WO2013077218A1 - 光半導体封止材用樹脂組成物 - Google Patents
光半導体封止材用樹脂組成物 Download PDFInfo
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- WO2013077218A1 WO2013077218A1 PCT/JP2012/079317 JP2012079317W WO2013077218A1 WO 2013077218 A1 WO2013077218 A1 WO 2013077218A1 JP 2012079317 W JP2012079317 W JP 2012079317W WO 2013077218 A1 WO2013077218 A1 WO 2013077218A1
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- 239000004576 sand Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- FDRCDNZGSXJAFP-UHFFFAOYSA-M sodium chloroacetate Chemical compound [Na+].[O-]C(=O)CCl FDRCDNZGSXJAFP-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- the present invention relates to a resin composition for an optical semiconductor encapsulant, and more specifically, a resin composition for an optical semiconductor encapsulant that forms a resin having high transparency and refractive index and excellent heat resistance when cured. About.
- a sealing material used for an optical semiconductor such as an LED or a photodiode a resin excellent in light transmittance and heat resistance such as an epoxy resin or a silicon resin is used.
- a sealing agent having high luminance has been demanded. For this reason, it is required to increase the refractive index of the sealing agent to improve the light extraction efficiency.
- zirconium oxide composed of nanoparticles having a smaller particle diameter.
- alkyl such as neodecanoic acid is used.
- Carboxylic acid is used (Patent Document 1).
- nano-level particles having an average particle diameter of several tens of nanometers or less have high surface energy, and therefore tend to be very cohesive, and the amount of the mixture cannot be increased. That is, when a large amount of zirconium oxide nanoparticles are blended in order to further increase the refractive index, even if a large amount of the dispersant described in Patent Document 1 is used, the particles cannot be sufficiently dispersed, and light transmittance There is a problem that it is greatly reduced.
- the present invention has been made in view of such problems of the prior art, and the object thereof is a light having a low viscosity, excellent light transmittance and heat resistance, and having a high refractive index. It is to provide a semiconductor encapsulant composition.
- the resin composition for an optical semiconductor encapsulant of the present invention comprises zirconium oxide particles having an average particle diameter of 1 to 30 nm, a dispersant represented by the following formula (1), and an epoxy compound. To do.
- R in the formula (1) is a branched chain alkyl group or alkenyl group having 3 to 24 carbon atoms
- AO in the formula (1) represents an oxyalkylene group having 1 to 4 carbon atoms
- N is a numerical value in the range of 5 to 30 indicating the average number of added moles of alkylene oxide
- X in the formula (1) is a linking group comprising a carbon atom, a hydrogen atom and / or an oxygen atom.
- X in the formula (1) in the dispersant is preferably an alkylene group having 1 to 15 carbon atoms.
- X in the formula (1) in the dispersant may be a linking group represented by the following formula (2).
- Y in the formula (2) is any selected from an alkylene group having 1 to 15 carbon atoms, a vinylene group, a phenylene group, and a carboxyl group-containing phenylene group.
- the compounding amount of the zirconium oxide particles is 0.5 to 80% by weight. It is preferable that the compounding ratio of zirconium oxide nanoparticles can be increased while suppressing an increase in the viscosity of the dispersion, so that the refractive index of the resulting resin is increased. It becomes possible. Also, the dispersion stability is excellent.
- optical semiconductor of the present invention is characterized by using any of the above resin compositions for optical semiconductor encapsulants.
- the resin composition for optical semiconductor encapsulants of the present invention is used, a cured product having high transparency and refractive index and excellent heat resistance can be obtained.
- Dispersoid particles are zirconium oxide nanoparticles, specifically, zirconium oxide having an average particle diameter of 1 to 30 nm. Further, the zirconium oxide nanoparticles in the present invention may be crystalline or amorphous. Further, the dispersoid particles dispersed by the dispersant in the present invention may be isotropic particles, anisotropic particles, or fibrous.
- zirconium oxide nanoparticles that are to be dispersed in the present invention those obtained by a known method can be used.
- a method for preparing fine particles a top-down method in which coarse particles are mechanically pulverized and refined, and a bottom in which particles are formed through a cluster state in which several unit particles are generated and aggregated.
- any one prepared by any method can be suitably used. Further, they may be either a wet method or a dry method.
- the bottom-up method includes a physical method and a chemical method, and any method may be used.
- the dispersant in the present invention may be used in a top-down process in which coarse particles are mechanically pulverized and refined to form several unit particles, which pass through a cluster state in which they are aggregated. May be used in a bottom-up process in which particles are formed, or after preparing fine particles in advance by the above-described method, a surface modifier or surface may be used to stably remove the dispersoid particles from the medium. It is also possible to use particles taken out by being coated or impregnated with a known protective agent called a protective agent. As the protective agent, the above-mentioned known dispersants can be substituted.
- the zirconium oxide nanoparticles as the dispersoid particles in the present invention serve to increase the refractive index as a sealant, thereby improving the light extraction efficiency and obtaining a sealant with high brightness.
- a preferable blending amount of the zirconium oxide nanoparticles is 0.5 to 80% by weight, more preferably 30 to 70% by weight, and still more preferably 35% with respect to the entire resin composition for an optical semiconductor encapsulant of the present invention. ⁇ 60% by weight.
- the hydrophobic group (R) of the dispersant in the present invention contains a branched chain alkyl group or alkenyl group having 3 to 24 carbon atoms.
- the content of the branched chain alkyl group or alkenyl group having 3 to 24 carbon atoms is preferably 70% by weight or more based on the total of R.
- the raw material alcohol that can be used to generate R may have a single carbon number or a mixture of alcohols having different carbon numbers.
- the raw material alcohol may be synthetically or naturally derived, and the chemical structure may be a single composition or a mixture of a plurality of isomers.
- known alcohols can be selected. Specific examples include butanol, isobutanol, pentanol and / or its isomer, hexanol and / or its isomer, heptanol and / or its isomer derived from synthesis.
- Octanol and / or its isomer 3,5,5-trimethyl-1-hexanol, isononanol, isodecanol, isounol produced by the oxo process via higher olefins derived from propylene or butene, or mixtures thereof
- Decanol, isododecanol, isotridecanol, Neodol 23, 25, 45 manufactured by Shell Chemicals, SAFOL23 manufactured by Sasol, EXXAL7, EXXAL8N, EXXAL9, EXXAL10, EXXXAL11 and EXXXA manufactured by Exxon Mobil 13 illustrates another example of a higher alcohol which can be suitably used.
- octyl alcohol decyl alcohol, lauryl alcohol (1-dodecanol), myristyl alcohol (1-tetradecanol), cetyl alcohol (1-hexadecanol), stearyl alcohol (1-octadecanol), oleyl alcohol (Cis-9-octadecene-1-ol) and the like are also examples of higher alcohols that can be used.
- a single composition of Guerbet Alcohol having a 2-alkyl-1-alkanol type chemical structure, or a mixture thereof is an example of a higher alcohol that can be suitably used, such as 2-ethyl-1-hexanol, 2-propyl-1-hexanol, 2-butyl-1-hexanol, 2-ethyl-1-heptanol, 2-propyl-1-heptanol, 2-ethyl-1-octanol, 2-hexyl-1-decanol, 2- In addition to heptyl-1-undecanol, 2-octyl-1-dodecanol, 2-decyl-1-tetradecanol, there are isostearyl alcohols derived from branched alcohols.
- the hydrophobic group (R) contains a branched alkyl group and / or alkenyl group having 3 to 24 carbon atoms.
- the hydrophobic group (R) is hydrogen or a hydrocarbon group having 1 to 2 carbon atoms
- the carbon number exceeds 25
- the hydrophobic group (R) has a carbon number in the range of 3 to 24
- the selection range of the dispersion medium that can be used is It may be limited, or substitution or mixing with a different type of dispersion medium may occur in the dispersion preparation process.
- the hydrophobic group (R) is more preferably a branched alkyl group having 8 to 18 carbon atoms. .
- Dispersant oxyalkylene group (AO) n The alkylene oxide species that are preferably selected for the dispersant in the present invention will be described.
- AO in Formula (1) represents an oxyalkylene group having 1 to 4 carbon atoms.
- the alkylene oxide having 2 carbon atoms is ethylene oxide.
- the alkylene oxide having 3 carbon atoms is propylene oxide.
- the alkylene oxide having 4 carbon atoms is tetrahydrofuran or butylene oxide, and is preferably 1,2-butylene oxide or 2,3-butylene oxide.
- an oxyalkylene chain (-(AO) n-) is introduced for the purpose of adjusting the dispersion medium affinity of the dispersant.
- alkylene oxide is a homopolymer chain, random polymerization of two or more alkylene oxides. It may be a chain, a block polymer chain, or a combination thereof.
- N which shows the average addition mole number of the alkylene oxide of Formula (1) is in the range of 5 to 30, but is preferably in the range of 5 to 20.
- Dispersing agent linking group (X) can be selected from a known structure consisting of a carbon atom, a hydrogen atom, and an oxygen atom, preferably a saturated hydrocarbon group, an unsaturated hydrocarbon group, an ether group, a carbonyl group, or an ester group. It may have an alicyclic structure or an aromatic ring structure, and may have a repeating unit.
- the linking group X contains a nitrogen atom and / or a sulfur atom and / or a phosphorus atom, it has an action of weakening the affinity effect of the carboxyl group on the dispersoid, and thus is not suitable as a structural factor of the dispersant in the present invention. .
- X in the formula (1) is preferably an alkylene group having 1 to 15 carbon atoms, and more preferably an alkylene group having 1 to 8 carbon atoms.
- X in the formula (1) is preferably a substance represented by the above formula (2).
- Y in Formula (2) is any selected from an alkylene group having 1 to 15 carbon atoms, a vinylene group, a phenylene group, and a carboxyl group-containing phenylene group.
- R is preferably an alkyl group having 8 to 18 carbon atoms and having a branched chain
- n represents the average number of moles of ethylene oxide added, preferably in the range of 3 to 20.
- the blending amount of the dispersant in the present invention is not particularly limited, but is 0.1 to 300% by weight and 0.5 to 20% by weight based on the zirconium oxide particles as the dispersoid particles. %, Preferably 1 to 15% by weight, more preferably 2 to 10% by weight.
- the dispersant in the present invention can be produced by a known method. For example, using a general nonionic surfactant compound obtained by adding an alkylene oxide to an alcohol, amine, or thiol by a known method as a raw material, a monohalogenated lower carboxylic acid or a salt thereof is used. Although it can manufacture by the method of making it react with a hydroxyl group, or the method of ring-opening reaction with the hydroxyl group of the alkylene oxide terminal using an acid anhydride, it is not limited to these methods.
- hydrophobic groups alkylene oxide types and addition forms thereof, addition molar amounts, linking groups, etc. are particularly limited within the above-mentioned range, so that a wider range of types than known dispersants can be selected.
- the industrial utility value is great in that it can disperse various dispersoids and can disperse and stabilize the dispersoids in a wider variety of dispersion media.
- the dispersant used in the present invention should be used by reducing the content of ionic species, particularly alkali metal ions, alkaline earth metal ions, heavy metal ions, and halogen ions, contained by a known purification method. Can do.
- the ionic species in the dispersant greatly affects the dispersion stability, touch resistance, oxidation resistance, electrical properties (conductive properties, insulation properties), stability over time, heat resistance, low humidity, and weather resistance of the dispersion. Therefore, although the content of the ions can be appropriately determined, it is preferably less than 10 ppm in the dispersant.
- the resin composition for an optical semiconductor encapsulant of the present invention can be prepared using a known stirring means, homogenizing means, and dispersing means.
- dispersers that can be used include roll mills such as two rolls and three rolls, ball mills such as ball mills and vibration ball mills, paint shakers, continuous disk type bead mills, bead mills such as continuous annular type bead mills, sand mills, and jets. Mill etc. are mentioned.
- the dispersion treatment can be performed in an ultrasonic wave generation bath.
- Epoxy compound used in the resin composition for optical semiconductor encapsulating materials of the present invention is a compound having an epoxy group.
- the following can be illustrated as such a compound.
- the aliphatic epoxy compound include triglycidyl isocyanurate, butyl glycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, polypropylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, dimer acid And polyglycidyl ether.
- Examples of the alicyclic epoxy compound include 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexenecarboxylate, bis (3,4-epoxycyclohexyl) adipate, cyclohexanedimethanol diglycidyl ether, ⁇ - Caprolactone-modified 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether and hydrogenated novolak type An epoxy compound etc. are mentioned.
- the aromatic epoxy compound examples include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, and a novolac type epoxy compound.
- an aliphatic epoxy compound and an alicyclic epoxy compound are preferable because light resistance and heat discoloration are improved.
- these epoxy compounds may be used independently and 2 or more types may be used, and the oligomer of the said compound may be sufficient as an epoxy compound.
- a curing agent can be further used. As such a curing agent, any of polyaddition type, catalyst type, and condensation type can be used.
- amine compounds such as diaminodiphenylmethane, diaminodiphenylsulfone, diethylenetriamine, and triethylenetetramine, polyamide
- Amide compounds such as dicyandiamide, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylbicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride, bicyclo [2.2.1] heptane-2,3 -Acid anhydrides such as dicarboxylic acid anhydrides. Of these, acid anhydrides are preferred.
- the blending amount of the curing agent is not particularly limited, but is 25 to 180% by weight, more preferably 80 to 130% by weight with respect to the epoxy compound of the present invention.
- a preferable blending amount of the epoxy compound or a mixture of the epoxy compound and the curing agent is 20 to 80% by weight, more preferably 25 to 75% by weight, based on the entire resin composition for optical semiconductor sealing material of the present invention. More preferably, it is 30 to 70% by weight.
- the resin composition for optical semiconductor encapsulating material of the present invention includes various resins, oligomers, and monomers used for ordinary paints, adhesives, and molding. There are no particular restrictions on the type. Specifically, acrylic resin, polyester resin, alkyd resin, urethane resin, silicone resin, fluorine resin, epoxy resin, polycarbonate resin, polyvinyl chloride resin, polyvinyl alcohol, or the like may be added. Moreover, you may add the organic solvent whose boiling point in 1 atmosphere is less than 100 degreeC.
- the resin composition for an optical semiconductor encapsulant of the present invention can be cured by a method such as heating, ultraviolet irradiation or electron beam irradiation. Of these, curing by heating is preferable because a relatively thick sealing material can be formed.
- Example 1 100 parts of a commercially available zirconium oxide dispersion (trade name SZR-M manufactured by Sakai Chemical Co., Ltd., methanol dispersion containing a primary particle diameter of 3 nm and 30% by weight of zirconium oxide), 3 of the dispersant A produced in Production Example 1 Parts, 1,6-hexanediol diglycidyl ether (trade name: Denacol EX-212, manufactured by Nagase ChemteX Corp.) and methylbicyclo [2.2.1] heptane-2,3-dicarboxylic acid anhydride And 13.5 parts of a mixture of bicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride (trade name: Jamaicacid HNA-100, manufactured by Shin Nippon Rika Co., Ltd.).
- a commercially available zirconium oxide dispersion trade name SZR-M manufactured by Sakai Chemical Co., Ltd., methanol dispersion containing
- Example 2 An optical semiconductor encapsulant composition was obtained in the same manner as in Example 1 except that 3 parts of Dispersant B described in Production Example 2 was used instead of 3 parts of Dispersant A.
- Example 3 An optical semiconductor encapsulant composition was obtained in the same manner as in Example 1 except that 3 parts of Dispersant C described in Production Example 3 was used instead of 3 parts of Dispersant A.
- Example 4 It replaced with 3 parts of dispersing agent A, and carried out similarly to Example 1 except having used 3 parts of dispersing agent D as described in manufacture example 4, and obtained the optical semiconductor sealing material composition.
- Example 5 An optical semiconductor encapsulant composition was obtained in the same manner as in Example 1 except that 3 parts of the dispersant E described in Production Example 5 was used instead of 3 parts of the dispersant A.
- Example 6 The amount of dispersant A used was changed to 4.5 parts, the amount of carboxylic anhydride curing agent used was changed to 12.75 parts, and further replaced with 13.5 parts of 1,6-hexanediol diglycidyl ether, Except for using 12.75 parts of 1,4-cyclohexanedimethanol diglycidyl ether (trade name: Guatemala Resin DME-100, manufactured by Shin Nippon Chemical Co., Ltd.), the same procedure as in Example 1 was carried out to obtain an optical semiconductor encapsulant composition. It was.
- Example 7 The amount of dispersant A used was changed to 4.5 parts, the amount of carboxylic anhydride curing agent used was changed to 12.75 parts, and further replaced with 13.5 parts of 1,6-hexanediol diglycidyl ether, Guatemala Resin HBE-100 (trade name, main component: hydrogenated bisphenol A diglycidyl ether, manufactured by Shin Nippon Rika Co., Ltd.) was used in the same manner as in Example 1 except that 12.75 parts were obtained. It was.
- Example 8 Example 1 except that the amount of dispersant A used was changed to 4.5 parts, the amount of 1,6-hexanediol diglycidyl ether used was changed to 7 parts, and the amount of carboxylic anhydride curing agent used was changed to 7 parts. It carried out similarly and the optical-semiconductor sealing material composition was obtained.
- Example 1 The same procedure as in Example 1 was performed except that 3 parts of 2-ethylhexanoic acid was used instead of 3 parts of the dispersant A.
- Example 2 The same procedure as in Example 1 was conducted except that 3 parts of lauric acid was used instead of 3 parts of the dispersant A.
- Example 3 The same procedure as in Example 1 was performed except that 3 parts of dispersant a described in Production Example 6 was used instead of 3 parts of dispersant A.
- Example 4 The same procedure as in Example 1 was performed except that 3 parts of phenyltriethoxysilane (trade name: KBE-103, manufactured by Shin-Etsu Silicone) was used instead of 3 parts of the dispersant A.
- phenyltriethoxysilane trade name: KBE-103, manufactured by Shin-Etsu Silicone
- the optical semiconductor encapsulant composition of each example was excellent in dispersibility and the viscosity was at a level that does not hinder handling.
- the compositions of Comparative Examples 1 and 2 have poor dispersibility, and all the compositions of Comparative Examples have high viscosity.
- the compositions of Comparative Examples 3 and 4 have no fluidity, so that they are cured. Can not get.
- cured material obtained from the optical-semiconductor sealing material composition of each Example had a favorable external appearance, there was no problem also about haze, and the refractive index showed the high value. Furthermore, there was little change in the light transmittance at the initial stage and after the heat test, and excellent results were shown.
- the optical semiconductor encapsulant composition of the present invention is excellent in light transmittance and heat resistance and has a high refractive index, and therefore can be used as an encapsulant for LEDs and photodiodes.
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- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
Abstract
Description
本発明の光半導体封止材用樹脂組成物における分散質粒子は酸化ジルコニウムナノ粒子であり、具体的には平均粒子径が1~30nmの酸化ジルコニウムである。また、本発明における酸化ジルコニウムナノ粒子は結晶状であってもアモルファス状であってもよい。また、本発明における分散剤により分散される前記分散質粒子は等方性粒子であっても異方性粒子であってもよく、繊維状であってもよい。
本発明における分散剤の疎水基(R)は、分岐鎖を有し炭素数が3~24のアルキル基またはアルケニル基を含んでいる。分岐鎖を有し炭素数が3~24のアルキル基またはアルケニル基の含有量は、Rの全体に対して70重量%以上であることが好ましい。
本発明において分散剤に好適に選択されるアルキレンオキシド種について説明する。式(1)におけるAOは、炭素数1ないし4のオキシアルキレン基を示すものであり、具体的には炭素数2のアルキレンオキシドはエチレンオキシドである。炭素数3のアルキレンオキシドはプロピレンオキシドである。炭素数4のアルキレンオキシドは、テトラヒドロフラン或いはブチレンオキシドであるが、好ましくは、1,2-ブチレンオキシドまたは2,3-ブチレンオキシドである。分散剤においてオキシアルキレン鎖(-(AO)n-)は分散剤の分散媒親和性を調整する目的で導入され、アルキレンオキシドは単独重合鎖であっても、2種以上のアルキレンオキサイドのランダム重合鎖でもブロック重合鎖でもよく、また、その組み合わせであってもよい。式(1)のアルキレンオキシドの平均付加モル数を示すnは5ないし30の範囲であるが、5ないし20の範囲にあることが好ましい。
連結基(X)は炭素原子、水素原子、酸素原子からなる公知の構造から選択可能であるが、好ましくは飽和炭化水素基、不飽和炭化水素基、エーテル基、カルボニル基、エステル基からなり、脂環構造、芳香環構造を有していてもよく、また、繰り返し単位を有していてもよい。連結基Xに窒素原子及び/又は硫黄原子及び/又はリン原子などを含む場合は、カルボキシル基の分散質への親和効果を弱める作用があるために本発明における分散剤の構造因子としては適さない。
本発明においては、下記式(3)に記載の分散剤を使用することが一層好ましい。
本発明における分散剤の配合量は特に限定されるものではないが、分散質粒子である酸化ジルコニウム粒子に対して0.1~300重量%であり、0.5~20重量%が好ましく、1~15重量%がより好ましく、2~10重量%がさらに好ましい。
本発明における分散剤は、公知の方法で製造することができる。例えば、アルコール、アミン、チオールに公知の方法でアルキレンオキシドを付加した一般的な非イオン界面活性剤化合物を原料として、モノハロゲン化低級カルボン酸またはその塩を用い、塩基存在下でアルキレンオキシド末端の水酸基と反応させる方法、または、酸無水物を用いてアルキレンオキシド末端の水酸基との開環反応による方法により製造することができるが、これらの方法に限定されるものではない。
本発明の光半導体封止材用樹脂組成物において使用されるエポキシ化合物は、エポキシ基を有する化合物である。このような化合物としては、以下のものを例示することができる。
脂肪族エポキシ化合物としては、例えば、トリグリシジルイソシアヌレート、ブチルグリシジルエーテル、1,6-ヘキサンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、ポリプロピレングリコールジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、ダイマー酸ポリグリシジルエーテルなどが挙げられる。
脂環族エポキシ化合物としては、例えば、3,4-エポキシシクロヘキセニルメチル-3’,4’-エポキシシクロヘキセンカルボキシレート、ビス(3,4-エポキシシクロヘキシル)アジペート、シクロヘキサンジメタノールジグリシジルエーテル、ε-カプロラクトン変性3,4-エポキシシクロヘキセニルメチル-3’,4’-エポキシシクロヘキセンカルボキシレート、水素化ビスフェノールAジグリシジルエーテル、水素化ビスフェノールFジグリシジルエーテル、水素化ビスフェノールSジグリシジルエーテルおよび水素化ノボラック型エポキシ化合物などが挙げられる。
芳香族エポキシ化合物としては、例えば、ビスフェノールAジグリシジルエーテル、ビスフェノールFジグリシジルエーテル、ビスフェノールSジグリシジルエーテルおよびノボラック型エポキシ化合物などが挙げられる。
これらのうち、脂肪族エポキシ化合物および脂環族エポキシ化合物が耐光性および耐熱変色性が向上するため好ましい。
なお、これらのエポキシ化合物は、単独で使用してもよく、2種以上を使用してもよく、また、エポキシ化合物は、上記化合物のオリゴマーであってもよい。
本発明の光半導体封止材用樹脂組成物には、さらに硬化剤を使用することができる。このような硬化剤としては、重付加型、触媒型、縮合型のいずれのタイプのものでも使用可能であり、例えば、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、ジエチレントリアミン、トリエチレンテトラミンなどのアミン化合物、ポリアミド、ジシアンジアミドなどのアミド化合物、ヘキサヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、メチルビシクロ[2.2.1]ヘプタン-2,3-ジカルボン酸無水物、ビシクロ[2.2.1]ヘプタン-2,3-ジカルボン酸無水物などの酸無水物が挙げられる。これらのうち、酸無水物が好ましい。
硬化剤の配合量は、特に限定されないが、本発明のエポキシ化合物に対し25~180重量%であり、より好ましくは80~130重量%である。
エポキシ化合物あるいはエポキシ化合物と硬化剤の混合物の好ましい配合量は、本発明の光半導体封止材用樹脂組成物の全体に対して20~80重量%であり、より好ましくは25~75重量%、更に好ましくは30~70重量%である。
本発明の光半導体封止材用樹脂組成物には、上記各成分に加えて、通常の塗料用や粘接着用、成型用に利用されている各種樹脂類、オリゴマー類、単量体類も特に制限無く使用できる。具体的には、アクリル樹脂、ポリエステル樹脂、アルキド樹脂、ウレタン樹脂、シリコーン樹脂、フッ素樹脂、エポキシ樹脂、ポリカーボネート樹脂、ポリ塩化ビニル樹脂、ポリビニルアルコールなどを添加してもよい。また、1気圧における沸点が100℃未満の有機溶媒を添加してもよい。
本発明の光半導体封止材用樹脂組成物は、加熱、紫外線照射または電子線照射などの方法により、硬化することができる。これらのうち、比較的厚みのある封止材を形成可能であることから、加熱による硬化が好ましい。
[製造例1(分散剤Aの合成)]
トルエン溶媒中に、分岐C11~14アルキルアルコール(製品名:EXXAL13、エクソン・モービル社製)エチレンオキシド10モル付加物640g(1モル)およびモノクロロ酢酸ナトリウム152g(1.3モル)を反応器にとり、均一になるよう撹拌した。その後、反応系の温度60℃の条件で水酸化ナトリウム52gを添加した。次いで、反応系の温度を80℃に昇温させ、3時間熟成させた。熟成後、反応系が50℃の条件で98%硫酸117g(1.2モル)を滴下することにより、白色懸濁溶液を得た。次いで、この白色懸濁溶液を蒸留水で洗浄し、溶媒を減圧留去することにより、分散剤A(R:分岐C11~14アルキル、AO:エチレンオキシド、n:10、X:CH2)を得た。
製造例1において、分岐C11~14アルキルアルコールエチレンオキシド10モル付加物に代えて、イソデシルアルコールエチレンオキシド10モル付加物598g(1モル)としたこと以外は製造例1と同様の方法で行い、分散剤B(R:イソデシル、AO:エチレンオキシド、n:10、X:CH2)を得た。
製造例1において、分岐C11~14アルキルアルコールエチレンオキシド10モル付加物に代えて、分岐C11~14アルキルアルコールエチレンオキシド5モル付加物420g(1モル)としたこと以外は製造例1と同様の方法で行い、分散剤C(R:分岐C11~14アルキル、AO:エチレンオキシド、n:5、X:CH2)を得た。
分岐C11~14アルキルアルコールエチレンオキシド10モル付加物640g(1モル)およびコハク酸無水物100g(1モル)を120℃で2時間反応させることにより、分散剤D(R:分岐C11~14アルキル、AO:エチレンオキシド、n:10、X:COCH2CH2)を得た。
製造例1において、分岐C11~14アルキルアルコールエチレンオキシド10モル付加物に代えて、2-エチルヘキシルアルコールエチレンオキシド10モル付加物570g(1モル)としたこと以外は製造例1と同様の方法で行い、分散剤E(R:2-エチルヘキシル、AO:エチレンオキシド、n:10、X:CH2)を得た。
製造例1において、分岐C11~14アルキルアルコールエチレンオキシド10モル付加物に代えて、メタノールエチレンオキシド10モル付加物472g(1モル)としたこと以外は製造例1と同様の方法で行い、分散剤a(R:メチル、AO:エチレンオキシド、n:10、X:CH2)を得た。
市販の酸化ジルコニウム分散体(堺化学社製の商品名SZR-M、一次粒子径3nm、30重量%の酸化ジルコニウムを含有するメタノール分散体)100部、製造例1で製造した分散剤Aを3部、1,6-ヘキサンジオールジグリシジルエーテル(商品名:デナコールEX-212、ナガセケムテックス社製)13.5部とメチルビシクロ[2.2.1]ヘプタン-2,3-ジカルボン酸無水物とビシクロ[2.2.1]ヘプタン-2,3-ジカルボン酸無水物との混合物(商品名:リカシッド HNA-100、新日本理化社製)13.5部を混合した。これを、ロータリーエバボレーターを用いてメタノールを減圧除去することにより、本発明の光半導体封止材組成物を得た。
分散剤A3部に代えて、製造例2に記載の分散剤Bを3部使用した以外は実施例1と同様に行い、光半導体封止材組成物を得た。
分散剤A3部に代えて、製造例3に記載の分散剤Cを3部使用した以外は実施例1と同様に行い、光半導体封止材組成物を得た。
分散剤A3部に代えて、製造例4に記載の分散剤Dを3部使用した以外は実施例1と同様に行い、光半導体封止材組成物を得た。
分散剤A3部に代えて、製造例5に記載の分散剤Eを3部使用した以外は実施例1と同様に行い、光半導体封止材組成物を得た。
分散剤Aの使用量を4.5部に、無水カルボン酸硬化剤の使用量を12.75部にそれぞれ変更し、さらに、1,6-ヘキサンジオールジグリシジルエーテル13.5部に代えて、1,4-シクロヘキサンジメタノールジグリシジルエーテル(商品名:リカレジンDME-100、新日本理化社製)12.75部とした以外は実施例1と同様に行い、光半導体封止材組成物を得た。
分散剤Aの使用量を4.5部に、無水カルボン酸硬化剤の使用量を12.75部にそれぞれ変更し、さらに、1,6-ヘキサンジオールジグリシジルエーテル13.5部に代えて、リカレジンHBE-100(商品名、主成分:水素化ビスフェノールAジグリシジルエーテル、新日本理化社製)12.75部とした以外は実施例1と同様に行い、光半導体封止材組成物を得た。
分散剤Aの使用量を4.5部に、1,6-ヘキサンジオールジグリシジルエーテルの使用量を7部に、無水カルボン酸硬化剤の使用量を7部に変更した以外は実施例1と同様に行い、光半導体封止材組成物を得た。
分散剤A3部に代えて、2-エチルヘキサン酸を3部使用した以外は実施例1と同様に行った。
分散剤A3部に代えて、ラウリン酸を3部使用した以外は実施例1と同様に行った。
分散剤A3部に代えて、製造例6に記載の分散剤aを3部使用した以外は実施例1と同様に行った。
分散剤A3部に代えて、フェニルトリエトキシシラン(商品名:KBE-103、信越シリコーン社製)を3部使用した以外は実施例1と同様に行った。
上記実施例および比較例の光半導体封止材組成物について、分散性、粘度の評価を行い、その結果を表1に示した。評価方法は以下のとおりである。
目視により沈殿物の有無を確認し、沈殿物がない場合を○、沈殿物がある場合を×とした。
JIS K5600-2-3に準じて、E型粘度計(東機産業社製 RE80R)を使用し、25℃における分散体の粘度を測定した。
上記実施例および比較例の光半導体封止材組成物を、25μmのスペーサーを挟んだガラス板で作製したケースに入れ、100℃で1時間、150℃で1時間加熱して、厚さ25μmの硬化物を得た。この硬化物について、外観、屈折率、ヘイズ、耐熱試験前後の450nmにおける光線透過率の結果を表1に示した。評価方法は以下のとおりである。
目視により硬化物の外観を観察し、析出物が見られない場合を○、析出物が見られる場合を×とした。
プリズムカプラ(METRICON社製METRICONプリズムカプラ モデル2010)を使用し、波長589nmにおける屈折率を測定した。
JIS K 7136に準じて、ヘイズコンピューター(スガ製作所製 HZ-2)を使用して硬化物のヘイズを測定した。
得られた硬化物を150℃で12時間静置した後の波長450nmの光線透過率を測定した。
表1から明らかなように、各実施例の光半導体封止材組成物は分散性に優れ、粘度も取り扱いに支障のないレベルであった。これに対して比較例1及び2の組成物は分散性が悪く、また、すべての比較例の組成物は粘度が高く、特に比較例3及び4の組成物は流動性がないために硬化物を得ることができなかった。また、各実施例の光半導体封止材組成物から得られる硬化物は、何れも外観が良好で、ヘイズについても問題がなく、しかも屈折率は高い値を示した。更に、初期及び耐熱試験後の光透過率に変化は少なく、優れた結果を示した。
Claims (5)
- 前記式(1)のXは、炭素数が1ないし15のアルキレン基であることを特徴とする請求項1記載の光半導体封止材用樹脂組成物。
- 前記光半導体封止材用樹脂組成物の全体を100重量%とした場合に、前記酸化ジルコニウム粒子の配合量が0.5~80重量%である請求項1ないし3の何れか一項に記載の光半導体封止材用樹脂組成物。
- 請求項1ないし4の何れか一項に記載の光半導体封止材用樹脂組成物を用いた光半導体。
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JP2011136857A (ja) * | 2009-12-28 | 2011-07-14 | Jgc Catalysts & Chemicals Ltd | 疎水性酸化ジルコニウム粒子、その製造方法および該疎水性酸化ジルコニウム粒子含有樹脂組成物ならびに樹脂硬化物膜付基材 |
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JPWO2013077218A1 (ja) | 2015-04-27 |
TWI469824B (zh) | 2015-01-21 |
JP5213148B1 (ja) | 2013-06-19 |
KR101609085B1 (ko) | 2016-04-04 |
TW201338856A (zh) | 2013-10-01 |
CN103917597A (zh) | 2014-07-09 |
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