WO2013153875A1 - 積層研磨パッド及びその製造方法 - Google Patents
積層研磨パッド及びその製造方法 Download PDFInfo
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- WO2013153875A1 WO2013153875A1 PCT/JP2013/055516 JP2013055516W WO2013153875A1 WO 2013153875 A1 WO2013153875 A1 WO 2013153875A1 JP 2013055516 W JP2013055516 W JP 2013055516W WO 2013153875 A1 WO2013153875 A1 WO 2013153875A1
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- WIPO (PCT)
- Prior art keywords
- polishing
- layer
- adhesive
- light transmission
- polishing pad
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/1223—Hot-melt adhesive film-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
- B32B2038/0016—Abrading
Definitions
- the present invention relates to a laminated polishing pad used when planarizing unevenness on a surface of an object to be polished such as a semiconductor wafer by chemical mechanical polishing (CMP) and a manufacturing method thereof.
- CMP chemical mechanical polishing
- the present invention relates to a laminated polishing pad having a window (light transmission region) for detection and a manufacturing method thereof.
- a conductive film is formed on the surface of a semiconductor wafer (hereinafter also referred to as a wafer), and a wiring layer is formed by photolithography, etching, or the like.
- a process for forming an interlayer insulating film is performed on the surface of the wafer, and these processes cause irregularities made of a conductor such as metal or an insulator on the wafer surface.
- miniaturization of wiring and multilayer wiring have been advanced for the purpose of increasing the density of semiconductor integrated circuits, and along with this, technology for flattening the irregularities on the wafer surface has become important.
- CMP is a technique of polishing using a slurry-like abrasive (hereinafter referred to as slurry) in which abrasive grains are dispersed in a state where the surface to be polished of a wafer is pressed against the polishing surface of a polishing pad.
- slurry a slurry-like abrasive
- a polishing apparatus generally used in CMP includes a polishing surface plate 2 that supports a polishing pad 1 and a support base (polishing head) 5 that supports a material to be polished (wafer or the like) 4. And a backing material for uniformly pressing the wafer and a supply mechanism for the abrasive 3.
- the polishing pad 1 is attached to the polishing surface plate 2 by attaching it with a double-sided tape, for example.
- the polishing surface plate 2 and the support base 5 are disposed so that the polishing pad 1 and the material to be polished 4 supported by each of the polishing surface plate 2 and the support base 5 are opposed to each other, and are provided with rotating shafts 6 and 7 respectively. Further, a pressurizing mechanism for pressing the workpiece 4 against the polishing pad 1 is provided on the support base 5 side.
- the optical detection means is a method of detecting an end point of polishing by irradiating a wafer with a light beam through a window (light transmission region) through a polishing pad and monitoring an interference signal generated by the reflection. It is.
- a polyurethane resin foam sheet is generally used as a polishing pad used for high-precision polishing.
- the polyurethane resin foam sheet is excellent in local flattening ability, it is difficult to apply a uniform pressure to the entire wafer surface because of insufficient cushioning properties. For this reason, usually, a soft cushion layer is separately provided on the back surface of the polyurethane resin foam sheet, and is used for polishing as a laminated polishing pad.
- conventional laminated polishing pads generally have a polishing layer and a cushion layer bonded to each other with a double-sided tape, but the slurry enters between the polishing layer and the cushion layer during polishing, reducing the durability of the double-sided tape.
- the polishing layer and the cushion layer are easily peeled off.
- Patent Document 1 discloses that a plastic film and a polishing pad are bonded using a reactive hot melt adhesive.
- Patent Document 2 discloses a polishing pad in which a base layer and a polishing layer are bonded by a hot melt adhesive layer.
- Patent Document 3 discloses a polishing pad in which a polishing layer and a base layer are bonded by a double-sided tape, and is composed of a hot-melt adhesive between the back surface of the polishing layer and the double-sided tape, and blocks polishing slurry.
- a technique for providing a water blocking layer is disclosed.
- Patent Document 4 discloses a polishing pad in which a polishing layer and a lower layer are bonded with a hot melt adhesive containing EVA.
- Delamination can be prevented by using a hot melt adhesive.
- a hot-melt adhesive is used when manufacturing a laminated polishing pad having a light transmission region, (1) the manufacturing process becomes complicated, or (2) it is difficult to install the light transmission region at a predetermined position. (3) In the process of manufacturing the laminated polishing pad, the light transmission region is scratched, or the adhesive layer or the resin film provided on the lower surface side of the light transmission region is scratched or foreign matter adheres. There is a problem that the optical detection accuracy is lowered.
- JP 2002-224944 A JP 2005-167200 A JP 2009-95945 A Japanese translation of PCT publication 2010-52595
- the present invention provides a method for easily producing a laminated polishing pad that is difficult to peel off between a polishing layer and a support layer or an intermediate layer and has excellent optical detection accuracy even when the temperature becomes high due to long-time polishing.
- the purpose is to provide.
- the present inventors have found that the above object can be achieved by the following method for producing a laminated polishing pad, and have completed the present invention.
- the present invention includes a step of providing a light transmission region in the opening A of the polishing region to produce a polishing layer, a step of providing an adhesive member X containing a hot melt adhesive on one side of the polishing layer, and the adhesive member X A step of providing a peelable protective member at a portion corresponding to the light transmissive region, a step of attaching a support layer to the adhesive member X provided with the peelable protective member, and removing a portion of the support layer corresponding to the light transmissive region. Furthermore, the present invention relates to a method for manufacturing a laminated polishing pad including a step of forming an opening B by removing a peelable protective member.
- a step of preparing a polishing layer by providing a light transmission region in the opening A of the polishing region, the polishing layer and the intermediate layer are formed using an adhesive member X containing a hot melt adhesive.
- a method of manufacturing a laminated polishing pad including a step of removing a support layer corresponding to a light transmission region and further removing a peelable protective member to form an opening B.
- another present invention is a process for preparing a polishing layer by providing a light transmission region in the opening A of the polishing region, and using the adhesive member X containing the hot melt adhesive for the polishing layer and the intermediate layer.
- the present invention relates to a method for manufacturing a laminated polishing pad including a step of attaching, and a step of removing an adhesive member Y and a support layer corresponding to a light transmission region, and further removing a peelable protective member to form an opening B.
- the intermediate layer is preferably a resin film.
- the adhesive member X is an adhesive layer containing a polyester hot melt adhesive, or a double-sided tape having the adhesive layer on both sides of a base material, and the polyester hot melt adhesive is a base polymer. It is preferable to contain 2 to 10 parts by weight of an epoxy resin having two or more glycidyl groups in one molecule with respect to 100 parts by weight of the polyester resin.
- the polyester resin By adding 2 to 10 parts by weight of an epoxy resin having two or more glycidyl groups in one molecule with respect to 100 parts by weight of the polyester resin as a base polymer, the polyester resin is cross-linked so that a high temperature can be obtained by long-time polishing Even in this case, the durability of the adhesive member X against “slipping” generated during polishing is improved, and a laminated polishing pad that does not easily peel between the polishing layer and the support layer or the intermediate layer is obtained.
- the addition amount of the epoxy resin is less than 2 parts by weight, the durability of the adhesive member X against “slipping” generated during polishing becomes insufficient when the temperature becomes high due to long-time polishing. It becomes easy to peel between the support layer or the intermediate layer.
- it exceeds 10 parts by weight the hardness of the adhesive layer becomes too high and the adhesiveness is lowered, so that it is easy to peel between the polishing layer and the support layer or the intermediate layer.
- the polyester resin as the base polymer is preferably a crystalline polyester resin.
- the chemical resistance to the slurry is improved, and the adhesive force of the adhesive layer is hardly lowered.
- the present invention relates to a laminated polishing pad obtained by the production method and a method for producing a semiconductor device including a step of polishing a surface of a semiconductor wafer using the laminated polishing pad.
- the production method of the present invention it is possible to obtain a laminated polishing pad that hardly peels between the polishing layer and the support layer or the intermediate layer even when the temperature becomes high due to long-time polishing.
- the light transmission region can be easily installed at a desired position, and the light transmission region of the adhesive member provided on the lower surface side of the light transmission region using the peelable protective member. Since the corresponding part is protected, the part is not scratched or foreign matter adheres during the manufacturing process. Therefore, it is possible to effectively prevent a decrease in optical detection accuracy.
- Schematic configuration diagram showing an example of a polishing apparatus used in CMP polishing Schematic process drawing showing an example of a method for producing a laminated polishing pad of the present invention
- the light transmission region 10 is provided in the opening A9 of the polishing region 8, and the polishing layer 11 is produced.
- the polishing region 8 may be a foam or a non-foam, but is preferably a foam having fine bubbles.
- materials for the polishing region include polyurethane resins, polyester resins, polyamide resins, acrylic resins, polycarbonate resins, halogen resins (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, olefin resins (polyethylene). , Polypropylene, etc.), epoxy resins, photosensitive resins and the like, or a mixture of two or more.
- Polyurethane resin is particularly preferable as a material for forming a polishing region because it has excellent wear resistance and a polymer having desired physical properties can be easily obtained by variously changing the raw material composition.
- a polishing region made of a polyurethane resin foam will be described.
- the polyurethane resin is composed of an isocyanate component, a polyol component (high molecular weight polyol, low molecular weight polyol), and a chain extender.
- isocyanate component a known compound in the field of polyurethane can be used without particular limitation.
- isocyanate component 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 4,4′-diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, Aromatic diisocyanates such as p-phenylene diisocyanate, m-phenylene diisocyanate, p-xylylene diisocyanate, m-xylylene diisocyanate; ethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 1,6-hexamethylene diisocyanate, etc.
- Aliphatic diisocyanate 1,4-cyclohexane diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, isophorone diisocyanate Isocyanate, alicyclic diisocyanates such as norbornane diisocyanate. These may be used alone or in combination of two or more.
- Examples of the high molecular weight polyol include those usually used in the technical field of polyurethane. Examples include polyether polyols typified by polytetramethylene ether glycol, polyethylene glycol, etc., polyester polyols typified by polybutylene adipate, polycaprolactone polyols, reactants of polyester glycols such as polycaprolactone and alkylene carbonate, etc. Polyester polycarbonate polyol obtained by reacting ethylene carbonate with polyhydric alcohol and then reacting the obtained reaction mixture with organic dicarboxylic acid, polycarbonate polyol obtained by transesterification of polyhydroxyl compound and aryl carbonate Etc. These may be used alone or in combination of two or more.
- low molecular weight polyamines such as ethylenediamine, tolylenediamine, diphenylmethanediamine, and diethylenetriamine
- alcohol amines such as monoethanolamine, 2- (2-aminoethylamino) ethanol, and monopropanolamine can be used in combination.
- These low molecular weight polyols and low molecular weight polyamines may be used alone or in combination of two or more.
- the blending amount of the low molecular weight polyol, the low molecular weight polyamine or the like is not particularly limited, and is appropriately determined depending on the characteristics required for the polishing pad (polishing layer 11) to be produced.
- a chain extender is used for curing the prepolymer.
- the chain extender is an organic compound having at least two active hydrogen groups, and examples of the active hydrogen group include a hydroxyl group, a primary or secondary amino group, and a thiol group (SH).
- the polyurethane resin foam can be produced by applying a known urethanization technique such as a melting method or a solution method, but is preferably produced by a melting method in consideration of cost, working environment, and the like.
- the polyurethane resin foam can be produced by either the prepolymer method or the one-shot method.
- an isocyanate-terminated prepolymer is synthesized beforehand from an isocyanate component and a polyol component, and this is reacted with a chain extender.
- the polymer method is preferred because the resulting polyurethane resin has excellent physical properties.
- Examples of the method for producing a polyurethane resin foam include a method of adding hollow beads, a mechanical foaming method, and a chemical foaming method.
- a mechanical foaming method using a silicon surfactant which is a copolymer of polyalkylsiloxane and polyether and does not have an active hydrogen group is preferable.
- stabilizers such as antioxidants, lubricants, pigments, fillers, antistatic agents, and other additives may be added.
- the polyurethane resin foam may be a closed cell type or an open cell type.
- Polyurethane resin foam can be manufactured by batch feeding each component into a container and stirring, or by continuously supplying each component and non-reactive gas to the stirring device and stirring, It may be a continuous production method in which a dispersion is sent out to produce a molded product.
- the prepolymer that is the raw material of the polyurethane resin foam is placed in a reaction vessel, and then a chain extender is added and stirred, and then poured into a casting mold of a predetermined size to produce a block, and the block is shaped like a bowl or a band saw.
- a thin sheet may be used.
- a raw material resin may be dissolved and extruded from a T-die to directly obtain a sheet-like polyurethane resin foam.
- the polishing surface that comes into contact with the material to be polished in the polishing region 8 preferably has a concavo-convex structure for holding and renewing the slurry.
- the polishing area made of foam has many openings on the polishing surface and has the function of holding and updating the slurry.
- the concavo-convex structure is not particularly limited as long as it is a shape that holds and renews slurry. Examples include eccentric circular grooves, radial grooves, and combinations of these grooves. In addition, these uneven structures are generally regular, but the groove pitch, groove width, groove depth, etc. can be changed for each range in order to make the retention and renewability of the slurry desirable. Is also possible.
- the shape of the polishing region 8 is not particularly limited, and may be circular or long.
- the size of the polishing region can be appropriately adjusted according to the polishing apparatus to be used. In the case of a circular shape, the diameter is about 30 to 150 cm, and in the case of a long shape, the length is about 5 to 15 m. The width is about 60 to 250 cm.
- the thickness of the polishing region 8 is not particularly limited, but is usually about 0.8 to 4 mm, preferably 1.2 to 2.5 mm.
- the means for forming the opening A9 in the polishing region 8 is not particularly limited.
- a method of pressing or grinding with a cutting tool, a method using a laser such as a carbonic acid laser, and the shape of the opening A are provided. Examples include a method in which a raw material is poured into a mold and cured.
- the size of the opening A is not particularly limited.
- the planar shape of the opening A9 is not particularly limited, and examples thereof include a circle, an ellipse, a square, a rectangle, and a polygon.
- the cross-sectional shape of the opening A is not particularly limited, but in order to make it easy to temporarily fix the light transmission region in the opening A, the opening A may be formed to be thinner from the polishing surface side toward the polishing back surface side.
- the material for forming the light transmission region 10 is not particularly limited, but a material that enables highly accurate optical end point detection while polishing and has a light transmittance of 20% or more over the entire wavelength range of 400 to 700 nm is used. It is preferable that the material has a light transmittance of 50% or more.
- Such materials include polyurethane resins, polyester resins, phenol resins, urea resins, melamine resins, epoxy resins, and acrylic resins, and other thermosetting resins, polyurethane resins, polyester resins, polyamide resins, cellulose resins, Acrylic resins, polycarbonate resins, halogen resins (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, olefin resins (polyethylene, polypropylene, etc.), thermoplastic resins, butadiene rubber, isoprene rubber, etc. Examples thereof include rubber, photo-curing resin that is cured by light such as ultraviolet rays and electron beams, and photosensitive resin. These resins may be used alone or in combination of two or more.
- the material used for the light transmission region 10 is preferably one having the same or larger grindability than the material used for the polishing region.
- a highly abrasion-resistant polyurethane resin that can suppress light scattering in the light transmission region due to dressing marks during polishing is preferable.
- the production method of the light transmission region 10 is not particularly limited, and can be produced by a known method.
- a polyurethane resin block can be made with a band saw type or canna type slicer to a predetermined thickness, a resin can be poured into a mold with a cavity with a predetermined thickness and cured, and coating or sheet molding techniques can be used. The method that was used is used.
- the size of the light transmission region 10 is not particularly limited, but is preferably the same size as the opening A9 of the polishing region 8.
- the planar shape of the light transmission region is preferably the same shape as the opening A.
- the cross-sectional shape of the light transmission region is preferably the same as that of the opening A, and in order to make it easy to temporarily fix the light transmission region in the opening A, from the polishing surface side toward the polishing back surface side. You may make it the shape which becomes thin.
- the thickness of the light transmission region 10 is not particularly limited, but is preferably the same as or less than the thickness of the polishing region.
- the material to be polished may be damaged by the protruding portion during polishing. Further, the light transmission region is deformed by the stress applied during polishing, and is greatly distorted optically, so that there is a possibility that the optical end point detection accuracy of polishing is lowered.
- the thickness is too thin, the durability may be insufficient, or a large recess may be formed on the upper surface of the light transmission region, and a large amount of slurry may accumulate, resulting in a decrease in optical end point detection accuracy.
- the method for providing the light transmission region 10 in the opening A9 is not particularly limited.
- the light transmission region 10 is fitted in the opening A9, and the surface of the polishing region 8 and the surface of the light transmission region 10 are removably removed.
- Examples thereof include a method of bonding with an adhesive tape, and (2) a method of forming a light transmission region 10 by pouring a light transmission region forming material into the opening A9 and curing it.
- an adhesive member X12 containing a hot melt adhesive is provided on one side of the polishing layer 11.
- the light transmission region 10 is attached to the adhesive member X12.
- Examples of the adhesive member X12 include an adhesive layer containing a hot melt adhesive.
- the thickness of the adhesive layer is preferably 10 to 200 ⁇ m, more preferably 25 to 125 ⁇ m.
- the adhesive member X12 a double-sided tape having the adhesive layer on both sides of the base material may be used.
- the base material can prevent the slurry from penetrating to the support layer side, and can prevent peeling between the support layer and the adhesive layer.
- the substrate examples include polyester films such as polyethylene terephthalate film and polyethylene naphthalate film; polyolefin films such as polyethylene film and polypropylene film; nylon film and the like. Among these, it is preferable to use a polyester film having excellent properties for preventing water permeation.
- the surface of the substrate may be subjected to easy adhesion treatment such as corona treatment or plasma treatment.
- the thickness of the substrate is not particularly limited, but is preferably 10 to 180 ⁇ m from the viewpoint of transparency, flexibility, rigidity, and the like.
- the thickness of the adhesive layer is preferably 10 to 200 ⁇ m, more preferably 25 to 125 ⁇ m.
- a known hot melt adhesive can be used without particular limitation, but a polyester hot melt adhesive is preferably used.
- the polyester-based hot melt adhesive contains at least a polyester resin as a base polymer and an epoxy resin having two or more glycidyl groups in one molecule as a crosslinking component.
- polyester resin known ones obtained by condensation polymerization of an acid component and a polyol component can be used, and it is particularly preferable to use a crystalline polyester resin.
- the acid component examples include aromatic dicarboxylic acids, aliphatic dicarboxylic acids, and alicyclic dicarboxylic acids. These may be used alone or in combination of two or more.
- aromatic dicarboxylic acid examples include terephthalic acid, isophthalic acid, phthalic anhydride, ⁇ -naphthalenedicarboxylic acid, ⁇ -naphthalenedicarboxylic acid, and ester formers thereof.
- aliphatic dicarboxylic acid examples include succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecylenic acid, dodecanedioic acid, and ester formers thereof.
- alicyclic dicarboxylic acid examples include 1,4-cyclohexanedicarboxylic acid, tetrahydrophthalic anhydride, hexahydrophthalic anhydride and the like.
- unsaturated acids such as maleic acid, fumaric acid and dimer acid
- polyvalent carboxylic acids such as trimellitic acid and pyromellitic acid
- polyol component examples include dihydric alcohols such as aliphatic glycols and alicyclic glycols, and polyhydric alcohols. These may be used alone or in combination of two or more.
- aliphatic glycol examples include ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6 -Hexanediol, 1,8-octanediol, 1,9-nonanediol, neopentyl glycol, 3-methylpentanediol, 2,2,3-trimethylpentanediol, diethylene glycol, triethylene glycol, dipropylene glycol, etc. It is done.
- alicyclic glycol examples include 1,4-cyclohexanedimethanol and hydrogenated bisphenol A.
- polyhydric alcohol examples include glycerin, trimethylolethane, trimethylolpropane, and pentaerythritol.
- the crystalline polyester resin can be synthesized by a known method. For example, there are a melt polymerization method in which raw materials and a catalyst are charged and heated at a temperature equal to or higher than the melting point of the product, a solid phase polymerization method in which polymerization is performed at a temperature lower than the melting point of the product, a solution polymerization method using a solvent, and the like. It may be adopted.
- the melting point of the crystalline polyester resin is preferably 100 to 200 ° C.
- the adhesive force of the hot melt adhesive is reduced due to heat generated during polishing, and when it exceeds 200 ° C., the temperature at which the hot melt adhesive is melted increases, The pad is warped and tends to adversely affect the polishing characteristics.
- the number average molecular weight of the crystalline polyester resin is preferably 5000 to 50000.
- the number average molecular weight is less than 5,000, the mechanical properties of the hot melt adhesive deteriorate, so that sufficient adhesion and durability cannot be obtained.
- the number average molecular weight exceeds 50,000, the crystalline polyester resin is synthesized. There is a tendency for production problems such as gelation to occur, and the performance as a hot melt adhesive tends to deteriorate.
- epoxy resin examples include bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, stilbene type epoxy resin, biphenyl type epoxy resin, and bisphenol A novolak type epoxy resin.
- Cresol novolac type epoxy resin diaminodiphenylmethane type epoxy resin, polyphenyl base epoxy resin such as tetrakis (hydroxyphenyl) ethane base, fluorene-containing epoxy resin, triglycidyl isocyanurate, heteroaromatic ring (eg triazine ring etc.)
- Aromatic epoxy resin such as epoxy resin contained; aliphatic glycidyl ether type epoxy resin, aliphatic glycidyl ester type epoxy resin, alicyclic glycine Ether type epoxy resin, aromatic epoxy resins such as alicyclic glycidyl ester type epoxy resins. These may be used alone or in combination of two or more.
- the epoxy resin is preferably added in an amount of 2 to 10 parts by weight, more preferably 3 to 7 parts by weight, based on 100 parts by weight of the polyester resin as the base polymer.
- the polyester hot melt adhesive may contain known additives such as softeners such as olefin resins, tackifiers, fillers, stabilizers, and coupling agents. Moreover, you may contain well-known inorganic fillers, such as a talc.
- the polyester-based hot melt adhesive is prepared by mixing at least the polyester resin, the epoxy resin, and the like by an arbitrary method.
- single-screw extruder meshing same-direction parallel-shaft twin-screw extruder, mesh-type different-direction parallel-shaft twin-screw extruder, mesh-type different-direction oblique-shaft twin-screw extruder, non-meshing-type twin-screw extrusion
- Each raw material is mixed by an extruder, a kneader, etc. Prepare.
- the melting point of the polyester hot melt adhesive is preferably 100 to 200 ° C.
- the specific gravity of the polyester hot melt adhesive is preferably 1.1 to 1.3.
- the melt flow index (MI) of the polyester hot melt adhesive is preferably 16 to 26 g / 10 min under conditions of 150 ° C. and a load of 2.16 kg.
- the polyester hot melt adhesive can be used in any form such as a pellet form, a powder form, a sheet form, a film form, or a solution form dissolved in a solvent.
- the method of providing the adhesive member X12 including the hot melt adhesive on one side of the polishing layer 11 is not particularly limited.
- the adhesive member X12 including the hot melt adhesive is laminated on the polishing layer 11 and hot using a heater. A method in which the melt adhesive is heated or melted or softened, and then the hot melt adhesive is cured. (2) The hot melt adhesive that has been melted by heating is applied onto the polishing layer 11, and then the molten hot melt adhesive is cured. And the like.
- the polishing layer 11 and the adhesive member X12 may be temporarily bonded or may be completely bonded. When temporarily bonded, it is completely bonded in a later step.
- a peelable protective member 13 is provided at a portion corresponding to the light transmission region 10 of the adhesive member X12.
- the peelable protective member 13 is not particularly limited as long as it can cover a portion corresponding to the light transmission region 10 of the adhesive member X12.
- the resin sheet having heat resistance and peelability for example, a fluororesin sheet, a silicone resin sheet). Etc. is preferably used.
- the size of the peelable protective member 13 is not particularly limited, but is preferably the same size as the light transmission region 10 or smaller than the light transmission region 10.
- the thickness of the peelable protective member 13 is preferably 150 ⁇ m or less. When the thickness exceeds 150 ⁇ m, a step (space) is generated at the edge portion of the peelable protection member 13 when the support layer 14 is attached to the adhesive member X12 in a subsequent process, and the adhesive member X12 and the support layer in the portion Adhesiveness with 14 decreases.
- the support layer 14 is attached to the adhesive member X12 provided with the peelable protective member 13.
- the support layer 14 supplements the characteristics of the polishing layer 11.
- a layer having a lower elastic modulus than the polishing layer (cushion layer) may be used, or a layer having a higher elastic modulus than the polishing layer (high elastic layer) may be used.
- the cushion layer is necessary in order to achieve both planarity and uniformity in a trade-off relationship in CMP.
- Planarity refers to the flatness of a pattern portion when a material having fine irregularities generated during pattern formation is polished
- uniformity refers to the uniformity of the entire material to be polished. The planarity is improved by the characteristics of the polishing layer, and the uniformity is improved by the characteristics of the cushion layer.
- the high elastic layer is used for improving the planarization characteristics of the laminated polishing pad when a soft polishing layer is used in CMP to suppress the generation of scratches.
- a highly elastic layer it is possible to suppress excessive cutting of the edge portion of the material to be polished.
- the cushion layer examples include fiber nonwoven fabrics such as polyester nonwoven fabric, nylon nonwoven fabric, and acrylic nonwoven fabric; resin-impregnated nonwoven fabrics such as polyester nonwoven fabric impregnated with polyurethane; polymer resin foams such as polyurethane foam and polyethylene foam; butadiene rubber And rubber resins such as isoprene rubber; and photosensitive resins.
- the highly elastic layer examples include polyester films such as polyethylene terephthalate film and polyethylene naphthalate film; polyolefin films such as polyethylene film and polypropylene film; nylon films and the like.
- the method for attaching the support layer 14 to the adhesive member X12 is not particularly limited.
- the adhesive member X12 and the support layer 14 are laminated, the hot melt adhesive of the adhesive member X12 is heated and melted with a heater, and then melted.
- the method of hardening a hot melt adhesive is mentioned. After the hot melt adhesive is heated and melted, the support layer may be brought into close contact with the melted hot melt adhesive by pressing.
- the polishing layer 11 and the adhesive member X12 are temporarily bonded, the polishing layer 11 and the adhesive member X12 are completely bonded in the process.
- an adhesive member 15 for example, an adhesive layer, a double-sided tape, etc. for attaching the laminated polishing pad to the polishing surface plate may be provided on one side of the support layer 14.
- the portion of the support layer 14 corresponding to the light transmission region 10 is removed, the peelable protective member 13 is further removed, and an opening B16 for transmitting light is formed to produce the laminated polishing pad 1.
- the adhesive member 15 is provided, the part of the adhesive member 15 corresponding to the light transmission region 10 is also removed.
- the method of removing the support layer 14 (and the adhesive member 15) is not particularly limited, and examples thereof include a method of cutting and removing using a blade or the like, a method of removing by laser processing, and the like.
- the support layer 14 (and the adhesive member) When removing 15), the part is not scratched or foreign matter adheres. Therefore, it is possible to effectively prevent a decrease in optical detection accuracy.
- the light transmission region 10 is provided in the opening A9 of the polishing region 8, and the polishing layer 11 is produced.
- polishing layer 11 and the intermediate layer 17 are bonded together using an adhesive member X12 containing a hot melt adhesive.
- the intermediate layer 17 is provided to prevent the slurry from penetrating into the support layer and to prevent peeling between the support layer 14 and the adhesive member Y18.
- Examples of the intermediate layer 17 include polyester films such as a polyethylene terephthalate film and a polyethylene naphthalate film; polyolefin films such as a polyethylene film and a polypropylene film; and a nylon film. Among these, it is preferable to use a polyester film having excellent properties for preventing water permeation.
- the method for bonding the polishing layer 11 and the intermediate layer 17 together using the adhesive member X12 containing a hot melt adhesive is not particularly limited.
- the adhesive member X12 containing a hot melt adhesive is attached to the intermediate layer 17 ( Alternatively, the hot-melt adhesive is laminated on the polishing layer 11), the hot-melt adhesive is heated and melted with a heater, and then the polishing layer 11 (or the intermediate layer 17) is laminated on the molten adhesive, and the molten adhesive is cured.
- a hot-melt adhesive that is heated and melted is applied onto the intermediate layer 17 (or the polishing layer 11), and then the polishing layer 11 (or the intermediate layer 17) is laminated on the molten adhesive and then melted.
- the intermediate layer 17, the adhesive member X12 containing the hot melt adhesive, and the polishing layer 11 are laminated, and the resulting laminate is heated to melt the hot melt adhesive. Then, a method of curing the adhesive melted, and the like. Each member may be laminated and pressed to adhere. From the viewpoint of preventing deformation of the laminated polishing pad due to heat, the method (1) or (2) is preferable.
- the adhesive member Y18 may be a commonly used adhesive layer or double-sided tape, or may be an adhesive member containing the hot melt adhesive.
- a peelable protective member 13 is provided at a portion corresponding to the light transmission region 10 of the adhesive member Y18.
- the support layer 14 is attached to the adhesive member Y18 provided with the peelable protective member 13.
- you may provide the adhesive member 15 for example, an adhesive layer, a double-sided tape, etc.) for affixing a lamination
- the portion of the support layer 14 corresponding to the light transmission region 10 is removed, the peelable protective member 13 is further removed, and an opening B16 for transmitting light is formed to produce the laminated polishing pad 1.
- the adhesive member 15 is provided, the part of the adhesive member 15 corresponding to the light transmission region 10 is also removed.
- the light transmission region 10 is provided in the opening A9 of the polishing region 8, and the polishing layer 11 is produced.
- polishing layer 11 and the intermediate layer 17 are bonded together using an adhesive member X12 containing a hot melt adhesive.
- a peelable protective member 13 is provided in a portion corresponding to the light transmission region 10 of the intermediate layer 17.
- an adhesive member Y18 is provided on the intermediate layer 17 provided with the peelable protective member 13.
- the support layer 14 is attached to the adhesive member Y18. Further, the adhesive member 15 may be provided on one side of the support layer 14.
- the adhesive member Y18 and the support layer 14 corresponding to the light transmission region 10 are removed, the peelable protective member 13 is further removed, and an opening B16 for transmitting light is formed to form the laminated polishing pad 1. Is made.
- the adhesive member 15 is provided, the part of the adhesive member 15 corresponding to the light transmission region 10 is also removed.
- the laminated polishing pad 1 of the present invention is difficult to peel off between the polishing layer 11 and the support layer 14 or the intermediate layer 17 even when the temperature becomes high due to long-time polishing, and has excellent optical detection accuracy. is there.
- the semiconductor device is manufactured through a step of polishing the surface of the semiconductor wafer using the laminated polishing pad.
- a semiconductor wafer is generally a laminate of a wiring metal and an oxide film on a silicon wafer.
- the method and apparatus for polishing the semiconductor wafer are not particularly limited. For example, as shown in FIG. 1, a polishing surface plate 2 that supports the laminated polishing pad 1, a support table (polishing head) 5 that supports the semiconductor wafer 4, and the wafer. This is performed using a backing material for performing uniform pressurization and a polishing apparatus equipped with a polishing agent 3 supply mechanism.
- the laminated polishing pad 1 is attached to the polishing surface plate 2 by attaching it with an adhesive member such as a double-sided tape.
- the polishing surface plate 2 and the support base 5 are disposed so that the laminated polishing pad 1 and the semiconductor wafer 4 supported on each of the polishing surface plate 2 and the support base 5 are opposed to each other, and are provided with rotating shafts 6 and 7 respectively. Further, a pressurizing mechanism for pressing the semiconductor wafer 4 against the laminated polishing pad 1 is provided on the support base 5 side. In polishing, the semiconductor wafer 4 is pressed against the laminated polishing pad 1 while rotating the polishing surface plate 2 and the support base 5, and polishing is performed while supplying slurry.
- the flow rate of the slurry, the polishing load, the polishing platen rotation speed, and the wafer rotation speed are not particularly limited and are appropriately adjusted.
- the protruding portion of the surface of the semiconductor wafer 4 is removed and polished flat. Thereafter, a semiconductor device is manufactured by dicing, bonding, packaging, or the like. The semiconductor device is used for an arithmetic processing device, a memory, and the like.
- melt flow index (MI)
- MI melt flow index
- polishing conditions a slurry obtained by adding 2% by weight of hydrogen peroxide to a diluted solution obtained by diluting W2000 (manufactured by Cabot) with ultrapure water was added at a flow rate of 150 ml / min during polishing.
- the load was 5 psi
- the polishing platen rotation speed was 120 rpm
- the wafer rotation speed was 120 rpm.
- the polishing pad surface was dressed for 20 seconds using a dresser (manufactured by Asahi Diamond Co., Ltd., M100 type).
- the dressing conditions were a dress load of 10 g / cm 2 , a polishing platen rotation speed of 30 rpm, and a dresser rotation speed of 15 rpm.
- Example 1 [Production of light transmission region] 128 parts by weight of a polyester polyol (number average molecular weight 2400) composed of adipic acid, hexanediol and ethylene glycol and 30 parts by weight of 1,4-butanediol were mixed, and the temperature was adjusted to 70 ° C. To this mixed solution, 100 parts by weight of 4,4′-diphenylmethane diisocyanate previously adjusted to 70 ° C. was added and stirred for about 1 minute. Then, the mixed solution was poured into a container kept at 100 ° C. and post-cured at 100 ° C. for 8 hours to produce a polyurethane resin. Using the produced polyurethane resin, a light transmission region (56 mm ⁇ 20 mm, thickness 1.25 mm) was produced by injection molding.
- a polyester polyol number average molecular weight 2400
- Concentric groove processing (groove width: 0.25 mm, groove depth: 0.45 mm, groove pitch: 1.5 mm) on the surface of the buffed sheet using a groove processing machine (manufactured by Toho Koki Co., Ltd.) ) This sheet was punched to a size of 60 cm in diameter, and then an opening A (56 mm ⁇ 20 mm) was formed at a position of about 12 cm from the center of the punched sheet to prepare a polishing region.
- a laminated polishing pad was produced by the method shown in FIG. First, a light transmission region was fitted into the opening A of the polishing region and temporarily fixed to prepare a polishing layer. Next, 100 parts by weight of a crystalline polyester resin (Byron GM420, manufactured by Toyobo Co., Ltd.) between the polishing layer and the peelable PET sheet, and o-cresol having two or more glycidyl groups in one molecule An adhesive layer (thickness 50 ⁇ m) made of a polyester-based hot melt adhesive containing 5 parts by weight of a novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN4400) is laminated, and the adhesive layer is formed using an infrared heater.
- a crystalline polyester resin Byron GM420, manufactured by Toyobo Co., Ltd.
- the polishing layer and the adhesive layer were temporarily bonded by heating to 100 ° C. Then, the peelable PET sheet was peeled off.
- the polyester hot melt adhesive used had a melting point of 142 ° C., a specific gravity of 1.22, and a melt flow index of 21 g / 10 min. Thereafter, a peelable protective member (fluororesin sheet, 55 mm ⁇ 18 mm, thickness: 100 ⁇ m) was attached to the portion corresponding to the light transmission region of the adhesive layer. Then, the adhesive layer is heated to 150 ° C.
- the molten adhesive was cured, and the polishing layer and the support layer were bonded together via the adhesive layer, and the light transmission region was bonded to the adhesive layer and completely fixed. Thereafter, the support layer was cut according to the size of the polishing layer.
- a pressure-sensitive double-sided tape (manufactured by 3M, 442JA) is bonded to the support layer using a laminating machine, the support layer and the pressure-sensitive double-sided tape corresponding to the light transmission region are cut and removed, and further peelable. By removing the protective member, an opening B was formed to produce a laminated polishing pad.
- Example 2 [Production of laminated polishing pad] A laminated polishing pad was produced by the method shown in FIG. First, a polishing layer was produced in the same manner as in Example 1. Next, an o-cresol novolac type epoxy having 100 parts by weight of a crystalline polyester resin (byron GM420, manufactured by Toyobo Co., Ltd.) and two or more glycidyl groups in one molecule on an intermediate layer made of a PET sheet. An adhesive layer (thickness 50 ⁇ m) made of a polyester hot melt adhesive containing 5 parts by weight of resin (Nippon Kayaku Co., Ltd., EOCN4400) is laminated, and the adhesive layer is heated to 150 ° C. using an infrared heater. Heated to melt.
- a crystalline polyester resin byron GM420, manufactured by Toyobo Co., Ltd.
- An adhesive layer (thickness 50 ⁇ m) made of a polyester hot melt adhesive containing 5 parts by weight of resin (Nippon Kayaku
- polishing layer was laminated
- a pressure-sensitive double-sided tape manufactured by 3M, 442JA
- a support layer Nipparei EXT, manufactured by Nihon Hojo Co., Ltd.
- urethane foam was attached to the pressure-sensitive double-sided tape using a laminating machine.
- another pressure-sensitive double-sided tape manufactured by 3M, 442JA was attached to the support layer. Then, the support layer and the pressure-sensitive double-sided tape corresponding to the light transmission region were cut and removed, and further, the peelable protective member was removed to form an opening B to produce a laminated polishing pad.
- Comparative Example 1 [Production of laminated polishing pad] First, a light transmission region was fitted into the opening A of the polishing region and temporarily fixed to prepare a polishing layer. Next, a pressure-sensitive double-sided tape (manufactured by Sekisui Chemical Co., Ltd., double tack tape) was bonded to the polishing layer. Then, a peelable protective member (fluorine resin sheet, 55 mm ⁇ 18 mm, thickness: 100 ⁇ m) is attached to the portion corresponding to the light transmission region of the pressure-sensitive double-sided tape, and further, the pressure-sensitive double-sided tape is applied to the pressure-sensitive double-sided tape using a laminator.
- a pressure-sensitive double-sided tape manufactured by Sekisui Chemical Co., Ltd., double tack tape
- a support layer made of urethane foam (Nippalei EXT, manufactured by Nippon Kijo Co., Ltd.) was attached. Thereafter, the support layer was cut according to the size of the polishing layer. Then, a pressure sensitive double-sided tape (made by 3M, 442JA) is bonded to the support layer using a laminating machine, and the portion of the support layer corresponding to the light transmission region and the pressure sensitive double-sided tape (442JA) are cut and removed. Further, by removing the peelable protective member, an opening B was formed to produce a laminated polishing pad.
- urethane foam Nippalei EXT, manufactured by Nippon Kijo Co., Ltd.
- the laminated polishing pad of the present invention is used for flattening optical materials such as lenses and reflecting mirrors, silicon wafers, glass substrates for hard disks, aluminum substrates, and materials requiring high surface flatness such as general metal polishing processing. Processing can be performed stably and with high polishing efficiency.
- the laminated polishing pad of the present invention is a process for planarizing a silicon wafer and a device on which an oxide layer, a metal layer, etc. are formed, before further laminating and forming these oxide layers and metal layers. It can be used suitably.
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Abstract
Description
(融点の測定)
ポリエステル系ホットメルト接着剤の融点は、TOLEDO DSC822(METTLER社製)を用い、昇温速度20℃/minにて測定した。
JIS Z8807-1976に準拠して行った。ポリエステル系ホットメルト接着剤からなる接着剤層を4cm×8.5cmの短冊状(厚み:任意)に切り出したものを比重測定用試料とし、温度23℃±2℃、湿度50%±5%の環境で16時間静置した。測定には比重計(ザルトリウス社製)を用い、比重を測定した。
ASTM-D-1238に準じて150℃、2.16kgの条件で、ポリエステル系ホットメルト接着剤のメルトフローインデックスを測定した。
作製した積層研磨パッドから25mm×25mmのサンプルを3枚切り取り、各サンプルの研磨層と支持層を引張り速度300mm/minで引張り、この時のせん断応力(N/25mm□)を測定した。サンプル3枚の平均値を表1に示す。また、その時のサンプルの剥離状態を確認した。また、作製した積層研磨パッドを用いて下記条件で60時間研磨した後に、上記と同様の方法でせん断応力の測定を行い、剥離状態を確認した。
研磨装置としてSPP600S(岡本工作機械社製)を用い、作製した積層研磨パッドを用いて、8インチのシリコンウエハ上にタングステン膜を10000Å製膜したウエハを1枚につき60秒研磨し、ウエハを交換しつつ60時間研磨を行った。その後、積層研磨パッドの層間の接着状態、光透過領域の裏面側の状態を目視により観察した。
なお、研磨条件としては、W2000(キャボット社製)を超純水で2倍に希釈した希釈液に過酸化水素水を2重量%添加したスラリーを研磨中に流量150ml/minで添加し、研磨荷重5psi、研磨定盤回転数120rpm、及びウエハ回転数120rpmとした。また、研磨前に、ドレッサー(旭ダイヤ社製、M100タイプ)を用いて研磨パッド表面を20秒間ドレス処理した。ドレス条件は、ドレス荷重10g/cm2、研磨定盤回転数30rpm、及びドレッサー回転数15rpmとした。
〔光透過領域の作製〕
アジピン酸とヘキサンジオールとエチレングリコールからなるポリエステルポリオール(数平均分子量2400)128重量部、及び1,4-ブタンジオール30重量部を混合し、70℃に温調した。この混合液に、予め70℃に温調した4,4’-ジフェニルメタンジイソシアネート100重量部を加え、約1分間撹拌した。そして、100℃に保温した容器中に該混合液を流し込み、100℃で8時間ポストキュアを行ってポリウレタン樹脂を作製した。作製したポリウレタン樹脂を用い、インジェクション成型にて光透過領域(56mm×20mm、厚さ1.25mm)を作製した。
反応容器内に、ポリエーテル系プレポリマー(ユニロイヤル社製、アジプレンL-325、NCO濃度:2.22meq/g)100重量部、及びシリコン系界面活性剤(東レダウコーニングシリコーン社製、SH-192)3重量部を混合し、温度を80℃に調整した。撹拌翼を用いて、回転数900rpmで反応系内に気泡を取り込むように約4分間激しく撹拌を行った。そこへ予め120℃で溶融した4,4’-メチレンビス(o-クロロアニリン)(イハラケミカル社製、イハラキュアミンMT)26重量部を添加した。その後、約1分間撹拌を続けてパン型のオープンモールドへ反応溶液を流し込んだ。この反応溶液の流動性がなくなった時点でオーブン内に入れ、110℃で6時間ポストキュアを行い、ポリウレタン発泡体ブロックを得た。このポリウレタン発泡体ブロックをバンドソータイプのスライサー(フェッケン社製)を用いてスライスし、ポリウレタン発泡体シート(比重:0.86、D硬度:52度)を得た。次にこのシートをバフ機(アミテック社製)を使用して、所定の厚さに表面バフをし、厚み精度を整えたシートとした(シート厚み:1.27mm)。このバフ処理をしたシートの表面に、溝加工機(東邦鋼機社製)を用いて同心円状の溝加工(溝幅:0.25mm、溝深さ:0.45mm、溝ピッチ:1.5mm)を行った。このシートを直径60cmの大きさに打ち抜き、次に、打ち抜いたシートの中心から約12cmの位置に開口部A(56mm×20mm)を形成して研磨領域を作製した。
図2に示す方法で積層研磨パッドを作製した。まず、研磨領域の開口部A内に光透過領域を嵌め込んで仮固定して研磨層を作製した。次に、研磨層と剥離性PETシートとの間に、結晶性ポリエステル樹脂(東洋紡績(株)社製、バイロンGM420)100重量部、及び1分子中にグリシジル基を2つ以上有するo-クレゾールノボラック型エポキシ樹脂(日本化薬(株)社製、EOCN4400)5重量部を含むポリエステル系ホットメルト接着剤からなる接着剤層(厚み50μm)を積層し、赤外ヒーターを用いて接着剤層を100℃に加熱して研磨層と接着剤層とを仮接着した。そして、剥離性PETシートを剥離した。なお、使用したポリエステル系ホットメルト接着剤の融点は142℃、比重は1.22、メルトフローインデックスは21g/10minであった。
その後、接着剤層の光透過領域に対応する部分に剥離性保護部材(フッ素樹脂シート、55mm×18mm、厚さ:100μm)を貼り付けた。その後、赤外ヒーターを用いて接着剤層を150℃に加熱してポリエステル系ホットメルト接着剤を溶融させ、溶融した接着剤上にラミネート機を用いて発泡ウレタンからなる支持層(日本発条社製、ニッパレイEXT)を積層し、研磨層、溶融した接着剤、及び支持層を圧着した。その後、溶融した接着剤を硬化させて、研磨層と支持層とを接着剤層を介して貼り合せると共に、光透過領域を接着剤層に貼り付けて完全に固定した。その後、研磨層の大きさに合わせて支持層を裁断した。
そして、前記支持層にラミネート機を使用して感圧式両面テープ(3M社製、442JA)を貼り合わせ、光透過領域に対応する部分の支持層及び感圧式両面テープを切断除去し、さらに剥離性保護部材を除去することにより開口部Bを形成して積層研磨パッドを作製した。
〔積層研磨パッドの作製〕
図3に示す方法で積層研磨パッドを作製した。まず、実施例1と同様の方法で研磨層を作製した。次に、PETシートからなる中間層上に、結晶性ポリエステル樹脂(東洋紡績(株)社製、バイロンGM420)100重量部、及び1分子中にグリシジル基を2つ以上有するo-クレゾールノボラック型エポキシ樹脂(日本化薬(株)社製、EOCN4400)5重量部を含むポリエステル系ホットメルト接着剤からなる接着剤層(厚み50μm)を積層し、赤外ヒーターを用いて接着剤層を150℃に加熱して溶融させた。そして、溶融した接着剤上にラミネート機を用いて前記研磨層を積層して圧着した。その後、溶融した接着剤を硬化させて、研磨層と中間層とを接着剤層を介して貼り合せると共に、光透過領域を接着剤層に貼り付けて完全に固定した。その後、研磨層の大きさに合わせて中間層を裁断した。
その後、前記中間層に、ラミネート機を使用して感圧式両面テープ(3M社製、442JA)を貼り付け、当該感圧式両面テープの光透過領域に対応する部分に剥離性保護部材(フッ素樹脂シート、55mm×18mm、厚さ:100μm)を貼り付けた。
その後、前記感圧式両面テープに、ラミネート機を用いて発泡ウレタンからなる支持層(日本発条社製、ニッパレイEXT)を貼り付けた。その後、前記支持層に別の感圧式両面テープ(3M社製、442JA)を貼り付けた。
そして、光透過領域に対応する部分の支持層及び感圧式両面テープを切断除去し、さらに剥離性保護部材を除去することにより開口部Bを形成して積層研磨パッドを作製した。
〔積層研磨パッドの作製〕
まず、研磨領域の開口部A内に光透過領域を嵌め込んで仮固定して研磨層を作製した。次に、研磨層に感圧式両面テープ(積水化学工業社製、ダブルタックテープ)を貼り合わせた。その後、前記感圧式両面テープの光透過領域に対応する部分に剥離性保護部材(フッ素樹脂シート、55mm×18mm、厚さ:100μm)を貼り付け、さらにラミネート機を用いて前記感圧式両面テープに発泡ウレタンからなる支持層(日本発条社製、ニッパレイEXT)を貼り付けた。その後、研磨層の大きさに合わせて支持層を裁断した。
そして、前記支持層にラミネート機を使用して感圧式両面テープ(3M社製、442JA)を貼り合わせ、光透過領域に対応する部分の支持層及び感圧式両面テープ(442JA)を切断除去し、さらに剥離性保護部材を除去することにより開口部Bを形成して積層研磨パッドを作製した。
2:研磨定盤
3:研磨剤(スラリー)
4:被研磨材(半導体ウエハ)
5:支持台(ポリシングヘッド)
6、7:回転軸
8:研磨領域
9:開口部A
10:光透過領域
11:研磨層
12:接着部材X
13:剥離性保護部材
14:支持層
15:粘着部材
16:開口部B
17:中間層
18:接着部材Y
Claims (8)
- 研磨領域の開口部A内に光透過領域を設けて研磨層を作製する工程、前記研磨層の片面にホットメルト接着剤を含む接着部材Xを設ける工程、前記接着部材Xの光透過領域に対応する部分に剥離性保護部材を設ける工程、剥離性保護部材を設けた前記接着部材Xに支持層を貼り付ける工程、及び光透過領域に対応する部分の支持層を除去し、さらに剥離性保護部材を除去して開口部Bを形成する工程を含む積層研磨パッドの製造方法。
- 研磨領域の開口部A内に光透過領域を設けて研磨層を作製する工程、前記研磨層と中間層とを、ホットメルト接着剤を含む接着部材Xを用いて貼り合せる工程、前記中間層に接着部材Yを設ける工程、前記接着部材Yの光透過領域に対応する部分に剥離性保護部材を設ける工程、剥離性保護部材を設けた前記接着部材Yに支持層を貼り付ける工程、及び光透過領域に対応する部分の支持層を除去し、さらに剥離性保護部材を除去して開口部Bを形成する工程を含む積層研磨パッドの製造方法。
- 研磨領域の開口部A内に光透過領域を設けて研磨層を作製する工程、前記研磨層と中間層とを、ホットメルト接着剤を含む接着部材Xを用いて貼り合せる工程、前記中間層の光透過領域に対応する部分に剥離性保護部材を設ける工程、剥離性保護部材を設けた前記中間層に接着部材Yを設ける工程、前記接着部材Yに支持層を貼り付ける工程、及び光透過領域に対応する部分の接着部材Y及び支持層を除去し、さらに剥離性保護部材を除去して開口部Bを形成する工程を含む積層研磨パッドの製造方法。
- 前記中間層が樹脂フィルムである請求項2又は3記載の積層研磨パッドの製造方法。
- 前記接着部材Xは、ポリエステル系ホットメルト接着剤を含む接着剤層、又は基材の両面に前記接着剤層を有する両面テープであり、前記ポリエステル系ホットメルト接着剤は、ベースポリマーであるポリエステル樹脂100重量部に対して、1分子中にグリシジル基を2つ以上有するエポキシ樹脂を2~10重量部含有する請求項1~4のいずれかに記載の積層研磨パッドの製造方法。
- 前記ポリエステル樹脂は、結晶性ポリエステル樹脂である請求項5記載の積層研磨パッドの製造方法。
- 請求項1~6のいずれかに記載の製造方法によって得られる積層研磨パッド。
- 請求項7記載の積層研磨パッドを用いて半導体ウエハの表面を研磨する工程を含む半導体デバイスの製造方法。
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US14/390,959 US9636796B2 (en) | 2012-04-11 | 2013-02-28 | Laminated polishing pad and method for producing same |
KR1020147018250A KR101633766B1 (ko) | 2012-04-11 | 2013-02-28 | 적층 연마 패드 및 그 제조 방법 |
CN201380011801.1A CN104160485A (zh) | 2012-04-11 | 2013-02-28 | 层叠研磨垫及其制造方法 |
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US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
KR101904322B1 (ko) | 2017-01-23 | 2018-10-04 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
KR101889081B1 (ko) | 2017-03-16 | 2018-08-16 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
US10293456B2 (en) * | 2017-04-19 | 2019-05-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them |
US10207388B2 (en) * | 2017-04-19 | 2019-02-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them |
TWI647065B (zh) * | 2017-08-07 | 2019-01-11 | 智勝科技股份有限公司 | 研磨墊及其製造方法以及研磨方法 |
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- 2012-04-11 JP JP2012090241A patent/JP5389973B2/ja not_active Expired - Fee Related
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2013
- 2013-02-28 WO PCT/JP2013/055516 patent/WO2013153875A1/ja active Application Filing
- 2013-02-28 US US14/390,959 patent/US9636796B2/en not_active Expired - Fee Related
- 2013-02-28 CN CN201380011801.1A patent/CN104160485A/zh active Pending
- 2013-02-28 KR KR1020147018250A patent/KR101633766B1/ko active IP Right Grant
- 2013-02-28 SG SG11201406374UA patent/SG11201406374UA/en unknown
- 2013-03-11 TW TW102108465A patent/TWI474894B/zh not_active IP Right Cessation
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US9636796B2 (en) | 2017-05-02 |
SG11201406374UA (en) | 2014-11-27 |
KR20140097546A (ko) | 2014-08-06 |
TW201347906A (zh) | 2013-12-01 |
KR101633766B1 (ko) | 2016-06-27 |
JP2013219276A (ja) | 2013-10-24 |
TWI474894B (zh) | 2015-03-01 |
US20150079879A1 (en) | 2015-03-19 |
JP5389973B2 (ja) | 2014-01-15 |
CN104160485A (zh) | 2014-11-19 |
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