WO2013179430A1 - Procédé de traitement laser, programme de commande de traitement et dispositif de commande de traitement - Google Patents

Procédé de traitement laser, programme de commande de traitement et dispositif de commande de traitement Download PDF

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Publication number
WO2013179430A1
WO2013179430A1 PCT/JP2012/063992 JP2012063992W WO2013179430A1 WO 2013179430 A1 WO2013179430 A1 WO 2013179430A1 JP 2012063992 W JP2012063992 W JP 2012063992W WO 2013179430 A1 WO2013179430 A1 WO 2013179430A1
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WO
WIPO (PCT)
Prior art keywords
processing
piercing
speed
machining
laser
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Application number
PCT/JP2012/063992
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English (en)
Japanese (ja)
Inventor
健二 熊本
裕章 黒川
利樹 腰前
宮本　直樹
裕司 木野
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2012/063992 priority Critical patent/WO2013179430A1/fr
Publication of WO2013179430A1 publication Critical patent/WO2013179430A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Definitions

  • the present invention relates to a laser processing method, a processing control program, and a processing control apparatus to which a piercing approach line is applied.
  • the conventional laser processing apparatus stops the processing head at the piercing position and opens the piercing position under the laser processing conditions for drilling. And after confirming that the hole was opened, the conventional laser processing apparatus performed laser processing, accelerating the processing head to the cutting speed.
  • the present invention has been made in view of the above, and an object thereof is to obtain a laser machining method, a machining control program, and a machining control apparatus capable of performing stable laser machining at high speed.
  • the present invention sets a processing speed during piercing, which is a processing speed when piercing the workpiece while moving the processing head, based on the processing conditions.
  • a piercing process is performed along the piercing approach line at the piercing processing speed while irradiating a laser beam while irradiating a laser beam, and the workpiece is cut along the machining path after the piercing position with the laser beam. Cutting step.
  • the laser processing method, the processing control program, and the processing control apparatus according to the present invention have an effect that stable laser processing can be performed at high speed.
  • FIG. 1-1 is a diagram illustrating a schematic configuration of a CO 2 laser processing machine according to an embodiment.
  • FIG. 1-2 is a diagram illustrating a schematic configuration of the fiber laser processing machine according to the embodiment.
  • FIG. 2 is a block diagram illustrating a configuration of the machining control apparatus according to the embodiment.
  • FIG. 3 is a diagram for explaining an example of the machining locus.
  • FIG. 4 is a diagram for explaining another example of the machining trajectory.
  • FIG. 5 is a flowchart showing a processing procedure of laser processing.
  • FIG. 6 is a diagram showing the relationship between the cutting processing speed and the piercing processing speed that can be set.
  • FIG. 7 is a diagram showing the ratio of the allowable piercing processing speed to the cutting processing speed.
  • FIG. 8 is a diagram illustrating a hardware configuration of the machining control device.
  • FIG. 1-1 is a diagram showing a schematic configuration of a CO 2 laser processing machine according to an embodiment
  • FIG. 1-2 is a diagram showing a schematic configuration of a fiber laser processing machine according to the embodiment. is there.
  • the CO 2 laser beam machine and the fiber laser beam machine are devices that cut the workpiece 5 (a plate member such as a sheet metal).
  • the CO 2 laser processing machine and the fiber laser processing machine may be described as the laser processing machine 100 without distinguishing between them.
  • the CO 2 laser processing machine has a processing control device (control unit) 1, a laser oscillator (laser light output unit) 3, and a laser light irradiation unit 2A.
  • the fiber laser processing machine includes a processing control device (control unit) 1, a laser oscillator (laser light output unit) 3, and a laser light irradiation unit 2B.
  • the laser oscillator 3 is a device that oscillates laser light (beam light) 10 such as a fiber laser or a CO 2 laser, and emits the laser light 10 toward the laser light irradiation unit 2A or the laser light irradiation unit 2B.
  • the laser processing machine 100 is a CO 2 laser processing machine
  • the laser oscillator 3 is provided with a PR mirror (partial reflection mirror) 31.
  • the PR mirror 31 partially reflects the laser beam 10 emitted from the laser oscillator 3 and guides it to the bend mirror 21.
  • the laser light irradiation unit 2A and the laser light irradiation unit 2B may be referred to as the laser light irradiation unit 2 without being distinguished from each other.
  • the laser beam irradiation unit 2 ⁇ / b> A irradiates the workpiece (work) 5 with the laser beam 10 guided from the laser oscillator 3.
  • the laser beam irradiation unit 2A includes bend mirrors 21 to 23 and a processing head 24.
  • the bend mirrors 21 to 23 are mirrors that change the beam angle.
  • the bend mirror 21 changes the beam angle of the laser light 10 sent from the PR mirror 31 and guides it to the bend mirror 22.
  • the bend mirror 22 deflects the beam angle of the laser beam 10 sent from the bend mirror 21 and sends it to the bend mirror 23.
  • the bend mirror 23 changes the beam angle and beam diameter of the laser light 10 sent from the bend mirror 22 and sends it to the machining head 24.
  • the configuration of the laser processing machine 100 when the laser processing machine 100 is a fiber processing machine will be described.
  • the laser processing machine 100 is a fiber laser processing machine
  • the laser beam 10 emitted from the laser oscillator 3 is transmitted as it is in the fiber 4 and guided to the processing lens 25 in the processing head 24. Since the laser oscillator 3 itself is configured in the fiber 4, the generated laser light 10 becomes non-polarized light whose polarization is not defined.
  • the difference from the CO 2 laser is that the oscillation wavelength is as short as 1.06 ⁇ m (CO 2 laser is 10.6 ⁇ m), and the condensing property (output / condensing spot diameter) is higher than that of the CO 2 laser.
  • the fiber laser processing machine has the merit that piercing and cutting speed in cutting processing are fast, and that high reflective materials such as copper and brass can be cut. Moreover, since a mirror is not required during propagation of the laser beam 10, the configuration is simple. As the device structure of a fiber laser processing machine, CO 2 has established the fiber 4 at the position of the optical path that transmits the laser beam 10 in the laser processing machine, a large difference between CO 2 laser processing machine in the configuration Absent.
  • the processing head 24 includes a processing lens 25.
  • the processing lens 25 condenses the laser beam 10 sent from the bend mirror 23 to a small spot diameter and irradiates the workpiece 5.
  • the machining head 24 irradiates the workpiece 5 with the laser beam 10 while moving at a predetermined speed in accordance with an instruction from the machining control device 1.
  • the machining head 24 of the present embodiment irradiates the workpiece 5 with the laser beam 10 while moving at a moving speed according to the machining conditions (such as the plate thickness of the workpiece 5).
  • the processing head 24 may inject assist gas to the workpiece 5 when performing laser processing on the workpiece 5.
  • the machining control device 1 controls the laser oscillator 3 and the laser beam irradiation unit 2.
  • the processing control device 1 has, for example, an NC (Numerical Control) device, and controls laser processing (piercing processing, cutting processing, etc.) by the laser light irradiation unit 2 using the NC device.
  • NC Numerical Control
  • the machining control apparatus 1 derives the moving speed of the machining head 24 during piercing for each machining condition (hereinafter referred to as the piercing machining speed), and controls the movement of the machining head 24 based on the derived result.
  • the processing control device 1 includes the thickness of the workpiece 5, the material of the workpiece 5, the processing output of the laser beam 10 (laser output conditions), and the condensing optical system (bend mirrors 21 to 23 and the processing).
  • the processing speed during piercing is set based on at least one of the characteristics of the lens 25).
  • the processing control device 1 sets a processing speed equal to or lower than a processing speed when cutting the workpiece 5 (hereinafter referred to as a cutting processing speed) as a piercing processing speed.
  • a processing speed when cutting the workpiece 5 hereinafter referred to as a cutting processing speed
  • the machining speed at which a hole can be made in the workpiece 5 is stored for each machining condition as a machining speed that can be set as the piercing machining speed.
  • the workpiece 5 is placed on a processing table (not shown), and laser processing is performed on the processing table.
  • the laser processing machine 100 uses a workpiece 5 having various materials and plate thicknesses as an object of laser processing.
  • the laser processing machine 100 may be a device that performs two-dimensional laser processing, or may be a device that performs three-dimensional laser processing.
  • FIG. 2 is a block diagram illustrating a configuration of the machining control apparatus according to the embodiment.
  • the machining control device 1 includes an input unit 11, a machining speed setting unit 12, a speed information storage unit 13, a machining program storage unit 14, a control program storage unit 15, and a control instruction unit 16.
  • the input unit 11 inputs information on processing such as processing conditions and sends the information to the processing speed setting unit 12.
  • the processing conditions input to the input unit 11 include at least one of the plate thickness of the workpiece 5, the material of the workpiece 5, the laser output conditions, and information on the condensing optical system.
  • the speed information storage unit 13 is a memory or the like that stores information (speed information) relating to a settable piercing processing speed.
  • the settable piercing machining speed (allowable piercing machining speed) varies depending on the machining conditions. Therefore, the speed information is information indicating a correspondence relationship between the machining conditions and the settable piercing machining speed.
  • the allowable piercing processing speed for each processing condition is shown as a ratio (0 to 100%) to the cutting processing speed.
  • the cutting processing speed is the maximum processing speed, and the piercing processing speed is set to be equal to or lower than the cutting processing speed.
  • the machining program storage unit 14 is a memory that stores a machining program used for laser machining.
  • a machining locus that is a laser machining path (a movement path of the machining head 24) is set.
  • the control program storage unit 15 is a memory that stores a control program (machining control program) used for laser processing.
  • a control program machining control program
  • a cutting speed is set in advance.
  • the machining speed setting unit 12 sets the piercing machining speed in the control program.
  • the machining speed setting unit 12 sets the machining speed during piercing using the machining conditions sent from the input unit 11 and the speed information in the speed information storage unit 13. For example, when the plate thickness of 3 mm is associated with 50% of the cutting processing speed in the speed information and the plate thickness of 3 mm is input from the input unit 11, 50% of the cutting processing speed is piercing. When the processing speed is set.
  • the machining speed setting unit 12 sets the piercing machining speed derived using the speed information in the control program in the control program storage unit 15.
  • the control instruction unit 16 controls the laser oscillator 3 and the laser beam irradiation unit 2 based on the machining program in the machining program storage unit 14 and the control program in the control program storage unit 15.
  • the control instruction unit 16 controls the machining head 24 so that the machining head 24 moves at the machining speed during piercing when the workpiece 5 is subjected to piercing. Further, the control instruction unit 16 controls the machining head 24 so that the machining head 24 moves at the machining speed at the time of cutting when the workpiece 5 is cut.
  • FIG. 3 is a diagram for explaining an example of the machining locus.
  • a machining locus 41 for the workpiece 5 is set in the machining program.
  • the processing trajectory 41 indicates various shapes such as a rectangular shape, a polygonal shape, and a circular shape by a one-stroke path.
  • the piercing position 42 is desirably arranged on the processing locus 41 having a shape to be cut in consideration of productivity.
  • a piercing approach line is required to enable running piercing. Therefore, a piercing approach line 43 is provided in front of the piercing position 42 in order to perform machining at a piercing processing speed that is equal to or lower than the piercing speed.
  • the piercing approach line 43 is a processing locus until the workpiece 5 is drilled at the piercing position 42 after the laser output is turned on.
  • the piercing approach line 43 is formed by a line having a length of several millimeters for moving the machining head 24 at a predetermined speed, for example.
  • a machining locus 41, a piercing approach line 43, and a piercing position 42 are set.
  • a piercing approach line 43 is provided on the machining locus 41.
  • the piercing approach line 43 is a part of the machining locus 41.
  • the position before performing online piercing is set as the piercing approach line 43 in the machining program.
  • a piercing approach line 43 is provided at a position on one side of a quadrangle that indicates the processing locus 41, a hole is made at the piercing position 42, and then cutting of the quadrangle is started.
  • the piercing approach line 43 is set at a position corresponding to the machining conditions and the machining locus 41 by CAM (Computer Aided Manufacturing) or the like.
  • the piercing approach line 43 is specified on CAD (Computer Aided Design) data indicating the machining locus 41.
  • CAD Computer Aided Design
  • the piercing position 42 is set on a line indicating the processing shape of the workpiece 5, and then the piercing approach line 43 is provided on the front side of the piercing position 42 among the lines indicating the processing shape, whereby the processing trajectory 41 is generated. Will be decided.
  • the piercing process speed is applied to the piercing approach line 43, and the cutting process speed is applied to the machining trajectory 41 other than the piercing approach line 43.
  • the laser output is turned on at the starting point of the piercing approach line 43 (processing locus 41). Then, the laser beam 10 is irradiated onto the piercing approach line 43 while moving the machining head 24 at the machining speed during piercing. As a result, running piercing is performed, and as a result, a piercing position 42 that is the end point of the piercing approach line 43 is perforated. Thereafter, the moving speed of the machining head 24 is switched from the piercing machining speed to the cutting machining speed, and the remaining machining locus 41 is irradiated with the laser beam 10. Thereby, the workpiece 5 is cut to the end point of the machining locus 41.
  • the end point of the processing locus 41 is substantially the same position as the piercing position 42.
  • the workpiece 5 is perforated in a short time, so that the piercing approach line 43 is a very small distance compared to the processing locus 41. Therefore, the start point and end point of the piercing approach line 43, the piercing position 42, and the end point of the machining locus 41 are substantially the same position.
  • the piercing process is performed while moving the machining head 24 at the piercing machining speed without stopping the machining head 24, it is possible to suppress a decrease in the machining speed during the piercing process. Therefore, it becomes possible to cut the workpiece 5 at high speed, and it is possible to suppress a decrease in productivity due to the piercing process.
  • FIG. 3 demonstrated the case where the piercing approach line 43 was provided on the process locus 41, you may provide the piercing approach line in areas other than the process locus 41 (areas other than the product area).
  • FIG. 4 is a diagram for explaining another example of the machining trajectory.
  • a piercing approach line 45 may be provided outside the machining locus 41.
  • the piercing position 44 that is the end point of the piercing approach line 45 is a position on the machining locus 41.
  • the piercing position 44 is the starting point of the machining locus 41.
  • FIG. 5 is a flowchart showing a processing procedure of laser processing. Note that FIG. 5 illustrates the case where the processing condition is the plate thickness of the workpiece 5, but the processing conditions include the plate thickness of the workpiece 5, the material of the workpiece 5, the laser output conditions, and the focusing optics. It only needs to contain at least one of the systems.
  • Speed information is stored in advance in the speed information storage unit 13.
  • the speed information here is a correspondence relationship between the plate thickness and the allowable piercing processing speed.
  • a machining program is stored in advance in the machining program storage unit 14.
  • a control program in which the cutting machining speed is set is stored in advance.
  • the input unit 11 sends the plate thickness to the processing speed setting unit 12.
  • the processing speed setting unit 12 derives the processing speed during piercing according to the plate thickness using the plate thickness and the speed information in the speed information storage unit 13.
  • the machining speed setting unit 12 sets the derived piercing machining speed in the control program in the control program storage unit 15 (step S2).
  • control instruction unit 16 controls the laser oscillator 3 and the laser beam irradiation unit 2 based on the machining program in the machining program storage unit 14 and the control program in the control program storage unit 15.
  • the laser processing to the workpiece 5 is performed (step S3). Specifically, the piercing process is performed at the set piercing process speed, and then the cutting process is performed at the cutting process speed.
  • FIG. 6 is a diagram showing the relationship between the cutting processing speed and the piercing processing speed that can be set.
  • the horizontal axis is the plate thickness
  • the vertical axis is the processing speed (cutting processing speed, settable piercing processing speed). Therefore, in FIG. 6, the relationship between the cutting processing speed 51 and the allowable piercing processing speed 52 that is a settable piercing processing speed is shown for each plate thickness.
  • the graph shown in FIG. 6 is obtained by measuring the speed at which running piercing is possible (allowable piercing processing speed) under the following conditions.
  • the laser oscillator 3 is a 2.5 kW output fiber laser oscillator.
  • the workpiece 5 is made of stainless steel that can be cut at high speed with a fiber laser.
  • the assist gas is nitrogen.
  • the laser output conditions and the condensing optical system are set to conditions that allow each plate thickness to be cut at the maximum speed, and measure the speed at which running piercing is possible while decreasing the processing speed in order from the maximum speed.
  • FIG. 7 is a graph showing the ratio of the allowable piercing processing speed to the cutting processing speed.
  • the horizontal axis is the plate thickness
  • the vertical axis is the processing speed ratio (allowable piercing processing speed / cutting processing speed).
  • the ratio of the allowable piercing processing speed 52 to the cutting processing speed 51 is approximately 100%. In other words, when the plate thickness is about 1 mm, it is possible to set a piercing processing speed that is substantially the same processing speed as the cutting processing speed 51.
  • the ratio of the allowable piercing processing speed 52 to the cutting processing speed 51 is approximately 50%. In other words, if an allowable piercing processing speed 52 of about 50% of the cutting processing speed 51 is set, running piercing processing with a plate thickness of up to 3 mm is possible. As the plate thickness increases, the ratio of the allowable piercing processing speed 52 to the cutting processing speed 51 decreases. Thus, it becomes possible to pierce at a desired position by reducing the processing speed at a predetermined ratio corresponding to the processing conditions with respect to the cutting processing speed 51.
  • the laser oscillator 3 is a 2.5 kW output fiber laser oscillator
  • any laser oscillator may be used.
  • the workpiece 5 may be other materials, such as mild steel, copper, and aluminum.
  • FIG. 8 is a diagram showing a hardware configuration of the machining control device.
  • the processing control device 1 includes a CPU (Central Processing Unit) 91, a ROM (Read Only Memory) 92, a RAM (Random Access Memory) 93, a display unit 94, and an input unit 95.
  • the CPU 91, ROM 92, RAM 93, display unit 94, and input unit 95 are connected via the bus line B.
  • the machining control device 1 sets a piercing machining speed using a setting program 90 that is a computer program.
  • the display unit 94 is a display device such as a liquid crystal monitor, and displays processing conditions, speed information, processing speed during piercing according to the processing conditions, and the like based on an instruction from the CPU 91.
  • the input unit 95 includes a mouse and a keyboard, and inputs instruction information (such as parameters necessary for setting the processing speed during piercing) input from the user. The instruction information input to the input unit 95 is sent to the CPU 91.
  • the setting program 90 is stored in the ROM 92 and loaded into the RAM 93 via the bus line B.
  • the CPU 91 executes a setting program 90 loaded in the RAM 93. Specifically, in the machining control device 1, the CPU 91 reads the setting program 90 from the ROM 92 and expands it in the program storage area in the RAM 93 in accordance with an instruction input from the input unit 95 by the user, and executes various processes.
  • the CPU 91 temporarily stores various data generated in the various processes in a data storage area formed in the RAM 93.
  • the setting program 90 executed by the machining control device 1 has a module configuration including a machining speed setting unit 12, the machining speed setting unit 12 is loaded on the main storage device, and the machining speed setting unit 12 is the main storage device. Generated on top.
  • an oscillator that considers a certain kind of polarized light has been used as an oscillator that performs laser cutting.
  • laser light having circularly polarized light is used, and when such polarization-controlled laser light is used, the workpiece is tapered in accordance with the direction of rotating polarized light. It is known that processing errors occur. Even when piercing is performed by providing a piercing approach line, it is necessary to consider the machining progress direction for the shape on the side to be cut off.
  • a solid laser such as a fiber laser, a disk laser, or a direct laser diode that transmits the laser beam 10 to the processing head 24 by performing fiber transmission is desirable.
  • a cutting speed that is slower than the maximum workable speed may be set as the cutting speed.
  • the piercing processing speed may be set to the same processing speed as the cutting processing speed.
  • the piercing process is performed while moving the machining head 24 at the machining speed at which a hole can be drilled in the workpiece 5 (the machining speed at the time of piercing). It becomes possible to do. Therefore, the productivity of laser processing by the laser processing machine 100 is improved.
  • machining trajectory 41 can be set with priority on the path, high-speed laser machining is possible.
  • the laser processing method, the processing control program, and the processing control apparatus according to the present invention are suitable for laser processing using a piercing approach line.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention porte sur un procédé de traitement laser comprenant une étape (S1) pour mettre en entrée l'épaisseur de feuille et d'autres conditions de traitement, une étape (S2) pour régler, sur la base de l'épaisseur de feuille et des autres conditions de traitement, la vitesse de perçage qui est la vitesse de traitement durant le perçage d'une pièce de travail tout en déplaçant une tête de traitement, et une étape (S3) pour réaliser le perçage le long d'une ligne d'approche de perçage à la vitesse de perçage tout en irradiant un faisceau laser, et la découpe de la pièce de travail avec le faisceau laser le long d'une trajectoire de traitement situé après la position de perçage.
PCT/JP2012/063992 2012-05-30 2012-05-30 Procédé de traitement laser, programme de commande de traitement et dispositif de commande de traitement WO2013179430A1 (fr)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07232288A (ja) * 1994-02-25 1995-09-05 Fanuc Ltd レーザ加工装置
JPH08206858A (ja) * 1995-01-31 1996-08-13 Mitsubishi Electric Corp レーザ加工装置および加工方法
JPH0966377A (ja) * 1995-09-04 1997-03-11 Fanuc Ltd レーザ加工方法及びレーザ加工装置
JPH1080784A (ja) * 1996-09-06 1998-03-31 Amada Co Ltd 熱切断機における多角形穴切断方法およびその装置
JP2007296580A (ja) * 2006-04-07 2007-11-15 Nissan Tanaka Corp レーザピアシング方法及び加工装置
JP2008200712A (ja) * 2007-02-20 2008-09-04 Fanuc Ltd レーザ加工方法及びレーザ加工装置
JP2012076088A (ja) * 2010-09-30 2012-04-19 Amada Co Ltd レーザ切断加工方法及び装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07232288A (ja) * 1994-02-25 1995-09-05 Fanuc Ltd レーザ加工装置
JPH08206858A (ja) * 1995-01-31 1996-08-13 Mitsubishi Electric Corp レーザ加工装置および加工方法
JPH0966377A (ja) * 1995-09-04 1997-03-11 Fanuc Ltd レーザ加工方法及びレーザ加工装置
JPH1080784A (ja) * 1996-09-06 1998-03-31 Amada Co Ltd 熱切断機における多角形穴切断方法およびその装置
JP2007296580A (ja) * 2006-04-07 2007-11-15 Nissan Tanaka Corp レーザピアシング方法及び加工装置
JP2008200712A (ja) * 2007-02-20 2008-09-04 Fanuc Ltd レーザ加工方法及びレーザ加工装置
JP2012076088A (ja) * 2010-09-30 2012-04-19 Amada Co Ltd レーザ切断加工方法及び装置

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