WO2013071844A1 - 光学面板的堆叠结构及其制造方法 - Google Patents

光学面板的堆叠结构及其制造方法 Download PDF

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Publication number
WO2013071844A1
WO2013071844A1 PCT/CN2012/084425 CN2012084425W WO2013071844A1 WO 2013071844 A1 WO2013071844 A1 WO 2013071844A1 CN 2012084425 W CN2012084425 W CN 2012084425W WO 2013071844 A1 WO2013071844 A1 WO 2013071844A1
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bonding
protective layer
bonding member
optical panel
bonding surface
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PCT/CN2012/084425
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English (en)
French (fr)
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佘志君
江耀诚
黄萍萍
蔡志雄
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宸鸿科技(厦门)有限公司
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Publication of WO2013071844A1 publication Critical patent/WO2013071844A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Definitions

  • the present invention relates to an optical panel, and more particularly to a stacked structure of an optical panel and a method of fabricating the same.
  • the touch panel usually has a glass cover (cover The glass cover is used on the one hand to protect the touch component and on the other hand as an interface for the user to input information.
  • cover is used on the one hand to protect the touch component and on the other hand as an interface for the user to input information.
  • glue for attaching other components of the touch panel
  • the glass cover is uneven at the factory, there are some cracks, and the glue does not fill the cracks.
  • Keeping a small amount of air in the cracks when curing the glue, A small amount of air is squeezed out, creating bubbles on the surface of the glass cover, causing poor product.
  • the same defect also exists in the bonding process of the touch panel and the display panel, or the bonding process of the touch panel and the plastic case.
  • the invention provides a stack structure of an optical panel, comprising:
  • a first protective layer is formed on the first bonding surface of the first bonding member to planarize
  • the first bonding surface of the first bonding member is The first bonding surface of the first bonding member.
  • the invention further provides a manufacturing method of a stacked structure of an optical panel, comprising the following steps:
  • a protective layer may be applied on the bonding surface of the bonding member to planarize the bonding surface of the bonding member to overcome the unevenness of the bonding surface of the bonding member. The problem, so as to avoid the bubbles generated when the fit, and thus improve the yield of the product.
  • Figure 1 is a cross-sectional view showing a stacked structure of an optical panel of the present invention
  • Figure 2 is a cross-sectional view showing a protective layer formed only on the bonding surface of the first bonding member of the present invention
  • Figure 3 is a cross-sectional view showing a protective layer formed only on the bonding surface of the second bonding member of the present invention
  • 4A is a cross-sectional view showing a protective layer formed on a bonding surface of a second bonding member of the present invention
  • 4B is a cross-sectional view showing a protective layer formed on the bonding surface of the first bonding material of the present invention
  • Figure 5 is a flow chart showing the process of the optical panel of the present invention.
  • the stacking structure of the optical panel includes a first bonding component 10, a second bonding component 12, and an adhesive 14 for bonding the first bonding component 10 and the second bonding component 12.
  • a first protective layer 16 is formed on the bonding surface of the first bonding member 10 opposite to the adhesive 14, and a second protective layer 18 is formed on the bonding surface of the second bonding member 12 opposite to the adhesive 14.
  • the first protective layer 16 is used to planarize the bonding surface of the first bonding member 10, and the second protective layer 18 is used to planarize the bonding surface of the second bonding member 12, that is, the first protective layer 16 and the second surface.
  • the protective layer 18 fills the crack of the bonding surface of the first bonding material 10 and the bonding surface of the second bonding material 12.
  • the first bonding component 10 can be a glass outer cover, a plastic housing or a display panel, and the second bonding component 12 can be a touch sensing substrate.
  • the glass cover 10 and the touch sensing substrate 12 are combined into a touch panel.
  • Adhesive 14 is a Optical adhesive layer.
  • the first protective layer 16 and the second protective layer 18 are gap fillers, filling the gap between the first bonding member 10 and the second bonding member 12.
  • the first protective layer 16 and the second protective layer 18 may be an ink layer. Or a layer of silicon dioxide (SiO2).
  • the first protective layer 16 and the second protective layer 18 are respectively formed on the bonding surface of the first bonding material 10 and the bonding surface of the second bonding material 12 by printing, spraying or sputtering.
  • the first protective layer 16 formed on the bonding surface of the first bonding member 10 is used to planarize the first bonding member 10 because the bonding surface of the first bonding member 10 has the crack 20 .
  • the bonding surface that is, the first protective layer 16 fills the crack 20 of the bonding surface of the first bonding member 10, and planarizes the bonding surface of the first bonding member 10. Therefore, the crack 20 is filled by the first protective layer 16 without air, so that, for example, when the adhesive 14 is cured by ultraviolet light heating, bubbles are not generated due to heat expansion of the air to improve the yield of the product.
  • the flatness of the bonding surface of the first bonding member 10 and the second bonding member 12 can be formed only for one of them.
  • the protective layer For example, the first bonding member of FIG. 2 is formed with a protective layer, wherein the components of FIG. 2 are the same as those of the component of FIG. 1, for example, the bonding surface of the first bonding member 10 has In the crack 20, the first protective layer 16 is formed on the bonding surface of the first bonding member 10 to planarize the bonding surface of the first bonding member 10.
  • the second bonding member 12 of FIG. 3 is formed with a protective layer 18, wherein the components of FIG. 3 having the same components as those of FIG. 1 have the same component symbols.
  • the bonding surface of the second bonding member 12 has In the crack 20, a second protective layer 18 is formed on the bonding surface of the second bonding member 12 to planarize the bonding surface of the second bonding member 12.
  • FIG. 4A and 4B show a bonding process of an optical panel and FIG. 5 is a flow chart of a process of an optical panel.
  • the first protective layer 16 is formed on the bonding surface of the first bonding member 10 to planarize the bonding surface of the first bonding member 10, and the first protective layer is formed by printing, spraying or sputtering. 16 on the bonding surface of the first bonding member 10, so as to fill the bonding surface of the first bonding member 10 The crack 20 (step S30).
  • an adhesive 14 is formed on the first protective layer 16 (step S32).
  • step S34 Forming the second protective layer 18 on the bonding surface of the second bonding member 12 to planarize the bonding surface of the second bonding member 12, and forming the second protective layer 18 by printing, spraying or sputtering.
  • step S34 The bonding surface of the second bonding member 12
  • step S36 the first bonding member 10 and the second bonding member 12 are adhered by the adhesive 14 (step S36), wherein the adhesive 14 is located between the first protective layer 16 and the second protective layer 18.
  • the first bonding component 10 is a glass outer cover, a plastic housing or a display panel
  • the second bonding component 12 is a touch sensing substrate.
  • the glass cover and the touch sensing substrate are combined into a touch panel.
  • the adhesive 14 is Optical adhesive layer.
  • the first protective layer 16 and the second protective layer 18 are gap fillers, and the first protective layer 16 and the second protective layer 18 may also be an ink layer or a silicon dioxide layer.
  • the bonding structure of the optical panel formed by the above process for example, the bonding surface of the first bonding member 10 has a crack 20, and the first protective layer 16 formed on the bonding surface of the first bonding member 10 is used for planarization.
  • the bonding surface of the first bonding member 10 fills the crack 20 so that the surface of the first bonding member 10 adhered to the adhesive 14 is flat. Since the crack 20 is filled by the first protective layer 16 without air, for example, when the adhesive 14 is cured by ultraviolet light heating, bubbles are not generated due to air heating expansion, and the first is not caused by air heating expansion. Both the fitting 10 and the adhesive 14 are peeled off.
  • the protective layer alone only on the bonding surface of the second bonding material 12 or the bonding surface of the first bonding material 10.
  • a protective layer is not formed on the bonding surface of the second bonding member 12, and the bonding surface of the first bonding member 10 is formed.
  • the first protective layer 16 is formed, and the second bonding member 12 and the first bonding member 10 are attached by the adhesive 14, as shown in FIG.
  • the second protective layer 18 is formed on the bonding surface of the second bonding member 12 to planarize the bonding surface of the second bonding member 12 without being applied to the bonding surface of the first bonding member 10.
  • a protective layer is formed, and the second bonding member 12 and the first bonding member 10 are attached with an adhesive 14, as shown in FIG.
  • An advantage of the present invention is to provide a stacking structure of an optical panel and a manufacturing method thereof, which can avoid the occurrence of air bubbles by applying a protective layer on the surface of the bonding member to avoid the problem of unevenness of the surface of the bonding member. Improve product yield.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Position Input By Displaying (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本发明提供一种光学面板的堆叠结构，其堆叠结构包含：一第一贴合件，具有一第一贴合面；以及一第一保护层，形成于该第一贴合件的第一贴合面上，以平坦化该第一贴合件的第一贴合面。本发明藉由在贴合件的表面涂上一保护层以克服贴合件的表面不平整的问题，从而避免产生气泡，进而提高产品的良率。本发明另提供一种光学面板的堆叠结构的制造方法。

Description

光学面板的堆叠结构及其制造方法 技术领域
本发明有关于一种光学面板，且特别有关于一种光学面板的堆叠结构及其制造方法。
背景技术
近年来，手机、车用导航系统、可携式计算机、计算机等具有触控输入功能的电子设备已被广泛使用。而这些产品通常配有触控面板。 触控面板通常具有一玻璃外盖（cover glass），该玻璃外盖一方面用于保护触控组件，另一方面作为使用者输入信息的接口。 然而，当在玻璃外盖上涂上胶水用于贴合触控面板的其它组件时，由于该玻璃外盖在出厂时其表面不平整而存在一些裂缝，而胶水并没有填满该等裂缝，使该等裂缝留存少量的空气，当固化该胶水时， 少量空气就会被挤压出，从而在玻璃外盖表面产生气泡，造成产品不良。同样的缺陷也存在于触控面板与显示面板之贴合、或触控面板与塑料壳体之贴合制程中。
故此，为了提高产品的良率，现今业界极需改进该产品结构及提出一种新的制程技术，来解决上述习知技术中存在的缺失。
发明内容
本发明之目的是提供一种光学面板的堆叠结构及其制造方法，其藉由在贴合件的表面涂上一保护层以克服贴合件的表面不平整的问题，从而避免产生气泡，进而提高产品的良率。
本发明是提供一种光学面板的堆叠结构，包含：
一第一贴合件，具有一第一贴合面；以及
一第一保护层，形成于该第一贴合件的第一贴合面上，以平坦化
第一贴合件的第一贴合面。
本发明另提供一种光学面板的堆叠结构之制造方法，包含下列步骤：
形成一第一保护层于一第一贴合件之第一贴合面上，以平坦化该第一贴合件之第一贴合面。
根据上述提供之光学面板的堆叠结构及其制造方法，可以在贴合件的贴合面涂上保护层，以平坦化贴合件的贴合面，来克服贴合件的贴合面不平整的问题，从而避免贴合时所产生之气泡，进而提高产品的良率。
附图说明
图1为本发明之光学面板之堆叠结构之剖面图；
图2为本发明之仅在第一贴合件的贴合面形成保护层之剖面图；
图3为本发明之仅在第二贴合件的贴合面形成保护层之剖面图；
图4A为本发明之第二贴合件的贴合面形成保护层之剖面图；
图4B为本发明之第一贴合件的贴合面形成保护层之剖面图；以及
图5为本发明之光学面板之制程之流程图。
具体实施方式
为使熟习本发明所属技术领域之一般技艺者能更进一步了解本发明，下文特列举本发明之较佳实施例，并配合所附图式，详细说明本发明的构成内容及所欲达成之功效。
在图1中所示 之光学面板之堆叠结构包含：一第一贴合件10、一第二贴合件12及用以贴合第一贴合件10及第二贴合件12之一黏着剂14。一第一保护层16形成在第一贴合件10的与黏着剂14相对的贴合面，一第二保护层18形成在第二贴合件12的与黏着剂14相对的贴合面。第一保护层16用以平坦化第一贴合件10的贴合面，第二保护层18用以平坦化第二贴合件12的贴合面，亦即第一保护层16和第二保护层18填补第一贴合件10的贴合面和第二贴合件12的贴合面的裂缝。
其中，第一贴合件10可以是一玻璃外盖、一塑料壳体或一显示面板，第二贴合件12可以是一触控感应基板。其中，玻璃外盖10与触控感应基板12贴合成为一触控面板。
黏着剂14是一 光学胶层。第一保护层16及第二保护层18是一间隙填充剂，填补第一贴合件10和第二贴合件12的缝隙，第一保护层16及第二保护层18可以是一油墨层或一二氧化硅(SiO2)层。第一保护层16及第二保护层18以印刷、喷涂或溅镀等方式分别形成于第一贴合件10之贴合面及第二贴合件12之贴合面。
在本实施例中，由于第一贴合件10之贴合面有裂缝20，而形成在第一贴合件10之贴合面的第一保护层16用以平坦化第一贴合件10之贴合面，亦即第一保护层16填补第一贴合件10之贴合面的裂缝20，平整化第一贴合件10的贴合面。因此裂缝20由第一保护层16填补而不会有空气，所以例如在藉由紫外线加热固化黏着剂14时，不会因为空气加热膨胀而产生气泡，以提高产品的良率。
在第一贴合件10及第二贴合件12与黏着剂14贴合前，可视第一贴合件10及第二贴合件12的贴合面的平整情况仅对其中一者形成保护层。举例说明，如图2之第一贴合件形成有保护层所示，其中图2之组件相同于图1之组件是有相同的组件符号，例如第一贴合件10之贴合面有 裂缝20，则在第一贴合件10之贴合面形成第一保护层16，以平坦化第一贴合件10之贴合面。
再者，如图3之第二贴合件12形成有保护层18所示，其中图3之组件相同于图1之组件是有相同的组件符号。例如第二贴合件12之贴合面有 裂缝20，则在第二贴合件12之贴合面形成第二保护层18，以平坦化第二贴合件12之贴合面。
以下将说明光学面板之贴合结构之制程。
图4A及4B显示光学面板之贴合制程及图5为光学面板之制程的流程图。首先，形成第一保护层16于第一贴合件10之贴合面上，以平坦化第一贴合件10之贴合面，而以印刷、喷涂或溅镀等方式形成第一保护层16在第一贴合件10之贴合面，如此可填补第一贴合件10之贴合面的 裂缝20(步骤S30)。接着，形成黏着剂14于第一保护层16上(步骤S32)。
形成第二保护层18于第二贴合件12之贴合面上，以平坦化第二贴合件12之贴合面，而以印刷、喷涂或溅镀等方式形成第二保护层18在第二贴合件12之贴合面(步骤S34)。接着，藉由黏着剂14贴合第一贴合件10及第二贴合件12(步骤S36)，其中黏着剂14位于第一保护层16与第二保护层18之间。完成上述之步骤以构成图1之光学面板之贴合结构。
其中，第一贴合件10是一玻璃外盖、一塑料壳体或一显示面板，第二贴合件12是一触控感应基板。其中，玻璃外盖与触控感应基板贴合成为一触控面板。
其中，黏着剂14是 光学胶层。第一保护层16与第二保护层18是间隙填充剂，第一保护层16与第二保护层18亦可以是油墨层或二氧化硅层。
由上述制程所构成光学面板之贴合结构，例如第一贴合件10之贴合面有裂缝20，而形成在第一贴合件10之贴合面的第一保护层16用以平坦化第一贴合件10之贴合面，而来填补裂缝20，使得与黏着剂14贴合之第一贴合件10的表面平整。由于裂缝20由第一保护层16填补而不会有空气，所以例如在藉由紫外线加热固化黏着剂14时，不会因为空气加热膨胀而产生气泡，更不会因空气加热膨胀而使第一贴合件10与黏着剂14两者剥离。
在上述制程中，可考虑仅在第二贴合件12之贴合面或第一贴合件10之贴合面单独形成保护层。例如，当要平坦化第一贴合件10之贴合面以填补裂缝20时，未在第二贴合件12之贴合面形成保护层，而在第一贴合件10之贴合面形成第一保护层16，并以黏着剂14贴合第二贴合件12及第一贴合件10，如图2所示。
在另一情况中，在第二贴合件12之贴合面形成第二保护层18，以平坦化第二贴合件12之贴合面，而不在第一贴合件10之贴合面形成保护层，并以黏着剂14贴合第二贴合件12及第一贴合件10，如图3所示。
本发明之优点是提供一种光学面板的堆叠结构及其制造方法，其藉由在贴合件的表面涂上一保护层以克服贴合件的表面不平整的问题，从而避免产生气泡，进而提高产品的良率。
虽然本发明已参照较佳具体例及举例性附图叙述如上，惟其应不被视为是限制性者。熟悉本技艺者对其形态及具体例之内容做各种修改、省略及变化，均不离开本发明之申请专利范围之所主张范围。

Claims (15)

  1. 一种光学面板的堆叠结构，其特征在于，包含：
    一第一贴合件，具有一第一贴合面；以及
    一第一保护层，形成于该第一贴合件的第一贴合面上，以平坦化该第一贴合件的第一贴合面。
  2. 根据权利要求1所述的 光学面板的堆叠结构，其特征在于，进一步包括：
    一第二贴合件，具有一第二贴合面；以及
    一黏着层，位于该第一保护层及该第二贴合件的第二贴合面之间，以贴合该第一贴合件和该第二贴合件。
  3. 根据权利要求2所述的 光学面板的堆叠结构，其特征在于，进一步包括：一第二保护层，形成于该第二贴合件的第二贴合面上，以平坦化该第二贴合件的第二贴合面，且位于该第二贴合件的第二贴合面与该黏着层之间。
  4. 根据权利要求3所述的 光学面板的堆叠结构，其特征在于，该第一保护层和该第二保护层是一间隙填充剂。
  5. 根据权利要求3所述的 光学面板的堆叠结构，其特征在于，该第一保护层和第二保护层是一油墨层及一二氧化硅层之其中一者。
  6. 根据权利要求2所述的 光学面板的堆叠结构，其特征在于，该第一贴合件是一玻璃外盖、一塑料壳体及一显示面板之其中一者，该第二贴合件是一触控感应基板，其中该玻璃外盖与该触控感应基板贴合为一触控面板。
  7. 根据权利要求2所述的 光学面板的堆叠结构，其特征在于，该黏着层是一光学胶层。
  8. 一种光学面板的堆叠结构之制造方法，其特征在于，包含下列步骤：
    形成一第一保护层于一第一贴合件之第一贴合面上，以平坦化该第一贴合件之第一贴合面。
  9. 根据权利要求8所述的 光学面板的堆叠结构之制造方法，其特征在于，更包括：
    形成一黏着层于该第一保护层上；以及
    藉由该黏着层贴合该第一贴合件的第一贴合面与一第二贴合件的第二贴合面。
  10. 根据权利要求9所述的 光学面板的堆叠结构之制造方法，其特征在于，进一步包括：形成一第二保护层于该第二贴合件之第二贴合面上，以平坦化该第二贴合件之第二贴合面，且该第二保护层位于该黏着层与该第二贴合件之第二贴合面之间。
  11. 根据权利要求10所述的 光学面板的堆叠结构之制造方法，其特征在于，形成该第一保护层和第二保护层的方式为印刷、喷涂、溅镀之其中之一。
  12. 根据权利要求10所述的 光学面板的堆叠结构之制造方法，其特征在于，该第一保护层和第二保护层是一间隙填充剂。
  13. 根据权利要求10所述的 光学面板的堆叠结构之制造方法，其特征在于，该第一保护层和第二保护层是一油墨层及一二氧化硅层之其中一者。
  14. 根据权利要求9所述的 光学面板的堆叠结构之制造方法，其特征在于，该第一贴合件是一玻璃外盖、一塑料壳体及一显示面板之其中一者，该第二贴合件是一触控感应基板，其中该玻璃外盖与该触控感应基板贴合为一触控面板。
  15. 根据权利要求9所述的 光学面板的堆叠结构之制造方法，其特征在于，该黏着层是一光学胶层。
PCT/CN2012/084425 2011-11-16 2012-11-10 光学面板的堆叠结构及其制造方法 WO2013071844A1 (zh)

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