WO2013157421A1 - 有機半導体層、電子デバイス、及び、電子デバイスの製造方法 - Google Patents
有機半導体層、電子デバイス、及び、電子デバイスの製造方法 Download PDFInfo
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- WO2013157421A1 WO2013157421A1 PCT/JP2013/060539 JP2013060539W WO2013157421A1 WO 2013157421 A1 WO2013157421 A1 WO 2013157421A1 JP 2013060539 W JP2013060539 W JP 2013060539W WO 2013157421 A1 WO2013157421 A1 WO 2013157421A1
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- polycyclic aromatic
- aromatic hydrocarbon
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- electrode
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- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 125000006261 methyl amino sulfonyl group Chemical group [H]N(C([H])([H])[H])S(*)(=O)=O 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000004458 methylaminocarbonyl group Chemical group [H]N(C(*)=O)C([H])([H])[H] 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 125000006216 methylsulfinyl group Chemical group [H]C([H])([H])S(*)=O 0.000 description 1
- 125000004170 methylsulfonyl group Chemical group [H]C([H])([H])S(*)(=O)=O 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 125000005184 naphthylamino group Chemical group C1(=CC=CC2=CC=CC=C12)N* 0.000 description 1
- 125000005185 naphthylcarbonyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 1
- 125000005186 naphthyloxy group Chemical group C1(=CC=CC2=CC=CC=C12)O* 0.000 description 1
- 125000005146 naphthylsulfonyl group Chemical group C1(=CC=CC2=CC=CC=C12)S(=O)(=O)* 0.000 description 1
- 125000005029 naphthylthio group Chemical group C1(=CC=CC2=CC=CC=C12)S* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000003170 phenylsulfonyl group Chemical group C1(=CC=CC=C1)S(=O)(=O)* 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 125000004592 phthalazinyl group Chemical group C1(=NN=CC2=CC=CC=C12)* 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000090 poly(aryl ether) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000004673 propylcarbonyl group Chemical group 0.000 description 1
- 125000003226 pyrazolyl group Chemical group 0.000 description 1
- 125000002098 pyridazinyl group Chemical group 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000005400 pyridylcarbonyl group Chemical group N1=C(C=CC=C1)C(=O)* 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 125000002294 quinazolinyl group Chemical group N1=C(N=CC2=CC=CC=C12)* 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 125000004306 triazinyl group Chemical group 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000000025 triisopropylsilyl group Chemical group C(C)(C)[Si](C(C)C)(C(C)C)* 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D493/00—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system
- C07D493/02—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system in which the condensed system contains two hetero rings
- C07D493/06—Peri-condensed systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
- H10K85/623—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene containing five rings, e.g. pentacene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
- H10K85/6574—Polycyclic condensed heteroaromatic hydrocarbons comprising only oxygen in the heteroaromatic polycondensed ring system, e.g. cumarine dyes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
Definitions
- the present disclosure relates to an organic semiconductor layer, an electronic device including the organic semiconductor layer, and a method for manufacturing the electronic device.
- Such an electronic device can deposit a semiconductor layer at a lower temperature than a configuration including a semiconductor layer made of an inorganic material. Therefore, it can be formed on a flexible substrate such as plastic, which has low heat resistance, and is expected to be multi-functional and cost-effective.
- organic semiconductor material constituting the semiconductor layer for example, 6,12-dioxaanthanthrene (so-called perixanthenoxanthene, 6,12-dioxaanthanthrene having the following structural formula, abbreviated as “PXX”
- PXX 612-dioxaanthanthrene having the following structural formula
- the organic semiconductor material having the above structural formula disclosed in the above patent publication is an organic semiconductor material having high carrier mobility, high degree of molecular design freedom, and high adaptability to processes. However, there is a strong demand for materials that exhibit even higher carrier mobility.
- an object of the present disclosure is to provide an organic semiconductor layer having higher carrier mobility, an electronic device including the organic semiconductor layer, and a method for manufacturing the electronic device.
- the organic semiconductor layer according to the first aspect of the present disclosure includes a first polycyclic aromatic hydrocarbon in which a substituent R 1 other than a hydrogen atom is connected by a single bond, And a polycyclic aromatic hydrocarbon.
- the organic semiconductor layer according to the second aspect of the present disclosure for achieving the above object includes: a first polycyclic aromatic hydrocarbon in which a first substituent R 1 other than a hydrogen atom is connected by a single bond; And a second polycyclic aromatic hydrocarbon in which a second substituent R 2 other than a hydrogen atom is connected by a single bond,
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of the same polycyclic aromatic hydrocarbon;
- the bonding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is different from the bonding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon.
- the organic semiconductor layer according to the third aspect of the present disclosure for achieving the above object includes: a first polycyclic aromatic hydrocarbon in which a first substituent R 1 other than a hydrogen atom is connected by a single bond; And a second polycyclic aromatic hydrocarbon in which a second substituent R 2 other than a hydrogen atom is connected by a single bond,
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of the same polycyclic aromatic hydrocarbon;
- the binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is the same as the binding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon;
- the first substituent R 1 and the second substituent R 2 are different.
- an electronic device of the present disclosure is provided.
- a method of manufacturing an electronic device includes: A first electrode, A second electrode spaced apart from the first electrode, and An active layer extending from the first electrode to the second electrode;
- An electronic device manufacturing method comprising at least A mixed solution (A) in which a first polycyclic aromatic hydrocarbon in which a substituent R 1 other than a hydrogen atom is linked by a single bond and a second polycyclic aromatic hydrocarbon are mixed, or The first polycyclic aromatic hydrocarbon in which the first substituent R 1 other than a hydrogen atom is bonded by a single bond and the second polycyclic aromatic hydrocarbon in which the second substituent R 2 other than a hydrogen atom is bonded by a single bond Mixed with polycyclic aromatic hydrocarbons, The first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of the same polycyclic aromatic hydrocarbon;
- the first polycyclic aromatic hydrocarbon in which the first substituent R 1 other than a hydrogen atom is bonded by a single bond and the second polycyclic aromatic hydrocarbon in which the second substituent R 2 other than a hydrogen atom is bonded by a single bond Mixed with polycyclic aromatic hydrocarbons,
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of the same polycyclic aromatic hydrocarbon;
- the binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is the same as the binding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon;
- An active layer is formed by applying and drying a mixed solution (C) different from the first substituent R 1 and the second substituent R 2 .
- the organic semiconductor layer or the active layer is composed of a mixture of two kinds of polycyclic aromatic hydrocarbons, and thus exhibits higher carrier mobility.
- FIG. 1A and 1B are schematic partial end views of a substrate and the like for explaining the outline of the method for manufacturing an electronic device of Example 1.
- FIG. 2A and 2B are schematic partial end views of a substrate and the like for explaining the outline of the manufacturing method of the electronic device of Example 2.
- FIG. 3A and 3B are schematic partial end views of a substrate and the like for explaining the outline of the electronic device manufacturing method according to the third embodiment.
- 4A, 4B, and 4C are schematic partial end views of a substrate and the like for explaining the outline of the manufacturing method of the electronic device of Example 4.
- FIG. 5A and 5B are schematic partial cross-sectional views of the electronic device of Example 5.
- FIG. 5A and 5B are schematic partial cross-sectional views of the electronic device of Example 5.
- Example 1 Organic Semiconductor Layer, Electronic Device, and Electronic Device Manufacturing Method According to First to Third Aspects of Present Disclosure
- Example 2 Modification of Example 1) 4
- Example 3 another modification of Example 1
- Example 4 another modification of Example 1) 6
- Example 5 a further modification of Example 1, a two-terminal electronic device), etc.
- the electronic device of the present disclosure or the electronic device obtained by the manufacturing method of the electronic device of the present disclosure can be a so-called two-terminal electronic device, or A first electrode, a second electrode spaced apart from the first electrode, a control electrode, and an insulating layer;
- the control electrode may be a so-called three-terminal type electronic device in which the control electrode is provided opposite to the active layer located between the first electrode and the second electrode via the insulating layer. it can.
- the semiconductor layer or the organic semiconductor layer according to the first aspect of the present disclosure hereinafter, these organic semiconductor layers are collectively referred to as “the organic semiconductor layer according to the first aspect of the present disclosure”.
- the first polycyclic aromatic hydrocarbon has a phenyl group;
- the substituent R 1 may be bonded to a phenyl group, in which the first polycyclic aromatic hydrocarbon is 3,9-diphenylperixanthenoxanthene (“Ph-PXX”). ] (Abbreviated as “)”.
- the substituent R 1 may be bonded to the respective para positions of the phenyl group.
- the substituent R 1 an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryl group, an arylalkyl group, an aromatic heterocyclic ring, a heterocyclic group, an alkoxy group, a cycloalkoxy group, an aryloxy group , Alkylthio group, cycloalkylthio group, arylthio group, alkoxycarbonyl group, aryloxycarbonyl group, sulfamoyl group, acyl group, acyloxy group, amide group, carbamoyl group, ureido group, sulfinyl group, alkylsulfonyl group, arylsulfonyl group, amino Group,
- the second polycyclic aromatic hydrocarbon has a phenyl group and has a second substituent R 2 bonded to the phenyl group;
- the first polycyclic aromatic hydrocarbon in which the substituent R 1 is connected by a single bond and the second polycyclic aromatic hydrocarbon having a phenyl group to which the second substituent R 2 is bonded are different from each other. It can be set as a structure. Such a configuration is referred to as a “first configuration of the second polycyclic aromatic hydrocarbon” for convenience.
- the second polycyclic aromatic hydrocarbon is composed of 3,9-diphenylperixanthenoxanthene (Ph-PXX),
- the second substituent R 2 can have a structure which is bound to the respective ortho or meta position of the phenyl group. Such a configuration is referred to as “the first 1A configuration of the second polycyclic aromatic hydrocarbon” for convenience.
- the second substituent R 2 is may be attached to each of the ortho and para positions of the phenyl group, the two substituents R 2 are bonded to each meta-position and para-position of the phenyl group It may be. Further, the second substituent R 2 may be the same as or different from the substituent R 1 .
- the second polycyclic aromatic hydrocarbon consists of 3,9-diphenylperixanthenoxanthene (Ph-PXX), and the second substituent R 2 is bonded to each para position of the phenyl group,
- the substituent R 1 and the second substituent R 2 can be configured differently.
- Such a configuration is referred to as “the first B configuration of the second polycyclic aromatic hydrocarbon” for convenience.
- the second polycyclic aromatic hydrocarbon is 2,8-diphenylperixanthenoxanthene or 1,7-diphenylperixane. It can be set as the structure which consists of tenoxanthene. Such a configuration is referred to as “a first C configuration of the second polycyclic aromatic hydrocarbon” for convenience.
- the second polycyclic aromatic hydrocarbon may be composed of TIPS-pentacene.
- these organic semiconductor layers are collectively referred to as “the organic semiconductor layer according to the second aspect of the present disclosure”.
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon consist of 3,9-diphenylperixanthenoxanthene (Ph-PXX),
- the binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is the para position of the phenyl group constituting the first polycyclic aromatic hydrocarbon;
- the binding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon may be configured to be an ortho position or a meta position of the phenyl group constituting the second polycyclic aromatic hydrocarbon. it can.
- the second substituent R 2 is may be attached to each of the ortho and para positions of the phenyl group, the two substituents R 2 are bonded to each meta-position and para-position of the phenyl group It may be. Further, the first substituent R 1 and the second substituent R 2 may be the same or different.
- organic semiconductor layer according to the third aspect of the present disclosure in the electronic device of the present disclosure including the above preferable form organic semiconductor layer according to the third aspect of the present disclosure in the electronic device of the present disclosure including the above preferable form
- organic semiconductor layer according to the third aspect of the present disclosure organic semiconductor layer according to the third aspect of the present disclosure (hereinafter, these organic semiconductor layers are collectively referred to as “organic semiconductor layer according to the third aspect of the present disclosure”).
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon consist of 3,9-diphenylperixanthenoxanthene (Ph-PXX),
- the binding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon can be configured to be in the para position of the phenyl group constituting the second polycyclic aromatic hydrocarbon.
- the above-mentioned substituents exemplified in the substituent R 1 are exemplified as the first substituent R 2
- examples of the second substituent R 2 include a hydrogen atom and the above-described substituents exemplified in the substituent R 1 .
- the mixed solution may be further mixed with an organic insulating material.
- the organic insulating material include poly ( ⁇ -methylstyrene), a cyclic cycloolefin polymer, and a cyclic cycloolefin copolymer.
- TOPAS manufactured by Topas Advanced Polymers GmbH, registered trademark
- ARTON registered trademark by JSR Corporation
- ZEONOR registered trademark by Nippon Zeon Co., Ltd.
- the second polycyclic aromatic hydrocarbon As a mixing ratio of the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon, when the mass of the first polycyclic aromatic hydrocarbon is “1”, the second polycyclic aromatic hydrocarbon
- the mass of the hydrocarbon is desirably 0.5 or less, preferably 0.35 or less, but is not limited thereto.
- the alkyl group constituting the substituent R 1 , the first substituent R 1, or the second substituent R 2 may be a methyl group, an ethyl group, or a propyl group. Isopropyl group, tertiary butyl group, pentyl group, hexyl group, octyl group, dodecyl group and the like. In addition, a straight chain and a branch are not ask
- Examples of the cycloalkyl group include a cyclopentyl group and a cyclohexyl group; examples of the alkenyl group include a vinyl group; examples of the alkynyl group include an ethynyl group; and an aryl group.
- Examples of the arylalkyl group include a methylaryl group, an ethylaryl group, an isopropylaryl group, a normalbutylaryl group, a p-tolyl group, and a p-ethylphenyl group.
- An alkoxy group can include a methoxy group, an ethoxy group, a propyloxy group, a pentyloxy group, a hexyloxy group, and the like; and a cycloalkoxy group can include a cyclopentyloxy group, a cyclohexyloxy group, and the like;
- Examples of the aryloxy group include a phenoxy group and a naphthyloxy group;
- examples of the alkylthio group include a methylthio group, an ethylthio group, a propylthio group, a pentylthio group, and a hexylthio group; Examples thereof include a cyclopentylthio group and a cyclohexylthio group;
- examples of the arylthio group include a phenylthio group and a naphthylthio group;
- examples of the alkoxycarbonyl group include
- acyl groups include acetyl group, ethylcarbonyl group, propylcarbonyl group, cyclohexylcarbonyl group, octylcarbonyl group, 2-ethylhexylcarbonyl group, dodecylcarbonyl group, phenylcarbonyl group, naphthylcarbonyl group, pyridylcarbonyl group and the like.
- acyloxy group include acetyloxy group, ethylcarbonyloxy group, octylcarbonyloxy group, and phenylcarbonyloxy group.
- Examples of the amide group include methylcarbonylamino group, ethylcarbonylamino group, and dimethyl group.
- carbamoyl group includes aminocarbonyl group, methylaminocarbonyl group, dimethylaminocarbonyl group, cyclohexylaminocarbonyl group, 2-ethylhexylaminocarbonyl group, phenylaminocarbonyl group, naphthylaminocarbonyl group, 2-pyridylamino
- Examples of the ureido group include a methylureido group, an ethylureido group, a cyclohexylureido group, a dodec
- a sulfinyl group such as a methylsulfinyl group, an ethylsulfinyl group, a butylsulfinyl group, a cyclohexylsulfinyl group, a 2-ethylhexylsulfinyl group, a phenylsulfuric group; Nyl group, naphthylsulfinyl group, 2-pyridylsulfinyl group and the like; and as alkylsulfonyl group, methylsulfonyl group, ethylsulfonyl group, butylsulfonyl group, cyclohexylsulfonyl group, 2-ethylhexylsulfonyl group, dodecylsulfonyl group
- the arylsulfonyl group includes a phenylsulfonyl group, a nap
- An amino group, a 2-ethylhexylamino group, an anilino group, a naphthylamino group, a 2-pyridylamino group, and the like; and a halogen atom can include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom;
- Examples of the fluorinated hydrocarbon group include a fluoromethyl group, a trifluoromethyl group, a pentafluoroethyl group, and a pentafluorophenyl group.
- a cyano group, a nitro group, a hydroxy group, and a mercapto group can be exemplified, and examples of the silyl group include a trimethylsilyl group, a triisopropylsilyl group, a triphenylsilyl group, and a phenyldiethylsilyl group.
- the substituents exemplified above may be further substituted with the above substituents. Moreover, these substituents may be bonded together to form a ring.
- an additive for example, a so-called doping material such as an n-type impurity or a p-type impurity
- a so-called doping material such as an n-type impurity or a p-type impurity
- the electronic device of the present disclosure may have a so-called three-terminal structure or a two-terminal structure as described above.
- An electronic device having a three-terminal structure constitutes, for example, a field effect transistor, more specifically, a thin film transistor (TFT), or a light emitting element. That is, a light emitting element (an organic light emitting element or an organic light emitting transistor) in which the active layer emits light by applying a voltage to the control electrode, the first electrode, and the second electrode can be configured.
- TFT thin film transistor
- a light emitting element an organic light emitting element or an organic light emitting transistor
- the current flowing from the first electrode to the second electrode in the active layer is controlled by the voltage applied to the control electrode.
- the organic semiconductor material constituting the active layer is light emission based on charge accumulation by modulation based on voltage applied to the control electrode or recombination of injected electrons and holes.
- the emission intensity is proportional to the absolute value of the current flowing from the first electrode to the second electrode, and is modulated by the voltage applied to the control electrode and the voltage applied between the first electrode and the second electrode. can do.
- the electronic device functions as a field effect transistor or a light emitting element depends on the voltage application state (bias) to the first electrode and the second electrode.
- a current flows from the first electrode to the second electrode by modulating the control electrode after applying a bias within a range in which electron injection from the second electrode does not occur. This is transistor operation.
- a photoelectric conversion element in which a current flows between the first electrode and the second electrode by irradiating light to the active layer can be given.
- various sensors such as a solar cell, an image sensor, and an optical sensor can be configured by the photoelectric conversion element.
- an organic electroluminescence element (organic EL element) or an organic EL display device can be configured, or can function as a chemical substance sensor.
- the electronic device can be a display element, a display device, a solar cell, or a sensor. Alternatively, it can be a capacitor.
- a photoelectric conversion element can also be configured from an electronic device having a three-terminal structure. In this case, voltage application to the control electrode may or may not be performed. In the latter case, to the control electrode. By applying this voltage, it is possible to modulate the flowing current.
- the first electrode, the second electrode, and the active layer are formed on the base or formed above the base.
- a semiconductor device is configured from the electronic device of the present disclosure, specifically, as the semiconductor device, a bottom-gate / bottom-contact field effect transistor (FET), a bottom-gate / top-contact FET, and a top-gate / bottom contact Type FET and top gate / top contact type FET.
- FET field effect transistor
- the bottom gate / bottom contact type FET is: (A) a gate electrode (control electrode) formed on the substrate, (B) a gate insulating layer (insulating layer) formed on the gate electrode and the substrate; (C) source / drain electrodes (first electrode and second electrode) formed on the gate insulating layer, and (D) a channel forming region formed between the source / drain electrodes and on the gate insulating layer and configured by the active layer; It has.
- the bottom gate / top contact type FET is: (A) a gate electrode (control electrode) formed on the substrate, (B) a gate insulating layer (insulating layer) formed on the gate electrode and the substrate; (C) a channel formation region formed on the gate insulating layer and configured by an active layer, a channel formation region extension, and (D) Source / drain electrodes (first electrode and second electrode) formed on the channel forming region extension part, It has.
- the top gate / bottom contact type FET is: (A) Source / drain electrodes (first electrode and second electrode) formed on the substrate, (B) a channel forming region formed on the substrate between the source / drain electrodes and constituted by an active layer; (C) a gate insulating layer (insulating layer) formed on the source / drain electrodes and the channel formation region, and (D) a gate electrode (control electrode) formed on the gate insulating layer; It has.
- the top gate / top contact type FET is: (A) a channel formation region formed on the substrate and configured by an active layer and a channel formation region extension part; (B) Source / drain electrodes (first electrode and second electrode) formed on the channel forming region extension part, (C) a gate insulating layer (insulating layer) formed on the source / drain electrodes and the channel formation region, and (D) a gate electrode (control electrode) formed on the gate insulating layer; It has.
- the base is a silicon oxide-based material (for example, SiO x , spin-on glass (SOG), silicon oxynitride (SiON)); silicon nitride (SiN Y ); aluminum oxide (Al 2 O 3 ), HfO 2, or the like. It can be composed of a metal oxide high dielectric insulating film; a metal oxide; a metal salt. When the base is composed of these materials, the base may be formed on a support appropriately selected from the following materials (or above the support).
- polymethyl methacrylate polymethyl methacrylate
- PMMA polymethyl methacrylate
- PVA polyvinyl alcohol
- PVP polyvinyl phenol
- PES polyethersulfone
- PC polycarbonate
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- polymer materials such as flexible plastic films, plastic sheets and plastic substrates made of polymer materials
- natural mineral insulating materials such as mica, metallic semiconductor materials, and molecular semiconductor materials.
- an electronic device can be incorporated or integrated into an image display device (display device) having a curved shape or an electronic device.
- a substrate various glass substrates, various glass substrates having an insulating film formed on the surface, quartz substrates, quartz substrates having an insulating film formed on the surface, silicon substrates having an insulating film formed on the surface, Examples thereof include a conductive substrate (a substrate made of a metal or alloy such as gold, aluminum or stainless steel, or a substrate made of highly oriented graphite) on which an insulating film is formed.
- a conductive substrate a substrate made of a metal or alloy such as gold, aluminum or stainless steel, or a substrate made of highly oriented graphite
- an appropriate material may be selected from the materials described above.
- the support include a conductive substrate (a substrate made of a metal such as gold or aluminum, a substrate made of highly oriented graphite, a stainless steel substrate, etc.).
- a conductive substrate a substrate made of a metal such as gold or aluminum, a substrate made of highly oriented graphite, a stainless steel substrate, etc.
- the electronic device is provided on the support member depending on the configuration and structure of the electronic device, this support member can also be configured from the above-described materials.
- control electrode As a material constituting the control electrode, the first electrode, the second electrode, the gate electrode, the source / drain electrode, and the wiring (hereinafter collectively referred to as “control electrode etc.”), platinum (Pt), gold ( Au), palladium (Pd), chromium (Cr), nickel (Ni), aluminum (Al), silver (Ag), tantalum (Ta), tungsten (W), copper (Cu), titanium (Ti), indium ( In, metals such as tin (Sn), iron (Fe), cobalt (Co), zinc (Zn), magnesium (Mg), manganese (Mn), ruthenium (Rh), rubidium (Rb), molybdenum (Mo) Or, an alloy containing these metal elements, conductive particles made of these metals, conductive particles of alloys containing these metals, conductive substances such as polysilicon containing impurities, carbon-based materials, etc.
- the electrode in contact with the organic semiconductor layer is composed of copper (Cu), aluminum (Al), so that carrier injection is possible. Therefore, it is possible to realize good transistor characteristics with a low barrier, and it is preferable from the viewpoint of the cost of the electrode material.
- organic materials such as poly (3,4-ethylenedioxythiophene) / polystyrene sulfonic acid [PEDOT / PSS], TTF-TCNQ, and polyaniline are listed as materials constituting the control electrode and the like. You can also. The materials constituting the control electrode and the like may be the same material or different materials.
- PVD method physical vapor deposition method
- PLD pulsed laser deposition method
- CVD method Phase growth method
- spin coating method various printing methods such as screen printing method, ink jet printing method, offset printing method, reverse offset printing method, gravure printing method, gravure offset printing method, letterpress printing, flexographic printing, micro contact method
- Air doctor coater method, blade coater method, rod coater method, knife coater method, squeeze coater method, reverse roll coater method, transfer roll coater method, gravure coater method, kiss coater method, cast coater method, spray coater method, slit coater method Method, slit orifice coating -Coating method such as calender coater method, casting method, capillary coater method, bar coater method, dipping method; stamp method; cast method; method using dispenser; spray method; lift-off method; shadow mask method; Any of plating methods such as an electrolytic plating method, an electroless plating method, or a combination thereof, and a
- PVD methods various vacuum deposition methods such as electron beam heating method, resistance heating method, flash vapor deposition, and crucible heating method, (b) plasma vapor deposition method, (c) bipolar sputtering method, DC sputtering Various sputtering methods such as DC method, DC magnetron sputtering method, high frequency sputtering method, magnetron sputtering method, ion beam sputtering method, bias sputtering method, (d) DC (direct current) method, RF method, multi-cathode method, activation reaction method And various ion plating methods such as an electric field evaporation method, a high-frequency ion plating method, and a reactive ion plating method.
- control electrode or the like When the control electrode or the like is formed based on an etching method, a dry etching method or a wet etching method may be employed. Examples of the dry etching method include ion milling and reactive ion etching (RIE). Further, the control electrode or the like can be formed based on a laser ablation method, a mask vapor deposition method, a laser transfer method, or the like.
- RIE reactive ion etching
- Examples of the material constituting the insulating layer include silicon oxide materials; silicon nitride (SiN Y ); metal oxide high dielectric insulating films such as aluminum oxide (Al 2 O 3 ) and HfO 2.
- silicon oxide materials silicon oxide materials
- metal oxide high dielectric insulating films such as aluminum oxide (Al 2 O 3 ) and HfO 2.
- PMMA polymethyl methacrylate
- PVP polyvinylphenol
- PVA polyvinyl alcohol
- PET polyethylene terephthalate
- polystyrene N-2 (aminoethyl) 3 -Silanol derivatives (silane coupling agents) such as aminopropyltrimethoxysilane (AEAPTMS), 3-mercaptopropyltrimethoxysilane (MPTMS), octadecyltrichlorosilane (OTS); control electrode at one end of octadecane
- organic insulating material capable of binding a functional group (organic polymers) may also be used a combination thereof.
- silicon oxide-based material silicon oxide (SiO x ), BPSG, PSG, BSG, AsSG, PbSG, silicon oxynitride (SiON), SOG (spin-on-glass), low dielectric constant material [for example, polyaryl ether, And cycloperfluorocarbon polymer and benzocyclobutene, cyclic fluororesin, amorphous fluororesin (for example, CYTOP manufactured by Asahi Glass Co., Ltd.), polytetrafluoroethylene, fluorinated aryl ether, fluorinated polyimide, amorphous carbon, organic SOG] Can do.
- the insulating layer is formed by the various PVD methods described above; various CVD methods; spin coating methods; the various printing methods described above; the various coating methods described above; the dipping method; the casting method; the sol-gel method; It can be formed by any one of a shadow mask method and a spray method. Alternatively, it can be formed by oxidizing or nitriding the surface of the control electrode (gate electrode), or by forming an oxide film or nitride film on the surface of the control electrode. As a method for oxidizing the surface of the control electrode, although depending on the material constituting the control electrode, an oxidation method using O 2 plasma and an anodic oxidation method can be exemplified.
- a nitriding method using N 2 plasma can be exemplified.
- an insulating molecule having a functional group that can form a chemical bond with the control electrode such as a linear hydrocarbon modified at one end with a mercapto group.
- An insulating layer can be formed on the surface of the control electrode (gate electrode) by coating the surface of the control electrode in a self-organizing manner by a method such as the method.
- the insulating layer (gate insulating layer) can be formed by modifying the surface of the control electrode (gate electrode) with a silanol derivative (silane coupling agent).
- the active layer may be patterned based on a known method such as a wet etching method, a dry etching method, or a laser ablation method.
- known solvents can be used, and may be selected as desired.
- benzene 1, 2
- at least one of -dichlorobenzene, o-dichlorobenzene, cyclohexane and ethylcyclohexane is just to determine the drying conditions (temperature, time, etc.) of a mixed solution suitably according to the solvent etc. to be used.
- an image display apparatus can be exemplified.
- an image display device a so-called desktop personal computer, notebook personal computer, mobile personal computer, PDA (Personal Digital Assist), mobile phone, game machine, electronic book, electronic newspaper, etc.
- an organic electroluminescence display device, a liquid crystal display device, a plasma display device, an electrophoretic display device, a cold cathode field emission display device, and the like can be given.
- various illuminating devices can also be mentioned.
- an electronic device When an electronic device is applied to and used in various image display apparatuses and various electronic devices, it may be a monolithic integrated circuit in which a large number of electronic devices are integrated on a support member, or each electronic device is cut and individualized as a discrete component. May be used. Moreover, you may seal an electronic device with resin.
- Example 1 relates to the organic semiconductor layer according to the first to third aspects of the present disclosure, the electronic device of the present disclosure, and the method of manufacturing the electronic device of the present disclosure.
- the first polycyclic aromatic carbonization in which substituent R 1 other than a hydrogen atom is connected by a single bond Hydrogen and the second polycyclic aromatic hydrocarbon are mixed.
- the first polycyclic aromatic hydrocarbon has a phenyl group, and the substituent R 1 is bonded to the phenyl group.
- the first polycyclic aromatic hydrocarbon is specifically composed of 3,9-diphenylperixanthenoxanthene (Ph-PXX), and is represented by the following structural formula (10) or structural formula (11). As shown, substituent R 1 is attached to each para position of the phenyl group.
- the substituent R 1 is an alkyl group, specifically, an ethyl group [Structural Formula (10)] or a propyl group [Structural Formula (11)].
- the structural formula (10) may hereinafter be referred to as “C2-Ph-PXX”, and the structural formula (11) may be referred to as “C3-Ph-PXX” hereinafter.
- the second polycyclic aromatic hydrocarbon has a phenyl group and a second substituent R 2 bonded to the phenyl group.
- the first polycyclic aromatic hydrocarbon in which the substituent R 1 is connected by a single bond and the second polycyclic aromatic hydrocarbon having a phenyl group to which the second substituent R 2 is bonded are: , Different (first configuration of the second polycyclic aromatic hydrocarbon).
- the second polycyclic aromatic hydrocarbon is specifically composed of 3,9-diphenylperixanthenoxanthene (Ph-PXX), and the second substituent R 2 is a phenyl group. It is bonded to the ortho- or meta-position.
- the structural formula of such a second polycyclic aromatic hydrocarbon (the 1st A configuration of the second polycyclic aromatic hydrocarbon) is shown below.
- the second polycyclic aromatic hydrocarbon is specifically composed of Ph-PXX, and the second substituent R 2 is bonded to each para position of the phenyl group, and the substituent R 1 And the second substituent R 2 is different.
- the structural formula of such a second polycyclic aromatic hydrocarbon (the 1B configuration of the second polycyclic aromatic hydrocarbon) is shown below.
- the second polycyclic aromatic hydrocarbon is specifically composed of 2,8-diphenylperixanthenoxanthene or 1,7-diphenylperixanthenoxanthene.
- the structural formula of such a second polycyclic aromatic hydrocarbon (the 1C configuration of the second polycyclic aromatic hydrocarbon) is shown below.
- the second polycyclic aromatic hydrocarbon consists of TIPS-pentacene.
- the first substituent R 1 other than a hydrogen atom is connected by a single bond.
- the hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of the same polycyclic aromatic hydrocarbon; the binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is the second It is different from the bonding site of the substituent R 2 to the second polycyclic aromatic hydrocarbon.
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of Ph-PXX, and the first substituent R 1
- the binding site to the first polycyclic aromatic hydrocarbon is the para position of the phenyl group constituting the first polycyclic aromatic hydrocarbon
- the bonding site to the hydrocarbon is an ortho position or a meta position of the phenyl group constituting the second polycyclic aromatic hydrocarbon.
- the first polycyclic aromatic hydrocarbon is composed of C2-Ph-PXX or C3-Ph-PXX
- the second polycyclic aromatic hydrocarbon is shown in Examples 1a to 1f. Have the following structural formula.
- the first substituent R 1 other than a hydrogen atom is connected by a single bond.
- the hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of the same polycyclic aromatic hydrocarbon; the binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is the second It is the same as the bonding site of the substituent R 2 to the second polycyclic aromatic hydrocarbon; the first substituent R 1 and the second substituent R 2 are different.
- the first polycyclic aromatic hydrocarbons and a second polycyclic aromatic hydrocarbons consists Ph-PXX; first substituent R 1
- the bonding site to hydrogen is the para position of the phenyl group constituting the second polycyclic aromatic hydrocarbon.
- the first polycyclic aromatic hydrocarbon is composed of C2-Ph-PXX or C3-Ph-PXX
- the second polycyclic aromatic hydrocarbon is formed from Examples 1g to 1k. Examples 1m to having the structural formula shown in Example 1o.
- the electronic devices of Example 1 or Examples 2 to 4 described later are: A first electrode, A second electrode spaced apart from the first electrode; Control electrodes, and Insulation layer, With The control electrode is a three-terminal electronic device that is provided to face a portion of the active layer located between the first electrode and the second electrode via an insulating layer.
- the three-terminal electronic device of Example 1 or Examples 2 to 4 described later flows from the first electrode toward the second electrode in the active layer by the voltage applied to the control electrode.
- a field effect transistor (FET) in which current is controlled the control electrode corresponds to the gate electrode, the first electrode and the second electrode correspond to the source / drain electrodes, the insulating layer corresponds to the gate insulating film, and active The layer corresponds to a channel formation region.
- FET field effect transistor
- the electronic device of Example 1 is a semiconductor device, specifically, a bottom-gate / bottom-contact field effect transistor [more specifically, Thin film transistor (TFT)], (A) a gate electrode 14 (corresponding to a control electrode) formed on the substrate 10; (B) a gate insulating layer 15 (corresponding to an insulating layer) formed on the gate electrode 14 and the substrate 10; (C) a source / drain electrode 16 (corresponding to a first electrode and a second electrode) formed on the gate insulating layer 15, and (D) a channel forming region 17 formed between the source / drain electrodes 16 and on the gate insulating layer 15 and constituted by the active layer 20; It has.
- TFT Thin film transistor
- FIGS. 1A and 1B are schematic partial end views of a substrate and the like.
- the gate electrode 14 is formed on the substrate 10. Specifically, a resist layer (not shown) from which a portion where the gate electrode 14 is to be formed is formed on the insulating film 12 made of SiO 2 formed on the surface of the glass substrate 11 based on the lithography technique. To do. Thereafter, a titanium (Ti) layer (not shown) as an adhesion layer and a gold (Au) layer as a gate electrode 14 are sequentially formed on the entire surface by vacuum deposition, and then the resist layer is removed. To do. Thus, the gate electrode 14 can be obtained based on the so-called lift-off method. Note that the gate electrode 14 can also be formed on the insulating film 12 made of SiO 2 formed on the surface of the glass substrate 11 based on a printing method.
- a gate insulating layer 15 corresponding to an insulating layer is formed on the base 10 including the gate electrode 14 (more specifically, the insulating film 12 formed on the surface of the glass substrate 11).
- the gate insulating layer 15 made of SiO 2 is formed on the gate electrode 14 and the insulating film 12 based on the sputtering method.
- a source / drain electrode 16 made of a copper (Cu) layer having a thickness of 25 nm is formed on the gate insulating layer 15 based on a screen printing method (see FIG. 1A).
- Cu copper
- the first polycyclic aromatic hydrocarbon comprising C2-Ph-PXX or C3-Ph-PXX shown in Structural Formula (10) and Structural Formula (11), and Examples 1a to
- the mass of the first polycyclic aromatic hydrocarbon is “1” with respect to the second polycyclic aromatic hydrocarbon shown in Example 1s
- the mass of the second polycyclic aromatic hydrocarbon is 0.00.
- the mixture mixed as 053 was dissolved in a solvent such as tetralin, xylene, toluene or the like or a mixed solvent obtained by mixing these with a high boiling point solvent so as to be 0.5% by mass.
- the mixed solution (A), the mixed solution (B), or the mixed solution (C) is applied on the basis of a spin coating method and dried, so that the channel formation region 17 (active layer 20) is formed in the gate insulating layer 15 and the source. / It can be formed on the drain electrode 16 (see FIG. 1B).
- the image display unit is formed on or above the TFT, which is an electronic device constituting the control unit (pixel drive circuit) of the image display device thus obtained.
- an image display device including an organic electroluminescence element, an electrophoretic display element, a semiconductor light emitting element, or the like
- the electronic device constituting the control unit (pixel drive circuit) of the image display device and the electrode (for example, pixel electrode) in the image display unit obtained in this way are connected by a connection unit such as a contact hole or a wiring.
- a connection unit such as a contact hole or a wiring.
- a passivation film (not shown) is formed on the entire surface.
- FET bottom gate / bottom contact type semiconductor device
- a passivation film (not shown) may be formed on the entire surface, thereby improving the adhesion between the active layer 20 and the gate insulating layer 15. Can be planned.
- Example 1 In the electronic device of Example 1, a mixture of two types of polycyclic aromatic hydrocarbons was used for the channel formation region, and carrier mobility could be improved as compared with Comparative Example 1. Specifically, when the carrier mobility when the active layer is formed only from the first polycyclic aromatic hydrocarbon is set to “1”, the carrier movement in Examples 1a to 1r is except for Example 1s. The degree was 2 or more.
- Example 1g Comparative Example 1 a 11.57 ⁇ 11.52 ⁇ b 12.92 ⁇ 12.82 ⁇ c 22.2 ⁇ 22.6. ⁇ 96.2 ° 95.7 °
- the carrier mobility ⁇ is expressed by the following equation. here, ⁇ 0 : Prefactor E a : Activation energy k B : Boltzmann constant T 2: Temperature.
- ⁇ 0 is a term that greatly depends on the molecular arrangement, but as shown in Table 2, since the change in the lattice constant of the thin film is small, only the first polycyclic aromatic hydrocarbon (Comparative Example 1), In addition, it is considered that there is no significant difference in the value of ⁇ 0 between the first polycyclic aromatic hydrocarbon and the mixture of the second polycyclic aromatic hydrocarbon (Example 1g). Therefore, it thought to improve the mobility ⁇ by the value of the activation energy E a is reduced.
- the crystallite size becomes large. It is widely known that the crystallite size can be obtained from the half width obtained by XRD analysis (in-plane) of a thin film. As compared with Comparative Example 1, it was confirmed that the crystallite size was increased in Example 1g obtained by mixing the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon. This is considered to have improved carrier mobility. In Comparative Example 1, the crystallite size was 80 nm, but in Example 1g, the crystallite size was 105 nm. That is, the crystallite size was about 1.3 times.
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are dissolved in a solvent.
- the second polycyclic aromatic hydrocarbon having high solubility in the solvent may be selected.
- the organic semiconductor layer can be formed by a coating method. It is possible to easily obtain an optimal mixed solution state when forming the film.
- Example 1 when two types of organic semiconductor materials (low-molecular organic semiconductor materials and high-molecular organic semiconductor materials) with greatly different structures are mixed to form a film, they are completely different from the state of each single-component thin film. As a result of the formation of the molecular arrangement, the film formation conditions may change significantly. When a low molecular organic semiconductor material and a high molecular organic semiconductor material are mixed, the resulting organic semiconductor layer is amorphous. This may cause a problem that the off-state current increases and the off-state current increases. However, in Example 1, except for Example 1s, two types of polycyclic aromatic hydrocarbons having the same central skeleton (the part where the carrier flows and PXX in Example 1) are mixed.
- the film forming conditions greatly change.
- the obtained organic semiconductor layer can have high crystallinity, there is no problem that the off-current increases. That is, when a higher concentration is required in a printing method or the like, if the first polycyclic aromatic hydrocarbon has low solubility and cannot be further added, the second polycyclic aromatic having better solubility. By adding the group hydrocarbon, the concentration can be adjusted freely.
- the second embodiment is a modification of the first embodiment.
- the three-terminal electronic device was a bottom gate / top contact type FET (specifically, a TFT).
- a gate electrode 14 (corresponding to a control electrode) formed on the substrate 10;
- a gate insulating layer 15 (corresponding to an insulating layer) formed on the gate electrode 14 and the substrate 10;
- C a channel forming region 17 and a channel forming region extending portion 18 formed on the gate insulating layer 15 and configured by the active layer 20, and
- a source / drain electrode 16 (corresponding to a first electrode and a second electrode) formed on the channel forming region extension 18; It has.
- FIGS. 2A and 2B are schematic partial end views of the substrate and the like.
- Step-200 First, after forming the gate electrode 14 on the substrate 10 in the same manner as [Step-100] of Example 1, the substrate including the gate electrode 14 (more than in [Step-110] of Example 1) Specifically, the gate insulating layer 15 is formed on the insulating film 12).
- the active layer 20 is formed on the gate insulating layer 15 in the same manner as in [Step-130] of Example 1 (see FIG. 2A).
- the channel formation region 17 and the channel formation region extension 18 can be obtained.
- the source / drain electrode 16 is formed on the channel forming region extension 18 so as to sandwich the channel forming region 17 (see FIG. 2B). Specifically, a copper (Cu) layer as the source / drain electrode 16 is formed based on the screen printing method in the same manner as in [Step-120] of the first embodiment.
- Cu copper
- the third embodiment is also a modification of the first embodiment.
- the three-terminal electronic device was a top gate / bottom contact type FET (specifically, a TFT).
- a TFT top gate / bottom contact type FET
- Source / drain electrode 16 (corresponding to the first electrode and the second electrode) formed on the substrate 10
- B a channel forming region 17 formed on the substrate 10 between the source / drain electrodes 16 and constituted by the active layer 20
- a gate electrode 14 (corresponding to a control electrode) formed on the gate insulating layer 15; It has.
- FIGS. 3A and 3B are schematic partial end views of the substrate and the like.
- Step-300 First, after forming the source / drain electrode 16 on the insulating film 12 corresponding to the substrate by the same method as [Step-120] of Example 1, the same as [Step-130] of Example 1, A channel formation region 17 (active layer 20) is formed on the insulating film 12 including the source / drain electrodes 16 (see FIG. 3A).
- the gate insulating layer 15 is formed in the same manner as in [Step-110] in the first embodiment. Thereafter, the gate electrode 14 is formed on the portion of the gate insulating layer 15 above the channel formation region 17 by the same method as [Step-100] of Example 1 (see FIG. 3B).
- the fourth embodiment is also a modification of the first embodiment.
- the three-terminal electronic device was a top gate / top contact type FET (specifically, a TFT).
- a TFT top gate / top contact type FET
- the field effect transistor of Example 4 as shown in a schematic partial cross-sectional view in FIG.
- A a channel forming region 17 and a channel forming region extending portion 18 formed on the substrate 10 and configured by the active layer 20;
- B a source / drain electrode 16 (corresponding to a first electrode and a second electrode) formed on the channel forming region extension 18;
- C a gate insulating layer 15 (corresponding to an insulating layer) formed on the source / drain electrode 16 and the channel formation region 17, and
- D a gate electrode 14 (corresponding to a control electrode) formed on the gate insulating layer 15; It has.
- FIGS. 4A, 4B, and 4C are schematic partial end views of the substrate and the like.
- the active layer 20 is formed on the substrate 10 (more specifically, the insulating film 12), so that the channel forming region 17 and the channel forming region extending portion are formed. 18 can be obtained (see FIG. 4A).
- the source / drain electrode 16 is formed on the channel forming region extending portion 18 in the same manner as in [Step-120] in Example 1 (see FIG. 4B).
- the gate insulating layer 15 is formed by the same method as in [Step-110] in the first embodiment.
- the gate electrode 14 is formed on the portion of the gate insulating layer 15 above the channel formation region 17 by the same method as [Step-100] of Example 1 (see FIG. 4C).
- the fifth embodiment is also a modification of the first embodiment.
- the electronic device is specifically composed of a two-terminal electronic device, and more specifically, a schematic partial cross-sectional view is shown.
- the active layer 33 includes the first polycyclic aromatic hydrocarbon composed of C2-Ph-PXX or C3-Ph-PXX, and the second polycyclic aromatic carbon described in Examples 1a to 1s. Consists of a mixture of hydrogen. Then, electric power is generated by irradiating the active layer 33 with light. That is, the electronic device of Example 5 functions as a photoelectric conversion element or a solar cell. Alternatively, the active layer 33 functions as a light emitting element that emits light when a voltage is applied to the first electrode 31 and the second electrode 32.
- the electronic device of Example 5 can also function as a chemical substance sensor composed of a two-terminal electronic device. Specifically, when the chemical substance to be detected is adsorbed on the active layer 33, the electrical resistance value between the first electrode 31 and the second electrode 32 changes. Therefore, a current is passed between the first electrode 31 and the second electrode 32, or an appropriate voltage is applied between the first electrode 31 and the second electrode 32, and the electric resistance value of the active layer 33 is reduced. By measuring, the amount (concentration) of the chemical substance adsorbed on the active layer 33 can be measured. Since the chemical substance is in an adsorption equilibrium state in the active layer 33, the equilibrium state changes as time passes and the amount (concentration) of the chemical substance in the atmosphere in which the active layer 33 is placed changes.
- Example 5 Except for the above points, the configuration and structure of the electronic device of Example 5 are basically the same as those of Example 1 or Example 2 except that the control electrode and the insulating layer are not provided. The detailed description will be omitted.
- the electronic device of Example 5 performs the same steps as [Step-120] to [Step-130] of Example 1, or alternatively, [Step-210] to [Step-220] of Example 2. It can be obtained by executing a similar process.
- first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are not limited to the examples, and the structure, configuration, formation conditions, and manufacturing conditions of the electronic device are also illustrative. Yes, it can be changed as appropriate.
- a plurality of types of first polycyclic aromatic hydrocarbons and one type of second polycyclic aromatic hydrocarbon may be mixed, or one type of first polycyclic aromatic hydrocarbon and Plural kinds of second polycyclic aromatic hydrocarbons may be mixed, or plural kinds of first polycyclic aromatic hydrocarbons and plural kinds of second polycyclic aromatic hydrocarbons may be mixed. Good.
- the electronic device of the present disclosure when applied to and used in various image display apparatuses and various electronic apparatuses, it may be a monolithic integrated circuit in which a large number of electronic devices are integrated on a support member, or each electronic device may be cut and individually And may be used as discrete parts.
- the gate insulating layer 15 and the active layer 20 can also be formed based on the phase separation method described below. That is, a first polycyclic aromatic hydrocarbon, a second polycyclic aromatic hydrocarbon, and poly ( ⁇ -methylstyrene) that is an organic insulating material are uniformly dissolved in mesitylene to prepare a mixed solution. Then, in a step similar to [Step-200] in Example 2, a first gate insulating layer covering base 10 and gate electrode 14 is formed.
- an insulating material made of a photocurable or thermosetting organic substance for example, a polyvinylphenol (PVP) solution containing a crosslinking agent
- a photocurable or thermosetting organic substance for example, a polyvinylphenol (PVP) solution containing a crosslinking agent
- the first gate insulating layer made of polyvinylphenol can be obtained by heating to 150 ° C.
- the above mixed solution is applied on the first gate insulating layer based on the spin coat method, and then the obtained coating film is 100 ° C. or higher, preferably 130 ° C. or higher in the atmosphere for 20 minutes to 30 minutes. Let dry for a minute.
- the second gate insulating layer is not contaminated before the organic semiconductor layer is formed, and the interface between the second gate insulating layer and the organic semiconductor layer has high smoothness, and these Since the layer has high film thickness accuracy, it is possible to manufacture an electronic device having excellent performance with little variation in characteristics.
- the electronic device manufacturing method described above or the electronic device manufacturing method described below can also be applied to the first embodiment and the third to fourth embodiments.
- a cyclic cycloolefin polymer or a cyclic cycloolefin copolymer specifically, for example, TOPAS can be used as the organic insulating material.
- a mixed solution may be prepared by uniformly dissolving the first polycyclic aromatic hydrocarbon, the second polycyclic aromatic hydrocarbon, and TOPAS, which is an organic insulating material, in xylene. Then, in a step similar to [Step-200] in Example 2, a first gate insulating layer covering base 10 and gate electrode 14 is formed.
- an insulating material made of a photocurable or thermosetting organic substance for example, a polyvinylphenol (PVP) solution containing a crosslinking agent
- a photocurable or thermosetting organic substance for example, a polyvinylphenol (PVP) solution containing a crosslinking agent
- the first gate insulating layer made of polyvinylphenol can be obtained by heating to 150 ° C.
- the above mixed solution is applied on the first gate insulating layer based on the spin coat method, and then the obtained coating film is 100 ° C. or higher, preferably 130 ° C. or higher in the atmosphere for 20 minutes to 30 minutes. Let dry for a minute.
- Organic Semiconductor Layer First Aspect >> An organic semiconductor layer formed by mixing a first polycyclic aromatic hydrocarbon in which a substituent R 1 other than a hydrogen atom is connected by a single bond, and a second polycyclic aromatic hydrocarbon.
- the first polycyclic aromatic hydrocarbon has a phenyl group, The organic semiconductor layer according to [1], wherein the substituent R 1 is bonded to a phenyl group.
- Substituent R 1 is an alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryl group, arylalkyl group, aromatic heterocyclic ring, heterocyclic group, alkoxy group, cycloalkoxy group, aryloxy group, alkylthio group.
- the second polycyclic aromatic hydrocarbon has a phenyl group, and has a second substituent R 2 bonded to the phenyl group,
- the first polycyclic aromatic hydrocarbon in which the substituent R 1 is connected by a single bond and the second polycyclic aromatic hydrocarbon having a phenyl group to which the second substituent R 2 is bonded are different from each other.
- the second polycyclic aromatic hydrocarbon is composed of 3,9-diphenylperixanthenoxanthene, The organic semiconductor layer according to [6], wherein the second substituent R 2 is bonded to each ortho-position or meta-position of the phenyl group.
- the second polycyclic aromatic hydrocarbon is composed of 3,9-diphenylperixanthenoxanthene, The second substituent R 2 is bonded to the respective para position of the phenyl group;
- the organic semiconductor layer according to [6], wherein the second polycyclic aromatic hydrocarbon is composed of 2,8-diphenylperixanthenoxanthene or 1,7-diphenylperixanthenoxanthene.
- the second substituent R 2 is a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryl group, an arylalkyl group, an aromatic heterocyclic ring, a heterocyclic group, an alkoxy group, or a cycloalkoxy group.
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon consist of 3,9-diphenylperixanthenoxanthene,
- the binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is the para position of the phenyl group constituting the first polycyclic aromatic hydrocarbon;
- the binding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon is the ortho position or the meta position of the phenyl group constituting the second polycyclic aromatic hydrocarbon [12].
- Organic semiconductor layer is
- the first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon consist of 3,9-diphenylperixanthenoxanthene, The binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon, the para position of the phenyl group constituting the first polycyclic aromatic hydrocarbon;
- the organic semiconductor according to [14], wherein the binding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon is the para position of the phenyl group constituting the second polycyclic aromatic hydrocarbon. layer.
- the first substituent R 1 is an alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryl group, arylalkyl group, aromatic heterocyclic ring, heterocyclic group, alkoxy group, cycloalkoxy group, aryloxy Group, alkylthio group, cycloalkylthio group, arylthio group, alkoxycarbonyl group, aryloxycarbonyl group, sulfamoyl group, acyl group, acyloxy group, amide group, carbamoyl group, ureido group, sulfinyl group, alkylsulfonyl group, arylsulfonyl group, An amino group, a halogen atom, a fluorinated hydrocarbon group, a cyano group, a nitro group, a hydroxy group, a mercapto group, and one kind of substituent selected from the group consisting of
- ⁇ Electronic device A first electrode, A second electrode spaced apart from the first electrode, and An active layer extending from the first electrode to the second electrode; At least, The active layer is an electronic device comprising the organic semiconductor layer according to any one of [1] to [16]. [18] comprising a first electrode, a second electrode spaced apart from the first electrode, a control electrode, and an insulating layer; The electronic device according to [17], wherein the control electrode is provided so as to face a portion of the active layer located between the first electrode and the second electrode via an insulating layer.
- An electronic device manufacturing method comprising at least A mixed solution in which a first polycyclic aromatic hydrocarbon in which a substituent R 1 other than a hydrogen atom is linked by a single bond and a second polycyclic aromatic hydrocarbon, or The first polycyclic aromatic hydrocarbon in which the first substituent R 1 other than a hydrogen atom is bonded by a single bond and the second polycyclic aromatic hydrocarbon in which the second substituent R 2 other than a hydrogen atom is bonded by a single bond Mixed with polycyclic aromatic hydrocarbons, The first polycyclic aromatic hydrocarbon and the second polycyclic aromatic hydrocarbon are composed of the same polycyclic aromatic hydrocarbon; A mixed solution in which the binding site of the first substituent R 1 to the first polycyclic aromatic hydrocarbon is different from the binding site of the second substituent R 2 to the second polycyclic aromatic hydrocarbon; or , The first polycyclic
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Abstract
Description
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と異なる。
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と同じであり、
第1の置換基R1と第2の置換基R2とは異なる。
第1電極、
第1電極と離間して設けられた第2電極、及び、
第1電極から第2電極に亙り設けられた能動層、
を少なくとも備えており、
能動層は、上記の本開示の第1の態様あるいは第2の態様あるいは第3の態様に係る有機半導体層から成る。
第1電極、
第1電極と離間して設けられた第2電極、及び、
第1電極から第2電極に亙り設けられた能動層、
を少なくとも備えた電子デバイスの製造方法であって、
水素原子以外の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の多環芳香族炭化水素とが混合されて成る混合溶液(A)、又は、
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と異なる混合溶液(B)、又は、
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と同じであり、
第1の置換基R1と第2の置換基R2とは異なる混合溶液(C)を、塗布、乾燥することで能動層を形成する。
1.本開示の第1の態様~第3の態様に係る有機半導体層、電子デバイス、及び、電子デバイスの製造方法、全般に関する説明
2.実施例1(本開示の第1の態様~第3の態様に係る有機半導体層、電子デバイス、及び、電子デバイスの製造方法)
3.実施例2(実施例1の変形)
4.実施例3(実施例1の別の変形)
5.実施例4(実施例1の更に別の変形)
6.実施例5(実施例1の更に別の変形、2端子型電子デバイス)、その他
本開示の電子デバイス、あるいは、本開示の電子デバイスの製造方法にて得られる電子デバイスを、所謂2端子型の電子デバイスとすることができるし、あるいは又、
第1電極、第1電極と離間して設けられた第2電極、制御電極、及び、絶縁層を備えており、
制御電極は、絶縁層を介して、第1電極と第2電極との間に位置する能動層の部分に対向して設けられている形態、即ち、所謂3端子型の電子デバイスとすることができる。
第1の多環芳香族炭化水素はフェニル基を有しており、
置換基R1はフェニル基に結合している形態とすることができ、このような形態において、第1の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテン(『Ph-PXX』と略称する)から成る形態とすることができる。そして、Ph-PXXから成るこのような形態にあっては、以下の構造式(1)に示すように、置換基R1はフェニル基のそれぞれのパラ位に結合している形態とすることができ、ここで、置換基R1として、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、トリメチルシリル基を含むシリル基から成る群から選択された1種類の置換基を挙げることができる。
第2の多環芳香族炭化水素は、フェニル基を有しており、フェニル基に結合している第2の置換基R2を有し、
置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の置換基R2が結合したフェニル基を有する第2の多環芳香族炭化水素とは、異なっている構成とすることができる。尚、このような構成を、便宜上、『第2の多環芳香族炭化水素の第1の構成』と呼ぶ。
以下の構造式(2)あるいは構造式(3)に示すように、第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテン(Ph-PXX)から成り、
第2の置換基R2はフェニル基のそれぞれのオルソ位又はメタ位に結合している構成とすることができる。尚、このような構成を、便宜上、『第2の多環芳香族炭化水素の第1Aの構成』と呼ぶ。尚、第2の置換基R2がフェニル基のそれぞれのオルソ位及びパラ位に結合していてもよいし、第2の置換基R2がフェニル基のそれぞれのメタ位及びパラ位に結合していてもよい。また、第2の置換基R2は、置換基R1と同じであってもよいし、異なっていてもよい。
第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテン(Ph-PXX)から成り、第2の置換基R2はフェニル基のそれぞれのパラ位に結合しており、
置換基R1と第2の置換基R2とは異なる構成とすることができる。尚、このような構成を、便宜上、『第2の多環芳香族炭化水素の第1Bの構成』と呼ぶ。
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテン(Ph-PXX)から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第1の多環芳香族炭化水素を構成するフェニル基のパラ位であり、
第2の置換基R2の第2の多環芳香族炭化水素への結合部位は、第2の多環芳香族炭化水素を構成するフェニル基のオルソ位又はメタ位である構成とすることができる。尚、第2の置換基R2がフェニル基のそれぞれのオルソ位及びパラ位に結合していてもよいし、第2の置換基R2がフェニル基のそれぞれのメタ位及びパラ位に結合していてもよい。また、第1の置換基R1と第2の置換基R2とは、同じであってもよいし、異なっていてもよい。
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテン(Ph-PXX)から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位、第1の多環芳香族炭化水素を構成するフェニル基のパラ位であり、
第2の置換基R2の第2の多環芳香族炭化水素への結合部位は、第2の多環芳香族炭化水素を構成するフェニル基のパラ位である構成とすることができる。
(A)基体上に形成されたゲート電極(制御電極)、
(B)ゲート電極及び基体上に形成されたゲート絶縁層(絶縁層)、
(C)ゲート絶縁層上に形成されたソース/ドレイン電極(第1電極及び第2電極)、並びに、
(D)ソース/ドレイン電極の間であってゲート絶縁層上に形成され、能動層によって構成されたチャネル形成領域、
を備えている。
(A)基体上に形成されたゲート電極(制御電極)、
(B)ゲート電極及び基体上に形成されたゲート絶縁層(絶縁層)、
(C)ゲート絶縁層上に形成され、能動層によって構成されたチャネル形成領域及びチャネル形成領域延在部、並びに、
(D)チャネル形成領域延在部上に形成されたソース/ドレイン電極(第1電極及び第2電極)、
を備えている。
(A)基体上に形成されたソース/ドレイン電極(第1電極及び第2電極)、
(B)ソース/ドレイン電極の間の基体上に形成され、能動層によって構成されたチャネル形成領域、
(C)ソース/ドレイン電極及びチャネル形成領域上に形成されたゲート絶縁層(絶縁層)、並びに、
(D)ゲート絶縁層上に形成されたゲート電極(制御電極)、
を備えている。
(A)基体上に形成され、能動層によって構成されたチャネル形成領域及びチャネル形成領域延在部、
(B)チャネル形成領域延在部上に形成されたソース/ドレイン電極(第1電極及び第2電極)、
(C)ソース/ドレイン電極及びチャネル形成領域上に形成されたゲート絶縁層(絶縁層)、並びに、
(D)ゲート絶縁層上に形成されたゲート電極(制御電極)、
を備えている。
第1電極、
第1電極と離間して設けられた第2電極、及び、
第1電極から第2電極に亙り設けられた能動層、
を少なくとも備えており、
能動層は、C2-Ph-PXXあるいはC3-Ph-PXXから成る第1の多環芳香族炭化水素、及び、上記の実施例1a~実施例1sの有機半導体層から成る第2の多環芳香族炭化水素の混合物から構成されている。
第1電極、
第1電極と離間して設けられた第2電極、
制御電極、及び、
絶縁層、
を備えており、
制御電極は、絶縁層を介して、第1電極と第2電極との間に位置する能動層の部分に対向して設けられている3端子型電子デバイスである。
(A)基体10上に形成されたゲート電極14(制御電極に相当する)、
(B)ゲート電極14及び基体10上に形成されたゲート絶縁層15(絶縁層に相当する)、
(C)ゲート絶縁層15上に形成されたソース/ドレイン電極16(第1電極及び第2電極に相当する)、並びに、
(D)ソース/ドレイン電極16の間であってゲート絶縁層15上に形成され、能動層20によって構成されたチャネル形成領域17、
を備えている。
先ず、基体10上にゲート電極14を形成する。具体的には、ガラス基板11の表面に形成されたSiO2から成る絶縁膜12上に、ゲート電極14を形成すべき部分が除去されたレジスト層(図示せず)を、リソグラフィ技術に基づき形成する。その後、密着層としてのチタン(Ti)層(図示せず)、及び、ゲート電極14としての金(Au)層を、順次、真空蒸着法にて全面に成膜し、その後、レジスト層を除去する。こうして、所謂リフト・オフ法に基づき、ゲート電極14を得ることができる。尚、ガラス基板11の表面に形成されたSiO2から成る絶縁膜12上に、印刷法に基づきゲート電極14を形成することもできる。
次に、ゲート電極14を含む基体10(より具体的には、ガラス基板11の表面に形成された絶縁膜12)上に、絶縁層に相当するゲート絶縁層15を形成する。具体的には、SiO2から成るゲート絶縁層15を、スパッタリング法に基づきゲート電極14及び絶縁膜12上に形成する。ゲート絶縁層15の成膜を行う際、ゲート電極14の一部をハードマスクで覆うことによって、ゲート電極14の取出部(図示せず)をフォトリソグラフィ・プロセス無しで形成することができる。
その後、ゲート絶縁層15の上に、厚さ25nmの銅(Cu)層から成るソース/ドレイン電極16を、スクリーン印刷法に基づき形成する(図1A参照)。このように、ソース/ドレイン電極16を銅(Cu)から構成することで、コンタクト抵抗の低減、移動度の向上といった特性の向上を図ることができる。
次いで、具体的には、構造式(10)及び構造式(11)に示したC2-Ph-PXXあるいはC3-Ph-PXXから成る第1の多環芳香族炭化水素と、実施例1a~実施例1sに示した第2の多環芳香族炭化水素とを、第1の多環芳香族炭化水素の質量を「1」としたとき、第2の多環芳香族炭化水素の質量を0.053として混合した混合物を、テトラリン、キシレン、トルエン等の溶媒、あるいは、これらに高沸点の溶媒を混合した混合溶媒に0.5質量%となるように溶解した。そして、係る混合溶液(A)あるいは混合溶液(B)あるいは混合溶液(C)をスピンコート法に基づき塗布し、乾燥することで、チャネル形成領域17(能動層20)をゲート絶縁層15及びソース/ドレイン電極16上に形成することができる(図1B参照)。
例えば、画像表示装置の製造にあっては、この工程に引き続き、こうして得られた、画像表示装置の制御部(画素駆動回路)を構成する電子デバイスであるTFTの上あるいは上方に、画像表示部(具体的には、例えば、有機エレクトロルミネッセンス素子あるいは電気泳動ディスプレイ素子、半導体発光素子等から成る画像表示部)を、周知の方法に基づき形成することで、画像表示装置を製造することができる。ここで、こうして得られた、画像表示装置の制御部(画素駆動回路)を構成する電子デバイスと、画像表示部における電極(例えば、画素電極)とを、例えば、コンタクトホールや配線といった接続部で接続すればよい。以下に説明する実施例2~実施例4においても、電子デバイスの製造の完了後、同様の工程を経ることで画像表示装置を得ることができる。
実施例1g 比較例1
a 11.57Å 11.52Å
b 12.92Å 12.82Å
c 22.2Å 22.6Å
γ 96.2° 95.7°
μ0:プリファクター
Ea:活性化エネルギー
kB:ボルツマン定数
T :温度
である。
(A)基体10上に形成されたゲート電極14(制御電極に相当する)、
(B)ゲート電極14及び基体10上に形成されたゲート絶縁層15(絶縁層に相当する)、
(C)ゲート絶縁層15上に形成され、能動層20によって構成されたチャネル形成領域17及びチャネル形成領域延在部18、並びに、
(D)チャネル形成領域延在部18上に形成されたソース/ドレイン電極16(第1電極及び第2電極に相当する)、
を備えている。
先ず、実施例1の[工程-100]と同様にして、基体10上にゲート電極14を形成した後、実施例1の[工程-110]と同様にして、ゲート電極14を含む基体(より具体的には絶縁膜12)上にゲート絶縁層15を形成する。
次いで、実施例1の[工程-130]と同様にして、能動層20をゲート絶縁層15の上に形成する(図2A参照)。こうして、チャネル形成領域17及びチャネル形成領域延在部18を得ることができる。
その後、チャネル形成領域延在部18の上に、チャネル形成領域17を挟むようにソース/ドレイン電極16を形成する(図2B参照)。具体的には、実施例1の[工程-120]と同様にして、ソース/ドレイン電極16としての銅(Cu)層をスクリーン印刷法に基づき形成する。
次に、実施例1の[工程-140]と同様の工程を実行することで、実施例2の電子デバイスを完成させることができる。
(A)基体10上に形成されたソース/ドレイン電極16(第1電極及び第2電極に相当する)、
(B)ソース/ドレイン電極16の間の基体10上に形成され、能動層20によって構成されたチャネル形成領域17、
(C)ソース/ドレイン電極16及びチャネル形成領域17上に形成されたゲート絶縁層15(絶縁層に相当する)、並びに、
(D)ゲート絶縁層15上に形成されたゲート電極14(制御電極に相当する)、
を備えている。
先ず、実施例1の[工程-120]と同様の方法で、基体に相当する絶縁膜12上にソース/ドレイン電極16を形成した後、実施例1の[工程-130]と同様にして、ソース/ドレイン電極16を含む絶縁膜12上に、チャネル形成領域17(能動層20)を形成する(図3A参照)。
次いで、ゲート絶縁層15を、実施例1の[工程-110]と同様の方法で形成する。その後、チャネル形成領域17の上のゲート絶縁層15の部分に、実施例1の[工程-100]と同様の方法でゲート電極14を形成する(図3B参照)。
その後、実施例1の[工程-140]と同様の工程を実行することで、実施例3の電子デバイスを完成させることができる。
(A)基体10上に形成され、能動層20によって構成されたチャネル形成領域17及びチャネル形成領域延在部18、
(B)チャネル形成領域延在部18上に形成されたソース/ドレイン電極16(第1電極及び第2電極に相当する)、
(C)ソース/ドレイン電極16及びチャネル形成領域17上に形成されたゲート絶縁層15(絶縁層に相当する)、並びに、
(D)ゲート絶縁層15上に形成されたゲート電極14(制御電極に相当する)、
を備えている。
先ず、実施例1の[工程-130]と同様にして、基体10(より具体的には絶縁膜12)上に能動層20を形成することで、チャネル形成領域17及びチャネル形成領域延在部18を得ることができる(図4A参照)。
次いで、実施例1の[工程-120]と同様の方法で、チャネル形成領域延在部18上にソース/ドレイン電極16を形成する(図4B参照)。
その後、ゲート絶縁層15を実施例1の[工程-110]と同様の方法で形成する。次いで、チャネル形成領域17の上のゲート絶縁層15の部分に、実施例1の[工程-100]と同様の方法でゲート電極14を形成する(図4C参照)。
次に、実施例1の[工程-140]と同様の工程を実行することで、実施例4の電子デバイスを完成させることができる。
第1電極31及び第2電極32、並びに、
第1電極31と第2電極32との間に形成された能動層33、
を備えている。尚、能動層33は、C2-Ph-PXXあるいはC3-Ph-PXXから成る第1の多環芳香族炭化水素、及び、実施例1a~実施例1sにおいて説明した第2の多環芳香族炭化水素の混合物から成る。そして、能動層33への光の照射によって電力が生成する。即ち、実施例5の電子デバイスは、光電変換素子あるいは太陽電池として機能する。あるいは又、第1電極31及び第2電極32への電圧の印加によって能動層33が発光する発光素子として機能する。
[1]《有機半導体層:第1の態様》
水素原子以外の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の多環芳香族炭化水素とが混合されて成る有機半導体層。
[2]第1の多環芳香族炭化水素はフェニル基を有しており、
置換基R1はフェニル基に結合している[1]に記載の有機半導体層。
[3]第1の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成る[2]に記載の有機半導体層。
[4]置換基R1はフェニル基のそれぞれのパラ位に結合している[3]に記載の有機半導体層。
[5]置換基R1は、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基である[1]乃至[4]のいずれか1項に記載の有機半導体層。
[6]第2の多環芳香族炭化水素は、フェニル基を有しており、フェニル基に結合している第2の置換基R2を有し、
置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の置換基R2が結合したフェニル基を有する第2の多環芳香族炭化水素とは、異なっている[1]乃至[5]のいずれか1項に記載の有機半導体層。
[7]第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第2の置換基R2はフェニル基のそれぞれのオルソ位又はメタ位に結合している[6]に記載の有機半導体層。
[8]第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第2の置換基R2はフェニル基のそれぞれのパラ位に結合しており、
置換基R1と第2の置換基R2とは異なる[6]に記載の有機半導体層。
[9]第2の多環芳香族炭化水素は、2,8-ジフェニルペリキサンテノキサンテン又は1,7-ジフェニルペリキサンテノキサンテンから成る[6]に記載の有機半導体層。
[10]第2の置換基R2は、水素原子、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基である[6]乃至[9]のいずれか1項に記載の有機半導体層。
[11]第2の多環芳香族炭化水素は、TIPS-ペンタセンから成る[1]乃至[5]のいずれか1項に記載の有機半導体層。
[12]《有機半導体層:第2の態様》
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と異なる有機半導体層。
[13]第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第1の多環芳香族炭化水素を構成するフェニル基のパラ位であり、
第2の置換基R2の第2の多環芳香族炭化水素への結合部位は、第2の多環芳香族炭化水素を構成するフェニル基のオルソ位又はメタ位である[12]に記載の有機半導体層。
[14]《有機半導体層:第3の態様》
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と同じであり、
第1の置換基R1と第2の置換基R2とは異なる有機半導体層。
[15]第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位、第1の多環芳香族炭化水素を構成するフェニル基のパラ位であり、
第2の置換基R2の第2の多環芳香族炭化水素への結合部位は、第2の多環芳香族炭化水素を構成するフェニル基のパラ位である[14]に記載の有機半導体層。
[16]第1の置換基R1は、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基であり、
第2の置換基R2は、水素原子、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基である[12]乃至[15]のいずれか1項に記載の有機半導体層。
[17]《電子デバイス》
第1電極、
第1電極と離間して設けられた第2電極、及び、
第1電極から第2電極に亙り設けられた能動層、
を少なくとも備えており、
能動層は、[1]乃至[16]のいずれか1項に記載の有機半導体層から成る電子デバイス。
[18]第1電極、第1電極と離間して設けられた第2電極、制御電極、及び、絶縁層を備えており、
制御電極は、絶縁層を介して、第1電極と第2電極との間に位置する能動層の部分に対向して設けられている[17]に記載の電子デバイス。
[19]《電子デバイスの製造方法》
第1電極、
第1電極と離間して設けられた第2電極、及び、
第1電極から第2電極に亙り設けられた能動層、
を少なくとも備えた電子デバイスの製造方法であって、
水素原子以外の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の多環芳香族炭化水素とが混合されて成る混合溶液、又は、
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と異なる混合溶液、又は、
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と同じであり、
第1の置換基R1と第2の置換基R2とは異なる混合溶液を、塗布、乾燥することで能動層を形成する電子デバイスの製造方法。
[20]混合溶液には、更に、有機絶縁材料が混合されている[19]に記載の電子デバイスの製造方法。
Claims (20)
- 水素原子以外の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の多環芳香族炭化水素とが混合されて成る有機半導体層。
- 第1の多環芳香族炭化水素はフェニル基を有しており、
置換基R1はフェニル基に結合している請求項1に記載の有機半導体層。 - 第1の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成る請求項2に記載の有機半導体層。
- 置換基R1はフェニル基のそれぞれのパラ位に結合している請求項3に記載の有機半導体層。
- 置換基R1は、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基である請求項1に記載の有機半導体層。
- 第2の多環芳香族炭化水素は、フェニル基を有しており、フェニル基に結合している第2の置換基R2を有し、
置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の置換基R2が結合したフェニル基を有する第2の多環芳香族炭化水素とは、異なっている請求項1に記載の有機半導体層。 - 第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第2の置換基R2はフェニル基のそれぞれのオルソ位又はメタ位に結合している請求項6に記載の有機半導体層。 - 第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第2の置換基R2はフェニル基のそれぞれのパラ位に結合しており、
置換基R1と第2の置換基R2とは異なる請求項6に記載の有機半導体層。 - 第2の多環芳香族炭化水素は、2,8-ジフェニルペリキサンテノキサンテン又は1,7-ジフェニルペリキサンテノキサンテンから成る請求項6に記載の有機半導体層。
- 第2の置換基R2は、水素原子、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基である請求項6に記載の有機半導体層。
- 第2の多環芳香族炭化水素は、TIPS-ペンタセンから成る請求項1に記載の有機半導体層。
- 水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と異なる有機半導体層。 - 第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第1の多環芳香族炭化水素を構成するフェニル基のパラ位であり、
第2の置換基R2の第2の多環芳香族炭化水素への結合部位は、第2の多環芳香族炭化水素を構成するフェニル基のオルソ位又はメタ位である請求項12に記載の有機半導体層。 - 水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と同じであり、
第1の置換基R1と第2の置換基R2とは異なる有機半導体層。 - 第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、3,9-ジフェニルペリキサンテノキサンテンから成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位、第1の多環芳香族炭化水素を構成するフェニル基のパラ位であり、
第2の置換基R2の第2の多環芳香族炭化水素への結合部位は、第2の多環芳香族炭化水素を構成するフェニル基のパラ位である請求項14に記載の有機半導体層。 - 第1の置換基R1は、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基であり、
第2の置換基R2は、水素原子、アルキル基、シクロアルキル基、アルケニル基、アルキニル基、アリール基、アリールアルキル基、芳香族複素環、複素環基、アルコキシ基、シクロアルコキシ基、アリールオキシ基、アルキルチオ基、シクロアルキルチオ基、アリールチオ基、アルコキシカルボニル基、アリールオキシカルボニル基、スルファモイル基、アシル基、アシルオキシ基、アミド基、カルバモイル基、ウレイド基、スルフィニル基、アルキルスルホニル基、アリールスルホニル基、アミノ基、ハロゲン原子、フッ化炭化水素基、シアノ基、ニトロ基、ヒドロキシ基、メルカプト基、及び、シリル基から成る群から選択された1種類の置換基である請求項12又は請求項14に記載の有機半導体層。 - 第1電極、
第1電極と離間して設けられた第2電極、及び、
第1電極から第2電極に亙り設けられた能動層、
を少なくとも備えており、
能動層は、請求項1乃至請求項16のいずれか1項に記載の有機半導体層から成る電子デバイス。 - 第1電極、第1電極と離間して設けられた第2電極、制御電極、及び、絶縁層を備えており、
制御電極は、絶縁層を介して、第1電極と第2電極との間に位置する能動層の部分に対向して設けられている請求項17に記載の電子デバイス。 - 第1電極、
第1電極と離間して設けられた第2電極、及び、
第1電極から第2電極に亙り設けられた能動層、
を少なくとも備えた電子デバイスの製造方法であって、
水素原子以外の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、第2の多環芳香族炭化水素とが混合されて成る混合溶液、又は、
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と異なる混合溶液、又は、
水素原子以外の第1の置換基R1が単結合で結ばれた第1の多環芳香族炭化水素と、水素原子以外の第2の置換基R2が単結合で結ばれた第2の多環芳香族炭化水素とが混合されて成り、
第1の多環芳香族炭化水素及び第2の多環芳香族炭化水素は、同じ多環芳香族炭化水素から成り、
第1の置換基R1の第1の多環芳香族炭化水素への結合部位は、第2の置換基R2の第2の多環芳香族炭化水素への結合部位と同じであり、
第1の置換基R1と第2の置換基R2とは異なる混合溶液を、塗布、乾燥することで能動層を形成する電子デバイスの製造方法。 - 混合溶液には、更に、有機絶縁材料が混合されている請求項19に記載の電子デバイスの製造方法。
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Publication number | Priority date | Publication date | Assignee | Title |
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CN106981569A (zh) * | 2016-01-15 | 2017-07-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | 有机薄膜晶体管电极及其修饰方法与应用 |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007281474A (ja) * | 2006-04-06 | 2007-10-25 | Xerox Corp | 官能化ヘテロアセン類およびそれから作製された電子デバイス |
JP2009200085A (ja) * | 2008-02-19 | 2009-09-03 | Sony Corp | 半導体装置および有機半導体薄膜 |
JP2009544743A (ja) * | 2006-07-28 | 2009-12-17 | メルク パテント ゲーエムベーハー | 有機エレクトロルミネセンス素子のための新規な材料 |
JP2010006794A (ja) * | 2008-05-26 | 2010-01-14 | Sony Corp | ジオキサアンタントレン系化合物及び半導体装置 |
JP2011077470A (ja) * | 2009-10-02 | 2011-04-14 | Sony Corp | 半導体装置の製造方法 |
JP2011178832A (ja) * | 2010-02-26 | 2011-09-15 | Dic Corp | 紫外線硬化型インクジェット記録用インク、それから得られた絶縁膜、電子素子及び電子素子の製造方法 |
US20120025173A1 (en) * | 2010-08-02 | 2012-02-02 | Sony Corporation | Semiconductor device, method of manufacturing the same, and method of forming multilayer semiconductor thin film |
JP2012033904A (ja) * | 2010-06-30 | 2012-02-16 | National Institute For Materials Science | 有機半導体薄膜形成方法、半導体素子及び有機電界効果トランジスタ |
JP2012039103A (ja) * | 2010-07-13 | 2012-02-23 | Sumitomo Chemical Co Ltd | 有機半導体組成物、有機薄膜及びこれを備える有機薄膜トランジスタ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6340548B1 (en) * | 2000-03-16 | 2002-01-22 | Imation Corp. | Organophotoreceptors for electrophotography featuring novel charge transport compounds |
JP2009029746A (ja) * | 2007-07-27 | 2009-02-12 | Sony Corp | 有機材料および半導体装置 |
JP2011146452A (ja) * | 2010-01-13 | 2011-07-28 | Yamamoto Chem Inc | 有機トランジスタ |
JP5454394B2 (ja) * | 2010-07-09 | 2014-03-26 | ソニー株式会社 | 光電変換素子及び固体撮像装置 |
-
2013
- 2013-04-05 JP JP2014511170A patent/JP6094831B2/ja not_active Expired - Fee Related
- 2013-04-05 WO PCT/JP2013/060539 patent/WO2013157421A1/ja active Application Filing
- 2013-04-05 US US14/391,862 patent/US20150102308A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007281474A (ja) * | 2006-04-06 | 2007-10-25 | Xerox Corp | 官能化ヘテロアセン類およびそれから作製された電子デバイス |
JP2009544743A (ja) * | 2006-07-28 | 2009-12-17 | メルク パテント ゲーエムベーハー | 有機エレクトロルミネセンス素子のための新規な材料 |
JP2009200085A (ja) * | 2008-02-19 | 2009-09-03 | Sony Corp | 半導体装置および有機半導体薄膜 |
JP2010006794A (ja) * | 2008-05-26 | 2010-01-14 | Sony Corp | ジオキサアンタントレン系化合物及び半導体装置 |
JP2011077470A (ja) * | 2009-10-02 | 2011-04-14 | Sony Corp | 半導体装置の製造方法 |
JP2011178832A (ja) * | 2010-02-26 | 2011-09-15 | Dic Corp | 紫外線硬化型インクジェット記録用インク、それから得られた絶縁膜、電子素子及び電子素子の製造方法 |
JP2012033904A (ja) * | 2010-06-30 | 2012-02-16 | National Institute For Materials Science | 有機半導体薄膜形成方法、半導体素子及び有機電界効果トランジスタ |
JP2012039103A (ja) * | 2010-07-13 | 2012-02-23 | Sumitomo Chemical Co Ltd | 有機半導体組成物、有機薄膜及びこれを備える有機薄膜トランジスタ |
US20120025173A1 (en) * | 2010-08-02 | 2012-02-02 | Sony Corporation | Semiconductor device, method of manufacturing the same, and method of forming multilayer semiconductor thin film |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106981569A (zh) * | 2016-01-15 | 2017-07-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | 有机薄膜晶体管电极及其修饰方法与应用 |
CN106981569B (zh) * | 2016-01-15 | 2019-10-18 | 中国科学院苏州纳米技术与纳米仿生研究所 | 有机薄膜晶体管电极及其修饰方法与应用 |
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