WO2013111752A1 - 電子部品収納用パッケージおよび電子装置 - Google Patents
電子部品収納用パッケージおよび電子装置 Download PDFInfo
- Publication number
- WO2013111752A1 WO2013111752A1 PCT/JP2013/051201 JP2013051201W WO2013111752A1 WO 2013111752 A1 WO2013111752 A1 WO 2013111752A1 JP 2013051201 W JP2013051201 W JP 2013051201W WO 2013111752 A1 WO2013111752 A1 WO 2013111752A1
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- WO
- WIPO (PCT)
- Prior art keywords
- housing
- electronic component
- screw
- hole
- screwing
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Definitions
- the present invention relates to an electronic component storage package and an electronic device.
- a package described in Patent Document 1 is known as an electronic component storage package for storing electronic components (hereinafter also simply referred to as a package).
- the package described in Patent Document 1 includes screwing portions for attaching a substrate to an external substrate at four corners.
- a step is formed between the portion of the base body where the frame is joined and the screwing portion so that the upper surface on the screwing portion side becomes lower.
- the screwing portion formed at the tip of the step is thin.
- the present invention has been made in view of the above problems, and an object thereof is to provide a package having excellent heat dissipation.
- An electronic component storage package includes a housing in which an electronic component is mounted in a recess having an opening on an upper surface, and a screwing portion that is fixed to a side surface of the housing and extends toward the side. And. And this screwing part is provided on the side of the casing provided between the thin part provided on the tip side and having a through hole for attaching a screw, and the thin part and the side of the casing. It is characterized by having a thick part that is thinner than the thickness in the vertical direction and thicker than the thickness in the vertical direction of the thin part, and a screw fastening hole provided in this thick part in the vertical direction. .
- An electronic device includes the electronic component storage package, the electronic component mounted in the concave portion of the electronic component storage package, and a lid body that is bonded to the upper surface of the housing with the opening being closed. It is characterized by comprising.
- the screwing portion is smaller than the thickness in the vertical direction on the side surface of the casing and the thin portion having the through hole, and the thickness in the vertical direction of the thin portion.
- FIG. 1 is a perspective view showing an electronic component storage package and an electronic apparatus using the same according to an embodiment of the present invention. It is a disassembled perspective view which shows the electronic component storage package and electronic device which were shown in FIG.
- FIG. 6 is another exploded perspective view showing the electronic component storage package and the electronic device shown in FIG. 1.
- FIG. 2 is a cross-sectional view taken along the line X-X ′ in the electronic component storage package and the electronic device illustrated in FIG. 1.
- FIG. 2 is a bottom view of the electronic component storage package and the electronic device shown in FIG. 1.
- FIG. 7 is a cross-sectional view taken along the line X-X ′ in the electronic component storage package and the electronic device illustrated in FIG. 6. It is sectional drawing which concerns on the other embodiment example in the A section shown in FIG.
- FIG. 1 is a perspective view showing an electronic component storage package 10 according to an embodiment of the present invention.
- an electronic component storage package 10 according to an embodiment of the present invention includes a housing 1 having an opening on an upper surface, and a screwing portion 31 extending from the housing 1 toward the side. ing. One end of the screwing portion 31 is fixed to the side surface of the housing 1.
- An input / output terminal 2 is fixed to the housing 1.
- the input / output terminal 2 is a part of the housing 1.
- the frame body 4 may be joined around the opening on the upper surface of the housing 1.
- the screwing portion 31 includes a thin-walled portion 34 having a through-hole 36 for attaching a screw, and a thick-walled portion 35 that is thicker than the thin-walled portion 34 and thinner than the vertical thickness of the side surface of the housing 1. have.
- the thick portion 35 has a screw fastening hole 37 in the vertical direction.
- the housing 1 is a member for hermetically sealing the electronic component 5 together with the frame body 4 and the lid body 6.
- the housing 1 has an opening of a recess 1a on the upper surface.
- An electronic component 5 is mounted in the recess 1a.
- the casing 1 has a quadrangular outer periphery when viewed in plan.
- a plurality of cutout portions 13 cut out from the upper side are provided on the side surface of the housing 1.
- the notch 13 is provided on each of three sides of the four sides when viewed in plan.
- the notch 13a provided on one side of the center between the other two sides of the notches 13 (13a, 13b, 13c) on the three sides is notched so as to open on the side surface and the lower surface. Yes.
- the notches 13b and 13c provided on the remaining two sides are notched so as to open to the side surfaces.
- the input / output terminal 2 is attached to each of the plurality of notches 13.
- the input / output terminal 2 is fitted into the notch 13.
- the input / output terminal 2 is joined and fixed to the housing 1.
- Lead terminals 24 extending to the outside are provided on the lower surfaces of the respective input / output terminals 2. If the cutout 13 is cut out so as to open to the side surface and the lower surface as described above, a part of the lead terminal 24 is positioned inside the outer periphery of the housing 1 as shown in FIG. Can be made. Thereby, the package 10 can be reduced in size.
- the signal transmitted through the input / output terminal 2 is a high-frequency signal, it is required to shorten the transmission distance in order to minimize signal loss.
- the lead terminal 24 is a member for electrical connection with an external device, if the length of the lead terminal 24 itself in the signal transmission direction is shortened, it is convenient for mounting the package 10 on the external substrate. May be reduced. For this reason, it is desirable to shorten the signal transmission distance while securing the length of the lead terminal 24. Therefore, it is preferable that a part of the lead terminal 24 is positioned inside the outer periphery of the housing 1. Thereby, the transmission distance of the signal can be shortened while ensuring the length of the lead terminal 24.
- the input / output terminal 2 (2a) for high-frequency signal transmission is provided in the notch 13 (13a) that opens to the side surface and the lower surface.
- input / output terminals 2 (2b, 2c) for low-frequency electric signals for power supply and the like are provided in the two cutouts 13 (13b, 13c) opened in the side surfaces.
- the housing 1 is one on which the electronic component 5 is mounted, high insulation is required.
- an insulating mounting substrate 12 is installed on a metal member 11. Since the metal member 11 has a high heat dissipation property, it is possible to improve the heat dissipation property from the electronic component 5 while improving the insulation property with the electronic component 5 by adopting the above configuration.
- the electronic component 5 is mounted on the upper surface of the mounting substrate 12.
- the material of the metal member 11 specifically, a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten can be used. Alternatively, an alloy or composite material made of these metals can be used. By applying a metal processing method such as a rolling method or a punching method to such an ingot of a metal material, the metal member 11 constituting the casing 1 can be manufactured.
- the housing 1 and the screwing portion 31 are integrally formed.
- a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body is used. be able to. Further, a glass ceramic material may be used instead of these ceramic materials.
- the input / output terminal 2 is a member for electrically connecting the inside and outside of the housing 1.
- the input / output terminal 2 is fitted on the notch 13 while being partly installed on the bottom surface of the housing 1. When viewed in plan, a part of the input / output terminal 2 protrudes from the side surface of the housing 1.
- the input / output terminal 2 includes a wall portion 25, a signal line, and a lead terminal 24.
- the wall portion 25 is a rectangular parallelepiped member made of an insulating material, and a step portion is formed on the upper surface of a portion located inside the housing 1.
- the signal line is formed from the surface of the step portion of the wall portion 25 to the lower surface of the portion located outside the housing 1.
- the lead terminal 24 is provided on the lower surface of the wall portion 25 and located on the outside of the housing 1.
- the lead terminal 24 is electrically connected to the signal line.
- the signal line exposed on the surface of the step portion of the input / output terminal 2 and the electronic component 5 are electrically connected. This connection can be made, for example, via a bonding wire. With the above configuration, electrical signals can be transmitted between the electronic component 5 and the outside of the package 10.
- a dielectric member with good insulation is preferably used.
- an aluminum oxide sintered body having a relative dielectric constant of about 9.4 a mullite sintered body having a relative dielectric constant of about 7.5, a silicon carbide sintered body having a relative dielectric constant of about 40,
- a ceramic material such as an aluminum nitride sintered body having a relative dielectric constant of approximately 8.5 and a silicon nitride sintered body having a relative dielectric constant of approximately 9.6, or a glass ceramic material is used for the wall portion 25. It is done.
- the wall portion 25 is made of a dielectric having a relative dielectric constant of about 4 to 50 as described above.
- the frame 4 is provided so as to continuously cover the upper part of the input / output terminal 2 and the upper part of the housing 1.
- the frame body 4 is a frame-shaped member, and the shape of the inner periphery and the outer periphery when viewed in plan is a quadrangular shape.
- the frame 4 is provided along the opening.
- the frame body 4 is joined to the input / output terminal 2 and the metal portion 11.
- a material of the frame 4 for example, a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten can be used. Alternatively, an alloy or composite material made of these metals can be used.
- the lid 6 can be easily joined.
- the screwing portion 31 is a member for fixing the housing 1 to the external substrate.
- the screwing portion 31 extends from the housing 1 toward the side.
- the screwing portions 31 are provided at two corners sandwiching one side of the housing 1 where the input / output terminal 2 (2a) for high-frequency signal transmission is provided.
- the screwing portion 31 is a plate-like member and has a thin portion 34 and a thick portion 35.
- the thin portion 34 has a through hole 36 for attaching a screw.
- the through hole 36 is open to the upper surface and the lower surface of the thin portion 34.
- the thickness of the thin portion 34 may be set to 0.5 to 2 mm, and the thickness of the thick portion 35 may be set to 2.5 to 8 mm.
- the thickness of the side surface of the housing 1 is 3 to 10 mm, which is thicker than the thick portion 35.
- the diameter of the through hole 36 is preferably set to 1 to 5 mm.
- a hole 37 having a diameter of 0.5 to 5 mm for screw fastening is formed in the thick part 35.
- the screwing portion 31 has a thin portion 34 having a through-hole 36, and a thick portion that is smaller than the vertical thickness of the side surface of the housing 1 and larger than the vertical thickness of the thin portion 34.
- 35 and the screw fastening hole 37 provided in the vertical direction of the thick portion 35 correct the warpage of the housing 1 and improve the heat dissipation to the external substrate.
- the through hole 36 of the package 10 is attached to the external substrate using screws. At this time, while the thin portion 34 is slightly deformed, the warp of the housing 1 is corrected so as to be entirely along the external substrate, and the housing 1 is fastened to the external substrate.
- the warp of the housing 1 is further corrected at the base of the screwing portion 31, and the housing 1 is fastened to the external substrate.
- the screwing portion 31 is fixed to the external substrate so as to be parallel to the external substrate. Since the warp of the housing 1 is corrected and the contact area with the external substrate is increased, the heat dissipation from the housing 1 to the external substrate is improved. Furthermore, since the screwing part 31 is also fixed in close contact with the external board as a whole, heat dissipation from the screwing part 31 to the external board is also improved.
- the thick portion 35 is formed to be smaller than the thickness in the vertical direction on the side surface of the housing 1, there is a step between the upper surface of the casing 1 above the thick portion 35 and the upper surface of the thick portion 35. Parts are provided. Therefore, when the frame body 4 is joined to the upper surface of the side surface of the housing 1 via a joining material such as a brazing material, the brazing material does not flow to the upper surface of the thick portion 35, and the frame body 4 has the thick portion 35. It is difficult to move toward the top surface. As a result, the frame body 4 is placed at a desired position on the upper surface of the housing 1 and joined.
- a joining material such as a brazing material
- the screw fastening hole 37 may be a hole 37 penetrating in the vertical direction of the thick portion 35.
- a screw may be inserted into the hole 37 from the upper opening of the thick portion 35 and the screw may be fixed to the external substrate.
- the hole 37 is opened at least on the lower surface of the thick portion 35.
- the hole 37 is a screw hole 37 having a thread groove cut on the inner peripheral surface. Therefore, the operation
- the thick portion 35 is integrally formed with the side surface of the housing 1 and the screwing portion 31, the thick portion 35 is fastened when a screw is fastened to the hole 37 of the thick portion 35.
- the force is transmitted directly to the housing 1. Therefore, the correction effect of the housing 1 can be increased.
- a screw fixing member 131 may be attached to the screwing portion 31.
- the screw fixing member 131 is provided with a through hole H between the thin portion 34 of the screwing portion 31 and the side surface of the housing 1, and the screw fixing member 131 is fitted into the through hole H, and a joining material such as a brazing material is used. It is joined.
- a screw hole 37 is provided in the screw fixing member 131.
- the screw fixing member 131 is provided with a hooking portion 131 a that protrudes outward from the screw fixing member 131 so that the lower end edge contacts the lower surface of the screw fixing portion 31. Accordingly, the screw fixing member 131 can be prevented from coming out of the through hole H or moving when being joined to the screwing portion 31 via a joining material such as a brazing material.
- a screw groove for attaching the screw from below to above is cut in the inner surface of the screw fixing member 131.
- the screw fixing member 131 can be fixed to the external substrate S using screws from below to above.
- the hook 131 a is provided so as to protrude, for example, 0.1 to 1 mm in the planar direction along the lower surface of the screwing portion 31.
- the hook portion 131a has a vertical thickness set to, for example, 0.5 to 3 mm.
- a groove for fitting the hook 131a is provided on the lower surface of the screwing portion 31.
- the hook 131a is fitted and fixed so as to be embedded in the groove.
- the hook part 131a is partially embedded in the lower surface of the screwing part 31, so that the screw fixing member 131 can be prevented from moving in the plane direction and the vertical direction. It is possible to prevent the screw fixing member 131 from being displaced with respect to the screwing portion 31.
- the outer periphery of the hooking portion 131a and the inner periphery of the groove of the screwing portion 31 are preferably formed in such a size that a gap G is formed between them.
- the presence of the gap G makes it possible to suppress interference of the force generated between the side surface of the screw fixing member 131 and the inner surface of the groove portion of the screwing portion 31. As a result of reducing the stress generated at the contact portion between the through hole H and the side surface of the screw fixing member 131, when fixing the screw fixing member 131 to the screw fixing portion 31, It is possible to prevent separation between the two. In addition, since the gap G is provided between the screw fixing member 131 over the entire periphery of the lower portion of the through hole H, it is possible to prevent separation between the screw fixing member 131 and the screwing portion 31. .
- the screw fixing member 131 can be made of a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten. Alternatively, an alloy or composite material made of these metals can be used.
- the screw fixing member 131 can be manufactured by subjecting such a metal material ingot or wire to a metal working method such as cutting, forging, or forging.
- auxiliary screwing portions 32 are provided at two corners other than the two corners where the screwing portions 31 are provided. Unlike the screwing portion 31, the auxiliary screwing portion 32 does not have a portion corresponding to the thick portion 35. Specifically, the auxiliary screwing portion 32 is a plate-like member having a through hole 36 for attaching a screw, and the length in the direction extending from the side surface of the housing 1 is the side surface of the housing 1 in the screwing portion 31. It is shorter than the length in the direction extending from.
- the electronic device 100 includes an electronic component storage package 10, an electronic component 5 mounted inside the package 10, and a lid body 6 that is joined to the upper surface of the frame body 4 by closing an opening.
- the electronic component 5 is mounted on the upper surface of the mounting substrate 12.
- a component such as an optical semiconductor element, an IC (Integrated Circuit) element, and a capacitor can be used.
- the optical semiconductor element include a light emitting element that emits light typified by an LD (Laser-Diode) element or a light receiving element that receives light typified by a PD (Photodiode) element.
- the electronic component 5 is electrically connected to the wiring conductor of the input / output terminal 2 via a bonding wire.
- the electronic component 5 is electrically connected to an external wiring conductor via the bonding wire, the wiring conductor, the lead terminal 24, and the like.
- the lid 6 is joined to the upper surface of the frame 4.
- the lid body 6 is joined to the upper surface of the frame body 4 so as to close the opening of the recess 1a.
- the electronic component 5 is hermetically sealed.
- deterioration of the electronic component 5 caused by the use of the electronic device 100 for a long time can be suppressed.
- a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten can be used.
- an alloy or composite material made of these metals can be used.
- the frame body 4 and the lid body 6 are directly joined.
- the frame 4 is a metal frame having a shape that overlaps the lid 6 when viewed in plan, and is also called a so-called seal ring.
- the electronic device 100 Since the electronic device 100 according to the present embodiment has improved heat dissipation to the external substrate, the electronic component 5 can be protected and function well even when the high-power electronic component 5 is accommodated. .
- the casing 1 is configured by the metal member 11 and the mounting substrate 12
- the present invention is not limited thereto.
- it may be composed only of an insulating member.
- the insulating member for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body is used. it can. Moreover, you may be comprised only with the metal.
- the screwing portion 31 and the auxiliary screwing portion 32 are used as the configuration for screwing, but the present invention is not limited to this. Specifically, only the screwing portions 31 may be used at all four corners. Further, the screwing portion 31 may be used only at one of the four corners, and the auxiliary screwing portions 32 may be used at the other three corners.
- the screwing portion 31 and the auxiliary screwing portion 32 are provided at four locations, but the present invention is not limited to this. Specifically, it may be 1 place, 2 places, 3 places, or 5 places or more. Moreover, the screwing part 31 does not necessarily need to be provided in a corner
- the shape of the casing 1 when viewed in plan is a square shape, but is not limited thereto.
- the shape of the housing 1 may be a polygonal shape or a circular shape.
- the screwing part 31 and the housing 1 were integrally formed was shown, it is not restricted to this. Specifically, the housing 1 and the plurality of screwing portions 31 may be separately formed and joined.
- Housing 11 Metal member 12: Mounting substrate 13 (13a, 13b, 13c): Notch 2 (2a, 2b, 2c): Input / output terminal 24: Lead terminal 25: Wall 31: Screwing portion 32 : Sub screw part 34: Thin part 35: Thick part 36: Through hole 37: Hole 4: Frame 5: Electronic component 6: Lid 10: Electronic component storage package (package) 100: Electronic device
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
図1は本発明の一実施形態の電子部品収納用パッケージ10を示す斜視図である。図1~5に示すように、本発明の一実施形態の電子部品収納用パッケージ10は、上面に開口を有する筺体1と、筺体1から側方に向かって伸びたねじ止め部31とを備えている。ねじ止め部31の一端は筐体1の側面に固定されている。筐体1には入出力端子2が固定されている。この入出力端子2は筐体1の一部となっている。また、筐体1の上面の開口の周囲には枠体4が接合される場合がある。
電子装置100は、電子部品収納用パッケージ10と、パッケージ10の内部に実装された電子部品5と、枠体4の上面に開口を塞いで接合された蓋体6とを備えている。
11:金属部材
12:載置基板
13(13a、13b、13c):切欠き部
2(2a、2b、2c):入出力端子
24:リード端子
25:壁部
31:ねじ止め部
32:副ねじ止め部
34:薄肉部
35:厚肉部
36:貫通孔
37:穴
4:枠体
5:電子部品
6:蓋体
10:電子部品収納用パッケージ(パッケージ)
100:電子装置
Claims (5)
- 上面に開口を有した凹部に電子部品が実装される筐体と、
該筐体の側面に固定されて側方に向かって伸びたねじ止め部とを備え、
該ねじ止め部は、先端側に設けられた、ねじを取り付けるための貫通孔を有する薄肉部と、該薄肉部と前記筐体の側面との間に設けられた、該筐体の側面における上下方向の厚みよりも薄く、前記薄肉部の上下方向の厚みよりも厚い厚肉部と、該厚肉部に上下方向に設けられたねじ締結用の穴とを有していることを特徴とする電子部品収納用パッケージ。 - 前記厚肉部は、前記筐体の側面および前記ねじ止め部と一体に形成されていることを特徴とする請求項1に記載の電子部品収納用パッケージ。
- ねじ締結用の前記穴は、前記厚肉部の下面に開口していることを特徴とする請求項1または2に記載の電子部品収納用パッケージ。
- ねじ締結用の前記穴は、ねじ溝が切られたねじ穴であることを特徴とする請求項1乃至3のいずれか1つに記載の電子部品収納用パッケージ。
- 請求項1乃至4のいずれか1つに記載の電子部品収納用パッケージと、
該電子部品収納用パッケージの前記凹部に実装された電子部品と、
前記筺体の上面に前記開口を塞いで接合された蓋体とを備えた電子装置。
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JP2013555274A JP5841174B2 (ja) | 2012-01-24 | 2013-01-22 | 電子部品収納用パッケージおよび電子装置 |
CN201380006392.6A CN104067385B (zh) | 2012-01-24 | 2013-01-22 | 电子部件收纳用封装体以及电子装置 |
US14/374,310 US9351422B2 (en) | 2012-01-24 | 2013-01-22 | Package for housing electronic component and electronic device |
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JP2012-032692 | 2012-02-17 | ||
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PCT/JP2013/051201 WO2013111752A1 (ja) | 2012-01-24 | 2013-01-22 | 電子部品収納用パッケージおよび電子装置 |
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US (1) | US9351422B2 (ja) |
JP (1) | JP5841174B2 (ja) |
CN (1) | CN104067385B (ja) |
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Cited By (4)
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JP2016051755A (ja) * | 2014-08-29 | 2016-04-11 | 日亜化学工業株式会社 | 半導体発光装置用の保持部材及び光源装置 |
TWI557857B (zh) * | 2015-01-22 | 2016-11-11 | 台達電子工業股份有限公司 | 功率模組之封裝結構 |
US20170069556A1 (en) * | 2014-03-13 | 2017-03-09 | Kyocera Corporation | Electronic component housing package and electronic device |
JP2019009174A (ja) * | 2017-06-21 | 2019-01-17 | 日亜化学工業株式会社 | 発光モジュール |
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JP2001264590A (ja) * | 2000-03-17 | 2001-09-26 | Anritsu Corp | 光モジュール用パッケージ |
JP2002368322A (ja) * | 2001-06-06 | 2002-12-20 | Kyocera Corp | 光半導体素子収納用パッケージおよび光半導体装置 |
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JP2007012718A (ja) * | 2005-06-28 | 2007-01-18 | Kyocera Corp | 電子部品収納用パッケージおよび電子装置 |
JP5621217B2 (ja) * | 2009-06-11 | 2014-11-12 | シンフォニアテクノロジー株式会社 | 電子モジュールの製造方法及び電子モジュール並びに車両 |
DE102010002945A1 (de) * | 2010-03-17 | 2011-09-22 | Robert Bosch Gmbh | Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug |
JP5697669B2 (ja) * | 2010-07-30 | 2015-04-08 | 京セラ株式会社 | 電子部品収納用部品、電子モジュールおよび電子装置 |
JP5228076B2 (ja) * | 2010-09-03 | 2013-07-03 | 日立ビークルエナジー株式会社 | 車載用蓄電装置 |
JP5017473B1 (ja) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | テレビジョン受像機および電子機器 |
EP2795711A4 (en) * | 2011-12-20 | 2015-10-28 | Nokia Technologies Oy | APPARATUS FOR STORING ELECTRICAL POWER AND PORTABLE ELECTRONIC DEVICE |
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- 2013-01-22 WO PCT/JP2013/051201 patent/WO2013111752A1/ja active Application Filing
- 2013-01-22 CN CN201380006392.6A patent/CN104067385B/zh not_active Expired - Fee Related
- 2013-01-22 JP JP2013555274A patent/JP5841174B2/ja active Active
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JP2001264590A (ja) * | 2000-03-17 | 2001-09-26 | Anritsu Corp | 光モジュール用パッケージ |
JP2002368322A (ja) * | 2001-06-06 | 2002-12-20 | Kyocera Corp | 光半導体素子収納用パッケージおよび光半導体装置 |
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US20170069556A1 (en) * | 2014-03-13 | 2017-03-09 | Kyocera Corporation | Electronic component housing package and electronic device |
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JP2016051755A (ja) * | 2014-08-29 | 2016-04-11 | 日亜化学工業株式会社 | 半導体発光装置用の保持部材及び光源装置 |
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JP2019009174A (ja) * | 2017-06-21 | 2019-01-17 | 日亜化学工業株式会社 | 発光モジュール |
JP7025624B2 (ja) | 2017-06-21 | 2022-02-25 | 日亜化学工業株式会社 | 発光モジュール |
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JPWO2013111752A1 (ja) | 2015-05-11 |
CN104067385A (zh) | 2014-09-24 |
CN104067385B (zh) | 2017-02-22 |
US20140368998A1 (en) | 2014-12-18 |
JP5841174B2 (ja) | 2016-01-13 |
US9351422B2 (en) | 2016-05-24 |
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