WO2013189463A3 - 散热装置及终端 - Google Patents

散热装置及终端 Download PDF

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Publication number
WO2013189463A3
WO2013189463A3 PCT/CN2013/082873 CN2013082873W WO2013189463A3 WO 2013189463 A3 WO2013189463 A3 WO 2013189463A3 CN 2013082873 W CN2013082873 W CN 2013082873W WO 2013189463 A3 WO2013189463 A3 WO 2013189463A3
Authority
WO
WIPO (PCT)
Prior art keywords
terminal
heat dispersion
heat
circuit board
printed circuit
Prior art date
Application number
PCT/CN2013/082873
Other languages
English (en)
French (fr)
Other versions
WO2013189463A2 (zh
Inventor
肖华
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201310180342.1 priority Critical
Priority to CN201310180342.1A priority patent/CN104159391A/zh
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2013189463A2 publication Critical patent/WO2013189463A2/zh
Publication of WO2013189463A3 publication Critical patent/WO2013189463A3/zh

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

提供了一种用于终端的散热装置及终端,所述终端包括印刷电路板,设置于印刷电路板之上的元器件;散热装置(3)为一个散热罩,散热罩直接设置于元器件上方,用于将元器件工作时产生的热量导出。通过在终端中设置一个散热罩,该散热罩直接位于终端中印刷电路板之上,利用该散热罩的导热特性,将元器件所产生的热量进行均匀传导,解决了终端在运行时出现的局部过热问题,增强了用户的使用体验。
PCT/CN2013/082873 2013-05-15 2013-09-03 散热装置及终端 WO2013189463A2 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310180342.1 2013-05-15
CN201310180342.1A CN104159391A (zh) 2013-05-15 2013-05-15 一种用于终端的散热装置及终端

Publications (2)

Publication Number Publication Date
WO2013189463A2 WO2013189463A2 (zh) 2013-12-27
WO2013189463A3 true WO2013189463A3 (zh) 2014-04-17

Family

ID=49769600

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/082873 WO2013189463A2 (zh) 2013-05-15 2013-09-03 散热装置及终端

Country Status (2)

Country Link
CN (1) CN104159391A (zh)
WO (1) WO2013189463A2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105323996A (zh) * 2015-12-09 2016-02-10 江苏天安智联科技股份有限公司 一种具有散热功能的车载机壳
CN105611716B (zh) * 2016-01-21 2019-02-19 Oppo广东移动通信有限公司 一种移动终端的主板散热结构及移动终端

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101413651A (zh) * 2007-10-19 2009-04-22 浩然科技股份有限公司 密封式电源供应器模块化装置
CN201263290Y (zh) * 2008-10-06 2009-06-24 深圳华为通信技术有限公司 一种具有散热功能的电磁屏蔽装置和屏蔽模块
CN202026562U (zh) * 2011-03-11 2011-11-02 深圳瑞谷电子有限公司 带散热功能的屏蔽罩
CN202310446U (zh) * 2011-11-11 2012-07-04 上海广电影视制作有限公司 带有散热装置的电路板
CN102548365A (zh) * 2012-01-18 2012-07-04 惠州Tcl移动通信有限公司 一种高散热性能的移动终端
CN102802379A (zh) * 2011-06-29 2012-11-28 深圳光启高等理工研究院 散热组件及电子设备

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US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules
JPH043498A (en) * 1990-04-20 1992-01-08 Oki Electric Ind Co Ltd Direct mounting power amplifier
JPH0567893A (ja) * 1991-09-10 1993-03-19 Mitsubishi Electric Corp 回路基板の局部シールド方法
US5369552A (en) * 1992-07-14 1994-11-29 Ncr Corporation Multi-chip module with multiple compartments
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
KR100652621B1 (ko) * 2003-11-21 2006-12-06 엘지전자 주식회사 휴대용 단말기의 방열장치
CN100502627C (zh) * 2004-12-01 2009-06-17 展讯通信(上海)有限公司 一种移动通讯设备散热装置
KR101422249B1 (ko) * 2007-03-09 2014-08-13 삼성전자주식회사 소자 방열 장치
JP2008270537A (ja) * 2007-04-20 2008-11-06 Yokogawa Electric Corp 電子部品の放熱機構
JP2009016715A (ja) * 2007-07-09 2009-01-22 Tatsuta System Electronics Kk シールド及び放熱性を有する高周波モジュール及びその製造方法
CN101415316B (zh) * 2008-08-21 2011-04-20 华为终端有限公司 一种电子设备及其制造方法
CN102711416B (zh) * 2012-05-24 2015-10-21 中兴通讯股份有限公司 散热处理装置及移动终端

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101413651A (zh) * 2007-10-19 2009-04-22 浩然科技股份有限公司 密封式电源供应器模块化装置
CN201263290Y (zh) * 2008-10-06 2009-06-24 深圳华为通信技术有限公司 一种具有散热功能的电磁屏蔽装置和屏蔽模块
CN202026562U (zh) * 2011-03-11 2011-11-02 深圳瑞谷电子有限公司 带散热功能的屏蔽罩
CN102802379A (zh) * 2011-06-29 2012-11-28 深圳光启高等理工研究院 散热组件及电子设备
CN202310446U (zh) * 2011-11-11 2012-07-04 上海广电影视制作有限公司 带有散热装置的电路板
CN102548365A (zh) * 2012-01-18 2012-07-04 惠州Tcl移动通信有限公司 一种高散热性能的移动终端

Also Published As

Publication number Publication date
WO2013189463A2 (zh) 2013-12-27
CN104159391A (zh) 2014-11-19

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