WO2013189463A2 - 散热装置及终端 - Google Patents

散热装置及终端 Download PDF

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Publication number
WO2013189463A2
WO2013189463A2 PCT/CN2013/082873 CN2013082873W WO2013189463A2 WO 2013189463 A2 WO2013189463 A2 WO 2013189463A2 CN 2013082873 W CN2013082873 W CN 2013082873W WO 2013189463 A2 WO2013189463 A2 WO 2013189463A2
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WIPO (PCT)
Prior art keywords
heat dissipation
terminal
cover
heat
circuit board
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PCT/CN2013/082873
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English (en)
French (fr)
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WO2013189463A3 (zh
Inventor
肖华
Original Assignee
中兴通讯股份有限公司
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Publication of WO2013189463A2 publication Critical patent/WO2013189463A2/zh
Publication of WO2013189463A3 publication Critical patent/WO2013189463A3/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to terminal application technologies, and in particular, to a heat dissipation device and a terminal for a terminal. Background technique
  • terminals especially smart terminals based on third-generation mobile communication technologies and long-term evolution systems, have higher internal frequencies of main chips, faster memory access speeds, and RF power amplifiers. And power management power consumption is also correspondingly higher and higher, therefore, the heat treatment of the terminal is particularly important.
  • FIG. 1 is a schematic structural view of a printed circuit board (PCB) of a terminal in the related art
  • FIG. 2 is a schematic structural view of a shield cover of a terminal in the related art
  • these high-power devices such as a CPU inside the terminal are known.
  • Devices such as cores, power management and power consumption are generating more and more heat, while other components are usually less hot than the heat generated by these high-power devices, which causes local overheating of the terminals;
  • the embodiment of the invention provides a heat dissipating device and a terminal applied to the terminal, which solves the problem of local overheating of the terminal in the prior art.
  • Embodiments of the present invention provide a heat dissipation device applied to a terminal, where the terminal includes printing
  • the circuit board PCB is a component disposed on the printed circuit board;
  • the heat sink is a heat sink, and the heat shield is directly disposed above the component, and is used for guiding heat generated when the component works.
  • the heat dissipation cover comprises a cover body and a heat dissipation layer, and the heat dissipation layer is located between the component and the cover body for guiding heat generated during operation of the component to the cover body.
  • the cover body is integrally formed.
  • the material of the cover is a high thermal conductive material.
  • the heat dissipation layer is disposed in the following manner: the space between the printed circuit board and the cover is completely filled with the heat dissipation layer; or one end of the heat dissipation layer is connected to the heat generating surface of the at least one component, and the other end is connected to the cover connection.
  • the heat dissipation layer is a heat dissipation silicone layer or an omnidirectional conductive foam layer.
  • the heat dissipation cover is also used for shielding the signals generated by the components on the printed circuit board from interfering with other components of the terminal, and/or the signals generated by the other components of the shielding terminal interfere with the printing.
  • the components above the board work.
  • an embodiment of the present invention further provides a terminal, where the terminal includes: a printed circuit board, components disposed on the printed circuit board, and a heat dissipation device provided by the embodiment of the present invention, wherein the heat dissipation device is a A heat sink, the heat shield is directly disposed above the component, and is used to derive the heat generated when the component works.
  • the mobile terminal further comprises a shielding frame disposed on the printed circuit board to isolate components on the printed circuit board.
  • the shielding frame is integrally formed.
  • the heat dissipating device and the terminal provided by the embodiment of the invention provide a heat dissipating cover in the terminal, the heat dissipating cover is directly located on the printed circuit board in the terminal, and the heat generated by the components disposed on the printed circuit board is The collection is performed, and the heat generated by the heat-dissipating cover is used to conduct and spread the heat generated by all components into the air, thereby solving the local overheating problem that occurs when the terminal is in operation, and enhancing the user experience.
  • FIG. 1 is a schematic structural diagram of a PCB of a terminal in the related art
  • FIG. 2 is a schematic structural view of a shield cover of a terminal in the related art
  • FIG. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a PCB in a terminal according to an embodiment of the present invention. detailed description
  • the heat dissipating device provided by the embodiment of the invention can be widely applied to various terminals to solve the problem that the local temperature of the terminal device is too high due to uneven heat generation/heat dissipation, such as a mobile phone, a tablet computer, a notebook computer, etc.
  • the embodiments of the present invention are further explained in the manner that the terminal is a mobile phone and the specific embodiments are combined with the accompanying drawings.
  • FIG. 3 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present invention.
  • the heat dissipating device 3 is a heat dissipating cover.
  • the terminal includes a printed circuit board, and is disposed. The components on the printed circuit board are distributed as shown in the component areas in Figure 1 and Figure 5. The heat shield is placed directly above the components to derive the heat generated during operation of the components.
  • the heat dissipation cover shown in FIG. 3 should be larger than the installation area of the component on the PCB; preferably, the shape of the heat dissipation cover matches the setting area of the component on the PCB, and is slightly larger than the setting area.
  • the effect of this setting is as follows: It can ensure that the problem of uneven heat dissipation of the PCB can be solved, and the layout of other components of the terminal is not affected, and the manufacturing material of the heat dissipation cover can be saved, and the production cost is reduced.
  • the heat dissipating device 3 is a heat dissipating cover, and the heat dissipating cover includes a cover body 31 and a heat dissipation layer 32, and the heat dissipation layer is located at the component and the cover body.
  • the heat dissipation layer 32 does not completely cover the cover 31, but only on the PCB
  • the high-power device is provided with a heat dissipation layer 32 corresponding to accelerate the transmission rate of the heat generated by the high-power devices to other parts of the terminal device, enhance the heat conduction rate, and does not need to increase the cost, and can also be a certain degree.
  • Storing some heat to slow down the temperature rise rate of the terminal device; in other embodiments, the heat dissipation layer 32 can completely cover the cover 31, which can increase the heat storage effect and heat conduction effect even though the production cost is increased. It is possible to prevent the terminal device from being opened by non-maintenance personnel to cause a warranty dispute.
  • the cover body 31 shown in FIG. 4 is an integrally formed structure; the body molding of the cover body 31 not only reduces the material type of the heat dissipation cover, but also has a larger integrated area and is more beautiful. It is beneficial to dissipate heat to the entire terminal equipment, and solves the problem that the local temperature of the terminal equipment is too high in the related art.
  • the material of the cover 31 shown in FIG. 4 is a high thermal conductive material, such as copper, etc.
  • the cover 31 of the heat dissipation cover is made of a high thermal conductive material, which can further solve the local overheating of the terminal. The problem.
  • the heat dissipation layer 32 shown in FIG. 4 is a heat dissipation silicone layer or an omnidirectional conductive foam layer, and of course, another heat dissipation layer formed by a heat conductive material having a better heat conduction effect.
  • the heat dissipation layer is disposed as a heat dissipation silicone layer and/or an omnidirectional conductive foam layer because the two materials have good heat conduction effects and are inexpensive, and are advantageous for controlling the manufacturing cost of the terminal.
  • the heat dissipation layer 32 shown in FIG. 4 is disposed in such a manner that the space between the printed circuit board and the cover 31 is completely filled with the heat dissipation layer 32; or one end of the heat dissipation layer 32 and at least one The heating surface of the component is connected, and the other end is connected to the cover 31; the specific one is:
  • the components When selecting components, they are generally selected according to the power consumption and/or heat generation rate of each component.
  • the components with high power consumption and/or high heat generation rate are preferred, because such components will quickly generate a large amount of work.
  • the heat if not conducted in time, will lead to excessive temperature in the area where such components are located; after selecting components, the space in which the components are located can be completely Filling the heat dissipation layer 32, the size of the filled space can be determined according to actual needs, and the space between the PCB and the cover 32 can be directly filled without selecting components, so as to achieve an optimal heat transfer effect, but there is a cost.
  • only the heat dissipation layer 32 may be filled between the heat generating surface of the component and the cover 31, and the heat dissipation effect is slightly worse than the former, but the production cost is correspondingly reduced.
  • the heat dissipation device provided by the embodiment of the present invention , that is, the integrally formed heat dissipation cover also has a signal shielding function for shielding signals generated by components working on the printed circuit board from interfering with other components of the terminal, and/or when other components of the shielding terminal are working The resulting signal interferes with component operation on the printed circuit board.
  • the terminal includes: a printed circuit board, components disposed on the printed circuit board, and a heat dissipation device 3 provided by the embodiment of the present invention.
  • the heat sink 3 is a heat sink cover, and the heat sink cover is directly disposed above the component for discharging heat generated during operation of the component.
  • a shield frame as shown by a broken line in FIG. 5 is further disposed on the printed circuit board, and the shield frame isolates the components on the printed circuit board to avoid the element.
  • the shield frame in the above embodiment is integrally formed; and the integrally formed shield frame not only saves material but also controls compared with the separate shield frame shown in FIG.
  • the production cost has better shielding effect than the separate shielding frame of the related art, and also enhances the efficiency of heat conduction to a certain extent, and helps to alleviate the phenomenon that the local temperature of the terminal is too high.
  • the technical solutions of the embodiments of the present invention have at least the following beneficial effects: Firstly: by providing a heat sink in the terminal, the heat shield is directly located on the printed circuit board in the terminal, and the heat generated by the components disposed on the printed circuit board is collected, and the heat conduction of the heat shield is utilized.
  • the function is to conduct the heat generated by all components, and the heat shield can quickly transfer heat to the whole printed circuit board PCB without local overheating of the PCB, thereby solving the local overheating problem occurring when the terminal is in operation. , enhance the user experience;
  • a heat dissipation layer is arranged in the heat dissipation cover to increase the heat dissipation effect, and a part of the heat can be stored, thereby further enhancing the heat transfer effect;
  • the heat shield also has a signal shielding function, and does not need to separately provide a shielding member on the PCB.
  • the heat dissipation member and the shielding member inside the terminal are simplified, and the two are combined to reduce the components of the terminal device. The complexity makes the terminal thinner.
  • the separate shielding frame of the related technology is integrated, which not only increases the signal shielding effect, but also increases the heat conduction effect to a certain extent, further alleviating the terminal part in the related art. The phenomenon of too high temperature.
  • Embodiments of the present invention provide a heat dissipating device and a terminal for a terminal, the terminal includes a printed circuit board, and components disposed on the printed circuit board; the heat dissipating device is a heat dissipating cover, and the heat dissipating cover is directly disposed on the component Above, used to derive the heat generated when the components work.
  • the heat-dissipating cover is directly located on the printed circuit board in the terminal, and the heat generated by the component is uniformly conducted by using the heat-dissipating characteristic of the heat-dissipating cover, thereby solving the local appearance of the terminal during operation. Overheating issues enhance the user experience.

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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Abstract

本发明实施例提供了一种用于终端的散热装置及终端，所述终端包括印刷电路板，设置于印刷电路板之上的元器件；散热装置为一个散热罩，散热罩直接设置于元器件上方，用于将元器件工作时产生的热量导出。通过在终端中设置一个散热罩，该散热罩直接位于终端中印刷电路板之上，利用该散热罩的导热特性，将元器件所产生的热量进行均匀传导，解决了终端在运行时出现的局部过热问题，增强了用户的使用体验。

Description

散热装置及终端 技术领域 本发明涉及终端应用技术， 特别是涉及一种用于终端的散热装置及终 端。 背景技术
随着通信技术的发展， 终端， 特别是基于第三代移动通信技术、 以及 长期演进系统的智能终端， 其内部主芯片的主频越来越高， 存储器存取速 度越来越快， 射频功放和电源管理功耗也相应越来越高， 因此， 对终端的 散热处理就显得尤其重要。
图 1为相关技术中终端的印刷电路板 ( PCB , Printed Circuit Board )的 结构示意图， 图 2为相关技术中终端的屏蔽罩的结构示意图； 参照图 1可 知， 终端内部这些大功率器件， 如 CPU核心、 电源管理功耗等器件， 的发 热量越来越大， 而其他的元器件工作时所散发的热量通常小于这些大功率 器件的发热量， 这会导致终端局部过热的问题； 而且， 在相关技术中， 为 了避免各元器件之间信号的相互干扰， 往往需要针对各个大功率器件分别 设置屏蔽结构， 如图 2所示的屏蔽罩与图 1 中虚线部分所示的屏蔽架所构 成的屏蔽腔体， 这将进一步加剧终端的局部过热。
相关技术对于如何解决终端在工作时局部过热问题， 尚无有效的技术 方案。 发明内容
本发明实施例提供了一种应用于终端的散热装置及终端， 解决了当前 技术中终端局部过热的问题。
本发明实施例提供了一种应用于终端的散热装置， 所述终端包括印刷 电路板 PCB, 设置于印刷电路板之上的元器件； 散热装置为一个散热罩， 散热罩直接设置于元器件上方， 用于将元器件工作时产生的热量导出。
较优的， 所述散热罩包括罩体及散热层， 散热层位于元器件与罩体之 间， 用于将元器件工作时产生的热量导出至罩体。
较优的， 所述罩体为一体成型。
较优的， 所述罩体的材料为高导热材料。
较优的， 所述散热层的设置方式包括： 印刷电路板与罩体之间的空间 完全填充有散热层； 或者， 散热层的一端与至少一个元器件的发热面连接， 另一端与罩体连接。
较优的， 所述散热层为散热硅胶层或全向导电泡棉层。
较优的， 所述散热罩还用于屏蔽印刷电路板之上的元器件工作时产生 的信号干扰终端的其他元器件工作， 和 /或， 屏蔽终端的其他元器件工作时 产生的信号干扰印刷电路板之上的元器件工作。
为了解决上述问题， 本发明实施例还提供了一种终端， 所述终端包括： 印刷电路板、 设置于印刷电路板之上的元器件、 及本发明实施例提供的散 热装置， 散热装置为一个散热罩， 散热罩直接设置于元器件上方， 用于将 元器件工作时产生的热量导出。
较优的， 所述移动终端还包括屏蔽架， 屏蔽架设置于印刷电路板之上， 将印刷电路板之上的元器件分区隔离。
较优的， 所述屏蔽架一体成型。
本发明实施例提供的散热装置及终端， 通过在终端中设置一个散热罩， 该散热罩直接位于终端中印刷电路板之上， 将设置于该印刷电路板之上的 元器件所产生的热量都进行采集， 利用该散热罩的导热特性， 将所有元器 件所产生的热量进行均勾传导并散播到空气中， 解决了终端在运行时， 所 出现的局部过热问题， 增强了用户的使用体验。 附图说明
图 1为相关技术中终端的 PCB的结构示意图；
图 2为相关技术中终端的屏蔽罩的结构示意图；
图 3为本发明实施例提供的散热装置的结构示意图；
图 4为本发明实施例提供的散热装置的结构示意图；
图 5为本发明实施例提供的终端中 PCB的结构示意图。 具体实施方式
本发明实施例提供的散热装置可以广泛的应用于各种终端中， 以解决 其产热 /散热不均匀所导致的终端设备局部温度过高的问题， 如手机、 平板 电脑、 笔记本电脑等， 下文以终端为手机并通过具体实施例结合附图的方 式对本发明实施例做出进一步的诠释说明。
图 3为本发明实施例提供的散热装置的结构示意图， 参照图 3可知， 在本实施例中， 散热装置 3为一个散热罩， 此时， 结合图 1 , 可知， 终端包 括印刷电路板， 设置于印刷电路板之上的多个元器件， 其分布区域如图 1 及图 5 中的元器件区所示； 散热罩直接设置于元器件上方， 用于将元器件 工作时产生的热量导出。
在其他实施例中， 图 3所示的散热罩应该大于 PCB上设置元器件的设 置区域； 较优的， 该散热罩的形状与 PCB上设置元器件的设置区域匹配， 并略大于该设置区域即可， 这样设置的效果有： 保证可以解决 PCB散热不 均匀的问题， 并且不会影响终端其他元器件的布局， 又可以节省散热罩的 制作材料， 降低了生产成本。
图 4为本发明实施例提供的散热装置的结构示意图， 由图 4可知， 散 热装置 3为一个散热罩， 并且， 该散热罩包括罩体 31及散热层 32, 散热层 位于元器件与罩体之间， 用于将元器件工作时产生的热量导出至罩体； 如图 4所示， 散热层 32并没有完全覆盖罩体 31 , 而是仅在与 PCB上 大功率器件对应处设置有散热层 32, 以加速这些大功率器件所产生的热量 向终端设备的其他部位传输速率， 增强了导热速率， 还不必增加太大的成 本， 同时， 还可以在一定程度上存储一些热量， 减緩终端设备的温度升高 速率； 在其他实施例中， 散热层 32可以完全覆盖罩体 31 , 这样虽然会增加 生产成本， 却也可以增加储热效果及导热效果， 还可以避免终端设备被非 维修人员私自打开， 以引起保修争执。
较优的， 在其他实施例中， 图 4所示的罩体 31为一体成型的结构； 将 罩体 31—体成型不仅减少了散热罩的物料种类， 整体式联通区域更大， 更 加美观， 有利于热量传导分散到整个终端设备， 解决了相关技术所存在的 终端设备局部温度过高的问题。
较优的， 在其他实施例中， 图 4所示的罩体 31的材料为高导热材料， 如铜等， 采用高导热材料来制造散热罩的罩体 31 , 可以从进一步的解决终 端局部过热的问题。
较优的， 在其他实施例中， 图 4所示的散热层 32为散热硅胶层或全向 导电泡棉层， 当然， 还可以是其他的具备较好热传导效果的导热材料所形 成的散热层； 本实施例将散热层设置为散热硅胶层和 /或全向导电泡棉层是 因为这两种材料具备很好的导热效果， 并且价格低廉， 利于控制终端的制 造成本。
较优的， 在其他实施例中， 图 4所示的散热层 32设置方式为： 印刷电 路板与罩体 31之间的空间完全填充有散热层 32; 或者， 散热层 32的一端 与至少一个元器件的发热面连接， 另一端与罩体 31连接； 具体的为：
选择元器件时，一般根据各个元器件的电量消耗和 /或产热速率来选择， 优先选择电量消耗大和 /或产热速率高的元器件，因为此类元器件在工作时， 会快速产生大量的热量， 如果不及时进行传导， 就将导致此类元器件所在 区域温度过高的现象； 选择元器件之后， 可以将该元器件所在的空间完全 填充散热层 32, 所填充空间的大小可以根据实际需要来确定， 还可以不选 择元器件，直接将 PCB与罩体 32之间的空间全部填充，以达到最佳的热传 输效果， 但是存在成本略微增大； 相应的， 也可以仅将该元器件的发热面 与罩体 31之间填充散热层 32, 其散热效果虽然略差于前者，但生产成本相 应的会减小。
在终端中各个元器件在正常工作时， 会产生大量的信号， 这些信号之 间可能会互相干扰， 在相关技术中， 需要设置单独的屏蔽构件来进行信号 屏蔽； 本发明实施例提供的散热装置， 也即一体成型的散热罩还具有信号 屏蔽作用 , 用于屏蔽印刷电路板之上的元器件工作时产生的信号干扰终端 的其他元器件工作， 和 /或， 屏蔽终端的其他元器件工作时产生的信号干扰 印刷电路板之上的元器件工作。
图 5为本发明实施例终端中 PCB的结构示意图， 由图 5可知， 所述终 端包括： 印刷电路板、 设置于印刷电路板之上的元器件、 及本发明实施例 提供的散热装置 3 ,散热装置 3为一个散热罩，散热罩直接设置于元器件上 方， 用于将元器件工作时产生的热量导出。
较优的， 参照图 5可知， 在其他实施例中， 印刷电路板之上还设置有 如图 5虚线所示的屏蔽架， 屏蔽架将印刷电路板之上的元器件分区隔离， 用于避免元器件之间信号的相互干扰； 较优的， 可以仅针对大功率器件进 行分区隔离处理， 在保证隔离效果的基础上， 还可以控制生产成本。
较优的， 参照图 5可知， 在其他实施例中， 上述实施例中的屏蔽架一 体成型； 采用一体成型的屏蔽架与图 1 所示的分离式屏蔽架相比， 不仅节 省了材料， 控制了生产成本， 与相关技术的分离式屏蔽架相比具有更好的 屏蔽效果， 并且， 在一定程度上也会增强热传导的效率， 有助于緩解终端 局部温度过高的现象。
综上可知， 本发明实施例的技术方案， 至少存在以下有益效果： 首先： 通过在终端中设置一个散热罩， 该散热罩直接位于终端中印刷 电路板之上， 将设置于该印刷电路板之上的元器件所产生的热量都进行采 集， 利用该散热罩的导热特性， 将所有元器件所产生的热量进行均勾传导， 该散热罩能迅速将热量传导到整体印刷电路板 PCB, 而不至于 PCB局部过 热， 解决了终端在运行时， 所出现的局部过热问题， 增强了用户的使用体 验；
其次， 在散热罩内设置散热层， 可以增加散热效果， 并可以存储一部 分热量， 进一步加强了热传递效果；
再次， 该散热罩还具备信号屏蔽作用， 不需要在 PCB上另行设置屏蔽 构件， 除了降低生产成本外， 还简化了终端内部散热构件与屏蔽构件， 将 两者合一， 降低了终端设备构件的复杂性， 使终端的进一步薄化成为可能； 最后， 将相关技术的分离式屏蔽架做成一体， 不仅增加了信号屏蔽效 果， 在一定程度上也增加了导热效果， 进一步緩解相关技术中终端局部温 度过高的现象。
以上仅是本发明的具体实施方式而已， 并非对本发明做任何形式上的 等同变化或修饰， 均仍属于本发明技术方案的保护范围。 工业实用性
本发明实施例提供了一种用于终端的散热装置及终端， 所述终端包括 印刷电路板， 设置于印刷电路板之上的元器件； 散热装置为一个散热罩， 散热罩直接设置于元器件上方， 用于将元器件工作时产生的热量导出。 通 过在终端中设置一个散热罩， 该散热罩直接位于终端中印刷电路板之上 , 利用该散热罩的导热特性， 将元器件所产生的热量进行均匀传导， 解决了 终端在运行时出现的局部过热问题， 增强了用户的使用体验。

Claims

权利要求书
1、 一种用于终端的散热装置， 所述终端包括印刷电路板， 设置于所述 印刷电路板之上的元器件； 所述散热装置为一个散热罩， 所述散热罩直接 设置于所述元器件上方， 用于将所述元器件工作时产生的热量导出。
2、 如权利要求 1所述的用于终端的散热装置， 其中， 所述散热罩包括 罩体及散热层， 所述散热层位于所述元器件与所述罩体之间， 用于将所述 元器件工作时产生的热量导出至所述罩体。
3、 如权利要求 2所述的用于终端的散热装置， 其中， 所述罩体一体成 型。
4、 如权利要求 2所述的用于终端的散热装置， 其中， 所述罩体的材料 为高导热材料。
5、 如权利要求 2所述的用于终端的散热装置， 其中， 所述散热层的设 置方式包括： 所述印刷电路板与所述罩体之间的空间完全填充有所述散热 层； 或者， 所述散热层的一端与至少一个元器件的发热面连接， 另一端与 所述罩体连接。
6、 如权利要求 2所述的用于终端的散热装置， 其中， 所述散热层为散 热硅胶层或全向导电泡棉层。
7、 如权利要求 1至 6任一项所述的用于终端的散热装置， 其中， 所述 散热罩还用于屏蔽所述印刷电路板之上的元器件工作时产生的信号干扰所 述终端的其他元器件工作， 和 /或， 屏蔽所述终端的其他元器件工作时产生 的信号干扰所述印刷电路板之上的元器件工作。
8、 一种终端， 包括： 印刷电路板、 设置于所述印刷电路板之上的元器 件、 及如权利要求 1至 7任一项所述的散热装置， 所述散热装置为一个散 热罩， 所述散热罩直接设置于所述元器件上方， 用于将所述元器件工作时 产生的热量导出。
9、 如权利要求 8所述的终端， 其中， 所述移动终端还包括屏蔽架， 所 述屏蔽架设置于所述印刷电路板之上， 将所述印刷电路板之上的元器件分 区隔离。
10、 如权利要求 9所述的终端， 其中， 所述屏蔽架一体成型。
PCT/CN2013/082873 2013-05-15 2013-09-03 散热装置及终端 WO2013189463A2 (zh)

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