WO2013156737A1 - Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique - Google Patents

Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique Download PDF

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Publication number
WO2013156737A1
WO2013156737A1 PCT/FR2013/050855 FR2013050855W WO2013156737A1 WO 2013156737 A1 WO2013156737 A1 WO 2013156737A1 FR 2013050855 W FR2013050855 W FR 2013050855W WO 2013156737 A1 WO2013156737 A1 WO 2013156737A1
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WO
WIPO (PCT)
Prior art keywords
solution
platinum
electrolytic bath
salt
hpo
Prior art date
Application number
PCT/FR2013/050855
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English (en)
French (fr)
Inventor
Juliette Hugot
Frédéric Lagrange
Hervé MOLET
Original Assignee
Snecma
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snecma filed Critical Snecma
Priority to US14/395,190 priority Critical patent/US9752243B2/en
Priority to BR112014026033-8A priority patent/BR112014026033B1/pt
Priority to IN8735DEN2014 priority patent/IN2014DN08735A/en
Priority to CA2870760A priority patent/CA2870760C/fr
Priority to EP13722499.4A priority patent/EP2839059B1/fr
Priority to CN201380023550.9A priority patent/CN104271811B/zh
Priority to JP2015506292A priority patent/JP6290179B2/ja
Priority to RU2014146284A priority patent/RU2625923C2/ru
Publication of WO2013156737A1 publication Critical patent/WO2013156737A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Definitions

  • the invention relates to a method of manufacturing an electrolytic bath for producing a platinum-based metal underlayer on a metal substrate.
  • Such metal sub-layers belong in particular to a coating on a substrate consisting of a metal part called to withstand high mechanical and thermal stresses in operation, in particular a superalloy substrate.
  • a thermomechanical part constitutes in particular an aeronautical or terrestrial turbine engine part. Said part may for example be a blade or a turbomachine turbine distributor and in particular in a high-pressure turbojet or turboprop turboprop turbine.
  • the limit temperature of use of the superalloys is of the order of 1100 ° C, the temperature of the gases at the outlet of the combustion chamber or turbine inlet up to 1600 ° C.
  • thermal barriers in aircraft engines has become widespread over the last thirty years and makes it possible to increase the inlet temperature of the gases in the turbines, to reduce the cooling air flow and thus improve the efficiency of the engines.
  • this insulating coating makes it possible to create on a cooled part, in steady state of operation, a thermal gradient through the coating, whose total amplitude can exceed 100 ° C for a coating of about 150 to 200 ⁇ m in thickness. having a conductivity of 1.1 Wm ⁇ .K "1.
  • the operating temperature of the underlying metal forming the substrate for the coating is decreased by the same gradient, which leads to significant gains in the required cooling air volume, the service life of the part and the specific consumption of the turbine engine.
  • a thermal barrier comprising a yttria-stabilized zirconia-based ceramic layer, namely a yttria-containing zirconia comprising a molar content of yttrium oxide between 4 and 12% (especially between 6 and 8%), which has a coefficient of expansion different from the superalloy constituting the substrate and a relatively low thermal conductivity.
  • zirconia-based ceramic layer partially stabilized with yttrium oxide for example Zr0.92YO.0eO1.96.
  • a metal underlayer with a coefficient of expansion ideally close to the substrate, is generally interposed between the substrate of the part and the ceramic layer.
  • the metal sub-layer firstly makes it possible to reduce the stresses due to the difference between the thermal expansion coefficients of the ceramic layer and the superalloy forming the substrate.
  • This underlayer also provides adhesion between the substrate of the part and the ceramic layer, knowing that the adhesion between the underlayer and the substrate of the part is by inter-diffusion, and that the adhesion between the underlayer and the ceramic layer is made by mechanical anchoring and by the propensity of the underlayer to be developed at high temperature, at the ceramic / underlayer interface, a thin oxide layer which ensures the chemical contact with ceramics.
  • this metal sub-layer ensures the protection of the superalloy of the part against corrosion and oxidation phenomena (the ceramic layer is permeable to oxygen).
  • a sublayer consisting of a nickel aluminide comprising a metal selected from platinum, chromium, palladium, ruthenium, iridium, osmium, rhodium, or mixture of these metals and / or a reactive element selected from zirconium (Zr), cerium (Ce), lanthanum (La), titanium (Ti), tantalum (Ta), hafnium (Hf), silicon (Si) and yttrium (Y).
  • Zr zirconium
  • Ce cerium
  • La lanthanum
  • Ti titanium
  • Ta tantalum
  • Hf hafnium
  • Si silicon
  • Y yttrium
  • a (Ni, Pt) Al type coating is used in which the platinum is inserted into the nickel network of the ⁇ - ⁇ intermetallic compounds.
  • platinum When developing thermal barriers, platinum has a dual role: it is a diffusion barrier to prevent the diffusion of aluminum from the layer to the substrate.
  • platinum aluminide increases the corrosion resistance at high temperature and the adhesion of protective layers.
  • platinum aluminide coatings rapidly degrade at 1100 ° C: there are phase transformations related to the inter-diffusion of the elements of the coating and the substrates.
  • This metal sub-layer may in this case consist of a nickel-modified platinum nickel aluminide NiPtAI, according to a process comprising the following steps: the preparation of the surface of the workpiece by chemical etching and sandblasting; depositing on the part, by electrolysis, a platinum coating (Pt); the possible heat treatment of the assembly to diffuse Pt in the room; aluminum deposition (Al) by chemical vapor deposition (CVD) or physical vapor deposition (PVD); the possible heat treatment of the assembly to diffuse Pt and Al in the room; preparing the surface of the formed metallic underlayer; and electron beam evaporation (EB-PVD) deposition of a ceramic coating.
  • Pt platinum coating
  • Al aluminum deposition
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • EB-PVD electron beam evaporation
  • the platinum is deposited electrolytically before the thermochemical treatment of aluminization in the vapor phase.
  • electroplating reduces a complexed metal entity initially present in the solution by passing an electric current over a conductive part (the cathode). between an anode (electrode seat of an oxidation reaction) and a cathode on which deposition takes place (and on which other reduction reactions can take place simultaneously).
  • the pH of these solutions can be basic, acidic or neutral.
  • the compounds obtained at the end of platinum extraction are ammonium hexachloroplatinate (IV): (NH 4 ) 2 PtCl 6 or potassium hexachloroplatinate (IV): K 2 PtCl 6 .
  • the main platinum compounds present in the casting baths are derived from the transformation of these compounds.
  • the present invention aims to provide an electrolytic bath for the deposition of platinum on a metal substrate, which electrolytic bath has an improvement in technical performance, including identical or almost identical parameters and deposition conditions regardless of the geometry of the piece, an identical or almost identical deposition rate regardless of the current density applied, a deposition quality in accordance with the specifications, and an improved service life.
  • the method of manufacturing an electrolytic bath is characterized in that it comprises the following steps :
  • a complex resulting from the bond between an amino ligand and a platinum metal salt is preferred.
  • a ligand without a carbon chain and a single amine functional group: NH 3 (ammonia) or a salt xNH 4 + or an X-NH 2 ammonium) has been chosen, or X is chosen either as an inert molecule, a spectator of the main reaction is as an interacting molecule in formulation reactions.
  • the metal salt of the third system is chosen from platinum salts of oxidation state IV.
  • This solution also has the additional advantage of allowing, in addition, the use of platinum salts of oxidation degree IV, which are much more stable than the platinum salts of oxidation state IL.
  • the first system, the second system and the fourth system are grouped into a single solution forming a first solution B.
  • the third system forms a second solution A consisting of an aqueous solution with platinum, comprising sodium hydroxide (NaOH) and at least one platinum salt of degree of oxidation IV.
  • a second solution A consisting of an aqueous solution with platinum, comprising sodium hydroxide (NaOH) and at least one platinum salt of degree of oxidation IV.
  • the molar ratio between the amount of sodium hydroxide NaOH and the amount of platinum salt of oxidation degree IV is 2.
  • the third system forms a second solution A consisting of an aqueous solution with platinum, comprising sodium hydroxide (NaOH) and at least one platinum salt with a degree of oxidation IV, and in step e), the following sub-steps are carried out:
  • the first solution B is covered and its temperature is raised to at least 50 ° C for at least 1H30,
  • a step f) is carried out during which said electrolytic bath is heated at a temperature of between 80 ° C. and 97 ° C. for at least two hours.
  • a step g) is carried out during which electroplating of a platinum deposit on a metal substrate is carried out with said electrolytic bath.
  • the second solution A is added to the first solution B.
  • the first solution B is brought to a temperature of 60 ° C.
  • said oxidation state platinum salt IV is diammonium hexachloroplatinate of formula (NH 4 ) 2 PtCl 6 .
  • said amine compound x p " (NH 4 ) + p comprises diammonium hydrogenophosphate (NH 4 ) 2 HPO 4 and / or ammonium dihydrogen phosphate NH 4 H 2 PO 4 .
  • the first system comprises diammonium hydrogenophosphate (NH 4 ) 2 HPO 4 and ammonium dihydrogen phosphate NH 4 H 2 PO 4 with a molar ratio of 2 between the amount of ammonium dihydrogen phosphate NH 4 H 2 PO 4 and the amount of diammonium hydrogen phosphate (NH 4 ) 2 HPO 4 .
  • the first solution B supplied in step a) is obtained with water having a temperature of the order of 30 ° C.
  • the second solution A supplied in stage c) is obtained with water having a temperature of the order of 45.degree.
  • step b) the temperature of the first solution B is raised to at least 50 ° C. for at least 3 hours 30 minutes;
  • said electrolytic bath is heated to a temperature of at least 80 ° C. for at least three hours (for example at 85 ° C. for 3 hours).
  • the present invention also relates to a process for manufacturing a platinum-based metal underlayer from the electrolytic bath obtained according to the manufacturing method which has just been described, characterized in that it comprises the following steps :
  • the present invention also relates to a set of solutions for the manufacture of an electrolytic bath for producing a platinum-based metal underlayer on a metal substrate, characterized in that it comprises:
  • a first solution B consisting of an aqueous solution with an amino ligand, comprising at least one compound X- (NH 2 ) n , with X belonging to the group consisting of (CH 3 , CH 3 -CH 2 , CH 3 - (CH 2) 2 ) m ), or NH 3 or a salt x p " (NH 4 ) + P having one or more amino functions and with x acid radical belonging to the group consisting of (PO 4 3- ", HPO 4 2 ⁇ , H 2 PO 4 ⁇ , HP0 4 2" H2PO4 ", S0 4 2", HSO 4 ", HS04" and H 2 SO 4, CH 3 COO " , CH 3 COOH, CH 3 COOH and CH 3 COO " ), or H 2 SO 4 , or CH 3 COOH, n, m and p being non-zero integers, and
  • a second solution A consisting of an aqueous solution with platinum, comprising sodium hydroxide (NaOH) and at least one platinum salt of oxidation degree IV.
  • said platinum salt of oxidation state IV is diammonium hexachloroplatinate of formula ( ⁇ 4 ) 2 ⁇ 0 6 .
  • the molar ratio between the amount of sodium hydroxide NaOH and the amount of platinum salt of oxidation degree IV is 2.
  • said amine compound x p ⁇ (NH 4 ) + p comprises diammonium hydrogen phosphate (NH 4 ) 2 HPO 4 and / or ammonium dihydrogen phosphate NH 4 H 2 PO 4 .
  • the first solution B comprises diammonium hydrogen phosphate (NH 4 ) 2HPO 4 and ammonium dihydrogen phosphate NH 4 H 2 PO 4 with a molar ratio of 2 between the amount of ammonium dihydrogenophosphate NH 4 H 2 PO 4 4 and the amount of diammonium hydrogen phosphate (NH 4 ) 2 HPO 4 .
  • the invention also relates to the electrolytic bath resulting from the manufacturing method according to the invention.
  • Such an electrolytic bath for producing a platinum-based metal underlayer on a superalloying substrate is characterized in that it comprises a platinum amine complex of the wavelength of a Pt-NH bond. 3 or Pt-NH 2 and a buffer solution
  • FIG. 1A to II, 2A and 2B show different curves showing the characteristics and behavior of different electrolytic baths manufactured according to the manufacturing method of the invention.
  • An electrolytic bath makes it possible to deposit the platinum in a way which is particularly ecological and economical (short time of realization, realization under atmospheric pressure avoiding the equipment of putting under vacuum) compared to techniques of deposition in vapor phase or thermal projection.
  • this deposition method is compatible with pierced parts: the geometry of the current lines preventing significant deposition in the holes, in particular small cooling holes which are thus not obstructed.
  • the bath formulation is made from four ingredients distributed between two separate solutions, A and B, heated and stirred separately to react the ingredients together in each solution, before mixing together the two solutions A and B.
  • the mixture between the two solutions A and B is then itself heated and stirred. Once the heating time of the mixture A + B is respected, the platinum plating bath is ready for use for carrying out the electroplating.
  • solution A comprises, inter alia, the platinum salt (s)
  • solution B is the solution comprising, inter alia, ligands (it is recalled that a ligand is a chemical entity, ionic or molecular, bearing chemical functions allowing it to bind to one or more metallic entities, usually a cation, the association of a metallic entity with one or more ligands forming a soluble edifice in solution called complex).
  • solution A in 300 ml of distilled water at 45 ° C., put 5 g of sodium hydroxide of the chemical formula NaOH (ie 0.080 mole) and 18.3 g of diammonium hexachloroplatinate platinum salt of formula (NH 4 ) 2 PtCl 6 (ie 0.040 moles).
  • the molar ratio between the amount of sodium hydroxide and diammonium hexachloroplatinate salt is 2. Let the platinum salts dissolve in solution A;
  • solution A is prepared and is added to solution B previously heated to 60 ° C.
  • the mixture A + B (whose pH is previously adjusted to 6.3 by adding a basic solution such as, for example, sodium hydroxide, potassium hydroxide, sodium triphosphate) is raised to 85 ° C for 3 hours. All solutions are covered during the heating stages.
  • a basic solution such as, for example, sodium hydroxide, potassium hydroxide, sodium triphosphate
  • the pH of the mixture of solutions A + B is set between 6 and 10 and preferably between 6 and 7.
  • pions are coated with platinum at different intensities. Each pawn is weighed before and after deposit.
  • the bath of test 2 offers the following advantages: It is a bath whose high repeatability has been observed, and which compared to a reference bath, the average deposition rate is important for a new bath ( Figure lA), and remains sufficiently important during operation ( Figure lA).
  • the bath of the test 2 is indeed repeatable because the curves of the average speed and the dispersion of the fabrications 1 and 2 are superimposable, which shows the extreme reproducibility of the manufacture.
  • the bath of test 2 has a good plateau dispersion (FIG.
  • the bath of the test 2 has little loss of platinum over time (Figure 1 C) and that the average efficiency (Figure 2A) and the speed (Figure 2B) of the bath is almost identical after three successive regenerations.
  • Concerning the platinum losses we encounter with the reference bath many platinum losses, mainly in the form of a platinum solid precipitate at the bottom of the tank.
  • the baths according to the invention that the platinum losses are lower and above all constant in time (constant with the electrolyses).
  • the bath of test 2 is the one with less platinum losses, so the bath of test 2 is more economical from the economic point of view.
  • the baths of tests 4 and 7 offer results quite similar to those of test 2.
  • the electrolytic bath of test 2 gives stable results over time, in terms of deposition rate, and after several regenerations of the bath: the speed of deposit is almost unchanged between the first and the third regeneration.
  • To regenerate a bath we add platinum salts in the bath to enhance its platinum content. Once the salts have been added, the bath is left stirring at 65 ° C. for 12 to 24 hours so that all the salts are dissolved in the bath.
  • the manufacture of the electrolytic bath is similar to that of the recipe of Example 1, except for the following points.
  • Solution B contains ammonium hydrogen sulphate of chemical formula (NH 4 ) 2 SO 4 in an amount of 43.5 g and diammonium sulphate of chemical formula NH 4 S O 4 in an amount of 76 g and water . The whole is brought to 50 ° C during 4:30.
  • the manufacture of the electrolytic bath is similar to that of the recipe of Example 1, except for the following points.
  • Solution B contains ammonium acetate of chemical formula CH 3 COONH 4 in an amount of 102.4 g and acetic acid of chemical formula CH 3 COOH in an amount of 39.6 g.
  • the whole is brought to 50 ° C during 4:30.
  • the pH of the mixture of solutions A + B is set between 1 and 5.
  • the ligand is chosen from aliphatic polyamines of 3 to 20 carbon atoms with a linear or branched carbon chain.
  • the ligand is chosen from primary polyamines such as diaminopropanes such as 1,3-diaminopropane and 1,2-diaminopropane, diethylenetriamine, 1,4-diaminobutane and 1,6-diaminohexane; secondary polyamines such as ⁇ , ⁇ 'dimethyl-1,3-propanediamine; and tertiary polyamines such as N, N, N ', N' tetramethylethylenediamine.
  • the ligands preferentially chosen are diaminopropanes.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PCT/FR2013/050855 2012-04-19 2013-04-18 Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique WO2013156737A1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US14/395,190 US9752243B2 (en) 2012-04-19 2013-04-18 Method of fabricating a bath of electrolyte for plating a platinum-based metallic underlayer on a metallic substrate
BR112014026033-8A BR112014026033B1 (pt) 2012-04-19 2013-04-18 Metodo de fabricaqao para fabricar um banho de eletrolito
IN8735DEN2014 IN2014DN08735A (en, 2012) 2012-04-19 2013-04-18
CA2870760A CA2870760C (fr) 2012-04-19 2013-04-18 Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique
EP13722499.4A EP2839059B1 (fr) 2012-04-19 2013-04-18 Procédé de fabrication d'un bain électrolytique pour la réalisation d'une sous-couche métallique à base de platine sur un substrat métallique.
CN201380023550.9A CN104271811B (zh) 2012-04-19 2013-04-18 一种在金属基体上电镀铂基金属底层的电解浴的制备方法
JP2015506292A JP6290179B2 (ja) 2012-04-19 2013-04-18 金属基材上にプラチナ系金属基層をめっきするための電解質の浴を製造する方法
RU2014146284A RU2625923C2 (ru) 2012-04-19 2013-04-18 Способ изготовления ванны электролита для нанесения металлического грунтового слоя на основе платины на металлический субстрат

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1253599 2012-04-19
FR1253599A FR2989694B1 (fr) 2012-04-19 2012-04-19 Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique

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WO2013156737A1 true WO2013156737A1 (fr) 2013-10-24

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US (1) US9752243B2 (en, 2012)
EP (1) EP2839059B1 (en, 2012)
JP (1) JP6290179B2 (en, 2012)
CN (1) CN104271811B (en, 2012)
BR (1) BR112014026033B1 (en, 2012)
CA (1) CA2870760C (en, 2012)
FR (1) FR2989694B1 (en, 2012)
IN (1) IN2014DN08735A (en, 2012)
RU (1) RU2625923C2 (en, 2012)
WO (1) WO2013156737A1 (en, 2012)

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CN104975312A (zh) * 2015-07-30 2015-10-14 江苏金曼科技有限责任公司 一种延长镀液使用寿命的电镀方法
FR3058165B1 (fr) 2016-10-27 2018-12-14 Safran Aircraft Engines Procede et dispositif de regeneration de bain de platine
FR3066505B1 (fr) 2017-05-16 2021-04-09 Safran Aircraft Engines Procede et dispositif ameliores de filtration de bain de platine par electrodialyse
CN110894617A (zh) * 2018-09-13 2020-03-20 深圳市永达锐国际科技有限公司 3d铂金电铸工艺方法
CN114214685A (zh) * 2021-09-22 2022-03-22 湘潭大学 高温防护涂层及其制备方法与应用

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GB2351089A (en) * 1999-06-15 2000-12-20 Hong Kong Productivity Council Platinum electroforming/electroplating using haloplatinics

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GB2351089A (en) * 1999-06-15 2000-12-20 Hong Kong Productivity Council Platinum electroforming/electroplating using haloplatinics

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US20150075996A1 (en) 2015-03-19
US9752243B2 (en) 2017-09-05
IN2014DN08735A (en, 2012) 2015-05-22
CA2870760C (fr) 2021-02-23
RU2625923C2 (ru) 2017-07-19
FR2989694B1 (fr) 2015-02-27
EP2839059B1 (fr) 2016-04-13
CA2870760A1 (fr) 2013-10-24
BR112014026033B1 (pt) 2020-11-24
BR112014026033A2 (pt) 2017-06-27
CN104271811A (zh) 2015-01-07
RU2014146284A (ru) 2016-06-10
FR2989694A1 (fr) 2013-10-25
EP2839059A1 (fr) 2015-02-25
JP6290179B2 (ja) 2018-03-07
JP2015514873A (ja) 2015-05-21
CN104271811B (zh) 2016-10-12

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