of Ni or Ni alloy with high corrosion resistance on the surface of a chassis.
- a surface metal layer made of Ni or Ni alloy is preferably formed on at least a portion of the chassis connected to the circuit.
- the surface metal layer made of Ni or Ni alloy is provided on substantially the entire front and back surfaces (both surfaces) in consideration of productivity.
- the chassis of the present invention can be used as a chassis of a portable device that contains electronic components with heat dissipation.
- the portable device can be reduced in size (thinned) and reduced in weight by at least a reduction in the thickness of the chassis.
- heat from the electronic component that easily generates heat can be efficiently radiated through the chassis of the present invention, heat storage in the electronic component is suppressed, and malfunction of the electronic component due to heat storage can be suppressed.
- heat from the electronic component can be radiated more efficiently.
- the “electronic component” includes not only a component that uses power such as a display or an integrated circuit (IC) but also a component that supplies power such as a battery.
- the chassis manufacturing method includes a first layer formed of austenitic stainless steel, a second layer formed of Cu or Cu alloy, and a third layer formed of austenitic stainless steel. Are laminated in this order, and a step of forming the clad material so that the thickness of the second layer is 15% or more of the thickness of the clad material by rolling joining. It includes a step of rolling in a state where the first layer, the second layer, and the third layer are laminated, and a step of diffusion annealing the clad material.
- the manufacturing method of the chassis according to the second aspect of the present invention includes the first layer formed of austenitic stainless steel, the second layer formed of Cu or Cu alloy, and the austenitic stainless steel.
- the clad material is formed by rolling joining so that the thickness of the second layer is 15% or more of the thickness of the clad material.
- the clad material is rolled and joined without forming a step in each layer. Therefore, by applying the clad material to the chassis, the thickness of the chassis can be reduced more than the conventional thickness without providing the step.
- a manufacturing method capable of suppressing damage to the chassis due to external force received in a normal use mode without fear of dropping off a part of the chassis. Can do.
- the step of forming the clad material includes a step of rolling in a state where the first layer, the second layer, and the third layer are laminated, and a step of diffusion annealing the clad material. Even when the first layer and the third layer formed of austenitic stainless steel are martensite and become magnetic, they can be demagnetized in the diffusion annealing step. Thereby, it can suppress that the magnetized chassis is manufactured.
- the step of rolling in a state where the first layer, the second layer, and the third layer are laminated, and the step of diffusion annealing the clad material It is performed several times alternately. Accordingly, even when the clad material is gradually rolled and thinned by performing a plurality of rolling processes, it can be demagnetized in the subsequent diffusion annealing process, so that a magnetized chassis is manufactured. Can be reliably suppressed.
- austenitic stainless steel known to have excellent corrosion resistance
- Cu or Cu alloy known to have good thermal conductivity.
- it is suitable for a chassis for a portable device in which an electronic component with heat dissipation is included.
- FIG. 10 is a cross-sectional view for explaining the prior art disclosed in Japanese Patent Laid-Open No. 2007-12928.
- the display 1, the chassis 2, the substrate 3, and the battery 4 are arranged in this order from the top (Z1 side).
- the display 1, the chassis 2 and the substrate 3 are formed in a substantially rectangular shape having a length L1 of about 100 mm in the longitudinal direction and a length L2 of about 50 mm in the lateral direction when viewed in a plan view. Yes.
- the battery 4 is formed in a rectangular shape smaller than the substrate 3 when viewed in plan.
- the display 1 includes a liquid crystal display, an organic EL display, and the like, and has a function of displaying an image on the upper surface on the Z1 side.
- the lower surface of the display 1 on the Z2 side is in contact (contact) with the upper surface of the chassis 2 on the Z1 side. That is, the display 1 is arranged in the vicinity of the chassis 2.
- the display 1 generates heat when displaying an image, and the heat generated in the display 1 is configured to be released to the outside mainly through the chassis 2.
- the display 1 is an example of the “electronic component” in the present invention.
- the chassis 2 is made of a substantially rectangular plate material having a thickness t1 of about 0.3 mm in the Z direction.
- the chassis 2 has a function of protecting the display 1 from an external impact and a function of releasing heat from the display 1 and the CPU 31 to the outside.
- the battery 4 has a function of supplying power to the display 1, the substrate 3, and the like, and is disposed on the lower surface of the substrate 3 on the Z2 side.
- a CPU 31 for executing a program for controlling the mobile device 100 is provided on the upper surface of the substrate 3 on the Z1 side.
- the upper surface of the CPU 31 on the Z1 side is in contact (contact) with the lower surface of the chassis 2 on the Z2 side. That is, the CPU 31 is disposed in the vicinity of the chassis 2.
- the CPU 31 generates heat when a program for controlling the entire portable device 100 is executed, and heat generated in the CPU 31 is configured to be released to the outside mainly through the chassis 2. Yes.
- the CPU 31 is an example of the “electronic component” in the present invention.
- the chassis 2 includes a SUS (Steel Use Stainless) layer 21, a Cu layer 22 laminated on the lower surface of the SUS layer 21 on the Z2 side, and a Cu layer 22. It is composed of a three-layer clad material in which the SUS layer 23 laminated on the lower surface on the Z2 side (the side opposite to the upper surface on the Z1 side on which the SUS layer 21 is laminated) is pressure-welded.
- the SUS layers 21 and 23 and the Cu layer 22 are firmly bonded to each other by roll bonding.
- the SUS layer 21, the Cu layer 22, and the SUS layer 23 are examples of the “first layer”, “second layer”, and “third layer” of the present invention, respectively.
- Both the SUS layer 21 and the SUS layer 23 are formed of SUS304 or SUS301, which are austenitic stainless steel. That is, the SUS layer 21 and the SUS layer 23 are formed of austenitic stainless steel having the same material such as chemical components and structure. Note that SUS304 and SUS301 are non-magnetic in terms of material, and usually have a property of not being magnetized.
- the Cu layer 22 is made of Cu having a purity of 99.9% or more, such as oxygen-free copper, tough pitch copper, and phosphorus deoxidized copper.
- SUS304 and SUS301 have a thermal conductivity of about 15 W / (mxK).
- Cu has a thermal conductivity of about 400 W / (m ⁇ K). That is, Cu has higher thermal conductivity than SUS304 and SUS301.
- SUS304 has a 0.2% proof stress of about 840 MPa
- SUS301 has a 0.2% proof strength equivalent to or slightly higher than SUS304.
- Cu has a 0.2% proof stress of about 200 MPa. That is, SUS304 and SUS301 have higher mechanical strength than Cu.
- the SUS layer 21, the Cu layer 22, and the SUS layer 23 have thicknesses t2, t3, and t4 in the Z direction, respectively.
- the thickness t2 of the SUS layer 21 and the thickness t4 of the SUS layer 23 are substantially equal.
- the interfaces of the SUS layer 21, the Cu layer 22, and the SUS layer 23 are not flat surfaces and may be formed so as to wave. In such a case, when the average value of the thickness t2 of the SUS layer 21 is 95% or more and 105% or less of the average value of the thickness t4 of the SUS layer 23, in actual production, There is no problem even if the thickness t2 and the thickness t4 of the SUS layer 23 are regarded as substantially the same.
- the plate thickness ratio of the thickness t3 of the Cu layer 22 is preferably about 20% or more of the thickness t1 of the chassis 2, and more preferably about 30% or more of the thickness t1 of the chassis 2.
- the plate thickness ratio of the thickness t3 of the Cu layer 22 is preferably about 60% or less of the thickness t1 of the chassis 2, and more preferably about 50% or less of the thickness t1 of the chassis 2.
- a SUS plate 121 and a SUS plate 123 formed of either SUS304 or SUS301, and a Cu plate 122 formed of Cu are prepared.
- the thickness of the SUS plate 121 and the thickness of the SUS plate 123 are substantially equal, and the thickness of the Cu plate 122 is the sum of the thickness of the SUS plate 121, the thickness of the Cu plate 122, and the thickness of the SUS plate 123.
- the thickness of each plate material is adjusted so as to be 15% or more.
- the roller 105 is used for continuous rolling joining at a rolling reduction of about 60%.
- the clad material 102 having a thickness of about 1 mm and having the SUS layer 21, the Cu layer 22, and the SUS layer 23 laminated in this order is continuously formed.
- the formed clad material 102 is diffusion-annealed in a reducing atmosphere of about 1000 ° C. Then, the clad material 102 is continuously rolled until the thickness becomes about 1/3 (target value: 0.33 mm). In addition, after the clad material 102 is diffusion-annealed again in a reducing atmosphere at about 1000 ° C., the rolling is continuously performed at a rolling reduction of about 10%. Thereby, the clad material 102 having a thickness t1 (see FIG. 3) of about 0.3 mm is continuously formed.
- the structure may become martensite and become magnetized due to the processing. However, since it is demagnetized through the diffusion annealing, it can be said that no particular problem occurs.
- the chassis 2 is manufactured.
- the chassis 2 is processed into a predetermined shape by pressing or the like.
- the chassis 2 includes the SUS layer 21, the Cu layer 22 stacked on the lower surface of the SUS layer 21 on the Z2 side, and the SUS layer stacked on the lower surface of the Cu layer 22 on the Z2 side.
- the clad material is composed of a three-layer clad material that is pressure-welded to 23. Thereby, each layer can be joined without forming a step, and the thickness t1 of the chassis 2 can be reduced. As a result, the portable device 100 can be reduced in size (thinned) or reduced in weight by at least a reduction in the thickness t1 of the chassis 2. Further, since it is not necessary to have a fitting structure as shown in FIG. 14, the chassis 2 can be prevented from being damaged due to an external force received in a normal usage mode without fear of dropping off a part of the chassis 2. .
- each layer since each layer is laminated
- SUS304 or SUS301 which is austenitic stainless steel having high mechanical strength, is located on both sides of the chassis 2 on the Z1 side and the Z2 side, the mechanical strength of the chassis 2 can be easily improved. Moreover, since corrosion resistance can be provided to the surface of the chassis 2, the malfunction resulting from magnetization or rust can be suppressed.
- the thickness t3 of the Cu layer 22 is 15% or more of the thickness t1 of the chassis 2 to ensure a sufficient thickness t3 of the Cu layer 22 formed of Cu having excellent thermal conductivity. Therefore, the heat from the CPU 31 can be quickly dispersed and dissipated throughout the chassis 2. Thereby, since heat can be radiated from the entire chassis 2 to the outside, a good heat radiation performance can be obtained.
- the thickness t3 of the Cu layer 22 is preferably 60% or less of the thickness t1 of the chassis 2, and more preferably 50% or less of the thickness t1 of the chassis 2.
- the thickness t2 of the SUS layer 21 and the thickness t4 of the SUS layer 23 formed by SUS304 or SUS301 having heat dissipation characteristics by the Cu layer 22 and high mechanical strength are sufficiently secured. be able to.
- the SUS layers 21 and 23 are formed of SUS304 or SUS301, which is a nonmagnetic austenitic stainless steel, so that the SUS layers 21 and 23 are magnetized (magnetized). Can be suppressed. Therefore, it can suppress that a malfunction arises in a portable apparatus resulting from the magnetic force by the magnetization of a chassis. That is, the magnetization of the SUS layers 21 and 23 finally formed in the chassis 2 is suppressed. Moreover, according to the SUS layers 21 and 23 made of austenitic stainless steel having good corrosion resistance, the occurrence of rust can be suppressed. Furthermore, since SUS304 or SUS301 that can be easily obtained is used for the SUS layers 21 and 23, the manufacturing cost of the chassis 2 can be reduced.
- the thickness t3 of the Cu layer 22 is about 20% or more of the thickness t1 of the chassis 2, better heat dissipation performance can be obtained, and the thickness t3 of the Cu layer 22 is equal to the thickness t1 of the chassis 2. If it is about 30% or more, even better heat dissipation performance can be obtained.
- the SUS layers 21 and 23 are made of austenitic stainless steel having the same material such as chemical composition and structure, and the thickness t2 of the SUS layer 21 and the thickness t4 of the SUS layer 23 are substantially equal. Therefore, the front and back of the chassis 2 need not be distinguished, and handling in the manufacturing process can be facilitated. Further, since the processing characteristics of the SUS layer 21 and the SUS layer 23 can be made substantially equal, the processing characteristics of the SUS layer 21 and the SUS layer 23 are different at the time of forming the clad material 102 or at the time of pressing. This can reduce the risk of problems in the production and processing of the chassis 2 due to the above.
- the thickness of the clad material can be set to 0.3 mm as described above, and thus the thickness t1 of the chassis 2 is sufficiently thinned by using this clad material. 100 can be easily reduced in thickness and weight. Moreover, the thermal conductivity of the chassis 2 can be effectively improved by forming the Cu layer 22 with Cu having a higher thermal conductivity.
- the SUS layers 21 and 23 are formed by SUS304 having a larger amount of Ni than SUS301, it is advantageous from the viewpoint that it is difficult to magnetize when forming the clad material 102 or during press working. That is, it is easier to suppress magnetization of the chassis 2 finally obtained by using SUS304 than SUS301 for the SUS layers 21 and 23.
- the mechanical strength can be improved while ensuring the heat dissipation performance of the chassis 2. This will be described later with reference to FIG.
- the heat from the display 1 and the CPU 31 is effectively transmitted from the chassis 2 by arranging the display 1 and the CPU 31 in the vicinity of the chassis 2 having a good heat dissipation performance. It can dissipate heat. Furthermore, heat from the display 1 or the CPU 31 can be radiated from the chassis 2 more effectively by bringing the display 1 or the CPU 31 into contact with the chassis 2 having good heat dissipation performance. Thereby, since it can suppress that heat is accumulate
- the formed cladding material 102 is diffusion-annealed in a reducing atmosphere at about 1000 ° C. Then, the clad material 102 is continuously rolled until it has a thickness of about 1/3. In addition, after the clad material 102 is diffusion-annealed again in a reducing atmosphere at about 1000 ° C., the rolling is continuously performed at a rolling reduction of about 10%.
- the chassis 2 of the above embodiment shown in FIG. 3 was used. Specifically, as Examples 1 to 8 (see FIG. 7), a SUS layer 21 formed of SUS304, a Cu layer 22 formed of Cu, and a SUS layer 23 formed of SUS304 are stacked in this order. The chassis 2 made of the clad material was used. Further, as Examples 9 to 13 (see FIG. 8), a clad in which a SUS layer 21 formed of SUS301, a Cu layer 22 formed of Cu, and a SUS layer 23 formed of SUS301 are stacked in this order. A chassis 2 made of a material was used.
- the ratio of the thickness t3 of the Cu layer 22 to the thickness t1 of the chassis 2 (Cu plate thickness ratio) is 15.0% and 20.0%, respectively. 30.0%, 34.0%, 42.8%, 50.0%, 55.6% and 60.0%.
- the ratio of the thickness t3 of the Cu layer 22 (Cu plate thickness ratio) is 34.0%, 42.8%, 50.0%, 55.6% and 60.0%.
- Comparative Example 1 a single plate material of SUS304 having a thickness of 0.3 mm was used.
- Comparative Example 2 as in Examples 1 to 8, the SUS layer formed of SUS304, the Cu layer formed of Cu, and the SUS layer formed of SUS304 are A plate material made of a three-layer clad material having a thickness of 0.3 mm, which was sequentially laminated, was used. In Comparative Example 2, the Cu plate thickness ratio was set to 14.0%.
- Comparative Example 3 a single Cu plate having a thickness of 0.3 mm was used.
- Comparative Example 4 see FIG.
- Comparative Example 5 a single plate material of SUS304 having a thickness of 0.4 mm larger than the thickness (0.3 mm) of Comparative Example 1 was used.
- Comparative Example 6 as shown in FIG. 5, a Cu foil layer 202a made of SUS304 having a thickness t5 of 0.4 mm and having a thickness t6 of 30 ⁇ m is formed on the upper surface on the Z1 side. The plate material 202 was used. In Comparative Example 6, the Cu foil layer 202a was formed in order to improve the heat dissipation performance of the plate material 202.
- the ratio of the thickness t6 of the Cu foil layer 202a to the thickness t5 of the plate material 202 (Cu foil thickness / SUS304 thickness) is 7.5%.
- Heat dissipation performance In order to evaluate the heat dissipation performance, the temperature distribution was observed for each chassis 2 of Examples 1 to 13 and the plate materials of Comparative Examples 1 to 6 when a heat generation source was arranged on the surface. Specifically, as shown in FIG. 6, each of Examples 1 to 13 having a length L1 of 100 mm in the longitudinal direction (X direction) and a length L2 of 50 mm in the short direction (Y direction). Chassis 2 and the plate materials of Comparative Examples 1 to 6 were prepared. And the heater 31a corresponding to CPU31 (refer FIG. 2) which is a heat source of this embodiment was affixed on the lower surface by the side of Z2 of each chassis 2 or board
- the heater 31a was heated by supplying 1 W of power to the heater 31a. And the temperature distribution of the chassis 2 and board
- the temperature difference was 20 ° C. or more.
- Comparative Example 2 in which the Cu plate thickness ratio was less than 15.0% (14.0%), the temperature difference was less than 20 ° C. (19.4 ° C.).
- the temperature difference (19.4 ° C.) generated in Comparative Example 2 is the temperature difference (20.6) generated in Comparative Example 5 having a thickness (0.4 mm) larger than that of Comparative Example 1 (0.3 mm). ° C).
- the plate material of Comparative Example 2 was found to be inferior in heat dissipation performance to the plate material of Comparative Example 5 having a larger thickness, although an improvement in heat dissipation performance was recognized as compared with the plate material of Comparative Example 1 having the same thickness. did. As a result, it is considered that the plate material of Comparative Example 2 is insufficient to obtain good heat dissipation performance while reducing the thickness. On the other hand, it was confirmed that each of the chassis 2 of Examples 1 to 13 and the plate material of Comparative Example 3 can obtain good heat dissipation performance while reducing the thickness.
- Example 1 the temperature difference (21.3 ° C.) generated in Example 1 is slightly different from the temperature difference (21.7 ° C.) generated in Comparative Example 4 in which the graphite sheet was bonded, and Examples 2 to 13 and The temperature difference produced in Comparative Example 3 was clearly greater than the temperature difference produced in Comparative Example 4. From this, it was confirmed that the chassis 2 of each of Examples 1 to 13 and the plate material of Comparative Example 3 can obtain good heat dissipation performance while reducing the thickness.
- the temperature difference was 30 ° C. or more.
- This temperature difference is the temperature difference (28.8 ° C.) generated in Comparative Example 6 in which the Cu foil layer 202a (see FIG. 5) for improving the heat dissipation performance is formed and has a large thickness (0.4 mm). Obviously bigger than.
- the chassis 2 of each of Examples 3 to 13 and the plate material of Comparative Example 3 can obtain sufficient heat dissipation performance without providing a Cu foil layer for improving the heat dissipation performance. It was confirmed that it was possible to obtain even better heat dissipation performance while reducing the size.
- the Cu plate thickness ratio that is, the ratio of the thickness of the Cu layer (second layer) to the thickness of the clad material increases. It was confirmed that the rate of increase in temperature difference from Comparative Example 1 was small. Further, from the results of Examples 4 to 7 and Examples 9 to 12 shown in FIGS. 7 to 9, when the SUS layers 21 and 23 are formed of SUS304, compared to the case where the SUS layers 21 and 23 are formed of SUS301, The temperature difference is slightly smaller. However, this degree of change is not recognized as a clear difference, and it has been confirmed that the material of austenitic stainless steel does not significantly affect the superiority or inferiority of the heat dissipation performance.
- the 0.2% proof stress of each chassis 2 and plate material decreased as the Cu plate thickness ratio increased.
- the 0.2% proof stress was 400 MPa or more.
- the 0.2% proof stress (395 MPa) of Example 8 is estimated to be a manufacturing variation although it is less than 400 MPa.
- Comparative Example 3 in which the Cu plate thickness ratio was larger than 60% (100.0%), the 0.2% proof stress was less than 400 MPa (210 MPa). Thereby, it is considered that the plate material of Comparative Example 3 is insufficient to obtain a high mechanical strength while reducing the thickness.
- the respective chassis 2 of Examples 1 to 13 and the plate members of Comparative Examples 1 and 2 can obtain high mechanical strength while reducing the thickness.
- the 0.2% proof stress is higher than when the SUS layers 21 and 23 are formed from SUS304. Slightly larger.
- the 0.2% yield strength (649 MPa) of Example 9 (SUS301) is greater than the 0.2% yield strength (583 MPa) of Example 4 (SUS304). It increased by 66 MPa.
- the chassis 2 having higher mechanical strength can be obtained by forming the SUS layers 21 and 23 from SUS301.
- each of the chassis 2 of Examples 1 to 13 having a Cu plate thickness ratio of 15.0% or more can obtain good heat dissipation performance while reducing the thickness.
- each of the chassis 2 of Examples 3 to 5 and Examples 9 to 11 having a Cu plate thickness ratio of 30.0% or more can obtain a better heat dissipation performance while reducing the thickness.
- the upper limit of the preferred Cu plate thickness ratio is 60% or less, and more preferably 50% or less, for realizing a chassis having the above-described good heat dissipation performance and higher mechanical strength. There was found.
- the battery 304 is disposed so as to be adjacent to the substrate 303 in the short direction (Y direction) as in the mobile device 300 of the first modification of the embodiment shown in FIG. Both may be configured to abut against the chassis 2. Thereby, not only the heat from the display 1 and the CPU 31 but also the heat from the battery 304 can be efficiently released from the chassis 2.
- the battery 304 is an example of the “electronic component” in the present invention.
- the present invention is not limited to this.
- the CPU does not have to contact the chassis.
- a frame-shaped support portion 433 that surrounds the CPU 31 is joined to the upper surface (the surface on the Z1 side) of the substrate 403 using the solder 432.
- the chassis 402 may be fixed to the support portion 433 so that the lower surface (Z2 side surface) of the lid-like chassis 402 made of the three-layer clad material comes into contact with the upper surface of the support portion 433.
- the chassis 402 having good heat dissipation performance and high mechanical strength is disposed in the vicinity of the CPU 31, so that the substrate 403 is provided while effectively radiating heat from the CPU 31 that easily generates heat from the chassis 402. It is possible to ensure the mechanical strength of the mobile terminal.
- the support portion 433 is preferably formed of austenitic stainless steel such as SUS304.
- an Sn-based plating layer 402b on the surface of the chassis 402.
- the chassis 402 can be attached to the support portion 433 mechanically by screws or caulking, but is often soldered in the field of electronic components.
- Sn contained in the solder may grow abnormally (whiskers). Therefore, it is preferable to form the Sn-based plating layer 402b on at least the portion of the chassis 402 that is involved in soldering.
- the Sn-based plating layer 402b may be formed on the surface of the clad material before being formed on the chassis 402, or may be formed on the surface of the chassis 402 after forming the shape of the chassis 402. In consideration of productivity and jigs and tools required for plating formation, it is preferable to form the Sn-based plating layer 402b on the entire front and back surfaces (both surfaces) of the austenitic stainless steel of the chassis 402. In addition, as Sn system plating, what consists of Sn or a Sn alloy can be applied, and what consists of Sn of 99% or more of purity is more preferable.
- the Sn-based plating layer 402b is an example of the “surface metal layer” in the present invention.
- the Ni layer 502b may be formed over substantially the entire surface of the chassis 502, as in the third modification of the embodiment shown in FIG.
- the Ni layer 502b may be formed by plating, or by rolling and joining the Ni layer, the first layer, the second layer, the third layer, and the Ni layer in this order, the chassis as a clad material It may be formed integrally with 502. As a result, it is possible to suppress an increase in electrical resistance (contact resistance) at the contact portion between the chassis 502 and the electric circuit, so that the chassis 502 is used as a current circuit for grounding the electric circuit.
- the Ni layer 502b may be formed at least on the surface of the chassis 502 at a position in contact with the electronic component of the portable device. Further, the corrosion resistance of the chassis 502 can be improved by the Ni layer 502b. Further, as the metal material constituting the Ni layer 502b, a material made of Ni or a Ni alloy such as a Ni—P alloy can be applied.
- the Ni layer 502b is an example of the “surface metal layer” in the present invention.
- the chassis 2 is provided in the portable device 100 including the display 1
- the present invention is not limited thereto.
- the chassis may be provided in a portable router that does not have a display. In this case, it is possible to efficiently release the heat from the battery of the router and the CPU through the chassis. Further, the chassis may be used for a stationary small device.
- produce was shown, and in the said modification, the example which uses the display 1, CPU31 and the battery 304 as an electronic component which is easy to generate
- the invention is not limited to this.
- an electronic component such as a power supply circuit may be used as the electronic component that easily generates heat.
- the present invention is not limited to this.
- chassis of the present invention can also be configured by using a plurality of chassis members made of a three-layer clad material.
- the SUS layer 21 (first layer) and the SUS layer 23 (third layer) are both formed of SUS304 or both of them are formed of SUS301. It is not limited to this.
- the first layer and the third layer may be formed of austenitic stainless steel other than SUS304 or SUS301.
- the first layer and the third layer may be formed of different austenitic stainless steels. For example, some combinations such as SUS304 and SUS301, SUS316 and SUS304, etc. can be considered according to usage conditions.
- the Cu layer 22 is formed of Cu having a purity of 99.9% or more.
- the present invention is not limited to this.
- the Cu layer may be formed of a Cu alloy having a purity of 97% or more, such as C19400 (CDA standard) made of Cu-2.30Fe-0.10Zn-0.03P. Since these Cu alloys have higher mechanical strength than Cu, the mechanical strength of the chassis can be further improved.
- a Cu foil layer may be formed on the upper surface of the chassis of the present invention as in Comparative Example 6 shown in FIG. 5, and the thermal conductivity for bonding the display on the upper surface of the chassis of the present invention.
- An adhesive sheet may be disposed. If it is a chassis which has such a structure, it can be guessed that the usefulness in a market further increases as a thin chassis which has the outstanding heat dissipation performance.
- the present invention is not limited to this.
- the CPU and the chassis may be bonded via an adhesive, or the CPU and the chassis may be arranged via other members.
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Abstract
Description
次に、図2、図3、図5~図10を参照して、本発明の効果を確認するために行った放熱性能の測定と機械的強度の測定とについて説明する。なお、特段の記載がない限り、「厚み」や「板厚」は平均値を意図する。
放熱性能の評価のため、実施例1~13のそれぞれのシャーシ2と、比較例1~6のそれぞれの板材について、その表面上に発熱源を配置した場合の温度分布を観察した。具体的には、図6に示すように、長手方向(X方向)に100mmの長さL1を有するとともに、短手方向(Y方向)に50mmの長さL2を有する実施例1~13のそれぞれのシャーシ2と比較例1~6のそれぞれの板材とを準備した。そして、本実施形態の発熱源であるCPU31(図2参照)に対応するヒータ31aを、それぞれのシャーシ2や板材のZ2側の下面上に張り付けた。このヒータ31aは、X方向およびY方向に10mmの長さL3を有している。なお、比較例4および比較例6では、ヒータ31aをZ1側の上面とは反対側のZ2側の下面に張り付けた。
また、機械的強度の評価のために、実施例1~13のそれぞれのシャーシ2と比較例1~6のそれぞれの板材について、応力ひずみ線図を測定して、0.2%の永久ひずみが生じる際の応力(0.2%耐力)を求めた。
2、402 シャーシ
21 SUS層(第1層)
22 Cu層(第2層)
23 SUS層(第3層)
31 CPU(電子部品)
100、300 携帯機器
304 電池(電子部品)
402b Sn系メッキ層(表面金属層)
502b Ni層(表面金属層)
Claims (20)
- オーステナイト系ステンレスにより形成される第1層(21)と、CuまたはCu合金により形成され、前記第1層に積層される第2層(22)と、オーステナイト系ステンレスにより形成され、前記第2層の前記第1層とは反対側に積層される第3層(23)とが圧延接合されたクラッド材からなり、前記第2層の厚みは、前記クラッド材の厚みの15%以上である、シャーシ。
- 前記第2層の厚みは、前記クラッド材の厚みの20%以上である、請求項1に記載のシャーシ。
- 前記第2層の厚みは、前記クラッド材の厚みの30%以上である、請求項2に記載のシャーシ。
- 前記第2層の厚みは、前記クラッド材の厚みの60%以下である、請求項1に記載のシャーシ。
- 前記第2層の厚みは、前記クラッド材の厚みの50%以下である、請求項4に記載のシャーシ。
- 前記第1層および前記第3層は、オーステナイト系ステンレスにより形成されており、前記第3層の厚みの平均値は、前記第1層の厚みの平均値の95%以上105%以下である、請求項1に記載のシャーシ。
- 前記クラッド材の厚みは、0.3mm以下である、請求項1に記載のシャーシ。
- 前記第1層および前記第3層は、オーステナイト系ステンレスにより形成され、前記第2層は、Cuにより形成される、請求項1に記載のシャーシ。
- 前記第1層および前記第3層は、SUS304により形成される、請求項8に記載のシャーシ。
- 前記第1層および前記第3層は、SUS301により形成される、請求項8に記載のシャーシ。
- 放熱を伴う電子部品(1)を内在する携帯機器(100)の前記シャーシとして用いられる、請求項1に記載のシャーシ。
- 前記シャーシに、放熱を伴う前記電子部品が接触している、請求項11に記載のシャーシ。
- 前記シャーシの少なくとも一部分に対して、表面金属層(402b、502b)を有している、請求項1に記載のシャーシ。
- 前記シャーシの略全面に対して、前記表面金属層を有している、請求項13に記載のシャーシ。
- 前記シャーシの少なくとも一部分に対して、メッキによる前記表面金属層を有している、請求項13に記載のシャーシ。
- 前記シャーシの少なくとも一部分に対して、圧延接合による前記表面金属層を有している、請求項13に記載のシャーシ。
- 前記表面金属層(402b)は、SnまたはSn合金からなる、請求項13に記載のシャーシ。
- 前記表面金属層(502b)は、NiまたはNi合金からなる、請求項13に記載のシャーシ。
- オーステナイト系ステンレスにより形成される第1層(21)と、CuまたはCu合金により形成される第2層(22)と、オーステナイト系ステンレスにより形成される第3層(23)とがこの順番で積層された状態で、圧延接合により、前記第2層の厚みがクラッド材(102)の厚みの15%以上になるように前記クラッド材を形成する工程を備え、
前記クラッド材を形成する工程は、前記第1層と前記第2層と前記第3層とを積層させた状態で圧延する工程と、前記クラッド材を拡散焼鈍する工程とを含む、シャーシの製造方法。 - 前記第1層と前記第2層と前記第3層とを積層させた状態で圧延する工程と、前記クラッド材を拡散焼鈍する工程とは、交互に複数回行われる、請求項19に記載のシャーシの製造方法。
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