WO2013154047A1 - 有機elモジュール、並びに、有機elモジュールの給電構造 - Google Patents
有機elモジュール、並びに、有機elモジュールの給電構造 Download PDFInfo
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- WO2013154047A1 WO2013154047A1 PCT/JP2013/060491 JP2013060491W WO2013154047A1 WO 2013154047 A1 WO2013154047 A1 WO 2013154047A1 JP 2013060491 W JP2013060491 W JP 2013060491W WO 2013154047 A1 WO2013154047 A1 WO 2013154047A1
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/20—Electroluminescent [EL] light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
Definitions
- the present invention relates to an organic EL (Electro Luminescence) module mainly used as illumination.
- the present invention also relates to a power feeding structure for an organic EL module.
- organic EL modules have attracted attention as lighting devices that can replace incandescent lamps and fluorescent lamps, and many studies have been made.
- the organic EL module is obtained by applying a sealing structure and a casing to an organic EL device.
- the organic EL device is formed by laminating an organic EL element on a substrate such as a glass substrate, a transparent resin film, or a metal sheet, and forming a power feeding structure for feeding power to the organic EL element.
- an organic EL element makes two electrodes which one or both have translucency oppose, and laminated
- the organic EL device emits light by the energy of recombination of electrically excited electrons and holes. That is, the organic EL module is a self-luminous device and can emit light of various wavelengths by appropriately selecting a material of the light emitting layer.
- the organic EL module has a feature that the thickness is extremely small and light compared to incandescent lamps, fluorescent lamps, and LED lighting, and light is emitted in a planar shape, so that there are few restrictions on installation locations. Furthermore, since the organic EL module has higher luminous efficiency than incandescent lamps and fluorescent lamps, the organic EL module has features that it consumes less power and generates less heat.
- Patent Document 1 proposes a lighting device in which a protruding terminal is attached to an electric wire connected to a DC power source and the protruding terminal is connected to an organic EL module.
- a protruding terminal is provided at a position corresponding to the organic EL module, and the protruding terminal is electrically connected to an electrode in the organic EL module, so that the organic light is linearly formed in the same manner as in point emission LED lighting. It has succeeded in spreading EL modules and emitting light.
- the length of the wire and the distance of the protruding terminal are strictly designed according to the installation environment (for example, power supply position and installation position) in advance before installing the organic EL module.
- the installation environment for example, power supply position and installation position
- the layout needs to be changed for reasons such as remodeling or redesign, it can only be changed to a layout that matches the existing power supply structure. Therefore, when the organic EL module is rearranged or the like, there is a problem that the advantage of the organic EL module that there are few restrictions on the installation place is impaired.
- an object of the present invention is to provide an organic EL module in which the features of the organic EL module are utilized and the layout can be easily changed according to the installation environment. Another object is to provide a power feeding structure using the organic EL module.
- an organic EL module having an organic EL device in which at least one plane is a light emitting surface, and at least three connector portions arranged on the back side of the light emitting surface.
- the organic EL device two electrode layers and an organic light emitting layer sandwiched between the electrode layers are laminated on a substrate having a planar spread, and the connector portion spreads in a planar shape.
- the connector part has at least a power supply terminal, and the power supply terminal is electrically connected in parallel and electrically connected to the two electrode layers.
- the connector portion is distributed with a spread in a planar shape. That is, at least three connector portions are not arranged in a straight line.
- the power supply terminals of the respective connector portions are electrically connected to each other in parallel, and are also electrically connected to the electrode layer in the organic EL device. Therefore, it is possible to apply a voltage between the electrode layers of the organic EL device regardless of which connector part of the connector part is electrically connected to the power supply terminal, and to emit light from the organic light emitting layer. Is possible. Furthermore, since the organic EL device can emit light even if an external power supply is electrically connected to the power supply terminal of any of the connector parts, the external power supply can be adapted to the installation status of the organic EL module.
- the connector part to connect can be selected. Therefore, even when the layout is changed, a connector portion that can be suitably connected can be selected in accordance with a desired layout. That is, the organic EL module of this aspect can flexibly cope with a change in layout and has few restrictions on the installation location of the organic EL module.
- the electric power feeding terminal of a connector part is each electrically connected in parallel. Therefore, for example, by connecting an external power source to the power supply terminal of one connector part and electrically connecting the power supply terminal of the other connector part and the power supply terminal of the connector part of another organic EL module, Electric power can be supplied from the external power source to the other organic EL module via the organic EL module. That is, the organic EL module of this aspect also functions as a part of the power supply wiring connecting the power supply terminals. Therefore, a plurality of organic EL modules can be made to emit light with one external power source, and no extra wiring is required, thereby reducing the cost.
- the organic EL module of this aspect also functions as a part of the power supply wiring connecting the power supply terminals. There is no need to newly provide a power supply terminal for the organic EL module corresponding to the additional position of the EL module, and the number of power supply terminals is not affected. Therefore, according to this aspect, a new organic EL module can be easily added.
- the organic EL module when used as illumination, the organic EL module can emit light in a planar shape as described above. Therefore, unlike the point-emitting LED illumination, a plurality of organic EL modules are mounted on a wall such as a ceiling. In many cases, the floor is spread and spread vertically. In such a case, unlike point-emitting LED lighting, in order to illuminate the entire surface evenly, the gap between adjacent organic EL modules is eliminated as much as possible, and the distance between the light emitting surfaces of the organic EL modules is made closer. It is preferable to install.
- a preferred aspect includes a base member provided with the connector portion, and the base member has a shape that can be spread in a flat shape.
- the connector portion is spread, at least another organic EL module is provided. That is, it is provided as many as adjacent.
- substantially no gap includes not only a state in which there is no gap completely but also a state in which a gap is almost negligible. Specifically, it includes a state where a gap of about several mm is open.
- the base member has a shape that can be spread in a flat shape
- the connector portion is provided with a number of adjacent at least other organic EL modules when spread
- the light emitting surface and the light emitting surface of another adjacent organic EL module can be installed close to each other. Further, the number of power supply terminals in the connector portion is not deficient during connection.
- the base member has a polygonal shape in plan view, and a connector portion is arranged corresponding to each side.
- a preferable aspect is that the base member is disposed on the projection surface in the member thickness direction of the organic EL device.
- a preferred aspect is that when a current is supplied to one connector part, the current supplied from the one connector part is shunted to the other connector part of the self, and the self-conductivity is supplied to the own organic EL device. It has a route.
- the organic EL module of this aspect by supplying a current to one connector part, it is possible not only to emit light itself, but also to flow a current to a wiring connected to another connector part.
- a more preferable aspect is that a plurality of the diversion paths are provided.
- the recommended aspect includes a mounting part having a circuit structure, and the circuit structure includes a mounting circuit and a connector side connection wiring for electrically connecting the mounting circuit and the connector part, and the connector side connection wiring. Is having a spread in a planar shape.
- the connector side connection wiring for connecting the mounting circuit and the connector portion has a planar shape. That is, since the connector side connection wiring has a certain width or more, it is less likely to be disconnected than the conventional linear wiring.
- the recommended aspect has a base member for fixing the organic EL device to the mounting surface, and the base member has a current-carrying terminal electrically connected to the organic EL device and the two electrode layers on the light emitting surface side.
- the circuit structure having a mounting circuit and an energization terminal side connection wiring for electrically connecting the mounting circuit and the energization terminal, the energization terminal side connection wiring being It has a spread in the shape of a plane.
- the energization terminal side connection wiring for connecting the mounting circuit and the energization terminal has a planar shape. That is, since the energization terminal side connection wiring has a certain width or more, it is less likely to be disconnected than the conventional linear wiring.
- a preferable aspect includes a base member, the base member includes a mounting portion and a main body portion on which the mounting portion is placed, and the mounting portion is formed of a circuit board and a circuit portion.
- the circuit portion is concentrated on one main surface side of the circuit board, and one main surface of the circuit board faces the main body portion.
- a more preferable aspect is that the main body portion and the circuit board are arranged with a predetermined space therebetween, and the circuit portion is accommodated in the space.
- the circuit unit since the circuit unit is accommodated in the space, the circuit unit is not compressed and is not easily short-circuited.
- a particularly preferable aspect is that the connector portion is provided on a surface opposite to the one main surface of the circuit board.
- the organic EL device has a power feeding part electrically connected to the two electrode layers, and the power feeding part is formed in the vicinity of the side or arc of the base material of the organic EL device. It is that you are.
- the vicinity of the side or the arc represents one side of the base material or a region within 0 to 10 percent of the diameter. Preferably, it is a region of 0 to 5 percent of one side or diameter of the substrate.
- the power feeding unit since the power feeding unit is formed in the vicinity of the side or arc of the base material of the organic EL device, the power feeding unit does not hinder the light emission surface that emits light when driven.
- the organic EL device has two or more power supply portions electrically connected to one of the two electrode layers, and electrically connects the organic EL device and the connector portion.
- a conductive member is provided, and the conductive member connects at least two power supply units among the two or more power supply units.
- the conductive member and the two power supply units are connected, it is possible to supply power to the organic EL device even if one of the power supply units is damaged.
- a more preferable aspect is that the base material has a polygonal shape, and the two power feeding portions are arranged in the vicinity of one side of the base material and the opposite side of the one side.
- the vicinity of one side and the opposite side refers to one side of the substrate or a region within 0 to 10 percent of the diameter. Preferably, it is a region of 0 to 5 percent of one side or diameter of the substrate.
- the power feeding portions are provided on one side and the opposite side, current can flow from the corner of the light emitting surface to the corner in the direction connecting the one side and the opposite side. Therefore, uneven light emission is less likely to occur.
- the conductive member has a plurality of conductive foils arranged in a plane and is provided with resin films having insulating properties on both front and back surfaces of the plurality of conductive foils.
- the conductive member has a plurality of conductive foils arranged in a plane, and the insulating resin films are provided on both front and back surfaces of the plurality of conductive foils.
- the thickness hardly increases. Therefore, it is difficult to impair the feature that the organic EL module is thin.
- one or more conductive foils are electrically connected to one of the two electrode layers of the organic EL device, and the other one or more conductive foils are the other of the two electrode layers of the organic EL device. It is electrically connected to.
- power can be supplied to each electrode layer from the power supply unit of the organic EL device independently by each conductive foil.
- a general lighting device such as a hanging lighting may have a structure that emits light by being fed from the center to the lighting device.
- a power supply structure that can supply power centrally.
- the conductive member has a current-carrying region where a plurality of conductive foils are exposed from the resin film on one side, and the current-carrying region is located at the center of the conductive member.
- power can be supplied to the power supply unit located at the end of the organic EL device via the central energization region of the conductive member. For this reason, concentrated power supply can be performed from the center.
- a preferable aspect is that the conductive member is placed on the surface opposite to the light emitting surface of the organic EL device and crosses the surface on the opposite side.
- the organic EL device has a light emitting region that actually emits light when driven when the substrate is viewed in plan
- the conductive member includes an annular portion surrounding the light emitting region of the organic EL device, A connecting portion extending from the annular portion into the light emitting region, the annular portion being connected to each power feeding portion, and the connecting portion being a terminal directly or indirectly connected to the base member in the light emitting region; And the organic EL device and the connector part are electrically connected via the terminal part.
- a more preferable aspect is that the terminal portion is located in the vicinity of the front end of the connection portion in the extending direction and is located in the center of the light emitting region.
- a more preferable aspect is to have a soaking member having thermal conductivity, and the soaking member is a sheet or a plate and covers the entire light emitting region of the organic EL device.
- the heat-equalizing member having thermal conductivity since the entire light emitting region of the organic EL device is covered by the heat-equalizing member having thermal conductivity, the heat distribution in the light emitting surface can be made uniform. Therefore, occurrence of luminance unevenness can be suppressed.
- a particularly preferable aspect is that the annular portion surrounds the soaking member with a predetermined interval.
- a preferable aspect is to have a buffer plate, which covers the entire light emitting region of the organic EL device and relieves pressure on the organic EL device side.
- each layer in the organic EL device is not easily pressed and short-circuited.
- a more preferable aspect is that the buffer plate is interposed between the connection portion and the organic EL device.
- the pressing force due to the connecting portion located on the organic EL device can be reduced by the buffer plate.
- the organic EL device has a power feeding part electrically connected to the two electrode layers, and the annular part has a grounding part electrically connected to the terminal part.
- the grounding unit is directly or indirectly connected to the power feeding unit.
- a preferred aspect is provided with a conductive member that electrically connects the organic EL device and the connector part, and has a frame that can be attached to the organic EL device.
- the frame integrates the conductive member and the organic EL device. It is that.
- the conductive member and the organic EL device can be integrated by the rigidity of the frame, the conductive member and the organic EL device are hardly separated from each other.
- a more preferable aspect is that the frame has a locking piece that can be engaged with the base member.
- the organic EL device can be easily attached to the base member because it can be engaged with the base member by the locking piece of the frame.
- the frame body has an organic EL element side cover portion that covers a surface opposite to the light emitting surface of the organic EL device, and the organic EL element side cover portion is a through-hole penetrating in the member thickness direction.
- the conductive member passes through an opening on the connector side of the through hole.
- One aspect of the present invention is an organic EL in which two electrode layers and an organic light emitting layer sandwiched between the electrode layers are laminated on a substrate having a planar spread, and at least one plane is a light emitting surface.
- An apparatus and an organic EL module having at least three connector portions on the back surface side of the light emitting surface, and including a mounting portion having a circuit structure, wherein the circuit structure electrically connects the mounting circuit, the mounting circuit, and the connector portion.
- the connector side connection wiring to be connected to the connector side connection wiring has a planar spread.
- One aspect of the present invention is an organic EL in which two electrode layers and an organic light emitting layer sandwiched between the electrode layers are laminated on a substrate having a planar spread, and at least one plane is a light emitting surface.
- An organic EL module having at least three connector portions on the back side of the light emitting surface, and the organic EL device includes a power feeding portion electrically connected to one of the two electrode layers. It has two or more conductive members that electrically connect the organic EL device and the connector portion, and the conductive member connects the two power feeding portions.
- One aspect of the present invention is an organic EL in which two electrode layers and an organic light emitting layer sandwiched between the electrode layers are laminated on a substrate having a planar spread, and at least one plane is a light emitting surface.
- the organic EL module having the device and at least three connector portions on the back side of the light emitting surface, the organic EL device has a light emitting region that actually emits light when driven when the substrate is viewed in plan view,
- the organic EL device has two or more power supply portions that are electrically connected to one of the two electrode layers, and a conductive member that electrically connects the power supply portion and the connector portion of the organic EL device.
- the conductive member includes an annular portion surrounding the light emitting region of the organic EL device, and a connection portion extending from the annular portion into the light emitting region, and the annular portion is connected to each power feeding portion, and the connection In the light emitting area. Or indirectly connected to a terminal portion and is to the organic EL device and the connector portion via the terminal portions are electrically connected.
- An organic EL module power feeding structure having at least three organic EL modules having the above-described aspects and a connecting member for electrically connecting between the connector portions of the organic EL module, wherein an external power source is connected between the organic EL modules. It is preferable that the power supply structure of the organic EL module is configured to form at least two closed circuits through the connection member and the organic EL device having the organic light emitting layer as a load.
- the external power supply the connection member that electrically connects the organic EL module connected to the external power supply and the other organic EL module, and the organic EL device in the other organic EL module,
- the closed circuit that is included is formed for each organic EL module other than the organic EL module that is electrically connected to the external power supply. Therefore, it is possible to emit light by flowing current from a single external power source to a plurality of organic EL modules.
- a preferable aspect is that the base members of the at least three organic EL modules are arranged so as to be flat-filled.
- planar filling means a state in which one or a plurality of types of base members are laid so as to have no gaps.
- the shape of the base member does not matter. For example, only a quadrangular base member may be spread, or a triangular base member and a hexagonal base member may be combined and spread.
- the organic EL modules can be spread without gaps.
- a more preferable aspect is that the two closed circuits pass through different organic EL modules.
- one organic EL module includes a first closed circuit via an organic EL device loaded with its own organic light emitting layer and an organic EL device loaded with an organic light emitting layer of another organic EL module.
- the second closed circuit is formed.
- two or more organic EL modules can emit light simultaneously.
- a particularly preferable aspect is that a plurality of power supply paths for supplying power from an external power source for one organic EL module are provided.
- the connector portions are distributed in a planar shape, and the respective connector portions are electrically parallel to each other, and the organic EL device Since the two electrode layers are electrically connected, the layout can be easily changed according to the installation environment.
- FIG. 1 is a perspective view conceptually showing an organic EL module according to a first embodiment of the present invention.
- FIG. 2 is an electric circuit diagram of the organic EL module of FIG. 1, (a) is an electric circuit diagram according to an actual positional relationship, and (b) is a simplified electric circuit diagram of (a). It is the perspective view which showed notionally the electric power feeding structure using the organic EL module of FIG. It is an electric circuit diagram of the electric power feeding structure of the organic EL module of FIG. It is explanatory drawing showing the flow of the electric current of the electric circuit diagram of the electric power feeding structure of the organic EL module of FIG. 4, and the electric conduction path
- FIG. 10 is an electric circuit diagram of the feeding structure of the organic EL module of FIG. 9.
- FIG. 11 is an explanatory diagram showing power feeding paths to the organic EL module of the power feeding structure of the organic EL module in FIG. 10, and (a) to (d) are schematic diagrams showing each power feeding path, and current flow is represented by arrows. Yes.
- It is a schematic diagram of the electric power feeding structure of the organic EL module which concerns on another embodiment of this invention.
- It is a schematic diagram of the electric power feeding structure of the organic EL module which concerns on another embodiment of this invention, (a), (b) represents each embodiment.
- It is the perspective view which looked at the organic EL module which concerns on Example 1 of this invention from the lower surface side.
- FIG. 2 is a plan view conceptually showing a circuit board of the mounting unit in FIG. 1. It is explanatory drawing of the circuit area
- the organic EL module 1 is preferably used mainly as a lighting device. As shown in FIG. 1, the organic EL module 1 includes a connection plate 2 (base member) including a plurality of connector portions 10 and an organic EL device 3. The organic EL module 1 can emit light from the light emitting surface 53 (see FIG. 14) of the organic EL device 3 by electrically connecting an external power source to the connector portion 10 of the connection plate 2 and functions as illumination.
- connection plate 2 is formed of a fixed portion 6 and a mounting portion 5.
- the fixed part 6 has a planar shape and has at least three sides. That is, the fixed part 6 has a polygonal shape.
- the fixing part 6 of the present embodiment has a rectangular shape and has four sides. In other words, the fixed portion 6 has two opposite sides.
- the mounting unit 5 includes a direct current stabilizing circuit and known mounting components such as dimming, toning, and signal transmission / reception. Moreover, the mounting part 5 has the some connector part 10 (10a, 10b, 10c, 10d) electrically connected with the said mounting component.
- the organic EL module 1 When the organic EL module 1 is laid together with other organic EL modules 1, the organic EL module 1 has at least the number of connector portions 10 adjacent to the other organic EL modules 1.
- the connector portions 10a, 10b, 10c, and 10d are collectively referred to as the connector portion 10 when they have the same configuration.
- the mounting portion 5 has a planar shape and has at least three sides, like the fixed portion 6. That is, the mounting part 5 has a polygonal shape.
- the mounting part 5 of this embodiment has a rectangular shape and has four sides. Further, each side of the mounting portion 5 is parallel to each corresponding side of the fixed portion 6.
- the mounting portion 5 is located at the center of the fixing portion 6 as shown in FIG. 1, and the connector portions 10 a, 10 b, 10 c, 10 d are provided at positions corresponding to the respective sides of the fixing portion 6 of the connection plate 2. Yes. That is, the connector portion 10a and the connector portion 10c are arranged at positions facing the length direction 1 with the center of the mounting portion 5 interposed therebetween.
- the connector portion 10b and the connector portion 10d are arranged at positions facing a direction w (hereinafter also referred to as a width direction w) orthogonal to the length direction l with the center of the mounting portion 5 interposed therebetween.
- a direction w hereinafter also referred to as a width direction w
- the virtual line connecting the connector part 10 a and the connector part 10 c intersects the virtual line connecting the connector part 10 b and the connector part 10 d at the center of the mounting part 5.
- the connector portions 10a to 10d are arranged at positions close to the respective sides of the mounting portion 5 as shown in FIG. Specifically, the distance from each side to the corresponding connector part 10a to 10d is arranged in a range within 1/4 of the short side of the mounting part 5, and is arranged in a range within 1/5. It is preferable. Furthermore, it is more preferable to arrange in the vicinity of each side of the mounting part 5, that is, in a range within 1/6 of the short side of the mounting part 5 from each side.
- the connector parts 10a to 10d are particularly preferably arranged along each side of the mounting part 5.
- the connector unit 10 has a first power supply terminal 7 (power supply terminal) and a second power supply terminal 8 (power supply terminal), as shown in FIGS.
- the first power supply terminal 7 is electrically connected to the first electrode layer 16 serving as the anode in the organic EL device 3 through the mounting portion 5 as shown in FIG.
- the second power supply terminal 8 is electrically connected to the second electrode layer 18 that is a cathode in the organic EL device 3 through the mounting portion 5.
- the connector part 10 (10a, 10b, 10c, 10d) can be electrically connected with an external power supply or the connection member 12 like FIG.
- the first power supply terminal 7 of the connector unit 10 can be connected to the power supply terminal 22 of the external power source and the connection terminal 20 (20a, 20b) of the connection member 12 as shown in FIGS. .
- the 2nd electric power feeding terminal 8 of the connector part 10 can be connected with the power supply terminal 23 of an external power supply, or the connection terminal 21 (21a, 21b) of the connection member 12.
- each connector part 10a, 10b, 10c, 10d is mutually connected in parallel like FIG.2 (b).
- each connector part 10a, 10b, 10c, 10d is electrically connected to the organic EL device 3 in parallel. That is, each connector part 10a, 10b, 10c, 10d forms a closed circuit with the organic EL device 3, respectively.
- some organic EL modules include a mounting circuit such as a stabilized current circuit for supplying a stable current to the organic EL device.
- the mounting circuit is arranged in a conductive path between the external power supply and the organic EL device, and current is supplied to the organic EL device.
- a thin and linear wiring is used on the substrate. Therefore, for example, when a load is suddenly applied to the wiring due to an external force or the like, the wiring may be disconnected. If the wiring is disconnected, the current cannot be supplied to the organic EL device. Of course, if the current continues to flow in the disconnected state, the circuit board may generate heat and cause ignition or the like.
- the mounting portion 5 of the organic EL module 1 of the present embodiment is provided with a characteristic circuit structure 30 for solving such a problem.
- the circuit structure 30 of the mounting unit 5 is divided into a plurality of regions having a planar extension on the circuit board 31 by annular insulating regions 36 and 37 as shown in FIGS. Yes.
- the circuit structure 30 includes a circuit region 32 (conduction terminal side connection wiring) surrounded by a thick line in FIG. 30, a plus region 33 (connector side connection wiring) surrounded by a thick line in FIG. And a minus region 35 (connector side connection wiring) surrounded by a thick line.
- the circuit area 32 is an area where a mounting circuit such as a direct current stabilization circuit is provided.
- the circuit region 32 is electrically connected to the plus region 33 through the internal wiring of the circuit board 31 as shown in FIG. 30, and the energization terminal 73 is located inside the region. That is, the circuit region 32 is a region that functions as a wiring connecting the mounting circuit and the terminal.
- the plus region 33 is a region electrically connected to the first power supply terminal 7 of the connector portion 10 as shown in FIG. Further, the plus region 33 is a region in which the first power supply terminals 7 of the respective connector portions 10 are electrically connected in parallel. That is, the plus region 33 is a region that functions as a wiring connecting the mounting circuit and the terminal. The plus region 33 is electrically separated from the circuit region 32 by the insulating region 36 on the surface of the circuit board 31. That is, the plus region 33 and the circuit region 32 are not energized unless the internal wiring of the circuit board 31 or the components of the mounting circuit are interposed.
- the minus region 35 is a region electrically connected to the second power supply terminal 8 of the connector portion 10 as shown in FIG. Further, the minus region 35 is a region in which the second power supply terminals 8 of the respective connector portions 10 are electrically connected in parallel. That is, the minus region 35 is a region that functions as a wiring connecting the mounting circuit and the terminal. The minus region 35 is electrically separated from the plus region 33 by the insulating region 37 on the surface of the circuit board 31. That is, the minus region 35 and the plus region 33 are not energized unless the internal wiring of the circuit board 31 or the components of the mounting circuit are interposed. In the minus area 35, the energization terminal 75 is located in the area.
- the circuit structure 30 has a circuit region 32 positioned substantially at the center of the circuit board 31 as shown in FIG. As shown in FIG. 31, a plus region 33 is disposed so as to surround the circuit region 32, and an insulating region 36 is interposed between the circuit region 32 and the plus region 33. When viewed from the plus region 33 side, the plus region 33 is an annular region, and the circuit region 32 is located inside the annular region. In the circuit structure 30, as shown in FIG. 32, a minus region 35 is disposed so as to surround the plus region 33, and an insulating region 37 is interposed between the plus region 33 and the minus region 35. When viewed from the minus region 35 side, the minus region 35 is an annular region, and the plus region 33 is located inside the annular region.
- the connector 10 and the mounting circuit, and the wiring connecting the mounting circuit and the current-carrying terminals 73 and 75 are spread in a planar shape, so that the amount of current per unit area can be reduced. it can. Therefore, for example, even if a load is suddenly applied due to an external force or the like, it is difficult to disconnect due to heat generation or the like.
- the organic EL device 3 When attention is paid to the organic EL device 3, the organic EL device 3 is obtained by laminating at least an organic EL element 15 on a substrate 11 (base material) having translucency as shown in FIG. And a light emitting surface 53 that actually emits light when driven. As shown in FIG. 1, the organic EL element 15 includes a functional layer 17 (organic light emitting layer) that actually emits light between at least the first electrode layer 16 and the second electrode layer 18.
- the material of the substrate 11 is not particularly limited, and is appropriately selected from, for example, a flexible film substrate or a plastic substrate.
- a glass substrate or a transparent film substrate is preferable in terms of transparency and good workability.
- the substrate 11 of the present embodiment employs a transparent insulating substrate having transparency and insulating properties, and specifically employs a glass substrate.
- the material of the first electrode layer 16 is not particularly limited.
- a metal such as indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnO 2 ), or zinc oxide (ZnO) is used.
- An oxide or a metal such as silver (Ag) or chromium (Cr) is employed.
- a transparent conductive oxide is preferable in that light generated from the organic light emitting layer in the functional layer 17 can be effectively extracted, and ITO or IZO having high transparency is particularly preferable among them. In this embodiment, ITO is adopted.
- the functional layer 17 is a layer provided between the first electrode layer 16 and the second electrode layer 18 and including at least one organic light emitting layer.
- the functional layer 17 of this embodiment is composed of a plurality of layers mainly made of organic compounds.
- the functional layer 17 can be formed of a known material such as a low molecular dye material or a conjugated polymer material used in a general organic EL device.
- the functional layer 17 may have a multilayer structure including a plurality of layers such as a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer.
- the functional layer 17 has PN coupling and has a rectifying action.
- the functional layer 17 allows current to flow only from the anode to the cathode and does not flow current from the cathode to the anode.
- the organic light-emitting layer allows a current to flow only from the first electrode layer 16 serving as the anode toward the second electrode layer 18 serving as the cathode.
- the material of the second electrode layer 18 is not particularly limited, and examples thereof include metals such as silver (Ag) and aluminum (Al).
- the second electrode layer 18 of the present embodiment is made of Al.
- the organic EL module power supply structure 100 when a plurality of organic EL modules 1 are connected will be described.
- the organic EL module power supply structure 100 of the present embodiment has a row direction l (a direction orthogonal to the column direction w) with respect to the organic EL module 1 (1b) directly connected to an external power source as shown in FIGS. ) And the organic EL module 1 (1c, 1a, 1d) so as to be adjacent to each other in the column direction w.
- the connector portion 10a of the organic EL module 1b is electrically connected to an external power source as shown in FIG.
- the connector portion 10c of the organic EL module 1b is electrically connected to the connector portion 10a of the organic EL module 1d adjacent in the row direction 1 via the connection member 12.
- the connecting member 12 is a connection cable having conductivity.
- the connection member 12 can electrically connect between the connection terminals 20a and 20b and between the connection terminals 21a and 21b as shown in FIG. That is, the connection member 12 can be electrically connected between the connector portions 10 and 10 of the connection target organic EL module 1 by connecting to the connector portion 10 of each connection target organic EL module 1.
- the power supply terminals 7 and 8 of the connector portion 10a of the organic EL module 1b are connected to the power supply terminals 22 and 23 of the external power supply as shown in FIG.
- the power supply terminals 7 and 8 of the connector portion 10c of the organic EL module 1b are connected to the connection terminals 20a and 21a on one side of the connection member 12.
- the other connection terminals 20b and 21b of the connection member 12 are connected to the power supply terminals 7 and 8 of the connector portion 10a of the organic EL module 1d.
- the connector portion 10d of the organic EL module 1b is connected to the row direction w via the connecting member 12. Is electrically connected to the connector portion 10b of the organic EL module 1a adjacent to. Similarly, the connector portion 10b of the organic EL module 1b is electrically connected to the connector portion 10d of the organic EL module 1c adjacent in the column direction w via the connecting member 12.
- the power supply terminals 7 and 8 of the connector portion 10b of the organic EL module 1b are connected to the connection terminals 20a and 21a on one side of the connection member 12.
- the other connection terminals 20b and 21b of the connection member 12 are connected to the power supply terminals 7 and 8 of the connector portion 10d of the organic EL module 1c.
- the power supply terminals 7 and 8 of the connector portion 10d of the organic EL module 1b are connected to the connection terminals 20a and 21a on one side of the connection member 12.
- the other connection terminals 20b and 21b of the connection member 12 are connected to the power supply terminals 7 and 8 of the connector portion 10b of the organic EL module 1a.
- the current supplied from the external power source is supplied to the organic EL device 3b and each of the connector portions 10b, 10c, and 10d in the organic EL module 1b. Are shunted into four conductive paths through. The current divided by the conductive path flows through the organic EL devices 3a to 3d provided in the organic EL modules 1a to 1d via the connection member 12, respectively.
- a part of the current supplied from the external power source into the organic EL module 1b via the connector portion 10a is organic EL. It is transmitted to the organic EL device 3b in the module 1b, and returns to the external power source via the connector portion 10a.
- the power supply structure 100 for the organic EL module power is supplied from an external power source to the organic EL device 3b in the organic EL module 1b, so that the functional layer 17 in the organic EL device 3b emits light. That is, the organic EL module 1b functions as illumination.
- the current supplied from the external power source into the organic EL module 1b via the connector part 10a is supplied from the connector part 10b of the organic EL module 1b to the connecting member 12.
- the current transmitted to the connector unit 10d is transmitted to the organic EL device 3c, and is transmitted from the organic EL device 3c to the connector unit 10d.
- the current transmitted to the connector portion 10d is transmitted from the connector portion 10d of the organic EL module 1c to the connector portion 10b of the organic EL module 1b via the connecting member 12.
- the current transmitted to the connector unit 10b is transmitted to the organic EL module 1b and returns from the connector unit 10a to the external power source.
- the organic EL module power supply structure 100 a closed circuit is formed via the organic EL device 3 c having the external power supply, the connection member 12, and the functional layer 17 as a load, and the organic EL module 1 c is connected from the external power supply. Since power is supplied to the organic EL device 3c, the functional layer 17 in the organic EL device 3c emits light. That is, the organic EL module 1c functions as illumination.
- the current supplied from the external power source into the organic EL module 1b via the connector part 10a is supplied from the connector part 10c of the organic EL module 1b to the connecting member 12.
- To the connector portion 10a of the organic EL module 1d The current transmitted to the connector portion 10a is transmitted to the organic EL device 3d in the organic EL module 1d, and is transmitted from the organic EL device 3d to the connector portion 10a.
- the current transmitted to the connector portion 10a is transmitted from the connector portion 10a of the organic EL module 1d to the connector portion 10c of the organic EL module 1b via the connection member 12.
- the current transmitted to the connector unit 10c is transmitted to the organic EL module 1b and returns from the connector unit 10a to the external power source.
- a closed circuit is formed via the external power source, the connection member 12, and the organic EL device 3d having the functional layer 17 as a load. Since power is supplied to the EL device 3d, the functional layer 17 in the organic EL device 3d emits light. That is, the organic EL module 1d functions as illumination.
- the current supplied from the external power source into the organic EL module 1b via the connector part 10a is transmitted from the connector part 10d of the organic EL module 1b to the connecting member 12.
- To the connector portion 10b of the organic EL module 1a The current transmitted to the connector portion 10b is transmitted to the organic EL device 3a in the organic EL module 1a, and is transmitted from the organic EL device 3a to the connector portion 10b.
- the current transmitted to the connector portion 10b is transmitted from the connector portion 10b of the organic EL module 1a to the connector portion 10d of the organic EL module 1b via the connection member 12.
- the current transmitted to the connector portion 10d is transmitted to the organic EL module 1b and returns from the connector portion 10a to the external power source.
- a closed circuit is formed via the organic EL device 3a having the external power source, the connection member 12, and the functional layer 17 as a load. Since power is supplied to the organic EL device 3a, the functional layer 17 in the organic EL device 3a emits light. That is, the organic EL module 1a functions as illumination.
- the current supplied from the external power supply is divided into a plurality of conductive paths and is supplied to the organic EL devices 3a to 3d in the organic EL modules 1a to 1d. That is, the organic EL module power supply structure 100 can flow current from a single external power source to the plurality of organic EL modules 1a to 1d, and the light emitting surfaces 53 of the organic EL modules 1a to 1d (see FIG. 14). ) Can be emitted.
- the connector portions 10a to 10d are all electrically in parallel, and are also electrically parallel to the organic EL devices 3a to 3d. Therefore, among the connector portions 10a to 10d of the organic EL module 1, the unused connector portion 10, that is, the connection terminals 20, 21 (20a, 21a or 20b, 21b) of the connection member 12, or the power supply terminal of the external power supply A voltage is applied between the first electrode layer 16 and the second electrode layer 18 in the organic EL device 3 of the connected organic EL module 1 even if an external power source is connected to any connector unit 10 to which 22 and 23 are not connected. It is possible to make it.
- the organic EL module 1 functions as a part of the power supply wiring, it is not necessary to change the length of the connection member 12 depending on the installation environment. Therefore, it is easy to standardize the connection member 12, and versatility is high. Further, when a new organic EL module 1 is added due to a layout change or the like, the power supply terminals 7 and 8 of the connector portion 10 of the organic EL module 1 to be added and the connector portions 10a to 10d of the existing organic EL module 1 are added.
- the connection member 12 connects the power supply terminals 7 and 8 of the unconnected connector 10 (unused connector). In this way, it is possible to supply power to the additional organic EL module 1 via the existing organic EL module 1, and to easily add a new organic EL module 1.
- the organic EL module power supply structure 200 according to the second embodiment is different from the organic EL module power supply structure 100 according to the first embodiment in the number of connected organic EL modules 1.
- nine organic EL modules 1 (1A to 1I) are connected by connecting members 12 as shown in FIG.
- the organic EL module power supply structure 200 of the present embodiment has the organic EL modules 1 arranged in a horizontal and vertical pattern.
- the organic EL module power supply structure 200 includes three organic EL modules, three in the vertical direction (row direction l) and three in the horizontal direction (column direction w). Is laid.
- the organic EL module power supply structure 200 electrically connects the adjacent organic EL modules 1 using the connection member 12. That is, a plurality of closed circuits that do not pass through the external power supply are formed between the paths and the organic EL modules 1 (1A to 1I). Further, since the organic EL modules 1 (1A to 1I) are electrically parallel to each other as shown in FIG. 10, any of the connector portions 10a to 10d of the organic EL module 1 (1A to 1I) is used. Are electrically parallel to the organic EL devices 3A to 3I.
- the organic EL module power supply structure 200 has a plurality of connection members 12 connected to each of the organic EL modules 1A to 1I, and has a plurality of power supply paths to the organic EL devices 3A to 3I. is doing. Therefore, as a representative example, attention is paid to the organic EL module 1E located in the center in the row direction l and the column direction w, the power supply path from the external power supply to the organic EL module 1E will be described, and the other organic EL modules 1 will be described. Is omitted.
- the connector part 10a of the organic EL module 1E is electrically connected to the connector part 10c of the adjacent organic EL module 1B via the connection member 12 as shown in FIG.
- the connector portion 10b of the organic EL module 1E is electrically connected to the connector portion 10d of the adjacent organic EL module 1F via the connection member 12.
- the connector portion 10c of the organic EL module 1E is electrically connected to the connector portion 10a of the adjacent organic EL module 1H via the connection member 12.
- the connector portion 10d of the organic EL module 1E is electrically connected to the connector portion 10b of the adjacent organic EL module 1D via the connection member 12.
- the organic EL module power supply structure 200 has four power supply paths as power supply paths to the organic EL module 1E as shown in FIG.
- the first power supply path is a path directly transmitted from the external power source to the organic EL module 1E via the organic EL module 1B as shown in FIG.
- the second power supply path is a path that is transmitted from an external power source to the organic EL module 1E via the organic EL module 1B, the organic EL module 1A, and the organic EL module 1D as shown in FIG.
- the third power supply path is a path that is transmitted from the external power source to the organic EL module 1E via the organic EL module 1B, the organic EL module 1C, and the organic EL module 1F. As shown in FIG.
- the fourth power supply path is transmitted from the external power source to the organic EL module 1H via the organic EL module 1B, the organic EL module 1A, the organic EL module 1D, and the organic EL module 1G.
- the signal is transmitted from an external power source to the organic EL module 1H via the organic EL module 1B, the organic EL module 1C, the organic EL module 1F, and the organic EL module 1I.
- a path is transmitted from the organic EL module 1H to the organic EL module 1E.
- the organic EL module power supply structure 200 has a plurality of power supply paths to the organic EL module 1 to be supplied as described above, the load to the connection member 12 that connects each organic EL module 1 is distributed to supply power.
- the organic EL module 1 can be supplied with power. That is, in the power supply structure 200 of the organic EL module, the connection member 12 is not easily disconnected when supplying power.
- the load of the connecting member 12 can be reduced, the thickness of the cable of the connecting member 12 can be reduced. That is, the cost can be reduced with the power supply structure 200 of the organic EL module. From another point of view, if one power supply path can be secured among the power supply paths to the organic EL module 1E, power can be supplied to the organic EL device 3 of the organic EL module 1E.
- the connection relationship between the organic EL modules 1 can be changed.
- the external power source is directly connected to the connector unit 10, but the present invention is not limited to this, and may be connected via the power supply member 25 provided in the duct rail. At this time, it is preferable to branch from one power supply member 25 and connect to the connector portion 10 as shown in FIG.
- connection plate 2 is used.
- the present invention is not limited to this, and the shape of the connection plate 2 is not limited as long as it has at least three different sides.
- the connection plate 2 may have a triangular shape as shown in FIG. 13A or a hexagonal shape as shown in FIG.
- the position of the connector portion 10 is preferably arranged at a position corresponding to a side adjacent to the other connection plate 2 when the other connection plate 2 is laid.
- not only a straight side but also a curved side or the like may be included.
- the shape of the connection plate 2 is particularly preferably a shape that is flat-filled.
- the mounting portion 5 is provided in the center of the fixing portion 6.
- the mounting unit 5 is located above the light emitting surface 53 of the organic EL device 3. Therefore, the power feeding structure of the organic EL device 3 for connecting the current from the mounting unit 5 to the power feeding unit 55 is necessary. Therefore, an embodiment of the present invention is shown below, and a power feeding structure adopted in the embodiment is also described.
- Example 1 of the organic EL module 1 this invention is not limited to these Examples.
- the organic EL module 1 can be installed with a plurality of organic EL modules 1 spread in a plane with a plurality of organic EL modules 1 as shown in FIG.
- the organic EL module 1 includes an organic EL device 3, a conductive member 52, a frame body 70, and a base member 71 (corresponding to the fixed portion 6) as shown in FIGS.
- the organic EL device 3 is obtained by laminating the organic EL element 15 on the substrate 11 having translucency. As shown in FIG. 16, the organic EL device 3 is divided into a light emitting region 50 where a light emitting surface 53 that actually emits light during driving is located and a plurality of power feeding regions 51 that are fed during driving. Specifically, the light emitting region 50 is located in the center of the organic EL device 3 in the longitudinal direction l (direction perpendicular to the width direction w). The power feeding area 51 is arranged around the light emitting area 50 and on the two sides sandwiching the light emitting area 50.
- the organic EL device 3 according to the first embodiment is a so-called “bottom emission” type organic EL device that extracts light from at least the substrate 11 side.
- the organic EL device 3 includes one or a plurality of organic EL elements 15 in the light emitting region 50.
- the organic EL device 3 according to the first embodiment employs a structure in which a plurality of organic EL elements 15 are built in the light emitting region 50.
- a large number of organic EL elements 15 are planarly distributed on one surface of the substrate 11, and each organic EL element 15 is electrically connected in series on the substrate 11. That is, the organic EL device 3 used in the first embodiment is a so-called integrated organic EL device. Therefore, it is possible to reduce the power loss due to the voltage drop between the electrode layers of the organic EL element 15. Further, since the organic EL elements 15 distributed in a planar manner on one surface of the substrate 11 emit light, the light emission uniformity in the light emitting surface 53 can be improved.
- a plurality of power feeding portions 55 are exposed on the side opposite to the substrate 11 (on the conductive member 52 side) as shown in FIG. More specifically, in the power feeding region 51, four power feeding portions 55 are formed on the back surface side of the substrate 11 (the opposite side to the light emitting surface 53, the lower side in FIG. 16) as shown in FIG. That is, two power supply portions 55a and 55b are provided on one side. Two power feeding portions 55a and 55b are also provided on the side facing the side.
- the power feeding portion 55 is a portion where conductive films 56a and 56b described later are exposed, and has an area of about several mm 2 to several cm 2 .
- the power feeding unit 55 is electrically connected to the first electrode layer 16 or the second electrode layer 18 in the organic EL element 15.
- FIG. 17 a state in which the power feeding portion 55 a is electrically connected to the first electrode layer 16 and the power feeding portion 55 b is electrically connected to the second electrode layer 18 is schematically illustrated using an enlarged view shown in a circle. It is shown in the figure.
- the power feeding units 55 a and 55 a that are opposed to each other are connected to one of the first electrode layer 16 and the second electrode layer 18 in the organic EL element 15.
- the power feeding portions 55 b and 55 b at the facing positions are respectively connected to the other of the first electrode layer 16 or the second electrode layer 18 in the organic EL element 15.
- the power feeding units 55a and 55a are electrically connected to the first electrode layer 16 in the organic EL element 15 as shown in FIG.
- the power feeding portions 55b and 55b are electrically connected to the second electrode layer 18 in the organic EL element 15, respectively.
- a power feeding unit 55 a electrically connected to the first electrode layer 16 in the organic EL element 15 and a power feeding unit 55 b electrically connected to the second electrode layer 18 are provided. It is arranged.
- the organic EL element 15 includes the functional layer 17 between at least the first electrode layer 16 and the second electrode layer 18 as described above. Further, in the organic EL element 15, conductive films 56a and 56b electrically connected to the first electrode layer 16 or the second electrode layer 18 are stacked inside the organic EL element 15 as shown in FIG.
- FIG. 17 is an exploded perspective view of a part of the organic EL element 15 in the organic EL device 3 of FIG.
- the conductive films 56a and 56b are electrically conductive thin films that form the power feeding portions 55a and 55b.
- the conductive films 56 a and 56 b extend over the entire longitudinal direction l of the organic EL device 3.
- an insulating film 57 is laminated across the two conductive films 56a and 56b in a region other than the power feeding portions 55a and 55b.
- the power feeding portion 55 is a portion where the conductive films 56a and 56b, which are conductors, are exposed. That is, in the organic EL device 3, the power feeding portions 55a and 55a and the power feeding portions 55b and 55b are electrically connected by the conductive films 56a and 56b.
- the conductive member 52 is a member that covers a part or the entire surface of the organic EL device 3 opposite to the substrate 11 as shown in FIG. 18 is an explanatory diagram in which the conductive foils 60a and 60b of the conductive member 52 are extended in a planar shape.
- the conductive member 52 is formed by a plurality of conductive foils 60a and 60b and an insulating resin film 61 covering both surfaces of the conductive foils 60a and 60b.
- the two resin films 61 and 61 cover the two conductive foils 60a and 60b and the intermediate portions of the conductive foils 60a and 60b.
- a part of the resin film 61 is peeled off at a central portion of the resin film 61 to form an opening, and the conductive foils 60a and 60b are formed from the opening. Exposed. That is, the conductive member 52 can conduct electricity through the exposed portions of the conductive foils 60a and 60b from the openings.
- the number of conductive foils 60 is determined in accordance with the number of power supply units 55a and 55b installed in the organic EL device 3. More specifically, the number of conductive foils 60 of the conductive member 52 is half of the number of power supply units 55 installed. Further, the interval between the adjacent conductive foils 60 is equal to the distance between the power feeding portions 55a and 55b in the width direction w.
- the conductive foils 60 a and 60 b are rectangular foil bodies as shown in FIG. 18, and the long sides thereof are arranged along the longitudinal direction 1 of the organic EL device 3. Further, the respective conductive foils 60 a and 60 b are arranged in parallel with a predetermined interval in the width direction w, and are integrated by the resin film 61.
- the conductive foils 60a and 60b are not particularly limited as long as they are conductive foil bodies. For example, metal conductive foils such as copper foil, silver foil, gold foil, and platinum foil can be employed. In the conductive foils 60a and 60b of the first embodiment, a strip-shaped copper foil is used.
- the resin film 61 extends in the direction w in which the conductive foils 60a and 60b are juxtaposed (the direction perpendicular to the longitudinal direction 1 of the conductive foils 60a and 60b), and the two conductive foils 60a and 60b. Covering.
- the resin films 61 and 61 covering both surfaces of the conductive foils 60a and 60b are joined on the outer side in the juxtaposed direction w of the conductive foils 60a and 60b.
- the conductive member 52 is in a state where the two resin films 61 are in close contact, and the conductive foils 60 a and 60 b are inserted between the resin films 61.
- the resin film 61 is not particularly limited as long as it is an insulating resin thin film.
- an insulating resin thin film such as polyethylene terephthalate (PET) or polyethylene (PE) can be adopted.
- PET polyethylene terephthalate
- PE polyethylene
- the resin film 61 may be a sheet.
- the conductive member 52 includes an insulating region 65 shown in FIG. 15, a conductive region 63 located on both outer sides in the longitudinal direction l of the insulating region 65 shown in FIG. 18, and the length of the insulating region 65 shown in FIG. 15. And an energization region 62 located in the center of the direction l.
- the insulating region 65 is a region in which the resin film 61 covers both surfaces of the conductive foils 60a and 60b as shown in FIG.
- the conductive region 63 is a region where the conductive foils 60 a and 60 b are exposed from both sides in the longitudinal direction l of the resin film 61.
- the energization region 62 is a region where the conductive foils 60a and 60b are exposed from the resin film 61 only on one surface as shown in FIG. That is, the other surface of the conductive foils 60 a and 60 b is covered with the resin film 61 in the energization region 62.
- the conductive foils 60a and 60b in the conductive region 63 are processed by bending a plurality of times along the side (long side) extending in the longitudinal direction of the organic EL device 3 as shown in FIG. Specifically, the conductive foils 60a and 60b in the conductive region 63 are bent twice so as to cover the end surface of one side of the organic EL device 3 as shown in FIG. That is, the conductive foils 60a and 60b in the conductive region 63 have a “U” shape as shown in FIG.
- the conductive foils 60a and 60b in the conductive region 63 have an upper surface protection part 67, an end surface protection part 68, and a lower surface protection part 69, as shown in FIGS.
- the upper surface protection portion 67 is substantially flush with the insulating region 65 and is disposed on the upper surface of the organic EL device 3 (on the side facing the substrate 11 and the organic EL element 15). is there.
- the end face protection part 68 is a part that protrudes downward (upward in FIG. 16) with respect to the upper surface protection part 67 as shown in FIG. 16, and is a part that protects the end face of the organic EL device 3.
- the lower surface protection part 69 is a part that is folded back toward the organic EL device 3 from the end in the protruding direction of the end surface protection part 68 as shown in FIG. 16, and is a part that protects the lower surface (substrate 11 side) of the organic EL device 3. is there.
- the frame body 70 is a frame-shaped member that covers the outer peripheral edge of the organic EL device 3.
- the frame body 70 is a frame having an opening 82 as shown in FIG. That is, the frame body 70 is a member that covers the end faces of the four sides of the organic EL device 3, and can be mounted along the edge of the organic EL device 3.
- the opening 82 has a rectangular shape in plan view.
- the frame 70 has a light emitting surface side covering portion 83, an organic EL element side covering portion 85, and an end surface covering portion 86 that connects the light emitting surface side covering portion 83 and the organic EL element side covering portion 85. is doing.
- the frame body 70 has a fixed space 87 surrounded by the light emitting surface side covering portion 83, the organic EL element side covering portion 85, and the end surface covering portion 86.
- the fixed space 87 can accommodate the organic EL device 3 and the conductive member 52 therein.
- the material of the frame 70 is not particularly limited as long as it is a material having elasticity and flexibility, and for example, an elastic resin such as silicone or rubber can be adopted.
- the frame body 70 is preferably formed by integral molding.
- the size of the single frame 70 is slightly smaller than the size of the frame 70 when attached to the organic EL module 1.
- the vertical, horizontal, or height of the frame 70 alone is 90% or more of the corresponding size of the vertical, horizontal, and height when the frame 70 is attached to the organic EL module 1. It is less than 100 percent, preferably 95 percent or more and 99 percent or less, and more preferably 96 percent or more and 98 percent or less.
- the frame body 70 is provided with a through hole 81 at a position corresponding to the energization region 62 (see FIG. 15) of the conductive member 52 when attached to the organic EL device 3.
- a through hole 81 is provided in the center of the organic EL element side cover 85.
- the opening shape of the through hole 81 is a square shape, and when attached to the organic EL device 3, a part or all of the conductive foils 60a and 60b in the energization region 62 is exposed from the opening.
- the base member 71 is formed by a support member 72, the mounting portion 5, and energization terminals 73 and 75.
- the support member 72 includes a main body portion 76, attachment portions 77 and 78, and connection portions 79 and 80 that connect the main body portion 76 and the attachment portions 77 and 78.
- the main-body part 76 protrudes in the thickness direction (up-down direction) with respect to the attaching parts 77 and 78 like FIG. 15, FIG.
- the main body portion 76 and the attachment portion 77 are continuous in a step shape via the connection portion 79 as shown in FIG.
- the main body portion 76 and the attachment portion 78 are continuous in a step shape via the connection portion 80.
- the attachment portions 77 and 78 can attach the organic EL module 1 to a wall surface (attachment surface) such as a ceiling as shown in FIG. 14 by a known fastening element such as a screw.
- the mounting part 5 is provided with connector parts 10a to 10d as shown in FIG.
- the connector portions 10a to 10d are electrically connected to energization terminals 73 and 75 (see FIG. 21) via the mounting portion 5.
- the connector portions 10a to 10d are provided on the upper side of the support member 72 as shown in FIG.
- the energization terminals 73 and 75 are provided below the support member 72 as shown in FIG.
- the energization terminals 73 and 75 come into contact with the conductive foils 60 a and 60 b located in the energization region 62 of the conductive member 52, and the organic EL module 1 in the organic EL module 1.
- the conductive member 52 is attached to and integrated with the organic EL device 3.
- the frame body 70 is attached so as to cover the edges of the integrated organic EL device 3 and the conductive member 52.
- the frame body 70 is expanded (stretched) to be larger than the outer shape of the organic EL device 3, and the organic matter is fixed in the fixed space 87 of the frame body 70.
- the edge of the EL device 3 is fitted.
- the organic EL device 3 is always urged so as to be in close contact with the conductive member 52 by the elasticity of the frame body 70. Therefore, the organic EL module 1 is prevented from separating the conductive member 52 from the organic EL device 3.
- the organic EL module 1 has expanded the frame 70 which has elasticity and flexibility, and has fitted the organic EL apparatus 3, and is pressing the organic EL apparatus 3 with the restoring force of the frame 70, The frame 70 is unlikely to come off from the organic EL device 3.
- the frame 70 is fixed to the base member 71 by bringing the current-carrying terminals 73 and 75 of the base member 71 into contact with the conductive foils 60 a and 60 b located in the current-carrying region 62 of the conductive member 52. That is, the current-carrying terminals 73 and 75 and the conductive foils 60a and 60b are in contact with each other through the through hole 81 of the frame body 70.
- the current flowing from the external power source is transmitted from the first power supply terminal 7 of the connector unit 10 and is transmitted to the energizing terminal 73 through the mounting unit 5.
- the current transmitted to the energization terminal 73 is transmitted from the energization terminal 73 to the conductive foil 60 a through the energization region 62 of the conductive member 52, and is transmitted to the power feeding unit 55 a of the organic EL device 3.
- the electric power is transmitted from the power feeding unit 55 a to the first electrode layer 16 in the organic EL device 3.
- the current transmitted to the first electrode layer 16 in the organic EL device 3 passes through the functional layer 17 in the organic EL device 3 and reaches the second electrode layer 18. At this time, the light emitting layer in the functional layer 17 emits light.
- the current transmitted to the second electrode layer 18 in the organic EL device 3 is transmitted to the conductive foil 60b through the power supply portion 55b and the conductive region 63 of the conductive member 52, and is transmitted from the conductive region 62 of the conductive member 52 to the conductive terminal 75. .
- the current transmitted to the energizing terminal 75 is transmitted from the energizing terminal 75 to the second power supply terminal 8 of the connector unit 10 via the mounting unit 5.
- the connecting member 12 to the connector portion 10
- the light emitting surface 53 can emit light through the electrode layer 16 and the substrate 11.
- the organic EL module 201 can be installed with a plurality of organic EL modules 201 spread in a plane. As shown in FIGS. 23, 24, and 25, the organic EL module 201 includes a base member 202, an organic EL device 203, a soaking member 205, a buffer plate 206, a current-carrying member 208, and a frame 207. I have.
- the organic EL device 203 according to the second embodiment has the same configuration as the organic EL device 3 according to the first embodiment.
- the organic EL device 203 according to the second embodiment is different from the organic EL device 3 according to the first embodiment in the number of power supply units 55 as illustrated in FIG.
- the organic EL device 203 according to the second embodiment includes a total of six power supply units 55, including three power supply units 55A to 55C on one side and three power supply units 55A to 55C on the opposite side. have.
- the organic EL device 203 is provided with a power feeding unit 55A and a power feeding unit 55C that are electrically connected to the first electrode layer 16 in the organic EL element 15 on both ends in the width direction w of the substrate 11. Inside them, a power feeding portion 55B electrically connected to the second electrode layer 18 is disposed. That is, in the width direction w of the substrate 11, the power feeding units 55 ⁇ / b> A, 55 ⁇ / b> B, and 55 ⁇ / b> C are arranged in this order from one side.
- the power feeding portions 55 and 55 facing each other with the light emitting region 50 interposed therebetween are connected to the same electrode layer.
- the power feeding units 55A and 55A and the power feeding units 55C and 55C are electrically connected to the first electrode layer 16 in the organic EL element 15, respectively, and the power feeding units 55B and 55B.
- the power feeding units 55B and 55B are electrically connected to the second electrode layer 18 in the organic EL element 15, respectively.
- the heat equalizing member 205 is a sheet or a plate-like body having a planar shape, and is preferably a quadrangular sheet.
- the size of the soaking member 205 is preferably one that covers the entire region of the light emitting region 50 of the organic EL device 203.
- the thickness of the soaking member 205 is preferably 50 ⁇ m or more and 1 mm or less.
- the thickness of the soaking member 205 is more preferably 70 ⁇ m or more and 500 ⁇ m or less, and particularly preferably 100 ⁇ m or more and 300 ⁇ m or less. If it is the above-mentioned range, a heat dissipation and soaking function can be exhibited. Also, the thickness is not too thick.
- the material of the soaking member 205 is not particularly limited as long as it has high thermal conductivity, and graphite, ceramic, metal, inorganic compound, and the like can be adopted.
- a metal for example, copper, aluminum, iron, nickel, chromium, tin, brass, stainless steel and the like can be mentioned. From the viewpoints of heat dissipation and heat uniformity, graphite sheets and aluminum foil are particularly preferable.
- the buffer plate 206 is a member interposed between the connecting portion 215 of the conductive member 210 and the heat equalizing member 205 when the organic EL module 201 is assembled as shown in FIGS. 24 and 25, and the conductive member 210 is organic. It is a member that relieves the force of pressing the EL device 203.
- the material of the buffer plate 206 is not particularly limited as long as it has a rigidity that does not substantially elastically deform when the organic EL module 201 is assembled.
- the material of the buffer plate 206 is insulated by an insulating resin or a metal plate. The thing which covered the film can be adopted.
- the thickness of the buffer plate 206 is preferably 0.3 mm or more and 2 mm or less in the case of resin, and is preferably 0.05 mm or more and 1 mm or less, and 0.1 mm or more and 0.5 mm or less in the case of a metal plate. More preferably.
- the buffer plate 206 is preferably formed of a material that does not transmit the external force received on one side when the organic EL module 201 is assembled to the opposite side.
- the energization member 208 is a member that electrically connects the energization terminals 73 and 75 (see FIG. 26) of the base member 202 and the power feeding units 55A to 55C (see FIG. 25) of the organic EL device 203.
- the current-carrying member 208 is formed by a conductive member 210 and adhesive members 211A to 211C that connect the conductive member 210 and the power feeding portion 55 of the organic EL device 203.
- the conductive member 210 is formed of a flexible printed circuit board (FPC) and is subjected to predetermined patterning. Specifically, the conductive member 210 includes at least a pattern for electrically connecting the energizing terminal 73 (see FIG. 26) of the base member 202 and the power feeding portions 55A and 55C, and the energizing terminal 75 of the base member 202 (FIG. 26). And a pattern for electrically connecting the power supply portion 55B.
- FPC flexible printed circuit board
- the conductive member 210 has an annular portion 212 and a connecting portion 215 as shown in FIG.
- the annular portion 212 is a quadrangular annular portion in plan view (when viewed from the base member 202 side), and is a portion that covers the power supply portions 55A to 55C of the organic EL device 203 as shown in FIG. That is, the annular portion 212 is placed along each side of the organic EL device 203 as shown in FIG. 24 and has an opening 216 on the inner side.
- the shape of the opening 216 is rectangular as shown in FIG. 25, and the size of the opening is slightly larger than that of the buffer plate 206, and is large enough to accommodate the buffer plate 206 inside. As shown in FIG.
- the annular portion 212 has grounding portions 217A to 217C on the side extending in the width direction w.
- the ground portions 217A and 217C are electrically connected to the terminal portion 213a of the connection portion 215, and the ground portion 217B is electrically connected to the terminal portion 213b of the connection portion 215.
- the connecting portion 215 is a tongue-shaped portion extending from the center in the width direction w of one side of the annular portion 212 toward the annular center (center in the length direction 1) of the annular portion 212 as shown in FIG.
- the connection portion 215 has terminal portions 213a and 213b in the vicinity of the distal end in the extending direction from the annular portion 212.
- the connecting portion 215 extends in the length direction 1 of the organic EL device 203 when the organic EL module 201 is assembled, and extends toward the center of the light emitting surface 53.
- the terminal portions 213a and 213b are arranged in the width direction w of the organic EL device 203, and can contact the energizing terminals 73 and 75 (see FIG. 26) of the base member 202.
- the adhesive members 211A to 211C are members that adhere and electrically connect the power feeding portions 55A to 55C and the grounding portions 217A to 217C of the organic EL device 203 as shown in FIG. It is.
- the adhesive members 211A to 211C are arranged at predetermined intervals in the width direction w.
- the material of the adhesive members 211A to 211C is not particularly limited as long as it has adhesiveness and electrical conductivity.
- a conductive adhesive such as anisotropic conductive film (ACF) or low-temperature solder is used. it can.
- the frame body 207 is a frame-shaped member that covers the outer peripheral edge of the organic EL device 203 as shown in FIGS. 27 and 28, and has substantially the same configuration as the frame 70 of the first embodiment.
- the frame body 207 includes a locking piece 218 that can be engaged with the base member 202 in addition to the configuration of the frame body 70 of the first embodiment.
- the locking pieces 218 are provided in a distributed manner on the surface of the organic EL element side cover 85 as shown in FIGS.
- Each of the locking pieces 218 includes a hooking portion 220 and a connecting portion 221 that connects the hooking portion 220 and the organic EL element side covering portion 85 as shown in FIG.
- connection part 221 protrudes in the orthogonal direction (member thickness direction) with respect to the upper surface of the organic EL element side cover part 85.
- the hooking portion 220 protrudes from the end portion of the connecting portion 221 in the protruding direction so as to be parallel to the upper surface of the organic EL element side covering portion 85.
- the protrusion direction of each hook part 220 has faced the same direction. Specifically, when the organic EL module 201 is assembled, it faces the extending direction 1 of the connecting portion 215 of the conductive member 210 of the energizing member 208.
- the through holes 222 are located at positions corresponding to the terminal portions 213a and 213b. Specifically, a through hole 222 is provided in the center of the organic EL element side cover 85.
- the opening shape of the through-hole 222 is a square shape.
- the base member 202 is formed by the skeleton part 223, the mounting part 5, and the energization terminals 73 and 75.
- the skeleton 223 is formed by bending a single plate material.
- the skeleton part 223 includes a main body part 225, an attachment part 226 that can be attached to a wall surface such as a ceiling, and a reinforcing part 227 for increasing the rigidity of the skeleton part 223.
- the main body 225 has the mounting portion 5 attached to the center thereof, and has a plurality of fixing holes 228 on the outer side of the mounting portion 5.
- the frame body 207 when the frame body 207 is attached to the base member 202 as shown in FIG. 23, four frames are located outside the mounting portion 5 in the width direction and corresponding to the locking pieces 218 of the frame body 207.
- a fixing hole 228 is provided. The fixing holes 228 can be engaged with the corresponding locking pieces 218, respectively.
- the attachment portions 226 are provided at the four corners of the main body 225 as shown in FIG. 27 when the base member 202 is viewed in plan.
- the attachment portion 226 includes an upright wall portion 230 bent upward from the main body portion 225, and an attachment surface 231 bent in a direction parallel to the main body portion 225 from the distal end of the upright wall portion 230 in the bending direction (member thickness direction). Is formed.
- the attachment surface 231 is a surface that comes into contact with a wall surface such as a ceiling when attached to a wall surface such as a ceiling, and a hole through which a known fastening element such as a bolt can be inserted is provided at the center.
- the attachment portion 226 has a function of attaching the organic EL module 1 to a wall surface such as a ceiling using a known fastening element. Further, the mounting portion 226 is different in height from the main body portion 225, and has an interval maintaining function for maintaining the circuit board 31 of the mounting portion 5 and a wall surface (attached surface) such as a ceiling at a predetermined interval. . Therefore, the circuit board 31 of the mounting part 5 is not pressed against the mounting surface.
- the reinforcing part 227 is provided at both ends of the main body part 225 in the length direction l and is a bent portion bent upward from the main body part 225.
- the mounting unit 5 is formed by a circuit board 31 and a circuit unit 233 such as a direct current stabilization circuit as shown in FIG.
- the circuit portion 233 is concentrated on one main surface side.
- the surface of the circuit board 31 on which the circuit part 233 is mainly attached faces the upper surface of the main body part 225 as shown in FIG. Yes.
- the main body 225 and the circuit board 31 are arranged with a predetermined space therebetween, and the circuit portion 233 is accommodated in the space.
- the connector part 10 is provided on the surface of the circuit board 31 opposite to the surface on which the circuit part 233 is mainly attached.
- the soaking member 205 is placed on the organic EL device 203, and the buffer plate 206 is placed thereon. At this time, the soaking member 205 covers part or the entire surface of the light emitting surface 53 of the organic EL device 203. Further, the soaking member 205 does not cover the power feeding portions 55A to 55C. In other words, the power feeding portions 55A to 55C are exposed from the heat equalizing member 205.
- the grounding portions 217A to 217C of the conductive member 210 and the power feeding portions 55A to 55C of the organic EL device 203 are connected via the adhesive members 211A to 211C (the energizing member 208).
- the annular portion 212 of the conductive member 210 is located on the organic EL device 203 and outside the buffer plate 206.
- the buffer plate 206, the heat equalizing member 205, the annular portion 212, and the adhesive members 211A to 211C are arranged with a predetermined interval as shown in FIG. That is, the buffer plate 206 and the heat equalizing member 205 are not in contact with the annular portion 212 and are not in contact with the adhesive members 211A to 211C.
- connection portion 215 is placed on the buffer plate 206 as shown in FIG.
- the terminal portions 213a and 213b of the connection portion 215 are located at the center of the organic EL device 203 in the width direction w and the length direction l.
- the frame 207 is attached and integrated so as to cover the edges of the integrated organic EL device 203 and the energizing member 208 (the annular portion 212 of the conductive member 210).
- the frame body 207 is expanded (stretched) so as to be larger than the outer shape of the organic EL device 203 using the elasticity and flexibility of the frame body 207, and the organic matter is fixed in the fixed space 87 of the frame body 207.
- the edge of the EL device 203 is fitted.
- the organic EL device 203 is always biased by the elasticity of the frame body 207 so that the conductive member 210 and the organic EL device 203 are in close contact with each other. Therefore, the organic EL module 201 is prevented from separating the conductive member 210 from the organic EL device 203.
- the frame body 207 is attached to the base member 202 attached to a wall surface such as a ceiling by another process. Specifically, the locking piece 218 of the frame body 207 is slid and inserted into the fixing hole 228 of the base member 202, and the locking portion 214 is locked to the main body portion 225 of the base member 202. At this time, the current-carrying terminals 73 and 75 are in contact with the terminal portions 213a and 213b, and the current-carrying terminals 73 and 75 are fixed in a state of pressing the terminal portions 213a and 213b.
- the organic EL module 201 since the buffer plate 206 is interposed between the organic EL device 203 and the connection portion 215 as described above, the pressing force to the organic EL device 203 is reduced. As a result, the pressing force of the energizing terminals 73 and 75 is not transmitted to the organic EL device 203. Therefore, the organic EL element 15 in the organic EL device 203 is not compressed and is not easily short-circuited.
- the buffer plate 206 is placed on the heat equalizing member 205 on the organic EL device 203, the heat generated in the organic EL device 203 during driving is reduced. Heat is soaked by the heat equalizing member 205, and further, the heat escapes through the buffer plate 206, so that the heat hardly stays in the organic EL device 203 and does not concentrate locally. Therefore, light emission defects are less likely to occur.
- the frame body 207 can be easily attached and detached.
- the current flowing from the external power source is transmitted from the first power supply terminal 7 of the connector unit 10 and is transmitted to the energizing terminal 73 via the circuit unit 233 in the mounting unit 5.
- the current transmitted to the energizing terminal 73 is transmitted to the annular portion 212 via the terminal portion 213a of the connecting portion 215 of the conductive member 210, and is transmitted to the power feeding portions 55A and 55C of the organic EL device 203 via the ground portions 217A and 217C. .
- the current transmitted to the power feeding units 55 ⁇ / b> A and 55 ⁇ / b> C is transmitted to the first electrode layer 16 in the organic EL device 203.
- the current transmitted to the first electrode layer 16 in the organic EL device 3 passes through the functional layer 17 in the organic EL device 203 and reaches the second electrode layer 18. At this time, the light emitting layer in the functional layer 17 emits light.
- the current transmitted to the second electrode layer 18 in the organic EL device 3 is transmitted to the annular portion 212 of the conductive member 210 via the power supply portion 55B and the ground portion 217B, and is transmitted from the connection portion 215 of the conductive member 210 to the terminal portion 213b. .
- the electric power is transmitted from the terminal portion 213b to the second power supply terminal 8 of the connector portion 10 through the energization terminal 75 and the circuit portion 233 in the mounting portion 5.
- connection member 12 As described above, by connecting the connection member 12 to the connector portion 10, it is possible to apply a voltage to the organic EL device 203 in the organic EL module 201, and the light emitting surface 53 of the organic EL device 203 can emit light.
- the connector portion 10 includes only the power feeding terminals 7 and 8 has been described as an example.
- the present invention is not limited to this, and the dimming circuit or the like is provided in the mounting portion 5.
- the connector unit 10 may be provided with a signal terminal. In that case, it is preferable to provide a signal line in the connecting member 12.
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Abstract
Description
そして、有機EL素子は、一方又は双方が透光性を有する2つの電極を対向させ、この電極の間に有機化合物からなる発光層を積層したものである。有機EL装置は、電気的に励起された電子と正孔との再結合のエネルギーによって発光する。
すなわち、有機ELモジュールは、自発光デバイスであり、発光層の材料を適宜選択することにより、種々の波長の光を発光することができる。
そこで、特許文献1では、直流電源に接続された電線に突出端子を取り付け、当該突出端子を有機ELモジュールに接続する照明装置が提案されている。この照明装置では、有機ELモジュールに対応した位置に突出端子を設けて、突出端子を有機ELモジュール内の電極に電気的に接続することで、点発光のLED照明等と同様、直線状に有機ELモジュールを敷き詰めて発光させることに成功している。
また、特許文献1の給電構造は、レイアウトの変更などに伴って有機ELモジュールを増設する場合に、電線に接続されたすべての突出端子に有機ELモジュールが接続されていると、新たに有機ELモジュールを増設することができないという問題があった。
さらに、当該コネクター部のうち、いずれのコネクター部の給電端子に外部電源を電気的に接続しても、有機EL装置を発光させることができるため、有機ELモジュールの設置状況に合わせて、外部電源を接続するコネクター部を選択することができる。それ故に、たとえレイアウトの変更を行う場合であっても、所望のレイアウトに合わせて、好適に接続できるコネクター部を選択できる。すなわち、本様相の有機ELモジュールは、レイアウトの変更に柔軟に対応でき、有機ELモジュールの設置場所の制約が少ない。
さらに、既設の有機ELモジュールに新たに有機ELモジュールを増設する場合であっても、本様相の有機ELモジュールは、給電端子間を接続する給電用の配線の一部としても機能するため、有機ELモジュールの増設位置に対応した有機ELモジュールへの給電用の端子を新たに設ける必要がなく、給電用の端子の個数に影響されない。それ故に、本様相によれば、容易に新たな有機ELモジュールを増設することができる。
「ほぼ隙間がない」とは、完全に隙間がない状態に加えて、ほぼ無視できる程度に隙間が空いている状態も含む。具体的には、数mm程度の隙間が空いている状態も含む。
なお、以下の説明において、特に断りがない限り、有機ELモジュール1の上下左右の位置関係は、図1の姿勢を基準に説明する。すなわち、基板11側を下側、実装部5側を上側とする。また、図面は、理解を容易にするために全体的に実際の大きさ(長さ、幅、厚さ)に比べて極端に描写している。
接続板2は、図1のように固定部6と、実装部5から形成されている。
固定部6は、平面状に広がりをもっており、少なくとも3辺を有している。すなわち、固定部6は、多角形状をしている。本実施形態の固定部6は、方形状をしており、4辺を有している。言い換えると、固定部6は、互いに対向する辺が2つずつ存在する。
有機ELモジュール1は、他の有機ELモジュール1とともに敷き詰めた場合に、少なくとも他の有機ELモジュール1が隣接する数のコネクター部10を有している。
以下、コネクター部10a,10b,10c,10dについて同様の構成の場合、まとめてコネクター部10とも称する。
実装部5は、図1のように固定部6の中央に位置しており、コネクター部10a,10b,10c,10dは、接続板2の固定部6の各辺に対応する位置に設けられている。
すなわち、コネクター部10aとコネクター部10cは、実装部5の中心を挟んで、長さ方向lに対向する位置に配されている。一方、コネクター部10bとコネクター部10dは、実装部5の中心を挟んで、長さ方向lに直交する方向w(以下、幅方向wともいう)に対向する位置に配されている。
言い換えると、コネクター部10aとコネクター部10cとを結んだ仮想線は、コネクター部10bとコネクター部10dとを結んだ仮想線と実装部5の中心で交差する。
具体的には、各辺から対応するコネクター部10a~10dまでの距離は、実装部5の短辺の1/4以内の範囲に配されており、1/5以内の範囲に配されていることが好ましい。さらには、実装部5の各辺の近傍、すなわち、各辺から実装部5の短辺の1/6以内の範囲に配されていることがより好ましい。
コネクター部10a~10dは、実装部5の各辺に沿って配されていることが特に好ましい。
第1給電端子7は、図2のように実装部5を介して有機EL装置3内の陽極たる第1電極層16と電気的に接続されている。
第2給電端子8は、実装部5を介して、有機EL装置3内の陰極たる第2電極層18と電気的に接続されている。
具体的には、コネクター部10の第1給電端子7は、図3,図4のように外部電源の電源端子22や接続部材12の接続端子20(20a,20b)と接続可能となっている。コネクター部10の第2給電端子8は、外部電源の電源端子23や接続部材12の接続端子21(21a,21b)と接続可能となっている。
そして、各コネクター部10a,10b,10c,10dは、図2(b)のように、互いに電気的に並列に接続されている。さらに、各コネクター部10a,10b,10c,10dは、有機EL装置3に対しても電気的に並列に接続されている。すなわち、各コネクター部10a,10b,10c,10dは、有機EL装置3とそれぞれ閉回路を形成している。
そのため、例えば外力などによって、突発的に当該配線に負荷がかかると、配線が断線するおそれがあった。配線が断線すると、有機EL装置に電流を供給できないことは勿論、断線状態で電流を流し続けると、回路基板が発熱し発火等の原因となるおそれがある。
本実施形態の実装部5の回路構造30は、回路基板31上に図29,図33に示されるように環状の絶縁領域36,37によって平面状に広がりを有した複数の領域に分断されている。
具体的には、回路構造30は、図30の太線で囲まれる回路領域32(通電端子側接続配線)と、図31の太線で囲まれるプラス領域33(コネクター側接続配線)と、図32の太線で囲まれるマイナス領域35(コネクター側接続配線)と、を有している。
プラス領域33は、回路基板31表面上で絶縁領域36によって回路領域32と電気的に切り離れている。すなわち、プラス領域33と回路領域32は、回路基板31の内部配線又は、実装回路の構成部材を介さない限り、通電しない。
マイナス領域35は、回路基板31表面上で絶縁領域37によってプラス領域33と電気的に切り離れている。すなわち、マイナス領域35とプラス領域33は、回路基板31の内部配線又は、実装回路の構成部材を介さない限り、通電しない。
また、マイナス領域35は、その領域内に通電端子75が位置している。
また、回路構造30は、図32のように、プラス領域33の周りを囲むようにマイナス領域35が配されており、プラス領域33とマイナス領域35の間に絶縁領域37が介在されている。マイナス領域35側からみると、マイナス領域35は環状の領域となっており、その環状内部にプラス領域33が位置している。
有機EL素子15は、図1のように少なくとも第1電極層16と第2電極層18との間に実際に発光する機能層17(有機発光層)を備えたものである。
本実施形態の基板11は、透明性及び絶縁性を有した透明絶縁基板を採用しており、具体的には、ガラス基板を採用している。
機能層17内の有機発光層から発生した光を効果的に取り出せる点では、透明導電性酸化物が好ましく、特にその中でも透明性が高いITOあるいはIZOが特に好ましい。本実施形態では、ITOを採用している。
ここで、機能層17は、PN結合を有するものであり、整流作用を持つ。すなわち、機能層17は、陽極から陰極のみに電流を流し、陰極から陽極には電流を流さない。本実施形態では、有機発光層は、陽極たる第1電極層16から陰極たる第2電極層18に向かってのみ電流を流すものである。
本実施形態の有機ELモジュールの給電構造100は、図3,図4のように直接外部電源と接続した有機ELモジュール1(1b)に対して、行方向l(列方向wに対して直交方向)及び列方向wに隣接するように有機ELモジュール1(1c,1a,1d)が敷設されている。
また、有機ELモジュール1bのコネクター部10cは、接続部材12を介して行方向lに隣接する有機ELモジュール1dのコネクター部10aと電気的に接続されている。
なお、接続部材12は、導電性を有した接続ケーブルである。接続部材12は、図4のように接続端子20a,20b間及び接続端子21a,21b間を電気的に接続することができる。すなわち、接続部材12は、接続対象の各有機ELモジュール1のコネクター部10に接続することで、接続対象の有機ELモジュール1のコネクター部10,10間を電気的に接続可能となっている。
また、有機ELモジュール1bのコネクター部10cの給電端子7,8は、接続部材12の一方側の接続端子20a,21aと接続されている。接続部材12の他方側の接続端子20b,21bは、有機ELモジュール1dのコネクター部10aの給電端子7,8と接続されている。
このとき、有機ELモジュールの給電構造100では、外部電源から有機ELモジュール1b内の有機EL装置3bに給電されるので、有機EL装置3b内の機能層17が発光する。すなわち、有機ELモジュール1bが照明として機能する。
このとき、有機ELモジュールの給電構造100では、外部電源と、接続部材12と、機能層17を負荷とする有機EL装置3cを経由する閉回路が形成されており、外部電源から有機ELモジュール1c内の有機EL装置3cに給電されるので、有機EL装置3c内の機能層17が発光する。すなわち、有機ELモジュール1cが照明として機能する。
このとき、有機ELモジュールの給電構造100では、外部電源と、接続部材12と、機能層17を負荷とする有機EL装置3dを経由する閉回路が形成されており、有機ELモジュール1d内の有機EL装置3dに給電されるので、有機EL装置3d内の機能層17が発光する。すなわち、有機ELモジュール1dが照明として機能する。
このとき、有機ELモジュールの給電構造100では、外部電源と、接続部材12と、機能層17を負荷とする有機EL装置3aを経由する閉回路が形成されており、外部電源から有機ELモジュール1a内の有機EL装置3aに給電されるので、有機EL装置3a内の機能層17が発光する。すなわち、有機ELモジュール1aが照明として機能する。
そのため、有機ELモジュール1のコネクター部10a~10dのうち、未使用のコネクター部10、すなわち、接続部材12の接続端子20,21(20a,21a又は20b,21b)、又は、外部電源の電源端子22,23が接続されていないどのコネクター部10に外部電源を接続しても、接続した有機ELモジュール1の有機EL装置3内の第1電極層16と第2電極層18間に電圧を印加させることが可能である。
それ故に、有機ELモジュール1を密集させた状態で敷き詰めて設置した場合でも、外部電源を接続できるコネクター部10a~10dを選択することができ、容易に所望のコネクター部10a~10dに接続することができる。つまり、レイアウトの変更を行いやすい。
また、レイアウトの変更等によって新たに有機ELモジュール1を増設する際には、増設する有機ELモジュール1のコネクター部10の給電端子7,8と、既存の有機ELモジュール1のコネクター部10a~10dのうち接続されていないコネクター部10(未使用コネクター部)の給電端子7,8と、を接続部材12によって接続する。このようにすれば、既存の有機ELモジュール1を介して、増設する有機ELモジュール1に給電でき、新たな有機ELモジュール1を増設しやすい。
本第2実施形態における有機ELモジュールの給電構造200は、図9のように、9つの有機ELモジュール1(1A~1I)をそれぞれ接続部材12によって接続している。
本実施形態の有機ELモジュールの給電構造200は、図9のように、有機ELモジュール1が縦横に碁盤状に並設されている。
具体的には、有機ELモジュールの給電構造200は、図9のように、縦方向(行方向l)に3つずつ、横方向(列方向w)に3つずつ、計9つの有機ELモジュールが敷設されている。そして、有機ELモジュールの給電構造200は、接続部材12を用いて隣接する有機ELモジュール1間をそれぞれ電気的に接続している。すなわち、経路、有機ELモジュール1(1A~1I)間で、外部電源を経由しない閉回路が複数形成されている。
また、有機ELモジュール1(1A~1I)は、図10のように、そのそれぞれが互いに電気的に並列になっているため、有機ELモジュール1(1A~1I)のいずれのコネクター部10a~10dも有機EL装置3A~3Iに対して、互いに電気的に並列となっている。
そこで、代表例として、行方向l及び列方向wの中央に位置する有機ELモジュール1Eについて注目し、外部電源から有機ELモジュール1Eへの給電経路について説明し、他の有機ELモジュール1については説明を省略する。
そして、有機ELモジュールの給電構造200は、図11のように、有機ELモジュール1Eへの給電用の経路として、4つの給電経路を有している。
第2の給電経路は、図11(b)のように外部電源から有機ELモジュール1B、有機ELモジュール1A、有機ELモジュール1Dを経由して有機ELモジュール1Eに伝わる経路である。
第3の給電経路は、図11(c)のように外部電源から有機ELモジュール1B、有機ELモジュール1C、有機ELモジュール1Fを経由して有機ELモジュール1Eに伝わる経路である。
第4の給電経路は、図11(d)のように、外部電源から有機ELモジュール1B、有機ELモジュール1A、有機ELモジュール1D、有機ELモジュール1Gを経由して有機ELモジュール1Hに伝わる。外部電源から有機ELモジュール1B、有機ELモジュール1C、有機ELモジュール1F、有機ELモジュール1Iを経由して有機ELモジュール1Hに伝わる。そして、有機ELモジュール1Hから有機ELモジュール1Eに伝わる経路である。
また、別の観点からみると、有機ELモジュール1Eへの給電経路のうち、1つの給電経路が確保できれば、有機ELモジュール1Eの有機EL装置3に給電できるため、レイアウトの変更の際に容易に有機ELモジュール1間の接続関係を変更可能である。
有機ELモジュール1を全面に敷き詰められる観点から、接続板2の形状は、特に平面充填となる形状であることが好ましい。
そのため、電流を実装部5から給電部55へつなげるための有機EL装置3の給電構造が必要となる。そこで、以下に本発明の実施例を示し、当該実施例に採用する給電構造についても説明する。
有機ELモジュール1は、図15,図16のように有機EL装置3と、導電部材52と、枠体70と、ベース部材71(固定部6に対応)を備えている。
有機EL装置3は、上記したように透光性を有した基板11に有機EL素子15を積層したものである。有機EL装置3は、図16のように、その面内において駆動時に実際に発光する発光面53が位置する発光領域50と、駆動時に給電される複数の給電領域51に分けられる。具体的には、発光領域50は、有機EL装置3の長手方向l(幅方向wに直交する方向)の中央に位置している。給電領域51は、発光領域50の周囲であって、発光領域50を挟んだ2辺側にそれぞれ配されている。また、本実施例1の有機EL装置3は、少なくとも基板11側から光を取り出す、いわゆる「ボトムエミッション」型の有機EL装置である。
給電部55は、後述する導電膜56a,56bが露出した部分であり、数mm2~数cm2程度の面積を有している。
給電部55は、有機EL素子15内の第1電極層16又は第2電極層18に電気的に接続されている。図17では、円内に示した拡大図を用いて給電部55aが第1電極層16に電気的に接続され、給電部55bが第2電極層18に電気的に接続された状態を模式的に図示している。
基板11の長さ方向lにおいて、対向する位置にある給電部55a,55aは、それぞれ有機EL素子15内の第1電極層16又は第2電極層18のうちの一方に接続されている。また、対向する位置にある給電部55b,55bは、それぞれ有機EL素子15内の第1電極層16又は第2電極層18のうちの他方に接続されている。
具体的には、給電部55a,55aは、図17のように、それぞれ有機EL素子15内の第1電極層16と電気的に接続されている。一方、給電部55b,55bは、それぞれ有機EL素子15内の第2電極層18と電気的に接続されている。
なお、図17は、図16の有機EL装置3について有機EL素子15の一部を分解した斜視図である。導電膜56a,56bは給電部55a,55bを形成する電気伝導性を有した薄膜である。導電膜56a,56bは有機EL装置3の長手方向l全体に延びている。また、給電部55a,55b以外の領域には、2枚の導電膜56a,56bに亘って絶縁膜57が積層している。逆に言えば、給電部55は、導電体である導電膜56a,56bが露出した部分である。
すなわち、有機EL装置3では、導電膜56a,56bによって、給電部55a,55a、給電部55b,55b間を電気的に接続している。
導電部材52は、図18のように有機EL装置3の基板11とは反対側の一部又は全面を覆う部材である。なお、図18は、導電部材52の導電箔60a,60bを平面状に引き延ばした説明図である。
導電部材52は、図18のように複数の導電箔60a,60bと、導電箔60a,60bの両面を覆った絶縁性の樹脂膜61と、によって形成されている。本実施例1では、2枚の導電箔60a,60bと、その導電箔60a,60bのそれぞれの中間部を2枚の樹脂膜61,61が覆っている。そして、図15のように一方の面(上面)において、樹脂膜61の中央部位は、樹脂膜61の一部が剥がされて、開口が形成されており、当該開口から導電箔60a,60bが露出している。すなわち、導電部材52は、開口からの導電箔60a,60bの露出部位を介して電気伝導が可能となっている。
導電箔60a,60bは、導電性を有した箔体であれば特に限定されるものではなく、例えば、銅箔や銀箔、金箔、白金箔などの金属製の導電箔などが採用できる。
なお、本実施例1の導電箔60a,60bでは、帯状の銅箔を用いている。
絶縁領域65は、図15のように導電箔60a,60bの両面を樹脂膜61が覆った領域である。
導電領域63は、図18のように導電箔60a,60bが樹脂膜61の長手方向l両側から露出した領域である。
通電領域62は、図15のように一方の面のみ樹脂膜61から導電箔60a,60bが露出した領域である。すなわち、導電箔60a,60bの他方の面は、通電領域62において樹脂膜61が被覆している。
上面保護部67は、図15のように絶縁領域65と略同一平面上であって、有機EL装置3の上面(基板11と有機EL素子15を挟んで対向する側)に配された部位である。
端面保護部68は、図16のように上面保護部67に対して下方(図16では上方)に向けて突出した部位であり、有機EL装置3の端面を保護する部位である。
下面保護部69は、図16のように端面保護部68の突出方向端部から有機EL装置3側に折り返された部位であり、有機EL装置3の下面(基板11側)を保護する部位である。
枠体70は、有機EL装置3の外周縁を覆う額縁状の部材である。枠体70は、図19のように開口82を有したフレームである。すなわち、枠体70は、有機EL装置3の4辺の端面を覆う部材であり、有機EL装置3の縁に沿って装着可能となっている。開口82は、平面視すると長方形状となっている。有機EL装置3に枠体70を取り付けた際には、枠体70の開口82から有機EL装置3の発光面53の一部又は全部が露出する。
具体的には、枠体70単体の縦、横、高さのいずれかの大きさは、有機ELモジュール1に取り付けた際の縦、横、高さのうち、対応する大きさの90パーセント以上100パーセント未満となっており、95パーセント以上99パーセント以下であることが好ましく、96パーセント以上98パーセント以下であることがより好ましい。
具体的には、有機EL素子側覆部85の中央に貫通孔81が設けられている。
貫通孔81の開口形状は、方形状をしており、有機EL装置3に取り付けたときに、その開口から通電領域62の導電箔60a,60bの一部又は全部が露出する。
ベース部材71は、図15,図21のように支持部材72と、実装部5と、通電端子73,75によって形成されている。
支持部材72は、図21のように、本体部76と、取付部77,78と、本体部76と取付部77,78を接続する接続部79,80から形成されている。また、本体部76は、図15,図21のように取付部77,78に対して厚み方向(上下方向)に突出している。
本体部76と取付部77は、図21のように接続部79を介して段状に連続している。同様に、本体部76と取付部78は、接続部80を介して段状に連続している。
取付部77,78は、ねじ等の公知の締結要素によって、図14のように天井などの壁面(被取付面)に有機ELモジュール1を取り付けることが可能となっている。
また、通電端子73,75は、図22のように有機ELモジュール1を取り付けた際に、導電部材52の通電領域62に位置する導電箔60a,60bと接触し、有機ELモジュール1内の有機EL装置3の給電部55a,55bと実装部5とを電気的に接続する部位である。すなわち、通電端子73,75は、支持部材72を厚み方向に挿通し、導電部材52と物理的に接続可能となっている。
具体的には、枠体70の弾性と可撓性を利用して枠体70を有機EL装置3の外形よりも大きくなるように広げ(伸ばして)、枠体70の固定空間87内に有機EL装置3の縁を嵌める。
有機EL装置3は、常に枠体70の弾性によって、導電部材52と密着するように付勢されている。そのため、有機ELモジュール1は、有機EL装置3から導電部材52が離反することが防止されている。
また、有機ELモジュール1は、弾性と可撓性を有した枠体70を広げて有機EL装置3を嵌め込んでおり、枠体70の復元力によって、有機EL装置3を押しつけているため、有機EL装置3から枠体70が外れにくい。
有機EL装置3内の第1電極層16に伝わった電流は、有機EL装置3内で機能層17を通過して第2電極層18に至る。このとき、機能層17内の発光層が発光する。
有機EL装置3内の第2電極層18に伝わった電流は、給電部55b及び導電部材52の導電領域63を介して導電箔60bに伝わり、導電部材52の通電領域62から通電端子75に伝わる。通電端子75に伝わった電流は、通電端子75から実装部5を介してコネクター部10の第2給電端子8に伝わる。
有機ELモジュール201は、実施例1と同様、複数の有機ELモジュール201とともに平面状に広がりをもって敷き詰めて設置可能なものである。
有機ELモジュール201は、図23,図24,図25のようにベース部材202と、有機EL装置203と、均熱部材205と、緩衝板206と、通電部材208と、枠体207と、を備えている。
実施例2の有機EL装置203は、実施例1の有機EL装置3と同様の構成を有している。実施例2の有機EL装置203は、図25のように実施例1の有機EL装置3と給電部55の個数が異なる。
具体的には、実施例2の有機EL装置203は、図25のように一辺側に3つの給電部55A~55C、その対辺側に3つの給電部55A~55C、の計6つの給電部55を有している。
また、有機EL装置203は、基板11の幅方向wにおいて、両端側に有機EL素子15内の第1電極層16と電気的に接続された給電部55Aと給電部55Cが配されており、それらの内側には、第2電極層18と電気的に接続された給電部55Bが配されている。すなわち、基板11の幅方向wには、片側から給電部55A,55B,55Cの順に配されている。
一方、有機EL装置203は、基板11の長さ方向l(幅方向wと直交方向)において、発光領域50を挟んで対向する給電部55,55同士が同一電極層と接続されている。
具体的には、有機EL装置203では、給電部55A,55Aと給電部55C,55Cが、それぞれ有機EL素子15内の第1電極層16と電気的に接続されており、給電部55B,55Bが、それぞれ有機EL素子15内の第2電極層18と電気的に接続されている。
均熱部材205の大きさは、有機EL装置203の発光領域50の全領域を覆うものであることが好ましい。
均熱部材205の厚みは、50μm以上1mm以下であることが好ましい。均熱部材205の厚みは、70μm以上500μm以下であることがより好ましく、100μm以上300μm以下であることが特に好ましい。
上記した範囲であれば、放熱及び均熱機能を発揮できる。また、厚みも厚くなりすぎない。
緩衝板206は、図24,図25のように有機ELモジュール201を組み立てた時に、導電部材210の接続部215と、均熱部材205との間に介在する部材であり、導電部材210が有機EL装置203を押圧する力を緩和する部材である。
また、緩衝板206の素材は、有機ELモジュール201を組み立てた時にほぼ弾性変形しない程度の剛性を有していれば、特に限定されるものではなく、例えば、絶縁性の樹脂や金属板に絶縁フィルムを覆ったものなどが採用できる。
緩衝板206の厚みは、樹脂製の場合、0.3mm以上2mm以下であることが好ましく、金属板の場合、0.05mm以上1mm以下であることが好ましく、0.1mm以上0.5mm以下であることがより好ましい。
また、緩衝板206は、有機ELモジュール201を組み立てた時に片面で受けた外力をその反対側の面に伝えない素材で形成していることが好ましい。
通電部材208は、ベース部材202の通電端子73,75(図26参照)と、有機EL装置203の給電部55A~55C(図25参照)とを電気的に接続する部材である。
通電部材208は、図25のように導電部材210と、導電部材210と有機EL装置203の給電部55を接続する接着部材211A~211Cとによって形成されている。
具体的には、導電部材210は、少なくとも、ベース部材202の通電端子73(図26参照)と給電部55A,55Cとを電気的に接続するパターンと、ベース部材202の通電端子75(図26参照)と給電部55Bとを電気的に接続するパターンと、を有している。
環状部212は、平面視すると(ベース部材202側からみると)、四角環状の部位であり、図24のように有機EL装置203の給電部55A~55Cの上方を覆う部位である。
すなわち、環状部212は、図24のように有機EL装置203の各辺に沿って載置されており、内側に開口部216を有している。開口部216の形状は、図25のように方形状をしており、その開口の大きさは、緩衝板206より一回り大きく、その内側に緩衝板206を収納可能な大きさとなっている。
環状部212は、図25のように、幅方向wに延伸する辺に接地部217A~217Cを有している。接地部217A,217Cは、接続部215の端子部213aと電気的に接続されており、接地部217Bは、接続部215の端子部213bと電気的に接続されている。
また、端子部213a,213bは、有機EL装置203の幅方向wに並んでおり、ベース部材202の通電端子73,75(図26参照)と接触可能となっている。
枠体207は、図27,図28のように有機EL装置203の外周縁を覆う額縁状の部材であり、実施例1の枠体70とほぼ同様の構成を有している。具体的には、枠体207は、実施例1の枠体70の構成に加えて、ベース部材202に係合可能な係止片218を有している。
係止片218は、図24,図27のように有機EL素子側覆部85の面上に分布を持って設けられている。また、係止片218は、それぞれ図24のように引掛部220と、引掛部220と有機EL素子側覆部85を接続する接続部221を有している。
接続部221は、有機EL素子側覆部85の上面に対して直交方向(部材厚方向)に突出している。引掛部220は、その接続部221の突出方向端部から有機EL素子側覆部85の上面と平行となるように突出している。
そして、それぞれの引掛部220の突出方向は、同一方向を向いている。具体的には、有機ELモジュール201を組み立てた際に、通電部材208の導電部材210の接続部215の延伸方向lを向いている。
具体的には、有機EL素子側覆部85の中央に貫通孔222が設けられている。貫通孔222の開口形状は、方形状をしている。
有機EL装置203に枠体207を取り付けたときには、その開口内に端子部213a,213bが露出する。そのため、ベース部材202の通電端子73,75(図26参照)は、貫通孔222を経由して端子部213a,213bと接触可能となっており、電気的に接続可能となっている。
ベース部材202は、図26,図27のように骨格部223と、実装部5と、通電端子73,75によって形成されている。
骨格部223は、1枚の板材を折り曲げ加工することによって形成されている。骨格部223は、本体部225と、天井等の壁面に取り付け可能な取付部226と、骨格部223の剛性を高めるための補強部227を有している。
本体部225は、図27のように、その中央に実装部5が取り付けられており、その実装部5の外側に複数の固定孔228を有している。
具体的には、図23のようにベース部材202に枠体207を取り付けたときに、実装部5の幅方向の外側であって、枠体207の係止片218に対応する位置に4つの固定孔228が設けられている。固定孔228は、それぞれ対応する係止片218と係合可能となっている。
取付面231は、天井等の壁面に取り付けた時に、天井等の壁面と接触する面であり、その中央には、ボルト等の公知の締結要素が挿通可能な孔が設けられている。すなわち、取付部226は、公知の締結要素を用いて、天井などの壁面に有機ELモジュール1を取り付ける機能を有している。
また、取付部226は、本体部225と高さが異なっており、実装部5の回路基板31と天井等の壁面(被取付面)とを所定の間隔に維持するための間隔維持機能も有する。そのため、実装部5の回路基板31が被取付面に圧迫されることがない。
実装部5を骨格部223に取り付けてベース部材202を形成した際には、図28のように回路基板31の主に回路部233が取り付けられた面は、本体部225の上面と対面している。また、本体部225と回路基板31は、所定の空間を空けて配されており、当該空間内に回路部233が収納されている。コネクター部10は、回路基板31の主に回路部233が取り付けられた面の反対側の面に設けられている。
このとき、均熱部材205は、有機EL装置203の発光面53の一部又は全面を覆っている。また、均熱部材205は、給電部55A~55Cを覆っていない。逆に言うと、給電部55A~55Cは、均熱部材205から露出している。
このとき、導電部材210の環状部212は、有機EL装置203上であって、緩衝板206の外側に位置している。そして、緩衝板206及び均熱部材205と、環状部212と接着部材211A~211Cは、図28のように所定の間隔を空けて配されている。すなわち、緩衝板206及び均熱部材205は、環状部212と接触しておらず、接着部材211A~211Cにも接触していない。
また、舌状の接続部215は、図24のように緩衝板206上に載置されている。接続部215の端子部213a,213bは、有機EL装置203の幅方向w及び長さ方向lの中心に位置している。
このとき、有機EL装置203は、常に枠体207の弾性によって、導電部材210と有機EL装置203とが密着するように付勢されている。そのため、有機ELモジュール201は、有機EL装置203から導電部材210が離反することが防止されている。
このとき、通電端子73,75と端子部213a,213bが接触し、通電端子73,75が端子部213a,213bを押圧した状態で固定されている。
ここで、本実施例2の有機ELモジュール201は、上記したように有機EL装置203と接続部215との間には緩衝板206が介在しているため、有機EL装置203への押圧力が緩和され有機EL装置203に通電端子73,75の押圧力が伝わらない。そのため、有機EL装置203内の有機EL素子15が圧迫されず、短絡しにくい。
有機EL装置3内の第1電極層16に伝わった電流は、有機EL装置203内の機能層17を通過して第2電極層18に至る。このとき、機能層17内の発光層が発光する。
有機EL装置3内の第2電極層18に伝わった電流は、給電部55B及び接地部217Bを介して導電部材210の環状部212に伝わり、導電部材210の接続部215から端子部213bに伝わる。端子部213bから通電端子75、実装部5内の回路部233を介して、コネクター部10の第2給電端子8に伝わる。
2 接続板(ベース部材)
3,3a~3d,3A~3I 有機EL装置
5 実装部
7 第1給電端子(給電端子)
8 第2給電端子(給電端子)
10,10a~10d コネクター部
11 基板(基材)
12 接続部材
16 第1電極層(電極)
17 機能層(有機発光層)
18 第2電極層(電極)
30 回路構造
31 回路基板
32 回路領域(通電端子側接続配線)
33 プラス領域(コネクター側接続配線)
35 マイナス領域(コネクター側接続配線)
50 発光領域
52,210 導電部材
53 発光面
55,55a,55b,55A~55C 給電部
60,60a,60b 導電箔
61 樹脂膜
62 通電領域
70,207 枠体
71,202 ベース部材
73 通電端子
76 本体部
87 固定空間(空間)
100,200 有機ELモジュールの給電構造
205 均熱部材
206 緩衝板
212 環状部
213a,213b 端子部
215 接続部
233 回路部
Claims (36)
- 少なくとも一方の平面が発光面となる有機EL装置と、前記発光面の裏面側に配置された少なくとも3つのコネクター部とを有する有機ELモジュールにおいて、
前記有機EL装置は、面状に広がりを有する基材に、2層の電極層と、前記電極層に挟まれた有機発光層が積層されており、
前記コネクター部は、平面状に広がりをもって配置されたものであり、
前記コネクター部は、少なくとも給電端子を有し、
前記給電端子は、電気的に並列に接続され、かつ、当該2層の電極層と電気的に接続されていることを特徴とする有機ELモジュール。 - 前記コネクター部を備えたベース部材を有し、
前記ベース部材は、平面状に敷き詰め可能な形状であり、
前記コネクター部は、敷き詰めた場合に、少なくとも他の有機ELモジュールが隣接する数だけ設けられていることを特徴とする請求項1に記載の有機ELモジュール。 - 前記ベース部材は、平面視すると多角形状であり、
各辺に対応してコネクター部が配されていることを特徴とする請求項1又は2に記載の有機ELモジュール。 - ベース部材は、有機EL装置の部材厚方向の投影面上に配されていることを特徴とする請求項1乃至3のいずれかに記載の有機ELモジュール。
- 一のコネクター部に電流を供給したときに、当該一のコネクター部から供給された電流を自己の他のコネクター部に分流する分流経路と、自己の有機EL装置へ供給する自己導電経路を備えていることを特徴とする請求項1乃至4のいずれかに記載の有機ELモジュール。
- 前記分流経路を複数備えていることを特徴とする請求項5に記載の有機ELモジュール。
- 回路構造を有した実装部を備え、
当該回路構造は、実装回路と、当該実装回路とコネクター部を電気的に接続するコネクター側接続配線を有し、
当該コネクター側接続配線は、面状に広がりを有していることを特徴とする請求項1乃至6のいずれかに記載の有機ELモジュール。 - 有機EL装置を被取付面に固定するベース部材を有し、
ベース部材は、前記発光面側に有機EL装置と前記2層の電極層に電気的に接続する通電端子を有し、
回路構造を有した実装部を備え、
当該回路構造は、実装回路と、当該実装回路と通電端子を電気的に接続する通電端子側接続配線を有し、
当該通電端子側接続配線は、面状に広がりを有していることを特徴とする請求項1乃至7のいずれかに記載の有機ELモジュール。 - ベース部材を有し、
当該ベース部材は、実装部と、実装部を載置する本体部を有し、
当該実装部は、回路基板と回路部から形成されており、
当該回路部は、回路基板の一方の主面側に回路部が集中しており、
当該回路基板の一方の主面は、本体部と対面していることを特徴とする請求項1乃至8のいずれかに記載の有機ELモジュール。 - 前記本体部と回路基板は、所定の空間を空けて配されており、
当該空間内に回路部が収納されていることを特徴とする請求項9に記載の有機ELモジュール。 - 前記コネクター部は、回路基板の前記一方の主面に対して反対側の面に設けられていることを特徴とする請求項10に記載の有機ELモジュール。
- 前記有機EL装置は、前記2層の電極層と電気的に接続された給電部を有し、
当該給電部は、有機EL装置の基材の辺又は弧の近傍に形成されていることを特徴とする請求項1乃至11のいずれかに記載の有機ELモジュール。 - 前記有機EL装置は、前記2層の電極層のうち一方の電極層と電気的に接続された給電部を2以上有し、
前記有機EL装置とコネクター部を電気的に接続する導電部材を備え、
当該導電部材は、前記2以上の給電部のうち、少なくとも2つの給電部間を接続していることを特徴とする請求項1乃至12のいずれかに記載の有機ELモジュール。 - 前記基材は、多角形状であり、
前記2つの給電部は、基材の一辺及び当該1辺の対辺の近傍に配されていることを特徴とする請求項13に記載の有機ELモジュール。 - 前記導電部材は、複数の導電箔が平面的に配置され、前記複数の導電箔の表裏両面に絶縁性を有した樹脂膜が設けられていることを特徴とする請求項13又は14に記載の有機ELモジュール。
- 1以上の導電箔が有機EL装置の前記2層の電極層の一方に電気的に接続され、他の1以上の導電箔が有機EL装置の前記2層の電極層の他方に電気的に接続されていることを特徴とする請求項15に記載の有機ELモジュール。
- 前記導電部材は、片面の樹脂膜から複数の導電箔が露出した通電領域を有し、
当該通電領域は、導電部材の中央に位置していることを特徴とする請求項15又は16に記載の有機ELモジュール。 - 前記導電部材は、有機EL装置の発光面に対して反対側の面に載置されており、
当該反対側の面を横切っていることを特徴とする請求項13乃至17のいずれかに記載の有機ELモジュール。 - 前記有機EL装置は、基材を平面視したときに、駆動時に実際に発光する発光領域を有し、
前記導電部材は、有機EL装置の発光領域を囲む環状部と、環状部から発光領域内に延びた接続部を有し、
当該環状部は各給電部と接続されており、
前記接続部は、発光領域内でベース部材と直接的又は間接的に接続される端子部を有し、
当該端子部を経由して有機EL装置とコネクター部が電気的に接続されることを特徴とする請求項13又は14に記載の有機ELモジュール。 - 前記端子部は、接続部の延伸方向先端近傍に位置し、かつ、発光領域の中央に位置していることを特徴とする請求項19に記載の有機ELモジュール。
- 熱伝導性を有した均熱部材を有し、
当該均熱部材は、シート又は板状体であって、かつ、有機EL装置の発光領域全域を覆っていることを特徴とする請求項19又は20に記載の有機ELモジュール。 - 前記環状部は、均熱部材の周りを所定の間隔を空けて囲んでいることを特徴とする請求項21に記載の有機ELモジュール。
- 緩衝板を有し、
当該緩衝板は、有機EL装置の発光領域全域を覆い、有機EL装置側への圧力を緩和させるものであることを特徴とする請求項19乃至22のいずれかに記載の有機ELモジュール。 - 前記緩衝板は、前記接続部と有機EL装置の間に介在していることを特徴とする請求項19乃至23のいずれかに記載の有機ELモジュール。
- 前記有機EL装置は、前記2層の電極層と電気的に接続された給電部を有し、
前記環状部は、前記端子部と電気的に接続された接地部を有し、
当該接地部は、給電部と直接的又は間接的に接続されていることを特徴とする請求項19乃至24のいずれかに記載の有機ELモジュール。 - 前記有機EL装置とコネクター部を電気的に接続する導電部材を備え、
有機EL装置に装着可能な枠体を有し、
当該枠体は、前記導電部材と有機EL装置を一体化していることを特徴とする請求項1乃至25のいずれかに記載の有機ELモジュール。 - 前記枠体は、前記ベース部材に係合可能な係止片を有していることを特徴とする請求項26に記載の有機ELモジュール。
- 前記枠体は、有機EL装置の発光面と反対側の面を覆う有機EL素子側覆部を有し、
当該有機EL素子側覆部は、部材厚方向に貫通した貫通孔を有し、
前記導電部材は当該貫通孔のコネクター側の開口を通過していることを特徴とする請求項26又は27に記載の有機ELモジュール。 - 面状に広がりを有する基材に、2層の電極層と、前記電極層に挟まれた有機発光層が積層され、少なくとも一方の平面が発光面となる有機EL装置と、前記発光面の裏面側に少なくとも3つのコネクター部を有する有機ELモジュールにおいて、
回路構造を有した実装部を備え、
当該回路構造は、実装回路と、当該実装回路とコネクター部を電気的に接続するコネクター側接続配線を有し、
当該コネクター側接続配線は、面状に広がりを有していることを特徴とする有機ELモジュール。 - 面状に広がりを有する基材に、2層の電極層と、前記電極層に挟まれた有機発光層が積層され、少なくとも一方の平面が発光面となる有機EL装置と、前記発光面の裏面側に少なくとも3つのコネクター部を有する有機ELモジュールにおいて、
前記有機EL装置は、前記2層の電極層のうち一方の電極層と電気的に接続された給電部を2以上有し、
前記有機EL装置とコネクター部を電気的に接続する導電部材を備え、
当該導電部材は、前記2つの給電部間を接続していることを特徴とする有機ELモジュール。 - 面状に広がりを有する基材に、2層の電極層と、前記電極層に挟まれた有機発光層が積層され、少なくとも一方の平面が発光面となる有機EL装置と、前記発光面の裏面側に少なくとも3つのコネクター部を有する有機ELモジュールにおいて、
前記有機EL装置は、基材を平面視したときに、駆動時に実際に発光する発光領域を有し、
前記有機EL装置は、前記2層の電極層のうち一方の電極層と電気的に接続された給電部を2以上有し、
前記有機EL装置の給電部とコネクター部を電気的に接続する導電部材を備え、
前記導電部材は、有機EL装置の発光領域を囲む環状部と、環状部から発光領域内に延びた接続部を有し、
当該環状部は各給電部と接続されており、
前記接続部は、発光領域内でベース部材と直接的又は間接的に接続されている端子部を有し、
当該端子部を経由して有機EL装置とコネクター部が電気的に接続されていることを特徴とする有機ELモジュール。 - 請求項1乃至31のいずれかに記載の有機ELモジュールが少なくとも3つと、当該有機ELモジュールのコネクター部間を電気的に接続する接続部材を有した有機ELモジュールの給電構造であって、
前記有機ELモジュール間で、外部電源と、接続部材と、有機発光層を負荷とする有機EL装置とを経由する、少なくとも2つの閉回路を形成するものであることを特徴とする有機ELモジュールの給電構造。 - 前記少なくとも3つの有機ELモジュールのベース部材は、平面充填になるように配されていることを特徴とする請求項32に記載の有機ELモジュールの給電構造。
- 前記2つの閉回路は、異なる有機ELモジュールを経由していることを特徴とする請求項32又は33に記載の有機ELモジュールの給電構造。
- 一の有機ELモジュールは、自己の有機発光層を負荷とする有機EL装置を経由する第1閉回路と、他の有機ELモジュールの有機発光層を負荷とする有機EL装置を経由する第2閉回路を形成することを特徴とする請求項32乃至34のいずれかに記載の有機ELモジュールの給電構造。
- 一の有機ELモジュールに対する外部電源から給電される給電経路を複数備えていることを特徴とする請求項32乃至35のいずれかに記載の有機ELモジュールの給電構造。
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EP2838317B1 (en) | 2017-10-11 |
US9307585B2 (en) | 2016-04-05 |
US20150137710A1 (en) | 2015-05-21 |
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