WO2013104167A1 - 一种用于打印机的芯片及包含该芯片的墨盒 - Google Patents

一种用于打印机的芯片及包含该芯片的墨盒 Download PDF

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Publication number
WO2013104167A1
WO2013104167A1 PCT/CN2012/075920 CN2012075920W WO2013104167A1 WO 2013104167 A1 WO2013104167 A1 WO 2013104167A1 CN 2012075920 W CN2012075920 W CN 2012075920W WO 2013104167 A1 WO2013104167 A1 WO 2013104167A1
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WO
WIPO (PCT)
Prior art keywords
contact
printer
chip
high voltage
voltage contact
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Application number
PCT/CN2012/075920
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English (en)
French (fr)
Inventor
贾志铮
钦雷
Original Assignee
珠海纳思达企业管理有限公司
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Application filed by 珠海纳思达企业管理有限公司 filed Critical 珠海纳思达企业管理有限公司
Priority to DE212012000242.1U priority Critical patent/DE212012000242U1/de
Publication of WO2013104167A1 publication Critical patent/WO2013104167A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts

Definitions

  • the utility model relates to a chip for a printer and an ink cartridge comprising the same.
  • the ink cartridge and the ink containing portion are detachably mounted in the printing apparatus.
  • Various devices are mounted in the ink cartridge and the ink containing portion.
  • a storage device that stores information related to ink is known.
  • a high voltage circuit that outputs a response signal based on application of a voltage higher than a power supply voltage of a device such as a memory device (for example, a piezoelectric element used as an ink remaining amount sensor, or an analog circuit that simulates ink amount information) is also known.
  • a device is electrically connected to the control unit (external) of the printing device.
  • the device and the control unit are sometimes electrically connected via contacts.
  • FIG. 1 is a schematic structural view of a chip for a printer, including a circuit board 100, device circuits, and sheet-type contact points 110-190, wherein the sheet-type contact points 11CT190 are arranged in a row on one side of the circuit board 100, and the control circuit Set on the opposite side.
  • 2 is a schematic view showing the structure of a contact mechanism fixed inside the printer.
  • the plurality of conductive elastic members 203 and 204 are alternately clamped on the contact mechanism by different depths of the grooves 201 and 202, and each elastic member is provided with A contact portion, and the contact portion 21CT290 corresponds to the sheet-type contact point 11CT190 on the chip for the printer.
  • the sheet-type contact points 11CT190 on the chip for the printer are electrically connected to the contact portions 21CT290 on the respective contact mechanisms, i.e., the chip for the printer is electrically connected to the printer.
  • the contact portion of the contact mechanism shown in Fig. 2 has a folding resistance, and the contact portion is pressed during the installation and removal of the ink cartridge. As the number of times the ink cartridge is installed and removed increases, the number of times the contact portion is squeezed increases, causing the contact portion to lose its elasticity when the life of the printer is not terminated, thereby causing an increase in the number of electrical connections between the chip and the printer for the printer. Reduce connection stability.
  • CN201080002628. 5 device circuit and control department Electrically connected to the printer via contacts. The device circuit is electrically connected to the control unit to control the information of the ink cartridge to communicate with the printer.
  • the contact point with the printer is often on the same circuit board as the contact of the control unit due to space limitation and manufacturing cost, and the distance is very close.
  • the excitation voltage of the piezoelectric sensor circuit is much higher than the excitation voltage of the control portion, and even when the two are shorted, the high voltage can burn the device circuit and the controller.
  • the arrangement of the contacts on the existing circuit board is such that the high voltage circuit (piezoelectric sensor circuit) side contacts are located at the outermost side of the electron group, and the contacts of the low voltage circuit (device circuit and controller circuit) are located inside the electron group , to complete the point communication between the ink cartridge and the printer.
  • the specific structure of the above contact arrangement is such that a plurality of contacts of the low voltage circuit are arranged in a plurality of rows with a plurality of contacts of the high voltage circuit, and the contact portions of the contacts form a plurality of lines. Two contact portions of the high voltage contact are disposed on a first line of the plurality of lines, and a contact portion of the low voltage contact is evenly disposed at two contact portions of the high voltage contact on the first line between.
  • the arrangement of the above-mentioned contacts has the following defects.
  • SUMMARY OF THE INVENTION The present invention provides a chip for a printer to solve the technical problem that a chip for a printer is easily short-circuited when the ink is wetted by the low-voltage contact and the high-voltage contact.
  • a chip for a printer comprising: a circuit board, a control circuit disposed on a side of the circuit board, at least one high voltage contact connected to the high voltage circuit in the printer and at least a low voltage contact connected to a low voltage circuit in the printer, wherein the printer is provided with an elastic member having a smoothing portion and a contact portion, the elastic member being electrically connectable to the high voltage contact and the low voltage contact, wherein The at least one high voltage contact mates with a smoothing zone position of the resilient member in the printer, the at least one low voltage contact matching a contact location of the resilient member in the printer.
  • the high pressure contact mates with a smoothing zone position of the resilient member in the printer, the low pressure contact matching the position of the contact of the resilient member in the printer.
  • the plurality of low voltage contacts have a plurality of low voltage contacts forming a low voltage contact group; the plurality of high voltage contacts having a plurality of high voltage contacts forming a high voltage contact group.
  • the low voltage contact group is at a lower portion of the circuit board, and the high voltage contact group is in a region away from the low voltage contact.
  • the high voltage contact is a curved arched conductive wire.
  • the high voltage contact has at least one contact location electrically connected to a smooth region of the resilient member of the contact mechanism secured in the printer. One end of the high voltage contact is fixed to the circuit board.
  • the other end of the high voltage contact is fixed to the circuit board.
  • the other end of the high voltage contact is suspended. Both ends of the high voltage contact are movably in contact with contacts on the circuit board.
  • a gap is formed in the circuit board, and the contact position is electrically connected through the slit to a smooth region of the elastic member of the contact mechanism fixed in the printer.
  • the smoothing area positions match.
  • the low pressure contact is a sheet type contact point.
  • the utility model also provides an ink cartridge, comprising a cartridge body and a chip, wherein the chip is any one of the above chips.
  • DRAWINGS 1 is a schematic structural view of a conventional imaging cartridge chip
  • FIG. 2 is a schematic structural view of a conventional contact mechanism
  • FIG. 3 is a schematic structural diagram of a chip according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of connection between a chip and a contact mechanism according to an embodiment of the present invention.
  • FIG. 5(A) is a schematic structural view of a high and low voltage contact surface of a chip according to an embodiment of the present invention
  • FIG. 5(B) is a schematic perspective structural view of a chip according to an embodiment of the present invention.
  • FIG. 6 is another schematic structural diagram of a chip according to an embodiment of the present invention.
  • FIG. 7 is another schematic structural diagram of a chip according to an embodiment of the present invention.
  • FIG. 8 is another schematic structural diagram of a chip according to an embodiment of the present invention. detailed description
  • the piezoelectric sensor circuit for detecting the ink level of the ink cartridge is considered to be on the same circuit board as the contact of the control unit due to space limitation and manufacturing cost, and is spaced apart from each other. Very close. Moreover, the excitation voltage of the piezoelectric sensor circuit is much higher than the excitation voltage of the control unit, and even when the two are short-circuited, the high voltage can burn the device circuit and the controller. In turn, the electrical connection between the chip and the printer is broken, and the connection stability is lowered.
  • a chip for a printer comprising: a circuit board, a control circuit disposed on a side of the circuit board, a high voltage contact connecting the high voltage circuit in the printer, and a low voltage contact connecting the low voltage circuit in the printer
  • the printer is provided with an elastic member with a smoothing zone and a contact portion, one of the high voltage contact and the low voltage contact is matched with the smoothing position of the elastic member in the printer, and the other is in contact with the elastic member in the printer.
  • the positions are matched, the high voltage contacts match the smoothing position of the elastic members in the printer, the low voltage contacts match the position of the contacts of the elastic members in the printer, and the low voltage contacts have multiple, multiple low voltage contacts
  • a low voltage contact group is formed; a plurality of high voltage contacts are formed, and a plurality of high voltage contacts form a high voltage contact group, the low voltage contact group is at a lower portion of the circuit board, and the high voltage contact group is at a region away from the low voltage contact.
  • FIG. 3 is a schematic structural diagram of a chip according to an embodiment of the present invention, including: a circuit board 300 and a control circuit 301 disposed on a side of the circuit board 300.
  • the circuit board 300 is further provided with at least one high voltage contact 302.
  • the high voltage contact 302 is a conductive metal wire, and the high voltage contact 302 is electrically connected to the smoothing region of the elastic member of the contact mechanism fixed in the printer, as shown in FIG. Show.
  • the high voltage contact 302 of Fig. 4 is electrically connected to the smoothing region of the elastic member of the contact mechanism fixed in the printer, and each of the elastic members 203 and 204 in the contact mechanism is connected to the electrode 51CT590 of the printer through the respective contact portion, thereby realizing imaging.
  • the contacts 250 and 290 are connected to a printer circuit for applying a high voltage to the chip.
  • Other contacts (210-240, 260-280) are low voltage terminals
  • the high voltage contact 302 also has at least one contact location 303 as shown in FIG.
  • the contact position 303 is electrically connected to the smoothing zone (203) of the resilient member of the contact (250 or 290) of the contact mechanism fixed in the printer.
  • the high voltage terminal 302 may be fixed to the circuit board 300 at both ends, or may be fixed at one end to the circuit board 300, and the other end may be movably inserted into the through hole of the circuit board or may be suspended. See Figure 3, Figure 6, Figure 7, and Figure 8.
  • the low voltage terminal group 304 is electrically connected to the contacts (210-240, 260-280) of the contact mechanism of the printer.
  • the high voltage contact 302 of the chip provided in Figure 6 is fixed on the circuit board 300 at both ends.
  • the two ends of the high voltage contact 302 in Fig. 6 are fixed to the side of the circuit board 300 opposite to the control circuit 301 by soldering.
  • the circuit board 300 may be provided with a recess 305, and both ends of the high voltage contact 302 may be fixed in the recess of the circuit board 300 by soldering.
  • the high voltage contact 302-terminal of the chip provided in Figures 3, 7 and 8 is fixed to the circuit board 300, and the other end is movably inserted into the through hole provided in the circuit board 300.
  • the high voltage contact 302-end of FIG. 3 is fixed to the side of the circuit board 300 opposite to the control circuit 301 by soldering, and the other end is movably inserted into the through hole provided in the circuit board 300.
  • the high voltage contact 302-end of Figure 3 can also pass through the circuit board 300.
  • the circuit board 300 of Fig. 7 is provided with a slit 303.
  • the high voltage contact 302 is fixed in the recess 305 of the circuit board 300 by soldering, and the other end is movably passed through the slit 306 in the circuit board 300.
  • the other end of the high voltage terminal 302 can also be suspended, which is not limited thereto.
  • FIG. 5(A) shows a schematic diagram of the high and low voltage contact surface structure of the chip.
  • the high voltage contact 302 is disposed on the upper portion of the circuit board 300
  • low The pressure contact group 304 is disposed at a lower portion of the circuit board 300 remote from the high voltage contact 302.
  • the high voltage contact is a conductive metal pin (wire) that protrudes from the plane of the circuit board 300
  • the low voltage contact 304 is a sheet type contact point on the plane of the circuit board 300.
  • the low voltage contact 304 of the chip shown in Fig. 5(B) is located on one plane of the circuit board 300, and the contact position 303 of the high voltage contact 302 protrudes from the above plane.
  • the control circuit 301 is located on the opposite side of the above plane.
  • One end of the high voltage contact 302 is located on the same side as the control circuit 301.
  • one end of the high voltage contact 302 can also be located in the same plane as the low voltage terminal 304, as needed for design.
  • the position at which the end of the high voltage contact 302 that is in contact with the circuit is located away from the low voltage terminal 304. There is no restriction on this.
  • the high voltage contact 302 may also be formed by soldering one or more metal blocks on the circuit board 300 by cutting the metal blocks.
  • the contact position 303 may be a circular surface contact position, a triangular contact position, or a movable end of the high voltage terminal 302.
  • the contact bit 303 is a circular surface contact.
  • the contact bit 303 can be located at the middle of the high voltage contact 302 or at the top of the high voltage contact 302.
  • the contact bits 303 on the different high voltage contacts 302 may be arranged in a line parallel or oblique to the bottom edge of the circuit board 300.
  • the contact locations 303 may be alternately arranged in a plurality of rows depending on the application scenario.
  • the shape, position and arrangement of the contact position 303 are not limited in the embodiment of the present invention.
  • the high voltage contact 302 is a curved arch type conductive metal needle.
  • the high voltage contact 302 can also be a linear conductive metal pin, as shown in FIG.
  • the high voltage contact 302 can also be other shapes without limitation.
  • At least one low voltage contact 304 electrically connected to the contact portion of the contact mechanism is disposed on the circuit board 300.
  • the contact portions of the low voltage contact 304 may be arranged in a line parallel or oblique to the bottom edge of the circuit board 300, as shown in Fig. 5(A), or staggered in a plurality of rows, which is not limited thereto.
  • the high voltage contact provided on the chip is electrically connected to the smoothing region of the elastic member of the contact mechanism fixed in the printer.
  • the high-voltage contacts of each chip are squeezed during the installation and removal of the ink cartridge, and are electrically connected to the smooth region of the elastic member of the printer contact mechanism, which reduces the amplitude of the movement of the contact portion of the contact mechanism with respect to the contact mechanism. Installed failure rate, which in turn improves connection stability.
  • the high voltage contact and the low voltage contact are respectively set to be electrically The upper and lower parts of the road are far apart. This reduces the likelihood of a short circuit.
  • the embodiment of the present invention further provides an ink cartridge, comprising an ink cartridge body and a chip fixed on the cartridge body.
  • the chip comprises a circuit board, a control circuit disposed on a side of the circuit board, and at least one of the circuit board is fixed in the printer.
  • the smoothing zone of the elastic member of the contact mechanism is electrically connected to the high voltage contact. Please refer to Figure 3 to Figure 8 above for a schematic diagram of the structure of the chip. At least one low voltage contact electrically connected to the contact portion of the contact mechanism may also be provided on the circuit board 300 of the chip provided in Figures 3-8.
  • the stability of the electrical connection between the imaging cartridge and the printer can be improved, and the maintenance difficulty is reduced.

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  • Ink Jet (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)

Abstract

公开了一种用于打印机的芯片。该芯片包括：电路板（300），设置在电路板（300）侧面的控制电路（301），连接打印机中高电压电路的高电压触点（302）和连接打印机中低电压电路的低电压触点（304）。打印机中设置有带平滑区和接触部的弹性件（203），高电压触点（302）和低电压触点（304）中一个与打印机中的弹性件（203）的平滑区位置相匹配，另一个与打印机中的弹性件（203）的接触部位置相匹配。由于弹性件（203）的平滑区与接触部位置相距较远，单个墨滴不能导致两者短路，解决了现有技术中用于打印机芯片的低电压触点与高电压触点的距离很近，因而在沾到墨水时容易短路的技术问题。

Description

说明书 一种用于打印机的芯片及包含该芯片的墨盒 技术领域
本实用新型涉及一种用于打印机的芯片及包含该芯片的墨盒。
背景技术
在现有的 Epson等系列型号的印刷装置中，墨盒和墨水容纳部可装卸地被安 装在印刷装置中。在墨盒和墨水容纳部中安装各种器件。作为器件， 例如公知有 存储与墨水有关的信息的存储装置。另外， 也公知有基于比存储装置这样的器件 的电源电压高的电压的施加来输出响应信号的高电压电路（例如， 用作墨水余量 传感器的压电元件， 或模拟墨水量信息的模拟电路）。 这样的器件与印刷装置的 控制部（外部） 电连接。 例如， 器件和控制部有时经由触点电连接。 而上述的电 路， 触点以及存储装置所形成的部件通常称作芯片。 图 1公开了一种用于打印机的芯片的结构示意图， 包括电路板 100、 器件电 路和薄片型接触点 110~190， 其中薄片型接触点 11CT190分行排列设置在电路板 100的一侧， 控制电路设置在相对的另一侧。 图 2公开了一种固定在打印机内部 的接触机构的结构示意图， 多个导电的弹性件 203和 204通过深浅不同的凹槽 201和 202交错夹持在接触机构上， 每个弹性件上设置有一个接触部， 且接触部 21CT290与用于打印机的芯片上的薄片型接触点 11CT190—一对应。 当墨盒安装 到打印机中时，用于打印机的芯片上的薄片型接触点 11CT190分别与各自对应的 接触机构上的接触部 21CT290 电连接， 即用于打印机的芯片与打印机实现电连 接。
图 2所示的接触机构的接触部具有耐折度， 墨盒安装和拆除过程中， 接触部 被挤压。 随着墨盒安装和拆除的次数增加， 接触部被挤压次数增加， 致使接触部 在打印机寿命未终止时， 失去弹性， 进而造成用于打印机的芯片和打印机之间的 电连接出现故障次数增加， 降低连接稳定性。 另外， 在其同一类似技术的专利 CN201080002628. 5中的器件电路和控制部 经由触点与打印机电连接。器件电路与控制部电连接以便控制墨盒的信息与打印 机通讯。而在检测墨盒墨水余量的压电传感器电路由于空间限制及制造的成本考 虑， 其与打印机的接点触点往往与控制部的触点位于同一个电路板上， 并且相距 很近。而且压电传感器电路的激励电压远远高于控制部的激励电压， 甚至当两者 短接后， 高压可将器件电路和控制器烧毁。现有电路板上的触点的排布是高电压 电路（压电传感器电路）侧触点位于电子群的最外侧， 而低压电路（器件电路及 控制器电路） 的触点位于电子群的内侧， 以此完成墨盒与打印机的点通讯。
上述触点排列的具体结构是：低压电路的多个触点与高压电路的多个触点排 成多列， 其触点的接触部形成多条线。高压触点的两个接触部被配置在所述多条 线中的第一线上，低压触点的接触部被均匀配置在所述第一线上的所述高压触点 的两个接触部之间。
而上述的触点的排布存在以下的几方面的缺陷，第一， 低压触点与高压触点 的距离很近， 当墨盒装机并拆下时， 往往墨盒的墨水会沾到电路板上， 再次装机 时极易将高压电路与低压电路短路。造成低压元器件的损坏。第二， 当墨盒发生 偏移时， 往往致使触点接触不良及误接触的情况发生， 造成墨盒装机不识别。 实用新型内容 本实用新型提供一种用于打印机的芯片，以解决现有用于打印机的芯片因低 压触点与高压触点的距离很近在沾到墨水时而容易短路的技术问题。 为了解决以上技术问题， 本实用新型采取的技术方案是： 一种用于打印机的芯片， 包括： 电路板， 设置在电路板侧面的控制电路， 至少一个连接打印机中高电压电路的高压触点和至少一个连接打印机中低电压 电路的低压触点，所述打印机中设置有带平滑区和接触部的弹性件， 所述弹性件 可与所述高压触点和低压触点电连接，其特征是， 所述至少一个的高电压触点与 所述打印机中的弹性件的平滑区位置相匹配，所述至少一个的低电压触点与所述 打印机中的弹性件的接触部位置相匹配。 所述高压触点与所述打印机中的弹性件的平滑区位置相匹配， 所述低压触 点与所述打印机中的弹性件的接触部位置相匹配。 所述低压触点有多个， 所述多个低压触点形成低压触点群； 所述高压触点 有多个， 所述多个高压触点形成高压触点群。 所述低压触点群在所述电路板的下部， 所述高压触点群在远离所述低压触 点的区域。 所述高压触点为弯曲拱型导电金属丝。 所述高压触点上具有至少一个与固定在打印机中的接触机构的弹性件的平 滑区电连接的接触位。 所述高压触点的一端固定在电路板上。 所述高压触点的另一端固定在电路板上。 所述高压触点的另一端悬空。 所述高压触点的两端可活动地与电路板上的触点接触。 所述电路板上开有缝隙， 所述接触位穿过所述缝隙与固定在打印机中的接 触机构的弹性件的平滑区电连接。 所述低压触点有多个， 所述多个低压触点中有部分低压触点与所述打印机 中的弹性件的接触部位置相匹配，另一部分低压触点与所述打印机中的弹性件的 平滑区位置相匹配。 所述低压触点为薄片型接触点。 本实用新型还提供一种墨盒， 包括墨盒盒体和芯片， 其特征是， 所述芯片 为上述的任一芯片。 在采用了上述技术方案后， 由于高电压触点和低电压触点中一个与打印机 中的弹性件的平滑区位置相匹配，另一个与打印机中的弹性件的接触部位置相匹 配。 而弹性的平滑区与接触部位置相距较远， 单个的墨滴不能导致两者短路， 解 决了现有用于打印机的芯片因低压触点与高压触点的距离很近在沾到墨水时而 容易短路的技术问题。
附图说明 图 1为现有成像盒芯片的结构示意图；
图 2为现有接触机构的结构示意图；
图 3为本实用新型实施例提供的芯片的一种结构示意图；
图 4为本实用新型实施例提供的芯片与接触机构的连接示意图；
图 5 (A)为本实用新型实施例提供的芯片的高低压触点面结构示意图;
图 5 (B)为本实用新型实施例提供的芯片的立体结构示意图；
图 6为本实用新型实施例提供的芯片的另一种结构示意图；
图 7为本实用新型实施例提供的芯片的另一种结构示意图；
图 8为本实用新型实施例提供的芯片的另一种结构示意图。 具体实施方式
发明人经过长时间实践发现，检测墨盒墨水余量的压电传感器电路由于空间 限制及制造的成本考虑，其与打印机的接点触点往往与控制部的触点位于同一个 电路板上， 并且相距很近。而且压电传感器电路的激励电压远远高于控制部的激 励电压， 甚至当两者短接后， 高压可将器件电路和控制器烧毁。进而造成芯片与 打印机之间的电连接出现故障， 降低连接稳定性。
为了解决上述问题， 提供一种用于打印机的芯片， 包括： 电路板， 设置在 电路板侧面的控制电路，连接打印机中高电压电路的高电压触点和连接打印机中 低电压电路的低电压触点， 打印机中设置有带平滑区和接触部的弹性件， 高电压 触点和低电压触点中一个与打印机中的弹性件的平滑区位置相匹配，另一个与打 印机中的弹性件的接触部位置相匹配，高电压触点与打印机中的弹性件的平滑区 位置相匹配，低电压触点与打印机中的弹性件的接触部位置相匹配， 低压触点有 多个， 多个低压触点形成低压触点群； 高压触点有多个， 多个高压触点形成高压 触点群， 低压触点群在电路板的下部， 高压触点群在远离低压触点的区域。
下面结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进 行清楚、 完整地描述， 显然， 所描述的实施例仅仅是本实用新型一部分实施例， 而不是全部的实施例。基于本实用新型中的实施例， 本领域普通技术人员在没有 做出创造性劳动前提下所获得的所有其他实施例， 都属于本实用新型的保护范 围。 图 3为本实用新型实施例提供的芯片的一种结构示意图，包括： 电路板 300、 控制电路 301设置在电路板 300侧面。电路板 300上还设置有至少一个高压触点 302， 高压触点 302是一根导电金属丝， 高压触点 302与固定在打印机中的接触 机构的弹性件的平滑区电连接， 如图 4所示。
图 4中高压触点 302与固定在打印机中的接触机构的弹性件的平滑区电连接， 接触机构中每个弹性件 203和 204通过各自的接触部与打印机的电极 51CT590 连接，进而实现了成像盒芯片与打印机的电连接。而如图 2所示的打印机的接触 机构中，触点 250和 290所连接的是为芯片施加高电压的打印机电路。其他触点 ( 210-240, 260-280) 为低压端子
上述高压触点 302上还具有至少一个接触位 303， 如图 3所示。 接触位 303 与固定在打印机中的接触机构的触点 （250或 290) 的弹性件的平滑区 （203 ) 电 连接。 高压端子 302可以两端固定在电路板 300上， 也可以一端固定在电路板 300上， 另一端可活动地插入电路板的通孔中或者悬空。 具体参见图 3、 图 6、 图 7、 图 8。
另外， 低压端子群 304与打印机的接触机构的触点 ( 210-240， 260-280) 电 连接。
图 6提供的芯片中高压触点 302两端固定在电路板 300上。 其中： 图 6中高 压触点 302两端通过焊接方式固定在电路板 300与设置有控制电路 301相对的侧 面上。 另外， 也可将电路板 300上设置凹槽 305， 高压触点 302两端通过焊接方 式固定在电路板 300的凹槽中。
图 3、 图 7和图 8提供的芯片中高压触点 302—端固定在电路板 300， 另一端 可活动地插入电路板 300上设置的通孔中。其中： 图 3中高压触点 302—端通过 焊接方式固定在电路板 300与设置有控制电路 301相对的侧面上，另一端可活动 地插入电路板 300上设置的通孔中。当然， 图 3中高压触点 302—端还可以穿过 电路板 300。 图 7中电路板 300上设置有缝隙 303， 高压触点 302—端通过焊接 方式固定在电路板 300的凹槽 305中，另一端可活动地穿过电路板 300上设置缝 隙 306中。 当然， 高压端子 302的另一端还可以悬空设置， 对此不加以限制。
为了使本领域技术人员更加直接地理解本实用新型， 图 5 (A) 所示的是芯 片的高低压触点面结构示意图。其中高压触点 302布置在电路板 300的上部， 低 压触点群 304布置在远离高压触点 302的电路板 300的下部。其中高压触点是突 出于电路板 300平面的导电金属针 （丝）， 低压触点 304是位于电路板 300平面 上的薄片型接触点。
如图 5 (B)所示的芯片的低压触点 304位于电路板 300的一个平面， 高压 触点 302的接触位 303突出于上述平面。控制电路 301位于上述平面相对的一个 面。 上述高压触点 302的一端位于与控制电路 301所在的同一个面上。 当然， 处 于设计的需要， 高压触点 302的一端也可位于与低压端子 304所在的同一平面。 对高压触点 302与电路相接的一端的设置位置处于远离低压端子 304的地方。对 此不加以限制。
上述高压触点 302还可以是在电路板 300上焊接一个或者多个金属块，通过 切割金属块的方式形成。接触位 303可以圆弧面型接触位， 也可以为三角型接触 位，还可以是高压端子 302可活动的一端。为了便于芯片的安装及电连接的稳定 性，接触位 303为圆弧面型接触位。接触位 303可以位于高压触点 302的中间部 位， 也可以位于高压触点 302的顶部。不同高压触点 302上的接触位 303可以排 列成一条与电路板 300底边平行或者斜交的直线， 也可以根据应用场景需要， 接 触位 303交错地排列成多行。本实用新型实施例对上述接触位 303的形状， 位置 以及排列不加以限制。
上述图 3至图 8中， 高压触点 302为弯曲拱型导电金属针。 当然， 高压触点 302还可以为直线型导电金属针，如图 8所示。高压触点 302还可以是其他形状， 对此不加以限制。
本实用新型实施例提供的芯片中， 在电路板 300上设置有至少一个与接触机 构的接触部电连接的低压触点 304。低压触点 304的接触部可以排列成一条与电 路板 300底边平行或者斜交的直线， 如图 5 (A) 所示， 或者交错排列成多行， 对此不加以限制。
应用上述技术方案， 通过设置在芯片上的高压触点与固定在打印机中的接 触机构的弹性件的平滑区电连接。低压触电与打印机的接触机构的触点区。每个 芯片的高压触点在墨盒安装和拆除过程中被挤压，且与打印机接触机构的弹性件 的平滑区电连接， 其在墨盒摇摆中相对于接触机构的接触部的活动幅度降低， 降 低装机故障率， 进而提高连接稳定性。 同时， 高压触点与低压触点分别设置成电 路板的上部和下部， 相离较远。 进而降低了短路的可能性。
本实用新型实施例还提供一种墨盒，包括墨盒本体和固定在墨盒盒本体上的 芯片， 芯片包括电路板， 设置在电路板侧面的控制电路， 电路板上设置有至少一 个与固定在打印机中的接触机构的弹性件的平滑区电连接的高压触点。芯片的结 构示意图请参阅上述图 3至图 8， 对此不再加以阐述。 在图 3至图 8提供的芯片 的电路板 300上还可以设置有至少一个与接触机构的接触部电连接的低压触点。
当然，在上述实施例中当低压触点有多个时， 也可以只有多个低压触点中的 部分低压触点与打印机中的弹性件的接触部位置相匹配，而另一部分低压触点与 打印机中的弹性件的平滑区位置相匹配。
应用本实用新型实施例提供的墨盒，可以提高成像盒与打印机电连接的稳定 性， 降低维护难度。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本实 用新型。 对这些实施例的多种修改对本领域的专业技术人员来说是显而易见的， 本文中所定义的一般原理可以在不脱离本实用新型的精神或范围的情况下，在其 它实施例中实现。 因此， 本实用新型将不会被限制于本文所示的这些实施例， 而 是要符合与本文所公开的原理和新颖特点相一致的最宽范围。

Claims

权利要求书
1、一种用于打印机的芯片， 包括： 电路板， 设置在电路板侧面的控制电路， 至少一个连接打印机中高电压电路的高压触点和至少一个连接打印机中低电压 电路的低压触点，所述打印机中设置有带平滑区和接触部的弹性件， 所述弹性件 可与所述高压触点和低压触点电连接，其特征是， 所述至少一个的高电压触点与 所述打印机中的弹性件的平滑区位置相匹配，所述至少一个的低电压触点与所述 打印机中的弹性件的接触部位置相匹配。
2、 如权利要求 1所述的芯片， 其特征是， 所述高压触点与所述打印机中的 弹性件的平滑区位置相匹配，所述低压触点与所述打印机中的弹性件的接触部位 置相匹配。
3、 如权利要求 2所述的芯片， 其特征是， 所述低压触点有多个， 所述多个 低压触点形成低压触点群； 所述高压触点有多个， 所述多个高压触点形成高压触 点群。
4、 如权利要求 3所述的芯片， 其特征是， 所述低压触点群在所述电路板的 下部， 所述高压触点群在远离所述低压触点的区域。
5、 如权利要求 2所述的芯片， 其特征是， 所述高压触点为弯曲拱型导电金 属丝。
6、 如权利要求 5所述的芯片， 其特征是， 所述高压触点上具有至少一个与 固定在打印机中的接触机构的弹性件的平滑区电连接的接触位。
7、 如权利要求 5所述的芯片， 其特征是， 所述高压触点的一端固定在电路 板上。
8、 如权利要求 5所述的芯片， 其特征是， 所述高压触点的另一端固定在电 路板上。
9、 如权利要求 6所述的芯片， 其特征是， 所述高压触点的另一端悬空。
10、 如权利要求 5所述的芯片， 其特征是， 所述高压触点的两端可活动地 与电路板上的触点接触。
11、 如权利要求 5所述的芯片， 其特征是， 所述电路板上开有缝隙， 所述 接触位穿过所述缝隙与固定在打印机中的接触机构的弹性件的平滑区电连接。
12、 如权利要求 1 所述的芯片， 其特征是， 所述低压触点有多个， 所述多 个低压触点中有部分低压触点与所述打印机中的弹性件的接触部位置相匹配，另 一部分低压触点与所述打印机中的弹性件的平滑区位置相匹配。
13、 如权利要求 1-12所述的任一芯片， 其特征是， 所述低压触点为薄片型 接触点。
14、一种墨盒，包括墨盒盒体和芯片，其特征是，所述芯片为权利要求 1-13 所述的任一芯片。
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